USD605141S1 - Passive heat sink stand for electronic devices - Google Patents
Passive heat sink stand for electronic devices Download PDFInfo
- Publication number
- USD605141S1 USD605141S1 US29/312,378 US31237808F USD605141S US D605141 S1 USD605141 S1 US D605141S1 US 31237808 F US31237808 F US 31237808F US D605141 S USD605141 S US D605141S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- electronic devices
- passive heat
- sink stand
- stand
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
The broken lines shown in the drawings are for illustrative purposes only and do not form part of the claimed design.
Claims (1)
- The ornamental design of a passive heat sink stand for electronic devices, as shown and herein described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/312,378 USD605141S1 (en) | 2008-10-17 | 2008-10-17 | Passive heat sink stand for electronic devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/312,378 USD605141S1 (en) | 2008-10-17 | 2008-10-17 | Passive heat sink stand for electronic devices |
Publications (1)
Publication Number | Publication Date |
---|---|
USD605141S1 true USD605141S1 (en) | 2009-12-01 |
Family
ID=41351208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/312,378 Expired - Lifetime USD605141S1 (en) | 2008-10-17 | 2008-10-17 | Passive heat sink stand for electronic devices |
Country Status (1)
Country | Link |
---|---|
US (1) | USD605141S1 (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD647526S1 (en) * | 2010-07-12 | 2011-10-25 | Scosche Industries, Inc. | Tablet computer case |
USD782459S1 (en) * | 2015-08-24 | 2017-03-28 | BobjGear, LLC | Cooling device for electronic device |
USD814625S1 (en) * | 2016-04-25 | 2018-04-03 | Neograf Solutions, Llc | Heat spreader |
USD814626S1 (en) * | 2016-04-25 | 2018-04-03 | Neograf Solutions, Llc | Heat spreader |
USD814627S1 (en) * | 2016-04-25 | 2018-04-03 | Neograf Solutions, Llc | Heat spreader |
USD819578S1 (en) * | 2016-07-14 | 2018-06-05 | Enermax Technology Corporation | Heat dissipating fin |
USD822625S1 (en) * | 2016-04-26 | 2018-07-10 | Showa Denko K.K. | Fin for heat exchanger |
USD854001S1 (en) * | 2015-08-24 | 2019-07-16 | BobjGear, LLC | Cooling device for electronic device |
USD856944S1 (en) * | 2019-01-31 | 2019-08-20 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD856945S1 (en) * | 2019-01-31 | 2019-08-20 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD896767S1 (en) | 2019-12-02 | 2020-09-22 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD940718S1 (en) * | 2019-12-20 | 2022-01-11 | Seagate Technology Llc | Storage device |
USD940719S1 (en) * | 2019-12-20 | 2022-01-11 | Seagate Technology Llc | Storage device |
USD997153S1 (en) * | 2022-01-26 | 2023-08-29 | Huisheng Huang | Car phone holder |
US11859915B1 (en) | 2019-01-31 | 2024-01-02 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
Citations (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD348252S (en) * | 1992-04-06 | 1994-06-28 | Nec Corporation | Heat-radiating fin for a heat sink |
US20020088609A1 (en) * | 1997-06-30 | 2002-07-11 | Tantoush Mohammad A. | Scalable and modular heat sink-heat pipe cooling system |
US20020186531A1 (en) * | 2001-06-12 | 2002-12-12 | Himanshu Pokharna | Mobile computer system with detatchable thermoelectric module for enhanced cooling capability in a docking station |
US20020189794A1 (en) * | 2001-05-25 | 2002-12-19 | Agilent Technologies, Inc. | Cooler for electrical and/ or electronic components, linked to present cooling needs |
USD478055S1 (en) * | 2002-08-08 | 2003-08-05 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipating fin |
US20030189829A1 (en) * | 2001-08-09 | 2003-10-09 | Matsushita Electric Industrial Co., Ltd. | LED illumination apparatus and card-type LED illumination source |
US20030205369A1 (en) * | 2002-05-02 | 2003-11-06 | Ming-Hwa Liu | Heat-radiating structure with low height |
US6651733B1 (en) * | 2002-10-16 | 2003-11-25 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat sink |
USD485535S1 (en) * | 2002-07-29 | 2004-01-20 | Matsushita Electric Industrial Co., Ltd. | Radiator |
US6719040B2 (en) * | 2001-09-14 | 2004-04-13 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant with improved tunnel structure |
US20040069462A1 (en) * | 2002-09-25 | 2004-04-15 | Sony Corporation | Heat transfer element, cooling device and electronic device having the element |
US6863117B2 (en) * | 2002-02-26 | 2005-03-08 | Mikros Manufacturing, Inc. | Capillary evaporator |
US20050178532A1 (en) * | 2004-02-18 | 2005-08-18 | Huang Meng-Cheng | Structure for expanding thermal conducting performance of heat sink |
US7028754B2 (en) * | 2004-04-26 | 2006-04-18 | Hewlett-Packard Development Company, L.P. | High surface area heat sink |
US20060118278A1 (en) * | 2004-05-12 | 2006-06-08 | Matsushita Electric Industrial Co., Ltd. | Cooling device |
US20060118280A1 (en) * | 2004-12-03 | 2006-06-08 | Foxconn Technology Co.,Ltd | Cooling device incorporating boiling chamber |
USD543953S1 (en) * | 2003-09-02 | 2007-06-05 | Cubic Wafer, Inc. | Wing portion of a butterfly-style inside-out heat sink |
USD554135S1 (en) | 2005-11-16 | 2007-10-30 | Michael Z. Lim | Thermal insulating board for a laptop computer |
USD555162S1 (en) | 2006-06-02 | 2007-11-13 | Zalman Tech Co., Ltd. | Heat dissipator for a notebook computer |
US20080093053A1 (en) * | 2006-10-24 | 2008-04-24 | Seaho Song | Systems and methods for providing two phase cooling |
USD571815S1 (en) | 2006-08-10 | 2008-06-24 | Cooler Master Co., Ltd. | Cool pad for electronic device |
US20090009968A1 (en) * | 2006-02-28 | 2009-01-08 | Takeshi Hongo | Cooling device and electronic apparatus |
USD586763S1 (en) * | 2007-08-23 | 2009-02-17 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
-
2008
- 2008-10-17 US US29/312,378 patent/USD605141S1/en not_active Expired - Lifetime
Patent Citations (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD348252S (en) * | 1992-04-06 | 1994-06-28 | Nec Corporation | Heat-radiating fin for a heat sink |
US20020088609A1 (en) * | 1997-06-30 | 2002-07-11 | Tantoush Mohammad A. | Scalable and modular heat sink-heat pipe cooling system |
US20020189794A1 (en) * | 2001-05-25 | 2002-12-19 | Agilent Technologies, Inc. | Cooler for electrical and/ or electronic components, linked to present cooling needs |
US20020186531A1 (en) * | 2001-06-12 | 2002-12-12 | Himanshu Pokharna | Mobile computer system with detatchable thermoelectric module for enhanced cooling capability in a docking station |
US20030189829A1 (en) * | 2001-08-09 | 2003-10-09 | Matsushita Electric Industrial Co., Ltd. | LED illumination apparatus and card-type LED illumination source |
US6719040B2 (en) * | 2001-09-14 | 2004-04-13 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant with improved tunnel structure |
US6863117B2 (en) * | 2002-02-26 | 2005-03-08 | Mikros Manufacturing, Inc. | Capillary evaporator |
US20030205369A1 (en) * | 2002-05-02 | 2003-11-06 | Ming-Hwa Liu | Heat-radiating structure with low height |
USD485535S1 (en) * | 2002-07-29 | 2004-01-20 | Matsushita Electric Industrial Co., Ltd. | Radiator |
USD478055S1 (en) * | 2002-08-08 | 2003-08-05 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipating fin |
US20040069462A1 (en) * | 2002-09-25 | 2004-04-15 | Sony Corporation | Heat transfer element, cooling device and electronic device having the element |
US6651733B1 (en) * | 2002-10-16 | 2003-11-25 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat sink |
USD543953S1 (en) * | 2003-09-02 | 2007-06-05 | Cubic Wafer, Inc. | Wing portion of a butterfly-style inside-out heat sink |
US20050178532A1 (en) * | 2004-02-18 | 2005-08-18 | Huang Meng-Cheng | Structure for expanding thermal conducting performance of heat sink |
US7028754B2 (en) * | 2004-04-26 | 2006-04-18 | Hewlett-Packard Development Company, L.P. | High surface area heat sink |
US20060118278A1 (en) * | 2004-05-12 | 2006-06-08 | Matsushita Electric Industrial Co., Ltd. | Cooling device |
US20060118280A1 (en) * | 2004-12-03 | 2006-06-08 | Foxconn Technology Co.,Ltd | Cooling device incorporating boiling chamber |
USD554135S1 (en) | 2005-11-16 | 2007-10-30 | Michael Z. Lim | Thermal insulating board for a laptop computer |
US20090009968A1 (en) * | 2006-02-28 | 2009-01-08 | Takeshi Hongo | Cooling device and electronic apparatus |
USD555162S1 (en) | 2006-06-02 | 2007-11-13 | Zalman Tech Co., Ltd. | Heat dissipator for a notebook computer |
USD571815S1 (en) | 2006-08-10 | 2008-06-24 | Cooler Master Co., Ltd. | Cool pad for electronic device |
US20080093053A1 (en) * | 2006-10-24 | 2008-04-24 | Seaho Song | Systems and methods for providing two phase cooling |
USD586763S1 (en) * | 2007-08-23 | 2009-02-17 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD647526S1 (en) * | 2010-07-12 | 2011-10-25 | Scosche Industries, Inc. | Tablet computer case |
USD782459S1 (en) * | 2015-08-24 | 2017-03-28 | BobjGear, LLC | Cooling device for electronic device |
USD854001S1 (en) * | 2015-08-24 | 2019-07-16 | BobjGear, LLC | Cooling device for electronic device |
USD814625S1 (en) * | 2016-04-25 | 2018-04-03 | Neograf Solutions, Llc | Heat spreader |
USD814626S1 (en) * | 2016-04-25 | 2018-04-03 | Neograf Solutions, Llc | Heat spreader |
USD814627S1 (en) * | 2016-04-25 | 2018-04-03 | Neograf Solutions, Llc | Heat spreader |
USD822625S1 (en) * | 2016-04-26 | 2018-07-10 | Showa Denko K.K. | Fin for heat exchanger |
USD819578S1 (en) * | 2016-07-14 | 2018-06-05 | Enermax Technology Corporation | Heat dissipating fin |
USD856944S1 (en) * | 2019-01-31 | 2019-08-20 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD856945S1 (en) * | 2019-01-31 | 2019-08-20 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
US11859915B1 (en) | 2019-01-31 | 2024-01-02 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD896767S1 (en) | 2019-12-02 | 2020-09-22 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD969760S1 (en) | 2019-12-02 | 2022-11-15 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD940718S1 (en) * | 2019-12-20 | 2022-01-11 | Seagate Technology Llc | Storage device |
USD940719S1 (en) * | 2019-12-20 | 2022-01-11 | Seagate Technology Llc | Storage device |
USD997153S1 (en) * | 2022-01-26 | 2023-08-29 | Huisheng Huang | Car phone holder |
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