CN113770501B - Wedge-shaped cleaver structure for improving bonding density of lead - Google Patents
Wedge-shaped cleaver structure for improving bonding density of lead Download PDFInfo
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- CN113770501B CN113770501B CN202110847959.9A CN202110847959A CN113770501B CN 113770501 B CN113770501 B CN 113770501B CN 202110847959 A CN202110847959 A CN 202110847959A CN 113770501 B CN113770501 B CN 113770501B
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- lead
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78314—Shape
- H01L2224/78315—Shape of the pressing surface, e.g. tip or head
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The invention relates to the technical field of microelectronic packaging, and particularly discloses a wedge-shaped riving knife structure for improving the bonding density of a lead, which comprises a knife handle and a knife head connected with one end of the knife handle; the tool bit is provided with via hole structure, via hole structure is including setting up the lead wire via hole on the tool bit and setting up the V type structure on via hole structure bottom surface. The invention realizes high-density lead bonding with the line spacing smaller than half of the width of the tool bit of the riving knife, and the bonding density is obviously improved.
Description
Technical Field
The invention relates to the technical field of microelectronic packaging, in particular to a wedge-shaped riving knife structure for improving the bonding density of leads.
Background
In the field of microelectronic packaging, electrical interconnection between unpackaged integrated circuit chips and between chips and peripheral circuits is usually realized by wire bonding, and a wedge-shaped welding process has the characteristics of high welding density, small welding spot size, capability of realizing low-radian interconnection, capability of realizing deep cavity welding, small parasitic effect and the like, and is one of commonly used wire bonding methods. The wedge cleaver is an important tool in the wedge bonding process and directly determines the density of bonding wires and the quality of a bonded product.
In the chip lead interconnection process, in order to improve performance, a plurality of leads are generally used for interconnection. With the progress of chip processing technology, the bonding pad of a device is smaller and smaller, the density of bonding wires is required to be improved continuously, in order to adapt to the development of high density and miniaturization of the chip bonding pad, the width of the bonding surface of a cleaver is reduced at present, and the wire diameter of the thinner wire is selected to realize multi-wire bonding, but the development of wire thinning and bonding technology cannot keep up with the development of a chip, and meanwhile, the reduction of the wire diameter brings the risk of reliability reduction. On the premise of not changing the wire diameter of the lead, the conventional wedge-shaped cleaver is limited to structural interference of a lead through hole, when a first lead is bonded and a second lead is bonded, if the wire spacing is smaller than half of the width of a cleaver bit, the structure can interfere with the first lead, so that the first lead is collapsed and deformed, and further improvement of the bonding density is severely restricted.
Chinese patent CN107052557A discloses a welded ceramic chopper with a coating, which prevents the inner surface of the ceramic chopper from adhering to a bonding wire by adding a coating on the inner surface of the ceramic chopper;
chinese patent CN107275243A discloses a welded chopper and a method for making the same, wherein the middle part of the chopper is provided with a passage of a cylindrical groove and a conical groove to improve the ultrasonic transmission efficiency, and a groove is designed at the knife mouth part to avoid material residue;
chinese patent CN107710394A discloses a welding chopper, which realizes the purposes of improving bonding strength, improving filament truncation and inhibiting abrasion by the precise design of the end of the chopper;
chinese patent CN108389806A discloses a ceramic cleaver for improving bonding strength of a lead, and the bonding effect and the bonding stability are improved by the design of the surface structure of the cleaver;
chinese patent CN109332901A discloses a ceramic cleaver and a manufacturing method and application thereof, which improve the service life and welding effect of the cleaver by laser bombardment treatment.
The structure and the performance of the cleaver are improved, compared with the prior art, the service life and the welding effect of the cleaver are improved, but the improvement of the bonding density of the wedge-shaped welding cleaver is not involved.
In the prior art, as shown in fig. 3, bonding wires 20, wire vias a30, and wire via structures a40. In the bonding process, the bonding wire 20 penetrates into the riving knife through the wire via hole 30, the riving knife drives the bonding wire 20 to realize bonding, and when the bonding density reaches a certain degree, the certain degree described herein means that the wire pitch is smaller than the width of 1/2 of the via hole structure, and the wire via hole structure A40 extrudes the bonded wire to cause the bonded wire to deform.
Disclosure of Invention
The invention aims to solve the technical problem of providing a wedge-shaped riving knife structure for improving the bonding density of a lead, realizing high-density lead bonding with the line spacing smaller than half of the width of the knife head of the riving knife by changing a via hole structure, and obviously improving the bonding density.
The technical problem to be solved by the invention is as follows:
a wedge-shaped riving knife structure for improving the bonding density of a lead comprises a knife handle and a knife head connected with one end of the knife handle; the tool bit is provided with a via hole structure, and the via hole structure comprises a lead via hole arranged on the tool bit and a V-shaped structure arranged on the bottom surface of the via hole structure.
In some possible embodiments, the axis of the lead via is on the same plane as the center of the V-shaped structure.
In some possible embodiments, the V-shaped structure comprises a connecting surface connected with the cutter head, two inclined surfaces connected with the connecting surface and forming an apex angle a; the vertex angle A is positioned on one side of the connecting surface far away from the lead through hole, the angle of the vertex angle A is A, and the angle is more than 180 degrees and more than 30 degrees.
In some possible embodiments, the diameter of the wire via is 1.5-2 times the diameter of the wire.
In some possible embodiments, the diameter of the wire via is 1.5 times the diameter of the wire, and the angle of the apex angle a is 36.5 °.
In some possible embodiments, the distance between the vertex of the wire via hole close to one side of the V-shaped structure and the vertex of the vertex angle A of the V-shaped structure is 1.5 times of the diameter of the wire.
In some possible embodiments, the cutting head is wedge-shaped.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, by arranging the V-shaped structure, the horizontal clearance between the via hole structure and the bonded adjacent lead is effectively improved under the condition of the same bonding distance in the lead bonding process, so that the lead bonding density is improved;
the invention reduces the interference of the riving knife to the adjacent lead and avoids the deformation and collapse of the lead caused by the lead via hole structure of the riving knife in the bonding process.
The invention has simple structure and strong practicability.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic plan view of a lead via and a V-shaped structure according to the present invention;
FIG. 3 is a prior art wedge riving knife configuration;
wherein: 1. a lead; 2. a lead via; 3. a V-shaped structure; 31. a left bevel; 32. a right bevel; 33. a connection face; 20. bonding a lead; 30. a lead via A; 40. a lead via structure a; 100. the left side surface of the cutter head; 200. the right side of the cutter head.
Detailed Description
In the description of the present invention, it is to be understood that the terms indicating an orientation or positional relationship are based on the orientations and positional relationships shown in the drawings only for the convenience of describing the present invention and for simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship.
In the description of the embodiments of the present application, the meaning of "a plurality" means two or more unless otherwise specified. For example, the plurality of positioning posts refers to two or more positioning posts. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The present invention will be described in detail below.
As shown in fig. 1-2:
a wedge-shaped riving knife structure for improving the bonding density of a lead comprises a knife handle and a knife head connected with one end of the knife handle; the tool bit is provided with via hole structure, via hole structure is including setting up lead wire via hole 2 on the tool bit and setting up V type structure 3 on via hole structure bottom surface.
Preferably, the V-shaped structure 3 is formed integrally with the cutter head.
In some possible embodiments, the axis of the lead via 2 is on the same plane as the center of the V-shaped structure 3.
In some possible embodiments, as shown in fig. 2, the V-shaped structure includes a connecting surface 33 connected with the cutter head, and two inclined surfaces respectively connected with the connecting surface; one sides of the two inclined planes far away from the connecting surface are mutually connected to form a vertex angle A; the vertex angle A is positioned on one side of the connecting surface far away from the lead through hole, the angle of the vertex angle A is A, and the angle is more than 180 degrees and more than 30 degrees;
the two inclined surfaces include a left inclined surface 31 intersecting an extended surface of the head left side surface 100 and forming an acute angle B, and a right inclined surface 32 intersecting an extended surface of the head right side surface 200 and forming an acute angle C.
In some possible embodiments, the diameter of the lead via 2 is 1.5-2 times the diameter of the lead 1.
In some possible embodiments, the diameter of the lead via 2 is 1.5 times the diameter of the lead 1, and the angle of the vertex angle a is 36.5 °.
In some possible embodiments, the distance between the vertex of the side of the lead via 2 close to the V-shaped structure 3 and the vertex of the vertex angle a of the V-shaped structure 3 is D, the diameter of the lead 1 is D, and D =1.5D.
Preferably, as shown in fig. 2, the distance between the vertex of the lead via 2 close to the V-shaped structure 3 and the vertex of the vertex angle a of the V-shaped structure 3 is 1.5 times the diameter of the lead 1; the diameter of the lead wire through hole 2 is 1.5 times of the diameter of the lead wire 1, and the angle of the vertex angle A is 36.5 degrees; at which point the bond density is at a maximum.
In some possible embodiments, the cutting head is wedge-shaped.
In some possible embodiments, the lead vias 2 are circular in cross-section.
Through the improvement, on the premise that the line diameter of the lead 1 is not changed, the high-density lead 1 bonding with the line spacing smaller than half of the width of the cutter head of the riving knife can be realized by changing the riving knife via hole structure, and the bonding density is obviously improved.
The V-shaped structure 3 is arranged, so that in the process of bonding the multiple leads 1, when the bonding of the previous lead 1 is completed and the next lead 1 is bonded on the bonding pad at the adjacent position, the contact interference between the riving knife and the first lead 1 can be effectively reduced by the V-shaped structure 3 at the position of the riving knife lead through hole 2, and the bonding density of the leads 1 is improved.
The V-shaped structure 3 can reduce the interference of the riving knife on the adjacent lead wire 1 in the bonding process of the multiple lead wires 1, and avoid the deformation and collapse of the lead wire 1 caused by the riving knife lead wire via hole 2 structure in the bonding process. The invention can increase the density of the wedge bonding wires 1.
Example 1:
the V-shaped structure 3 can effectively reduce the extrusion of the via hole position to the first bonding lead 1 in the bonding process of the second lead 1 after the bonding of the first lead 1 is finished, thereby improving the bonding density of the lead 1. Compared with the wedge-shaped riving knife structure in the prior art, the invention ensures that the minimum width of the bonding pad of the single-bonding-pad double-wire welding is improved to 70 μm from 100 μm.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed.
Claims (5)
1. A wedge-shaped riving knife structure for improving the bonding density of a lead comprises a knife handle and a knife head connected with one end of the knife handle; the tool bit is provided with a via hole structure, and the via hole structure comprises a lead via hole arranged on the tool bit and a V-shaped structure arranged on the bottom surface of the via hole structure;
the V-shaped structure comprises a connecting surface connected with the cutter head and two inclined surfaces respectively connected with the connecting surface; one sides of the two inclined planes far away from the connecting surface are mutually connected to form a vertex angle A; the vertex angle A is positioned on one side of the connecting surface, which is far away from the lead through hole, the angle of the vertex angle A is A, wherein 180 degrees is more than A and more than 30 degrees;
the two inclined planes comprise a left inclined plane which is intersected with the extending plane of the left side surface of the cutter head and forms an acute angle B, and a right inclined plane which is intersected with the extending plane of the right side surface of the cutter head and forms an acute angle C.
2. The wedge-shaped riving knife structure for improving the bonding density of the leads as claimed in claim 1, wherein the diameter of the lead via is 1.5-2 times the diameter of the lead.
3. The wedge-shaped riving knife structure for improving the bonding density of the leads as claimed in claim 2, wherein the diameter of the wire through hole is 1.5 times the diameter of the lead, and the angle of the top angle A is 36.5 °.
4. The wedge-shaped riving knife structure for improving the wire bonding density of claim 2 or 3, wherein the distance between the vertex of the wire through hole close to one side of the V-shaped structure and the vertex of the vertex angle A of the V-shaped structure is 1.5 times of the diameter of the wire.
5. The wedge-shaped riving knife structure for improving wire bonding density of claim 4 wherein the cutting head is a wedge-shaped structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110847959.9A CN113770501B (en) | 2021-07-27 | 2021-07-27 | Wedge-shaped cleaver structure for improving bonding density of lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110847959.9A CN113770501B (en) | 2021-07-27 | 2021-07-27 | Wedge-shaped cleaver structure for improving bonding density of lead |
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| Publication Number | Publication Date |
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| CN113770501A CN113770501A (en) | 2021-12-10 |
| CN113770501B true CN113770501B (en) | 2022-12-27 |
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| CN202110847959.9A Active CN113770501B (en) | 2021-07-27 | 2021-07-27 | Wedge-shaped cleaver structure for improving bonding density of lead |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116000511B (en) * | 2022-12-26 | 2024-04-09 | 深圳市海志亿半导体工具有限公司 | Cutter head for enhancing fine-pitch wire feeding forming effect |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7451905B2 (en) * | 2004-06-22 | 2008-11-18 | Edwards Enterprises | Wire bonding wedge |
| CN107170691B (en) * | 2017-05-27 | 2019-07-16 | 中国电子科技集团公司第二十九研究所 | A kind of method for being superimposed on microbonding disk or carrying out automatic wedge bonding side by side |
| CN210296301U (en) * | 2019-09-18 | 2020-04-10 | 深圳市丰尔科技有限公司 | Riving knife for bonding |
| CN110783213B (en) * | 2019-10-15 | 2021-08-17 | 中国电子科技集团公司第二十九研究所 | Wedge-shaped cleaver for wire bonding and preparation method |
| CN210878199U (en) * | 2019-10-17 | 2020-06-30 | 成都精蓉创科技有限公司 | No-step straight-through type round hole wire guide hole deep cavity welding cleaver |
| CN112786470B (en) * | 2020-12-30 | 2024-10-18 | 中国有研科技集团有限公司 | Wedge-shaped riving knife for bonding strips and processing method thereof |
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