TWI776021B - Processing device - Google Patents

Abstract

Provided is a machining apparatus that does not confuse the correction of the deviation of the cutting path and the deviation of the machining groove including the cutting groove and the dividing groove. A processing device (12) at least provided with: holding means (14) for holding the wafer (2); and processing means (16) for dicing the wafer (2) held by the holding means (14) in the dicing lane (4) A processing groove (54) is formed; and X-axis feeding means for processing and feeding the holding means (14) and processing means (16) in the X-axis direction opposite to each other; and Y-axis feeding means for connecting the holding means (14) and the processing means ( 16) Relatively indexed feeding in the Y-axis direction orthogonal to the X-axis direction; and photographing means (18) having a microscope (36) for photographing a wafer (36) held by the holding means (14) 2) It is provided with a reference line (L) for detecting the cutting line (4) and the processing groove (54); and a display means (20). In the display means (20), it is displayed: an image display part (38), which displays the image captured by the photographing means (18); (L) The deviation is stored as a correction value; and the machining groove correction button (42) is used to store the deviation between the machining groove (54) and the reference line (L) as a correction value; and the Y-axis actuating part ( 46), actuate the Y-axis feeding means; and a pair of movable wires (48), wrapping the reference line (L) to keep line symmetry and approach and away from the reference line (L); and the movable wire actuating part (50), the A pair of movable wires (48) actuate. When the interval between the pair of movable wires (48) is not set to be recognized as the wide interval of the cutting lane (4), an error will be reported if the cutting lane correction button (40) is touched. When the interval between the pair of movable wires (48) is not set to be recognized as the wide interval of the machining groove (54), an error is reported when the machining groove correction button (42) is touched.

Description

Processing device

The present invention relates to a processing apparatus for forming processing grooves, wherein the processing grooves divide a wafer having a plurality of devices separated by dicing streets and formed on the surface thereof into individual components.

Components such as ICs and LSIs are separated by dicing lines (segmentation lines) and formed on the surface of the wafer, and the dicing lines are cut by a cutting device to be divided into individual components. It is used in electronic devices such as mobile phones and personal computers.

A cutting device includes at least: holding means for holding the wafer; cutting means including a cutting blade for cutting the scribe lines of the wafer held by the holding means so as to be rotatable; and X-axis feeding means for holding the holding means Cutting and feeding in an X-axis direction opposite to the cutting means; and a Y-axis feeding means for indexing and feeding the holding means and the cutting means in a Y-axis direction orthogonal to the X-axis direction; and a photographing means having a microscope, the microscope The wafer held by the holding means is photographed to provide reference lines for detecting scribe lines and dicing grooves; and display means; and scribe lines that can cut the wafer with high precision (for example, refer to Patent Document 1).

That is, in the display means, the line display: image display part, to display the image captured by the shooting means; and the cutting path correction button, which is used to memorize the deviation between the cutting path and the reference line as the correction value; and the cutting groove correction button, which is used to adjust the difference between the cutting groove and the reference line. The deviation is memorized as a correction value; and the X-axis actuating part operates the X-axis feeding means; and the Y-axis actuating part acts the Y-axis feeding means; Away from the reference line; and the movable line actuating part, actuate a pair of movable lines; when the Y-axis actuating part is actuated, the center of the cutting line is placed on the reference line and the interval between a pair of movable lines is placed in the width of the cutting line. In the case of width, if you touch the cutting lane correction button, the moving distance of the cutting lane will be memorized as the correction value in the Y-axis direction, and it will be corrected to the reference line and the cutting lane in the next indexing feed of the cutting lane. Central agree.

In addition, when the Y-axis actuating part is actuated, the center of the cutting groove is placed on the reference line, and the interval between the pair of movable lines is set at the width of the cutting groove, when the cutting groove correction button is touched, the cutting groove is cut. The movement distance in the Y-axis direction will be memorized as the correction value in the Y-axis direction. In the next indexing feed of the cutting lane, it will be corrected so that the reference line and the center of the cutting groove are consistent and the cutting groove will be formed in the cutting lane. the center of.

[Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2014-113669

However, when the Y-axis actuating part is actuated, the center of the cutting line is placed on the reference line, and the interval between a pair of movable lines is placed in the width of the cutting line, if the cutting groove correction button is touched, the cutting line The correction value will be memorized as the correction value of the cutting groove, and there is a problem that high-precision indexing feeding cannot be performed, and the cutting groove cannot be cut with high precision.

In addition, when the Y-axis actuating part is actuated, the center of the cutting groove is placed on the reference line, and the interval between the pair of movable lines is placed on the width of the cutting groove, when the cutting groove correction button is touched, the cutting groove is cut. The correction value of , will be memorized as the correction value of the cutting line, and there is a problem that the center of the cutting line cannot be cut with high precision.

The above-mentioned problem may also occur in a laser processing apparatus that irradiates a laser beam to a scribe line to form a dividing groove.

The problem to be solved by the present invention, which has been developed in view of the above-mentioned facts, is to provide a machining apparatus that does not confuse the correction of the deviation of the scribe line and the deviation of the machining groove including the cutting groove and the dividing groove.

In order to solve the above problems to be solved, the present invention provides the following processing apparatus. That is to say, a processing device is a processing device that forms a processing groove, and the processing groove is to divide a wafer with a plurality of components separated by dicing streets and formed on the surface into individual components. The apparatus includes at least: holding means for holding the wafer; and processing means for forming processing grooves in the scribe lines of the wafer held by the holding means; and X-axis feeding means for moving the holding means and the processing means on the X-axis relative direction and Y-axis feeding means for indexing and feeding the holding means and the processing means in a Y-axis direction orthogonal to the X-axis direction; and photographing means having a microscope, the microscope photographing being held in the holding The wafer of the method is provided with a reference line for detecting dicing lines and processing grooves; and a display means; in the display means, it is displayed: an image display part, which displays the image captured by the shooting means; and a dicing line correction button, which is used for to memorize the deviation between the cutting path and the reference line as a correction value; and the machining groove correction button, which is used to memorize the deviation between the machining groove and the reference line as a correction value; The shaft feeding means is actuated; and a pair of movable wires sandwiches the reference wire to maintain line symmetry and approach and away from the reference wire; and a movable wire actuating part actuates the pair of movable wires; If it is not set to be recognized as the width of the cutting lane, if you touch the cutting lane correction button, an error will be reported. When the interval of the pair of movable wires is not set to be recognized as a machining groove In the case of the width interval of , if you touch the machining groove correction button, an error will be reported.

Preferably, when the Y-axis actuating portion is actuated, the position of the cutting line displayed on the image display portion is moved to the reference line, and the movable wire actuating portion is actuated to make the pair of movable wires coincide with the cutting line. In the case of the wide width of the cutting path, if the correction button of the cutting path is touched, the moving distance of the cutting path will be memorized as the correction value of the cutting path. When the Y-axis actuating part is actuated, it will be displayed on the image display part. When the position of the machining groove is moved to the reference line and the movable wire actuating part is actuated to make the pair of movable wires match the width of the machining groove, when the machining groove correction button is touched, the moving distance of the machining groove Will be memorized as the correction value of the machining groove. This processing method is It is suitable that the machining groove is a cutting groove with a cutting means capable of rotating the cutting blade.

The processing apparatus provided by the present invention is provided with at least: holding means for holding the wafer; processing means for forming processing grooves in the scribe lines of the wafer held by the holding means; and X-axis feeding means for connecting the holding means with the The processing means is relatively fed in the X-axis direction; and the Y-axis feeding means is indexed to feed the holding means and the processing means in the Y-axis direction orthogonal to the X-axis direction; and the photographing means has a microscope, the The microscope captures the wafer held by the holding means and is provided with a reference line for detecting scribe lines and grooves; and a display means; on the display means, it is displayed: an image display unit that displays an image captured by the photographing means; and The cutting path correction button is used to memorize the deviation between the cutting path and the reference line as a correction value; and the machining groove correction button is used to memorize the deviation between the machining groove and the reference line as a correction value; and the Y axis an actuating part for actuating the Y-axis feeding means; and a pair of movable wires for sandwiching the reference line to maintain line symmetry so as to approach and away from the reference line; and a movable wire actuating portion to actuate the pair of movable wires; If the interval between a pair of movable wires is not set to be recognized as the interval between the widths of the cutting lanes, an error will be reported if the trimming lane correction button is touched. When the interval between the pair of movable wires is not set to be In the case that it is recognized as the width of the machining groove, if the correction button of the machining groove is touched, an error will be reported, so the deviation between the cutting line and the reference line will not be memorized as the correction value of the machining groove, and it will not be used. The deviation between the machining groove and the reference line will be The amount memory is used as the correction value of the cutting track, which can perform index feeding with high precision and form a high-precision machining groove on the cutting track.

2: Wafer

2a: Surface (of wafer 2)

4: Cutting Road

6: Components

8: Ring frame

10: Adhesive tape

12: Cutting device (processing device)

14: Keep Means

16: Cutting means (processing means)

18: Shooting means

20: Show Means

22: Device cover

24: Chuck platform

26: Adsorption chuck

28: Fixtures

30: Spindle cover

32: Mandrel

34: Cutter

36: Microscope

38: Image Display Section

40: Cutting road correction button

42: Processing groove correction button

44: X-axis actuating part

44a: Right direction actuation part

44b: Left direction actuating part

46: Y-axis actuating part

46a: Upward direction actuating part

46b: Downward Actuator

48: Movable line

50: Movable wire actuating part

50a: Movable wire approach part

50b: Movable wire away part

52: Correction value display part

54: Cutting groove (processing groove)

L: Baseline

[Fig. 1] A perspective view of a wafer.

[ Fig. 2 ] A perspective view of a processing apparatus constructed in accordance with the present invention.

[FIG. 3] A perspective view of the imaging means and the wafer during correction.

[ Fig. 4 ] A model diagram showing the image of the display means shown in Fig. 2 .

[Fig. 5] Model diagram of the image before correction.

[ Fig. 6] Fig. 6 is a model diagram of an image in a state where the position of the scribe line has been moved to the reference line from the state shown in Fig. 5 .

[ Fig. 7] Fig. 7 is a model diagram of an image in a state in which a pair of movable wires are aligned with the width of the dicing lane from the state shown in Fig. 6 .

[ Fig. 8] Fig. 8 is a model diagram of an image in a state where the position of the processing groove is moved to the reference line from the state shown in Fig. 7 .

[ Fig. 9] Fig. 9 is a model diagram of an image in a state in which a pair of movable wires are aligned with the width of the machining groove from the state shown in Fig. 8 .

Hereinafter, an embodiment of a processing apparatus constructed in accordance with the present invention will be described with reference to the drawings.

In FIG. 1, a disk-shaped wafer 2 that can be processed by a processing apparatus constructed in accordance with the present invention is disclosed. the surface of this wafer 2 2a, a plurality of scribe lines 4 formed in a lattice shape are divided into a plurality of rectangular regions, and a plurality of elements 6 such as ICs, LSIs, etc. are formed in each of the plurality of rectangular regions. The wafer 2 in the illustrated embodiment is attached to an adhesive tape 10 whose peripheral edge is fixed to the annular frame 8 .

The cutting apparatus 12 shown in FIG. 2 is an example of a processing apparatus constructed in accordance with the present invention, and includes at least holding means 14 for holding the wafer 2 , and cutting means 16 as the wafer 2 held by the holding means 14 . The cutting path 4 forms a processing means for processing grooves; and an X-axis feeding means (not shown), which processes and feeds the holding means 14 and the cutting means 16 in the X-axis direction (the direction indicated by the arrow X in FIG. 1 ) relatively; and Y-axis feeding means (not shown), for indexing and feeding the holding means 14 and the cutting means 16 in the Y-axis direction orthogonal to the X-axis direction (the direction indicated by the arrow Y in FIG. 1 ); and the photographing means 18; and display means 20. In addition, the planes regulated by the X-axis direction and the Y-axis direction are substantially horizontal. In addition, the Z-axis direction indicated by the arrow Z in FIG. 1 is an up-down direction orthogonal to the X-axis direction and the Y-axis direction.

The holding means 14 includes a circular chuck table 24 that is rotatably and movably attached to the device housing 22 in the X-axis direction. The chuck stage 24 is rotated around an axis extending in the Z-axis direction by a chuck stage motor (not shown) built in the device housing 22 . The above-mentioned X-axis feeding means in the illustrated embodiment is composed of a ball screw (not shown) that is connected to the chuck table 24 and extends in the X-axis direction, and a motor (not shown) that rotates the ball screw. , the chuck table 24 is machined and fed relative to the cutting means 16 in the X-axis direction. On the upper end portion of the chuck table 24, a porous structure connected to a suction means (not shown) is arranged The circular suction chuck 26 in the chuck table 24 generates an attractive force on the suction chuck 26 by means of suction, thereby attracting and holding the wafer 2 carried on it. In addition, a plurality of clamps 28 for fixing the annular frame 8 are arranged at intervals in the circumferential direction on the peripheral edge of the chuck table 24 .

The cutting means 16 includes: a mandrel cover 30 supported by the device cover 22 movably in the Y-axis direction and movably in the Z-axis direction (movable up and down); and a mandrel 32 with the Y-axis direction as the axis center It is rotatably supported by the mandrel housing 30 ; a motor (not shown) rotates the mandrel 32 ; and a cutting blade 34 is fixed to the front end of the mandrel 32 . As described above, the cutting means 16, which is a processing means for forming processing grooves in the dicing lanes 4 of the wafer 2, is provided with the cutting blade 34 and can be rotated. In the illustrated embodiment, the processing grooves formed in the wafer 2 are: A cutting groove formed by the cutting blade 34 . The above-mentioned Y-axis feeding means is composed of a ball screw (not shown) connected to the mandrel housing 30 and extending in the Y-axis direction, and a motor (not shown) that rotates the ball screw, and is opposite to the holding means 14 . The mandrel housing 30 is relatively indexed and fed in the Y-axis direction. In addition, the mandrel housing 30 is connected to the Z-axis by a Z-axis feeding means composed of a ball screw (not shown) extending in the Z-axis direction and a motor (not shown) for rotating the ball screw. The direction is cut into the feed (elevation).

As shown in FIG. 2 , the imaging means 18 is provided above the moving path of the chuck table 24 . As described with reference to FIGS. 3 and 4 , the imaging means 18 includes a microscope 36 that photographs the wafer 2 held by the holding means 14 and is provided with detection scribe lines 4 and machining grooves (in the illustrated embodiment, the dicing grooves are dicing grooves). ) of the reference line L (refer to Figure 4). The reference line L extending in the X-axis direction is formed on an imaging element (not shown) such as a lens of the microscope 36 or a CCD. this Further, the microscope 36, supported by the mandrel housing 30, is moved in the Y-axis direction by the Y-axis feeding means together with the mandrel housing 30, and is moved in the Z-axis direction by the Z-axis feeding means.

The display means 20 in the illustrated embodiment is constituted by a touch panel provided on the upper front surface of the device case 22 . As shown in FIG. 4 , on the display means 20, there are displayed: an image display part 38, which displays the image captured by the photographing means 18; be memorized as a correction value; and the machining groove correction button 42 is used to memorize the deviation between the machining groove and the reference line L as a correction value; and the X-axis actuating part 44 is used to actuate the X-axis feeding means; and the Y-axis actuating part 46, actuate the Y-axis feeding means; and a pair of movable wires 48, wrap around the reference line L and maintain line symmetry while approaching and away from the reference line L; and the movable wire actuating part 50, actuate the pair of movable wires 48; Value display unit 52 .

The image display unit 38 for displaying the image captured by the photographing means 18 with the horizontal axis being the X-axis direction and the vertical axis being the Y-axis direction, together with the reference line L of the photographing means 18, will take the reference line L as the reference line L. A pair of movable lines 48 that are symmetrical about the axis of symmetry are shown parallel to the X-axis direction. The cutting lane correction button 40 is a button for storing the deviation between the cutting lane 4 and the reference line L as a correction value in the memory means (not shown) of the cutting device 12. When the Y-axis actuating part 46 is actuated, the When the position of the cutting lane 4 displayed on the image display part 38 is moved to the reference line L, and the movable wire actuating part 50 is actuated to make the pair of movable wires 48 conform to the width of the cutting lane 4, if the touch cutting When the lane correction button 40 is pressed, the moving distance of the cutting lane 4 is stored in the above-mentioned memory means as the correction value of the cutting lane 4 . In addition, the machining groove correction button 42 is used for The amount of deviation between the machining groove and the reference line L is stored as a correction value in the button of the above-mentioned memory means, and when the Y-axis actuating portion 46 is actuated, the position of the machining groove displayed on the image display portion 38 is moved to the reference line L, In addition, when the movable wire actuating part 50 is actuated to make the pair of movable wires 48 match the width of the machining groove, when the machining groove correction button 42 is touched, the moving distance of the machining groove is memorized as a correction value of the machining groove. on the above-mentioned memory means. In addition, in the embodiment shown in the figure, when the interval between the pair of movable wires 48 is not set to be recognized as the interval (eg, 45 μm or more) of the width (eg, 50 to 60 μm) of the scribe line 4 , If the scribe line correction button 40 is touched, an error will be reported. When the interval between the pair of movable wires 48 is not set to be recognized as the interval (eg, less than 45 μm) of the width (eg, 25-35 μm) of the processing groove Next, if the machining groove correction button 42 is touched, an error will be reported. Therefore, when the deviation amount between the cutting lane 4 and the reference line L is memorized as the correction value, even if the operator touches the machining groove correction button 42 by mistake, the correction value of the cutting lane 4 will not be used as the correction value of the machining groove. Memorize in the above-mentioned memory means. In addition, when the amount of deviation between the machining groove and the reference line L is memorized as a correction value, even if the operator touches the kerf correction button 40 by mistake, the correction value of the machining groove will not be stored in the kerf 4 as a correction value. The above memory means. In addition, as an error notification, an error display with respect to the display means 20, the flickering or lighting of a warning lamp (not shown), the notification by a warning sound, etc. are mentioned.

The X-axis actuating portion 44 includes a right-direction actuating portion 44a that actuates the X-axis feeding means to move the photographing area by the photographing means 18 to the right in FIG. 4 , and actuates the X-axis feeding means to cause the photographing means 18 The left-direction actuating portion 44b moves the resulting photographing area to the left in FIG. 4 . Further, the Y-axis actuating portion 46 includes an upward direction actuating portion 46a that actuates the Y-axis feeding means to move the imaging means 18 upward in FIG. The downward direction of the middle moves the downward direction actuating portion 46b. In addition, the movable wire actuating portion 50 has a movable wire approaching portion 50a that allows the pair of movable wires 48 to approach the reference line L while maintaining a line-symmetric relationship with the reference line L as the axis of symmetry, and a movable wire approach portion 50a that maintains the reference line L as a The line-symmetrical relationship of the axis of symmetry causes the pair of movable wires 48 to be separated from the reference line L by the movable wire distance portion 50b.

When forming cutting grooves in the dicing lanes 4 of the wafer 2 using the cutting device 12 as described above, first, the surface 2 a of the wafer 2 is turned upward, and the wafer 2 is sucked and held on the upper surface of the chuck table 24 . In addition, the annular frame 8 is fixed by a plurality of clamps 28 . Next, the wafer 2 is photographed from above by the photographing means 18 , and based on the image of the wafer 2 photographed by the photographing means 18 , the X-axis feeding means, the Y-axis feeding means, and the chuck stage are actuated by the motors to make the The cutting lanes 4 are aligned in the X-axis direction, and the cutting blade 34 is placed above the cutting lanes 4 aligned in the X-axis direction. Next, the cutting blade 34 and the mandrel 32 are rotated together by the motor. Next, the mandrel housing 30 is lowered by the Z-axis feeding means, so that the cutting edge of the cutting blade 34 is cut into the cutting lane 4 aligned in the X-axis direction, and the X-axis feeding means is actuated to clamp the cutting means 16. The disk stage 24 is machine-fed relatively in the X-axis direction, whereby cutting is performed to form cutting grooves for dividing the wafer 2 into individual elements 6 along the scribe line 4 . Next, the cutting means 16 is fed by the Y-axis to the chuck table 24 by the amount of the indexing feed amount (the interval in the Y-axis direction of the cutting lane 4 in the state before the cutting process is applied) just beforehand. means towards the y-axis To do the indexing feed. Then, when the cutting process and the indexing feed are alternately repeated to perform the cutting process on the entire scribe line 4 aligned in the X-axis direction, when the cutting groove is formed by the cutting device 12 as described above, the occurrence of The deviation in the Y-axis direction of the cutting lane 4 accompanying the cutting process, or the deviation in the Y-axis direction of the cutting blade 34 due to thermal expansion of the mandrel 32 . In a state where such a deviation occurs, if the index feeding is performed repeatedly while the cutting process is performed with the preset index feed amount, the cutting may reach a position where it is separated from the scribe line 4 and the element 6 may be damaged. In view of this, when the cutting groove is formed by the cutting device 12, the machining position is corrected (that is, the deviation between the cutting path 4 and the cutting groove) is corrected after the cutting is performed several times. In the correction of the machining position, firstly, a kerf correction is performed to obtain the deviation amount of the kerf 4 and the reference line L in the Y-axis direction and memorize it as a correction value of the kerf, and then to obtain the difference between the cutting groove and the reference line L. The amount of deviation in the Y-axis direction is memorized as machining groove correction as a correction value for cutting grooves. In addition, the cutting groove formed along the scribe line 4 is denoted by reference numeral 54 in FIG. 3 .

In the dicing line correction, firstly, as shown in FIG. 3 , the X-axis feeding means and the Y-axis feeding means are operated to align the wafer 2 and the imaging means 18 , and the imaging means 18 captures the image of the recently formed cutting groove 54 . Cutting Lane 4. The image captured by the imaging means 18 is displayed on the image display unit 38 of the display means 20 as shown in FIG. 5 , for example. In addition, when a metal pattern called TEG (Test Element Group) is periodically provided in the cutting track 4, metal burrs are generated in the cutting groove where the TEG is cut, and the like, if photographed The cutting grooves here may be mistaken for metal burrs and the like as cutting grooves. Therefore, in such a case, the X-axis actuating portion 44 is operated. The position of the cutting tract 4 photographed by the photographing means 18 is adjusted by moving, and the cutting groove where the TEG is not provided is photographed. Next, based on the captured image, as shown in FIG. 6 , the Y-axis actuating unit 46 is actuated to move the center position in the Y-axis direction of the scribe line 4 displayed on the image display unit 38 toward the reference line L. At this time, the operator looks at the photographed image and adjusts the position of the dicing lane 4 with the naked eye so that the central position of the dicing lane 4 in the Y-axis direction coincides with the reference line L, so it is difficult to use the Y-axis actuating part 46 The center position of the Y-axis direction of the dicing lane 4 is accurately placed on the reference line L by one operation. Therefore, the movable wire actuating part 50 is actuated to fit the space between the pair of movable wires 48 to the width of the dicing lane 4 to check whether the center position of the dicing lane 4 in the Y-axis direction matches the reference line L. As described above, the pair of movable wires 48 approach and move apart while maintaining a line-symmetric relationship with the reference line L as the axis of symmetry. Therefore, if the interval between the pair of movable wires 48 is the same as the width of the cutting lane 4, the cutting is performed. The center position of the track 4 in the Y-axis direction and the reference line L are aligned. Then, the actuation of the Y-axis actuating portion 46 and the actuation of the movable wire actuating portion 50 are appropriately repeated, and when the interval between the pair of movable wires 48 is consistent with the width of the cutting lane 4 as shown in FIG. Road correction button 40. In this way, the movement distance of the cutting lane 4 in the Y-axis direction from the position before correction (the amount of deviation between the cutting lane 4 and the reference line L) is stored in the Y-axis direction of the cutting lane 4 as a correction value of the cutting lane 4. The above-mentioned memory means of the cutting device 12 . The correction value of the scribe line 4 is displayed on the correction value display portion 52 of the display means 20 (-5.5 μm in the illustrated embodiment).

In the illustrated embodiment, even if the operator accidentally touches the machining groove correction button 42 during such kerf correction, if the interval between the pair of movable wires 48 is not set so as to be recognized as the width of the cutting groove 54 . in the interval An error will be reported, so the correction value of the cutting lane 4 will not be memorized as the correction value of the cutting groove 54 . In addition, in FIG. 7 , for the sake of simplicity, the pair of movable wires 48 are described with an interval slightly wider than the width of the dicing lane 4 .

Next, the machining groove correction will be described. Machining groove correction starts from a state where the center position of the scribe line 4 in the Y-axis direction is aligned with the reference line L. First, as shown in FIG. 8 , the Y-axis actuating unit 46 is actuated and displayed on the image display unit. The central position in the Y-axis direction of the cutting groove 54 of 38 moves toward the reference line L. Next, the movable wire actuating portion 50 is actuated to fit the space between the pair of movable wires 48 to the width of the cutting groove 54 to check whether the center position of the cutting groove 54 in the Y-axis direction matches the reference line L. Then, the actuation of the Y-axis actuating portion 46 and the actuation of the movable wire actuating portion 50 are appropriately repeated, and when the interval between the pair of movable wires 48 is equal to the width of the cutting groove 54 as shown in FIG. Gutter correction button 42 . In this way, the movement distance in the Y-axis direction of the cutting groove 54 from the state in which the center position of the cutting lane 4 in the Y-axis direction is aligned with the reference line L is used as a correction value of the cutting groove 54 in the Y-axis direction. Memorized in the above-mentioned memory means of the cutting device 12 . The correction value of the cutting groove 54 is displayed on the correction value display portion 52 of the display means 20 (+1.2 μm in the illustrated embodiment). In the embodiment shown in the figure, even if the operator accidentally touches the kerf correction button 40 at the time of such machining groove correction, if the interval between the pair of movable wires 48 is not set so as to be recognized as the width of the kerf 4 . In the case of an interval, an error will be reported, so the correction value of the cutting groove 54 will not be memorized as the correction value of the cutting line 4 . In addition, in FIG. 9 , for the sake of simplicity, the pair of movable wires 48 are described with an interval slightly wider than the width of the cutting groove 54 .

In the correction of the processing position as above, firstly in the cutting line During the correction, the movement distance in the Y-axis direction of the scribe line 4 from the position before the correction (the amount of deviation between the scribe line 4 and the reference line L) is obtained. The moving distance of the cutting groove 54 in the Y-axis direction (the amount of deviation between the cutting groove 54 and the reference line L) from the state where the center position in the Y-axis direction of the The amount of deviation between the cutting track 4 and the cutting groove 54 . Then, the index feeding is performed by adding the correction value of the cutting groove 54 to the preset indexing feeding amount to perform the indexing feeding, so that the center position in the Y-axis direction of the cutting road 4 can be obtained. Cutting grooves 54 are formed.

In the embodiment shown above, when the interval between the pair of movable wires 48 is not set so as to be recognized as the interval between the widths of the cutting lanes 4, an error will be reported when the cut lane correction button 40 is touched. , when the interval between the pair of movable wires 48 is not set to be recognized as the interval between the widths of the cutting grooves 54, an error will be reported if the groove correction button 42 is touched, so the cutting grooves 4 and the The deviation amount of the reference line L is stored as the correction value of the cutting groove 54, and the deviation amount of the cutting groove 54 and the reference line L is not stored as the correction value of the cutting line 4, so that the index feeding can be performed with high precision to adjust the cutting line. 4. High-precision cutting grooves 54 are formed.

In addition, in the embodiment shown in the figure, the cutting device 12 including the cutting blade 34 for cutting the scribe line 4 of the wafer 2 held by the holding means 14 and the cutting means 16 for rotating the cutting blade 34 is described. A laser processing apparatus including a laser beam irradiating means for forming dividing grooves by irradiating a laser beam to the dicing lines 4 of the wafer 2 held by the holding means may be employed.

4‧‧‧Cutting Road

20‧‧‧Display means

38‧‧‧Image Display Section

40‧‧‧Cutting road correction button

42‧‧‧Machining groove correction button

44‧‧‧X-axis actuating part

44a‧‧‧Right direction actuating part

44b‧‧‧Left direction actuating part

46‧‧‧Y-axis actuating part

46a‧‧‧Upward acting part

46b‧‧‧ downward direction actuating part

48‧‧‧Moveable Cord

50‧‧‧Moveable wire actuating part

50a‧‧‧Accessible part of movable wire

50b‧‧‧Moveable cord remote part

52‧‧‧Correction value display

54‧‧‧Cutting groove (processing groove)

L‧‧‧Baseline

Claims (3)

A processing device is a processing device for forming a processing groove, the processing groove is to divide a plurality of components by a dicing street (street) and form a wafer formed on the surface to be divided into individual components, the processing device, At least: holding means for holding the wafer; and processing means for forming processing grooves in the scribe lines of the wafer held by the holding means; and X-axis feeding means for facing the holding means and the processing means in the X-axis direction and Y-axis feeding means for indexing and feeding the holding means and the processing means in a Y-axis direction orthogonal to the X-axis direction; and photographing means having a microscope, the microscope photographing being held in the holding The wafer is equipped with a reference line for detecting dicing lines and processing grooves; and a display means; In the display means, there are displayed: an image display part, which displays the image captured by the photographing means; and a cutting line correction button, which is used to memorize the deviation between the cutting line and the reference line as a correction value; and a machining groove The correction button is used to memorize the deviation between the machining groove and the reference line as a correction value; and the Y-axis actuating part operates the Y-axis feeding means; and a pair of movable wires that sandwich the reference line to maintain line symmetry and approaching and moving away from the reference line; and the movable line actuating part to actuate the pair of movable lines; When the interval between the pair of movable lines is not set to be recognized as the interval between the widths of the cutting lanes, an error will be reported if the trimming lane correction button is touched. When the interval between the pair of movable wires is not set so as to be recognized as the interval between the widths of the machining grooves, an error is reported when the machining groove correction button is touched. The processing apparatus according to claim 1, wherein when the Y-axis actuating portion is actuated, the position of the cutting line displayed on the image display portion is moved to the reference line, and the movable line actuating portion is moved to the reference line. Under the condition that the pair of movable lines are consistent with the width of the cutting lane, if the cutting lane correction button is touched, the moving distance of the cutting lane will be memorized as the correction value of the cutting lane. When the Y-axis actuating portion is actuated, the position of the machining groove displayed on the image display portion is moved to the reference line, and the movable wire actuating portion is actuated to make the pair of movable wires match the width of the machining groove. In this case, when the machining groove correction button is touched, the moving distance of the machining groove is memorized as a correction value of the machining groove. The processing apparatus according to claim 1, wherein the processing means is a cutting means provided with a cutting blade and can be rotated, and the processing groove is a cutting groove.

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