TWI717174B - LC composite parts - Google Patents

Abstract

The LC composite component 1 includes a magnetic substrate 21 having magnetism, a magnetic layer 22 having magnetism, inductors 11, 12, 17, capacitors 13-16, and cores 23 and 24 having magnetism. The magnetic substrate 21 has a first surface 21a and a second surface 21b opposite to the first surface. The magnetic layer 22 is arranged so as to face the first surface 21 a of the magnetic substrate 21. The inductors 11, 12, 17 and the capacitors 13 to 16 are arranged between the first surface 21 a of the magnetic substrate 21 and the magnetic layer 22. The cores 23 and 24 are arranged between the first surface 21 a of the magnetic substrate 21 and the magnetic layer 22 and connected to the magnetic layer 22. In the direction perpendicular to the first surface 21a of the magnetic substrate 21, the thickness of the cores 23, 24 is more than 1.0 times the thickness of the magnetic layer 22, and in the direction perpendicular to the first surface of the magnetic substrate, the thickness of the magnetic substrate It is 1.0 times or more the thickness of the magnetic layer, and the magnetic substrate 21, the magnetic layer 22, and the cores 23 and 24 include magnetic metal particles and resin.

Description

LC composite parts

The present invention relates to an LC composite part.

In recent years, electronic components used in wireless communication devices such as mobile phones and wireless LAN communication devices have been required to be further reduced in size and performance. In Patent Document 1, an LC composite part is disclosed. The LC composite part includes an inductor, a capacitor, a magnetic layer, and a substrate, and the substrate, the magnetic layer, and the inductor are arranged in a specific positional relationship, and the substrate has a predetermined The thickness and complex permeability. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2016-006847

[The problem to be solved by the invention]

However, the LC composite component disclosed in Patent Document 1 has room for further improvement in the insertion loss characteristics of the LC composite component.

Therefore, the object of the present invention is to provide an LC composite component with further improved insertion loss characteristics. [Technical means to solve the problem]

One aspect of the present invention relates to an LC composite part, which has: a magnetic substrate with magnetism, a magnetic layer with magnetism, more than one capacitor, more than one inductor, and more than one core with magnetism Section; The magnetic substrate has a first surface and a second surface opposite to the first surface, the magnetic layer is arranged to face the first surface of the magnetic substrate, the one or more inductors and the One or more capacitors are arranged between the first surface of the magnetic substrate and the magnetic layer, and the core portion is arranged between the first surface of the magnetic substrate and the magnetic layer, and is connected to the magnetic layer. In the direction perpendicular to the first surface of the magnetic substrate, the thickness of the core is 1.0 times or more the thickness of the magnetic layer, and in the direction perpendicular to the first surface of the magnetic substrate, the thickness of the magnetic substrate is the thickness of the magnetic layer 1.0 times or more, the magnetic substrate, the magnetic layer, and the core include magnetic metal particles and resin.

In one aspect, in the direction perpendicular to the first surface of the magnetic substrate, the thickness of the magnetic substrate may be 3.0 times or less the thickness of the magnetic layer.

In one aspect, the average major axis diameter of the magnetic metal particles may be 120 nm or less.

In one aspect, the average aspect ratio of the magnetic metal particles may be 1.2-6.

In one aspect, the magnetic saturation of the magnetic substrate, the magnetic layer and the core may be above 90 emu/g.

In one aspect, the CV value of the aspect ratio of the magnetic metal particles may be 0.4 or less.

In one aspect, the magnetic metal particles may include at least one selected from the group consisting of Fe, Co, and Ni as a main component. [Effects of Invention]

According to the present invention, an LC composite component with further improved insertion loss characteristics is provided.

Hereinafter, preferred embodiments of the present invention will be described. However, the present invention is not limited to the following embodiments.

(LC composite parts) 1 and 2, the LC composite component of the present embodiment of the present invention will be described. Fig. 1 is a perspective view showing the structure of the LC composite part 1 of this embodiment. Fig. 2 is a cross-sectional view showing the structure of the LC composite part of this embodiment.

The LC composite component 1 includes: a magnetic substrate 21 with magnetism; a magnetic layer 22 with magnetism; inductors 11, 12, and 17; capacitors 13-16; cores 23 and 24 with magnetism; and a dielectric laminate 37.

As shown in Figs. 1 and 2, the magnetic substrate 21 is a flat plate having a first surface 21a and a second surface 21b opposite to the first surface. The thickness of the magnetic substrate 21 in the direction perpendicular to the first surface 21a is not particularly limited, but, for example, in order to make the shape of the obtained LC composite part practical and easy to produce, it can be 30 to 200 μm, preferably 40 to 100 μm . The material of the magnetic substrate 21 will be described later.

The magnetic layer 22 is a flat plate having a first surface 22 a and a second surface 22 b, and is arranged such that the second surface 22 b faces the first surface 21 a of the magnetic substrate 21. Furthermore, in this specification, the so-called magnetic refers to ferromagnetism or ferrimagnetism. The material of the magnetic layer 22 will be described later.

The dielectric laminate 37 is arranged between the first surface 21a of the magnetic substrate 21 and the magnetic layer 22 (second surface 22b). The dielectric laminate 37 has a plurality of dielectric layers 31 to 36 laminated as shown in FIG. 2. Each of the dielectric layers 31 to 36 includes a dielectric material. Examples of dielectric materials are resins and ceramics. Examples of resins are polyimide resin, benzocyclobutene resin, bismaleimide triazine resin (BT resin), epoxy resin and acrylic resin, and examples of ceramics are silicon nitride and alumina.

The LC composite part 1 presents a rectangular parallelepiped shape, and has an upper surface 1t, a bottom surface 1b, and four side surfaces 1s. In this embodiment, the upper surface 1 t of the LC composite part 1 includes the second surface 21 b of the magnetic substrate 21. In addition, the bottom surface 1b of the LC composite part 1 includes the first surface 22a of the magnetic layer 22. The LC composite component 1 is mounted on the mounting substrate such that, for example, the bottom surface 1b of the LC composite component 1, that is, the first surface 22a of the magnetic layer 22, and the upper surface of the mounting substrate face each other.

The inductors 11, 12, 17, the capacitors 13 to 16, and the cores 23, 24 are arranged between the first surface 21 a of the magnetic substrate 21 and the second surface 22 b of the magnetic layer 22, that is, in the dielectric laminate 37. In this embodiment, the capacitors 13 to 16 are arranged at positions where they do not overlap with the other inductors 11, 12, and 17 when viewed from a direction perpendicular to the first surface 21a. Examples of materials for conductors for inductors and capacitors are Cu, Al, and Ag. The details of inductors and capacitors are described later.

The cores 23 and 24 each have a column shape and are respectively arranged on the shafts of the coil structures of the inductors 11 and 12. The cores 23 and 24 are connected to the magnetic layer 22. In this specification, "the cores 23, 24 are connected to the magnetic layer 22" means that the cores 23, 24 are directly connected (in contact) with the magnetic layer 22, and the cores 23, 24 and the magnetic layer 22 are not Direct connection (contact), but for example, a form of magnetic connection via a non-magnetic (dielectric, etc.) layer with a thickness of about 0.1-10 μm. In FIG. 2, the cores 23 and 24 are in contact with the magnetic layer 22. The material of the core is described later. It is preferable that the cores 23 and 24 do not directly contact the magnetic substrate 21. That is, as shown in FIG. 2, it is preferable to provide a non-magnetic (dielectric, etc.) layer with a thickness of about 0.1-10 μm between the cores 23, 24 and the magnetic substrate 21, but the cores 23, 24 are also It can directly contact the magnetic substrate 21.

As shown in FIG. 2, when the thickness of the cores 23 and 24 in the direction perpendicular to the first surface 21a of the magnetic substrate 21 is set as T1, the magnetic layer in the direction perpendicular to the first surface 21a of the magnetic substrate 21 When the thickness of 22 is set to T2, the thickness T1 of the cores 23 and 24 is 1.0 times or more of the thickness T2 of the magnetic layer 22, preferably 1.2 times or more, more preferably 2.0 times or more, and more preferably 3.0 times or more. The thickness T1 of the cores 23 and 24 may also be less than 10 times the thickness T2 of the magnetic layer 22. Thereby, the insertion loss of the LC composite component that does not reach the cut-off frequency can be reduced, and the insertion loss beyond the cut-off frequency can be increased. As the reason, it can be considered that the loss in the inductor is reduced by suppressing the loss of the inductor core and increasing the inductance of the inductor.

From the same point of view, as shown in FIG. 2, when the thickness of the magnetic substrate 21 in the direction perpendicular to the first surface 21a of the magnetic substrate 21 is set to T3, the thickness T3 of the magnetic substrate 21 is the thickness T2 of the magnetic layer 22 1.0 times or more, preferably 1.1 times or more, more preferably 1.2 times or more. The thickness T3 of the magnetic substrate 21 may be 3.0 times or less of the thickness T2 of the magnetic layer 22, preferably 2.0 times or less.

The thickness of the cores 23 and 24 is not particularly limited, but for example, in order to make the shape of the obtained LC composite part practical and easy to manufacture, it can be 30-200 μm, preferably 100-150 μm. Furthermore, the thickness of the cores 23 and 24 is preferably set to be greater than the axial length of the coil structure of the inductors 11 and 12.

Since the inductors 11 and 12 of the LC composite part 1 are equipped with cores 23 and 24, respectively, the inductors 11 and 12 of the LC composite part 1 do not have the cores 23 and 24, and the inductors can be enlarged. The inductance.

(Material of magnetic substrate, magnetic layer and core) The magnetic substrate 21, the magnetic layer 22, and the cores 23 and 24 include resin and magnetic metal particles having magnetism.

In this embodiment, there is no particular limitation on the particle size of the magnetic metal particles. The average major axis diameter of the magnetic metal particles is preferably 120 nm or less.

By satisfying this situation, it is easy to suppress the insertion loss of LC composite parts that do not reach the cutoff frequency, and it is easy to increase the insertion loss beyond the cutoff frequency. As the reason, one of the reasons can be considered to be, for example, that the filling of the magnetic metal particles in the magnetic layer 22 and the core 23 and the core 24 is improved, and the inductance of the inductor can be increased due to the higher magnetic permeability. At the same time, it can suppress the eddy current in the core 23 and 24 of the inductor.

From the same viewpoint, the average major axis diameter of the magnetic metal particles is more preferably 100 nm or less, and still more preferably 80 nm or less. In this embodiment, the average major axis diameter of the magnetic metal particles may be 30 nm or more. From the same viewpoint, the average major axis diameter of the magnetic metal particles is preferably 40 nm or more. In addition, the average minor axis diameter of the magnetic metal particles 4 is, for example, about 5 to 50 nm, and may be 7 to 30 nm.

The average aspect ratio of the magnetic metal particles is preferably 1.2-6. In this embodiment, the average aspect ratio is the average value of the ratio (aspect ratio) of the major axis diameter to the minor axis diameter of the magnetic metal particles. When the average aspect ratio is less than 1.2, the shape anisotropy becomes too small, and the natural resonance frequency becomes quite small, which helps increase the loss in the inductor core caused by natural resonance. In addition, when the aspect ratio exceeds 6, there is a possibility that the shape anisotropy becomes too large and the filling property is deteriorated, resulting in a decrease in density, which also contributes to a decrease in magnetic permeability, making it difficult to increase the inductance of the inductor.

From the same viewpoint, the average aspect ratio of the magnetic metal particles is preferably 1.3 or more and 4 or less, and more preferably 1.5 or more and 3 or less. Furthermore, the aspect ratio is preferably 2 or more.

In this embodiment, the CV value of the aspect ratio of the magnetic metal particles may be 0.4 or less. CV represents the coefficient of variation, which can be obtained from the following formula. Coefficient of Variation (CV) = standard deviation value/average value

Since the CV value of the aspect ratio of the magnetic metal particles is 0.4 or less, the unevenness of the demagnetization factor can be suppressed. Since the natural resonance frequency is proportional to the difference (short axis-long axis) of the demagnetization factor, as a result, the unevenness of the natural resonance frequency can be suppressed, and the line width of the natural resonance peak can be narrowed. Therefore, while reducing the loss in the inductor core caused by natural resonance, while increasing the inductance of the inductor, the insertion loss can be reduced when the cut-off frequency of the LC composite part is not reached, and the insertion loss beyond the cut-off frequency can be increased. From the same viewpoint, the CV value of the aspect ratio of the magnetic metal particles is preferably 0.3 or less. The CV value of the aspect ratio of the magnetic metal particles can be 0.10 or more.

The magnetic metal particles preferably include at least one selected from the group consisting of Fe, Co, and Ni as a main component, and more preferably include at least one selected from the group consisting of Fe and Co as a main component. In this specification, the so-called main component refers to a component that occupies more than 50% by mass. Since the magnetic metal particles contain at least one selected from the group consisting of Fe, Co, and Ni, which have high magnetic saturation, as a main component, the magnetic substrate 21, the magnetic layer 22, and the cores 23 and 24 can have high The permeability. The magnetic metal particles preferably include Fe, Fe, and Co or Fe and Ni as main components, more preferably include Fe or Fe and Co as main components, and particularly preferably include Fe and Co as main components. Since the magnetic metal particles contain Fe, Fe, and Co or Fe and Ni, which have high magnetic saturation, as main components, the magnetic substrate 21, the magnetic layer 22, and the cores 23 and 24 can have high magnetic permeability. The magnetic substrate 21, the magnetic layer 22, and the cores 23 and 24 may include mutually different magnetic metal particles, or may include the same magnetic metal particle. The so-called main component refers to the component that occupies more than 50% by mass. With such a composition, the natural resonance frequency can also be increased.

The magnetic metal particles may include a metal center and a metal oxide film covering the metal center. The metal center has conductivity, but the oxide metal film has insulation. Since the magnetic metal particles have a metal oxide film, the insulation between the magnetic metal particles can be obtained, and the magnetic loss caused by the eddy current between the particles can be reduced.

In the magnetic metal particles, the metal center contains the above-mentioned elements contained in the magnetic metal particles as a metal (zero valence). Since the center of the metal is covered with an oxide metal film, it can exist without being oxidized even in the atmosphere. The metal center is preferably Fe, Fe-Ni alloy or Fe-Co alloy, more preferably Fe or Fe-Co alloy, and still more preferably Fe-Co alloy. When the metal center is Fe, Fe-Ni alloy, or Fe-Co alloy, the magnetic metal particles have higher magnetic permeability due to the increase in magnetic saturation. For magnetic metal particles, the metal oxide film contains elements contained in the magnetic metal particles as oxides.

In this embodiment, the volume ratio of the magnetic metal particles in the magnetic substrate 21, the magnetic layer 22, and the cores 23 and 24 can be, for example, 30-60% by volume, and preferably 40-50% by volume. When the volume ratio of the magnetic metal particles is more than 30% by volume, it is easy to obtain desired magnetic properties in the magnetic substrate 21, the magnetic layer 22, and the cores 23 and 24. When the proportion of the magnetic metal particles is 60% by volume or less, the handling during processing becomes easy. Furthermore, in this specification, the volume ratio of the magnetic substrate 21, the magnetic layer 22, and the cores 23 and 24 is the ratio of the magnetic substrate 21, the magnetic layer 22, and the cores 23 and 24 excluding the voids.

The resin is an electrically insulating resin (insulating resin), and is stored between the magnetic metal particles in the magnetic substrate 21, the magnetic layer 22, and the cores 23 and 24. The magnetic substrate 21, the magnetic layer 22, and the core The parts 23 and 24 are combined to improve the insulation between the magnetic metal particles. Examples of insulating resins include silicone resins, phenol resins, acrylic resins, epoxy resins, and cured products thereof. These may be used individually by 1 type, and may be used in combination of 2 or more types. In addition, surface treatment agents such as coupling agents and dispersants, additives such as heat stabilizers and plasticizers may also be used as needed.

In this embodiment, the volume ratio of the resin in the magnetic substrate 21, the magnetic layer 22, and the cores 23 and 24 may be, for example, 40 to 70% by volume, and preferably 50 to 60% by volume. When the volume ratio of the resin is more than 40% by volume, it becomes easy to obtain insulation and bonding force between the magnetic metal particles. When the volume ratio of the resin is 70% by volume or less, even in the magnetic substrate 21, the magnetic layer 22, and the cores 23 and 24, the characteristics of the magnetic metal particles are easily developed.

The magnetic saturation of the magnetic substrate 21, the magnetic layer 22, and the cores 23 and 24 is not particularly limited, but may be 90 emu/g or more, for example. The magnetic permeability of the magnetic substrate 21, the magnetic layer 22, and the cores 23 and 24 can be improved by the magnetic saturation of 90 emu/g or more. In addition, the natural resonance frequency can be increased. From the same viewpoint, the magnetic saturation is preferably 100 emu/g or more, more preferably 120 emu/g or more. The magnetic saturation can also be less than 200 emu/g.

3A to 3C and 4A to 4C, the detailed configuration of the dielectric laminate 37, the capacitors 13 to 16, and the inductors 11, 12, and 17 will be described. In this embodiment, the dielectric laminate 37 of the LC composite component 1 includes six dielectric layers 31, 32, 33, 34, 35, and 36. The dielectric layers 31 to 36 are arranged between the magnetic substrate 21 and the magnetic layer 22 and are arranged in this order from the side of the first surface 21 a of the magnetic substrate 21. The dielectric layers 31 to 36 each have a first surface facing the same direction as the first surface 21a of the magnetic substrate 21 and a second surface facing the same direction as the second surface 21b of the magnetic substrate 21. In addition, in FIGS. 3A to 3C and FIGS. 4A to 4C, the cores 23 and 24 are omitted.

FIG. 3A shows the first surface of the dielectric layer 31. On the first surface of the dielectric layer 31, a conductor portion 311 for the inductor 11, a conductor portion 312 for the inductor 12, a conductor portion 313 for the capacitors 13 and 14, a conductor portion 315 for the capacitor 15 and a capacitor are formed The conductor portion 316 for 16 and the conductor portions 31T1, 31T2, 31T3, and 31T4 for terminals. In addition, FIG. 3A is shown in a state where the plurality of conductor parts are viewed from the second surface side of the dielectric layer 31. The arrangement in FIG. 3A of the above-mentioned plural conductor parts is as follows. The conductor portion 311 for the inductor 11 is arranged in an area on the left side of the center in the left-right direction. The conductor portion 312 for the inductor 12 is arranged in an area on the right side of the center in the left-right direction. The conductor part 316 for the capacitor 16 is arranged between the conductor part 311 for the inductor 11 and the conductor part 312 for the inductor 12. The conductor portions 313 for the capacitors 13 and 14 are arranged below the conductor portion 311 for the inductor 11, the conductor portion 312 for the inductor 12, and the conductor portion 316 for the capacitor 16. The conductor portion 315 for the capacitor 15 is arranged at a position below the conductor portion 313 for the capacitors 13 and 14. The terminal conductor portion 31T1 is arranged near the lower left corner. The terminal conductor part 31T2 is arranged near the lower right corner part. The terminal conductor portion 31T3 is arranged near the upper left corner. The terminal conductor portion 31T4 is arranged near the upper right corner.

The conductor portion 313 for the capacitors 13 and 14 is connected to one end of the conductor portion 311 for the inductor 11, the conductor portion 312 for the inductor 12, and the conductor portion 316 for the capacitor 16. In Fig. 3A, the boundary between the two conductor parts is indicated by a broken line. Also used in the following description, the same figure as FIG. 3A is shown in the same way as FIG. 3A. The conductor portion 311 for the inductor 11 and the conductor portion 312 for the inductor 12 are both linear conductor portions extending annularly from one end to the other end.

FIG. 3B shows the first side of the dielectric layer 32. On the first surface of the dielectric layer 32, a conductor portion 323 for the capacitor 13, a conductor portion 324 for the capacitor 14, conductor portions 325A and 325B for the capacitor 15, and a conductor portion 326 for the capacitor 16 are formed. In addition, FIG. 3B is shown in a state where the plurality of conductor portions are viewed from the second surface side of the dielectric layer 32. The arrangement in Fig. 3B of the above-mentioned plural conductor parts is as follows. That is, the conductor 326 for the capacitor 16 is arranged at a substantially center position in the left-right direction. The conductor part 323 for the capacitor 13 and the conductor part 324 for the capacitor 14 are arranged in this order from the left side at a position below the conductor part 326 for the capacitor 16. The conductor portions 325A and 325B for the capacitor 15 are arranged at positions below the conductor portion 323 for the capacitor 13 and the conductor portion 324 for the capacitor 14 in this order from the left.

The conductor portion 323 for the capacitor 13 and the conductor portion 324 for the capacitor 14 intersect the dielectric layer 32 and oppose the conductor portions 313 for the capacitors 13 and 14 shown in FIG. 3A. The capacitor 13 in FIG. 5 includes a conductor portion 313 for the capacitors 13, 14 and a conductor portion 323 for the capacitor 13, and a part of the dielectric layer 32 between them. The capacitor 14 in FIG. 5 includes a conductor portion 313 for the capacitors 13, 14 and a conductor portion 324 for the capacitor 14, and a part of the dielectric layer 32 between them. In addition, the conductor portions 325A and 325B for the capacitor 15 intervene the dielectric layer 32 and oppose the conductor portion 315 for the capacitor 15 shown in FIG. 3A. The capacitor 15 in FIG. 5 includes conductor portions 315, 325A, and 325B for the capacitor 15 and a part of the dielectric layer 32 between them. In addition, the conductor portion 326 for the capacitor 16 intervenes the dielectric layer 32 and is opposed to the conductor portion 316 for the capacitor 16 shown in FIG. 3A. The capacitor 16 in FIG. 5 includes the conductor portions 316 and 326 for the capacitor 16 and a part of the dielectric layer 32 between them.

The LC composite component 1 includes conductor portions 33V1, 33V2, 33V3, 33V4, 33V5, and 33V6 that penetrate the dielectric layers 32 and 33. In FIG. 3B, the conductor parts 33V1 to 33V6 are hatched. One end of the conductor portions 33V1 to 33V6 are respectively connected to the conductor portions 31T1 to 31T4 for terminals, the conductor portion 311 for the inductor 11 and the conductor portion 312 for the inductor 12 shown in FIG. 3A.

FIG. 3C shows the first side of the dielectric layer 33. On the first surface of the dielectric layer 33, a conductor portion 331 for the inductor 11, a conductor portion 332 for the inductor 12, a conductor portion 337 for the inductor 17, and conductor portions 333, 334, 335A, and 335B for connection are formed And 336, and terminal conductor portions 33T1, 33T2, 33T3, and 33T4. FIG. 3C shows a state where the plurality of conductor portions are viewed from the second surface side of the dielectric layer 33. FIG. The arrangement of the plurality of conductor parts in FIG. 3C is as follows. The conductor 331 for the inductor 11 is arranged in an area on the left side of the center in the left-right direction. The connecting conductor portion 336 is arranged between the conductor portion 331 for the inductor 11 and the conductor portion 332 for the inductor 12. The connecting conductor portions 333 and 334 are arranged at positions below the conductor portion 331 for the inductor 11, the conductor portion 332 for the inductor 12, and the connecting conductor portion 336 in this order from the left. The connection conductor parts 335A and 335B are arranged in this order from the left at positions below the connection conductor parts 333 and 334. The conductor part 337 for the inductor 17 is arranged above the conductor part 331 for the inductor 11, the conductor part 332 for the inductor 12, and the conductor part 336 for connection. The terminal conductor 33T1 is arranged near the lower left corner. The terminal conductor 33T2 is arranged near the lower right corner. The terminal conductor part 33T3 is arranged near the movable part on the upper left. The terminal conductor 33T4 is arranged near the upper right corner.

The terminal conductor portion 33T1 is connected to each end of the connection conductor portions 333 and 335A. The terminal conductor part 33T2 is connected to each end of the connection conductor parts 334 and 335B. The conductor portion 337 for the inductor 17 is connected to one end of the connecting conductor portion 336. The conductor portion 331 for the inductor 11 and the conductor portion 332 for the inductor 12 are both linear conductor portions extending annularly from one end to multiple ends.

The conductor portion 331 for the inductor 11, the conductor portion 332 for the inductor 12, and the terminal conductor portions 33T1 to 33T4 are respectively arranged in a direction perpendicular to the first surface 21a of the magnetic substrate 21 (and perpendicular to the dielectric layer 33). The direction of the first surface is the same.) When viewed, it overlaps with the conductor portion 311 for the inductor 11, the conductor portion 312 for the inductor 12, and the conductor portions 31T1 to 31T4 for terminals shown in FIG. 3A. The connecting conductor portions 333, 334, 335A, 335B, and 336 are respectively arranged in the same way as the conductor portion 323 for the capacitor 13 and the capacitor 14 shown in FIG. 3B when viewed from a direction perpendicular to the first surface 21a of the magnetic substrate 21 The position where the conductor part 324, the conductor parts 325A and 325B for the capacitor 15 and the conductor part 326 for the capacitor 16 overlap.

The LC composite component 1 includes conductor portions 33V7, 33V8, 33V9, 33V10, and 33V11 that penetrate the dielectric layer 33. In FIG. 3C, the conductor portions 33V1 to 33V11 are represented by two-dot chain lines. The other ends of the conductor portions 33V1 to 33V6 are connected to the terminal conductor portions 33T1 to 33T4, the conductor portion 331 for the inductor 11, and the conductor portion 332 for the inductor 11, respectively. In the conductor part 323 for the capacitor 13, the conductor part 324 for the capacitor 14, the conductor parts 325A and 325B for the capacitor 15 and the conductor part 326 for the capacitor 16 shown in FIG. 3B, one end of the conductor part 33V7 to 33V11 is respectively connected . The other ends of the conductor parts 33V7 to 33V11 are connected to the connection conductor parts 333, 334, 335A, 335B, and 336, respectively.

FIG. 4A shows the first side of the dielectric layer 34. On the first surface of the dielectric layer 34, there are formed a conductor portion 341 for the inductor 11, a conductor portion 342 for the inductor 12, and a conductor portion 347 for the inductor 17, and conductor portions 34T1, 34T2, 34T3 and 34T4. FIG. 4A shows a state where the plurality of conductor portions are viewed from the second surface side of the dielectric layer 34. FIG. The arrangement of the plurality of conductor parts in FIGS. 4A to 4C is as follows. The conductor portion 341 for the inductor 11 is arranged in an area further to the left than the center in the left-right direction. The conductor portion 342 for the inductor 12 is arranged in an area on the right side of the center in the left-right direction. The conductor portion 347 for the inductor 17 is arranged at a position above the conductor portion 341 for the inductor 11 and the conductor portion 342 for the inductor 12. The terminal conductor portion 34T1 is arranged near the lower left corner. The terminal conductor 34T2 is arranged near the lower right corner. The terminal conductor part 34T3 is arranged near the upper left corner part. The terminal conductor part 34T4 is arranged near the upper right corner part.

The conductor portion 341 for the inductor 11 and the conductor portion 342 for the inductor 12 are both linear conductor portions extending annularly from one end to the other end. The conductor portion 341 for the inductor 11, the conductor portion 342 for the inductor 12, the conductor portion 347 for the inductor 17, and the terminal conductor portions 34T1 to 34T4 are arranged from perpendicular to the first surface 21a of the magnetic substrate 21. When viewed in the direction (the same as the direction perpendicular to the first surface of the dielectric layer 34), the conductor part 331 for the inductor 11, the conductor part 332 for the inductor 12, and the conductor for the inductor 17 shown in FIG. 3C The position where the portion 337 and the terminal conductor portions 33T1 to 33T4 overlap.

The LC composite component 1 includes conductor portions 34V1, 34V2, 34V3, 34V4, 34V5, 34V6, and 34V7 that penetrate the dielectric layer 34. In FIG. 4A, the conductor portions 34V1 to 34V7 are represented by two-dot chain lines. In the terminal conductor portions 33T1 to 33T4 shown in FIG. 3C, the conductor portion 331 for the inductor 11, the conductor portion 332 for the inductor 12, and the conductor portion 337 for the inductor 17 are respectively connected to the conductor portions 34V1 to 34V7 One end. The other ends of the conductor portions 34V1 to 34V7 are connected to the terminal conductor portions 34T1 to 34T4, the conductor portion 341 for the inductor 11, the conductor portion 342 for the inductor 12, and the conductor portion 347 for the inductor 17, respectively.

FIG. 4B shows the first side of the dielectric layer 35. On the first surface of the dielectric layer 35, a conductor portion 351 for the inductor 11, a conductor portion 352 for the inductor 12, conductor portions 357A and 357B for the inductor 17, and conductor portions 35T1, 35T2 for terminals are formed 35T3 and 35T4. In addition, FIG. 4B shows a state where the plurality of conductor parts are viewed from the second surface side of the dielectric layer 35. The arrangement in Fig. 4B of the above-mentioned plural conductor parts is as follows. The conductor portion 351 for the inductor 11 is arranged in an area further to the left than the center in the left-right direction. The conductor portion 352 for the inductor 12 is arranged in an area on the right side of the center in the left-right direction. The conductor portions 357A and 357B for the inductor 17 are arranged in this order from the left side at positions above the conductor portion 351 for the inductor 11 and the conductor portion 352 for the inductor 12. The terminal conductor 35T1 is arranged near the lower left corner. The terminal conductor 35T2 is arranged near the lower right corner. The terminal conductor 35T3 is arranged near the upper left corner. The terminal conductor 35T4 is arranged near the upper right corner.

The terminal conductor portions 35T1 to 35T4 are respectively connected to one end of the conductor portion 351 for the inductor 11, the conductor portion 352 for the inductor 12, and the conductor portions 357A and 357B for the inductor 17. The conductor portion 351 for the inductor 11 and the conductor portion 352 for the inductor 12 are both linear conductor portions extending annularly from one end to the other end.

The conductor portion 351 for the inductor 11, the conductor portion 352 for the inductor 12, and the terminal conductor portions 35T1 to 35T4 are respectively arranged in a direction perpendicular to the first surface 21a of the magnetic substrate 21 (and perpendicular to the dielectric layer 35 The direction of the first surface is the same.) When viewed, it overlaps with the conductor portion 341 for the inductor 11, the conductor portion 342 for the inductor 12, and the terminal conductor portions 34T1 to 34T4 shown in FIG. 4A. The conductor portions 357A and 357B for the inductor 17 are arranged at positions overlapping the conductor portion 347 for the inductor 17 shown in FIG. 4A when viewed from a direction perpendicular to the first surface 21a of the magnetic substrate 21.

The LC composite component 1 includes conductor parts 35V1, 35V2, 35V3, 35V4, 35V5, 35V6, 35V7, and 35V8 penetrating the dielectric layer 35. In FIG. 4B, the conductor portions 35V1 to 35V8 are represented by two-dot chain lines. The conductor portions 34T1 to 34T4 for terminals, the conductor portion 341 for inductor 11 and the conductor portion 342 for inductor 12 shown in FIG. 4A are respectively connected to one end of the conductor portions 35V1 to 35V6. The conductor portion 347 for the inductor 17 shown in FIG. 4A is connected to one end of each of the conductor portions 35V7 and 35V8. The other ends of the conductor portions 35V1 to 35V8 are connected to the conductor portions 35T1 to 35T4 for terminals and the conductor portions 351, 352, 357A, and 357B for inductors, respectively.

4C shows the magnetic layer 22 and the dielectric layer 36, and the terminal conductor portions 41, 42, 43, and 44 that penetrate the magnetic layer 22 and the dielectric layer 36. The LC composite component 1 includes conductor portions 41, 42, 43, and 44 for terminals that penetrate the magnetic layer 22 and the dielectric layer 36. In FIG. 4C, the conductor parts 41-44 for terminals are hatched. One end of the terminal conductor parts 41 to 44 is connected to the terminal conductor parts 35T1 to 35T4 shown in FIG. 4B, respectively.

Next, referring to the circuit diagram of FIG. 5, the circuit configuration of the LC composite component 1 of the present embodiment will be described. In this embodiment, the LC composite component 1 has the function of a low-pass filter. As shown in FIG. 5, the LC composite component 1 includes an input terminal 2 to which a signal is input, an output terminal 3 to output a signal, three inductors 11, 12, and 17, and four capacitors 13, 14, 15, and 16.

One end of the inductor 11, one end of the capacitor 13 and one end of the capacitor 15 are electrically connected to the input terminal 2. One end of the inductor 12, one end of the capacitor 14 and one end of the capacitor 16 are electrically connected to the other end of the inductor 11 and the other end of the capacitor 13. The other end of the inductor 12, the other end of the capacitor 14 and the other end of the capacitor 15 are electrically connected to the output terminal 3. One end of the inductor 17 is electrically connected to the other end of the capacitor 16. The other end of the inductor 17 is connected to ground.

Hereinafter, the relationship between the specific configuration of the LC composite component 1 shown in FIGS. 1, 2 and 3A to 3C and FIGS. 4A to 4C and the circuit configuration shown in FIG. 5 will be further described. The input terminal 2 in FIG. 5 includes the other end of the terminal conductor 41 in FIGS. 4A to 4C. The output terminal 3 in FIG. 5 includes the other end of the terminal conductor 42 in FIGS. 4A to 4C. The other ends of the conductor portions 43 and 44 for the terminals in FIGS. 4A to 4C constitute the ground terminal of the ground connection in FIG. 5.

The inductor 11 in FIG. 5 includes conductor parts 311, 331, 341, and 351, and conductor parts 33V5, 34V5, and 35V5 for the inductor 11 in FIGS. 3A to 3C and FIGS. 4A to 4C, and has a coil structure. As shown in Figure 2, the core 23 penetrates through the dielectric layers 32 to 36 and is located at the inner periphery of the coil structure formed by the conductor portions 311, 331, 341, and 351 and the conductor portions 33V5, 34V5, and 35V5 for the inductor 11 Inside. The conductor portions 311, 331, 341, and 351 of the inductor 11 are all linear conductor portions extending along the outer circumference of the core portion 23.

The inductor 12 in FIG. 5 includes conductor parts 312, 332, 342, and 352, and conductor parts 33V6, 34V6, and 35V6 for the inductor 12 in FIGS. 3A to 3C and FIGS. 4A to 4C, and has a coil structure. As shown in FIG. 2, the core 24 penetrates through the dielectric layers 32 to 36 and is located on the inner circumference of the coil structure formed by the conductor portions 312, 332, 342, and 352 for the inductor 12, and the conductor portions 33V6, 34V6, and 35V6 The inside of the department. The conductor portions 312, 332, 342, and 352 used for the inductor 12 are all linear conductor portions extending along the outer circumference of the core portion 24.

The inductor 17 in FIG. 5 includes conductor portions 337, 347, 357A, and 357B, and conductor portions 34V7, 35V7, and 35V8 for the inductor 17 in FIGS. 3A to 3C and 4A to 4C, and has a coil structure.

(Effect) According to the LC composite component of this embodiment, it is possible to reduce the insertion loss of low-frequency signals that do not reach the cut-off frequency and increase the insertion loss of high-frequency signals that exceed the cut-off frequency. Therefore, it has excellent characteristics as a low-pass filter. Especially suitable for low-pass filters with cut-off frequency of 1.1 to 1.6 GHz. The cut-off frequency can be defined as the -3 dB point. In addition to being used as a low-pass filter, this LC composite part can also be used as a high-pass filter and band-pass filter.

(An example of manufacturing method) Next, referring to FIG. 1, the method of manufacturing the LC composite component 1 of this embodiment will be described. In the LC composite component 1 of the present embodiment, a plurality of constituent elements of the LC composite component 1 other than the magnetic substrate 21 are formed on a wafer including a plurality of LC composite components 1 that becomes a part of the magnetic substrate 21. Thereby, the basic structure of the LC composite part 1 in which a plurality of rows of the part bodies 20 are arranged is produced. Then, the plurality of component bodies 20 are separated from each other by cutting the basic structure. In this way, a plurality of LC composite parts 1 are manufactured.

Hereinafter, referring to FIGS. 2, 3A to 3C and FIGS. 4A to 4C, focusing on one LC composite part 1, the method of manufacturing the LC composite part 1 of the present embodiment will be described in more detail. In addition, in the following description, for convenience, the part of the wafer that becomes the magnetic substrate 21 is referred to as the magnetic substrate 21. In the manufacturing method of this embodiment, first, a plurality of dielectric layers and a plurality of conductor portions are formed on the magnetic substrate 21 using a thin film forming technique. Specifically, first, the dielectric layer 31 is formed on the first surface 21 a of the magnetic substrate 21. Then, a plurality of conductor portions 31T1 to 31T4, 311 to 316 shown in FIG. 3A are formed on the dielectric layer 31. The method of forming a plurality of conductor parts can be a method of patterning the conductor layer by etching using a mask after forming an unpatterned conductor layer, or it can also be a method of using a mask to form a patterned conductor layer的方法。 The method. As a method of forming the conductor layer, various thin film forming methods such as sputtering and plating can be used. The method of forming other plural conductor parts described below is also the same.

Then, the dielectric layer 32 is formed on the dielectric layer 31 and the conductor portions 31T1 to 31T4 and 311 to 316 by, for example, sputtering. Then, on the dielectric layer 32, the conductor portions 323, 324, 325A, 325B, and 326 for capacitors shown in FIG. 3B are formed. Then, the dielectric layer 33 is formed. Then, 6 holes for the conductor portions 33V1 to 33V6 are formed in the dielectric layers 32 and 33, and 5 holes for the conductor portions 33V7 to 33V11 are formed in the dielectric layer 33. Then, a plurality of conductor portions 33V1 to 33V6, 331, 332, 337, 333, 334, 335A, 335B, 336, 33T1, 33T2, 33T3, and 33T4 shown in FIGS. 3B and 3C are formed.

Then, a dielectric layer 34 is formed on the dielectric layer 33 and the conductor portion. Then, 7 holes for the conductor portions 34V1 to 34V7 are formed in the dielectric layer 34. Then, a plurality of conductor portions 341, 342, 347, 34T1, 34T2, 34T3, and 34T4 shown in FIG. 4A are formed. Then, a dielectric layer 35 is formed on the dielectric layer 34. Then, 8 holes for the conductor portions 35V1 to 35V8 are formed in the dielectric layer 35. Then, a plurality of conductor portions 351, 352, 357A, 357B, 35T1, 35T2, 35T3, and 35T4 shown in FIG. 4B are formed. Then, a dielectric layer 36 is formed on the dielectric layer 35 and the conductor portion.

Then, four holes for the terminal conductor portions 41 to 44 are formed in the dielectric layer 36. Then, the conductor parts 41 to 44 for terminals shown in FIG. 4C are formed by, for example, a plating method.

Then, two holes for the cores 23 and 24 are formed in the dielectric layers 32 to 36. Then, by filling the above-mentioned two holes and covering the conductor portions 41 to 44 for the terminals, a backup magnetic layer that becomes the magnetic layer 22, the core portions 23, and 24 is formed. Then, the reserve magnetic layer is polished until the conductor portions 41 to 44 for terminals are exposed. Thereby, the part of the spare magnetic layer remaining in the two holes for the core parts 23 and 24 becomes the core parts 23 and 24, and the remaining part becomes the magnetic layer 22. The basic structure is completed by forming the magnetic layer 22 and the cores 23 and 24. Then, the basic structure is cut by cutting out a plurality of component bodies 20. Furthermore, in order to form the cores 23 and 24 and the magnetic layer (spare magnetic layer) 22, a curable composition containing the magnetic metal particles and resin described above may be applied and cured.

The present invention is not limited to the above-mentioned embodiment, and various changes can be adopted. For example, the number of capacitors, inductors, and cores in the LC composite part may be one or more. In addition, the shapes of capacitors, inductors, and cores can be appropriately changed according to the application. In addition, the arrangement of inductors and capacitors can also be changed arbitrarily. For example, when viewed from a direction perpendicular to the first surface 21a, the capacitor may overlap with other inductors.

Furthermore, when the thickness of the magnetic layer is not uniform, the average thickness may be used as the thickness of the magnetic layer. When the thickness of the core is not uniform, the average thickness can be used as the thickness of the core. When the LC composite part has a plurality of cores, the thickness of at least one core and the thickness of the magnetic layer may satisfy the above relationship.

In addition, the manufacturing method of the LC composite component 1 of this embodiment is not limited to the above-mentioned method. For example, at least the plurality of dielectric layers and the plurality of conductor portions between the magnetic substrate 21 and the magnetic layer 22 in the LC composite component 1 can be formed by, for example, a low-temperature co-firing method.

Hereinafter, the present invention will be described in more detail with examples, but the present invention is not limited to the following examples.

(Example 1) The curable resin composition used to form the magnetic substrate, the magnetic layer, and the core was adjusted by the method shown below. That is, an aqueous solution of ferrous sulfate and cobalt sulfate is prepared so that the mass ratio of Fe and Co in the magnetic metal particles becomes 7:3, and these parts are neutralized with an alkaline aqueous solution. Carry out bubbling and aeration in the neutralized aqueous solution, and stir the above aqueous solution to obtain Co-containing needle-shaped goethite particles. The Co-containing goethite particles obtained by filtering the aqueous solution are washed and dried with ion exchange water, and then heated in air to obtain Co-containing hematite particles.

The obtained Co-containing hematite particles were heated at a temperature of 550°C in a furnace in a hydrogen atmosphere. After that, the atmosphere in the furnace was switched to argon and cooled to about 200°C. Furthermore, by cooling to room temperature while increasing the oxygen partial pressure to 21% in 24 hours, magnetic metal particles having a metal core and a metal oxide film and containing Fe and Co as main components are obtained.

In the obtained magnetic metal particles, epoxy resin and hardener are added so that the volume ratio of the magnetic metal particles in the hardened resin composition reaches 40% by volume, and they are mixed at room temperature using a mixing roller, thereby , The resin composition is made into a slurry form to obtain a curable resin composition for magnetic substrate, magnetic layer and core formation. Then, a well-known thin film forming method is used to produce the LC composite part 1 shown in FIGS. 1 to 5. Here, the cured product of the above resin composition is used as the material of the magnetic substrate 21, the magnetic layer 22 and the cores 23, 24, Cu is used as the conductive material of the inductors 11, 12, 17 and the capacitors 13-16, and polyamide is used. Imine resin is used as the material of the dielectric layers 31 and 33 to 36, and silicon nitride is used as the material of the dielectric layer 32. The thickness of the core is 100 μm, the thickness of the magnetic layer is 50 μm, the thickness of the magnetic substrate is 60 μm, and the size of the LC composite part when viewed from the thickness direction is 650 μm×500 μm. Set the cut-off frequency of LC composite parts to 1.2 GHz.

(Examples 2-7) Except that the thickness of the core, the thickness of the magnetic layer, and the thickness of the magnetic substrate were changed as shown in Table 1, the LC composite parts of Examples 2 to 7 were produced in the same manner as in Example 1. Furthermore, Embodiments 2 and 6 correspond to reducing the thickness of the core, while maintaining the number of turns of the coil structure of the inductors 11 and 12, while shortening the conductor parts 33V5, 34V5 and 35V5 and the conductor parts 33V6, 34V6 and 35V6. Length, reduce the axial length of the coil structure. In addition, Embodiments 4 and 5 correspond to increasing the thickness of the core part, while maintaining the number of turns of the coil structure of the inductors 11 and 12, while increasing the conductor parts 33V5, 34V5 and 35V5 and the conductor parts 33V6, 34V6 and 35V6. Length, increase the axial length of the coil structure. In any embodiment, the thickness of the cores 23 and 24 is set to be greater than the axial length of the coil structure of the inductors 11 and 12.

(Example 8) In addition to the neutralization step, the neutralization rate of the alkaline aqueous solution is reduced, and the metal (Fe and Co) ion concentration after the neutralization is supplied in the oxidation step is reduced, and the average length of the magnetic metal particles is changed as shown in Table 1. Except for the shaft diameter, the aspect ratio value, and the CV value, in the same manner as in Example 1, the LC composite part of Example 8 was obtained.

(Example 9) In addition to the neutralization step, the neutralization rate of the alkaline aqueous solution is increased, the metal (Fe and Co) ion concentration after the neutralization is supplied in the oxidation step is increased, and the average length of the magnetic metal particles is changed as shown in Table 1. Except for the shaft diameter, the aspect ratio value, and the CV value, the LC composite part of Example 9 was obtained in the same manner as in Example 1.

(Example 10) In addition to the neutralization step, the neutralization rate of the alkaline aqueous solution is increased, the metal (Fe and Co) ion concentration after the neutralization is supplied in the oxidation step is increased, and the average length of the magnetic metal particles is changed as shown in Table 1. Except for the shaft diameter, the aspect ratio value, and the CV value, in the same manner as in Example 1, the LC composite part of Example 10 was obtained.

(Examples 11, 12) Except that the curable resin composition was prepared so that the volume ratio of the magnetic metal particles in the cured resin composition reached 30% by volume and 50% by volume, respectively, Example 11 was obtained in the same manner as in Example 1. , 12 LC composite parts.

(Example 13) Except that Co was not added in the manufacture of magnetic metal particles, and the curable resin composition was prepared so that the volume ratio of the magnetic metal particles in the cured resin composition reached 50% by volume, the same as in Example 1 In this way, the LC composite part of Example 13 was obtained.

(Example 14) Except that Ni was added to replace Co in the manufacture of magnetic metal particles, and the volume ratio of the magnetic metal particles in the hardened resin composition reached 50% by volume, the curable resin composition was prepared as in Example 1. In the same way, the LC composite part of Example 14 was obtained.

(Comparative example 1) The LC composite part of Comparative Example 1 was obtained in the same manner as in Example 1, except that the thickness of the core was set to 30 μm. Furthermore, in response to reducing the thickness of the core, while maintaining the number of turns of the coil structure of the inductors 11 and 12, reducing the length of the conductor portions 33V5, 34V5 and 35V5 and the conductor portions 33V6, 34V6 and 35V6, reducing the coil structure The length of the axis. That is, the thickness of the cores 23 and 24 is set to be greater than the axial length of the coil structure of the inductors 11 and 12.

[Evaluation method of magnetic metal particles] (Size and aspect ratio of magnetic metal) Observe the magnetic metal particles in the cross section of the magnetic layer of the LC composite parts obtained in each embodiment and comparative example with a transmission electron microscope (TEM) at a magnification of 500,000 times, and measure the size of the magnetic metal particles in the long axis and short axis directions (Major axis diameter and minor axis diameter) (nm), and find the aspect ratio. In the same way, 200 to 500 magnetic metal particles are observed, and the average value of the major axis diameter, minor axis diameter, and aspect ratio is calculated. The average value of the aspect ratio and the CV value of the magnetic metal particles, and the average value of the major axis diameter of the magnetic metal particles are shown in Table 1.

(Magnetic saturation) The cured product of the resin composition obtained in the Examples and Comparative Examples was processed into 1 mm×1 mm×3 mm, and the processed composite magnets were measured using a vibrating sample type magnetometer (VSM, manufactured by Tamagawa Seisakusho Co., Ltd.) The magnetic saturation (emu/g). The results are shown in Table 1.

(Maximum and minimum insertion loss of LC composite parts) A network analyzer (N5230A, Keysight Technologies) was used to obtain the frequency characteristics of the insertion loss in the LC composite parts obtained in each embodiment and comparative example. Then, find the maximum value of insertion loss in 0.824-0.960 GHz and the minimum value of insertion loss in 1.648-1.920 GHz. The results are shown in Table 1. In addition, characteristic diagrams showing the frequency characteristics of the insertion loss of Example 1, Example 5, and Comparative Example 1 are shown in FIGS. 6 to 8 respectively.

[Table 1] Metal particles Metal particle long axis diameter (nm) aspect ratio Aspect ratio CV value Volume ratio of metal particles in hardened substance (vol%) Magnetic saturation of hardened material (emu/g) Core thickness T1 (μm) Magnetic layer thickness T2 (μm) Magnetic substrate thickness T3 (μm) T1/T2 T3/T2 Maximum insertion loss (dB) Minimum insertion loss (dB) Example 1 Fe Co 49 2.3 0.26 40 121 100 50 60 2.0 1.2 0.40 36.0 Example 2 Fe Co 48 2.3 0.25 40 121 50 50 60 1.0 1.2 0.52 34.6 Example 3 Fe Co 50 2.4 0.25 40 121 100 83 100 1.2 1.2 0.47 35.1 Example 4 Fe Co 49 2.2 0.26 40 121 150 30 60 5.0 2.0 0.37 35.8 Example 5 Fe Co 47 2.5 0.27 40 121 150 50 60 3.0 1.2 0.36 36.2 Example 6 Fe Co 48 2.3 0.24 40 121 50 50 50 1.0 1.0 0.53 32.9 Example 7 Fe Co 49 2.4 0.28 40 121 100 50 150 2.0 3.0 0.51 33.0 Example 8 Fe Co 33 1.3 0.20 40 125 100 50 60 2.0 1.2 0.42 31.6 Example 9 Fe Co 119 5.8 0.36 40 114 100 50 60 2.0 1.2 0.44 32.4 Example 10 Fe Co 56 4.8 0.44 40 118 100 50 60 2.0 1.2 0.44 30.1 Example 11 Fe Co 45 2.3 0.26 30 116 100 50 60 2.0 1.2 0.42 33.7 Example 12 Fe Co 48 2.5 0.24 50 140 100 50 60 2.0 1.2 0.40 32.5 Example 13 Fe 35 1.4 0.19 50 102 100 50 60 2.0 1.2 0.48 31.3 Example 14 Fe Ni 37 1.5 0.22 50 91 100 50 60 2.0 1.2 0.49 31.0 Comparative example 1 Fe Co 48 2.2 0.27 40 121 30 50 60 0.6 1.2 0.65 29.0

According to the results of Examples 1 to 3 and 5 and Comparative Example 1, it can be seen that the case where T1/T2 is 1.0 or more (Examples 1 to 3 and 5) is compared with the case where T1/T2 is less than 1.0 (Comparative Example 1). The insertion loss characteristics are further improved. In addition, it can be seen that when T1/T2 is 1.0 or more, the insertion loss characteristics are the case where T1/T2 is 3.0 (Example 5), the case where T1/T2 is 2.0 (Example 1), and T1/T2 is 1.2. The order of the case (embodiment 3) and the case where T1/T2 is 1.0 (embodiment 2) is further improved.

1: LC composite parts 1b: bottom surface 1s: side 1t: upper surface 2: Input terminal 3: output terminal 11, 12, 17: inductor 13~16: Capacitor 20: Part body 21: Magnetic substrate 21a: The first side of the magnetic substrate 21b: The second side of the magnetic substrate 22: Magnetic layer 22a: the first side of the magnetic layer 22 22b: The second side of the magnetic layer 22 23, 24: core 31~36: Dielectric layer 33V1~33V11, 34V1~34V7, 35V1~35V8: conductor part 31T1~31T4, 33T1~33T4, 34T1~34T4, 35T1~35T4, 41~44: conductor part for terminal 37: Dielectric laminate 311, 312, 331, 332, 337, 341, 342, 347, 351, 352, 357A, 357B: Conductor parts for inductors 313, 315, 316, 323, 324, 325A, 325B, 326: Conductor parts for capacitors T1, T2, T3: thickness

Fig. 1 is a perspective view showing the structure of an LC composite part according to an embodiment of the present invention. Fig. 2 is a cross-sectional view showing the structure of an LC composite part according to an embodiment of the present invention. Fig. 3A is an explanatory diagram for explaining the structure of the dielectric layer of the LC composite component in one embodiment of the present invention. Fig. 3B is an explanatory diagram for explaining the structure of the dielectric layer of the LC composite component in one embodiment of the present invention. Fig. 3C is an explanatory diagram for explaining the structure of the dielectric layer of the LC composite component in one embodiment of the present invention. Fig. 4A is an explanatory diagram for explaining the structure of the dielectric layer of the LC composite component in one embodiment of the present invention. Fig. 4B is an explanatory diagram for explaining the structure of the dielectric layer of the LC composite component in one embodiment of the present invention. Fig. 4C is an explanatory diagram for explaining the structure of the dielectric layer of the LC composite component in one embodiment of the present invention. Fig. 5 is a circuit diagram showing the circuit configuration of an LC composite component according to an embodiment of the present invention. Fig. 6 is a characteristic diagram showing the frequency characteristics of the insertion loss in the LC composite part of the first embodiment. Fig. 7 is a characteristic diagram showing the frequency characteristics of the insertion loss in the LC composite part of the fifth embodiment. Fig. 8 is a characteristic diagram showing the frequency characteristics of the insertion loss in the LC composite part of the first comparative example.

1: LC composite parts

1b: bottom surface

1s: side

1t: upper surface

11, 12, 17: inductor

13~16: Capacitor

20: Part body

21: Magnetic substrate

21a: The first side of the magnetic substrate

21b: The second side of the magnetic substrate

22: Magnetic layer

22a: the first side of the magnetic layer 22

22b: The second side of the magnetic layer 22

23, 24: Core

37: Dielectric laminate

42,44: Conductor part for terminal

Claims (7)

An LC composite part comprising: a magnetic substrate with magnetism, a magnetic layer with magnetism, one or more capacitors, one or more inductors, and one or more cores with magnetism; the magnetic substrate has a first The magnetic layer is arranged to face the first surface of the magnetic substrate, and the one or more inductors and the one or more capacitors are arranged on the second surface opposite to the first surface. Between the first surface of the magnetic substrate and the magnetic layer, the core is disposed between the first surface of the magnetic substrate and the magnetic layer, and is connected to the magnetic layer, perpendicular to the first surface of the magnetic substrate In the direction in which the thickness of the core is 1.0 times or more the thickness of the magnetic layer, in the direction perpendicular to the first surface of the magnetic substrate, the thickness of the magnetic substrate is 1.0 times or more the thickness of the magnetic layer, In addition, the magnetic substrate, the magnetic layer, and the core each include magnetic metal particles and resin. The LC composite part of claim 1, wherein in a direction perpendicular to the first surface of the magnetic substrate, the thickness of the magnetic substrate is 3.0 times or less the thickness of the magnetic layer. The LC composite part of claim 1 or 2, wherein the average major axis diameter of the magnetic metal particles is 120 nm or less. Such as the LC composite part of claim 1 or 2, wherein the average aspect ratio of the above-mentioned magnetic metal particles is 1.2-6. The LC composite part of claim 1 or 2, wherein the magnetic saturation of the magnetic substrate, the magnetic layer, and the core is 90 emu/g or more. Such as the LC composite part of claim 1 or 2, wherein the CV value of the aspect ratio of the magnetic metal particles is 0.4 or less. The LC composite part of claim 1 or 2, wherein the magnetic metal particles contain at least one selected from the group consisting of Fe, Co, and Ni as a main component.

Images