JP2003133136A - Magnetic part and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plane magnetic part which reduces an increase of a conductor resistance at a high frequency, has a small usable loss at a high frequency, is a small type and has a high performance index. SOLUTION: The magnetic part is constituted of at least a magnetic material and a conductor, the conductor is arranged between an upper portion magnetic material layer and a lower portion magnetic material layer, and the magnetic material is arranged in a space portion among the upper portion magnetic material layer, the lower portion magnetic material layer, and the conductor.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency planar inductance component suitable for a converter, a switching power supply, etc., which is compact in size and made of a conductive material and a magnetic material.

[0002]

2. Description of the Related Art In recent years, demands for miniaturization and weight reduction of electronic equipment components are strict, and miniaturization is an essential issue even in switching power supplies and the like that can obtain high-quality electric power. Miniaturization has been promoted by making components such as transformers, inductors and capacitors smaller. For semiconductor parts and capacitor parts, LS
As typified by I and multilayer ceramic capacitors, thin film forming technology has been used from early on, and has responded to the demand for miniaturization of component parts. On the other hand, magnetic components such as transformers and inductors are the most difficult to miniaturize so far, and it is difficult to suppress the increase in loss due to higher frequencies, so this was the first cause that hinders the miniaturization of power supplies. Therefore, it is no exaggeration to say that the size of the switching power supply is currently determined by the magnetic parts such as the transformer. Therefore, in recent years, research on flat transformers and flat inductors using a thin film forming technique has been advanced in order to cope with higher frequencies, and development of small power supplies with a switching frequency increased to the MHz band has been activated.

FIG. 12 is a schematic view showing a planar inductor manufactured by a thin film forming technique as a conventional example 1 by cutting a part thereof. In the figure, 1 is a substrate, 2 is an insulating layer, 3 is a lower magnetic layer, 4
Indicates a conductor pattern, and 5 indicates an upper magnetic layer. Conventionally, a thin film magnetic component of this type has been manufactured as follows. That is, a lower magnetic layer is formed on a substrate 1 having an insulating surface by a thin film forming method such as sputtering, vapor deposition, and plating, and this is patterned to form a rectangular magnetic film pattern, and an insulating film is formed on top of this. The layer 2 is formed of polyimide, photoresist, SiO ₂ , Al ₂ O ₃ , SiN, etc., and after flattening, the conductor pattern 4 is formed by a thin film forming method such as sputtering, vapor deposition, plating, etc., and patterned. To form an inductor layer by forming an insulating layer 2 on the insulating layer 2 with polyimide, photoresist, SiO ₂ , Al ₂ O ₃ , SiN, etc., and then flattening the upper magnetic layer 5. It Incidentally, FIG. 13 is a sectional view of the planar inductor of Conventional Example 1 described above.

As a second conventional example, FIG. 14 shows a schematic sectional view of a planar inductor using a screen printing method. In the figure, 1'denotes a Si substrate, 2'denotes a lower ferrite layer, 3'denotes a conductor pattern, and 4'denotes a ferrite filling layer. Conventionally, a planar inductor of this type has been manufactured as follows. That is, a ferrite powder paste is applied by a screen printing method on a substrate 1 ′ such as a Si wafer having a smooth surface and baked at about 1000 ° C. to form a lower ferrite layer 2 ′, and a plating base film is deposited by vapor deposition or the like. After the fabrication, the resist is used for patterning, and the conductor pattern 3'is formed by electroplating. After removing the resist, a ferrite powder paste containing a binder is applied by a screen printing method to fill the coil gap and the upper part of the coil and harden at about 200 ° C. to manufacture an inductor.

[0005]

However, when the plane inductor or the plane transformer is formed by the above-mentioned conventional technique 1, there is a problem that the loss is sharply increased at a high frequency and the characteristics of the inductor are significantly deteriorated. This is a problem caused by the flat shape, and as shown in FIG. 15, the magnetic flux of the upper and lower magnetic films leaks from the magnetic film due to the resistance of the magnetic circuit and intersects with the conductor pattern arranged between the upper and lower magnetic films. As a result, the high-frequency resistance of the coil is significantly increased, and the figure of merit (Q =
This is a phenomenon in which ωL / R) decreases. On the other hand, in the planar inductor according to Conventional Example 2 above, by embedding the periphery of the coil pattern with a magnetic material, the magnetic flux generated from the conductor pattern circulates in the surrounding magnetic material as shown in FIG. Although the effect of suppressing the increase in coil resistance at high frequencies by reducing the magnetic flux is obtained, the magnetic field generated from each conductor pattern is isolated without surrounding adjacent conductors due to the surrounding magnetic material, so the direction of the current flow. The mutual inductance generated between adjacent conductor patterns in the same direction decreases, and only a self-inductance of a single wire can be obtained.

For this reason, the inductance value obtained by forming the spiral coil is not proportional to the square of the number of turns, and only a small value, which is almost proportional to the length of the coil, can be obtained as in the case of the zigzag coil. , Small size and high inductance cannot be obtained. As described above, the conventional example 1 has a large coil loss at high frequencies, and the conventional example 2 has only a small inductance per unit area. Therefore, the loss that can be used at high frequencies is small, and the planar magnetism has a high figure of merit. Parts were not realized.

The present invention has been made in order to solve the above problems, and an object thereof is to reduce an increase in conductor resistance at high frequencies, reduce loss that can be used at high frequencies, be small, and have a high figure of merit. It is to provide a planar magnetic component.

[0008]

In order to solve the above-mentioned problems, according to the present invention, as described in claim 1, in a planar magnetic component, a plurality of adjacent magnetic layers are provided between the upper magnetic layer and the lower magnetic layer. A magnetic component is characterized in that a bypass magnetic circuit through which magnetic fluxes from the upper and lower magnetic bodies extend is provided in a gap portion of conductors arranged as a unit.

In the present invention, as described in claim 2, the bypass magnetic circuit formed between the conductors between the upper and lower magnetic bodies has a relative magnetic permeability smaller than that of the upper magnetic body and the lower magnetic body. A magnetic component characterized by using the magnetic material having the above.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.

(First Embodiment) FIG. 1 is an external perspective view of a first embodiment of the present invention, and FIG. 2 is an upper magnetic body 10 which is a component when a magnetic component according to the present invention is disassembled.
FIG. 3 is a perspective view of each of 0, the lower magnetic body 300, and the winding portion 200. The magnetic body forming the bypass magnetic path is omitted.

First, the external perspective view shown in FIG. 1 will be described. FIG. 1 shows an inductor which is an embodiment of a magnetic component of the present invention, in which the uppermost layer is an upper magnetic body 100,
The middle layer is the winding 200, and the bottom layer is the lower magnetic pole body 300. Although not shown in the drawing, the bypass magnetic path is formed near the winding portion 200 of the middle layer, and the lower magnetic body 300 and the upper magnetic body 100 are formed. It becomes the positional relationship between and. Further, the hole in the center of the upper magnetic body is a contact part 400 for drawing out at the inner peripheral end of the winding, and the slits radially extending from the contact part are contact parts 500 for extracting at the outer peripheral end of the winding.
Is.

Next, FIG. 2 will be described. Reference numeral 100 denotes an upper magnetic body. In this embodiment, a Co-based amorphous alloy thin film was produced by sputtering, but an Fe-based amorphous alloy thin film, a permalloy thin film, a nanocrystalline soft magnetic thin film, or a soft magnetic ferrite thin film may be used. . The lead-out contact portion 400 at the inner peripheral end of the winding and the lead-out contact portion 500 at the outer peripheral end of the winding can be simultaneously processed when patterning the upper magnetic body 100, and can be easily manufactured. Further, the contact portion 5 for drawing out the outer peripheral end of the winding wire
00 can be formed at any place on the outer peripheral portion of the magnetic film, but as shown in FIG. 2 of the present embodiment, 00 is formed on each of the four side corners from the lead-out contact portion 400 at the inner peripheral end of the winding. The radial formation toward the surface can introduce shape anisotropy into the magnetic material and reduce eddy current loss to improve the high frequency characteristics of the magnetic film. Further, since it can be connected to the lower winding at any position of the slit, it is possible to add an advantage that the inductance value can be easily adjusted.

Reference numeral 200 denotes a winding portion, which is produced by wet plating in this embodiment, but it goes without saying that it can be produced by a thin film forming technique such as sputtering.

Reference numeral 300 denotes a lower magnetic material. In this embodiment, a Co-based amorphous alloy thin film was prepared by sputtering similarly to the upper magnetic material, but an Fe-based amorphous alloy thin film, a permalloy thin film, a nanocrystalline soft magnetic thin film, and a soft magnetic material. A ferrite thin film may be used.

Although not shown in the figure, the bypass magnetic path formed in the vicinity of the winding portion 200 of the intermediate layer and sandwiched between the upper magnetic body 100 and the lower magnetic body 30O has a bypass magnetic path. In the above, the Co-based amorphous powder was mixed with the binder, and the Fe-based amorphous powder and the Mn were mixed.
-Metal powders such as oxide magnetic powders such as -Zn ferrite powders and Ni-Zn ferrites, sendust powders, permalloy powders, carbonyl soft powders, metallic glass powders, and nanocrystalline soft magnetic powders are used. It goes without saying that it can be manufactured by

The manufacturing method of the first embodiment will be described below with reference to FIG.
Will be described in detail below.

First, a SiO ₂ film 700 is formed by sputtering on a substrate 600 having a good surface flatness such as a Si wafer, and then an amorphous CoZrTa magnetic film (SiO ₂ ) insulating film is sequentially formed by using an ion beam sputtering apparatus. After stacking, patterning is performed by ion beam etching to form the lower magnetic body 300.
Subsequently, a SiNx insulating film 800 is formed, and Cu and Nb are sequentially formed as a plating base film.

The resist is spin-coated, and the resist is exposed and developed using a mask on which a spiral winding pattern is formed to form a resist coil pattern. Etching is performed using the resist pattern as a mask to produce a Cu coil pattern 200. Then, a frame is formed by a thick film resist, and a Cu coil is produced by electrolytic plating of Cu. The resist frame between the Cu coil patterns is removed by etching to complete the winding portion.
At this time, it is necessary to form a natural oxidation treatment or an oxide film with a spatter to form an insulating layer on the surface of the Cu coil in preparation for the case where the specific resistance value of the magnetic paste (described later) is low. Do accordingly.

Then, in order to produce a bypass magnetic path,
A paste (hereinafter referred to as a magnetic paste) in which a Co-based amorphous powder having a particle diameter of about 3 μm and a binder are mixed is applied by a screen printing method, and is filled between coil patterns (900).
After flattening, it is heat-cured at about 200 ° C. After the polyimide is applied by spin coating on the unit made up of the lower magnetic body 300, the winding wire 200, and the bypass magnetic path 900 thus produced and cured (750),
Similar to the method of forming the lower magnetic body, the upper magnetic body is film-formed by ion beam sputtering, and then, as shown in FIG. The extraction contact slit portion 500 at the outer peripheral end of the winding is patterned by ion beam etching. This contact slit reduces the eddy current loss of the magnetic film and contributes to the improvement of high frequency characteristics by inducing induced magnetic anisotropy in the magnetic film. In this embodiment, the upper magnetic body 1
Although the slits are provided only on No. 00, it is needless to say that the same effect can be obtained by providing the slits on the lower magnetic body 300, and further lower loss and higher frequency characteristics can be improved. Subsequently, as a process for drawing out the wiring, an arbitrary ion beam sputtering device is used for the drawing contact part 400 at the inner peripheral end of the winding and the drawing contact slit part 500 at the outer peripheral end of the winding, and the upper part of the conductor is ion-milled. After removing the insulating portion, solder bumps were formed to produce a connecting bat.

After the process is completed, the inductance chip is completed by cutting out. Although the ion beam sputtering apparatus is used as the method for removing the insulating portion on the conductor in this embodiment, it is obvious that a method for removing the insulating portion by a laser trimming device or machining may be used.

FIG. 4 shows the results of measuring the frequency dependence of the inductance value and the figure of merit Q = (ωL / R) for the magnetic component of this example thus produced and the magnetic component produced by using the conventional technique.

In FIG. 4, A is the case where the relative magnetic permeability of the upper and lower magnetic films in the case of the solid film is 4,000 and the relative magnetic permeability of the magnetic paste forming the bypass magnetic path is 150 in the first embodiment. B is the relative permeability of the magnetic paste.
0 and C are the cases where the relative magnetic permeability of the magnetic paste is 10, and for comparison, the measurement results of the samples manufactured by the techniques of Conventional Example 1 and Conventional Example 2 are shown.

From FIG. 4, it can be seen that the sample of Conventional Example 1 exhibits a high inductance, but the leakage flux intermingling with the coil causes the equivalent series resistance value to increase from a relatively low frequency and the loss to rapidly increase. The figure of merit Q obtained is low, and the peak frequency is about 0.5 MHz. Also,
In the sample of Conventional Example 2, since the increase in coil resistance due to the leakage magnetic flux is small, the value of the equivalent series resistance is low and the loss is low, but the inductance value is low. Therefore, the obtained Q value has a peak value at about 10 MHz. On the other hand, regarding Samples A to C of this example, the obtained inductance value changes depending on the magnitude of the relative magnetic permeability of the magnetic binder, but the equivalent series resistance is different from that of Conventional Example 1 by providing the bypass magnetic path. Since the increase in the low frequency range is suppressed, the figure of merit Q increases up to the high frequency range,
It has a peak at z, and its value is also larger than that of the conventional example, and the value of B sample is nearly three times as large. Further, it can be seen that the frequency at which Q becomes maximum can be adjusted within a wide frequency range by changing the relative permeability of the magnetic binder. Comparing a region having a high Q value of 30 or more, in Conventional Example 2, it is limited to the region of 8 MHz to 14 MHz, but in the present implementation, the bandwidth is increased to 2 MHz to 14 MHz, and high frequency switching is performed. It has a great merit that it can be used at a frequency of several MHz which is a frequency used in a power supply.

In the samples A to C, the inductance value obtained by changing the relative magnetic permeability of the magnetic binder has a peak, and the inductance value of the sample A having a high relative magnetic permeability is the same as that of the sample B having a low relative magnetic permeability of the binder. The value is lower than the inductance value. The reason for this is that, from the relationship between the magnetic resistance and the characteristic length of the magnetic circuit composed of the upper and lower magnetic bodies and the bypass magnetic path, the magnetic flux generated by the coil in the sample A having a high relative magnetic permeability of the binder is Since only the magnetic film and the bypass magnetic path are mainly passed, mutual inductance between adjacent coils is difficult to obtain, and only self-inductance occurs.

On the other hand, in the sample B having a relatively low relative magnetic permeability of the binder, since the magnetic resistance of the bypass magnetic path is high,
Since the magnetic flux generated by the coil extends not only to the nearest upper and lower magnetic films and the bypass magnetic path but also to the periphery of the adjacent coil, the inductance value increases due to the mutual inductance in addition to the self-inductance. Further, at this time, it can be understood that the magnetic flux that has intersected with the coil conductor as a leakage magnetic flux in the conventional structure passes through the bypass magnetic path, whereby the resistance increase of the coil conductor is reduced and the performance index Q is increased. On the other hand, in the sample C having the lowest relative permeability, since the magnetic resistance of the bypass magnetic path is high, the leakage magnetic flux between the upper and lower magnetic films cannot be concentrated in the bypass magnetic path and intersects with the coil as in the case of Conventional Example 1. Therefore, the equivalent series resistance increases from a relatively low frequency region, so that the Q value peaks at several MHz, and the value thereof is relatively small as A and B.

(Second Embodiment) FIG. 5 is an external perspective view of a second embodiment of the present invention, and FIG. 6 is an upper magnetic body 11 which is a component when a magnetic component according to the present invention is disassembled.
3 is a perspective view showing each of 0, the lower magnetic body 310, and the winding part 210. FIG. The magnetic body forming the bypass magnetic path is omitted.

First, the external perspective view shown in FIG. 5 will be described. FIG. 5 shows an inductor which is an embodiment of the magnetic component of the present invention, in which the uppermost layer is the upper magnetic body 110,
The middle layer is the winding part 210 and the bottom layer is the lower magnetic body 310. Although not shown in the figure, the bypass magnetic path is formed near the winding part 210 of the middle layer, and the lower magnetic body 310 and the upper magnetic body 110 are formed. It becomes the positional relationship between and. Also, the winding part 2
The contact portions 410 and 51O provided in 10 are pads for wiring connection of the inductor.

Next, FIG. 6 will be described. 110 is an upper magnetic body and 310 is a lower magnetic body. In this embodiment, C
Although a plurality of o-based amorphous alloy ribbons were patterned by chemical etching and laminated, a Fe-based amorphous alloy ribbon, a permalloy ribbon, or a nanocrystalline soft magnetic ribbon may be used. It is also possible to simultaneously process the slits 111 and the like for improving the characteristics of the magnetic film during the patterning.

Reference numeral 210 denotes a winding portion, which is a double-sided sheet coil produced by using a flexible double-sided substrate in which copper foil is laminated on both sides of a polyimide sheet having excellent heat resistance, and the spiral coil on both sides is formed on the inner peripheral portion. It is connected by a through hole provided, and is a turn-back connection configuration in which one side has N turns and both sides have 2 * N turns.

The manufacturing method according to the second embodiment will be described in detail below.

As a top and bottom magnetic body, a Co-based amorphous alloy ribbon is patterned by chemical etching, and a plurality of such layers are laminated to produce m × n upper magnetic bodies 110 and lower magnetic bodies 310. Using a conventional flexible sheet coil substrate in which a copper foil is laminated on both sides of a heat-resistant polyimide sheet as a winding portion, a winding sheet 210 in which spiral winding coil patterns are formed on both sides is arranged m × n in number. It was made. Particle size 3 as magnetic paste
A paste was prepared by mixing NiZn ferrite powder of about μm and a binder.

FIG. 7 is a schematic view for explaining the manufacturing method,
After applying a magnetic paste by a screen printing method to both surfaces of a winding sheet on which m × n winding portions 210 are formed,
By arranging the upper and lower magnetic bodies and heating while applying pressure, the magnetic paste is cured and m × n inductance components are simultaneously manufactured. After completely hardened, cutting is performed to complete m × n inductance components.

As a result of measuring the electrical characteristics of the inductance component thus produced, the figure of merit was about four times that of the one produced by the prior art 1, and low loss characteristics could be confirmed. In addition, a Q factor having a performance index about three times higher than that of the device manufactured by the conventional technique 2 was obtained. At the same time, since the upper and lower surfaces of the inductor are made of metal with excellent thermal conductivity, the heat dissipation is also excellent, and the temperature rise of the parts is also reduced. Further, by arranging a magnetic material having a high relative magnetic permeability on the upper and lower surfaces of the inductor, it can be expected to reduce radiation noise and improve radiation noise resistance.

As described above, according to the second embodiment, the effect of improving the figure of merit is high and the mass productivity is excellent, and various inductance parts can be easily manufactured by changing the specifications of the winding part. it can. Further, by selecting the relative magnetic permeability of the magnetic paste, it is possible to easily realize a high figure of merit Q according to the frequency range to be used.

(Third Embodiment) FIG. 8 is an external perspective view of a third embodiment of the present invention, and FIG. 9 is an upper magnetic body 12 which is a component when a magnetic component according to the present invention is disassembled.
FIG. 3 is a perspective view of each of 0, the lower magnetic body 320, and the winding portion 220.

First, the external perspective view shown in FIG. 8 will be described. FIG. 8 shows an inductor which is an embodiment of the magnetic component of the present invention. The uppermost layer is the upper magnetic body 120,
The middle layer is the winding part 220, and the bottom layer is the lower magnetic body 320. Although not shown in the figure, the bypass magnetic path is formed near the winding part 220 of the middle layer, and the lower magnetic body 320 and the upper magnetic body 120 are provided. It becomes the positional relationship between and.

Next, FIG. 9 will be described. 120 is an upper magnetic body and 320 is a lower magnetic body. In this embodiment, Ni is used.
Although a thin plate of -Zn ferrite was used, a thin plate of Mn-Zn ferrite or metallic magnetic glass may be used. 22
Reference numeral 0 denotes a winding portion, which is a magnet wire wound around a spiral coil, and is folded back in the same manner as in the second embodiment.

The manufacturing method of the third embodiment will be described in detail below. Ni-Zn ferrite thin plates are manufactured to have desired dimensions as upper and lower magnetic bodies, and upper magnetic body 120 and lower magnetic body 320 are manufactured. As a winding part, a magnet wire is wound in a spiral shape with a space provided, and the magnetic paste is filled and hardened by using a heating press machine to form a winding part in which the periphery of the coil is covered with the magnetic paste. Create. The magnetic body parts 120 and 32 thus produced
0, by overlapping and adhering the winding part 220,
An inductance component having a magnetic pinder or a bypass magnetic path inserted between the coils of the winding portion is completed. In the case of ultra-thinning, it is possible to remove the substrate portion by etching or the like after applying ferrite powder on a substrate such as a Si wafer by screen printing and firing as in the case of the conventional technique 2. . Similarly, a method of forming a soft magnetic film on a substrate such as a Si wafer by using a sol-gel method and then removing the substrate has a remarkable effect on thinning. Further, in the present embodiment, as the method for producing the winding portion, the heating press device is used, but it is also effective to use the injection molding device for mass production.

As a result of measuring the electrical characteristics of the inductance component thus manufactured, the effect that the cross-sectional area of the coil was large and the conductor resistance was reduced was added, and the figure of merit was about 6 times that of the one manufactured by the prior art 1. A low loss characteristic was confirmed. Further, a Q value having a performance index about 4 times higher than that of the device manufactured by the conventional technique 2 was obtained.

As described above, the technique of the third embodiment is highly effective in improving the figure of merit and is also excellent in mass productivity, and various inductance components can be easily manufactured by changing the specifications of the winding portion. . Further, by selecting the relative magnetic permeability of the magnetic paste, it is possible to easily realize a high figure of merit Q according to the frequency range to be used.

(Fourth Embodiment) FIG. 10 shows a fourth embodiment of the present invention.
11 is an external perspective view of the embodiment of FIG. 11, and FIG. 11 is a perspective view of each of the upper magnetic body 130, the lower magnetic body 330, and the winding portion 230 that are constituent elements when the magnetic component according to the present invention is disassembled.

First, the external perspective view shown in FIG. 10 will be described. FIG. 10 shows an inductor which is an embodiment of the magnetic component of the present invention, and the uppermost layer is the upper magnetic body 13.
0, the middle layer is the winding part 230, and the bottom layer is the lower magnetic body 330.
Although not shown in the figure, the magnetic material that serves as a bypass magnetic path is formed by coating on the surface of the winding, and the lower magnetic material 33
There is a positional relationship between 0 and the upper magnetic body 130. Next, FIG. 11 will be described. 130 is an upper magnetic body, 33
Reference numeral 0 denotes a lower magnetic body, which is provided with a convex portion serving as a center leg in the center portion for improving the inductance. Although a thin plate (hereinafter referred to as a magnetic sheet) formed by mixing amorphous metal powder with a binder is used in this embodiment, a Ni—Zn soft magnetic ferrite thin plate, a metallic magnetic glass, or a soft magnetic metallic ribbon may be used. Reference numeral 230 denotes a winding portion, which is a rectangular copper wire wound around a spiral coil, and the surface of which is coated with a magnetic paste. Similar to the second embodiment, it is folded back.

The manufacturing method of the fourth embodiment will be described in detail below.

As the upper and lower magnetic bodies, magnetic sheets having desired dimensions are prepared, and the upper magnetic body 130 and the lower magnetic body 330 are formed.
To make. As a winding part, magnetic paste is applied to the surface of a small-diameter rectangular copper wire, which is temporarily hardened by heat (hereinafter,
A magnetic film-coated conductor wire is produced, which is wound in a spiral shape and then heated to main-cure the magnetic paste to produce a winding portion in which the periphery of the coil is covered with the magnetic paste. The magnetic parts 130 and 330 and the winding part 230 thus manufactured
By overlapping and adhering, the magnetic pinder or the inductance component with the bypass magnetic path inserted between the coils of the winding portion is completed. Further, in the present embodiment, as the magnetic paste curing method for the winding portion, heat curing was performed, but it goes without saying that various techniques such as ultraviolet curing can be adopted by selecting the type of binder of the magnetic paste.

As a result of measuring the electrical characteristics of the inductance component thus manufactured, the use of a flat conductor wire as the wire of the winding portion improves the space factor and reduces the conductor resistance. The figure of merit was about 6 times that of the produced one, and low loss characteristics could be confirmed. Further, compared with the one manufactured by the conventional technique 2, a Q value having a performance index about 4 times higher was obtained, and the metal magnetic layer having a high saturation magnetic flux density was provided above and below the winding portion, so that about 2 Double DC superposition characteristics were obtained.

As described above, the technique of the fourth embodiment has a high effect of improving the figure of merit and is also excellent in mass productivity, and various inductance parts can be manufactured by changing the specifications of the winding portion and the magnetic layer. Easy to make.

[0048]

As described above, according to the present invention, by forming a bypass magnetic path whose magnetic resistance is adjusted between upper and lower magnetic films forming a main magnetic circuit, a leakage magnetic flux is induced in the bypass magnetic path. However, the leakage magnetic flux that intersects with the conductor pattern is reduced to suppress the increase in coil resistance at high frequencies, and the magnetic resistance of the bypass magnetic path is made larger than that of the upper and lower magnetic films, so that the current directions are the same. (EN) It is possible to realize a magnetic circuit in which a magnetic flux extends across a conductor, and to provide a small-sized planar magnetic component having a high figure of merit utilizing both the self-inductance of the conductor and the mutual inductance between the conductors.

Further, by using the configuration and manufacturing technique of the present invention, the performance of the inductance component can be sufficiently exhibited, and high reliability, high efficiency, miniaturization, low cost, high function, and practical inductance can be obtained. It is possible to realize parts and contribute to downsizing, thinning, loss reduction, and cost reduction of electronic devices in general.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of a magnetic component according to the present invention.

FIG. 2 is a diagram for explaining the constituent elements of the magnetic component according to the present invention, which is disassembled from the first embodiment.

FIG. 3 is a sectional structural view of a first embodiment of a magnetic component according to the present invention.

FIG. 4 is a diagram comparing the electrical characteristics of the first embodiment of the magnetic component according to the present invention.

FIG. 5 is a perspective view showing a second embodiment of the magnetic component according to the present invention.

FIG. 6 is a diagram illustrating constituent elements when a second embodiment of the magnetic component according to the present invention is disassembled.

FIG. 7 is a schematic view showing a manufacturing method of the second embodiment of the magnetic component according to the present invention.

FIG. 8 is a perspective view showing a third embodiment of the magnetic component according to the present invention.

FIG. 9 is a diagram illustrating constituent elements when a magnetic component according to a third embodiment of the present invention is disassembled.

FIG. 10 is a perspective view showing a fourth embodiment of the magnetic component according to the present invention.

FIG. 11 is a diagram illustrating constituent elements when a magnetic component according to a fourth embodiment of the present invention is disassembled.

FIG. 12 is a perspective view showing a structure of the prior art example 1 with the − cut.

FIG. 13 is a schematic cross-sectional view of Conventional Example 1.

FIG. 14 is a schematic cross-sectional view of Conventional Example 2.

FIG. 15 is a schematic diagram illustrating a magnetic flux distribution of Conventional Example 1.

16 is a schematic diagram illustrating a magnetic flux distribution of Conventional Example 2. FIG.

[Explanation of symbols]

1 substrate, 2 insulating layers, 3 lower magnetic body, 4 coil pattern, 5 upper magnetic body, 1'board, 2'lower magnetic body, 3'coil pattern, 4'Ferrite filling layer (upper magnetic body), 100 upper magnetic body, 200 winding part, 300 lower magnetic material, 40O wiring contact, 500 wiring contacts, 600 substrates, 700 insulating film, 750 insulating film, 800 insulating layer, 900 bypass magnetic path, 110 upper magnetic body, 210 winding part, 310 lower magnetic body, 410 wiring contact, 510 wiring contacts, 120 upper magnetic body, 220 winding part, 320 lower magnetic body, 130 upper magnetic body, 230 winding part, 330 Lower magnetic body.

Continued front page    (72) Inventor Tatsuro Sakai             2-3-1, Otemachi, Chiyoda-ku, Tokyo Japan             Telegraph and Telephone Corporation (72) Inventor Satoshi Matsumoto             2-3-1, Otemachi, Chiyoda-ku, Tokyo Japan             Telegraph and Telephone Corporation (72) Inventor Yasumichi Kanai             2-3-1, Otemachi, Chiyoda-ku, Tokyo Japan             Telegraph and Telephone Corporation (72) Inventor Nobuhiko Yamashita             2-3-1, Otemachi, Chiyoda-ku, Tokyo Japan             Telegraph and Telephone Corporation (72) Inventor Toshiaki Taniuchi             2-3-1, Otemachi, Chiyoda-ku, Tokyo Japan             Telegraph and Telephone Corporation F-term (reference) 5E070 AA01 AB03 CB02 CB12

Claims (5)

[Claims] 1. A magnetic component including at least a magnetic body and a conductor, wherein a conductor is provided between an upper magnetic body layer and a lower magnetic body layer, and the upper magnetic body layer and the lower magnetic body layer are provided. A magnetic component characterized in that a magnetic material is provided in a gap portion with a conductor. 2. The magnetic body provided in the gap between the upper magnetic layer and the lower magnetic layer and the dynamic state is a magnetic body having a relative magnetic permeability smaller than that of the upper magnetic layer and the lower magnetic layer. The magnetic component according to claim 1, wherein the magnetic component is used. 3. A magnetic component comprising at least a magnetic body and a conductor, wherein a conductor is provided between the upper magnetic body layer and the lower magnetic body layer, and the upper magnetic body layer and the lower magnetic body layer are provided. A method of manufacturing a magnetic component, wherein a magnetic body is provided in a gap portion with the conductor, and the magnetic body provided in the gap portion is formed by filling the gap portion with a thin film forming technique. 4. A magnetic component including at least a magnetic body and a conductor, wherein a conductor is provided between an upper magnetic body layer and a lower magnetic body layer, and the upper magnetic body layer and the lower magnetic body layer are provided. A method of manufacturing a magnetic component, wherein a magnetic body is provided in a gap between the conductor and the magnetic body provided in the gap is formed by filling the gap by a thick film printing technique. 5. A magnetic component comprising at least a magnetic body and a conductor, wherein a conductor is provided between the upper magnetic body layer and the lower magnetic body layer, and the upper magnetic body layer and the lower magnetic body layer are provided. A method of manufacturing a magnetic component, wherein a magnetic body is provided in a gap with a conductor, and the magnetic body provided in the gap is formed by coating the conductor by a thin film forming technique.