CN110176410B - Processing device - Google Patents
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- CN110176410B CN110176410B CN201910117577.3A CN201910117577A CN110176410B CN 110176410 B CN110176410 B CN 110176410B CN 201910117577 A CN201910117577 A CN 201910117577A CN 110176410 B CN110176410 B CN 110176410B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Microelectronics & Electronic Packaging (AREA)
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- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
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Abstract
Provided is a machining device which does not cause erroneous correction of the offset of a spacer and correction of the offset of a machining groove including a cutting groove and a dividing groove. The processing device (12) has at least a holding unit (14), a processing unit (16), an X-axis feeding unit, a Y-axis feeding unit, a photographing unit (18), and a display unit (20). An image display unit (38), a lane correction button (40), a machining groove correction button (42), a Y-axis operation unit (46), a pair of movable wires (48), and a movable wire operation unit (50) are displayed on the display unit (20). When a spacer correction button (40) is touched in a state where the interval between a pair of movable lines (48) is not set to an interval recognized as the width of a spacer (4), an error is notified. When a machining groove correction button (42) is touched while the interval between a pair of movable wires (48) is not set to be recognized as the interval of the width of a machining groove (54), an error is notified.
Description
Technical Field
The present invention relates to a processing apparatus that forms a processing groove for dividing a wafer having a plurality of devices formed on a front surface thereof by dividing the wafer into the devices.
Background
A wafer having devices such as ICs and LSIs formed on the front surface thereof by dividing the streets (lines to divide) is divided into individual devices by cutting the streets by a cutting device, and the divided devices are used for electronic equipment such as mobile phones and personal computers.
The cutting device has at least: a holding unit that holds a wafer; a cutting unit having a cutting tool that cuts the streets of the wafer held by the holding unit and being rotatable; an X-axis feeding unit that causes the holding unit and the cutting unit to perform cutting feeding relatively in an X-axis direction; a Y-axis feeding unit for relatively indexing the holding unit and the cutting unit in a Y-axis direction perpendicular to the X-axis direction; an imaging unit including a microscope having a reference line, the microscope imaging the wafer held by the holding unit to detect the streets and the cutting grooves; and a display unit, wherein the cutting device can cut the spacing channel of the wafer with high precision (for example, refer to patent document 1).
That is, the display unit displays: an image display unit that displays an image captured by the capturing unit; a spacer correction button for storing an offset between the spacer and the reference line as a correction value; a cutting groove correction button for storing an offset amount of the cutting groove from the reference line as a correction value; an X-axis operation unit for operating the X-axis feeding unit; a Y-axis operation unit for operating the Y-axis feeding unit; a pair of movable lines which are positioned close to and apart from the reference line while maintaining line symmetry across the reference line; and a movable wire operating section that operates the pair of movable wires, and when the spacer correction button is touched with the Y-axis operating section operated to position the center of the spacer at the reference line and the interval of the pair of movable wires at the width of the spacer, stores the movement distance of the spacer as a correction value in the Y-axis direction and corrects in the index feed of the next spacer so that the reference line coincides with the center of the spacer.
In addition, when the cutting groove correction button is touched with the Y-axis operation portion being operated to position the center of the cutting groove at the reference line and the interval of the pair of movable lines at the width of the cutting groove, the movement distance in the Y-axis direction of the cutting groove is stored as the correction value in the Y-axis direction and corrected in the indexing feed of the next interval lane so that the reference line coincides with the center of the cutting groove and the cutting groove is formed in the center of the interval lane.
Patent document 1: japanese patent laid-open publication No. 2014-113669
However, there are the following problems: when the Y-axis operation unit is operated to position the center of the pitch track at the reference line and to position the pitch of the pair of movable lines at the pitch track width, the pitch track correction button is touched, the pitch track correction value is stored as the pitch track correction value, and the pitch track cannot be cut with high accuracy because the pitch track correction value cannot be fed with high accuracy.
In addition, there are the following problems: when the pitch track correction button is touched with the Y-axis operation portion being operated to position the center of the cutting groove at the reference line and the interval between the pair of movable lines at the width of the cutting groove, the correction value of the cutting groove is stored as the correction value of the pitch track, and the center of the pitch track cannot be cut with high accuracy.
The above-described problems also occur in a laser processing apparatus that irradiates a streets with laser light to form separation grooves.
Disclosure of Invention
The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a machining device that does not cause erroneous correction of the displacement of a spacer and correction of the displacement of a machining groove including a cutting groove and a dividing groove.
In order to solve the above problems, the present invention provides the following processing apparatus. That is, the processing apparatus forms a processing groove for dividing a wafer having a plurality of devices formed on a front surface thereof by dividing the wafer into the devices, the processing apparatus including at least: a holding unit that holds a wafer; a processing unit that forms a processing groove in the spacer of the wafer held by the holding unit; an X-axis feeding unit that causes the holding unit and the processing unit to perform processing feeding relatively in an X-axis direction; a Y-axis feeding unit that causes the holding unit and the processing unit to perform indexing feeding relatively in a Y-axis direction perpendicular to the X-axis direction; a photographing unit having a microscope with a reference line, the microscope photographing the wafer held by the holding unit to detect the streets and the processing grooves; and a display unit on which: an image display unit that displays the image captured by the capturing unit; a spacer correction button for storing an offset between the spacer and the reference line as a correction value; a processing groove correction button for storing an offset between the processing groove and the reference line as a correction value; a Y-axis operation unit for operating the Y-axis feeding unit; a pair of movable lines which are located near to and far from the reference line and maintain line symmetry across the reference line; and a movable wire operating unit that operates the pair of movable wires, and that notifies an error when the lane correction button is touched when the interval between the pair of movable wires is not set to be the interval recognized as the width of the lane, and that notifies an error when the processing groove correction button is touched when the interval between the pair of movable wires is not set to be the interval recognized as the width of the processing groove.
Preferably, when the distance correction button is touched in a case where the Y-axis operation unit is operated to move the position of the distance displayed on the image display unit to the reference line and the movable line operation unit is operated to match the width of the pair of movable lines to the distance, the movement distance of the distance is stored as a correction value of the distance, and when the Y-axis operation unit is operated to move the position of the processing groove displayed on the image display unit to the reference line and the movable line operation unit is operated to match the width of the processing groove, the movement distance of the processing groove is stored as a correction value of the processing groove. Preferably, the machining unit is a cutting unit having a cutting tool and the cutting tool is rotatable, and the machining groove is a cutting groove.
The processing device provided by the invention at least comprises: a holding unit that holds a wafer; a processing unit that forms a processing groove in the spacer of the wafer held by the holding unit; an X-axis feeding unit that causes the holding unit and the processing unit to perform processing feeding relatively in an X-axis direction; a Y-axis feeding unit that causes the holding unit and the processing unit to perform indexing feeding relatively in a Y-axis direction perpendicular to the X-axis direction; a photographing unit having a microscope with a reference line, the microscope photographing the wafer held by the holding unit to detect the streets and the processing grooves; and a display unit on which: an image display unit that displays the image captured by the capturing unit; a spacer correction button for storing an offset between the spacer and the reference line as a correction value; a processing groove correction button for storing an offset between the processing groove and the reference line as a correction value; a Y-axis operation unit for operating the Y-axis feeding unit; a pair of movable lines which are located near to and far from the reference line and maintain line symmetry across the reference line; and a movable wire operating unit that operates the pair of movable wires, and when the lane correction button is touched when the interval between the pair of movable wires is not set to be recognized as the width of the lane, an error is notified, and when the lane correction button is touched when the interval between the pair of movable wires is not set to be recognized as the interval of the width of the processing groove, an error is notified, and therefore, the offset amount between the lane and the reference wire is not stored as the correction value of the processing groove, and the offset amount between the processing groove and the reference wire is not stored as the correction value of the lane, and the indexing feed can be performed with high accuracy, and the processing groove with high accuracy can be formed in the lane.
Drawings
Fig. 1 is a perspective view of a wafer.
Fig. 2 is a perspective view of a machining apparatus constructed in accordance with the present invention.
Fig. 3 is a perspective view of the photographing unit and the wafer at the time of correction.
Fig. 4 is a schematic view of an image displayed on the display unit shown in fig. 2.
Fig. 5 is a schematic view of an image before correction is performed.
Fig. 6 is a schematic view of an image in a state in which the position of the spacer is moved to the reference line from the state shown in fig. 5.
Fig. 7 is a schematic view of an image in a state in which a pair of movable lines is made to coincide with the width of a spacer from the state shown in fig. 6.
Fig. 8 is a schematic view of an image in a state in which the position of the processing groove is moved to the reference line from the state shown in fig. 7.
Fig. 9 is a schematic view of an image in a state in which a pair of movable lines are aligned with the width of the processing groove from the state shown in fig. 8.
Description of the reference numerals
2: a wafer; 4: a spacer; 12: cutting devices (machining devices); 14: a holding unit; 16: a cutting unit (processing unit); 18: a photographing unit; 20: a display unit; 34: a cutting tool; 36: a microscope; 38: an image display unit; 40: a lane correction button; 42: machining a groove correction button; 46: a Y-axis operation unit; 48: a movable wire; 50: a movable wire operating section; 54: cutting grooves (machining grooves); l: and (5) a datum line.
Detailed Description
Hereinafter, embodiments of a processing apparatus according to the present invention will be described with reference to the drawings.
Fig. 1 shows a disk-shaped wafer 2 which can be processed by a processing apparatus constructed in accordance with the present invention. The front surface 2a of the wafer 2 is divided into a plurality of rectangular regions by a plurality of streets 4 formed in a lattice shape, and a plurality of devices 6 such as ICs and LSIs are formed in the plurality of rectangular regions. The wafer 2 in the illustrated embodiment is adhered to an adhesive tape 10 fixed to the annular frame 8 at its peripheral edge.
The cutting device 12 shown in fig. 2 is an example of a machining device configured according to the present invention, and the cutting device 12 includes at least: a holding unit 14 that holds the wafer 2; a cutting unit 16 as a processing unit that forms a processing groove in the streets 4 of the wafer 2 held by the holding unit 14; an X-axis feeding unit (not shown) for relatively feeding the holding unit 14 and the cutting unit 16 in the X-axis direction (the direction indicated by the arrow X in fig. 1); a Y-axis feeding unit (not shown) for relatively indexing the holding unit 14 and the cutting unit 16 in a Y-axis direction (a direction indicated by an arrow Y in fig. 1) perpendicular to the X-axis direction; a photographing unit 18; and a display unit 20. In addition, a plane defined by the X-axis direction and the Y-axis direction is substantially horizontal. The Z-axis direction indicated by the arrow Z in fig. 1 is the vertical direction perpendicular to the X-axis direction and the Y-axis direction.
The holding unit 14 includes a circular chuck table 24, and the chuck table 24 is rotatably attached to the apparatus case 22 so as to be movable in the X-axis direction. The chuck table 24 is rotated about an axis extending in the Z-axis direction by a chuck table motor (not shown) incorporated in the apparatus case 22. The X-axis feeding unit in the illustrated embodiment includes: a ball screw (not shown) connected to the chuck table 24 and extending in the X-axis direction; and a motor (not shown) that rotates the ball screw, wherein the X-axis feeding unit performs machining feeding relative to the cutting unit 16 in the X-axis direction with respect to the chuck table 24. A porous circular suction chuck 26 connected to a suction unit (not shown) is disposed at an upper end portion of the chuck table 24, and suction force is generated by the suction unit on the suction chuck 26 in the chuck table 24, so that the wafer 2 placed on the upper surface is sucked and held. A plurality of jigs 28 for fixing the annular frame 8 are arranged at intervals in the circumferential direction on the peripheral edge of the chuck table 24.
The cutting unit 16 includes: a spindle case 30 supported by the device case 22 so as to be movable in the Y-axis direction and movable (liftable) in the Z-axis direction; a spindle 32 rotatably supported by the spindle case 30 about the Y axis direction; a motor (not shown) for rotating the main shaft 32; and a cutting tool 34 fixed to the front end of the spindle 32. In this way, the cutting unit 16, which is a processing unit for forming a processing groove in the streets 4 of the wafer 2, has the cutting tool 34 and the cutting tool 34 is rotatable, and in the illustrated embodiment, the processing groove formed in the wafer 2 is a cutting groove formed by the cutting tool 34. The Y-axis feeding unit includes: a ball screw (not shown) connected to the spindle case 30 and extending in the Y-axis direction; and a motor (not shown) that rotates the ball screw, wherein the Y-axis feeding unit performs indexing feeding of the spindle case 30 relative to the holding unit 14 in the Y-axis direction. The spindle housing 30 performs plunge feed (elevation) in the Z-axis direction by a Z-axis feed unit, which may include: a ball screw (not shown) extending in the Z-axis direction; and a motor (not shown) for rotating the ball screw.
As shown in fig. 2, the photographing unit 18 is disposed above the moving path of the chuck table 24. As described with reference to fig. 3 and 4, the imaging unit 18 includes a microscope 36 having a reference line L, and the microscope 36 images the wafer 2 held by the holding unit 14 to detect the streets 4 and the machining grooves (in the illustrated embodiment, the cutting grooves) (see fig. 4). The reference line L extending in the X-axis direction is formed in an imaging element (not shown) such as a lens or a CCD of the microscope 36. The microscope 36 is supported by the spindle housing 30, and moves in the Y-axis direction by the Y-axis feeding unit together with the spindle housing 30, and also moves in the Z-axis direction by the Z-axis feeding unit.
The display unit 20 in the illustrated embodiment is constituted by a touch panel provided on the upper portion of the front surface of the device case 22. As shown in fig. 4, on the display unit 20, there are displayed: an image display unit 38 that displays an image captured by the capturing unit 18; a spacer correction button 40 for storing the offset between the spacer 4 and the reference line L as a correction value; a processing groove correction button 42 for storing the offset between the processing groove and the reference line L as a correction value; an X-axis operation unit 44 for operating the X-axis feeding unit; a Y-axis operation unit 46 for operating the Y-axis feeding unit; a pair of moving lines 48 which are positioned in line symmetry with respect to the reference line L and which are positioned closer to and farther from the reference line L; a movable wire operating unit 50 for operating the pair of movable wires 48; and a correction value display section 52.
The image display unit 38 displays the image captured by the imaging unit 18 such that the horizontal axis is the X-axis direction and the vertical axis is the Y-axis direction, and displays a pair of moving lines 48 symmetrical about the reference line L as the symmetry axis, together with the reference line L of the imaging unit 18, so as to be parallel to the X-axis direction. The spacer correction button 40 is a button for storing the offset amount between the spacer 4 and the reference line L as a correction value in a storage unit (not shown) of the cutting device 12, and when the Y-axis operation unit 46 is operated to move the position of the spacer 4 displayed on the image display unit 38 to the reference line L and the movable line operation unit 50 is operated to match the width of the pair of movable lines 48 and the spacer 4, the movement distance of the spacer 4 is stored as the correction value of the spacer 4 in the storage unit. The machining groove correction button 42 is a button for storing the offset amount between the machining groove and the reference line L as a correction value in the storage means, and when the machining groove correction button 42 is touched with the Y-axis operation unit 46 being operated to move the position of the machining groove displayed on the image display unit 38 to the reference line L and the movable line operation unit 50 being operated to match the pair of movable lines 48 with the width of the machining groove, the movement distance of the machining groove is stored in the storage means as the correction value of the machining groove. In the illustrated embodiment, when the lane correction button 40 is touched with the interval between the pair of movable wires 48 not set to be equal to or larger than the interval (for example, 45 μm) between the widths (for example, 50 μm to 60 μm) of the lanes 4, an error is notified, and when the lane correction button 42 is touched with the interval between the pair of movable wires 48 not set to be equal to or smaller than the interval (for example, less than 45 μm) between the widths (for example, 25 μm to 35 μm) of the processing grooves, an error is notified. Therefore, when the offset amount between the spacer 4 and the reference line L is stored as the correction value, even if the operator touches the machining groove correction button 42 by mistake, the correction value of the spacer 4 is not stored as the correction value of the machining groove in the storage unit. When the offset between the machining groove and the reference line L is stored as the correction value, even if the operator touches the lane correction button 40 by mistake, the correction value of the machining groove is not stored in the storage unit as the correction value of the lane 4. Examples of the error notification include an error display on the display unit 20, turning off or on of a warning lamp (not shown), and notification of a warning sound.
The X-axis operation unit 44 includes: a right direction operation unit 44a that operates the X-axis feeding unit to move the imaging region of the imaging unit 18 in the right direction in fig. 4; and a left direction operation unit 44b that operates the X-axis feeding unit to move the imaging region of the imaging unit 18 in the left direction in fig. 4. The Y-axis operation unit 46 includes: an upward movement section 46a that moves the imaging unit 18 upward in fig. 4 by moving the Y-axis feeding unit; and a downward movement portion 46b that moves the imaging unit 18 downward in fig. 4 by operating the Y-axis feeding unit. The movable wire operating unit 50 includes: a movable line approaching portion 50a that approaches the pair of movable lines 48 toward the reference line L while maintaining a line-symmetrical relationship about the reference line L as a symmetry axis; and a moving line distance portion 50b that moves the pair of moving lines 48 away from the reference line L while maintaining a line-symmetrical relationship with the reference line L as an axis of symmetry.
When the cutting grooves are formed in the streets 4 of the wafer 2 using the cutting device 12 as described above, the wafer 2 is first held by suction on the upper surface of the chuck table 24 with the front surface 2a of the wafer 2 facing upward. The ring frame 8 is fixed by a plurality of jigs 28. Next, the wafer 2 is photographed from above by the photographing unit 18, and the X-axis feeding unit, the Y-axis feeding unit, and the chuck table motor are operated to align the streets 4 with the X-axis direction based on the image of the wafer 2 photographed by the photographing unit 18, and the cutting tool 34 is positioned above the streets 4 aligned with the X-axis direction. Then, the cutting tool 34 is rotated together with the spindle 32 by a motor. Next, the following cutting process was performed: the spindle housing 30 is lowered by the Z-axis feeding unit, the cutting edge of the cutting tool 34 is cut into the streets 4 aligned with the X-axis direction, and the X-axis feeding unit is operated to perform machining feeding in the X-axis direction so that the chuck table 24 is opposed to the cutting unit 16, whereby cutting grooves for dividing the wafer 2 into the individual devices 6 are formed along the streets 4. Next, the cutting unit 16 is indexed in the Y-axis direction with respect to the chuck table 24 by the Y-axis feeding unit in accordance with a preset indexing amount (interval in the Y-axis direction of the spacer lane 4 in a state before cutting processing is performed). In this case, when the cutting grooves are formed by the cutting device 12 as described above, the Y-axis direction of the streets 4 and the Y-axis direction of the cutting tool 34 due to thermal expansion of the spindle 32 are offset in association with the cutting operation, and the cutting operation and the indexing operation are alternately repeated to perform the cutting operation on all streets 4 aligned with the X-axis direction. In a state where such a shift occurs, when the cutting process is repeated while the indexing is performed in accordance with the preset indexing amount, the device 6 may be damaged by cutting to a position deviated from the streets 4. Therefore, when the cutting groove is formed by the cutting device 12, correction of the machining position (i.e., correction of the offset of the spacer 4 from the cutting groove) is performed after cutting is performed several times. In the correction of the machining position, first, the lane correction is performed, the offset in the Y-axis direction between the lane 4 and the reference line L is obtained and stored as a correction value for the lane 4, and then the machining groove correction is performed, and the offset in the Y-axis direction between the cutting groove and the reference line L is obtained and stored as a correction value for the cutting groove. In fig. 3, a cutting groove formed along the spacer 4 is denoted by reference numeral 54.
In the lane correction, first, as shown in fig. 3, the X-axis feeding unit and the Y-axis feeding unit are operated to align the wafer 2 with the imaging unit 18, and the imaging unit 18 images the lane 4 in which the cutting groove 54 is newly formed. The image captured by the capturing unit 18 is displayed on the image display section 38 of the display unit 20 as shown in fig. 5, for example. In addition, in the case where a metal pattern called TEG (Test Element Group: test element group) is periodically provided in the streets 4, there is a possibility that a metal burr or the like is generated in the cutting groove of the portion where the TEG is cut, and when the cutting groove of the portion is imaged, the metal burr or the like is erroneously recognized as the cutting groove, and therefore, in such a case, the X-axis operation unit 44 is operated to adjust the position of the streets 4 imaged by the imaging unit 18, and the cutting groove of the portion where the TEG is not provided is imaged. Next, based on the captured image, as shown in fig. 6, the Y-axis operation unit 46 is operated to move the Y-axis direction central position of the spacer 4 displayed on the image display unit 38 toward the reference line L. At this time, the operator observes the photographed image, and adjusts the position of the spacer 4 by visual measurement so that the Y-axis direction central position of the spacer 4 coincides with the reference line L, so that it is difficult to accurately position the Y-axis direction central position of the spacer 4 at the reference line L by one operation of the Y-axis operation unit 46. Therefore, the movable wire operating unit 50 is operated so that the interval between the pair of movable wires 48 matches the width of the spacer 4, and it is checked whether or not the center position in the Y-axis direction of the spacer 4 matches the reference line L. As described above, the pair of movable lines 48 approach and separate while maintaining the line-symmetrical relationship about the reference line L as the symmetry axis, and therefore, when the interval of the pair of movable lines 48 coincides with the width of the spacer 4, the center position of the spacer 4 in the Y-axis direction coincides with the reference line L. Further, when the Y-axis operation unit 46 and the movable wire operation unit 50 are appropriately repeated and the interval between the pair of movable wires 48 matches the width of the spacer 4 as shown in fig. 7, the spacer correction button 40 is touched. Then, the distance of movement of the spacer 4 in the Y-axis direction (the amount of offset between the spacer 4 and the reference line L) from the position before correction is stored in the storage means of the cutting device 12 as a correction value in the Y-axis direction of the spacer 4. The correction value of the spacer 4 is displayed on a correction value display section 52 (in the illustrated embodiment, -5.5 μm) of the display unit 20. In the illustrated embodiment, even if the operator touches the machining groove correction button 42 by mistake in such a lane correction, the correction value of the lane 4 is not stored as the correction value of the cutting groove 54 because an error is reported when the interval between the pair of movable lines 48 is not set to be recognized as the interval of the width of the cutting groove 54. In fig. 7, for convenience of explanation, a pair of movable lines 48 are shown at intervals slightly wider than the width of the streets 4.
Next, the machining groove correction will be described. Starting machining groove correction from a state where the Y-axis direction center position of the spacer 4 is aligned with the reference line L, first, as shown in fig. 8, the Y-axis operation unit 46 is operated to move the Y-axis direction center position of the cutting groove 54 displayed on the image display unit 38 toward the reference line L. Next, the movable wire operating unit 50 is operated so that the interval between the pair of movable wires 48 matches the width of the cutting groove 54, and it is checked whether the center position in the Y-axis direction of the cutting groove 54 matches the reference line L. Further, when the Y-axis operation unit 46 and the movable wire operation unit 50 are appropriately repeated and the interval between the pair of movable wires 48 matches the width of the cutting groove 54 as shown in fig. 9, the machining groove correction button 42 is touched. Then, the movement distance in the Y-axis direction of the cutting groove 54 from the state where the center position in the Y-axis direction of the spacer 4 is aligned with the reference line L is stored in the storage means of the cutting device 12 as the correction value in the Y-axis direction of the cutting groove 54. The correction value of the cutting groove 54 is displayed on a correction value display section 52 (in the illustrated embodiment, +1.2μm) of the display unit 20. In the illustrated embodiment, even if the operator touches the lane correction button 40 by mistake in performing such a machining groove correction, the error is reported when the interval between the pair of movable lines 48 is not set to be the interval recognized as the width of the lane 4, and therefore the correction value of the cutting groove 54 is not stored as the correction value of the lane 4. In fig. 9, for convenience of explanation, a pair of movable lines 48 are shown at intervals slightly wider than the width of the cutting groove 54.
As described above, in the correction of the machining position, first, in the lane correction, the movement distance in the Y-axis direction of the lane 4 (the amount of displacement between the lane 4 and the reference line L) from the position before correction is obtained, and then in the machining groove correction, the movement distance in the Y-axis direction of the cutting groove 54 (the amount of displacement between the cutting groove 54 and the reference line L) from the state where the center position in the Y-axis direction of the lane 4 is aligned with the reference line L is obtained, so that the amount of displacement between the lane 4 and the cutting groove 54 can be accurately obtained using the reference line L. Then, the cutting groove 54 can be formed at the center position in the Y axis direction of the spacer 4 by performing the indexing according to the indexing amount after the correction of the correction value of the cutting groove 54 is added to the indexing amount set in advance.
As described above, in the illustrated embodiment, when the lane correction button 40 is touched with the interval of the pair of movable lines 48 not set to be the interval of the width of the lane 4, an error is notified, and when the processing groove correction button 42 is touched with the interval of the pair of movable lines 48 not set to be the interval of the width of the cutting groove 54, an error is notified, and therefore, the offset amount of the lane 4 and the reference line L is not stored as the correction value of the cutting groove 54, and the offset amount of the cutting groove 54 and the reference line L is not stored as the correction value of the lane 4, and the indexing feeding can be performed with high accuracy to form the high-accuracy cutting groove 54 in the lane 4.
In the illustrated embodiment, the cutting device 12 having the cutting means 16 is described, and the cutting means 16 has the cutting tool 34 for cutting the streets 4 of the wafer 2 held by the holding means 14, and the cutting tool 34 is rotatable, but may be a laser processing device having a laser beam irradiation means for irradiating the streets 4 of the wafer 2 held by the holding means with laser beams to form separation grooves.
Claims (3)
1. A processing apparatus for forming a processing groove for dividing a wafer having a plurality of devices formed on a front surface thereof by dividing a street into the devices, the processing apparatus comprising at least:
a holding unit that holds a wafer;
a processing unit that forms a processing groove in the spacer of the wafer held by the holding unit;
an X-axis feeding unit that causes the holding unit and the processing unit to perform processing feeding relatively in an X-axis direction;
a Y-axis feeding unit that causes the holding unit and the processing unit to perform indexing feeding relatively in a Y-axis direction perpendicular to the X-axis direction;
a photographing unit having a microscope with a reference line, the microscope photographing the wafer held by the holding unit to detect the streets and the processing grooves; and
the display unit is provided with a display unit,
the display unit displays:
an image display unit that displays the image captured by the capturing unit;
a spacer correction button for storing an offset between the spacer and the reference line as a correction value;
a processing groove correction button for storing an offset between the processing groove and the reference line as a correction value;
a Y-axis operation unit for operating the Y-axis feeding unit;
a pair of movable lines which are located near to and far from the reference line and maintain line symmetry across the reference line; and
a movable wire operating unit for operating the pair of movable wires,
when the inter-track correction button is touched with the interval of the pair of movable wires not set to an interval recognized as the width of the inter-track, an error is notified,
when the processing groove correction button is touched with the interval of the pair of movable lines not set to be recognized as the interval of the width of the processing groove, an error is notified.
2. The processing apparatus according to claim 1, wherein,
when the Y-axis operation part is operated to move the position of the spacer displayed on the image display part to the reference line and the movable line operation part is operated to match the width of the pair of movable lines with the width of the spacer, the movement distance of the spacer is stored as a correction value of the spacer,
when the Y-axis operation unit is operated to move the position of the processing groove displayed on the image display unit to the reference line and the movable line operation unit is operated to match the pair of movable lines with the width of the processing groove, the movement distance of the processing groove is stored as a correction value of the processing groove.
3. The processing apparatus according to claim 1, wherein,
the machining unit is a cutting unit having a cutting tool and the cutting tool is rotatable, and the machining groove is a cutting groove.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2018027609A JP6998232B2 (en) | 2018-02-20 | 2018-02-20 | Processing equipment |
| JP2018-027609 | 2018-02-20 |
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| CN110176410A CN110176410A (en) | 2019-08-27 |
| CN110176410B true CN110176410B (en) | 2023-08-18 |
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| JP (1) | JP6998232B2 (en) |
| KR (1) | KR102595400B1 (en) |
| CN (1) | CN110176410B (en) |
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| Publication number | Publication date |
|---|---|
| KR102595400B1 (en) | 2023-10-27 |
| JP6998232B2 (en) | 2022-01-18 |
| KR20190100022A (en) | 2019-08-28 |
| TWI776021B (en) | 2022-09-01 |
| JP2019145637A (en) | 2019-08-29 |
| CN110176410A (en) | 2019-08-27 |
| TW201935551A (en) | 2019-09-01 |
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