US20110290859A1 - Ribbon bonding tools and methods of using the same - Google Patents
Ribbon bonding tools and methods of using the same Download PDFInfo
- Publication number
- US20110290859A1 US20110290859A1 US13/145,676 US201013145676A US2011290859A1 US 20110290859 A1 US20110290859 A1 US 20110290859A1 US 201013145676 A US201013145676 A US 201013145676A US 2011290859 A1 US2011290859 A1 US 2011290859A1
- Authority
- US
- United States
- Prior art keywords
- edge
- bonding tool
- working surface
- ribbon
- ribbon bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title description 8
- 235000012773 waffles Nutrition 0.000 claims description 15
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 description 25
- 239000004065 semiconductor Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000007812 deficiency Effects 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 238000005201 scrubbing Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006664 bond formation reaction Methods 0.000 description 2
- 230000005465 channeling Effects 0.000 description 2
- 238000009760 electrical discharge machining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010902 jet-milling Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/106—Features related to sonotrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78314—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78314—Shape
- H01L2224/78315—Shape of the pressing surface, e.g. tip or head
- H01L2224/78316—Shape of the pressing surface, e.g. tip or head comprising protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85203—Thermocompression bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
- H01L2224/85207—Thermosonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
Definitions
- the present invention relates to bonding tools used in ribbon bonding systems, and more particularly, to improved tip portions of ribbon bonding tools.
- wire bonding continues to be a primary method of providing electrical interconnection between two locations within a package (e.g., between a die pad of a semiconductor die and a lead of a leadframe).
- bonding tools e.g., capillary tools used during ball bonding, wedge tools used in wedge bonding
- ultrasonic, thermosonic, or thermocompressive energy are used to press a wire against a bonding location using ultrasonic, thermosonic, or thermocompressive energy.
- ribbon bonding may be used to provide electrical interconnection between locations.
- devices e.g., power semiconductor devices
- ribbon bonding may be used to provide electrical interconnection between locations.
- U.S. Patent Application Publication Nos. 2006/0163315 (entitled Ribbon Bonding Tool and Process) and 2007/0141755 (entitled Ribbon Bonding in an Electronic Package) relate to ribbon bonding and are incorporated herein by reference.
- FIG. 1 illustrates semiconductor die 110 supported by substrate 108 (e.g., leadframe 108 ). It is desired to provide a conductive interconnection between a location(s) on semiconductor die 110 (e.g., a die pad) and lead 108 a of leadframe 108 . Ribbon loop 112 provides such interconnection and includes first bond 112 a and second bond 112 b (both bonded to portions of semiconductor die 110 ), as well a third bond 112 c on lead 108 .
- substrate 108 e.g., leadframe 108
- Ribbon loop 112 provides such interconnection and includes first bond 112 a and second bond 112 b (both bonded to portions of semiconductor die 110 ), as well a third bond 112 c on lead 108 .
- Ribbon loop 112 is formed using ribbon bonding system 100 (e.g., a ribbon bonding machine).
- a ribbon bonding system includes many conventional components and subsystems such as a material handling system, a vision system, a computer, and many others. However, for simplicity, only a few elements of ribbon bonding system 100 are shown. Such elements include ribbon bonding tool 102 , ribbon guide 104 , and cutting tool 106 .
- ribbon bonding uses energy (e.g., ultrasonic energy to form bonds), and then, after formation of a ribbon loop, cutter 106 may be used to at least partially cut through the ribbon material prior to separation of the ribbon loop from the ribbon supply.
- FIG. 2 is a perspective view of ribbon bonding tool 102 engaged in aperture 114 a of ultrasonic transducer 114 , where ribbon bonding tool 102 is aligned in aperture 114 a using flat surface side 102 k (in this case, front side 102 k ).
- transducer 114 causes a “scrubbing” motion at the tip portion 102 a , and particular, to working surface 102 b of ribbon bonding tool 102 .
- FIGS. 3A-3F are various views of exemplary ribbon bonding tool 102 .
- FIG. 3A is a front view of tool 102
- FIG. 3B is a top view of tool 102 (illustrating flat surface side 102 k )
- FIG. 3A is a front view of tool 102
- FIG. 3B is a top view of tool 102 (illustrating flat surface side 102 k )
- FIG. 3C is a bottom view illustrating working surface 102 b
- FIG. 3D is a detailed view of a portion of FIG. 3A illustrating front edge 102 d of tip portion 102 a adjacent working surface 102 b
- FIG. 3E is a side view of tool 102
- FIG. 3F is a detailed view of a portion of FIG. 3E illustrating side edge 102 f 1 of tip portion 102 a adjacent working surface 102 b.
- FIG. 4A is an exemplary tip portion 102 a of a conventional ribbon bonding tool 102 .
- Tip portion includes working surface 102 b , front edge 102 d , back edge 102 e , side edge 102 f 1 , and side edge 102 f 2 .
- Working surface 102 b defines protrusions 102 b 1 and recesses 102 b 2 (where the protrusions and recesses may be part of a waffle or grid pattern on the working surface), where recesses 102 b 2 are between protrusions 102 b 1 .
- a typical scrubbing motion of a ribbon bonding tool is from front to back, along the direction of the ribbon.
- the scrubbing would typically occur in direction “d” which extends in a direction from front edge 102 d to back edge 102 e.
- FIG. 4B is a perspective view of a portion of ribbon loop 112 including first bond 112 a bonded to bonding location 110 .
- First bond 112 a is formed using a “waffle” type ribbon bonding tool (similar to that shown in FIG. 4A ) which forms openings/recesses 112 a 2 between protrusions 112 a 1 .
- waffle style ribbon bond tools suffer from a number of deficiencies. For example, the edges of the protrusions on the working surface of the ribbon bonding tool tend to leave an irregular edge in the heel region of the ribbon bond, which may initiate cracks 112 a 3 at some point during the life of the ribbon bond.
- Other limitations of existing ribbon bonding tools relate to ribbon looping difficulties, amongst others.
- a ribbon bonding tool including a body portion.
- the body portion includes a tip portion.
- the tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion.
- the working surface includes a region defining at least one of a plurality of recesses and a plurality of protrusions.
- the working surface also defines at least one of (1) a first planar portion between the region and the front edge of the tip portion, and (2) a second planar portion between the region and the back edge of the tip portion.
- a ribbon bonding tool including a body portion.
- the body portion includes a tip portion.
- the tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion.
- the working surface defines a plurality of recesses, wherein a portion of the recesses defined by the working surface adjacent at least one of the front edge and the back edge are deeper than others of the recesses.
- a ribbon bonding tool including a body portion.
- the body portion includes a tip portion.
- the tip portion includes a working surface, wherein during engagement with a transducer of a ribbon bonding system, the working surface extends lower in a center region than (1) at a first surface region extending from a first edge of the working surface toward the center region, and (2) at a region extending from a second edge of the working surface toward the center region, a length of the first surface region being at least 25% of a length of the working surface from the first edge to the second edge, a length of the second surface region being at least 25% of a length of the working surface from the first edge to the second edge.
- a ribbon bonding tool including a body portion.
- the body portion includes a tip portion.
- the tip portion including a working surface.
- the tip portion includes two side wall portions on either side of the working surface wherein a ribbon path is defined between the side wall portions.
- a ribbon bonding tool including a body portion.
- the body portion includes a tip portion.
- the tip portion includes a working surface.
- the tip portion includes two side wall portions extending along an exterior surface of at least a portion of a back side of the ribbon bonding tool wherein a ribbon path is defined between the side wall portions.
- inventive ribbon bonding tools may also be integrated into inventive ribbon bonding systems including various elements such as bond head elements (e.g., ultrasonic transducers, ribbon cutter, ribbon material guides), as well as other elements.
- bond head elements e.g., ultrasonic transducers, ribbon cutter, ribbon material guides
- the invention may also be considered in connection with methods of forming ribbon loops.
- Such methods may include a step of forming a ribbon bond of a ribbon loop on a first bonding location, extending the ribbon material toward a second bonding location, forming another ribbon bond on the second bonding location, and separating the now completed ribbon loop from the ribbon supply (using a ribbon cutter, if desired, to assist in the separation).
- Such a method is accomplished using an inventive ribbon bonding tool (and other elements of a ribbon bonding system) according to the exemplary embodiments disclosed herein.
- FIG. 1 is a side block diagram view of portions of a ribbon bonding system useful in explaining various exemplary embodiments of the present invention
- FIG. 2 is a perspective view of a ribbon bonding tool engaged in a transducer useful in explaining various exemplary embodiments of the present invention
- FIGS. 3A-3F are various views of the ribbon bonding tool of FIG. 2 ;
- FIG. 4A is a perspective view of a tip portion of a conventional ribbon bonding tool
- FIG. 4B is a portion of a ribbon loop formed using a conventional ribbon bonding tool
- FIG. 5A is a perspective view of a tip portion of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention.
- FIG. 5B is a portion of a ribbon loop formed using the ribbon bonding tool of FIG. 5A ;
- FIG. 6A is a perspective view of a tip portion of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention.
- FIG. 6B is a portion of a ribbon loop formed using the ribbon bonding tool of FIG. 6A ;
- FIGS. 6C-6H are perspective views of tip portions of ribbon bonding tools in accordance with various exemplary embodiments of the present invention.
- FIG. 7A is a side view of a portion of a conventional ribbon bonding tool
- FIG. 7B is a cross sectional view of a portion of a ribbon bond formed using the ribbon bonding tool of FIG. 7A ;
- FIGS. 8A-8B are perspective views of tip portions of ribbon bonding tools in accordance with exemplary embodiments of the present invention.
- FIG. 9A is a side view of a portion of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention.
- FIG. 9B is a cross sectional view of a portion of a ribbon bond formed using the ribbon bonding tool of FIG. 9A ;
- FIG. 10A is a bottom view of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention.
- FIGS. 10B-10C are various cross sectional views of the ribbon bonding tool of FIG. 10A ;
- FIGS. 11A-11B are block diagram views of a portion of a conventional ribbon bonding tool
- FIG. 12A is a perspective view of a portion of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention.
- FIG. 12B is a block diagram view of a portion of the ribbon bonding tool of FIG. 12A ;
- FIG. 13 is a block diagram front view of a portion of a conventional ribbon bonding tool
- FIG. 14 is a block diagram front view of a portion of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention.
- FIGS. 15A-15B are perspective views of a tip portion of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention.
- FIGS. 16A-16B are perspective views of a portion of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention.
- FIG. 17 is a perspective view of a portion of a working surface of a conventional ribbon bonding tool.
- FIG. 18 is a perspective view of a portion of a working surface of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention.
- the working surface (also known as a “foot”) of a ribbon bonding tool includes a region defining at least one of a plurality of recesses and a plurality of protrusions (such as in a waffle or grid pattern).
- the working surface also defines at least one planar portion, along at least one edge of the working surface.
- FIGS. 5A , 6 A, and 6 C- 6 H illustrate an example of such a ribbon bonding tool, with FIGS. 5B and 6B illustrating portions of ribbon loops.
- the planar portions may have dimensions (e.g., width, height, etc.) that vary.
- the planar portions are not required to be perfectly flat or smooth, but rather are smoother or flatter than the edges of a standard waffle tool. Such planar portions tend to improve looping capability and reduction of crack initiation sites in the heel region of the ribbon loop.
- FIG. 5A is a perspective bottom view of tip portion 502 a of a ribbon bonding tool.
- Tip portion 502 a includes working surface 502 b between front edge 502 d and back edge 502 e (and also defined between side edge 502 f 1 and side edge 502 f 2 ).
- Working surface 502 b includes a region defining protrusions 502 b 1 and recesses 502 b 2 (similar to a waffle pattern).
- Working surface 502 b also defines first planar portion 502 g 1 between the region and front edge 502 d , and second planar portion 502 g 2 between the region and back edge 502 e .
- planar portions 502 g 1 and 502 g 2 leave smooth heel regions during ribbon looping with decreased potential for crack-initiation sites.
- the length L 1 of the first planar portion (or the length L 2 of the second planar portion) may be between 5-40 percent of the length L from front edge 502 d to back edge 502 e.
- FIG. 5B illustrates a portion of ribbon loop 512 formed using the ribbon bonding tool of FIG. 5A .
- Portion 512 a of ribbon loop 512 corresponds to the region of working surface 502 b including protrusions 502 b 1 and recesses 502 b 2 .
- protrusions 512 b of portion 512 a correspond to recesses 502 b 2 of working surface 502 b
- recesses 512 c of portion 512 a correspond to protrusions 502 b 1 of working surface 502 b .
- Planar portions 512 d 1 and 512 d 2 correspond to planar portions 502 g 1 and 502 g 2 of working surface 502 b , and provide desirable heel regions “h” in ribbon loop 512 .
- the region of working surface 502 b defining protrusions 502 b 1 and recesses 502 b 2 is mostly below a plane defined across planar portions 502 g 1 and 502 g 2 (i.e., the top of protrusions 502 b 1 is at substantially the same height as planar portions 502 g 1 and 502 g 2 ). However, the region could extend above a plane defined across planar portions 502 g 1 and 502 g 2 .
- Tip portion 602 a of a ribbon bonding tool includes working surface 602 b between front edge 602 d and back edge 602 e (and also defined between side edge 602 f 1 and side edge 602 f 2 ).
- Working surface 602 b includes a region defining protrusions 602 b 1 .
- Working surface 602 b also defines first planar portion 602 g 1 between the region and front edge 602 d , second planar portion 602 g 2 between the region and back edge 602 e , third planar portion 602 g 3 between the region and side edge 602 f 2 , and fourth planar portion 602 g 4 between the region and side edge 602 f 2 .
- FIG. 6B illustrates portion 612 a of ribbon loop 612 formed using the ribbon bonding tool of FIG. 6A .
- Portion 612 a includes recesses 612 c corresponding to protrusions 602 b 1 of working surface 602 , and planar portions 612 d 1 and 612 d 2 .
- FIGS. 6C-6H are similar to the embodiment shown in FIG. 6A , where like reference numerals correspond to like elements of the ribbon bonding tool.
- FIG. 6C illustrates tip portion 622 a including working surface 622 b between front edge 622 d , back edge 622 e , side edge 622 f 1 , and side edge 622 f 2 .
- Working surface 622 b includes a region defining two rows of diamond shaped protrusions 622 b 1 .
- Working surface 622 b also defines first planar portion 622 g 1 between the region and front edge 622 d , second planar portion 622 g 2 between the region and back edge 622 e , third planar portion 622 g 3 between the region and side edge 622 f 1 , and fourth planar portion 622 g 4 between the region and side edge 622 f 2 .
- Other shapes and configurations of protrusions on the working surface are contemplated.
- FIG. 6D illustrates tip portion 632 a including working surface 632 b between front edge 632 d , back edge 632 e , side edge 632 f 1 , and side edge 632 f 2 .
- Working surface 632 b includes a region defining round shaped protrusions 632 b 1 .
- Working surface 632 b also defines first planar portion 632 g 1 between the region and front edge 632 d , second planar portion 632 g 2 between the region and back edge 632 e , third planar portion 632 g 3 between the region and side edge 632 f 1 , and fourth planar portion 632 g 4 between the region and side edge 632 f 2 .
- FIG. 6E illustrates tip portion 642 a including working surface 642 b between front edge 642 d , back edge 642 e , side edge 642 f 1 , and side edge 642 f 2 .
- Working surface 642 b includes a region defining rectangular shaped protrusions 642 b 1 .
- Working surface 642 b also defines first planar portion 642 g 1 between the region and front edge 642 d , second planar portion 642 g 2 between the region and back edge 642 e , third planar portion 642 g 3 between the region and side edge 642 f 1 , and fourth planar portion 642 g 4 between the region and side edge 642 f 2 .
- FIGS. 6F-6H illustrate exemplary configurations with recesses.
- FIG. 6F illustrates tip portion 652 a including working surface 652 b between front edge 652 d , back edge 652 e , side edge 652 f 1 , and side edge 652 f 2 .
- Working surface 652 b includes a region defining diamond shaped recesses 652 b 1 .
- Working surface 652 b also defines first planar portion 652 g 1 between the region and front edge 652 d , second planar portion 652 g 2 between the region and back edge 652 e , third planar portion 652 g 3 between the region and side edge 652 f 1 , and fourth planar portion 652 g 4 between the region and side edge 652 f 2 .
- FIG. 6G illustrates tip portion 662 a including working surface 662 b between front edge 662 d , back edge 662 e , side edge 662 f 1 , and side edge 662 f 2 .
- Working surface 662 b includes a region defining round shaped recesses 662 b 1 .
- Working surface 662 b also defines first planar portion 662 g 1 between the region and front edge 662 d , second planar portion 662 g 2 between the region and back edge 662 e , third planar portion 662 g 3 between the region and side edge 662 f 1 , and fourth planar portion 662 g 4 between the region and side edge 662 f 2 .
- FIG. 6H illustrates tip portion 672 a including working surface 672 b between front edge 672 d , back edge 672 e , side edge 672 f 1 , and side edge 672 f 2 .
- Working surface 672 b includes a region defining rectangular shaped recesses 672 b 1 .
- Working surface 672 b also defines first planar portion 672 g 1 between the region and front edge 672 d , second planar portion 672 g 2 between the region and back edge 672 e , third planar portion 672 g 3 between the region and side edge 672 f 1 , and fourth planar portion 672 g 4 between the region and side edge 672 f 2 .
- FIG. 7A is a side view of a portion of a conventional ribbon bonding tool with working surface 702 b having a waffle configuration, with a phantom view of a portion of working surface 702 b .
- Working surface 702 b includes protrusions 702 b 1 (also known as teeth) and recesses 702 b 2 (also known as grooves). End recesses 702 b 2 e have the same depth as other recesses 702 b 2 .
- recesses 702 b 2 / 702 b 2 e across working surface 702 b define a groove plane GP that is substantially flat and parallel to the bottom surface (labeled as bottom surface plane BSP) of the ribbon bonding tool.
- FIG. BSP bottom surface plane
- Ribbon loop 712 includes protrusions 712 c , and recesses 712 c (where recesses 712 c have the same depth as end recesses 712 c 1 ).
- FIGS. 8A-8B are bottom perspective views of tip portions 802 a / 852 a of ribbon bonding tools according to the present invention including recesses of varying depths.
- FIG. 8A illustrates working surface 802 b including protrusions 802 b 1 (also known as teeth) and recesses 802 b 2 / 802 b 2 e .
- End recesses 802 b 2 e along the front and back edge of tip portion 802 a are deeper than other recesses 802 b 2 , thereby resulting in longer protrusions/teeth adjacent the front and back edge of tip portion 802 a .
- FIG. 8A illustrates working surface 802 b including protrusions 802 b 1 (also known as teeth) and recesses 802 b 2 / 802 b 2 e .
- End recesses 802 b 2 e along the front and back edge of tip portion 802 a are deeper than other recesses 802 b 2 ,
- FIG. 8B illustrates working surface 852 b including protrusions 852 b 1 and recesses 852 b 2 / 852 b 2 e .
- End recesses 852 b 2 e along the front and back edge of tip portion 852 a are deeper than other recesses 852 b 2 , thereby resulting in longer protrusions/teeth adjacent the front and back edge of tip portion 852 a .
- the deeper recesses along the front and back edges allow for thicker ribbon material in a heel region of a ribbon loop formed using the ribbon bonding tool.
- FIG. 9A is a side view of a portion of ribbon bonding tool according to an exemplary embodiment of the present invention with working surface 902 b having a waffle configuration or the like, with a phantom view of a portion of working surface 902 b .
- Working surface 902 b includes protrusions 902 b 1 (also known as teeth) and recesses 902 b 2 (also known as grooves). End recesses 902 b 2 e are deeper than recesses 902 b 2 in the center portion of working surface 902 b . In fact, the recesses follow a profile that is deepest at the front and back edges of working surface 902 b , and shallowest in a center region of working surface 902 b .
- FIG. 9B illustrates a portion of ribbon loop 912 formed using the ribbon bonding tool of FIG. 9A .
- Ribbon loop 912 includes protrusions 912 b , and recesses 912 c , 912 c 1 , and 912 c 2 .
- the center recesses 912 c are shallowest, and end recesses 912 c 2 are the deepest, with recesses 912 c 1 having a depth between that of recesses 912 c and that of recesses 912 c 2 .
- protrusions 912 b will be longer where the recesses are deeper, and shorter when the recesses are shallower, thereby improving the heel strength of the ribbon bonds formed using such a tool.
- FIG. 10A is a bottom view of tip portion 1002 a of a ribbon bonding tool including working surface 1002 b (where working surface 1002 b includes a waffle configuration including protrusions/teeth and recesses/grooves).
- FIGS. 10B-10C are sectional views of the ribbon bonding tool of FIG. 10A .
- FIG. 10B is a sectional view cut across a groove between rows of protrusions 1002 b 1 (where the recesses 1002 b 2 are between adjacent protrusions 1002 b 1 ), where the varying recess depth defines curved groove plane GP.
- FIG. 10B is a sectional view cut across a groove between rows of protrusions 1002 b 1 (where the recesses 1002 b 2 are between adjacent protrusions 1002 b 1 ), where the varying recess depth defines curved groove plane GP.
- FIGS. 10A-10C is a sectional view cut across a row of protrusions 1002 b 1 , illustrating that end recesses 1002 b 2 e are deeper than recesses 1002 b 2 , thereby defining the curved groove plane.
- the curved groove plane GP illustrated in FIGS. 10A-10C extends from front edge 1002 d of working surface 1002 b to back edge 1002 e of working surface 1002 b (and not from side edge 1002 f 1 to side edge 1002 f 2 ).
- FIGS. 9A and 10A illustrate a curved groove plane GP
- other configurations are contemplated where the recess/groove depths are deeper adjacent the front and back edges and shallower at the center of the working surface.
- the grooves could follow an angled, as opposed to a curved, profile.
- the groove plane GP is illustrated as curving along the front to back direction (i.e., from the front edge of the working surface to the back edge of the working surface), the groove plane GP could extend from one side edge of the working surface to the other side edge of the working surface.
- the working surface of the ribbon bonding tool could have a curved (or varying depth) groove plane that extends in both the front to back direction (as in FIG. 9A ) and in the side to side direction (not shown). That is, a depth of the plurality of recesses follows a profile such that a depth of the recesses is shallower at a central portion of the working surface, and increases in each direction extending toward a periphery of the working surface.
- FIGS. 9 A and 10 A- 10 C illustrate ribbon bonding tools including a curved groove plane
- the bottom surface of the tool continues to be substantially flat (i.e., extending along plane “BSP” shown in FIGS. 9A and 10C ).
- Ribbon bonding tools having a flat bottom surface may suffer from a number of deficiencies.
- tip portion 1102 a rotates about its first transverse vibration node N, located a distance L from working surface 1102 b .
- This distance L is dependent on various factors such resonant frequency, tool material characteristics, etc. Exemplary distances L (and therefore the radius) are between 2-15 mm, 2-10 mm, and 3-5 mm.
- a standard bond tool has a flat bottom surface that undesirably imparts significant vertical vibration to the bond surface. More specifically, during the rotation about node N, front and back corners 1150 , 1152 fall below the level of the bottom surface in its resting state. A potential consequence is that the corners 1150 , 1152 generate a vertical vibration or force oscillation in the work surface.
- FIGS. 12A-12B illustrates tip portion 1202 a of a ribbon bonding tool which includes working surface 1202 b .
- the bottom surface of the ribbon bonding tool has a curved profile from front edge 1202 d to back edge 1202 e in order to minimize or eliminate vertical excitation of a bond surface during bonding.
- the radius of the curved profile may be configured as desired.
- the radius R is designed to be equal to the distance L between the bottom surface of the tip portion and the location of the first node N. That is, because the bottom surface is shorter at its edge portions, it is less likely to cause the excitation problems associated with conventional tools having a flat bottom surface.
- FIGS. 12A-12B are illustrated as including a curved profile the entire length of the working surface from the front edge to the back edge, the present invention is not limited thereto. Any of a number of configurations are possible wherein the working surface extends lower in a center region than (1) at a first surface region extending from a first edge of the working surface toward the center region, and (2) at a second surface region extending from a second edge of the working surface toward the center region.
- the first and second surface regions may be chamfered, curved, etc. so long as the areas adjacent the first and second edge are shorter than the center area between the first edge and the second edge.
- the first and second surface regions may be at least 25% of a length of the working surface from the first edge to the second edge. In such an embodiment, the total percentage of the length from the first edge to the second edge that has a reduced length/height is at least 50% (where the remainder of the working surface, such as the center portion, may be flat).
- FIGS. 12A-12B relate to examples of the present invention where the bottom surface follows a curved profile in a direction from the front edge to the back edge in order to address the potential vertical excitation problem caused by the rotation of the ribbon bonding tool about the node.
- conventional tools having a flat working surface suffer from other deficiencies.
- FIG. 13 illustrates a front view of tip portion 1300 a of a ribbon bonding tool.
- front edge 1302 d is shown extending between side edge 1302 f 1 to side edge 1302 f 2 .
- bonding locations e.g., die pads
- ribbon bond formation will be uneven.
- FIG. 13 illustrates a tilted bonding location 1310 (e.g., a tilted die pad on a semiconductor die).
- tip portion 1300 a of the ribbon boning tool is pressed through most of portion 1312 a of ribbon 1312 .
- a portion of working surface 1302 b adjacent side edge 1302 f 2 e.g., the corner
- FIG. 14 illustrates a front view of tip portion 1400 a of a ribbon bonding tool.
- front edge 1402 d is shown extending between side edge 1402 f 1 and side edge 1402 f 2 .
- working surface 1402 b of tip portion 1400 a follows a curved path between side edge 1402 f 1 and side edge 1402 f 2 .
- Such a curved path tends to minimize the impact of bonding location tilt (e.g., die tilt) on ribbon bond formation. While such a curved working surface may result in weaker bonding on the outside edges of the ribbon material, the curvature may be designed for an application to provide adequate bonding results.
- the height difference h between a side edge and a center point between the side edges may be between, for example, 1-10 mils, but of course may vary considerably based on the application.
- FIG. 14 illustrates a curved profile from side edge 1402 f 1 to side edge 1402 f 1
- the present invention is not limited thereto. Any of a number of configurations are possible wherein the working surface extends lower in a center region than (1) at a first surface region extending from a first side edge of the working surface toward the center region, and (2) at a second surface region extending from a second, side edge of the working surface toward the center region.
- the first and second surface regions may be chamfered, curved, etc. so long at the areas adjacent the first and second edge are shorter than the center area between the first edge and the second edge.
- the first and second surface regions may be at least 25% of a length of the working surface from the first side edge to the second side edge.
- ribbon bonding systems may include a ribbon guide (such as guide 104 in FIG. 1 ) to direct the ribbon material to a ribbon bonding tool, and to facilitate ribbon looping.
- ribbon guide 104 directs the ribbon material (e.g., the material of ribbon loop 112 ) under ribbon bonding tool 102 .
- the separate ribbon guide may not be adequate to consistently position the ribbon with the desired accuracy.
- FIGS. 15A-15B and 16 A- 16 B illustrate tip portions of ribbon bonding tool that include integrated ribbon guides for guiding the ribbon material under the working surface completely external to the ribbon bonding tool.
- the integrated ribbon guides are designed to assist in the control of the side-to-side position of the ribbon under the working surface of the ribbon bonding tool. Depending on the application, such designs may (or may not) be used in connection with conventional ribbon guides such as element 104 shown in FIG. 1 .
- the integrated guide will also simplify the complexity of the bond head setup for a ribbon bonding system because the ribbon guide alignment (to the ribbon bonding tool) may be less critical.
- FIGS. 15A-15B perspective views of tip portion 1502 a of ribbon bonding tool 1502 are provided.
- Working surface 1502 b is defined between two side wall portions 1502 sw 1 and 1502 sw 2 .
- Side wall portion 1502 sw 1 is provided along side edge 1502 f 1
- side wall portion 1502 sw 2 is provided along side edge 1502 f 2 .
- Side wall portion 1502 sw 1 includes tapered/angled side wall 1502 t 1
- side wall portion 1502 sw 2 includes tapered/angled side wall 1502 t 2 .
- side wall portions 1502 sw 1 and 1502 sw 2 extend partially up to back side 1502 bs .
- Ribbon material (e.g., part of ribbon loop 1512 shown in FIG. 15B ) is guided from a ribbon supply to a path defined between side wall portions 1502 sw 1 and 1502 sw 2 to working surface 1502 b .
- Side wall portions 1502 sw 1 and 1502 sw 2 (which extend partially along back side 1502 bs ) channel the ribbon material to the desired position under working surface 1502 b from back edge 1502 e to front edge 1502 d .
- the angled configurations of side wall portions 1502 sw 1 and 1502 sw 2 assist in the channeling of the ribbon material.
- the height of side wall portions 1502 sw 1 and 1502 sw 2 is preferably small enough that the side wall portions do not touch the bond surface under normal bonding conditions.
- the width between side wall portions 1502 sw 1 and 1502 sw 2 may be substantially the same as the width of the ribbon material being bonded, considering manufacturing tolerances of the ribbon material.
- FIGS. 16A-16B perspective views of tip portion 1602 a of ribbon bonding tool 1602 are provided.
- Side wall portions 1602 sw 1 and 1602 sw 2 extend along a portion of back side 1602 bs of ribbon bonding tool 1602 .
- Side wall portion 1602 sw 1 includes tapered/angled side wall 1602 t 1
- side wall portion 1602 sw 2 includes tapered/angled side wall 1602 t 2 .
- side wall portions 1602 sw 1 and 1602 sw 2 extend partially down to working surface 1602 b .
- Ribbon material e.g., part of ribbon loop 1612 shown in FIG.
- side wall portions 1602 sw 1 and 1602 sw 2 are guided from a ribbon supply to a path defined between side wall portions 1602 sw 1 and 1602 sw 2 to working surface 1602 b .
- Side wall portions 1602 sw 1 and 1602 sw 2 channel the ribbon material to the desired position under working surface 1602 b from back edge 1602 e to front edge 1602 d .
- the angled configurations of side wall portions 1602 sw 1 and 1602 sw 2 assist in the channeling of the ribbon material.
- the height of at least that portion of side wall portions 1602 sw 1 and 1602 sw 2 is preferably small enough that the side wall portions do not touch the bond surface under normal bonding conditions.
- the width between side wall portions 1602 sw 1 and 1602 sw 2 may be substantially the same as the width of the ribbon material being bonded, considering manufacturing tolerances of the ribbon material.
- the various exemplary ribbon bonding tools disclosed herein may have varying characteristics.
- the working surface as being substantially planar (e.g., FIGS. 12A-12B , FIG. 14 , FIGS. 15A-15B , and FIGS. 16A-16B )
- any of the tools may have a working surface with a waffle or grid configuration or other configuration defining a plurality of protrusions and recesses (e.g., such as shown in others of the drawings).
- FIG. 17 is a perspective view of a portion of working surface 1702 b of a conventional ribbon bonding tool, where working surface 1702 b defines a plurality of protrusions 1702 b 1 (and recesses as illustrated) in a waffle type configuration.
- Protrusions 1702 b 1 define sharp edges SE which undesirably can damage the ribbon material being bonded, and may undesirably contribute to build-up of ribbon material in the waffle pattern.
- FIG. 18 is a perspective view of a portion of working surface 1802 b of an inventive ribbon bonding tool, where working surface 1802 b defines a plurality of protrusions 1802 b 1 (and recesses as illustrated) in a waffle type configuration.
- protrusions 1802 b 1 define rounded edges RE. For example, corners of protrusions/teeth 1802 b 1 , may be rounded if they are sharper than 1 mil, with a maximum of 2 mils.
- Various embodiments of the present invention include features on or adjacent the working surface of a ribbon bonding tool including, for example, protrusions/teeth, recesses/grooves, rounded edges, side walls portions, amongst others.
- Such features may be formed by various methods (e.g., using computer control) including, for example, laser-machining, fluid-jet milling, direct molding, mechanical grinding, or EDM (electrical discharge machining).
- the present invention includes the aforementioned features (e.g., protrusions/teeth, recesses/grooves, rounded edges, side walls portions) having exemplary shapes/dimensions, it is understood that alternative shapes/dimensions are contemplated.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion. The working surface includes a region defining at least one of a plurality of recesses and a plurality of protrusions. The working surface also defines at least one of (1) a first planar portion between the region and the front edge of the tip portion, and (2) a second planar portion between the region and the back edge of the tip portion.
Description
- This application claims the benefit of International Patent Application No. PCT/US2010/023273 filed Feb. 5, 2010, which claims the benefit of U.S. Provisional Application Nos. 61/150,633; 61/150,596; 61/150,611; 61/150,625; 61/150,579; and 61/150,640, each of which was filed Feb. 6, 2009, the contents of which are incorporated herein by reference.
- The present invention relates to bonding tools used in ribbon bonding systems, and more particularly, to improved tip portions of ribbon bonding tools.
- In the processing and packaging of semiconductor devices, wire bonding continues to be a primary method of providing electrical interconnection between two locations within a package (e.g., between a die pad of a semiconductor die and a lead of a leadframe). To form wire loops to provide this interconnection, bonding tools (e.g., capillary tools used during ball bonding, wedge tools used in wedge bonding) are used to press a wire against a bonding location using ultrasonic, thermosonic, or thermocompressive energy.
- In the assembly of certain devices (e.g., power semiconductor devices) ribbon bonding may be used to provide electrical interconnection between locations. For example, U.S. Patent Application Publication Nos. 2006/0163315 (entitled Ribbon Bonding Tool and Process) and 2007/0141755 (entitled Ribbon Bonding in an Electronic Package) relate to ribbon bonding and are incorporated herein by reference.
- Various of the drawings disclosed herein (e.g.,
FIGS. 1 , 2, and 3A-3F) are useful in explaining conventional ribbon bonding tools and systems, as well as ribbon bonding tools and systems according to the present invention.FIG. 1 illustrates semiconductor die 110 supported by substrate 108 (e.g., leadframe 108). It is desired to provide a conductive interconnection between a location(s) on semiconductor die 110 (e.g., a die pad) and lead 108 a ofleadframe 108.Ribbon loop 112 provides such interconnection and includesfirst bond 112 a andsecond bond 112 b (both bonded to portions of semiconductor die 110), as well athird bond 112 c onlead 108.Ribbon loop 112 is formed using ribbon bonding system 100 (e.g., a ribbon bonding machine). As is understood by those skilled in the art, a ribbon bonding system includes many conventional components and subsystems such as a material handling system, a vision system, a computer, and many others. However, for simplicity, only a few elements ofribbon bonding system 100 are shown. Such elements includeribbon bonding tool 102,ribbon guide 104, andcutting tool 106. During formation of ribbon loops (such as ribbon loop 112) a ribbon material is fed to ribbonbonding tool 102 from a ribbon supply (not shown) usingribbon guide 104. Ribbon bonding uses energy (e.g., ultrasonic energy to form bonds), and then, after formation of a ribbon loop,cutter 106 may be used to at least partially cut through the ribbon material prior to separation of the ribbon loop from the ribbon supply. -
FIG. 2 is a perspective view ofribbon bonding tool 102 engaged inaperture 114 a ofultrasonic transducer 114, whereribbon bonding tool 102 is aligned inaperture 114 a usingflat surface side 102 k (in this case,front side 102 k). As is understood by those skilled in the art, transducer 114 causes a “scrubbing” motion at thetip portion 102 a, and particular, to workingsurface 102 b ofribbon bonding tool 102.FIGS. 3A-3F are various views of exemplaryribbon bonding tool 102.FIG. 3A is a front view oftool 102,FIG. 3B is a top view of tool 102 (illustratingflat surface side 102 k),FIG. 3C is a bottom view illustrating workingsurface 102 b,FIG. 3D is a detailed view of a portion ofFIG. 3A illustratingfront edge 102 d oftip portion 102 a adjacentworking surface 102 b,FIG. 3E is a side view oftool 102, andFIG. 3F is a detailed view of a portion ofFIG. 3E illustrating side edge 102f 1 oftip portion 102 a adjacentworking surface 102 b. - Certain ribbon bonding tools have features formed on the working surface such as those shown in U.S. Patent Application Publication No. 2006/0163315 entitled Ribbon Bonding Tool and Process.
FIG. 4A is anexemplary tip portion 102 a of a conventionalribbon bonding tool 102. Tip portion includes workingsurface 102 b,front edge 102 d,back edge 102 e, side edge 102f 1, and side edge 102 f 2.Working surface 102 b definesprotrusions 102b 1 andrecesses 102 b 2 (where the protrusions and recesses may be part of a waffle or grid pattern on the working surface), whererecesses 102 b 2 are betweenprotrusions 102b 1. A typical scrubbing motion of a ribbon bonding tool is from front to back, along the direction of the ribbon. InFIG. 4A , the scrubbing would typically occur in direction “d” which extends in a direction fromfront edge 102 d toback edge 102 e. -
FIG. 4B is a perspective view of a portion ofribbon loop 112 includingfirst bond 112 a bonded to bondinglocation 110.First bond 112 a is formed using a “waffle” type ribbon bonding tool (similar to that shown inFIG. 4A ) which forms openings/recesses 112 a 2 betweenprotrusions 112 a 1. Unfortunately, conventional waffle style ribbon bond tools suffer from a number of deficiencies. For example, the edges of the protrusions on the working surface of the ribbon bonding tool tend to leave an irregular edge in the heel region of the ribbon bond, which may initiatecracks 112 a 3 at some point during the life of the ribbon bond. Other limitations of existing ribbon bonding tools relate to ribbon looping difficulties, amongst others. - Thus, it would be desirable to provide improved ribbon bonding tools.
- According to an exemplary embodiment of the invention, a ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion. The working surface includes a region defining at least one of a plurality of recesses and a plurality of protrusions. The working surface also defines at least one of (1) a first planar portion between the region and the front edge of the tip portion, and (2) a second planar portion between the region and the back edge of the tip portion.
- According to another exemplary embodiment of the present invention, a ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion. The working surface defines a plurality of recesses, wherein a portion of the recesses defined by the working surface adjacent at least one of the front edge and the back edge are deeper than others of the recesses.
- According to another exemplary embodiment of the present invention, a ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface, wherein during engagement with a transducer of a ribbon bonding system, the working surface extends lower in a center region than (1) at a first surface region extending from a first edge of the working surface toward the center region, and (2) at a region extending from a second edge of the working surface toward the center region, a length of the first surface region being at least 25% of a length of the working surface from the first edge to the second edge, a length of the second surface region being at least 25% of a length of the working surface from the first edge to the second edge.
- According to another exemplary embodiment of the present invention, a ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion including a working surface. The tip portion includes two side wall portions on either side of the working surface wherein a ribbon path is defined between the side wall portions.
- According to another exemplary embodiment of the present invention, a ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface. The tip portion includes two side wall portions extending along an exterior surface of at least a portion of a back side of the ribbon bonding tool wherein a ribbon path is defined between the side wall portions.
- The inventive ribbon bonding tools may also be integrated into inventive ribbon bonding systems including various elements such as bond head elements (e.g., ultrasonic transducers, ribbon cutter, ribbon material guides), as well as other elements.
- Further, the invention may also be considered in connection with methods of forming ribbon loops. Such methods may include a step of forming a ribbon bond of a ribbon loop on a first bonding location, extending the ribbon material toward a second bonding location, forming another ribbon bond on the second bonding location, and separating the now completed ribbon loop from the ribbon supply (using a ribbon cutter, if desired, to assist in the separation). Such a method is accomplished using an inventive ribbon bonding tool (and other elements of a ribbon bonding system) according to the exemplary embodiments disclosed herein.
- The invention is best understood from the following detailed description when read in connection with the accompanying drawing. It is emphasized that, according to common practice, the various features of the drawing are not to scale. On the contrary, the dimensions of the various features are arbitrarily expanded or reduced for clarity. Included in the drawing are the following figures:
-
FIG. 1 is a side block diagram view of portions of a ribbon bonding system useful in explaining various exemplary embodiments of the present invention; -
FIG. 2 is a perspective view of a ribbon bonding tool engaged in a transducer useful in explaining various exemplary embodiments of the present invention; -
FIGS. 3A-3F are various views of the ribbon bonding tool ofFIG. 2 ; -
FIG. 4A is a perspective view of a tip portion of a conventional ribbon bonding tool; -
FIG. 4B is a portion of a ribbon loop formed using a conventional ribbon bonding tool; -
FIG. 5A is a perspective view of a tip portion of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention; -
FIG. 5B is a portion of a ribbon loop formed using the ribbon bonding tool ofFIG. 5A ; -
FIG. 6A is a perspective view of a tip portion of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention; -
FIG. 6B is a portion of a ribbon loop formed using the ribbon bonding tool ofFIG. 6A ; -
FIGS. 6C-6H are perspective views of tip portions of ribbon bonding tools in accordance with various exemplary embodiments of the present invention; -
FIG. 7A is a side view of a portion of a conventional ribbon bonding tool; -
FIG. 7B is a cross sectional view of a portion of a ribbon bond formed using the ribbon bonding tool ofFIG. 7A ; -
FIGS. 8A-8B are perspective views of tip portions of ribbon bonding tools in accordance with exemplary embodiments of the present invention; -
FIG. 9A is a side view of a portion of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention; -
FIG. 9B is a cross sectional view of a portion of a ribbon bond formed using the ribbon bonding tool ofFIG. 9A ; -
FIG. 10A is a bottom view of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention; -
FIGS. 10B-10C are various cross sectional views of the ribbon bonding tool ofFIG. 10A ; -
FIGS. 11A-11B are block diagram views of a portion of a conventional ribbon bonding tool; -
FIG. 12A is a perspective view of a portion of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention; -
FIG. 12B is a block diagram view of a portion of the ribbon bonding tool ofFIG. 12A ; -
FIG. 13 is a block diagram front view of a portion of a conventional ribbon bonding tool; -
FIG. 14 is a block diagram front view of a portion of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention; -
FIGS. 15A-15B are perspective views of a tip portion of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention; -
FIGS. 16A-16B are perspective views of a portion of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention; -
FIG. 17 is a perspective view of a portion of a working surface of a conventional ribbon bonding tool; and -
FIG. 18 is a perspective view of a portion of a working surface of a ribbon bonding tool in accordance with an exemplary embodiment of the present invention. - According to certain exemplary embodiments of the present invention, the working surface (also known as a “foot”) of a ribbon bonding tool includes a region defining at least one of a plurality of recesses and a plurality of protrusions (such as in a waffle or grid pattern). The working surface also defines at least one planar portion, along at least one edge of the working surface.
FIGS. 5A , 6A, and 6C-6H illustrate an example of such a ribbon bonding tool, withFIGS. 5B and 6B illustrating portions of ribbon loops. The planar portions may have dimensions (e.g., width, height, etc.) that vary. The planar portions are not required to be perfectly flat or smooth, but rather are smoother or flatter than the edges of a standard waffle tool. Such planar portions tend to improve looping capability and reduction of crack initiation sites in the heel region of the ribbon loop. -
FIG. 5A is a perspective bottom view oftip portion 502 a of a ribbon bonding tool.Tip portion 502 a includes workingsurface 502 b betweenfront edge 502 d and backedge 502 e (and also defined between side edge 502f 1 and side edge 502 f 2). Workingsurface 502 b includes aregion defining protrusions 502 b 1 and recesses 502 b 2 (similar to a waffle pattern). Workingsurface 502 b also defines first planar portion 502g 1 between the region andfront edge 502 d, and second planar portion 502 g 2 between the region andback edge 502 e. In contrast to conventional waffle tools where the entire working surface defines protrusions/recesses, planar portions 502g 1 and 502 g 2 leave smooth heel regions during ribbon looping with decreased potential for crack-initiation sites. The length L1 of the first planar portion (or the length L2 of the second planar portion) may be between 5-40 percent of the length L fromfront edge 502 d to backedge 502 e. -
FIG. 5B illustrates a portion ofribbon loop 512 formed using the ribbon bonding tool ofFIG. 5A .Portion 512 a ofribbon loop 512 corresponds to the region of workingsurface 502b including protrusions 502 b 1 and recesses 502 b 2. More specifically, protrusions 512 b ofportion 512 a correspond torecesses 502 b 2 of workingsurface 502 b, and recesses 512 c ofportion 512 a correspond toprotrusions 502b 1 of workingsurface 502 b. Planar portions 512d 1 and 512 d 2 correspond to planar portions 502g 1 and 502 g 2 of workingsurface 502 b, and provide desirable heel regions “h” inribbon loop 512. - In the configuration shown in
FIG. 5A , the region of workingsurface 502b defining protrusions 502 b 1 and recesses 502 b 2 is mostly below a plane defined across planar portions 502g 1 and 502 g 2 (i.e., the top ofprotrusions 502b 1 is at substantially the same height as planar portions 502g 1 and 502 g 2). However, the region could extend above a plane defined across planar portions 502g 1 and 502 g 2. - Referring now to
FIG. 6A , a perspective bottom view oftip portion 602 a of a ribbon bonding tool is shown. Tip portion includes workingsurface 602 b betweenfront edge 602 d and backedge 602 e (and also defined between side edge 602f 1 and side edge 602 f 2). Workingsurface 602 b includes aregion defining protrusions 602b 1. Workingsurface 602 b also defines first planar portion 602g 1 between the region andfront edge 602 d, second planar portion 602 g 2 between the region andback edge 602 e, third planar portion 602 g 3 between the region and side edge 602 f 2, and fourth planar portion 602 g 4 between the region and side edge 602 f 2.FIG. 6B illustratesportion 612 a ofribbon loop 612 formed using the ribbon bonding tool ofFIG. 6A .Portion 612 a includesrecesses 612 c corresponding toprotrusions 602b 1 of working surface 602, and planar portions 612d 1 and 612 d 2.FIGS. 6C-6H are similar to the embodiment shown inFIG. 6A , where like reference numerals correspond to like elements of the ribbon bonding tool. -
FIG. 6C illustratestip portion 622 a including workingsurface 622 b betweenfront edge 622 d, back edge 622 e, side edge 622f 1, and side edge 622 f 2. Workingsurface 622 b includes a region defining two rows of diamond shapedprotrusions 622b 1. Workingsurface 622 b also defines first planar portion 622g 1 between the region andfront edge 622 d, second planar portion 622 g 2 between the region and back edge 622 e, third planar portion 622 g 3 between the region and side edge 622f 1, and fourth planar portion 622 g 4 between the region and side edge 622 f 2. Of course, other shapes and configurations of protrusions on the working surface are contemplated. -
FIG. 6D illustratestip portion 632 a including workingsurface 632 b betweenfront edge 632 d, backedge 632 e, side edge 632f 1, and side edge 632 f 2. Workingsurface 632 b includes a region defining round shapedprotrusions 632b 1. Workingsurface 632 b also defines first planar portion 632g 1 between the region andfront edge 632 d, second planar portion 632 g 2 between the region andback edge 632 e, third planar portion 632 g 3 between the region and side edge 632f 1, and fourth planar portion 632 g 4 between the region and side edge 632 f 2.FIG. 6E illustratestip portion 642 a including workingsurface 642 b betweenfront edge 642 d, back edge 642 e, side edge 642f 1, and side edge 642 f 2. Workingsurface 642 b includes a region defining rectangular shapedprotrusions 642b 1. Workingsurface 642 b also defines first planar portion 642g 1 between the region andfront edge 642 d, second planar portion 642 g 2 between the region and back edge 642 e, third planar portion 642 g 3 between the region and side edge 642f 1, and fourth planar portion 642 g 4 between the region and side edge 642 f 2. - The features on the working surface are not limited to protrusions, but may include recesses, or both recesses and protrusions.
FIGS. 6F-6H illustrate exemplary configurations with recesses.FIG. 6F illustratestip portion 652 a including workingsurface 652 b betweenfront edge 652 d, back edge 652 e, side edge 652f 1, and side edge 652 f 2. Workingsurface 652 b includes a region defining diamond shapedrecesses 652b 1. Workingsurface 652 b also defines first planar portion 652g 1 between the region andfront edge 652 d, second planar portion 652 g 2 between the region and back edge 652 e, third planar portion 652 g 3 between the region and side edge 652f 1, and fourth planar portion 652 g 4 between the region and side edge 652 f 2.FIG. 6G illustratestip portion 662 a including workingsurface 662 b betweenfront edge 662 d, backedge 662 e, side edge 662f 1, and side edge 662 f 2. Workingsurface 662 b includes a region defining round shapedrecesses 662b 1. Workingsurface 662 b also defines first planar portion 662g 1 between the region andfront edge 662 d, second planar portion 662 g 2 between the region andback edge 662 e, third planar portion 662 g 3 between the region and side edge 662f 1, and fourth planar portion 662 g 4 between the region and side edge 662 f 2.FIG. 6H illustratestip portion 672 a including workingsurface 672 b betweenfront edge 672 d, backedge 672 e, side edge 672f 1, and side edge 672 f 2. Workingsurface 672 b includes a region defining rectangular shapedrecesses 672b 1. Workingsurface 672 b also defines first planar portion 672g 1 between the region andfront edge 672 d, second planar portion 672 g 2 between the region andback edge 672 e, third planar portion 672 g 3 between the region and side edge 672f 1, and fourth planar portion 672 g 4 between the region and side edge 672 f 2. -
FIG. 7A is a side view of a portion of a conventional ribbon bonding tool with workingsurface 702 b having a waffle configuration, with a phantom view of a portion of workingsurface 702 b. Workingsurface 702 b includesprotrusions 702 b 1 (also known as teeth) and recesses 702 b 2 (also known as grooves). End recesses 702 b 2 e have the same depth asother recesses 702 b 2. Thus, recesses 702 b 2/702 b 2 e across workingsurface 702 b define a groove plane GP that is substantially flat and parallel to the bottom surface (labeled as bottom surface plane BSP) of the ribbon bonding tool.FIG. 7B illustrates a portion ofribbon loop 712 formed using the ribbon bonding tool ofFIG. 7A .Ribbon loop 712 includesprotrusions 712 c, and recesses 712 c (where recesses 712 c have the same depth as end recesses 712 c 1). -
FIGS. 8A-8B are bottom perspective views oftip portions 802 a/852 a of ribbon bonding tools according to the present invention including recesses of varying depths.FIG. 8A illustrates workingsurface 802b including protrusions 802 b 1 (also known as teeth) and recesses 802 b 2/802 b 2 e. End recesses 802 b 2 e along the front and back edge oftip portion 802 a are deeper thanother recesses 802 b 2, thereby resulting in longer protrusions/teeth adjacent the front and back edge oftip portion 802 a.FIG. 8B illustrates workingsurface 852b including protrusions 852 b 1 and recesses 852 b 2/852 b 2 e. End recesses 852 b 2 e along the front and back edge oftip portion 852 a are deeper thanother recesses 852 b 2, thereby resulting in longer protrusions/teeth adjacent the front and back edge oftip portion 852 a. The deeper recesses along the front and back edges allow for thicker ribbon material in a heel region of a ribbon loop formed using the ribbon bonding tool. -
FIG. 9A is a side view of a portion of ribbon bonding tool according to an exemplary embodiment of the present invention with workingsurface 902 b having a waffle configuration or the like, with a phantom view of a portion of workingsurface 902 b. Workingsurface 902 b includesprotrusions 902 b 1 (also known as teeth) and recesses 902 b 2 (also known as grooves). End recesses 902 b 2 e are deeper thanrecesses 902 b 2 in the center portion of workingsurface 902 b. In fact, the recesses follow a profile that is deepest at the front and back edges of workingsurface 902 b, and shallowest in a center region of workingsurface 902 b. Thus, recesses 902 b 2/902 b 2 e across workingsurface 902 b define a curved groove plane GP (the groove plane GP following the shape of workingsurface 902 b at the bottom of the recesses/grooves).FIG. 9B illustrates a portion ofribbon loop 912 formed using the ribbon bonding tool ofFIG. 9A .Ribbon loop 912 includes protrusions 912 b, and recesses 912 c, 912c recesses 912 c 2 are the deepest, withrecesses 912 c 1 having a depth between that ofrecesses 912 c and that ofrecesses 912 c 2. Of course, protrusions 912 b will be longer where the recesses are deeper, and shorter when the recesses are shallower, thereby improving the heel strength of the ribbon bonds formed using such a tool. -
FIG. 10A is a bottom view oftip portion 1002 a of a ribbon bonding tool including workingsurface 1002 b (where workingsurface 1002 b includes a waffle configuration including protrusions/teeth and recesses/grooves).FIGS. 10B-10C are sectional views of the ribbon bonding tool ofFIG. 10A .FIG. 10B is a sectional view cut across a groove between rows ofprotrusions 1002 b 1 (where therecesses 1002 b 2 are betweenadjacent protrusions 1002 b 1), where the varying recess depth defines curved groove plane GP.FIG. 10C is a sectional view cut across a row ofprotrusions 1002b 1, illustrating that end recesses 1002 b 2 e are deeper thanrecesses 1002 b 2, thereby defining the curved groove plane. The curved groove plane GP illustrated inFIGS. 10A-10C extends fromfront edge 1002 d of workingsurface 1002 b to backedge 1002 e of workingsurface 1002 b (and not from side edge 1002f 1 to side edge 1002 f 2). - While
FIGS. 9A and 10A illustrate a curved groove plane GP, other configurations are contemplated where the recess/groove depths are deeper adjacent the front and back edges and shallower at the center of the working surface. For example, the grooves could follow an angled, as opposed to a curved, profile. - While the groove plane GP is illustrated as curving along the front to back direction (i.e., from the front edge of the working surface to the back edge of the working surface), the groove plane GP could extend from one side edge of the working surface to the other side edge of the working surface. Further, the working surface of the ribbon bonding tool could have a curved (or varying depth) groove plane that extends in both the front to back direction (as in
FIG. 9A ) and in the side to side direction (not shown). That is, a depth of the plurality of recesses follows a profile such that a depth of the recesses is shallower at a central portion of the working surface, and increases in each direction extending toward a periphery of the working surface. - While FIGS. 9A and 10A-10C illustrate ribbon bonding tools including a curved groove plane, the bottom surface of the tool continues to be substantially flat (i.e., extending along plane “BSP” shown in
FIGS. 9A and 10C ). Ribbon bonding tools having a flat bottom surface may suffer from a number of deficiencies. In certain configurations of the present invention (e.g., as shown inFIGS. 12A-12B and 14) it may be desirable that the bottom surface be curved (or otherwise be varied along its length). - Referring to
FIGS. 11A-11B , portions of conventionalribbon bonding tool 1102 are shown. As is understood by those skilled in the art, in order to generate the front to back scrub (in a direction along the length of the ribbon material) desired for forming ribbon bonds,tip portion 1102 a rotates about its first transverse vibration node N, located a distance L from workingsurface 1102 b. This distance L is dependent on various factors such resonant frequency, tool material characteristics, etc. Exemplary distances L (and therefore the radius) are between 2-15 mm, 2-10 mm, and 3-5 mm. A standard bond tool has a flat bottom surface that undesirably imparts significant vertical vibration to the bond surface. More specifically, during the rotation about node N, front andback corners corners -
FIGS. 12A-12B illustratestip portion 1202 a of a ribbon bonding tool which includes workingsurface 1202 b. The bottom surface of the ribbon bonding tool has a curved profile fromfront edge 1202 d to backedge 1202 e in order to minimize or eliminate vertical excitation of a bond surface during bonding. The radius of the curved profile may be configured as desired. In the illustrated example, the radius R is designed to be equal to the distance L between the bottom surface of the tip portion and the location of the first node N. That is, because the bottom surface is shorter at its edge portions, it is less likely to cause the excitation problems associated with conventional tools having a flat bottom surface. - Although
FIGS. 12A-12B are illustrated as including a curved profile the entire length of the working surface from the front edge to the back edge, the present invention is not limited thereto. Any of a number of configurations are possible wherein the working surface extends lower in a center region than (1) at a first surface region extending from a first edge of the working surface toward the center region, and (2) at a second surface region extending from a second edge of the working surface toward the center region. For example, the first and second surface regions may be chamfered, curved, etc. so long as the areas adjacent the first and second edge are shorter than the center area between the first edge and the second edge. For example, the first and second surface regions may be at least 25% of a length of the working surface from the first edge to the second edge. In such an embodiment, the total percentage of the length from the first edge to the second edge that has a reduced length/height is at least 50% (where the remainder of the working surface, such as the center portion, may be flat). -
FIGS. 12A-12B relate to examples of the present invention where the bottom surface follows a curved profile in a direction from the front edge to the back edge in order to address the potential vertical excitation problem caused by the rotation of the ribbon bonding tool about the node. However, conventional tools having a flat working surface suffer from other deficiencies. For example,FIG. 13 illustrates a front view oftip portion 1300 a of a ribbon bonding tool. Thus,front edge 1302 d is shown extending between side edge 1302f 1 to side edge 1302 f 2. As will be appreciated by those skilled in the art, bonding locations (e.g., die pads) are often tilted or not flat. If the surface of the bonding location is excessively tilted, ribbon bond formation will be uneven. In extreme cases, the ribbon bonding tool could sink completely through the ribbon on one side, touching the fragile die.FIG. 13 illustrates a tilted bonding location 1310 (e.g., a tilted die pad on a semiconductor die). In this illustration,tip portion 1300 a of the ribbon boning tool is pressed through most of portion 1312 a ofribbon 1312. Thus, it is possible that a portion of workingsurface 1302 b adjacent side edge 1302 f 2 (e.g., the corner) could contact anddamage bonding location 1310. -
FIG. 14 illustrates a front view oftip portion 1400 a of a ribbon bonding tool. Thus,front edge 1402 d is shown extending between side edge 1402f 1 and side edge 1402 f 2. Unlike workingsurface 1302 b illustrated inFIG. 13 (which is flat), workingsurface 1402 b oftip portion 1400 a follows a curved path between side edge 1402f 1 and side edge 1402 f 2. Such a curved path tends to minimize the impact of bonding location tilt (e.g., die tilt) on ribbon bond formation. While such a curved working surface may result in weaker bonding on the outside edges of the ribbon material, the curvature may be designed for an application to provide adequate bonding results. Thus, while the curved surface will tend to result in a variation of the bond strength (e.g., biased to one side) overall bond consistency should improve. Additionally, there is a reduced potential for contact between a portion (e.g., corner) of the ribbon bonding tool and the die or other bonding locations. The height difference h between a side edge and a center point between the side edges may be between, for example, 1-10 mils, but of course may vary considerably based on the application. - Although
FIG. 14 illustrates a curved profile from side edge 1402f 1 to side edge 1402f 1, the present invention is not limited thereto. Any of a number of configurations are possible wherein the working surface extends lower in a center region than (1) at a first surface region extending from a first side edge of the working surface toward the center region, and (2) at a second surface region extending from a second, side edge of the working surface toward the center region. For example, the first and second surface regions may be chamfered, curved, etc. so long at the areas adjacent the first and second edge are shorter than the center area between the first edge and the second edge. For example, the first and second surface regions may be at least 25% of a length of the working surface from the first side edge to the second side edge. - As illustrated in
FIG. 1 , ribbon bonding systems may include a ribbon guide (such asguide 104 inFIG. 1 ) to direct the ribbon material to a ribbon bonding tool, and to facilitate ribbon looping. InFIG. 1 ,ribbon guide 104 directs the ribbon material (e.g., the material of ribbon loop 112) underribbon bonding tool 102. In certain ribbon bonding applications (e.g., smaller width ribbon applications), the separate ribbon guide may not be adequate to consistently position the ribbon with the desired accuracy. -
FIGS. 15A-15B and 16A-16B illustrate tip portions of ribbon bonding tool that include integrated ribbon guides for guiding the ribbon material under the working surface completely external to the ribbon bonding tool. The integrated ribbon guides are designed to assist in the control of the side-to-side position of the ribbon under the working surface of the ribbon bonding tool. Depending on the application, such designs may (or may not) be used in connection with conventional ribbon guides such aselement 104 shown inFIG. 1 . The integrated guide will also simplify the complexity of the bond head setup for a ribbon bonding system because the ribbon guide alignment (to the ribbon bonding tool) may be less critical. - Referring specifically to
FIGS. 15A-15B , perspective views oftip portion 1502 a ofribbon bonding tool 1502 are provided. Workingsurface 1502 b is defined between twoside wall portions 1502sw Side wall portion 1502sw 1 is provided along side edge 1502f 1, andside wall portion 1502 sw 2 is provided along side edge 1502 f 2.Side wall portion 1502sw 1 includes tapered/angled side wall 1502t 1, andside wall portion 1502 sw 2 includes tapered/angled side wall 1502 t 2. As shown inFIG. 15A ,side wall portions 1502sw back side 1502 bs. Ribbon material (e.g., part ofribbon loop 1512 shown inFIG. 15B ) is guided from a ribbon supply to a path defined betweenside wall portions 1502sw surface 1502 b.Side wall portions 1502sw side 1502 bs) channel the ribbon material to the desired position under workingsurface 1502 b fromback edge 1502 e tofront edge 1502 d. The angled configurations ofside wall portions 1502sw side wall portions 1502sw side wall portions 1502sw - Referring specifically to
FIGS. 16A-16B , perspective views oftip portion 1602 a ofribbon bonding tool 1602 are provided.Side wall portions 1602sw back side 1602 bs ofribbon bonding tool 1602.Side wall portion 1602sw 1 includes tapered/angled side wall 1602t 1, andside wall portion 1602 sw 2 includes tapered/angled side wall 1602 t 2. As shown inFIG. 15A ,side wall portions 1602sw surface 1602 b. Ribbon material (e.g., part ofribbon loop 1612 shown inFIG. 16B ) is guided from a ribbon supply to a path defined betweenside wall portions 1602sw surface 1602 b.Side wall portions 1602sw surface 1602 b fromback edge 1602 e tofront edge 1602 d. The angled configurations ofside wall portions 1602sw side wall portions 1602sw surface 1602 b, then the height of at least that portion ofside wall portions 1602sw FIGS. 15A-15B , the width betweenside wall portions 1602sw - The various exemplary ribbon bonding tools disclosed herein may have varying characteristics. For example, while certain of the drawings disclose the working surface as being substantially planar (e.g.,
FIGS. 12A-12B ,FIG. 14 ,FIGS. 15A-15B , andFIGS. 16A-16B ), it is understood that any of the tools may have a working surface with a waffle or grid configuration or other configuration defining a plurality of protrusions and recesses (e.g., such as shown in others of the drawings).FIG. 17 is a perspective view of a portion of working surface 1702 b of a conventional ribbon bonding tool, where working surface 1702 b defines a plurality of protrusions 1702 b 1 (and recesses as illustrated) in a waffle type configuration. Protrusions 1702b 1 define sharp edges SE which undesirably can damage the ribbon material being bonded, and may undesirably contribute to build-up of ribbon material in the waffle pattern.FIG. 18 is a perspective view of a portion of working surface 1802 b of an inventive ribbon bonding tool, where working surface 1802 b defines a plurality of protrusions 1802 b 1 (and recesses as illustrated) in a waffle type configuration. In contrast to sharp edges SE inFIG. 17 , protrusions 1802b 1 define rounded edges RE. For example, corners of protrusions/teeth 1802b 1, may be rounded if they are sharper than 1 mil, with a maximum of 2 mils. - Various embodiments of the present invention include features on or adjacent the working surface of a ribbon bonding tool including, for example, protrusions/teeth, recesses/grooves, rounded edges, side walls portions, amongst others. Such features may be formed by various methods (e.g., using computer control) including, for example, laser-machining, fluid-jet milling, direct molding, mechanical grinding, or EDM (electrical discharge machining).
- Although the present invention includes the aforementioned features (e.g., protrusions/teeth, recesses/grooves, rounded edges, side walls portions) having exemplary shapes/dimensions, it is understood that alternative shapes/dimensions are contemplated.
- Although the invention is illustrated and described herein with reference to specific embodiments, the invention is not intended to be limited to the details shown. Rather, various modifications may be made in the details within the scope and range of equivalents of the claims and without departing from the invention.
Claims (60)
1. A ribbon bonding tool comprising:
a body portion including a tip portion,
the tip portion including a working surface between a front edge of the tip portion and a back edge of the tip portion, the working surface including a region defining at least one of a plurality of recesses and a plurality of protrusions, the working surface also defining at least one of (1) a first planar portion between the region and the front edge of the tip portion, and (2) a second planar portion between the region and the back edge of the tip portion.
2. The ribbon bonding tool of claim 1 wherein the working surface defines both the first planar portion and the second planar portion.
3. The ribbon bonding tool of claim 2 wherein the working surface also defines (1) a third planar portion between the region and a first side of the tip portion, and (2) a fourth planar portion between the region and a second side of the tip portion.
4. The ribbon bonding tool of claim 1 wherein the region defining at least one of a plurality of recesses and a plurality of protrusions is a waffle or a grid pattern of protrusions and recesses.
5. The ribbon bonding tool of claim 4 wherein the protrusions have rounded edges.
6. The ribbon bonding tool of claim 1 wherein the region defines a plurality of protrusions extending above a planar surface of the working surface.
7. The ribbon bonding tool of claim 6 wherein the plurality of protrusions are round.
8. The ribbon bonding tool of claim 6 wherein the plurality of protrusions are rectangular.
9. The ribbon bonding tool of claim 6 wherein the plurality of protrusions are diamond shaped.
10. The ribbon bonding tool of claim 6 wherein the plurality of protrusions are arranged in at least one row.
11. The ribbon bonding tool of claim 6 wherein the plurality of protrusions are arranged in at least two rows.
12. The ribbon bonding tool of claim 6 wherein the plurality of protrusions include rounded edges.
13. The ribbon bonding tool of claim 1 wherein the region defines a plurality of recesses extending below a planar surface of the working surface.
14. The ribbon bonding tool of claim 13 wherein the plurality of recesses are round.
15. The ribbon bonding tool of claim 13 wherein the plurality of recesses are rectangular.
16. The ribbon bonding tool of claim 13 wherein the plurality of recesses are diamond shaped.
17. The ribbon bonding tool of claim 13 wherein the plurality of recesses are arranged in at least one row.
18. The ribbon bonding tool of claim 13 wherein the plurality of recesses are arranged in at least two rows.
19. The ribbon bonding tool of claim 1 , wherein a length of the working surface is defined between the front edge and the back edge, and wherein the first planar portion extends along between 5-40 percent of the length.
20. The ribbon bonding tool of claim 1 , wherein a length of the working surface is defined between the front edge and the back edge, and wherein the second planar portion extends along between 5-40 percent of the length.
21. The ribbon bonding tool of claim 1 , wherein a length of the working surface is defined between the front edge and the back edge, and wherein each of the first planar portion and the second planar portion extends along between 5-40 percent of the length.
22. A ribbon bonding system comprising:
a transducer; and
a ribbon bonding tool supported by the transducer, the ribbon bonding tool Including a body portion including a tip portion, the tip portion including a working surface between a front edge of the tip portion and a back edge of the tip portion, the working surface including a region defining at least one of a plurality of recesses and a plurality of protrusions, the working surface also defining at least one of (1) a first planar portion between the region and the front edge of the tip portion, and (2) a second planar portion between the region and the back edge of the tip portion.
23. A ribbon bonding tool comprising:
a body portion including a tip portion,
the tip portion including a working surface between a front edge of the tip portion and a back edge of the tip portion, the working surface defining a plurality of recesses, wherein a portion of the recesses defined by the working surface adjacent at least one of the front edge and the back edge are deeper than others of the recesses.
24. The ribbon bonding tool of claim 23 wherein a portion of the recesses defined by the working surface adjacent both the front edge and the back edge are deeper than others of the recesses.
25. The ribbon bonding tool of claim 24 wherein a depth of the plurality of recesses follows a profile such that a depth of the recesses is shallower at a central portion of the working surface, and increases toward the front and the back edges.
26. The ribbon bonding tool of claim 25 wherein the profile is a curved profile.
27. The ribbon bonding tool of claim 25 wherein a depth of the plurality of recesses follows another profile such that a depth of the recesses is shallower at a central portion of the working surface, and increases toward side edges of the working surface.
28. The ribbon bonding tool of claim 27 wherein the profile, and the another profile, are curved profiles.
29. The ribbon bonding tool of claim 24 wherein a depth of the plurality of recesses follows a profile such that a depth of the recesses is shallower at a central portion of the working surface, and increases in each direction extending toward a periphery of the working surface.
30. The ribbon bonding tool of claim 29 wherein the profile is a curved profile.
31. A ribbon bonding system comprising:
a transducer; and
a ribbon bonding tool supported by the transducer, the ribbon bonding tool including a body portion including a tip portion, the tip portion including a working surface between a front edge of the tip portion and a back edge of the tip portion, the working surface defining a plurality of recesses and a plurality of protrusions, wherein a portion of the recesses adjacent at least one of the front edge and the back edge are deeper than others of the recesses.
32. A ribbon bonding tool comprising:
a body portion including a tip portion,
the tip portion including a working surface, at least a portion of the working surface following a curved path, the portion including an area of the working surface extending away from a first edge of the working surface, the portion also including an area of the working surface extending away from a second edge of the working surface, the portion of the working surface following the curved path includes at least 50% of a length between the first edge and the second edge.
33. The ribbon bonding tool of claim 32 wherein the portion of the working surface following the curved path includes an entire length between the first edge and the second edge.
34. The ribbon bonding tool of claim 33 wherein the first edge is a front edge and a second edge is the back edge.
35. The ribbon bonding tool of claim 33 wherein the first edge is a first side edge and the second edge is a second side edge.
36. The ribbon bonding tool of claim 32 wherein the first edge is a front edge and a second edge is the back edge.
37. The ribbon bonding tool of claim 32 wherein the first edge is a first side edge and the second edge is a second side edge.
38. The ribbon bonding tool of claim 32 for use in an ultrasonic system wherein the curved path is defined by a radius extending from (1) a location of the ribbon bonding tool that coincides with a first vibrational node of the ribbon bonding tool in the ultrasonic system to (2) the working surface.
39. The ribbon bonding tool of claim 38 wherein the radius is between 2-15 mm.
40. The ribbon bonding tool of claim 38 wherein the radius is between 2-10 mm.
41. The ribbon bonding tool of claim 38 wherein the radius is between 3-5 mm.
42. A ribbon bonding system comprising:
a transducer; and
a ribbon bonding tool supported by the transducer, the ribbon bonding tool including a body portion including a tip portion, the tip portion including a working surface, at least a portion of the working surface following a curved path, the portion including an area of the working surface extending away from a first edge of the working surface, the portion also including an area of the working surface extending away from a second edge of the working surface, the portion of the working surface following the curved path includes at least 50% of a length between the first edge and the second edge.
43. A ribbon bonding tool comprising:
a body portion including a tip portion,
the tip portion including a working surface, wherein during engagement with a transducer of a ribbon bonding system, the working surface extends lower in a center region than (1) at a first surface region extending from a first edge of the working surface toward the center region, and (2) at a region extending from a second edge of the working surface toward the center region, a length of the first surface region being at least 25% of a length of the working surface from the first edge to the second edge, a length of the second surface region being at least 25% of a length of the working surface from the first edge to the second edge.
44. The ribbon bonding tool of claim 43 wherein the first surface region is chamfered in a direction from the first edge toward the center region, and the second surface region is chamfered in a direction from the second edge toward the center region.
45. The ribbon bonding tool of claim 43 wherein the first surface region is curved in a direction from the first edge toward the center region, and the second surface region is curved in a direction from the second edge toward the center region.
46. The ribbon bonding tool of claim 43 wherein the first edge is a front edge and a second edge is the back edge.
47. The ribbon bonding tool of claim 43 wherein the first edge is a first side edge and the second edge is a second side edge.
48. A ribbon bonding system comprising:
a transducer; and
a ribbon bonding tool supported by the transducer, the ribbon bonding tool including a body portion including a tip portion, the tip portion including a working surface, wherein during engagement with a transducer of a ribbon bonding system, the working surface extends lower in a center region than (1) at a first surface region extending from a first edge of the working surface toward the center region, and (2) at a region extending from a second edge of the working surface toward the center region, a length of the first surface region being at least 25% of a length of the working surface from the first edge to the second edge, a length of the second surface region being at least 25% of a length of the working surface from the first edge to the second edge.
49. A ribbon bonding tool comprising:
a body portion including a tip portion,
the tip portion including a working surface, the tip portion including two side wall portions on either side of the working surface wherein a ribbon path is defined between the side wall portions.
50. The ribbon bonding tool of claim 49 wherein the side wall portions are tapered such that the ribbon path is larger at a bottom edge of the tool than it is at the working surface.
51. The ribbon bonding tool of claim 49 wherein the side wall portions are curved such that the ribbon path is larger at a bottom edge of the tool than it is at the working surface.
52. The ribbon bonding tool of claim 49 wherein the side wall portions are chamfered such that the ribbon path is larger at a bottom edge of the tool than it is at the working surface.
53. The ribbon bonding tool of claim 49 wherein the two side wall portions extend at least partially along a back side of the ribbon bonding tool such that the ribbon path is defined along a portion of the back side of the ribbon bonding tool and along the working surface.
54. A ribbon bonding system comprising:
a transducer; and
a ribbon bonding tool supported by the transducer, the ribbon bonding tool including a body portion including a tip portion, the tip portion including a working surface, the tip portion including two side wall portions on either side of the working surface wherein a ribbon path is defined between the side wall portions.
55. A ribbon bonding tool comprising:
a body portion including a tip portion,
the tip portion including a working surface, the tip portion including two side wall portions extending along an exterior surface of at least a portion of a back side of the ribbon bonding tool wherein a ribbon path is defined between the side wall portions.
56. The ribbon bonding tool of claim 55 wherein the side wall portions are tapered such that the ribbon path is smaller at an interior surface of the ribbon path than at an outer edge of the ribbon path defined between the two side wall portions.
57. The ribbon bonding tool of claim 55 wherein the side wall portions are curved such that the ribbon path is smaller at an interior surface of the ribbon path than at an outer edge of the ribbon path defined between the two side wall portions.
58. The ribbon bonding tool of claim 55 wherein the side wall portions are chamfered such that the ribbon path is smaller at an interior surface of the ribbon path than at an outer edge of the ribbon path defined between the two side wall portions.
59. The ribbon bonding tool of claim 55 wherein the two side wall portions extend at least partially along a bottom edge of the ribbon bonding tool such that the ribbon path is defined along at least a portion of the back side of the ribbon bonding tool and along at least a portion of the bottom edge.
60. A ribbon bonding system comprising:
a transducer; and
a ribbon bonding tool supported by the transducer, the ribbon bonding tool including a body portion including a tip portion, the tip portion including a working surface, the tip portion including two side wall portions extending along an exterior surface of at least a portion of a back side of the ribbon bonding tool wherein a ribbon path is defined between the side wall portions.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/145,676 US20110290859A1 (en) | 2009-02-06 | 2010-02-05 | Ribbon bonding tools and methods of using the same |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15062509P | 2009-02-06 | 2009-02-06 | |
US15057909P | 2009-02-06 | 2009-02-06 | |
US15061109P | 2009-02-06 | 2009-02-06 | |
US15064009P | 2009-02-06 | 2009-02-06 | |
US15063309P | 2009-02-06 | 2009-02-06 | |
US15059609P | 2009-02-06 | 2009-02-06 | |
US13/145,676 US20110290859A1 (en) | 2009-02-06 | 2010-02-05 | Ribbon bonding tools and methods of using the same |
PCT/US2010/023273 WO2010091222A2 (en) | 2009-02-06 | 2010-02-05 | Ribbon bonding tools and methods of using the same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2010/023273 A-371-Of-International WO2010091222A2 (en) | 2009-02-06 | 2010-02-05 | Ribbon bonding tools and methods of using the same |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/738,421 Continuation US20130119111A1 (en) | 2009-02-06 | 2013-01-10 | Ribbon bonding tools and methods of using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110290859A1 true US20110290859A1 (en) | 2011-12-01 |
Family
ID=42542656
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/145,676 Abandoned US20110290859A1 (en) | 2009-02-06 | 2010-02-05 | Ribbon bonding tools and methods of using the same |
US13/738,421 Abandoned US20130119111A1 (en) | 2009-02-06 | 2013-01-10 | Ribbon bonding tools and methods of using the same |
US14/705,341 Active US9929122B2 (en) | 2009-02-06 | 2015-05-06 | Ribbon bonding tools and methods of using the same |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/738,421 Abandoned US20130119111A1 (en) | 2009-02-06 | 2013-01-10 | Ribbon bonding tools and methods of using the same |
US14/705,341 Active US9929122B2 (en) | 2009-02-06 | 2015-05-06 | Ribbon bonding tools and methods of using the same |
Country Status (3)
Country | Link |
---|---|
US (3) | US20110290859A1 (en) |
CN (2) | CN102308374B (en) |
WO (1) | WO2010091222A2 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130140346A1 (en) * | 2010-03-31 | 2013-06-06 | Orthodyne Electronics Corporation | Ultrasonic bonding systems and methods of using the same |
CN103731792A (en) * | 2013-12-23 | 2014-04-16 | 惠州市三协精密有限公司 | Jig for welding magnetic circuit body |
US8746537B2 (en) | 2010-03-31 | 2014-06-10 | Orthodyne Electronics Corporation | Ultrasonic bonding systems and methods of using the same |
WO2014094730A1 (en) * | 2012-12-17 | 2014-06-26 | Hesse Gmbh | Tool for producing a friction-welded connection between a wire and a substrate, having a pocket-shaped recess |
US8820609B2 (en) | 2011-09-20 | 2014-09-02 | Orthodyne Electronics Corporation | Wire bonding tool |
US20170018752A1 (en) * | 2015-07-16 | 2017-01-19 | Samsung Sdi Co., Ltd. | Method of manufacturing secondary battery |
JP2019005776A (en) * | 2017-06-22 | 2019-01-17 | イーグル工業株式会社 | Ultrasonic joining method, ultrasonic joining jig, and joint structure |
JP2019030888A (en) * | 2017-08-08 | 2019-02-28 | イーグル工業株式会社 | Ultrasonic joining jig, ultrasonic joining method and joint structure |
US11517973B2 (en) | 2017-01-30 | 2022-12-06 | Newfrey Llc | Welding element and welding method for connecting a weld element to a workpiece |
US11929265B2 (en) * | 2021-12-21 | 2024-03-12 | Mitsubishi Electric Corporation | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011084503A1 (en) * | 2011-10-14 | 2013-04-18 | Robert Bosch Gmbh | Welding element for welding a contact element with a connection element |
CN103219255A (en) * | 2013-03-15 | 2013-07-24 | 李尚哲 | Ultrasonic welding chopper with multiple bonding wire grooves |
US9981336B2 (en) | 2015-11-04 | 2018-05-29 | Kulicke And Soffa Industries, Inc. | Ribbon bonding tools, and methods of designing ribbon bonding tools |
WO2017132027A1 (en) | 2016-01-26 | 2017-08-03 | Orthodyne Electronics Corporation | Wedge bonding tools, wedge bonding systems, and related methods |
JP2019013959A (en) * | 2017-07-06 | 2019-01-31 | イーグル工業株式会社 | Ultrasonic junction jig, junction structure and junction method |
JP7031185B2 (en) * | 2017-09-15 | 2022-03-08 | 富士電機株式会社 | Wedge tool and wedge bonding method |
DE102018221843A1 (en) * | 2018-12-14 | 2020-06-18 | Volkswagen Aktiengesellschaft | Ultrasonic welding device and method for producing a metal foil stack |
DE102019124334A1 (en) * | 2019-09-11 | 2021-03-11 | Hesse Gmbh | Bond arrangement and bonding tool |
US10981245B2 (en) * | 2019-09-24 | 2021-04-20 | GM Global Technology Operations LLC | Apparatus for ultrasonic welding of polymers and polymeric composites |
US11141925B2 (en) * | 2019-10-31 | 2021-10-12 | GM Global Technology Operations LLC | Ultrasonic welding and welding horn having indenter |
TWI792612B (en) * | 2021-10-15 | 2023-02-11 | 黃雅筠 | Ultrasonic welding structure of plastic sheet |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6523732B1 (en) * | 2001-10-10 | 2003-02-25 | Ford Global Technologies, Inc. | Ultrasonic welding apparatus |
US6824630B2 (en) * | 2002-07-31 | 2004-11-30 | Sumitomo Wiring Systems, Ltd. | Flexible flat cable connecting method and a horn construction of an ultrasonic welding machine |
US20060065697A1 (en) * | 2004-09-29 | 2006-03-30 | Fujitsu Limited | Bonding tool for ultrasonic bonding and method of ultrasonic bonding |
US20060169388A1 (en) * | 2005-01-28 | 2006-08-03 | Nissan Motor Co., Ltd. | Ultrasonic bonding equipment and resulting bonding structure |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3627190A (en) * | 1969-10-28 | 1971-12-14 | Gte Laboratories Inc | Apparatus for bonding semiconductor elements |
US3971499A (en) * | 1974-09-03 | 1976-07-27 | Tribotech | Bonding tool |
US3934783A (en) * | 1974-09-30 | 1976-01-27 | Larrison John E | Multiface wire bonding method and tool |
DE3335254A1 (en) | 1983-09-29 | 1985-04-18 | Schunk Ultraschalltechnik Gmbh, 8750 Aschaffenburg | CONNECTING DEVICE COMPRESS ELECTRICAL LADDER |
GB8624513D0 (en) * | 1986-10-13 | 1986-11-19 | Microelectronics & Computer | Single point bonding method |
US4976392A (en) * | 1989-08-11 | 1990-12-11 | Orthodyne Electronics Corporation | Ultrasonic wire bonder wire formation and cutter system |
JP2697411B2 (en) * | 1991-03-27 | 1998-01-14 | 日本電気株式会社 | TAB inner lead joining method |
JP2943381B2 (en) * | 1991-04-25 | 1999-08-30 | 日本電気株式会社 | Bonding method |
JP2727970B2 (en) * | 1993-10-07 | 1998-03-18 | 日本電気株式会社 | Bonding tool |
US5868301A (en) * | 1996-04-10 | 1999-02-09 | Tessera, Inc. | Semiconductor inner lead bonding tool |
US6286746B1 (en) * | 1997-08-28 | 2001-09-11 | Axya Medical, Inc. | Fused loop of filamentous material and apparatus for making same |
JP4132792B2 (en) * | 2001-11-22 | 2008-08-13 | ローム株式会社 | Capillary structure used for wire bonding |
GB0219910D0 (en) * | 2002-08-28 | 2002-10-02 | Koninkl Philips Electronics Nv | Wedge-bonding of wires in electronic device manufacture |
JP2006508011A (en) | 2002-11-22 | 2006-03-09 | サン−ゴバン セラミックス アンド プラスティクス,インコーポレイティド | Zirconia reinforced alumina ESD protective ceramic composition, component and method for forming the same |
JP4065799B2 (en) | 2003-03-12 | 2008-03-26 | 株式会社ルネサステクノロジ | Ultrasonic bonding apparatus and method |
US20040217488A1 (en) | 2003-05-02 | 2004-11-04 | Luechinger Christoph B. | Ribbon bonding |
US7249702B2 (en) * | 2003-12-04 | 2007-07-31 | Kulicke And Soffa Industries, Inc. | Multi-part capillary |
JP4047349B2 (en) * | 2004-11-09 | 2008-02-13 | 株式会社東芝 | Ultrasonic bonding apparatus for manufacturing semiconductor device, semiconductor device, and manufacturing method |
US20060163315A1 (en) * | 2005-01-27 | 2006-07-27 | Delsman Mark A | Ribbon bonding tool and process |
US20060180635A1 (en) * | 2005-02-17 | 2006-08-17 | Oon-Pin Lim | Bonding tool and method |
JP4271674B2 (en) * | 2005-07-26 | 2009-06-03 | 超音波工業株式会社 | Wire bonding equipment |
DE102006003806A1 (en) * | 2006-01-26 | 2007-08-02 | Ejot Gmbh & Co. Kg | Fastening element for Reibschweißverbindung with a flat component |
US20100170935A1 (en) | 2007-06-06 | 2010-07-08 | Schunk Sonosystems Gmbh | Method for connecting stranded wires in an electrically conducting manner and ultrasound welding device |
JP4989437B2 (en) * | 2007-12-14 | 2012-08-01 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
JP4941268B2 (en) * | 2007-12-17 | 2012-05-30 | 富士通株式会社 | Wire bonding method and wire bonding apparatus |
-
2010
- 2010-02-05 WO PCT/US2010/023273 patent/WO2010091222A2/en active Application Filing
- 2010-02-05 CN CN201080006910.0A patent/CN102308374B/en active Active
- 2010-02-05 US US13/145,676 patent/US20110290859A1/en not_active Abandoned
- 2010-02-05 CN CN201610006899.7A patent/CN105598573B/en active Active
-
2013
- 2013-01-10 US US13/738,421 patent/US20130119111A1/en not_active Abandoned
-
2015
- 2015-05-06 US US14/705,341 patent/US9929122B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6523732B1 (en) * | 2001-10-10 | 2003-02-25 | Ford Global Technologies, Inc. | Ultrasonic welding apparatus |
US6824630B2 (en) * | 2002-07-31 | 2004-11-30 | Sumitomo Wiring Systems, Ltd. | Flexible flat cable connecting method and a horn construction of an ultrasonic welding machine |
US20060065697A1 (en) * | 2004-09-29 | 2006-03-30 | Fujitsu Limited | Bonding tool for ultrasonic bonding and method of ultrasonic bonding |
US20060169388A1 (en) * | 2005-01-28 | 2006-08-03 | Nissan Motor Co., Ltd. | Ultrasonic bonding equipment and resulting bonding structure |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8511536B2 (en) * | 2010-03-31 | 2013-08-20 | Orthodyne Electronics Corporation | Ultrasonic bonding systems and methods of using the same |
US8584922B1 (en) | 2010-03-31 | 2013-11-19 | Orthodyne Electronics Corporation | Ultrasonic bonding systems and methods of using the same |
US20130140346A1 (en) * | 2010-03-31 | 2013-06-06 | Orthodyne Electronics Corporation | Ultrasonic bonding systems and methods of using the same |
US8746537B2 (en) | 2010-03-31 | 2014-06-10 | Orthodyne Electronics Corporation | Ultrasonic bonding systems and methods of using the same |
US8820609B2 (en) | 2011-09-20 | 2014-09-02 | Orthodyne Electronics Corporation | Wire bonding tool |
WO2014094730A1 (en) * | 2012-12-17 | 2014-06-26 | Hesse Gmbh | Tool for producing a friction-welded connection between a wire and a substrate, having a pocket-shaped recess |
CN103731792A (en) * | 2013-12-23 | 2014-04-16 | 惠州市三协精密有限公司 | Jig for welding magnetic circuit body |
US20170018752A1 (en) * | 2015-07-16 | 2017-01-19 | Samsung Sdi Co., Ltd. | Method of manufacturing secondary battery |
KR20170009297A (en) * | 2015-07-16 | 2017-01-25 | 삼성에스디아이 주식회사 | Manufacturing method for secondary battery |
KR102510882B1 (en) | 2015-07-16 | 2023-03-16 | 삼성에스디아이 주식회사 | Manufacturing method for secondary battery |
US11517973B2 (en) | 2017-01-30 | 2022-12-06 | Newfrey Llc | Welding element and welding method for connecting a weld element to a workpiece |
JP2019005776A (en) * | 2017-06-22 | 2019-01-17 | イーグル工業株式会社 | Ultrasonic joining method, ultrasonic joining jig, and joint structure |
JP2019030888A (en) * | 2017-08-08 | 2019-02-28 | イーグル工業株式会社 | Ultrasonic joining jig, ultrasonic joining method and joint structure |
US11929265B2 (en) * | 2021-12-21 | 2024-03-12 | Mitsubishi Electric Corporation | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
US9929122B2 (en) | 2018-03-27 |
US20150235983A1 (en) | 2015-08-20 |
WO2010091222A2 (en) | 2010-08-12 |
CN105598573A (en) | 2016-05-25 |
CN105598573B (en) | 2019-08-20 |
CN102308374B (en) | 2016-02-03 |
US20130119111A1 (en) | 2013-05-16 |
CN102308374A (en) | 2012-01-04 |
WO2010091222A3 (en) | 2010-11-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9929122B2 (en) | Ribbon bonding tools and methods of using the same | |
US20210028143A1 (en) | Ribbon bonding tools and methods of using the same | |
KR100745271B1 (en) | Ultrasonic adherence apparatus and adherence structure | |
US4030657A (en) | Wire lead bonding tool | |
JP4047349B2 (en) | Ultrasonic bonding apparatus for manufacturing semiconductor device, semiconductor device, and manufacturing method | |
US10864597B2 (en) | Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus | |
US20060163315A1 (en) | Ribbon bonding tool and process | |
US8820609B2 (en) | Wire bonding tool | |
JP2006013512A (en) | Capillary for wire bonding | |
US10562127B2 (en) | Ribbon bonding tools, and methods of designing ribbon bonding tools | |
US7407080B2 (en) | Wire bond capillary tip | |
US20150336206A1 (en) | Tool for producing a friction-welded connection between a wire and a substrate, having a pocket-shaped recess | |
JP4526957B2 (en) | Semiconductor device, bonding method and bonding ribbon | |
JP4274885B2 (en) | Ultrasonic bonding apparatus and ultrasonic bonding method | |
KR101682067B1 (en) | Semiconductor package with heat slug and leadframe bonded using ultrasonic welding | |
US10391584B2 (en) | Ultrasonic bonding jig, ultrasonic bonding method, and bonding structure | |
CN102763207B (en) | For the support system of semiconductor device | |
CN113770501B (en) | Wedge-shaped cleaver structure for improving bonding density of lead | |
JP2001024027A (en) | Semiconductor element, manufacture thereof, semiconductor device and manufacture | |
JP2015139780A (en) | Resonator and manufacturing method of resonator | |
JP2016029745A (en) | Bonding capillary | |
JP2010153499A (en) | Wire bonding machine | |
JP4408425B2 (en) | Band saw and method of manufacturing band saw | |
CN220612629U (en) | Welding chopper for bonding | |
JP2014116334A (en) | Wedge bonding tool and wedge bonding method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ORTHODYNE ELECTRONICS CORPORATION, CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:DELSMAN, MARK A.;COPPERTHITE, THEODORE J.;JONES, GARRETT W.;AND OTHERS;SIGNING DATES FROM 20110722 TO 20110727;REEL/FRAME:026692/0627 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |