CN110176410B - Processing device - Google Patents

Abstract

Provides a processing device that does not make mistakes in the offset correction of the interval track and the offset correction of the machining groove including the cutting groove and the dividing groove. The processing device (12) has at least a holding unit (14), a processing unit (16), an X-axis feed unit, a Y-axis feed unit, an imaging unit (18), and a display unit (20). Displayed on the display unit (20) are an image display portion (38), an interval track correction button (40), a machining groove correction button (42), a Y-axis action portion (46), a pair of movable lines (48) and a movable A moving line action part (50). When the distance between the pair of movable lines (48) is not set to the distance recognized as the width of the distance lane (4), when the distance correction button (40) is touched, an error is reported. When the machining tank correction button (42) is touched when the distance between the pair of movable lines (48) is not set to be recognized as the width of the machining tank (54), an error is reported.

Description

Processing device

technical field

The present invention relates to a processing device that forms processing slots for dividing a wafer having a plurality of devices formed on the front surface divided by lanes into individual devices.

Background technique

A wafer divided by streets (segmentation planning lines) and formed with devices such as ICs and LSIs on the front surface is cut by a cutting device on the streets to be divided into individual devices, and the divided devices are used in mobile phones, personal computers, etc. Electronic equipment.

The cutting device has at least: a holding unit, which holds the wafer; a cutting unit, which has a cutting tool capable of cutting the interval lanes of the wafer held by the holding unit; and an X-axis feed unit, which makes the holding unit The unit and the cutting unit perform cutting feed relatively in the X-axis direction; the Y-axis feed unit makes the holding unit and the cutting unit perform index feed relatively in the Y-axis direction perpendicular to the X-axis direction; the photographing unit , which is equipped with a microscope with a reference line, the microscope photographs the wafer held by the holding unit, thereby detecting the spacer and the cutting groove; and a display unit, the cutting device can cut the spacer of the wafer with high precision (for example, Refer to Patent Document 1).

That is, displayed on the display unit are: an image display section, which displays an image captured by the photographing unit; a gap correction button, which is used to store the offset between the gap and the reference line as a correction value; The button is used to store the offset between the cutting groove and the reference line as a correction value; the X-axis operation part is used to operate the X-axis feed unit; the Y-axis operation part is used to operate the Y-axis feed unit ; a pair of movable wires, which maintain line symmetry across the reference line, and approach and distance from the reference line; When the center of the interval lane is positioned on the reference line and the interval between a pair of movable lines is positioned as the width of the interval lane, when the interval lane correction button is touched, the movement distance of the interval lane is stored as a correction value in the Y-axis direction and is displayed on the next Calibration is performed in the index feed of the interval so that the reference line coincides with the center of the interval.

In addition, when the Y-axis operating part is operated to position the center of the cut groove on the reference line and the distance between a pair of movable lines is positioned to the width of the cut groove, when the cut groove correction button is touched, the Y axis of the cut groove is adjusted. The moving distance in the axial direction is stored as a correction value in the Y-axis direction and corrected in the index feed of the next track so that the reference line coincides with the center of the cutting groove and the cutting groove is formed in the center of the track.

Patent Document 1: Japanese Patent Laid-Open No. 2014-113669

However, there is a problem that when the cut groove correction button is touched while the center of the lane is positioned on the reference line and the distance between the pair of movable lines is set to the width of the lane by operating the Y-axis operating unit, The correction value of the interval track is stored as the correction value of the cutting groove, so high-precision index feeding cannot be performed, and the interval track cannot be cut with high precision.

In addition, there is a problem that when the gap correction button is touched while the center of the cutting groove is positioned on the reference line and the distance between a pair of movable lines is set to the width of the cutting groove by operating the Y-axis operating unit, The correction value of the cutting groove is stored as the correction value of the spacer, so the center of the spacer cannot be cut with high precision.

The above-mentioned problems also occur in a laser processing apparatus that forms division grooves by irradiating laser beams to the lanes.

Contents of the invention

The subject of this invention made|formed in view of the above-mentioned fact is to provide a processing apparatus which does not make a mistake|misalignment correction of the offset of a spacer, and the offset correction of the processing groove|channel including a cutting groove and a division|segmentation groove.

In order to solve the above-mentioned problems, the present invention provides the following processing apparatus. That is, the processing device forms a processing slot for dividing a wafer having a plurality of devices formed on the front surface by dividing by the spacer into individual devices, wherein the processing device at least has: a holding unit that holds the wafer; a processing unit that It forms processing grooves at intervals of the wafers held by the holding unit; the X-axis feeding unit makes the holding unit and the processing unit relatively perform processing feeding in the X-axis direction; the Y-axis feeding unit, which The holding unit and the processing unit are indexed and fed relative to each other in the Y-axis direction perpendicular to the X-axis direction; the photographing unit is provided with a microscope with a reference line, and the microscope photographs the wafer held by the holding unit , so as to detect the interval road and the processing groove; and the display unit, which is displayed on the display unit: an image display part, which displays the image taken by the shooting unit; an interval road correction button, which is used to align the interval road with the reference line The offset of the processing groove is stored as a correction value; the processing groove correction button is used to store the offset between the processing groove and the reference line as a correction value; the Y-axis action part makes the Y-axis feed unit action; a pair of movable wires, which maintain line symmetry across the reference line, approach and distance from the reference line; and a movable wire action part, which makes the pair of movable wires move, When the gap between the movable lines is not set to be recognized as the gap of the width of the gap, when the gap correction button is touched, an error is reported. When the gap between the pair of movable lines is not set to be recognized as When the gap between the width of the machining groove is touched, an error will be reported when the machining groove correction button is touched.

Preferably, the pair of movable lines and the pair of movable lines and When the gap correction button is touched when the width of the gap is the same, the moving distance of the gap is stored as a correction value of the gap, and when the Y-axis operation part is operated to display on the image display part When the position of the processing tank is moved to the reference line and the movable line action part is operated to make the pair of movable lines coincide with the width of the processing tank, when the processing tank correction button is touched, the movement of the processing tank The distance is stored as a correction value for machining grooves. Preferably, the machining unit is a cutting unit with a cutting tool and the cutting tool is rotatable, and the machining groove is a cutting groove.

The processing device provided by the present invention at least has: a holding unit, which holds the wafer; a processing unit, which forms a processing groove at the interval of the wafer held by the holding unit; an X-axis feed unit, which makes the holding unit and The processing unit performs processing feed relatively in the X-axis direction; the Y-axis feed unit makes the holding unit and the processing unit perform indexing feed relatively in the Y-axis direction perpendicular to the X-axis direction; photographing A unit, which has a microscope with a reference line, the microscope photographs the wafer held by the holding unit, thereby detecting the spacer and the processing groove; The image taken by the shooting unit; the interval track correction button, which is used to store the offset between the interval track and the reference line as a correction value; The amount of movement is stored as a correction value; the Y-axis action unit moves the Y-axis feed unit; a pair of movable wires maintains line symmetry across the reference line, approaches and moves away from the reference line; and The moving line action unit moves the pair of movable lines, and when the gap correction button is touched when the gap between the pair of movable lines is not set to be recognized as the width of the gap, an error is reported. , when the gap between the pair of movable lines is not set to be recognized as the gap of the width of the processing groove, when the processing groove correction button is touched, an error will be reported, so the distance between the interval track and the reference line will not be The offset is stored as the correction value of the machining groove, and the offset between the machining groove and the reference line is not stored as the correction value of the interval track, and it is possible to perform index feeding with high precision and form in the interval lane High-precision processing slots.

Description of drawings

FIG. 1 is a perspective view of a wafer.

Fig. 2 is a perspective view of a processing device constructed according to the present invention.

Fig. 3 is a perspective view of an imaging unit and a wafer during calibration.

FIG. 4 is a schematic diagram of an image displayed on the display unit shown in FIG. 2 .

Fig. 5 is a schematic diagram of an image before correction.

FIG. 6 is a schematic diagram of an image in a state where the position of the lane is moved to the reference line from the state shown in FIG. 5 .

FIG. 7 is a schematic diagram of an image in a state where a pair of movable wires are made to match the width of a spacer track from the state shown in FIG. 6 .

Fig. 8 is a schematic diagram of an image in a state where the position of the processing tank has been moved to the reference line from the state shown in Fig. 7 .

Fig. 9 is a schematic diagram of an image in a state where a pair of movable wires are made to match the width of a processing groove from the state shown in Fig. 8 .

Label description

2: wafer; 4: spacer; 12: cutting device (processing device); 14: holding unit; 16: cutting unit (processing unit); 18: photographing unit; 20: display unit; 34: cutting tool; 36: microscope ;38: Image display section; 40: Interval track correction button; 42: Processing slot correction button; 46: Y-axis action section; 48: Movable line; 50: Movable line action section; 54: Cutting slot (processing slot) ; L: baseline.

Detailed ways

Hereinafter, an embodiment of a processing apparatus configured according to the present invention will be described with reference to the drawings.

FIG. 1 shows a disk-shaped wafer 2 that can be processed by a processing device configured according to the present invention. The front surface 2a of the wafer 2 is divided into a plurality of rectangular areas by a plurality of partitions 4 formed in a lattice shape, and a plurality of devices 6 such as ICs and LSIs are formed in the plurality of rectangular areas. In the illustrated embodiment, the wafer 2 is stuck on the adhesive tape 10 whose peripheral edge is fixed to the ring frame 8 .

Cutting device 12 shown in Fig. 2 is an example of the processing device that constitutes according to the present invention, and this cutting device 12 has at least: holding unit 14, and it holds wafer 2; The spacer 4 of the wafer 2 held by 14 forms a processing groove; the X-axis feed unit (not shown), which makes the holding unit 14 and the cutting unit 16 in the X-axis direction (direction shown by arrow X in FIG. 1 ) Machining feed is carried out relatively; Y-axis feed unit (not shown), which makes the holding unit 14 and the cutting unit 16 face each other in the Y-axis direction (direction shown by arrow Y in FIG. 1 ) perpendicular to the X-axis direction Carry out index feeding; photographing unit 18; and display unit 20. In addition, the plane defined by the X-axis direction and the Y-axis direction is substantially horizontal. In addition, the Z-axis direction indicated by the arrow Z in FIG. 1 is an up-down direction perpendicular to the X-axis direction and the Y-axis direction.

The holding unit 14 includes a circular chuck table 24 , and the chuck table 24 is attached to the device case 22 so as to be rotatable and movable in the X-axis direction. The chuck table 24 is rotated around an axis extending in the Z-axis direction by a chuck table motor (not shown) built in the device case 22 . The above-mentioned X-axis feed unit in the illustrated embodiment includes: a ball screw (not shown), which is connected to the chuck table 24 and extends in the X-axis direction; and a motor (not shown), which makes the The ball screw rotates, and the X-axis feed unit causes the chuck table 24 to perform processing feed in the X-axis direction relative to the cutting unit 16 . A porous circular suction chuck 26 connected to a suction unit (not shown) is disposed on the upper end portion of the chuck workbench 24. In the chuck workbench 24, suction is generated on the suction chuck 26 by the suction unit. force, thereby attracting and holding the wafer 2 placed on the upper surface. In addition, a plurality of jigs 28 for fixing the ring frame 8 are arranged at intervals in the circumferential direction on the peripheral edge of the chuck table 24 .

The cutting unit 16 includes: a spindle housing 30 supported on the device housing 22 in a manner that can move freely in the Y-axis direction and in the Z-axis direction (lifting freely); and a spindle 32 that can move in the Y-axis direction The spindle housing 30 is supported to rotate about its axis; a motor (not shown) rotates the spindle 32 ; and a cutting tool 34 is fixed to the front end of the spindle 32 . In this way, the cutting unit 16 as a machining unit for forming machining grooves in the streets 4 of the wafer 2 has a cutting tool 34 and the cutting knife 34 is rotatable. In the illustrated embodiment, the machining grooves formed in the wafer 2 are formed by cutting Cutting flutes formed by cutter 34 . The above-mentioned Y-axis feed unit includes: a ball screw (not shown), which is connected to the main shaft housing 30, and extends along the Y-axis direction; and a motor (not shown), which rotates the ball screw, and the above-mentioned Y-axis The feeding unit makes the spindle housing 30 index-feed relative to the holding unit 14 in the Y-axis direction. In addition, the spindle housing 30 is fed (lifted) in the Z-axis direction through the Z-axis feed unit, and the Z-axis feed unit may include: a ball screw (not shown), which extends along the Z-axis direction; and an electric motor (not shown), which rotates the ball screw.

As shown in FIG. 2 , the photographing unit 18 is disposed above the moving path of the chuck table 24 . 3 and 4, the photographing unit 18 is provided with a microscope 36 having a reference line L, and the microscope 36 photographs the wafer 2 held by the holding unit 14 to detect the spacer 4 and the processing groove (in the illustrated embodiment). In the way, it is cutting groove) (refer to Figure 4). A reference line L extending in the X-axis direction is formed on a lens of the microscope 36 or an imaging element (not shown) such as a CCD. In addition, the microscope 36 is supported by the spindle housing 30 , moves in the Y-axis direction by the Y-axis feed unit together with the spindle housing 30 , and moves in the Z-axis direction by the Z-axis feed unit.

The display unit 20 in the illustrated embodiment is constituted by a touch panel provided on the upper front surface of the device case 22 . As shown in Figure 4, on the display unit 20 are displayed: an image display part 38, which displays the image taken by the photographing unit 18; Store as a correction value; the processing groove correction button 42 is used to store the offset between the processing groove and the reference line L as a correction value; the X-axis action part 44 makes the X-axis feed unit operate; Y Axis operating part 46, which makes the Y-axis feed unit move; a pair of movable wires 48, which maintain line symmetry across the reference line L, approach and distance from the reference line L; movable wire operating part 50, which makes a Operate the movable wire 48; and the correction value display unit 52.

The image display part 38 displays the image captured by the imaging unit 18 with the horizontal axis being the X-axis direction and the vertical axis being the Y-axis direction. The reference lines L of 18 are shown together parallel to the X-axis direction. The gap correction button 40 is a button for storing the offset amount between the gap 4 and the reference line L as a correction value in a storage unit (not shown) of the cutting device 12. When the position of the lane 4 displayed on the image display unit 38 is moved to the reference line L and the movable line operating unit 50 is operated so that the width of the pair of movable lines 48 is consistent with the width of the lane 4, touch the lane. When the correction button 40 is pressed, the moving distance of the interval track 4 is stored in the storage unit as the correction value of the interval track 4 . In addition, the processing groove correction button 42 is a button for storing the deviation amount between the processing groove and the reference line L as a correction value in the above-mentioned storage unit, and when the Y-axis operation part 46 is operated to display it on the image display part When the position of the machining groove at 38 is moved to the reference line L and the movable wire actuating part 50 is operated to make the pair of movable wires 48 coincide with the width of the machining groove, when the processing groove correction button 42 is touched, the processing groove will be adjusted. The moving distance is stored in the storage means as a correction value of the machining tank. In addition, in the illustrated embodiment, when the distance between a pair of movable wires 48 is not set to be recognized as the distance (for example, 45 μm or more) of the width of the lane 4 (for example, 50 μm to 60 μm), touch the distance When the track correction button 40 is pressed, an error is reported. When the interval between a pair of movable lines 48 is not set to the interval (for example, less than 45 μm) recognized as the width of the processing groove (for example, 25 μm to 35 μm), the processing tank is touched. When the calibration button 42 is pressed, an error is reported. Therefore, when storing the offset amount between the lane 4 and the reference line L as a correction value, even if the operator touches the machining tank correction button 42 by mistake, the correction value of the lane 4 will not be used as the calibration of the machining tank. The value is stored in the above storage unit. In addition, when storing the offset amount between the machining tank and the reference line L as a correction value, even if the operator touches the lane correction button 40 by mistake, the correction value of the machining tank will not be used as the correction value of the lane 4 to be stored in the above storage unit. In addition, examples of an error notification include an error display on the display unit 20 , extinguishing or lighting of a warning lamp (not shown), notification of a warning sound, and the like.

The X-axis operation part 44 has: a right direction operation part 44a, which moves the X-axis feed unit to move the imaging area of the imaging unit 18 to the right in FIG. 4; The action of the feed unit moves the imaging area of the imaging unit 18 to the left in FIG. 4 . In addition, the Y-axis operation part 46 has: the upward direction operation part 46a which operates the Y-axis feed unit to move the imaging unit 18 upward in FIG. The unit operates to move the imaging unit 18 downward in FIG. 4 . In addition, the movable wire operating part 50 has: a movable wire approaching part 50a which makes the pair of movable wires 48 approach toward the reference line L while maintaining a line-symmetrical relationship with the reference line L as the axis of symmetry; The wire distance part 50b moves the pair of movable wires 48 away from the reference line L while maintaining the relationship of line symmetry with the reference line L as the axis of symmetry.

When cutting grooves are formed on the streets 4 of the wafer 2 using the cutting device 12 as described above, the wafer 2 is sucked and held on the upper surface of the chuck table 24 with the front surface 2 a of the wafer 2 facing upward. In addition, the annular frame 8 is fixed by a plurality of clamps 28 . Next, the wafer 2 is photographed from above by the photographing unit 18, and the X-axis feed unit, the Y-axis feed unit, and the motor for the chuck table are operated according to the image of the wafer 2 photographed by the photographing unit 18 to move the spacer. 4 coincides with the X-axis direction, and the cutting tool 34 is positioned above the spacer 4 coincident with the X-axis direction. Next, the cutting tool 34 is rotated together with the main shaft 32 by the motor. Next, the following cutting process is implemented: the main shaft housing 30 is lowered by the Z-axis feed unit, the edge of the cutting tool 34 is cut into the spacer 4 consistent with the X-axis direction, and the X-axis feed unit is operated to make the The chuck table 24 is processed in the X-axis direction relative to the cutting unit 16 , thereby forming cutting grooves for dividing the wafer 2 into individual devices 6 along the lanes 4 . Then, according to the preset indexing feed amount (the interval in the Y-axis direction of the interval road 4 under the state before the cutting process), utilize the Y-axis feed unit to make the cutting unit 16 relative to the chuck table 24 in the Y direction. Index feed is performed in the axis direction. In addition, cutting and indexing are repeated alternately to perform cutting on all the partitions 4 that coincide with the X-axis direction. At this time, when cutting grooves are formed by the cutting device 12 as described above, accompanying The deviation in the Y-axis direction of the spacer 4 during the cutting process, and the deviation in the Y-axis direction of the cutting tool 34 due to the thermal expansion of the main shaft 32 . In such a state where such a deviation occurs, when the cutting process is repeated while performing index feed according to a preset index feed amount, the device 6 may be damaged by cutting to a position deviated from the street 4 . Therefore, when cutting grooves are formed by the cutting device 12 , correction of the machining position (that is, correction of offset between the streets 4 and the cutting grooves) is performed after several cutting operations. In the correction of the machining position, the gap correction is first carried out, the offset in the Y-axis direction between the gap 4 and the reference line L is obtained, and stored as the correction value of the gap 4, and then the machining groove correction is performed, The amount of deviation between the cutting groove and the reference line L in the Y-axis direction is obtained and stored as a correction value of the cutting groove. In addition, in FIG. 3, reference numeral 54 indicates the cutting groove formed along the partition road 4. As shown in FIG.

In the gap correction, first, as shown in FIG. 3 , the X-axis feed unit and the Y-axis feed unit are operated to align the wafer 2 and the imaging unit 18, and the imaging unit 18 is used to perform alignment on the newly formed cutting groove 54. Shots were taken at intervals of lane 4. The image captured by the imaging unit 18 is displayed on the image display unit 38 of the display unit 20 as shown in FIG. 5 , for example. In addition, when a metal pattern called TEG (Test Element Group: Test Element Group) is periodically provided in the street 4, metal burrs or the like are generated in the cutting groove of the part where the TEG is cut. When photographing the cutting groove of this part, there is a possibility that metal burrs and the like may be mistaken for the cutting groove. Therefore, in such a case, the X-axis operation part 44 is operated to perform imaging of the partition road 4 photographed by the imaging unit 18. Adjust the position and take pictures of the cutting grooves in the parts where the TEG is not installed. Next, based on the captured image, the Y-axis operation unit 46 is operated to move the center position in the Y-axis direction of the lane 4 displayed on the image display unit 38 toward the reference line L as shown in FIG. 6 . At this time, the operator observes the captured image and adjusts the position of the partition road 4 by visual measurement so that the center position of the partition road 4 in the Y-axis direction coincides with the reference line L. The action locates the central position of the partition lane 4 in the Y-axis direction on the reference line L accurately. Therefore, the movable wire operating unit 50 is operated so that the distance between the pair of movable wires 48 matches the width of the lane 4, and it is checked whether the center position of the lane 4 in the Y-axis direction coincides with the reference line L. As described above, the pair of movable wires 48 approaches and moves away while maintaining a line-symmetrical relationship with the reference line L as the axis of symmetry. The center position in the Y-axis direction of the partition road 4 coincides with the reference line L. As shown in FIG. And, suitably repeat the action of the Y-axis operating part 46 and the action of the movable line operating part 50, when the interval of a pair of movable lines 48 is consistent with the width of the spaced road 4 as shown in Figure 7, touch the spaced road. Calibration button 40 . Then, the movement distance of the lane 4 in the Y-axis direction from the position before correction (the amount of deviation between the lane 4 and the reference line L) is stored in the cutting device 12 as the correction value of the Y-axis direction of the lane 4 the above storage unit. The correction value of the interval track 4 is displayed on the correction value display portion 52 of the display unit 20 (-5.5 μm in the illustrated embodiment). In the illustrated embodiment, even if the operator accidentally touches the processing groove correction button 42 when performing such gap correction, since the distance between the pair of movable lines 48 is not set so as to be recognized as the cutting groove 54 In the case of a gap with a wider width, an error is reported, so the correction value of the gap track 4 is not stored as the correction value of the cutting groove 54 . In addition, in FIG. 7 , for convenience of description, a pair of movable wires 48 are shown at intervals slightly wider than the width of the partition lane 4 .

Next, machining groove correction will be described. Starting from the state where the central position of the partition road 4 in the Y-axis direction coincides with the reference line L, first, as shown in FIG. The central position in the Y-axis direction moves toward the reference line L. Next, the movable wire operating unit 50 is operated so that the distance between the pair of movable wires 48 matches the width of the cutting groove 54, and it is checked whether the center position of the cutting groove 54 in the Y-axis direction coincides with the reference line L. And, the operation of the Y-axis operation part 46 and the operation of the movable wire operation part 50 are repeated appropriately, and when the distance between the pair of movable wires 48 is consistent with the width of the cutting groove 54 as shown in FIG. Correction button 42 . Then, the movement distance of the cutting groove 54 in the Y-axis direction from the state in which the center position of the partition road 4 in the Y-axis direction coincides with the reference line L is stored in the cutting machine as a correction value of the cutting groove 54 in the Y-axis direction. The aforementioned storage unit of device 12 . The correction value of the cutting groove 54 is displayed on the correction value display part 52 of the display unit 20 (+1.2 μm in the illustrated embodiment). In the illustrated embodiment, even if the operator touches the lane correction button 40 by mistake when performing such machining tank correction, since the distance between the pair of movable lines 48 is not set so as to be recognized as the lane 4 In the case of a gap of the width, an error is reported, so the correction value of the cut groove 54 is not stored as the correction value of the gap track 4 . In addition, in FIG. 9 , for convenience of description, a pair of movable wires 48 are shown at intervals slightly wider than the width of the cutting groove 54 .

As described above, regarding the correction of the machining position, first, in the track correction, the movement distance of the track 4 in the Y-axis direction from the position before correction (the amount of deviation between the track 4 and the reference line L) is obtained. Next, in the machined groove calibration, the movement distance of the cut groove 54 in the Y-axis direction from the state where the center position of the partition road 4 in the Y-axis direction coincides with the reference line L (the distance between the cut groove 54 and the reference line L) is obtained. The offset amount of the spacer 4 and the cutting groove 54 can be accurately calculated using the reference line L. And, the index feed is performed according to the corrected index feed amount obtained by adding the correction value of the cutting groove 54 to the preset index feed amount, so that the center of the Y-axis direction of the interval road 4 can The position forms a cutting groove 54 .

As described above, in the illustrated embodiment, when the interval between the pair of movable wires 48 is not set to be recognized as the interval of the width of the interval lane 4, when the interval lane correction button 40 is touched, an error is reported. , when the interval between a pair of movable lines 48 is not set to be recognized as the interval of the width of the cutting groove 54, when the processing groove correction button 42 is touched, an error will be reported, so the interval road 4 will not be aligned with the reference line. The offset amount of L is stored as the correction value of the cutting groove 54, and the offset amount of the cutting groove 54 and the reference line L is not stored as the correction value of the interval track 4, and the indexing can be performed with high precision. Thus, high-precision cutting grooves 54 are formed in the streets 4 .

In addition, in the illustrated embodiment, the cutting device 12 having the cutting unit 16 having the cutting blade 34 for cutting the streets 4 of the wafer 2 held by the holding unit 14 has been described, and the cutting unit 16 has The cutter 34 is rotatable, but may be a laser processing device having a laser beam irradiation unit that irradiates laser beams to the lanes 4 of the wafer 2 held by the holding unit to form dividing grooves.

Claims (3)

1. A processing apparatus for forming a processing groove for dividing a wafer having a plurality of devices formed on a front surface thereof by dividing a street into the devices, the processing apparatus comprising at least:

a holding unit that holds a wafer;

a processing unit that forms a processing groove in the spacer of the wafer held by the holding unit;

an X-axis feeding unit that causes the holding unit and the processing unit to perform processing feeding relatively in an X-axis direction;

a Y-axis feeding unit that causes the holding unit and the processing unit to perform indexing feeding relatively in a Y-axis direction perpendicular to the X-axis direction;

a photographing unit having a microscope with a reference line, the microscope photographing the wafer held by the holding unit to detect the streets and the processing grooves; and

the display unit is provided with a display unit,

the display unit displays:

an image display unit that displays the image captured by the capturing unit;

a spacer correction button for storing an offset between the spacer and the reference line as a correction value;

a processing groove correction button for storing an offset between the processing groove and the reference line as a correction value;

a Y-axis operation unit for operating the Y-axis feeding unit;

a pair of movable lines which are located near to and far from the reference line and maintain line symmetry across the reference line; and

a movable wire operating unit for operating the pair of movable wires,

when the inter-track correction button is touched with the interval of the pair of movable wires not set to an interval recognized as the width of the inter-track, an error is notified,

when the processing groove correction button is touched with the interval of the pair of movable lines not set to be recognized as the interval of the width of the processing groove, an error is notified.

2. The processing apparatus according to claim 1, wherein,

when the Y-axis operation part is operated to move the position of the spacer displayed on the image display part to the reference line and the movable line operation part is operated to match the width of the pair of movable lines with the width of the spacer, the movement distance of the spacer is stored as a correction value of the spacer,

when the Y-axis operation unit is operated to move the position of the processing groove displayed on the image display unit to the reference line and the movable line operation unit is operated to match the pair of movable lines with the width of the processing groove, the movement distance of the processing groove is stored as a correction value of the processing groove.

3. The processing apparatus according to claim 1, wherein,

the machining unit is a cutting unit having a cutting tool and the cutting tool is rotatable, and the machining groove is a cutting groove.