Nothing Special   »   [go: up one dir, main page]

TWI711352B - Conductive board for a display device - Google Patents

Conductive board for a display device Download PDF

Info

Publication number
TWI711352B
TWI711352B TW108125284A TW108125284A TWI711352B TW I711352 B TWI711352 B TW I711352B TW 108125284 A TW108125284 A TW 108125284A TW 108125284 A TW108125284 A TW 108125284A TW I711352 B TWI711352 B TW I711352B
Authority
TW
Taiwan
Prior art keywords
electrode
light
conductive
emitting source
connection
Prior art date
Application number
TW108125284A
Other languages
Chinese (zh)
Other versions
TW202029850A (en
Inventor
范文昌
王嘉彬
Original Assignee
新宸科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新宸科技股份有限公司 filed Critical 新宸科技股份有限公司
Publication of TW202029850A publication Critical patent/TW202029850A/en
Application granted granted Critical
Publication of TWI711352B publication Critical patent/TWI711352B/en

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0066Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

A conductive board for a display device has an electrically insulated substrate, a plurality of light source electrode connecting areas, and at least one patterned layer of conductive lines. The light source electrode connecting areas are formed above the electrically insulated substrate, arranged into an array, and electrically isolated from each other. Each light source electrode connecting area has one common electrode connecting subarea and a plurality of single electrode connecting subareas. The patterned layer of conductive lines is formed above the electrically insulated substrate and includes at least a plurality of conductive lines each being electrically connected to the common electrode connecting subarea of each of the light source electrode connecting areas on the same row and the patterned layer of conductive lines includes conductive powder particles with particle size of less than 200 micrometers.

Description

顯示裝置用的導電板Conductive plate for display device

本申請關於一種顯示裝置,尤其是關於顯示裝置用的導電板。This application relates to a display device, in particular to a conductive plate for the display device.

發光二極體(Light emitting diode;LED)是一種以半導體材料作為發光材料的電子元件,相較于白熾燈和冷陰極螢光燈管(Cold cathode fluorescent lamp;CCFL)的優點為省電、環保、壽命長、體積小和響應快。由於以LED作為自發光源的顯示技術日趨成熟,因此,在顯示市場上為主流產品的中小型尺寸LCD顯示器也逐漸被平面化、薄型化及輕量化的LED顯示器所取代。另一方面,LED顯示面板也朝大尺寸演進,企圖成為多媒體資訊展示媒介的新寵。Light emitting diode (LED) is an electronic component that uses semiconductor materials as luminescent materials. Compared with incandescent lamps and cold cathode fluorescent lamps (CCFL), it has the advantages of energy saving and environmental protection. , Long life, small size and fast response. As the display technology that uses LEDs as the self-luminous source is becoming more and more mature, small and medium-sized LCD displays, which are mainstream products in the display market, are gradually being replaced by flat, thin and lightweight LED displays. On the other hand, LED display panels are also evolving toward larger sizes, attempting to become the new favorite of multimedia information display media.

大尺寸LED顯示面板在製作上,通常是先製作出一小尺寸或中尺寸的具有LED燈珠陣列的顯示面板,然後再將多個小尺寸或中尺寸的顯示面板組合成一個大尺寸的LED顯示面板。為了讓LED燈珠陣列中每個LED燈珠能夠被點亮,承載LED燈珠陣列的基板與LED燈珠陣列之間的導電性必須良好。此外,為了讓LED燈珠陣列中的每個LED燈珠能夠長時運作,承載LED燈珠陣列的基板也必須具有高導熱性。另一方面,為了讓LED燈珠陣列中每個LED燈珠被點亮後,能夠呈現各種應用場合所需的顯示效果,承載LED燈珠陣列的基板上的導電線路的製作必須能夠應付各種不同走線設計的需求並能快速完成。因此,如何讓承載LED燈珠的基板兼具高導電性及高導熱性,且能符合各種應用場合需求是本發明所要解決的技術問題。In the production of large-size LED display panels, usually a small or medium-sized display panel with an LED lamp bead array is produced first, and then multiple small or medium-sized display panels are combined into a large-sized LED Display panel. In order for each LED lamp bead in the LED lamp bead array to be lit, the conductivity between the substrate carrying the LED lamp bead array and the LED lamp bead array must be good. In addition, in order to allow each LED lamp bead in the LED lamp bead array to operate for a long time, the substrate carrying the LED lamp bead array must also have high thermal conductivity. On the other hand, in order for each LED lamp bead in the LED lamp bead array to be lit, it can present the display effect required by various applications, the production of the conductive circuit on the substrate carrying the LED lamp bead array must be able to cope with various differences The wiring design requirements can be completed quickly. Therefore, how to make the substrate carrying the LED lamp beads have both high electrical conductivity and high thermal conductivity, and can meet the requirements of various applications is the technical problem to be solved by the present invention.

有鑑於上述問題,本申請發明人提出一種顯示裝置用的導電板。In view of the above problems, the inventor of the present application proposes a conductive plate for a display device.

本申請的一實施態樣提出了一種顯示裝置用的導電板。一實施例中,所提出的顯示裝置用的導電板包含一電性絕緣基板、複數發光源電極連接區及一第一圖案化導電線路層。發光源電極連接區形成於電性絕緣基板的上方,彼此間電性隔離且配置成陣列,各個發光源電極連接區供一外部控制裝置電連接用且供一發光源的一共電極及複數單電極電連接用,各個發光源電極連接區中具有一供發光源的共電極對應電連接的共電極連接分區及複數分別供發光源的單電極對應電連接的單電極連接分區。第一圖案化導電線路層形成於電性絕緣基板的上方且至少具有複數第一導電線路,各個第一導電線路和位於同一列上的發光源電極連接區中的共電極連接分區電連接。第一圖案化導電線路層包含粒徑小於200微米的一選自於由銅、銀、鎳、銀包銅及碳所組成的群組的導電粉末顆粒。An embodiment of the present application proposes a conductive plate for a display device. In one embodiment, the proposed conductive plate for a display device includes an electrically insulating substrate, a plurality of light-emitting source electrode connection regions, and a first patterned conductive circuit layer. The light-emitting source electrode connection area is formed above the electrically insulating substrate, electrically isolated from each other and arranged in an array. Each light-emitting source electrode connection area is used for electrical connection of an external control device and provides a common electrode and a plurality of single electrodes of a light-emitting source For electrical connection, each light-emitting source electrode connection area has a common electrode connection area for electrical connection of the common electrode of the light-emitting source and a plurality of single electrode connection areas for electrical connection of the single electrode of the light-emitting source. The first patterned conductive circuit layer is formed on the electrically insulating substrate and has at least a plurality of first conductive circuits, and each first conductive circuit is electrically connected to the common electrode connection section in the light emitting source electrode connection area on the same column. The first patterned conductive circuit layer includes conductive powder particles selected from the group consisting of copper, silver, nickel, silver-coated copper, and carbon with a particle size of less than 200 microns.

一實施例中,所提出的顯示裝置用的導電板的第一圖案化導電線路層還具有複數彼此電性隔離的電極墊,電極墊各自形成於發光源電極連接區的共電極連接分區及單電極連接分區中,且所提出的顯示裝置用的導電板更在各個電極墊上形成一材質包含銅的金屬導電層。In an embodiment, the first patterned conductive circuit layer of the conductive plate for the proposed display device further has a plurality of electrode pads electrically isolated from each other, and the electrode pads are respectively formed in the common electrode connection area and the single electrode connection area of the light emitting source electrode connection area. In the electrode connection area, and the proposed conductive plate for the display device further forms a metal conductive layer containing copper on each electrode pad.

一實施例中,所提出的顯示裝置用的導電板更包含一形成在前述的金屬導電層且材質包含鎳金、鎳鈀金、錫、銀或有機保銲膜(OSP)的保護層。In one embodiment, the proposed conductive plate for a display device further includes a protective layer formed on the aforementioned metal conductive layer and made of nickel-gold, nickel-palladium-gold, tin, silver, or organic solder mask (OSP).

一實施例中,所提出的顯示裝置用的導電板的第一圖案化導電線路層還具有複數彼此電性隔離的電極墊,電極墊各自形成於發光源電極連接區的共電極連接分區及單電極連接分區中,且所提出的顯示裝置用的導電板更在各個電極墊上形成一材質包含奈米銀或奈米銅的焊接層。In an embodiment, the first patterned conductive circuit layer of the conductive plate for the proposed display device further has a plurality of electrode pads electrically isolated from each other, and the electrode pads are respectively formed in the common electrode connection area and the single electrode connection area of the light emitting source electrode connection area. In the electrode connection zone, and the conductive plate for the proposed display device further forms a solder layer made of nanosilver or nanocopper on each electrode pad.

一實施例中,所提出的顯示裝置用的導電板還形成有複數第一單電極連接線,這些第一單電極連接線路分別自一部分的發光源電極連接區中的單電極連接分區延伸出,且顯示裝置用的導電板更包含一透明絕緣層及一第二圖案化導電線路層。透明絕緣層位於電性絕緣基板的上方。第二圖案化導電線路層形成於電性絕緣基板的上方,具有複數第二單電極連接線,這些第二單電極連接線分別自另一部分的發光源電極連接區中的單電極連接分區延伸出,一部分的第二單電極連接線和一部分的第一單電極連接線被透明絕緣層隔開而彼此電性絕緣。In an embodiment, the conductive plate for the proposed display device is further formed with a plurality of first single-electrode connection lines, and these first single-electrode connection lines respectively extend from the single-electrode connection zone in a part of the light-emitting source electrode connection area, And the conductive plate used for the display device further includes a transparent insulating layer and a second patterned conductive circuit layer. The transparent insulating layer is located above the electrically insulating substrate. The second patterned conductive circuit layer is formed on the electrically insulating substrate and has a plurality of second single-electrode connection lines, and these second single-electrode connection lines respectively extend from the single-electrode connection zone in the other part of the light-emitting source electrode connection area A part of the second single-electrode connection line and a part of the first single-electrode connection line are separated by a transparent insulating layer and electrically insulated from each other.

一實施例中,所提出的顯示裝置用的導電板的第一圖案化導電線路層還具有複數分別連接第一單電極連接線的第一分電聯外電連接墊,且第二圖案化導電線路層還具有複數分別連接第二單電極連接線的第二分電聯外電連接墊,第二分電聯外電連接墊與第一分電聯外電連接墊彼此間隔開地設置於電性絕緣基板的靠近一側邊的鄰近表面上方,第二分電聯外電連接墊的排列方向平行於第一分電聯外電連接墊的排列方向。In one embodiment, the first patterned conductive circuit layer of the proposed conductive plate for the display device further has a plurality of first electrical connection pads connected to the first single electrode connection lines, and the second patterned conductive circuit The layer also has a plurality of second power distribution connection external electrical connection pads respectively connected to the second single electrode connection lines, and the second power distribution connection external electrical connection pads and the first power distribution connection external electrical connection pads are arranged on the electrically insulating substrate at a distance from each other. Above the adjacent surface close to one side, the arrangement direction of the second power distribution connection external electrical connection pads is parallel to the arrangement direction of the first power distribution connection external electrical connection pads.

一實施例中,所提出的顯示裝置用的導電板的被透明絕緣層隔開的一部分的第二單電極連接線和一部份的第一單電極連接線位於兩相鄰列的發光源電極連接區之間。In one embodiment, a part of the second single-electrode connection line and a part of the first single-electrode connection line of the conductive plate for the proposed display device separated by the transparent insulating layer are located in two adjacent rows of light-emitting source electrodes Between the connection areas.

一實施例中,所提出的顯示裝置用的導電板的第二單電極連接線的材質包含奈米銀絲、奈米碳管、導電高分子、氧化銦錫(ITO)、氟摻雜氧化錫(FTO)、氧化鋅(ZnO)或氧化鋁鋅(AZO)。In one embodiment, the material of the second single-electrode connection line of the proposed conductive plate for the display device includes silver nanowire, carbon nanotube, conductive polymer, indium tin oxide (ITO), and fluorine-doped tin oxide. (FTO), zinc oxide (ZnO) or aluminum zinc oxide (AZO).

一實施例中,所提出的顯示裝置用的導電板的第一圖案化導電線路層的材質還包含一選自於由甲醛、尿素、三聚氰胺、苯代三聚氰胺及醇類化合物所構成的群組的物質或一選自於由熱塑性聚氨酯(TPU)、環氧樹脂、聚甲基丙烯酸甲酯(PMMA)及乙基纖維素所構成的群組的物質。In one embodiment, the material of the first patterned conductive circuit layer of the proposed conductive plate for the display device further includes a material selected from the group consisting of formaldehyde, urea, melamine, benzoic melamine and alcohol compounds. The substance or a substance selected from the group consisting of thermoplastic polyurethane (TPU), epoxy resin, polymethyl methacrylate (PMMA) and ethyl cellulose.

一實施例中,所提出的顯示裝置用的導電板的電性絕緣基板為透明基板。In an embodiment, the electrically insulating substrate of the conductive plate for the proposed display device is a transparent substrate.

一實施例中,所提出的顯示裝置用的導電板包含一電性絕緣基板、一透明導電層、複數發光源電極連接區及一圖案化導電線路層。透明導電層形成於電性絕緣基板的上方且與電性絕緣基板接觸。發光源電極連接區位於透明導電層的上方,彼此間電性隔離且配置成陣列,各個發光源電極連接區供一外部控制裝置電連接用且供一發光源的一共電極及複數單電極電連接用,各個發光源電極連接區中具有一供發光源的共電極對應電連接的共電極連接分區及複數分別供發光源的單電極對應電連接的單電極連接分區。圖案化導電線路層形成於透明導電層的上方且與該透明導電層接觸,至少具有複數導電線路,各個導電線路和位於同一列上的發光源電極連接區各自具有的共電極連接分區電連接。圖案化導電線路層包含粒徑小於200微米的導電粉末顆粒。In one embodiment, the proposed conductive plate for a display device includes an electrically insulating substrate, a transparent conductive layer, a plurality of light-emitting source electrode connection regions, and a patterned conductive circuit layer. The transparent conductive layer is formed on the electrically insulating substrate and in contact with the electrically insulating substrate. The light-emitting source electrode connection area is located above the transparent conductive layer, electrically isolated from each other and arranged in an array. Each light-emitting source electrode connection area is used for electrical connection of an external control device and for electrical connection of a common electrode and a plurality of single electrodes of a light-emitting source Each light-emitting source electrode connection area has a common electrode connection section for electrical connection of the common electrode of the light-emitting source and a plurality of single electrode connection sections for electrical connection of the single electrode of the light-emitting source. The patterned conductive circuit layer is formed on the transparent conductive layer and is in contact with the transparent conductive layer, and has at least a plurality of conductive circuits, and each conductive circuit is electrically connected to the common electrode connection section of the light emitting source electrode connection area on the same column. The patterned conductive circuit layer contains conductive powder particles with a particle size of less than 200 microns.

依本發明各實施例所提出的顯示裝置用的導電板,相較於傳統的LED導電板,其上形成的圖案化導線具有高緻密性、高導電性、高導熱性的特點,提升LED顯示效能,同時具有製程時間短的優點,適於大量生產而能降低製造成本。Compared with the traditional LED conductive plate, the conductive plate for the display device proposed according to the various embodiments of the present invention has the characteristics of high density, high electrical conductivity, and high thermal conductivity, which improves the LED display. Efficiency, while having the advantages of short process time, suitable for mass production and can reduce manufacturing costs.

本發明揭示一種顯示裝置用的導電板,以下文中說明所對照的圖示,意在表達與本發明有關的特徵以便於理解其含義,並未依據實際尺寸完整繪製,亦不對本發明構成限定,在先聲明。此外,以下文中所述及的技術用語的意思如有與所屬技術領域的通常用語的意思不同時,以文中用以說明所述及的技術用語的描述為準。The present invention discloses a conductive plate for a display device. The following descriptions of the contrasting diagrams are intended to express the features related to the present invention to facilitate understanding of its meaning. It is not drawn completely based on the actual size and does not limit the present invention. First statement. In addition, if the meaning of the technical terms described in the following text is different from the meaning of the common terms in the technical field, the description of the technical terms described in the text shall prevail.

圖1是根據本發明一實施例的顯示裝置用的導電板的局部區域的一平面示意圖。圖2是根據本發明一實施例的顯示裝置用的導電板沿圖1的A-A方向的剖面的平面剖視圖。一實施例中,如圖1及圖2所示,顯示裝置用的導電板10具有一電性絕緣基板101、多數個發光源電極連接區11、第一圖案化導電線路層103及一透明導電層102。本實施例中,透明導電層102形成於電性絕緣基板101上且與電性絕緣基板101接觸,透明導電層102中形成有複數溝槽1021,各個溝槽1021將電性絕緣基板101的表面暴露出,同時形成多個電性隔離的透明導電區。多數個發光源電極連接區11形成於電性絕緣基板101上方,被界定在透明導電層102上的這些透明導電區,因此透過一部分的溝槽1021而彼此間電性隔離且配置成陣列。各個發光源電極連接區11供一外部控制裝置12電連接用且供一發光源的多數電極電連接用,發光源的多數電極包含一共電極及多數單電極,所稱的發光源例如是可發出紅、藍、綠光的LED燈珠,而所稱的發光源的共電極可以是共陽極或共陰極,例如是LED燈珠的接地電極,而所稱的發光源的單電極例如是LED燈珠的電壓輸入電極。各個發光源電極連接區11中具有分別對應發光源的這些電極的多數個分區,這些分區透過一部分的溝槽1021而彼此電性隔離,各個發光源電極連接區11的這些分區中包含一供發光源的共電極電連接的共電極連接分區及多數個分別供發光源的這些單電極電連接的單電極連接分區。FIG. 1 is a schematic plan view of a partial area of a conductive plate for a display device according to an embodiment of the invention. 2 is a plan cross-sectional view of a conductive plate for a display device according to an embodiment of the present invention along the A-A direction of FIG. 1. In one embodiment, as shown in FIGS. 1 and 2, the conductive plate 10 for the display device has an electrically insulating substrate 101, a plurality of light-emitting source electrode connection regions 11, a first patterned conductive circuit layer 103, and a transparent conductive Layer 102. In this embodiment, the transparent conductive layer 102 is formed on the electrically insulating substrate 101 and is in contact with the electrically insulating substrate 101. A plurality of grooves 1021 are formed in the transparent conductive layer 102, and each groove 1021 extends the surface of the electrically insulating substrate 101. Expose and simultaneously form a plurality of electrically isolated transparent conductive regions. A plurality of light-emitting source electrode connection regions 11 are formed on the electrically insulating substrate 101, and these transparent conductive regions defined on the transparent conductive layer 102 are thus electrically isolated from each other through a part of the trenches 1021 and arranged in an array. Each light-emitting source electrode connection area 11 is used for electrical connection of an external control device 12 and for electrical connection of multiple electrodes of a light-emitting source. The multiple electrodes of the light-emitting source include a common electrode and multiple single electrodes. The so-called light-emitting source is, for example, capable of emitting light. Red, blue, and green LED lamp beads, and the so-called common electrode of the light-emitting source can be a common anode or a common cathode, such as the ground electrode of the LED lamp bead, and the so-called single electrode of the light-emitting source is, for example, an LED lamp The voltage of the bead is input to the electrode. Each light-emitting source electrode connection area 11 has a plurality of partitions corresponding to the electrodes of the light-emitting source, and these partitions are electrically isolated from each other through a part of the trench 1021, and these partitions of each light-emitting source electrode connection area 11 include a light-emitting source. The common electrode connection section electrically connected to the common electrode of the source and a plurality of single electrode connection sections electrically connected to the single electrodes of the light-emitting source.

另一實施例中,顯示裝置用的導電板10具有一電性絕緣基板101、多數個發光源電極連接區11及第一圖案化導電線路層103,但不具有透明導電層102。此時,多數個發光源電極連接區11是直接被界定在電性絕緣基板101上,彼此分離且彼此間電性隔離,且配置成陣列,各個發光源電極連接區11中的多數個對應發光源的電極的分區是彼此分離且彼此間電性隔離,關於發光源電極連接區11的用途及其餘結構皆與前述相同,不再贅述。In another embodiment, the conductive plate 10 for a display device has an electrically insulating substrate 101, a plurality of light-emitting source electrode connection regions 11, and a first patterned conductive circuit layer 103, but does not have a transparent conductive layer 102. At this time, most of the light-emitting source electrode connection areas 11 are directly defined on the electrically insulating substrate 101, separated from each other and electrically isolated from each other, and are arranged in an array, and most of the light-emitting source electrode connection areas 11 correspond to light-emitting The partitions of the source electrodes are separated from each other and electrically isolated from each other. The use of the light-emitting source electrode connection region 11 and the rest of the structure are the same as the foregoing, and will not be repeated.

一實施例中,第一圖案化導電線路層103形成於電性絕緣基板101的上方且至少具有多數個第一導電線路1031及多數個共電聯外電連接墊1032。所有的第一導電線路1031的路徑和將各個發光源電極連接區11彼此隔離的溝槽1021的路徑錯開,且所有的第一導電線路1031的路徑彼此平行。各個第一導電線路1031和位於同一列上的這些發光源電極連接區11電連接,特別是和位於同一列上的各個發光源電極連接區11中對應於發光源的共電極的共電極連接分區電連接。每個共電聯外電連接墊1032連接了一條第一導電線路1031,每個共電聯外電連接墊1032形成於電性絕緣基板101的靠近一側邊1011的鄰近表面上且彼此間隔開地配置。共電聯外電連接墊1032用以電連接至外部控制裝置12。在顯示裝置用的導電板10用於建築物的場合中,整個顯示裝置用的導電板10的厚度至少為6mm,電性絕緣基板101的材質為玻璃,如此可提供足夠的結構強度。In an embodiment, the first patterned conductive circuit layer 103 is formed on the electrically insulating substrate 101 and has at least a plurality of first conductive circuits 1031 and a plurality of common electrical connection pads 1032. The paths of all the first conductive lines 1031 and the paths of the trenches 1021 that isolate the light-emitting source electrode connection regions 11 from each other are staggered, and the paths of all the first conductive lines 1031 are parallel to each other. Each first conductive circuit 1031 is electrically connected to the light-emitting source electrode connection regions 11 located on the same column, in particular to the common electrode connection area corresponding to the common electrode of the light-emitting source in each light-emitting source electrode connection region 11 located on the same column Electric connection. Each common electrical connection pad 1032 is connected to a first conductive circuit 1031, and each common electrical connection pad 1032 is formed on the adjacent surface of the electrically insulating substrate 101 close to one side 1011 and is spaced apart from each other. . The common electrical connection external electrical connection pad 1032 is used to electrically connect to the external control device 12. When the conductive plate 10 for a display device is used in a building, the thickness of the conductive plate 10 for the entire display device is at least 6 mm, and the material of the electrically insulating substrate 101 is glass, which can provide sufficient structural strength.

請繼續參照圖1,每個發光源電極連接區11供一個發光源的多個電極電連接用。一實施例中,如圖1所示,每個發光源電極連接區11可以供一個發光源的一個共電極和三個單電極電連接用,且透明導電層102上還形成有自每個發光源電極連接區11中分別對應於發光源的多個電極的多個分區(例如為一個共電極連接分區及三個單電極連接分區)各自延伸出的電極連接線111、112、113和114,且第一導電線路1031經由延伸自發光源電極連接區11中的共電極連接分區的電極連接線111和共電極連接分區電連接。Please continue to refer to FIG. 1, each light-emitting source electrode connection area 11 is used for electrical connection of multiple electrodes of a light-emitting source. In an embodiment, as shown in FIG. 1, each light-emitting source electrode connection area 11 can be used for electrical connection of a common electrode and three single electrodes of a light-emitting source, and the transparent conductive layer 102 is also formed with self-emission The electrode connection lines 111, 112, 113, and 114 respectively extend from the plurality of regions (for example, one common electrode connection region and three single electrode connection regions) of the plurality of electrodes of the light emitting source in the source electrode connection region 11, In addition, the first conductive circuit 1031 is electrically connected to the common electrode connection section through the electrode connection line 111 extending from the common electrode connection section in the light-emitting source electrode connection area 11.

另一實施例中,顯示裝置用的導電板可以不具有透明導電層102,而電極連接線111、112、113和114是直接形成於電性絕緣基板101上且接觸電性絕緣基板101,關於電極連接線111、112、113和114的用途及其餘結構皆與前述相同,不再贅述。In another embodiment, the conductive plate for the display device may not have the transparent conductive layer 102, and the electrode connecting lines 111, 112, 113, and 114 are directly formed on the electrically insulating substrate 101 and contacting the electrically insulating substrate 101. The usage and other structures of the electrode connecting wires 111, 112, 113, and 114 are the same as the foregoing, and will not be repeated.

請參照圖2,電性絕緣基板101的材質例如是玻璃、陶瓷、氮化鋁陶瓷、聚碳酸酯、聚對苯甲酸乙二酯、聚醯亞胺、BT樹脂、玻璃纖維或環狀烯烴共聚物,在一實施例中,電性絕緣基板101可為透明基板,以構成透明顯示裝置。接觸且位於電性絕緣基板101上的透明導電層102例如是一層以濺鍍或蒸鍍的方式所形成的氧化銦錫(ITO)膜、氟摻雜氧化錫(FTO)膜、氧化鋅(ZnO)膜或氧化鋁鋅(AZO)膜。第一圖案化導電線路層103的形成方式例如是網版印刷或噴印,第一圖案化導電線路層103接觸且位於電性絕緣基板101上,或者接觸且位於透明導電層102上,以透過透明導電層102提升散熱效果,第一圖案化導電線路層103(包含第一導電線路1031)的材質可以是固化後的銀漿、銅漿或銀包銅漿,或者是固化後的一種導電粉末漿料,導電粉末漿料包含粒徑小於200微米的銅、銀、鎳、銀包銅或碳的導電粉末顆粒,使用此導電粉末漿料可在第一圖案化導電線路層103上直接進行化學鍍,而不需要任何還原或催化等前處理。導電粉末漿料的製備方式是將10~95%的粒徑小於200微米的導電粉末、1~40%的黏結劑及5~70%的溶劑混合後,再施以機械研磨。所形成的導電粉末漿料於玻璃、陶瓷、聚對苯甲酸乙二酯、聚醯亞胺、BT樹脂或玻璃纖維基材上的附著性良好。所稱的導電粉末是具有導電性的粉末,例如是銀粉末、銅粉末、銀包銅粉末、鎳粉末或碳粉末,導電粉末的顆粒形狀可以是片狀、球狀、微晶狀或不規則狀。所稱的黏結劑例如是以甲醛、尿素、三聚氰胺、苯代三聚氰胺及醇類化合物縮聚而成的物質,再與熱塑性聚氨酯(TPU)、環氧樹脂、聚甲基丙烯酸甲酯(PMMA)或乙基纖維素混合而成。所稱的溶劑例如是以酯類化合物、醇類化合物、醚類化合物及酮類化合物其中之一,與松油醇、乙醇、乙酸乙酯、二元酸酯混合物(DBE)、乙二醇乙醚醋酸酯(CAC)、異佛爾酮或乙二醇丁醚醋酸酯混合而成。此外,為了提高各個第一導電線路1031的導電性及導熱性,可在各個第一導電線路1031上鍍上一層包含銅的金屬導電層104。Please refer to FIG. 2, the material of the electrically insulating substrate 101 is, for example, glass, ceramic, aluminum nitride ceramic, polycarbonate, polyethylene terephthalate, polyimide, BT resin, glass fiber or cyclic olefin copolymer In an embodiment, the electrically insulating substrate 101 may be a transparent substrate to form a transparent display device. The transparent conductive layer 102 in contact with and located on the electrically insulating substrate 101 is, for example, a layer of indium tin oxide (ITO) film, fluorine-doped tin oxide (FTO) film, zinc oxide (ZnO) formed by sputtering or evaporation. ) Film or aluminum oxide zinc (AZO) film. The formation method of the first patterned conductive circuit layer 103 is, for example, screen printing or spray printing. The first patterned conductive circuit layer 103 is in contact with and is located on the electrically insulating substrate 101, or is in contact with and located on the transparent conductive layer 102 to penetrate The transparent conductive layer 102 improves the heat dissipation effect. The material of the first patterned conductive circuit layer 103 (including the first conductive circuit 1031) can be cured silver paste, copper paste or silver-coated copper paste, or a cured conductive powder Paste. The conductive powder paste contains conductive powder particles of copper, silver, nickel, silver-coated copper or carbon with a particle size of less than 200 microns. The conductive powder paste can be used to directly chemically process the first patterned conductive circuit layer 103. Plating without any pre-treatment such as reduction or catalysis. The conductive powder slurry is prepared by mixing 10-95% of the conductive powder with a particle size of less than 200 microns, 1-40% of the binder and 5 to 70% of the solvent, and then applying mechanical grinding. The formed conductive powder slurry has good adhesion on glass, ceramic, polyethylene terephthalate, polyimide, BT resin or glass fiber substrate. The so-called conductive powder is a powder with conductivity, such as silver powder, copper powder, silver-coated copper powder, nickel powder or carbon powder. The particle shape of the conductive powder can be flake, spherical, microcrystalline or not. Regular shape. The so-called binder is, for example, a substance formed by the condensation polymerization of formaldehyde, urea, melamine, benzo-melamine and alcohol compounds, and then with thermoplastic polyurethane (TPU), epoxy resin, polymethyl methacrylate (PMMA) or ethyl acetate. Base cellulose is mixed. The so-called solvent is, for example, one of ester compounds, alcohol compounds, ether compounds and ketone compounds, and terpineol, ethanol, ethyl acetate, dibasic acid ester mixture (DBE), glycol ether Acetate (CAC), isophorone or ethylene glycol butyl ether acetate are mixed. In addition, in order to improve the electrical conductivity and thermal conductivity of each first conductive circuit 1031, a metal conductive layer 104 containing copper may be plated on each first conductive circuit 1031.

圖3A是根據本發明另一實施例的顯示裝置用的導電板沿圖1的B-B方向的剖面平面剖視圖。請繼續參照圖1和圖3A,本申請另一實施例中,第一圖案化導電線路層103還具有複數電極墊1033,這些電極墊1033彼此電性隔離且各自形成於發光源電極連接區11的共電極連接分區及單電極連接分區中,用以與發光源的電極連接,且電極墊1033可與透明導電層102接觸,以透過透明導電層102提升散熱效果,各個電極墊1033的材料包含了前述固化後的銀漿、銅漿或銀包銅漿,或者是前述固化後的導電粉末漿料。此外,為了提高各個電極墊1033的導電性及導熱性,可在各個電極墊1033上鍍上一層包含銅的金屬導電層104,金屬導電層104上還可以進一步形成一保護層105,保護層105的材質可以是鎳金、鎳鈀金、錫、銀或有機保銲膜(OSP),用以提高金屬導電層104的抗氧化性及表面黏著(SMT)的焊接性。3A is a cross-sectional plan view of a conductive plate for a display device according to another embodiment of the present invention along the B-B direction of FIG. 1. Please continue to refer to FIGS. 1 and 3A. In another embodiment of the present application, the first patterned conductive circuit layer 103 further has a plurality of electrode pads 1033, and these electrode pads 1033 are electrically isolated from each other and are respectively formed in the light emitting source electrode connection region 11. The common electrode connection zone and the single electrode connection zone are used to connect with the electrode of the light-emitting source, and the electrode pad 1033 can be in contact with the transparent conductive layer 102 to improve the heat dissipation effect through the transparent conductive layer 102. The material of each electrode pad 1033 includes The foregoing cured silver paste, copper paste, or silver-coated copper paste, or the foregoing cured conductive powder paste. In addition, in order to improve the electrical conductivity and thermal conductivity of each electrode pad 1033, a metal conductive layer 104 containing copper can be plated on each electrode pad 1033, and a protective layer 105 can be further formed on the metal conductive layer 104. The material can be nickel gold, nickel palladium gold, tin, silver or organic solder mask (OSP) to improve the oxidation resistance and surface adhesion (SMT) solderability of the metal conductive layer 104.

圖3B是根據本發明再一實施例的顯示裝置用的導電板沿圖1的B-B方向的剖面的平面剖視圖。如圖1及圖3B所示,本申請再一實施例中,不同於圖3A實施例的是,各個電極墊1033上沒有鍍上包含銅的金屬導電層104。取而代之的是,在各個電極墊1033上形成了一層材質包含奈米銀或奈米銅的焊接層106,以利發光源的各個電極在電極墊1033上的固定連接。藉此方式,可以直接以焊接層106與LED燈珠焊接,而不用傳統的錫膏。3B is a plan cross-sectional view of a conductive plate for a display device according to another embodiment of the present invention along the B-B direction of FIG. 1. As shown in FIGS. 1 and 3B, in another embodiment of the present application, which is different from the embodiment in FIG. 3A, each electrode pad 1033 is not plated with a metal conductive layer 104 containing copper. Instead, a solder layer 106 made of nanosilver or nanocopper is formed on each electrode pad 1033 to facilitate the fixed connection of each electrode of the light source on the electrode pad 1033. In this way, the soldering layer 106 can be directly soldered to the LED lamp bead instead of traditional solder paste.

另一實施例中,顯示裝置用的導電板可以不具有透明導電層102,而電極墊1033是直接形成於電性絕緣基板101上且接觸電性絕緣基板101,關於電極墊1033的用途及其餘結構皆與前述相同,不再贅述。In another embodiment, the conductive plate for the display device may not have the transparent conductive layer 102, and the electrode pad 1033 is directly formed on the electrically insulating substrate 101 and contacting the electrically insulating substrate 101. Regarding the use of the electrode pad 1033 and the rest The structure is the same as the foregoing, and will not be repeated.

圖4是根據本發明另一實施例的顯示裝置用的導電板的平面示意圖。如圖4所示,本實施例中,顯示裝置用的導電板20的電性絕緣基板201上形成有透明導電層202、多數個發光源電極連接區21a、21b及21c及第一圖案化導電線路層,透明導電層202與電性絕緣基板201接觸,第一圖案化導電線路層具有多數個第一導電線路2031、多數個共電聯外電連接墊2032以及多數個第一分電聯外電連接墊2034,透明導電層202與電性絕緣基板201接觸。此外,多數個彼此間電性隔離且配置成陣列的發光源電極連接區21a、21b及21c被界定在透明導電層202上。本實施例中,顯示裝置用的導電板更具有多數個共電極連接線211及多數個第一單電極連接線212、213、214。這些共電極連接線211分別自這些發光源電極連接區21a、21b及21c中的共電極連接分區延伸出,而這些第一單電極連接線212、213、214自一部分的發光源電極連接區21a及21b(亦即較靠近電性絕緣基板201的一側邊2011的發光源電極連接區)中的單電極連接分區延伸出。這些共電極連接線211各自連接第一導電線路2031,這些共電聯外電連接墊2032分別連接這些第一導電線路2031,而這些第一分電聯外電連接墊2034分別連接這些第一單電極連接線212、213和214。不同於圖1的是,本實施例的顯示裝置用的導電板20還具有一透明絕緣層22及一第二圖案化導電線路層23。透明絕緣層22位於電性絕緣基板201上方,例如形成於透明導電層202的一部分區域上。第二圖案化導電線路層23形成於電性絕緣基板201上方,具有複數第二單電極連接線232、233及234,這些第二單電極連接線232、233及234分別自另一部分的發光源電極連接區21c(亦即較遠離電性絕緣基板201的一側邊2011的發光源電極連接區)中的單電極連接區延伸出,一部分的這些第二單電極連接線232、233及234和一部分的這些第一單電極連接線212、213和214被透明絕緣層22隔開而彼此電性絕緣。此外,第二圖案化導電線路層23還包含了複數第二分電聯外電連接墊235,這些第二分電聯外電連接墊235分別連接這些第二單電極連接線232、233及234,這些第二分電聯外電連接墊235和這些第一分電聯外電連接墊2034彼此間隔開地設置於電性絕緣基板201的靠近一側邊2011的鄰近表面上,這些第二分電聯外電連接墊235的排列方向平行於這些第一分電聯外連接墊2034的排列方向。如此一來,顯示裝置用的導電板20上的單電極連接線及分電聯外電連接墊可進行雙層跨接,進而提升發光源電極連接區11的配置密度,增加顯示面板的可用像素。4 is a schematic plan view of a conductive plate for a display device according to another embodiment of the invention. As shown in FIG. 4, in this embodiment, a transparent conductive layer 202, a plurality of light-emitting source electrode connection regions 21a, 21b, and 21c, and a first patterned conductive layer are formed on the electrically insulating substrate 201 of the conductive plate 20 for the display device. The circuit layer, the transparent conductive layer 202 is in contact with the electrically insulating substrate 201, the first patterned conductive circuit layer has a plurality of first conductive circuits 2031, a plurality of common electrical connection external electrical connection pads 2032, and a plurality of first electrical connection external electrical connections The pad 2034 and the transparent conductive layer 202 are in contact with the electrically insulating substrate 201. In addition, a plurality of light-emitting source electrode connection regions 21a, 21b, and 21c electrically isolated from each other and arranged in an array are defined on the transparent conductive layer 202. In this embodiment, the conductive plate for the display device further has a plurality of common electrode connecting wires 211 and a plurality of first single electrode connecting wires 212, 213, and 214. The common electrode connection lines 211 respectively extend from the common electrode connection regions in the light emitting source electrode connection areas 21a, 21b, and 21c, and the first single electrode connection lines 212, 213, 214 extend from a part of the light emitting source electrode connection area 21a. And 21b (that is, the light-emitting source electrode connection area closer to the side 2011 of the electrically insulating substrate 201), the single-electrode connection area extends out. The common electrode connecting wires 211 are respectively connected to the first conductive lines 2031, the common electrical connection external electrical connection pads 2032 are respectively connected to the first conductive circuits 2031, and the first electrical branch electrical connection pads 2034 are respectively connected to the first single electrode connections. Lines 212, 213, and 214. Different from FIG. 1, the conductive plate 20 for the display device of this embodiment further has a transparent insulating layer 22 and a second patterned conductive circuit layer 23. The transparent insulating layer 22 is located above the electrically insulating substrate 201, for example, is formed on a part of the transparent conductive layer 202. The second patterned conductive circuit layer 23 is formed on the electrically insulating substrate 201, and has a plurality of second single-electrode connecting lines 232, 233, and 234. These second single-electrode connecting lines 232, 233, and 234 respectively originate from another part of the light-emitting source The single electrode connection area in the electrode connection area 21c (that is, the light emitting source electrode connection area on the side 2011 farther from the electrically insulating substrate 201) extends, and a part of these second single electrode connection lines 232, 233 and 234 and A part of these first single electrode connecting lines 212, 213, and 214 are separated by the transparent insulating layer 22 and electrically insulated from each other. In addition, the second patterned conductive circuit layer 23 also includes a plurality of second electrical connection pads 235 of the second power distribution connection, which are connected to the second single electrode connection lines 232, 233, and 234, respectively. The second electrical connection pads 235 and the first electrical connection pads 2034 are arranged on the adjacent surface of the electrically insulating substrate 201 close to the side 2011 at a distance from each other. These second electrical connections are The arrangement direction of the pads 235 is parallel to the arrangement direction of the first connection pads 2034. In this way, the single-electrode connection wires and the external electrical connection pads on the conductive plate 20 for the display device can be double-layered, thereby increasing the configuration density of the light-emitting source electrode connection area 11 and increasing the usable pixels of the display panel.

一實施例中,透明絕緣層22可以利用網版印刷、噴塗或貼膜的方式形成在一部分的這些第一單電極連接線212、213和214的上方及位於一部分的這些第二單電極連接線232、233及234的下方。此外,被透明絕緣層22隔開的一部分的第二單電極連接線232、233及234和一部份的第一單電極連接線212、213和214是位於兩相鄰列的發光源電極連接區之間。換言之,任兩相鄰的發光源電極連接區列之間,因不具有發光源電極連接區,而可以作為第一單電極連接線和第二單電極連接線的單層或雙層配置空間。一實施例中,這些第一單電極連接線212、213和214可以為經由切割透明導電層202所形成的複數溝槽電性隔離的透明導電線,複數溝槽可用雷射蝕刻方式形成,而這些第二單電極連接線232、233及234可以為進一步在被複數溝槽隔離的透明導電線上形成的固化後的銀漿、銅漿或銀包銅漿,或者是固化後的前述導電粉末漿料,或者是利用網版印刷或噴塗的方式形成第二圖案化導電線路層23,依此方式形成的第二圖案化導電線路層23的第二單電極連接線232、233和234的材質例如是奈米銀絲、奈米碳管或導電高分子(PEDOT)。In an embodiment, the transparent insulating layer 22 may be formed on a part of the first single electrode connecting lines 212, 213, and 214 and a part of the second single electrode connecting lines 232 by means of screen printing, spraying or filming. , 233 and 234 below. In addition, a part of the second single-electrode connecting lines 232, 233, and 234 separated by the transparent insulating layer 22 and a part of the first single-electrode connecting lines 212, 213, and 214 are connected to the light-emitting source electrodes in two adjacent columns. Between districts. In other words, between any two adjacent light-emitting source electrode connection region columns, since there is no light-emitting source electrode connection region, it can be used as a single-layer or double-layer configuration space for the first single electrode connection line and the second single electrode connection line. In an embodiment, the first single-electrode connection lines 212, 213, and 214 may be transparent conductive lines electrically isolated by a plurality of grooves formed by cutting the transparent conductive layer 202, and the plurality of grooves may be formed by laser etching, and These second single-electrode connection lines 232, 233, and 234 may be cured silver paste, copper paste, or silver-coated copper paste formed on transparent conductive lines separated by a plurality of trenches, or the foregoing conductive powder paste after curing The second patterned conductive circuit layer 23 is formed by screen printing or spraying. The material of the second single electrode connecting lines 232, 233 and 234 of the second patterned conductive circuit layer 23 formed in this way is, for example, It is silver nanowire, carbon nanotube or conductive polymer (PEDOT).

另一實施例中,可改利用濺鍍或蒸鍍的方式在為透明導電線的第一單電極連接線212、213和214上形成透明絕緣層22,以及利用濺鍍或蒸鍍鍍膜和雷射蝕刻的方式在透明絕緣層22上形成一部分的第二圖案化導電線路層23,依此方式形成的此部分的第二圖案化導電線路層23的第二單電極連接線232、233和234的材質例如是氧化銦錫(ITO)膜、氟摻雜氧化錫(FTO)膜、氧化鋅(ZnO)膜或氧化鋁鋅(AZO)膜等透明導電材料。In another embodiment, the transparent insulating layer 22 can be formed on the first single-electrode connecting wires 212, 213, and 214 that are transparent conductive wires by sputtering or evaporation instead, and the sputtering or evaporation film and lightning A part of the second patterned conductive circuit layer 23 is formed on the transparent insulating layer 22 by shooting etching, and the second single electrode connecting lines 232, 233, and 234 of this part of the second patterned conductive circuit layer 23 are formed in this way The material of is, for example, transparent conductive materials such as indium tin oxide (ITO) film, fluorine-doped tin oxide (FTO) film, zinc oxide (ZnO) film, or aluminum oxide zinc (AZO) film.

另一實施例中,顯示裝置用的導電板20可以不具有透明導電層202,而第一單電極連接線212、213和214的材料可以是固化後的銀漿、銅漿或銀包銅漿,或者是固化後的前述導電粉末漿料,第一單電極連接線212、213和214直接形成於電性絕緣基板201上且接觸電性絕緣基板201,透明絕緣層22位於一部分的這些第一單電極連接線212、213和214及一部分的這些第二單電極連接線232、233及234之間。本實施例的第一單電極連接線212、213和214的用途及其餘結構皆與前述實施例相同,不再贅述。In another embodiment, the conductive plate 20 for the display device may not have the transparent conductive layer 202, and the material of the first single electrode connecting wires 212, 213, and 214 may be cured silver paste, copper paste or silver-coated copper paste , Or the aforementioned conductive powder paste after curing, the first single-electrode connecting wires 212, 213, and 214 are directly formed on the electrically insulating substrate 201 and contact the electrically insulating substrate 201. The transparent insulating layer 22 is located in a part of these first Between the single-electrode connection lines 212, 213, and 214 and a part of these second single-electrode connection lines 232, 233, and 234. The usage and other structures of the first single-electrode connecting wires 212, 213, and 214 in this embodiment are the same as those in the previous embodiment, and will not be repeated.

圖5是根據本發明一實施例的顯示裝置用的導電板的對外電連接軟板的平面示意圖。請參照圖5,對外電連接軟板(FPC)或排線13上的靠近一側邊130a的鄰近表面上設置有兩行間隔的電連接墊131和132,且同一行的電連接墊131或132彼此對齊,不同行的電連接墊131和132彼此不對齊而成錯開的配置方式。依此配置方式,自電連接墊131引出至另一側邊130b的導線1311和自電連接墊132引出至另一側邊130b的導線1321不會相交,可以避免導線1311和導線1321之間的短路。一實施例中,當圖4中的雙層跨接的第一分電聯外電連接墊2034及第二分電聯外電連接墊235的位置如同圖5的電連接墊131和132呈同行彼此對齊及不同行彼此錯開配置時,圖5所示的單層不跨接的對外電連接軟板13可用來對應連接圖4所示的顯示裝置用的導電板20上的雙層跨接的第一分電聯外電連接墊2034及第二分電聯外電連接墊235。FIG. 5 is a schematic plan view of the external electrical connection soft board of the conductive plate for the display device according to an embodiment of the present invention. Referring to FIG. 5, two rows of spaced apart electrical connection pads 131 and 132 are provided on the adjacent surface of the external electrical connection soft board (FPC) or cable 13 near one side 130a, and the same row of electrical connection pads 131 or 132 are aligned with each other, and the electrical connection pads 131 and 132 in different rows are not aligned with each other to form a staggered configuration. According to this configuration, the wires 1311 drawn from the electrical connection pad 131 to the other side 130b and the wires 1321 drawn from the electrical connection pad 132 to the other side 130b will not intersect, which can prevent the wire 1311 and the wire 1321 from intersecting. Short circuit. In one embodiment, when the first electrical connection pad 2034 and the second electrical connection pad 235 of the double-layer bridge in FIG. 4 are aligned with each other in the same row as the electrical connection pads 131 and 132 of FIG. 5 And when the different rows are staggered to each other, the single-layer non-bridging external electrical connection soft board 13 shown in FIG. 5 can be used to connect the first double-layer bridging on the conductive plate 20 of the display device shown in FIG. The external electrical connection pad 2034 of the distribution connection and the second external electrical connection pad 235 of the distribution connection.

圖6是根據本發明另一實施例的顯示裝置用的導電板的對外電連接軟板的平面示意圖。請參照圖6,對外電連接軟板(FPC)或排線14上的靠近一側邊140a的表面上設置有兩行間隔的電連接墊141和142,且同一行的電連接墊141或142彼此對齊,不同行的電連接墊141和142亦彼此對齊。依此配置方式,為了避免電連接墊141引出至另一側邊140b的導線1411和電連接墊142引出至另一側邊140b的導線1421互相碰觸而形成短路,可以在導線1421形成後,先在包含所有導線1421的一部份路徑的一局部區域上形成一電絕緣層300,再讓電連接墊141引出的導線1411行經電絕緣層300所覆蓋的局部區域後到達另一側邊140b。因此,另一實施例中,當圖4中的雙層跨接的第一分電聯外電連接墊2034及第二分電聯外電連接墊235的位置如同圖6的電連接墊141和142呈同行及不同行皆彼此對齊配置時,圖6所示的雙層跨接的對外電連接軟板14可用來對應連接圖4所示的顯示裝置用的導電板20上的雙層跨接的第一分電聯外電連接墊2034及第二分電聯外電連接墊235。FIG. 6 is a schematic plan view of a flexible board for external electrical connection of a conductive plate for a display device according to another embodiment of the present invention. Referring to FIG. 6, two rows of spaced apart electrical connection pads 141 and 142 are provided on the external electrical connection soft board (FPC) or the surface of the cable 14 near one side 140a, and the same row of electrical connection pads 141 or 142 Aligned with each other, the electrical connection pads 141 and 142 in different rows are also aligned with each other. According to this arrangement, in order to prevent the wire 1411 from the electrical connection pad 141 leading to the other side 140b and the wire 1421 from the electrical connection pad 142 leading to the other side 140b from contacting each other and forming a short circuit, the wires 1421 can be formed after the wires 1421 are formed. First, an electrical insulation layer 300 is formed on a partial area including a partial path of all the wires 1421, and then the wires 1411 drawn from the electrical connection pad 141 pass through the partial area covered by the electrical insulation layer 300 and reach the other side 140b . Therefore, in another embodiment, when the positions of the first crossover external electrical connection pad 2034 and the second crossover external electrical connection pad 235 in FIG. 4 are the same as the electrical connection pads 141 and 142 of FIG. 6 When the same row and different rows are aligned with each other, the double-layer jumper external electrical connection soft board 14 shown in FIG. 6 can be used to connect the second layer of the double-layer jumper on the conductive plate 20 for the display device shown in FIG. One sub-connection external electrical connection pad 2034 and a second sub-connection external electrical connection pad 235.

圖7是根據本發明又一實施例的顯示裝置用的導電板的對外電連接軟板的平面示意圖。請參照圖7,對外電連接軟板(FPC)或排線15上的靠近一側邊150a的表面上設置有兩行間隔的電連接墊151和152,且同一行的電連接墊151或152彼此對齊,不同行的電連接墊151和152亦彼此對齊。依此配置方式,為了避免電連接墊151引出至另一側邊150b的導線1511和電連接墊152引出至另一側邊150b的導線1521互相碰觸而形成短路,可以在導線1511形成後,先在包含所有導線1511的一部份路徑的一局部區域上形成一電絕緣層400,再讓電連接墊152引出的導線1521行經電絕緣層400所覆蓋的局部區域後到達另一側邊150b。因此,又一實施例中,當圖4中的雙層跨接的第一分電聯外電連接墊2034及第二分電聯外電連接墊235的位置如同圖7的電連接墊151和152呈同行及不同行皆彼此對齊配置時,圖7所示的雙層跨接的對外電連接軟板15可用來對應連接圖4所示的顯示裝置用的導電板20上的雙層跨接的第一分電聯外電連接墊2034及第二分電聯外電連接墊235。FIG. 7 is a schematic plan view of a flexible board for external electrical connection of a conductive plate for a display device according to another embodiment of the present invention. Referring to FIG. 7, two rows of spaced electrical connection pads 151 and 152 are provided on the external electrical connection soft board (FPC) or the surface of the cable 15 near one side 150a, and the same row of electrical connection pads 151 or 152 Aligned with each other, the electrical connection pads 151 and 152 in different rows are also aligned with each other. According to this configuration, in order to prevent the wires 1511 from the electrical connection pad 151 leading to the other side 150b and the wires 1521 from the electrical connection pad 152 leading to the other side 150b from touching each other and forming a short circuit, the wires 1511 can be formed after the wires 1511 are formed. First, an electrical insulation layer 400 is formed on a partial area including a partial path of all the wires 1511, and then the wires 1521 drawn from the electrical connection pads 152 travel through the partial area covered by the electrical insulation layer 400 and reach the other side 150b . Therefore, in another embodiment, when the positions of the first electrical connection pad 2034 and the second electrical connection pad 235 of the double-layer jumper in FIG. 4 are the same as the electrical connection pads 151 and 152 of FIG. When the same row and different rows are aligned with each other, the double-layer jumper external electrical connection soft board 15 shown in FIG. 7 can be used to connect the second layer of the double-layer jumper on the conductive plate 20 for the display device shown in FIG. One sub-connection external electrical connection pad 2034 and a second sub-connection external electrical connection pad 235.

以上所述僅為本發明的較佳實施例,並非用以限定本發明。文中所述及的圖案化導電線路層是指在一基板上所形成的具有特定導電線路圖案的層狀結構,形成圖案化導電線路層的方式包括但不限於網版印刷、噴印、貼膜、噴塗、濺鍍成膜或蒸鍍成膜後雷射蝕刻。只要所形成的導電線路層具有特定導電線路圖案,均可稱為圖案化導電線路層,本發明不在此限制其形成方式。依本發明各實施例所提出的顯示裝置用的導電板,相較於傳統的LED導電板,其上形成的圖案化導線具有高緻密性、高導電性、高導熱性的特點,提升LED顯示效能,同時具有製程時間短的優點,適於大量生產而能降低製造成本。此外,以上的描述對於本發明所屬技術領域中具有通常知識者,應可明瞭而據以實施。只要不脫離本發明的精神和後附申請專利範圍,任何依據上述實施例所作的等效變更與調整,均視為包含於本發明的申請專利範圍中。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. The patterned conductive circuit layer mentioned in the text refers to a layered structure with a specific conductive circuit pattern formed on a substrate. The methods for forming the patterned conductive circuit layer include but are not limited to screen printing, spray printing, filming, Laser etching after spraying, sputtering or evaporation. As long as the formed conductive circuit layer has a specific conductive circuit pattern, it can be called a patterned conductive circuit layer, and the present invention does not limit its formation method here. Compared with the traditional LED conductive plate, the conductive plate for the display device proposed according to the embodiments of the present invention has the characteristics of high density, high electrical conductivity, and high thermal conductivity, which improves the LED display. Efficiency, while having the advantages of short process time, suitable for mass production and can reduce manufacturing costs. In addition, the above description should be clear to those with ordinary knowledge in the technical field to which the present invention pertains and implemented accordingly. As long as it does not deviate from the spirit of the present invention and the scope of the attached patent application, any equivalent changes and adjustments made according to the above-mentioned embodiments are deemed to be included in the scope of the present invention.

10:顯示裝置用的導電板 101:電性絕緣基板 1011:側邊 102:透明導電層 1021:溝槽 103:第一圖案化導電線路層 1031:第一導電線路 1032:共電聯外電連接墊 1033:電極墊 104:金屬導電層 105:保護層 106:焊接層 11:發光源電極連接區 111:電極連接線 112:電極連接線 113:電極連接線 114:電極連接線 12:外部控制裝置 13:對外電連接軟板 130a:側邊 130b:側邊 131:電連接墊 1311:導線 132:電連接墊 1321:導線 14:對外電連接軟板 140a:側邊 140b:側邊 141:電連接墊 1411:導線 142:電連接墊 1421:導線 15:對外電連接軟板 150a:側邊 150b:側邊 151:電連接墊 1511:導線 152:電連接墊 1521:導線 20:顯示裝置用的導電板 201:電性絕緣基板 2011:側邊 202:透明導電層 2031:第一導電線路 2032:共電聯外電連接墊 2034:第一分電聯外電連接墊 21a:發光源電極連接區 21b:發光源電極連接區 21c:發光源電極連接區 211:共電極連接線 212:第一單電極連接線 213:第一單電極連接線 214:第一單電極連接線 22:透明絕緣層 23:第二圖案化導電線路層 232:第二單電極連接線 233:第二單電極連接線 234:第二單電極連接線 235:第二分電聯外電連接墊 300:電絕緣層 400:電絕緣層 10: Conductive plate for display device 101: Electrically insulating substrate 1011: side 102: Transparent conductive layer 1021: Groove 103: The first patterned conductive circuit layer 1031: The first conductive circuit 1032: Common electrical connection external electrical connection pad 1033: Electrode pad 104: Metal conductive layer 105: Protective layer 106: Welding layer 11: Luminous source electrode connection area 111: Electrode connection line 112: Electrode connection line 113: Electrode connection line 114: Electrode connection line 12: External control device 13: External electrical connection soft board 130a: side 130b: side 131: Electrical connection pad 1311: Wire 132: Electrical connection pad 1321: Wire 14: External electrical connection soft board 140a: side 140b: side 141: Electrical connection pad 1411: Wire 142: Electrical connection pad 1421: Wire 15: External electrical connection soft board 150a: side 150b: side 151: Electrical connection pad 1511: Wire 152: Electrical connection pad 1521: Wire 20: Conductive plate for display device 201: Electrically insulating substrate 2011: side 202: Transparent conductive layer 2031: The first conductive circuit 2032: Common electrical connection external electrical connection pad 2034: External electrical connection pad of the first sub-connection 21a: Light-emitting source electrode connection area 21b: Light-emitting source electrode connection area 21c: Light-emitting source electrode connection area 211: Common electrode connection line 212: The first single electrode connection line 213: The first single electrode connection line 214: The first single electrode connection line 22: Transparent insulating layer 23: The second patterned conductive circuit layer 232: The second single electrode connection line 233: The second single electrode connection line 234: The second single electrode connection line 235: External electrical connection pad of the second sub-connection 300: Electrical insulation layer 400: Electrical insulation layer

圖1是根據本發明一實施例的顯示裝置用的導電板的局部區域的一平面示意圖。 圖2是根據本發明一實施例的顯示裝置用的導電板沿圖1的A-A方向的剖面的平面剖視圖。 圖3A是根據本發明另一實施例的顯示裝置用的導電板沿圖1的B-B方向的剖面平面剖視圖。 圖3B是根據本發明再一實施例的顯示裝置用的導電板沿圖1的B-B方向的剖面的平面剖視圖。 圖4是根據本發明另一實施例的顯示裝置用的導電板的平面示意圖。 圖5是根據本發明一實施例的顯示裝置用的導電板的對外電連接軟板的平面示意圖。 圖6是根據本發明另一實施例的顯示裝置用的導電板的對外電連接軟板的平面示意圖。 圖7是根據本發明又一實施例的顯示裝置用的導電板的對外電連接軟板的平面示意圖。FIG. 1 is a schematic plan view of a partial area of a conductive plate for a display device according to an embodiment of the invention. 2 is a plan cross-sectional view of a conductive plate for a display device according to an embodiment of the present invention taken along the A-A direction of FIG. 1. 3A is a cross-sectional plan view of a conductive plate for a display device according to another embodiment of the present invention along the B-B direction of FIG. 1. 3B is a plan cross-sectional view of a conductive plate for a display device according to still another embodiment of the present invention along the B-B direction of FIG. 1. 4 is a schematic plan view of a conductive plate for a display device according to another embodiment of the invention. FIG. 5 is a schematic plan view of the external electrical connection soft board of the conductive plate for the display device according to an embodiment of the present invention. 6 is a schematic plan view of a flexible board for external electrical connection of a conductive plate for a display device according to another embodiment of the present invention. FIG. 7 is a schematic plan view of a flexible board for external electrical connection of a conductive plate for a display device according to another embodiment of the present invention.

10:顯示裝置用的導電板 10: Conductive plate for display device

101:電性絕緣基板 101: Electrically insulating substrate

102:透明導電層 102: Transparent conductive layer

1021:溝槽 1021: groove

1031:第一導電線路 1031: The first conductive circuit

104:金屬導電層 104: Metal conductive layer

Claims (11)

一種顯示裝置用的導電板,包含: 一電性絕緣基板; 複數發光源電極連接區,形成於該電性絕緣基板的上方,彼此間電性隔離且配置成陣列,各個該些發光源電極連接區供一外部控制裝置電連接用且供一發光源的一共電極及複數單電極電連接用,各個該些發光源電極連接區中具有一供該發光源的該共電極對應電連接的共電極連接分區及複數分別供該發光源的該些單電極對應電連接的單電極連接分區;及 一第一圖案化導電線路層,形成於該電性絕緣基板的上方且至少具有複數第一導電線路,各個該第一導電線路和位於同一列的該些發光源電極連接區中的該共電極連接分區電連接,且該第一圖案化導電線路層包含粒徑小於200微米的一選自於由銅、銀、鎳、銀包銅及碳所組成的群組的導電粉末顆粒。A conductive plate for a display device, including: An electrically insulating substrate; A plurality of light-emitting source electrode connection areas are formed above the electrically insulating substrate, electrically isolated from each other and arranged in an array, each of the light-emitting source electrode connection areas is used for electrical connection of an external control device and a common light source Electrodes and a plurality of single electrodes are used for electrical connection, each of the light-emitting source electrode connection areas has a common electrode connection area for the common electrode of the light-emitting source to be electrically connected, and a plurality of light-emitting source corresponding to the single electrodes. Connected single electrode connection zone; and A first patterned conductive circuit layer is formed on the electrically insulating substrate and has at least a plurality of first conductive circuits, each of the first conductive circuit and the common electrode in the light-emitting source electrode connection regions in the same column The connection partitions are electrically connected, and the first patterned conductive circuit layer includes a conductive powder particle selected from the group consisting of copper, silver, nickel, silver-coated copper and carbon with a particle size of less than 200 microns. 根據申請專利範圍第1項所述的顯示裝置用的導電板,其中該第一圖案化導電線路層還具有複數彼此間電性隔離的電極墊,該些電極墊各自形成於該些發光源電極連接區的該共電極連接分區及該些單電極連接分區中,且該顯示裝置用的導電板更包含: 一金屬導電層,形成於各個該些電極墊上,該金屬導電層的材質包含銅。The conductive plate for a display device according to the first item of the scope of patent application, wherein the first patterned conductive circuit layer further has a plurality of electrode pads electrically isolated from each other, and the electrode pads are respectively formed on the light-emitting source electrodes In the common electrode connection area and the single electrode connection area of the connection area, and the conductive plate for the display device further includes: A conductive metal layer is formed on each of the electrode pads, and the material of the conductive metal layer includes copper. 根據申請專利範圍第2項所述的顯示裝置用的導電板,更包含: 一保護層,形成於該金屬導電層上,該保護層的材質包含鎳金、鎳鈀金、錫、銀及有機保銲膜(OSP)其中之一。According to the second item of the scope of patent application, the conductive plate for the display device further includes: A protective layer is formed on the metal conductive layer. The material of the protective layer includes one of nickel-gold, nickel-palladium-gold, tin, silver, and organic solder mask (OSP). 根據申請專利範圍第1項所述的顯示裝置用的導電板,其中該第一圖案化導電線路層還具有複數彼此電性隔離的電極墊,該些電極墊各自形成於該些發光源電極連接區的該共電極連接分區及該些單電極連接分區中,且該顯示裝置用的導電板更包含: 一焊接層,形成於各個該些電極墊上,該焊接層的材質包含奈米銀及奈米銅其中之一。The conductive plate for a display device according to the first item of the scope of patent application, wherein the first patterned conductive circuit layer further has a plurality of electrode pads electrically isolated from each other, and the electrode pads are respectively formed on the light emitting source electrode connection The common electrode connection zone and the single electrode connection zones of the region, and the conductive plate for the display device further includes: A soldering layer is formed on each of the electrode pads, and the material of the soldering layer includes one of nano-silver and nano-copper. 根據申請專利範圍第1項所述的顯示裝置用的導電板,更包含: 複數第一單電極連接線,該些第一單電極連接線分別自一部分的該些發光源電極連接區中的該些單電極連接分區延伸出; 一透明絕緣層,位於該電性絕緣基板的上方;及 一第二圖案化導電線路層,形成於該電性絕緣基板的上方,具有複數第二單電極連接線,該些第二單電極連接線分別自另一部分的該些發光源電極連接區中的該些單電極連接分區延伸出,一部分的該些第二單電極連接線和一部分的該些第一單電極連接線被該透明絕緣層隔開而彼此電性絕緣。According to the first item of the scope of patent application, the conductive plate for the display device further includes: A plurality of first single-electrode connection lines, the first single-electrode connection lines respectively extend from the single-electrode connection zones in a part of the light-emitting source electrode connection areas; A transparent insulating layer located above the electrically insulating substrate; and A second patterned conductive circuit layer is formed on the electrically insulating substrate, and has a plurality of second single electrode connecting lines, and the second single electrode connecting lines are from another part of the light emitting source electrode connecting regions. The single-electrode connection partitions extend, and a part of the second single-electrode connecting lines and a part of the first single-electrode connecting lines are separated by the transparent insulating layer and electrically insulated from each other. 根據申請專利範圍第5項所述的顯示裝置用的導電板,其中該第一圖案化導電線路層還具有複數分別連接該些第一單電極連接線的第一分電聯外電連接墊,且該第二圖案化導電線路層還具有複數分別連接該些第二單電極連接線的第二分電聯外電連接墊,該些第二分電聯外電連接墊與該些第一分電聯外電連接墊彼此間隔開地設置於該電性絕緣基板的靠近一側邊的鄰近表面上方,該些第二分電聯外電連接墊的排列方向平行於該些第一分電聯外電連接墊的排列方向。The conductive plate for a display device according to item 5 of the scope of patent application, wherein the first patterned conductive circuit layer further has a plurality of first electrical connection pads connected to the first single-electrode connection lines, and The second patterned conductive circuit layer also has a plurality of second power distribution connection external electrical connection pads respectively connected to the second single-electrode connection lines, the second power distribution connection external electrical connection pads and the first power distribution connection external electrical connection pads. The connection pads are arranged above the adjacent surface of the electrically insulating substrate close to one side at a distance from each other, and the arrangement direction of the second power distribution connection external electrical connection pads is parallel to the arrangement of the first power distribution connection external electrical connection pads direction. 根據申請專利範圍第5項所述的顯示裝置用的導電板,其中被該透明絕緣層隔開的該部分的該些第二單電極連接線和該部份的該些第一單電極連接線位於兩相鄰列的該些發光源電極連接區之間。The conductive plate for a display device according to item 5 of the scope of patent application, wherein the part of the second single-electrode connecting lines separated by the transparent insulating layer and the part of the first single-electrode connecting lines Located between the light-emitting source electrode connection areas in two adjacent rows. 根據申請專利範圍第5項所述的顯示裝置用的導電板,其中該些第二單電極連接線的材質包含奈米銀絲、奈米碳管、導電高分子、氧化銦錫(ITO)、氟摻雜氧化錫(FTO)、氧化鋅(ZnO)及氧化鋁鋅(AZO)其中之一。According to item 5 of the scope of patent application, the conductive plate for the display device, wherein the material of the second single electrode connecting wires includes silver nanowire, carbon nanotube, conductive polymer, indium tin oxide (ITO), One of fluorine-doped tin oxide (FTO), zinc oxide (ZnO) and aluminum zinc oxide (AZO). 根據申請專利範圍第1項所述的顯示裝置用的導電板,其中該第一圖案化導電線路層的材質還包含一選自於由甲醛、尿素、三聚氰胺、苯代三聚氰胺及醇類化合物所構成的群組的物質及一選自於由熱塑性聚氨酯(TPU)、環氧樹脂、聚甲基丙烯酸甲酯(PMMA)及乙基纖維素所構成的群組的物質。The conductive plate for a display device according to item 1 of the scope of patent application, wherein the material of the first patterned conductive circuit layer further includes a material selected from the group consisting of formaldehyde, urea, melamine, benzo-melamine and alcohol compounds A substance in the group of and a substance selected from the group consisting of thermoplastic polyurethane (TPU), epoxy resin, polymethyl methacrylate (PMMA) and ethyl cellulose. 根據申請專利範圍第1項所述的顯示裝置用的導電板,其中該電性絕緣基板為透明基板。According to the first item of the scope of patent application, the conductive plate for a display device, wherein the electrically insulating substrate is a transparent substrate. 一種顯示裝置用的導電板,包含: 一電性絕緣基板; 一透明導電層,形成於該電性絕緣基板的上方且與該電性絕緣基板接觸; 複數發光源電極連接區,位於該透明導電層的上方,彼此電性隔離且配置成陣列,各個該些發光源電極連接區供一外部控制裝置電連接用且供一發光源的一共電極及複數單電極電連接用,各個該些發光源電極連接區中具有一供該發光源的該共電極對應電連接的共電極連接分區及複數分別供該發光源的該些單電極對應電連接的單電極連接分區;及 一圖案化導電線路層,形成於該透明導電層的上方且與該透明導電層接觸,該圖案化導電線路層至少具有複數導電線路,各個該些導電線路和位於同一列的該些發光源電極連接區各自具有的該共電極連接分區電連接,且該圖案化導電線路層包含粒徑小於200微米的導電粉末顆粒。A conductive plate for a display device, including: An electrically insulating substrate; A transparent conductive layer formed on the electrically insulating substrate and in contact with the electrically insulating substrate; A plurality of light-emitting source electrode connection areas are located above the transparent conductive layer, electrically isolated from each other and arranged in an array. Each of the light-emitting source electrode connection areas is used for electrical connection of an external control device and provides a common electrode and a plurality of light-emitting sources. For electrical connection of a single electrode, each of the light-emitting source electrode connection areas has a common electrode connection area for electrical connection of the common electrode of the light-emitting source and a plurality of single electrodes for electrical connection of the single electrode of the light-emitting source. Electrode connection zone; and A patterned conductive circuit layer is formed above the transparent conductive layer and is in contact with the transparent conductive layer, the patterned conductive circuit layer has at least a plurality of conductive circuits, each of the conductive circuits and the light-emitting source electrodes in the same column The common electrode connection partitions in each connection area are electrically connected, and the patterned conductive circuit layer contains conductive powder particles with a particle size of less than 200 microns.
TW108125284A 2019-01-15 2019-07-17 Conductive board for a display device TWI711352B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962792575P 2019-01-15 2019-01-15
US62/792,575 2019-01-15

Publications (2)

Publication Number Publication Date
TW202029850A TW202029850A (en) 2020-08-01
TWI711352B true TWI711352B (en) 2020-11-21

Family

ID=71580108

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108125284A TWI711352B (en) 2019-01-15 2019-07-17 Conductive board for a display device

Country Status (2)

Country Link
CN (1) CN111435697B (en)
TW (1) TWI711352B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102945845A (en) * 2012-11-13 2013-02-27 佛山市国星光电股份有限公司 LED (Light Emitting Diode) device for display screen and display module
CN103313509A (en) * 2013-04-24 2013-09-18 上舜电子科技(中国)有限公司 Metal-based conducting circuit board and manufacturing method thereof
US20160320655A1 (en) * 2012-03-20 2016-11-03 Apple Inc. Electronic Device with Inverted Liquid Crystal Display
TW201710854A (en) * 2015-09-07 2017-03-16 宸盛光電有限公司 Touch panel and fabrication method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100662557B1 (en) * 2005-11-15 2006-12-28 삼성전자주식회사 Display device and manufacturing method of the same
CN102142396B (en) * 2011-03-02 2013-09-18 深超光电(深圳)有限公司 Fringe electric field type liquid crystal display array substrate and manufacture method thereof
TWI467528B (en) * 2013-10-30 2015-01-01 Au Optronics Corp Light emitting diode display panel and method of fabricating the same
TWI553837B (en) * 2014-06-17 2016-10-11 友達光電股份有限公司 Method for fabricating display panel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160320655A1 (en) * 2012-03-20 2016-11-03 Apple Inc. Electronic Device with Inverted Liquid Crystal Display
CN102945845A (en) * 2012-11-13 2013-02-27 佛山市国星光电股份有限公司 LED (Light Emitting Diode) device for display screen and display module
CN103313509A (en) * 2013-04-24 2013-09-18 上舜电子科技(中国)有限公司 Metal-based conducting circuit board and manufacturing method thereof
TW201710854A (en) * 2015-09-07 2017-03-16 宸盛光電有限公司 Touch panel and fabrication method thereof

Also Published As

Publication number Publication date
CN111435697B (en) 2024-07-30
TW202029850A (en) 2020-08-01
CN111435697A (en) 2020-07-21

Similar Documents

Publication Publication Date Title
US11538972B2 (en) Light-emitting unit and manufacturing method of light-emitting unit
KR20220025653A (en) Light-emitting display unit and display apparatus
US20140034981A1 (en) Light emitting diode structure
JP2009010204A (en) Light emitting device
US10492300B2 (en) Light-emitting module
CN109244263B (en) Lighting device using organic light emitting diode
CN108369980A (en) Light emitting module
JP2021516415A (en) Flexible LED light bar
CN104081548A (en) Light emission device and illumination device
CN100420049C (en) Baseboard structure of luminous diode module
CN103199173A (en) Light emitting diode chip, packaging substrate, packaging structure and manufacturing method thereof
TW202224230A (en) Light emitting display device and method of manufacturing the same
TWI711352B (en) Conductive board for a display device
KR102258524B1 (en) A method for manufacturing the electronic device using microled
TWI801648B (en) Conductive substrate of a display device
US20200302858A1 (en) Conductive substrate of a display device
EP2095434B1 (en) Led-based lighting device on a transparent substrate
US11276808B2 (en) Conductive substrate for a display device
CN220324478U (en) Luminous backboard
CN220651029U (en) Liquid crystal display module
TWI811451B (en) Conductive substrate for a display device
CN103733370A (en) Organic light-emitting element and light-emitting device including same
CN114868077B (en) Driving backboard, manufacturing method thereof and display module
KR101037325B1 (en) Metal base board for led lighting device and method for fabricating the same
TWI254466B (en) Substrate structure of LED module