TWI751437B - Conductive ball inspection and repair device - Google Patents

Abstract

[Subject] It is possible to obtain a plurality of lighting functions. [Solution] The present invention includes an inspection device (2) and a repair device (3); the inspection device (2) has a main inspection part (20); the main inspection part (20) has a camera (200), a lens (201), and Lighting devices (41), (42), (43); lighting devices (41), (42), (43) between the camera (200) and lens (201) of the main inspection part (20) and the workpiece (W) Three layers are arranged along the vertical direction, that is, the Z direction; the lighting devices (41), (42), (43) of the three layers respectively illuminate the inspection part of the workpiece (W) and its surroundings; as a result, the present invention Multiple lighting functions are available.

Description

Conductive ball inspection and repair device

The present invention relates to an apparatus for inspecting and repairing conductive balls.

The following Patent Document 1 exists as a conductive ball inspection and repair device. The ball inspection and repair device of Patent Document 1 includes an inspection device and a repair device. The inspection device has a camera and an illumination device, and inspects whether the conductive ball is normally mounted on the electrode of the workpiece. When a portion where the conductive ball is not normally mounted is detected by the inspection device, the repairing device corrects (repairs) the portion so that the conductive ball is properly mounted. [Prior Art Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 2017-34175

[Problems to be solved by the invention]

However, in the ball inspection and repair device of Patent Document 1, a single layer of illumination device is arranged below the camera, so only one illumination function can be obtained.

The problem to be solved by the present invention is to provide a conductive ball inspection and repair device capable of obtaining a plurality of lighting functions. [Means for solving problems]

The conductive ball inspection and repair device of the present invention is characterized by comprising an inspection device and a repair device, wherein the inspection device has an inspection portion for inspecting whether the conductive ball is normally attached to an electrode of a workpiece, and the repair device includes a repair portion that repairs When the inspection part detects the part where the conductive ball is not normally installed, it corrects the part so that the conductive ball is installed normally; A plurality of layers are arranged along the vertical direction between the lens and the workpiece, and the workpiece is illuminated; the multi-layer lighting devices respectively have: a ring-shaped frame member with a space provided in the central part and a plurality of light-emitting elements arranged on the frame member. Group.

In the conductive ball inspection and repair apparatus of the present invention, it is preferable that the light-emitting element group is arranged in a ring shape following the ring shape of the frame member, and the center of the lens and the center of the frame member are on the same straight line.

In the conductive ball inspection and repair device of the present invention, it is preferable that the light-emitting element group of the lighting device arranged at the position closest to the workpiece among the multilayered lighting devices is composed of a plurality of groups, and the light-emitting element groups of the plurality of groups emit light respectively. The wavelengths of light are different for each group.

In the conductive ball inspection and repair device of the present invention, it is preferable that among the multilayered lighting devices, the lighting device arranged at the position closest to the workpiece has a light diffusing member that diffuses the light emitted from the light-emitting element group. Incident and emitted to the workpiece side as diffused light.

In the conductive ball inspection and repair device of the present invention, it is preferable that the lighting device arranged at the position closest to the workpiece among the multilayered lighting devices is the lighting device that mainly illuminates the conductive ball.

In the conductive ball inspection and repair device of the present invention, it is preferable that the lighting device arranged at the position closest to the workpiece among the multilayer lighting devices has a light diffusing member, and is a lighting device that mainly illuminates the conductive ball, Here, the light diffusing member enters the light emitted from the light-emitting element group and emits it toward the workpiece as diffused light.

In the conductive ball inspection and repair device of the present invention, it is preferable that the light-emitting element group of the lighting device arranged at the position closest to the workpiece among the multilayered lighting devices is composed of multiple groups; The wavelength of light is different for each group; among the multilayer lighting devices, the wavelengths of light emitted by the light-emitting element groups of the lighting devices other than the lighting device arranged at the position closest to the workpiece are higher than those of the multiple groups. The shortest wavelength of the light emitted by the light-emitting element group is longer.

In the conductive ball inspection and repair device of the present invention, it is preferable that the workpiece is a substrate on which wirings are formed, and that the lighting devices other than the lighting device arranged at the position closest to the workpiece among the multilayer lighting devices are mainly directed to the workpiece. A lighting device that illuminates by wiring. (invention effect)

According to the conductive ball inspection and repair apparatus of the present invention, a plurality of lighting functions can be obtained.

Hereinafter, an example of an embodiment (Example) of the conductive ball inspection and repair apparatus according to the present invention will be described in detail with reference to the accompanying drawings. In this specification, left, right, front, back, top, and bottom are left, right, front, back, top, and bottom when the operator observes the conductive ball inspection and repair device according to the present invention. In addition, in the drawings, since it is a schematic diagram, the main components are shown, and the illustration of components other than the main components is omitted.

(Description of the configuration of the embodiment) Hereinafter, the configuration of the conductive ball inspection and repair apparatus according to the present embodiment will be described. In addition, the patent document 1 can also be referred to the electroconductive ball inspection and repair apparatus which concerns on this embodiment.

In FIGS. 1 to 3 , reference numeral “1” denotes the conductive ball inspection and repair apparatus according to the present embodiment. In addition, in FIGS. 1 to 4 , the symbol “X1” is the left side, “X2” is the “right side”, “Y1” is the “front (front) side”, and “Y2” is the “rear (inside, opposite) side” , "Z1" is "upper side", "Z2" is "lower side".

Here, "X direction" as the horizontal direction is "X1-X2 direction, left-right direction", similarly, "Y direction" as the horizontal direction is "Y1-Y2 direction, front-back direction", and "Z direction" as the vertical direction Direction" is "Z1-Z2 direction, up-down direction". The X direction, the Y direction, and the Z direction are orthogonal to each other, respectively.

(Description of workpiece W) As shown in FIGS. 1 to 3 , the workpiece W is a substrate in this example. This substrate is formed of conductive wirings on an insulating plate. The insulating plate is made of synthetic resin containing glass fibers. The conductive wiring is mainly composed of copper.

Here, in the manufacturing process of the substrate, the insulating plate thermally expands or contracts due to the heat treatment when the wiring is formed on the insulating plate. As a result, a dimensional error occurs between the designed wiring pattern and the manufactured wiring pattern. Therefore, when the workpiece W is a substrate, a process of actually confirming and registering the manufactured wiring pattern is required in the pre-process of inspection.

This process is performed by recognizing target marks, alignment marks, etc. (not shown) attached to the substrate in the main inspection unit 20 to be described later. This process is "the inspection pattern registration of the workpiece W" shown in the process S3 in FIG. 10 .

The workpiece W of this example is formed in the shape of a disk. Moreover, as the workpiece|work W, in addition to the disc shape of this example, it is also formed in a rectangular shape. Furthermore, a plurality of square-shaped integrated circuit chips (not shown) are formed on one surface of the workpiece W, and the plurality of integrated circuit chips are arranged vertically and horizontally. The number of integrated circuit chips is determined according to the diameter (diameter) of the workpiece W. The diameter of the workpiece W is, for example, 50 mm to 300 mm. In addition, the thickness of the workpiece|work W is 0.5 mm - 1 mm, for example. On the other hand, the length of one side of the integrated circuit chip is, for example, 30 mm.

The workpiece W in the shape of a circular plate needs to be oriented before the work process. Therefore, a straight portion (not shown) or a notch portion (not shown) is provided on the circumferential edge of the workpiece W as a mark for alignment. In addition, the composition and number of the integrated circuit chips in the workpiece W are different for each circuit design. Therefore, the workpiece W is provided with an identification mark (not shown) for identifying the workpiece W for each circuit design.

As shown in FIG. 9 , the conductive balls B are mounted on the workpiece W (a plurality of integrated circuit chips) by a conductive ball mounting device (not shown). That is, a pad-shaped or land-shaped electrode E is provided on one surface of the workpiece W. As shown in FIG. On this electrode E, the conductive ball B is mounted by the adhesion of the flux F. As shown in FIG.

The diameter of the conductive ball B is, for example, 30 μm to 70 μm. The conductive ball B is composed of a conductive member. For example, it is a metal ball such as solder, gold or silver, or a ball in which conductive plating is performed on the surface of a resin ball or a ceramic ball.

(Explanation of the mounting state of the conductive ball B) FIG. 9 shows a state in which the conductive balls B are mounted on the workpiece W by the conductive ball mounting device. That is, FIG. 9(A) shows a state in which the conductive ball B is normally mounted on the electrode E of the workpiece W (normal ball state). (B) in FIG. 9 shows a state in which the conductive ball B is not normally mounted on the electrode E of the workpiece W, and a state in which the conductive ball B is not mounted on the electrode E of the workpiece W, that is, a state in which there is no conductive ball B (Ball missing state). 9(C) shows a state in which the conductive ball B is not normally attached to the electrode E of the workpiece W, and the conductive ball B is located at a position deviated from the electrode E of the workpiece W (ball offset state). FIG. 9(D) shows a state in which the conductive ball B is not normally mounted on the electrode E of the workpiece W, and a state in which an extra (unnecessary) conductive ball B1 is mounted on the workpiece W (ball remaining state).

In this way, when the conductive ball mounting device mounts the conductive balls B on the workpiece W, not all the conductive balls B are normally mounted on the electrodes E of the workpiece W as shown in FIG. 9(A) . That is, as shown in (B), (C), and (D) of FIG. 9 , the conductive ball B may not be normally attached to the electrode E of the workpiece W in some cases. Therefore, after the conductive ball mounting apparatus mounts the conductive ball B on the workpiece W, it is necessary to check whether the conductive ball B is normally mounted on the electrode E of the workpiece W. In addition, when the conductive ball B is not normally attached to the electrode E of the workpiece W, it is necessary to correct so that the conductive ball B is normally attached to the electrode E of the workpiece W. FIG.

Hereinafter, the portion where the conductive ball B is normally mounted on the electrode E of the workpiece W as shown in FIG. 9(A) is referred to as a “normal portion”. Hereinafter, the portion where the conductive ball B is not normally mounted on the electrode E of the workpiece W as shown in (B), (C), and (D) of FIG. 9 is referred to as a “defective portion”. Furthermore, the normal site and the defective site are collectively referred to as "sites" hereinafter. The parts represent one electrode E, one conductive ball B, and their surroundings.

(Description of conductive ball inspection and repair device 1) The conductive ball inspection and repair apparatus 1 inspects whether the conductive ball B is normally mounted on the electrode E of the workpiece W after the conductive ball B is mounted on the workpiece W by the conductive ball mounting device. In addition, when the conductive ball B is not normally attached to the electrode E of the workpiece W, the conductive ball inspection and repair apparatus 1 corrects so that the conductive ball B is normally attached to the electrode E of the workpiece W.

As shown in FIGS. 1 to 3 , the conductive ball inspection and repair device 1 includes an inspection device 2 , a repair device 3 , an imaging device (not shown), and a display device 5 . Further, as shown in FIGS. 1 to 3 , the conductive ball inspection and repair apparatus 1 includes a calibration unit 6 , a table conveyance unit 7 , inspection unit conveyance units 20Z, 21Z, repair unit conveyance units 30Z, 31Z, and 32Z, and a control unit (not shown). Further, as shown in FIGS. 1 to 3 , the conductive ball inspection and repair apparatus 1 includes a holder 10 , a support member 11 , a loading port 12 , a prealigner 13 , a table 14 , and a conveyance as a workpiece conveyance unit. The robot 15 and the workpiece identification information acquisition unit 16 .

In addition, an operator (not shown) is located on the front side Y1 of the bracket 10 in FIG. 1 and at a position close to the right side X2. In addition, the operator faces the display device 5 .

The stand 10 is installed on the ground or an installation surface (not shown). Although not shown, the stand 10 is provided with walls and ceilings that form a work space. Here, the work space is a space surrounded by the four sides of the stand 10 in FIG. 1 . Inside the work space, an inspection device 2, a repair device 3, an imaging device, a display device 5, a calibration unit 6, a table conveyance unit 7, inspection unit conveyance units 20Z, 21Z, repair unit conveyance units 30Z, 31Z, 32Z, A detection unit, a drive unit, a support member 11 , a pre-aligner 13 , a table 14 , a transfer robot 15 , and a workpiece identification information acquisition unit 16 . In addition, outside the work space, an operation unit and a loading port 12 are arranged.

As shown in FIGS. 1 to 3 , the support members 11 are arranged on the right side and the rear side of the upper surface of the bracket 10 . The support member 11 is constituted by two struts 110 , two arms 111 , and one beam 112 . The lower ends of the two pillars 110 are respectively fixed to the left and right on the upper surface of the pillar 10 , and the two pillars 110 are arranged in the Z direction. The rear ends of the two arms 111 are fixed to the upper ends of the pillars 110, and the two arms 111 are arranged in the Y direction. Left and right ends of one beam 112 are fixed to the front ends of the two arms 111, and one beam 112 is arranged in the X direction.

As shown in FIG. 1 , the loading port 12 is arranged on the left outer side of the bracket 10 . A transfer container 17 (so-called FOUP (front-opening-unified-pod)) is placed on the table (upper surface) of the loading port 12 . The transport container 17 is carried into and out of the loading port 12 by a ceiling monorail, a ground moving robot, or the like, which is not shown. The conveyance container 17 accommodates the workpiece W in a sealed state. The conveyance container 17 is provided with a door for putting in and taking out the workpieces W. As shown in FIG. The door of the conveyance container 17 is opened or closed by the drive part which is controlled based on the control signal from the control part.

As shown in FIG. 1 , the pre-aligners 13 are arranged on the left and rear sides of the upper surface of the holder 10 . The pre-aligner 13 aligns the center and orientation of the workpiece W based on the marks of the straight portion or the notch portion of the workpiece W before the inspection by the inspection device 2 . The pre-aligner 13 is driven according to a control signal from the control unit. In addition, when the workpiece W is a rectangular substrate, it is not necessary to provide the pre-aligner 13 .

As shown in FIGS. 1 to 4 , the table 14 is transported in the X direction and the Y direction by the table transport unit 7 . The workpiece W is placed on the upper surface of the table 14 . In addition, the position of the table 14 shown in FIG. 1, FIG. 2 is an initial position.

As shown in FIG. 1 , the transfer robot 15 is arranged on the left side of the upper surface of the rack 10 and on the front side of the pre-aligner 13 . The transfer robot 15 transfers the workpiece W between the transfer container 17 and the pre-aligner 13 and between the pre-aligner 13 and the table 14 . Moreover, the door for carrying in and carrying out the workpiece|work W is provided in the wall between the conveyance container 17 on the outer side of a work space, and the pre-aligner 13 on the inner side of a work space. The transfer robot 15 is driven according to a control signal from the control unit. The door of the wall is opened or closed by the drive part which is controlled according to the control signal from the control part.

As shown in FIGS. 1 and 2 , the workpiece identification information acquisition unit 16 includes a camera 160 , a lens 161 , and a lighting fixture 162 in this example. The workpiece identification information acquisition unit 16 is provided on the flux transfer unit 30 of the repair device 3 . In addition, the workpiece identification information acquisition unit 16 may be provided at a location other than the flux transfer unit 30 .

Here, the positional information acquired by the workpiece identification information acquisition unit 16 is the positional information of the center (optical axis of the lens 161 ) of the lower end (tip) of the lens 161 .

After the center and orientation of the workpiece W are aligned by the pre-aligner 13 , the workpiece identification information acquisition unit 16 acquires identification information of the workpiece W from the identification mark of the workpiece W on the table 14 . Then, the workpiece identification information acquisition unit 16 outputs the acquired workpiece identification information to the control unit as a detection signal. Thereby, the workpiece W is identified by the control unit as to what kind of circuit design the workpiece W is. In addition, the workpiece identification information acquisition unit 16 may perform identification of the above-described target marks, alignment marks, and the like.

(Description of the table transfer unit 7) As shown in FIGS. 1 to 3 , the table transfer unit 7 is arranged on the upper surface of the rack 10 , on the front side of the support member 11 and on the right side of the transfer robot 15 . The table conveyance part 7 conveys the table 14 in the X direction and the Y direction which are horizontal directions and are orthogonal to each other. The table conveyance part 7 is driven by an X-direction fixing part (X-direction guide part) 70X, an X-direction moving part 71X, an X-direction drive part, a Y-direction fixing part (Y-direction guide part) 70Y, a Y-direction moving part 71Y, and a Y-direction drive Department composition.

The X-direction fixing portion 70X is fixed along the X-direction on the upper surface of the holder 10 . The X-direction moving portion 71X is attached to the X-direction fixing portion 70X so as to be movable in the X direction. The X-direction drive unit is, for example, a servo motor, and moves the X-direction moving unit 71X in the X-direction of the longitudinal direction of the X-direction fixing unit 70X. The X-direction drive unit is driven according to a control signal from the control unit.

The Y-direction fixing portion 70Y is fixed in the Y-direction on the upper surface of the X-direction moving portion 71X. The Y-direction moving portion 71 is attached to the Y-direction fixing portion 70 so as to be movable in the Y direction. The Y-direction driving part is, for example, a servo motor, and moves the Y-direction moving part 71Y in the Y-direction of the longitudinal direction of the Y-direction fixing part 70Y. The Y-direction drive unit is driven in accordance with a control signal from the control unit. In addition, in FIGS. 1-3, the X-direction moving part 71X and the Y-direction fixing part 70Y are shown as being integral.

(Description of inspection part conveying parts 20Z and 21Z) As shown in FIG. 2 , the inspection unit conveying units 20Z and 21Z respectively include a main inspection unit 20 serving as an inspection unit of the inspection apparatus 2 and an inspection unit 21 for verification (hereinafter referred to as “each unit 20 and 21 of the inspection unit”). It is conveyed in the vertical direction orthogonal to the X direction and the Y direction, that is, the Z direction.

The inspection part conveying part 20Z of the main inspection part 20 is constituted by a Z-direction fixing part (Z-direction guide part), a Z-direction moving part, and a Z-direction driving part 200Z. The Z-direction fixing portion is fixed on the left side of the front face of the beam 112 . The Z-direction moving portion is attached to the Z-direction fixing portion so as to be movable in the Z direction. The Z-direction drive unit 200Z is, for example, a servo motor, and moves the Z-direction moving unit in the Z-direction of the longitudinal direction of the Z-direction fixing unit. The Z-direction drive unit 200Z is driven according to a control signal from the control unit.

Similarly, the inspection part conveyance part 21Z of the inspection part 21 for verification is comprised from the Z direction fixing part (Z direction guide part), the Z direction moving part, and the Z direction driving part 210Z. The Z-direction fixing portion is fixed to the front surface of the beam 112 and on the left side of the Z-direction fixing portion of the inspection portion conveyance portion 20Z of the main inspection portion 20 . The Z-direction moving portion is attached to the Z-direction fixing portion so as to be movable in the Z direction. The Z-direction drive unit 210Z is, for example, a servo motor, and moves the Z-direction moving unit in the Z-direction of the longitudinal direction of the Z-direction fixing unit. The Z-direction drive unit 210Z is driven according to a control signal from the control unit.

(Description of the restoration part conveying parts 30Z, 31Z, 32Z) As shown in FIGS. 2 and 3 , the repairing portion conveying portions 30Z, 31Z, and 32Z serve as the repairing portion of the repairing device 3 , the flux transfer portion 30 , the conductive ball mounting portion 31 , and the excess conductive ball removing portion 32 (hereinafter referred to as the repairing portion). "The parts 30, 31, and 32 of the repair part") are conveyed in the vertical direction orthogonal to the X direction and the Y direction, that is, the Z direction, respectively.

The repair part conveyance part 30Z of the flux transfer part 30 is comprised from the Z direction fixing part (Z direction guide part), the Z direction moving part, and the Z direction driving part 300Z. The Z-direction fixing portion is fixed to the middle of the front surface of the beam 112 . The Z-direction moving portion is attached to the Z-direction fixing portion so as to be movable in the Z direction. The Z-direction drive unit 300Z is, for example, a servo motor, and moves the Z-direction moving unit in the Z-direction of the longitudinal direction of the Z-direction fixing unit. The Z-direction drive unit 300Z is driven according to a control signal from the control unit.

Similarly, the repairing portion conveying portion 31Z of the conductive ball mounting portion 31 includes a Z-direction fixing portion (Z-direction guide portion), a Z-direction moving portion, and a Z-direction driving portion 310Z. The Z-direction fixing portion is fixed on the front surface of the beam 112 and on the right side of the Z-direction fixing portion of the repair portion conveying portion 30Z of the flux transfer portion 30 . The Z-direction moving portion is attached to the Z-direction fixing portion so as to be movable in the Z direction. The Z-direction drive unit 310Z is, for example, a servo motor, and moves the Z-direction moving unit in the Z-direction of the longitudinal direction of the Z-direction fixing unit. The Z-direction drive unit 310Z is driven according to a control signal from the control unit.

Moreover, similarly, the repair part conveyance part 32Z of the surplus conductive ball removal part 32 is comprised by the Z direction fixing part (Z direction guide part), the Z direction moving part, and the Z direction driving part 320Z. The Z-direction fixing portion is fixed on the front surface of the beam 112 and on the right side of the Z-direction fixing portion of the repair portion conveying portion 31Z of the conductive ball mounting portion 31 . The Z-direction moving portion is attached to the Z-direction fixing portion so as to be movable in the Z direction. The Z-direction drive unit 320Z is, for example, a servo motor, and moves the Z-direction moving unit in the Z-direction of the longitudinal direction of the Z-direction fixing unit. The Z-direction drive unit 320Z is driven according to a control signal from the control unit.

(Description of Calibration Section 6) The calibration unit 6 acquires position information in the X direction, position information in the Y direction, and position information in the Z direction (hereinafter referred to as “position information in the X, Y, and Z directions”) of the respective parts 30 , 31 , and 32 of the repair unit. The position information in the X, Y, and Z directions of each of the parts 30 , 31 , and 32 of the repair part is the tip (lower end) of the flux transfer needle 300 of the flux transfer part 30 and the conductive ball mounting nozzle 310 of the conductive ball mounting part 31 . The leading end (lower end) of the residual conductive ball removing portion 32 and the position information of the leading end (lower end) of the residual conductive ball removing nozzle 320 in the X, Y, and Z directions. Then, the position of the workpiece W is calibrated using the position information acquired by the calibration unit 6 .

As shown in FIG. 1 , the calibration part 6 is fixed to the table 14 . The calibration unit 6 includes an X-Y position information acquisition unit (not shown) and a Z position information acquisition unit (not shown).

The X-Y position information acquisition unit acquires X-direction position information and Y-direction position information of each of the parts 30 , 31 , and 32 of the repair unit, and outputs the above-mentioned information to the control unit as a detection signal. The X-Y position information acquisition unit is a camera in this example.

The Z-position information acquisition unit acquires the Z-direction position information of each of the parts 30 , 31 , and 32 of the repair unit, and outputs the information as a detection signal to the control unit. The Z position information acquisition unit is a touch sensor or a touch displacement sensor in this example.

In addition, similarly, the calibration unit 6 acquires position information in the X, Y, and Z directions of the parts 20 and 21 of the inspection unit, and position information in the X, Y, and Z directions of the workpiece identification information acquisition unit 16, and uses the above information as detection The signal is output to the control unit.

(Description of Inspection Device 2) The inspection device 2 inspects whether the conductive ball B is normally mounted on the electrode E of the workpiece W. As shown in FIGS. 1 and 2 , the inspection apparatus 2 includes a main inspection unit 20 and a verification inspection unit 21 as inspection units.

The main inspection part 20 is provided in the Z direction moving part of the inspection part conveyance part 20Z. The inspection part 21 for verification is provided in the Z direction moving part of the inspection part conveyance part 21Z. As a result, the main inspection part 20 and the inspection part 21 for verification are arrange|positioned left-right along the X direction.

The main inspection unit 20 inspects whether or not the conductive ball B is normally attached to the electrode E of the workpiece W. The main inspection unit 20 includes a camera 200 , a lens 201 , and illumination devices 41 , 42 , and 43 in this example. The field of view (angle of view) of the camera 200 of the main inspection unit 20 is a range in which one or more integrated circuit chips on the workpiece W can be photographed. In addition, since the lens 201 of the main inspection unit 20 has a zoom function, the magnification of the camera 200 of the main inspection unit 20 can be changed, and the imaging range can be changed arbitrarily.

Here, the positional information in the X, Y, and Z directions acquired by the main inspection unit 20 is the positional information of the center (optical axis of the lens 201 ) of the lower end (tip) of the lens 201 .

The main inspection unit 20 uses the camera 200 to photograph the plurality of integrated circuit chips on the workpiece W one by one, and acquires information on whether the conductive balls B are normally mounted on the electrodes E of the workpiece W. The main inspection unit 20 outputs the acquired information to the control unit as a detection signal. Then, using the information acquired by the main inspection unit 20, the control unit inspects whether or not the conductive ball B is normally attached to the electrode E of the workpiece W.

When a defective part is detected by the main inspection part 20 , the verification inspection part 21 confirms the defective part. In this example, the verification inspection unit 21 includes a camera 210 , a lens 211 , and a lighting fixture 212 . Even if the field of view (angle of view) of the camera 210 of the inspection unit 21 for verification is narrow, it is a range in which an image of one site can be captured. Therefore, the magnification of the lens 211 of the inspection part 21 for verification is larger than the magnification of the lens 201 of the main inspection part 20 .

Here, the positional information in the X, Y, and Z directions of the verification inspection unit 21 acquired by the calibration unit 6 is the positional information of the center (optical axis of the lens 211 ) of the lower end (tip) of the lens 211 .

The inspection unit 21 for verification uses the camera 210 to photograph the defective portion detected by the main inspection unit 20 and acquires information on whether or not the repairing device 3 needs to be corrected. The verification inspection unit 21 outputs the acquired information to the control unit as a detection signal. Then, the information acquired by the verification inspection unit 21 is displayed on the display device 5 as an image. By visually viewing the image displayed on the display device 5, the operator confirms whether correction by the repair device 3 is necessary.

(Lighting of lighting devices 41, 42, 43) As shown in FIG. 3 , the illumination devices 41 , 42 , and 43 are arranged in multiple layers, three layers in this example, between the camera 200 and the lens 201 of the main inspection unit 20 and the workpiece W along the vertical direction, that is, the Z direction. The lighting devices 41 , 42 , and 43 on the three floors respectively illuminate the inspection site P of the workpiece W and its surroundings.

In addition, the workpiece W is placed on the upper surface of the table 14 . The table 14 is transported in the X direction and the Y direction by the table transport unit 7 . Then, the workpiece|work W is located in the predetermined position below the main inspection part 20 via the table conveyance part 7 and the table 14. That is, the inspection site P of the workpiece W is located on the optical axis C of the lens 201 of the main inspection unit 20 .

The lighting device 41 arranged at the position closest to the workpiece W among the three-layer lighting devices 41 , 42 , and 43 is referred to as a first lighting device (lowermost lighting device) 41 . In addition, the lighting device 42 arranged on the upper side Z1 of the first lighting device 41 among the three-layer lighting devices 41 , 42 , and 43 is referred to as a second lighting device (intermediate lighting device) 42 . Furthermore, the lighting device 43 arranged at the position farthest from the workpiece W among the three-layer lighting devices 41 , 42 , and 43 is referred to as a third lighting device (uppermost lighting device) 43 .

As shown in FIG. 4 , the three-layer lighting devices 41, 42, and 43 have frame members 410, 420, and 430 and light-emitting element groups 411B, 411R, 421, and 431, respectively. The frame members 410 , 420 , and 430 have a planar shape (the shape viewed from the upper side Z1 toward the lower side Z2 ) is annular, and in this example, is formed into a circular annular shape (or a polygonal annular shape). Spaces 412 , 422 , and 432 are provided in the central portions of the annular frame members 410 , 420 , and 430 .

The light-emitting element groups 411B, 411R, 421, and 431 are arranged in a circular ring shape following the circular ring shape of the frame members 410, 420, and 430. The center of the lens 201 and the centers of the frame members 410 , 420 , and 430 are located on the optical axis C of the lens 201 , that is, on the same straight line C.

(Description of the first lighting device 41 ) The first lighting device 41 will be described below. The frame member 410 is fixed to the lower end portion of the fixing member 40 . The upper end of the fixing member 40 is fixed to the beam 112 of the supporting member 11 . On the lower surface of the frame member 410, the light-emitting element groups 411B and 411R are arranged in a double circular ring shape.

The light-emitting element groups 411B and 411R are composed of a plurality of groups, and in this example, they are composed of two groups. The wavelengths of the light L1 emitted from the two light-emitting element groups 411B and 411R are different for each group. In this example, the wavelength of the light L1 emitted by the first light-emitting element group 411B is about 470 nm, the wavelength of blue light. The wavelength of the light L1 emitted by the second light-emitting element group 411R is about 630 nm, the wavelength of red light.

That is, the first-group light-emitting element group 411B is composed of a group of light-emitting elements that emit blue light, and in this example, is composed of a group of blue LEDs. The second light-emitting element group 411R is composed of a group of light-emitting elements emitting red light, in this example, a group of red LEDs.

As shown in FIG. 6 , the first light-emitting element group 411B composed of the blue LED group and the second light-emitting element group 411R composed of the red LED group are arranged in a double circular ring shape. In addition, in FIG. 6 , the first group of light-emitting element groups (groups of blue LEDs) 411B are represented by small circles painted in white, and the second group of light-emitting element groups (groups of red LEDs) 411R are shown in white-painted small circles. A graphic representation of a small "+" is drawn in the small circle.

Furthermore, as shown in FIG. 6(A) , the blue LEDs and the red LEDs are alternately arranged in the circumferential direction, respectively. In addition, as shown in FIG. 6(B) , the blue LEDs and the red LEDs are arranged in an inner circular ring and an outer circular ring, respectively. In addition, the arrangement of the blue LED and the red LED may be other than the example shown in the figure.

The first lighting device 41 has a light diffusing member 413 . The light diffusing member 413 is provided on the lower side Z2 of the frame member 410 and the light emitting element groups 411B and 411R. The light diffusing member 413 has an incident surface facing the light-emitting element groups 411B and 411R and an exit surface facing the inspection site P. The light diffusing member 413 enters the light L1 emitted from the light emitting element groups 411B and 411R from the incident surface, and emits the light L10 from the exit surface to the workpiece W side, that is, the inspection site P side as diffused light L10 .

As shown in FIG. 5 , the first lighting device 41 mainly illuminates the conductive ball B. As shown in FIG. That is, the incident angle θ of the diffused light L10 emitted from the light diffusing member 413 of the first illuminating device 41 to the surface of the workpiece W (the surface on which the conductive ball B is attached) is large. Therefore, when the diffused light L10 is incident on the surface of the spherical surface of the conductive ball B (at the time of contact), it is reflected as the reflected light L11 at a small reflection angle. The reflected light L11 from the conductive ball B is incident on the lens 201 of the main inspection unit 20 .

On the other hand, when the diffused light L10 is incident on one surface of the workpiece W (at the time of contact), it is reflected as the reflected light L12 with a large reflection angle. The reflected light L12 from the workpiece W does not enter the lens 201 of the main inspection unit 20 , but enters out of the field of view of the lens 201 . Thereby, the first lighting device 41 mainly illuminates the conductive ball B.

(Description of the use of the blue light and the red light of the first lighting device 41 to distinguish and use) Hereinafter, with reference to FIGS. 7 and 8 , the use of the first lighting device 41 for distinguishing between blue light and red light will be described. In addition, FIG. 7 is an explanatory diagram (graph) showing the spectral reflectance of copper (Cu). As is clear from FIG. 7 , in the case of copper (Cu), the longer the wavelength of light is, the higher the reflectance is.

8 is an explanatory diagram (a graph) showing the spectral reflectance of a tin alloy (Sn alloy). As is clear from FIG. 8 , as in the case of tin alloy (Sn alloy) and copper (Cu), the longer the wavelength of light, the higher the reflectance. In addition, in Figure 8, the initial tin alloy is represented by small black diamonds. In addition, surface oxides, ie, tin alloys with rusted surfaces, are represented by small black-painted squares.

The workpiece W, that is, the wiring of the substrate and the electrodes E are mainly composed of copper (Cu). Therefore, in the main inspection unit 20, in order to inspect (measure) the wiring pattern of the workpiece W and the electrodes E with high accuracy, it is preferable to use red light with a long wavelength.

In addition, the conductive ball B is made of solder in this example. Solder is mainly composed of an alloy of tin and lead, that is, a tin alloy (Sn alloy). Therefore, in the main inspection unit 20, in order to inspect (measure) the conductive ball B with high accuracy, it is preferable to use red light having a long wavelength. In particular, in the case of the conductive ball B whose surface is oxidized, it is preferable to use red light with a long wavelength.

Here, light with a shorter wavelength has a smaller (higher) optical resolution, enabling highly accurate inspection (measurement). Therefore, in the main inspection unit 20, in order to inspect (measure) the conductive ball B with high accuracy, it is preferable to use blue light having a short wavelength. In particular, in the case of an initial (new product) conductive ball B whose surface is not oxidized, it is preferable to use blue light with a short wavelength.

As described above, the first lighting device 41 can differentiate and use blue light and red light according to the object to be illuminated.

(Description of the second lighting device 42 ) The second lighting device 42 will be described below. The frame member 420 is fixed to the lower end portion of the fixing member 40 and to the upper side Z1 of the frame member 410 of the first lighting device 41 . On the inner inclined surface of the frame member 420, the light-emitting element group 421 is arranged in a triple circular ring shape. The center line of the light-emitting element group 421 faces the inspection site P. As shown in FIG.

The wavelength of the light L2 emitted by the light-emitting element group 421 of the second lighting device 42 is shorter than the wavelength of the light L1 emitted by the light-emitting element groups 411B and 411R of the first lighting device 41 (in this example, the wavelength of blue light is about 470 nm). )long. That is, the wavelength of the light L2 emitted by the light-emitting element group 421 of the second lighting device 42 is longer than the wavelength (about 470 nm) of the light L1 emitted by the light-emitting element group 411B of the first lighting device 41 , that is, blue light. In this example, the wavelength of the light L2 emitted from the light-emitting element group 421 is about 630 nm, the wavelength of red light.

The second lighting device 42 mainly illuminates the wiring of the workpiece W and the electrode E. That is, as shown in FIG. 7 , the second illuminating device 42 is adapted to illuminate the wirings and electrodes E of the workpiece W, which are mainly composed of copper (Cu), with light L2 of red light.

(Description of the third lighting device 43 ) The third lighting device 43 will be described below. The frame member 430 is fixed to the lower end portion of the lens 201 of the main inspection unit 20 . On the lower surface of the frame member 430, the light-emitting element groups 431 are arranged in a triple circular ring shape. The center line of the light-emitting element group 431 faces the inspection site P. As shown in FIG.

The wavelength of the light L3 emitted by the light-emitting element group 431 of the third lighting device 43 is shorter than the wavelength of the light L1 emitted by the two light-emitting element groups 411B and 411R of the first lighting device 41 (the wavelength of blue light in this example). about 470 nm) long. That is, the wavelength of the light L3 emitted by the light emitting element group 431 of the third lighting device 43 is longer than the wavelength (about 470 nm) of the light L1 emitted by the first light emitting element group 411B of the first lighting device 41 , that is, blue light. In this example, the wavelength of the light L3 emitted from the light-emitting element group 431 is about 630 nm, the wavelength of red light.

The third lighting device 43 mainly illuminates the wiring of the workpiece W and the electrodes E. That is, as shown in FIG. 7 , the third illuminating device 43 is suitable for illuminating the wirings and the electrodes E of the workpiece W, which are mainly composed of copper (Cu), with the light L2 of the red light.

(Description of Repair Device 3) When a defective portion is detected by the main inspection unit 20 and it is determined by the verification inspection unit 21 that the defective portion needs to be corrected, the repair device 3 performs correction so that the conductive ball B is normally mounted. As shown in FIGS. 1 and 2 , the repairing device 3 includes a flux transfer portion 30 , a conductive ball mounting portion 31 , and a surplus conductive ball removing portion 32 .

The flux transfer part 30 is provided in the Z direction moving part of the repair part conveyance part 30Z. The conductive ball mounting portion 31 is provided on the Z-direction moving portion of the repair portion conveying portion 31Z. The excess conductive ball removing portion 32 is provided on the Z-direction moving portion of the repair portion conveying portion 32Z. As a result, the flux transfer portion 30 , the conductive ball mounting portion 31 , and the excess conductive ball removing portion 32 are arranged in the left and right directions along the X direction.

The flux transfer part 30 transfers the flux F onto the electrodes E on which the conductive balls B are not mounted. The flux transfer needle 300 is attached to the flux transfer portion 30 via a needle holder, a locking mechanism, and a position measurement sensor. Here, as described above, the positional information of the flux transfer portion 30 acquired by the calibration portion 6 is the positional information of the center of the lower end (tip) of the flux transfer needle 300 .

Below the flux transfer needle 300, a flux supply tray 301 is arranged by the Y-direction moving mechanism 302. As shown in FIG. The Y-direction moving mechanism 302 includes a fixed portion (guide portion), a moving portion, and a driving portion 303 . The drive part 303 is, for example, a servo motor, and moves the moving part in the Y direction of the longitudinal direction of the fixed part. As a result, the flux supply tray 301 moves in the Y direction to be positioned below the flux transfer pins 300 , or to retreat from below the flux transfer pins 300 . The drive unit 303 is driven according to a control signal from the control unit.

The flux transfer needle 300 adheres an appropriate amount of flux F from the flux supply tray 301 located below. In addition, after the flux supply tray 301 is retracted from below, the flux transfer needle 300 descends in the Z direction and transfers the flux F onto the electrode E in the solder ball-missing state.

The conductive ball mounting portion 31 mounts the conductive balls B on the electrodes E with the flux F transferred by the flux transfer portion 30 . The conductive ball mounting nozzle 310 is mounted on the conductive ball mounting portion 31 via a nozzle holder, a locking mechanism, and a position measurement sensor. Here, as described above, the positional information of the conductive ball mounting portion 31 acquired by the calibration portion 6 is the positional information of the center of the lower end (tip) of the conductive ball mounting nozzle 310 .

Below the conductive ball mounting nozzle 310 , a conductive ball supply tray 311 is arranged by the Y-direction moving mechanism 312 . The Y-direction moving mechanism 312 includes a fixed portion (guide portion), a moving portion, and a driving portion 313 . The driving part 313 is, for example, a servo motor, and moves the moving part in the Y direction of the longitudinal direction of the fixed part. As a result, the conductive ball supply tray 311 moves in the Y direction to be positioned below the conductive ball mounting nozzle 310 , or to retreat from below the conductive ball mounting nozzle 310 . The drive unit 313 is driven according to a control signal from the control unit.

The conductive ball mounting nozzle 310 sucks one conductive ball B from the conductive ball supply tray 311 located below. In addition, after the conductive ball supply tray 311 is withdrawn from below, the conductive ball mounting nozzle 310 descends in the Z direction, and mounts the sucked conductive balls B on the flux F of the electrode E in the solder ball missing state.

The surplus conductive ball removing portion 32 removes the surplus conductive ball B1 mounted on the workpiece W unnecessarily. The residual conductive ball removing nozzle 320 is attached to the residual conductive ball removing portion 32 via a nozzle holder, a locking mechanism, and a position measurement sensor. Here, as described above, the position information of the residual conductive ball removing portion 32 acquired by the calibration portion 6 is the position information of the center of the lower end (tip) of the residual conductive ball removing nozzle 320 .

A surplus conductive ball receiving tray 321 is arranged below the surplus conductive ball removing nozzle 320 by the Y-direction moving mechanism 322 . The Y-direction moving mechanism 322 includes a fixed portion (guide portion), a moving portion, and a driving portion 323 . The driving part 323 is, for example, a servo motor, and moves the moving part in the Y direction in the longitudinal direction of the fixed part. Thereby, the surplus conductive ball receiving tray 321 moves in the Y direction to be positioned below the surplus conductive ball removing nozzle 320 , or retreats from below the surplus conductive ball removing nozzle 320 . The drive unit 323 is driven according to a control signal from the control unit.

When the surplus conductive ball receiving tray 321 is withdrawn from below, the surplus conductive ball removing nozzle 320 descends in the Z direction and attracts the surplus conductive balls B1. In addition, the residual conductive ball removal nozzle 320 ascends in the Z direction, and transfers the adsorbed redundant conductive balls B1 to the residual conductive ball receiving tray 321 located below.

In addition, the residual conductive ball removal nozzle 320 also removes the shifted conductive balls B shown in FIG. 9(C) .

(Description of the camera) The imaging device captures at least the part corrected by each of the parts 30 , 31 , and 32 of the repair part. The imaging device is arranged on the side where the operator is located, that is, on the front side Y1 with respect to the repair device 3 . The imaging device outputs the captured image to the control unit as a signal. The image captured by the imaging device is enlarged and displayed on the display device 5 by the control unit.

The imaging device stops driving under the control of the control unit, automatically moves between the parts 30 , 31 , and 32 of the restoration part, and automatically stops at the positions of the parts 30 , 31 , and 32 of the restoration part. In addition, the imaging device is adjusted in the Y direction, the Z direction, and the direction around the X axis by manual adjustment by the operator.

(Description of Display Device 5) The display device 5 enlarges and displays the object captured by the imaging device as an image visually recognized by the operator. As shown in FIGS. 1 and 2 , the display device 5 is arranged on the repairing device 3 side. That is, the display device 5 is arranged on the right side X2 of the repair device 3 . The height and orientation of the display device 5 are aligned with the position of the operator's eyes, that is, the operator's line of sight toward the display device 5 .

(Description of the Control Department) The conductive ball inspection and repair apparatus 1 includes a control unit. The control unit controls the process of inspecting the parts 20 , 21 of the inspection part and the process of correcting the parts 30 , 31 , 32 of the repair part, based on the instruction signal and the detection signal. The control unit is an information processing device, and is constituted by, for example, an electronic control unit (ECU). The control section includes a microcontroller and other electronic circuits. A microcontroller includes a processor and memory. The processor is at least one of a CPU (Central Processing Unit), an MPU (Microprocessor), or a GPU (Graphics Processing Unit). Memory includes ROM (Read Only Memory) and RAM (Random Access Memory). The processor executes programs stored in ROM or loaded in RAM.

(Explanation of the action of the embodiment) The electroconductive ball inspection and repair apparatus 1 according to the present embodiment has the above-described configuration, and the operation thereof will be described below with reference to the flowchart explanatory diagram showing the process in FIG. 10 .

First, the operator starts the operation of the conductive ball inspection and repair apparatus 1 by manual operation. Alternatively, the conductive ball inspection and repair apparatus 1 is automatically started to operate (start) under the control of the control unit.

Open the door of the carrying container 17 and the door of the wall. The transfer robot 15 takes out the workpiece W from the transfer container 17 and carries it into the conductive ball inspection and repair apparatus 1 ( S1 : loading of the workpiece W). At the same time, the door of the carrying container 17 and the door of the wall are closed. The transfer robot 15 arranges the workpiece W on the pre-aligner 13 . The pre-aligner 13 aligns the center and orientation of the workpiece W. In addition, when the workpiece|work W is a rectangular board|substrate, the process of aligning the center and the direction of the workpiece|work W by the pre-aligner 13 is abbreviate|omitted.

The transfer robot 15 arranges the workpiece W from the pre-aligner 13 on the table 14 at the initial position. The workpiece W is positioned on the workpiece identification information acquisition unit 16 by the table transfer unit 7 and the calibration unit 6, and is recognized by the workpiece identification information acquisition unit 16 (S2: identification of the workpiece W).

In addition, the workpiece|work W of this example consists of a board|substrate. Therefore, in the main inspection part 20, the pattern of the manufactured wiring is actually confirmed, and the recognized pattern is registered as the inspection pattern of the workpiece|work W (S3: the inspection pattern registration of the workpiece|work W). That is, the workpiece W is positioned in the main inspection unit 20 by the table conveyance unit 7 and the calibration unit 6 , and the inspection pattern of the workpiece W is registered in the main inspection unit 20 .

Next, in the above-mentioned stage (process) S3, the plurality of integrated circuit chips of the workpiece W are placed on the main inspection unit 20 by the stage conveyance unit 7 and the alignment unit 6, respectively, and are inspected by the main inspection unit 20 (S4). : inspection by the main inspection unit 20).

Based on the inspection by the main inspection unit 20 , the control unit determines whether or not there is a defective portion in the plurality of integrated circuit chips of the workpiece W ( S5 : Is there a defective portion?). Here, when there is no defective part, the process proceeds to the following stage (process) S11. On the other hand, when there is a defective part, it progresses to the next stage (process) S6.

The table conveyance unit 7 and the calibration unit 6 locate the defective portion on the verification inspection unit 21 , and perform inspection by the verification inspection unit 21 for confirmation ( S6 : inspection of the verification inspection unit 21 ). That is, the defective portion is imaged by the camera 210 of the verification inspection unit 21 , and the imaged image is enlarged and displayed on the display device 5 .

The operator visually confirms the image of the defective portion displayed in an enlarged manner on the display device 5, and determines whether correction is necessary (S7: Is correction necessary?). Then, when the operator judges that "correction is not necessary", the process proceeds to the following stage (process) S11. On the other hand, when the operator judges that "correction is required", the process proceeds to the next stage (process) S8.

The defective part is located on each of the parts 30 , 31 , and 32 of the repair part by the table conveyance part 7 and the alignment part 6 . Then, the defective part is corrected by each of the parts 30 , 31 , and 32 of the repair part ( S8 : the repair device 3 corrects the defective part). The working state of each of the parts 30 , 31 , and 32 of the repair part to repair the defective part is as follows.

That is, the defective part is the case where the solder ball is missing as shown in FIG. 9(B) . In this case, first, the flux transfer needles 300 of the flux transfer unit 30 transfer the flux F onto the electrodes E on which the conductive balls B are not mounted. Next, the conductive ball mounting nozzle 310 of the conductive ball mounting portion 31 mounts the conductive ball B on the flux F transferred onto the electrode E.

The defective part is the case where the solder balls are shifted as shown in (C) of FIG. 9 . In this case, first, the residual conductive ball removal nozzle 320 of the residual conductive ball removal unit 32 removes the conductive balls B that are detached from the electrode E. Next, the flux transfer needles 300 of the flux transfer unit 30 transfer the flux F onto the electrodes E from which the conductive balls B are detached. After that, the conductive ball mounting nozzle 310 of the conductive ball mounting portion 31 mounts the conductive ball B on the flux F transferred onto the electrode E.

The defective part is the state of remaining solder balls as shown in (D) of FIG. 9 . In this case, the excess conductive ball removal nozzle 320 of the excess conductive ball removal unit 32 removes the excess conductive balls B. As described above, each of the parts 30 , 31 , and 32 of the repair part repairs the defective part.

In this stage (process) S8 , the imaging device images the defective part to be corrected by each of the parts 30 , 31 , and 32 of the repair part as a target. The photographed object is enlarged and displayed on the display device 5 . The operator can visually check the object displayed on the display device 5 in an enlarged manner, and can confirm the state in which the defective part is corrected by the respective parts 30 , 31 , and 32 of the repair part.

If the defective part is corrected, the process proceeds to the next stage (process) S9. The corrected defective part is positioned on the verification inspection part 21 by the stage conveyance part 7 and the calibration part 6, and is reconfirmed by the verification inspection part 21 (S9: re-inspection of the verification inspection part 21). That is, the corrected defective part is photographed by the camera 210 of the inspection unit 21 for verification, and the photographed image is enlarged and displayed on the display device 5 .

The operator visually reconfirms the image of the defective part enlarged and displayed on the display device 5 and is the defective part after correction, and judges again whether re-correction is necessary ( S10 : Is re-correction necessary?). Then, when the operator judges that "re-correction is not necessary", the process proceeds to the following stage (process) S11. On the other hand, when the operator judges that "re-correction is required", the process proceeds to the previous stage (process) S8 again.

In some cases, there is no defective part, and there is no need for correction, and thus no need for re-correction. In this case, the table 14 is returned to the initial position. At the same time, the door of the carrying container 17 and the door of the wall are opened. The transfer robot 15 carries out the workpiece W on the table 14 from the conductive ball inspection and repair apparatus 1 and stores it in the transfer container 17 ( S11 : carrying out the workpiece W). At the same time, the door of the carrying container 17 and the door of the wall are closed.

By the above process, the operation of the conductive ball inspection and repair apparatus 1 is completed (finished).

(Explanation of the effect of the embodiment) The electroconductive ball inspection and repair apparatus 1 according to the present embodiment has the above-described configuration and functions, and the effects thereof will be described below.

In the conductive ball inspection and repair device 1 according to the present embodiment, three layers of illumination devices 41 , 42 , and 43 are disposed along the vertical direction, ie, the Z direction, between the camera 200 and the lens 201 of the main inspection unit 20 and the workpiece W. In addition, in the conductive ball inspection and repair apparatus 1 according to the present embodiment, the three-layer illumination devices 41 , 42 , and 43 respectively illuminate the inspection site P of the workpiece W and its surroundings. As a result, according to the conductive ball inspection and repair apparatus 1 according to the present embodiment, a plurality of illumination functions can be obtained.

Since the conductive ball inspection and repair apparatus 1 according to the present embodiment can obtain a plurality of lighting functions, it is possible to distinguish the lighting function suitable for an object to be illuminated from the plurality of lighting functions. As a result, the conductive ball inspection and repair apparatus 1 according to the present embodiment can inspect (measure) the conductive ball B with high accuracy.

In the conductive ball inspection and repair apparatus 1 according to the present embodiment, the light-emitting element groups 411B, 411R, 421, and 431 are arranged in a circular ring shape following the circular ring shape of the frame members 410, 420, and 430, and the lens 201 has a circular ring shape. The centers are located on the same straight line C as the centers of the frame members 410 , 420 , and 430 . As a result, the conductive ball inspection and repair device 1 according to the present embodiment can efficiently illuminate the inspection site P of the workpiece W and the light L1 ( L10 ), L2 , and L3 from the light-emitting element groups 411B, 411R, 421 , and 431 . around. As a result, the conductive ball inspection and repair apparatus 1 according to the present embodiment can inspect (measure) the conductive ball B with high accuracy.

In the conductive ball inspection and repair device 1 according to the present embodiment, the light-emitting element groups 411B and 411R of the first lighting device 41 are composed of two groups, and the wavelengths of the light L1 emitted by the two light-emitting element groups 411B and 411R respectively correspond to the phases of each group. different. That is, in the conductive ball inspection and repair apparatus 1 according to the present embodiment, the light-emitting element group 411B of the first group emits light L1 of blue light with a wavelength of about 470 nm, and the light-emitting element group 411R of the second group emits light of red light with a wavelength of about 630 nm L1. As a result, the conductive ball inspection and repair apparatus 1 according to the present embodiment can select and discriminate the light L1 using the blue light and the light L1 using the red light. For example, in the case of the initial (new product) conductive ball B whose surface has not been oxidized, the light L1 of blue light is used, and in the case of the conductive ball B whose surface has been oxidized, the light of red light is used L1. As a result, the conductive ball inspection and repair apparatus 1 according to the present embodiment can inspect (measure) the conductive ball B with high accuracy.

In the conductive ball inspection and repair apparatus 1 according to the present embodiment, since the first illumination device 41 includes the light diffusing member 413 , the incident angle θ of the diffused light L10 emitted from the light diffusing member 413 with respect to the workpiece W is large. Therefore, according to the conductive ball inspection and repair apparatus 1 according to the present embodiment, the diffused light L10 is reflected on the spherical surface of the conductive ball B as reflected light L11 and efficiently enters the lens 201 of the main inspection unit 20 . In addition, the diffused light L10 is reflected on the workpiece W as the reflected light L12 , and does not enter the lens 201 of the main inspection unit 20 , but enters out of the field of view of the lens 201 . As a result, according to the conductive ball inspection and repair apparatus 1 according to the present embodiment, the diffused light L10 from the light diffusing member 413 of the first illuminating device 41 can efficiently illuminate the conductive ball B, so that it is possible to accurately illuminate the conductive ball B. Check (measure) the conductive ball B.

In the conductive ball inspection and repair apparatus 1 according to the present embodiment, the conductive ball B is illuminated by the first lighting device 41 arranged at the position closest to the workpiece W. Therefore, in the conductive ball inspection and repair apparatus 1 according to the present embodiment, the light from the first illuminating device 41 and the diffused light L10 emitted by the light diffusing member 413 have a large incident angle θ with respect to the workpiece W. As a result, as described above, according to the conductive ball inspection and repair device 1 according to the present embodiment, the diffused light L10 from the light diffusing member 413 of the first lighting device 41 can efficiently illuminate the conductive ball B, thereby enabling the conductive ball B to be illuminated efficiently. The conductive ball B can be inspected (measured) with high accuracy.

In the conductive ball inspection and repair device 1 according to the present embodiment, the light emitting element group 421 of the second lighting device 42 and the light emitting element group 431 of the third lighting device 43 emit red lights L2 and L3. The wavelength of the red light is longer than the wavelength (about 470 nm) of the light L1 of the blue light emitted by the first light-emitting element group 411B of the first lighting device 41 . Accordingly, the conductive ball inspection and repairing device 1 according to the present embodiment is suitable for applying the red light beams L2 and L3 from the second lighting device 42 and the third lighting device 43 to the workpiece W mainly composed of copper (Cu). The wiring and electrode E are illuminated. As a result, the conductive ball inspection and repair apparatus 1 according to the present embodiment can inspect (measure) the wiring, the electrodes E, and the conductive balls B of the workpiece W with high accuracy, and can register the inspection pattern with high accuracy.

In the conductive ball inspection and repair device 1 according to the present embodiment, the second lighting device 42 and the third lighting device 43 are arranged at positions away from the workpiece W, so the light from the second lighting device 42 and the third lighting device 43 L2 and L3 can efficiently illuminate the wiring of the workpiece W and the electrode E. As a result, the conductive ball inspection and repair apparatus 1 according to the present embodiment can inspect (measure) the wiring, the electrodes E, and the conductive balls B of the workpiece W with high accuracy, and can register the inspection pattern with high accuracy.

In the conductive ball inspection and repair device 1 according to the present embodiment, the light L1 , L2 , and L3 of red light in three directions from the first lighting device 41 , the second lighting device 42 , and the third lighting device 43 affect the workpiece W. The wiring and electrode E are illuminated. As a result, the conductive ball inspection and repair apparatus 1 according to the present embodiment can inspect (measure) the wiring, the electrodes E, and the conductive balls B of the workpiece W with high accuracy, and can register the inspection pattern with high accuracy.

(Explanation of examples other than the embodiment) In addition, in the said embodiment, as the workpiece|work W, the board|substrate which formed the disk shape was demonstrated. However, in the present invention, the workpiece may be a substrate having a rectangular shape other than a disk shape, and may be a wafer made of silicon or the like in addition to the substrate.

In addition, in the above-described embodiment, three layers of lighting devices 41 , 42 , and 43 are arranged. However, in the present invention, the lighting devices may be arranged in two layers or four or more layers.

In addition, in the above-described embodiment, the planar shapes of the frame members 410 , 420 , and 430 of the three-layer lighting devices 41 , 42 , and 43 are formed in a circular ring shape or a polygonal ring shape. However, in the present invention, the planar shape of the frame members 410 , 420 , and 430 may be a shape other than a circular ring or a polygonal ring, for example, a ring such as an elliptical ring, a triangular ring, and a square ring.

In addition, in the above-described embodiment, the center of the lens 201 and the centers of the frame members 410 , 420 , and 430 are located on the same straight line C. However, in the present invention, the center of the lens 201 and the centers of the frame members 410 , 420 , and 430 may not be located on the same straight line C but may be offset from each other.

In addition, in the above-described embodiment, the light-emitting element groups 411B and 411R of the first lighting device 41 are composed of two groups. However, in the present invention, the light-emitting element group of the first lighting device 41 may be composed of one group or three or more groups.

Furthermore, in the above-described embodiment, the two light-emitting element groups 411B and 411R of the first lighting device 41 emit blue light and red light. However, in the present invention, the plurality of light-emitting element groups of the first lighting device 41 may emit blue light, green light, red light, and the like. In addition, when the light-emitting element groups of the first lighting device 41 are one set, one light-emitting element group may emit single-color light such as blue light, green light, and red light.

In addition, in the above-described embodiment, the first lighting device 41 includes the light diffusing member 413 . However, in the present invention, the light diffusing member 413 may not be provided on the first lighting device 41 .

In addition, in the above-described embodiment, the light-emitting element group 421 of the second lighting device 42 and the light-emitting element group 431 of the third lighting device 43 emit red light. However, in the present invention, the light-emitting element group 421 of the second lighting device 42 and the light-emitting element group 431 of the third lighting device 43 may emit green light or the like. That is, the color (wavelength of light) of light emitted by the light-emitting element group 421 of the second lighting device 42 is the same as the color (wavelength of light) emitted by the light-emitting element group 431 of the third lighting device 43 . However, in the present invention, the color (wavelength of light) of the light emitted by the light-emitting element group 421 of the second lighting device 42 and the color (wavelength of light) of the light emitted by the light-emitting element group 431 of the third lighting device 43 may also be different.

In addition, this invention is not limited to the said embodiment.

1: Conductive ball inspection and repair device 10: Bracket 11: Support parts 110: Pillar 111: Arm 112: Beam 12: Load port 13: Pre-aligner 14: Workbench 15: Handling robot (workpiece handling department) 16: Workpiece identification information acquisition department 160: Camera 161: Lens 162: Lighting 17: Handling Containers (FOUP) 2: Inspection device 20: Main Inspection Department (Inspection Department) 200: Camera 201: Lens 20Z: The inspection part conveying part of the main inspection part 20 200Z: Z-direction drive unit 21: Inspection section for verification (inspection section) 210: Camera 211: Lens 212: Lighting 21Z: Inspection part conveying part of the inspection part 21 for verification 210Z: Z-direction drive unit 3: Repair device 30: Flux transfer part (repair part) 300: Flux transfer pin 301: Flux Tray 302: Y direction moving mechanism 303: Drive Department 30Z: Repair part conveying part of the flux transfer part 30 300Z: Z-direction drive unit 31: Conductive ball mounting part (repair part) 310: Conductive Ball Mounting Nozzle 311: Conductive ball supply tray 312: Y direction moving mechanism 313: Drive Department 310Z: Z-direction drive unit 31Z: Repair part conveying part of the conductive ball mounting part 31 32: Residual conductive ball removal part (repair part) 320: Residual conductive ball removal nozzle 321: Remaining conductive ball receiving tray 322: Y direction moving mechanism 323: Drive Department 32Z: Restoration part conveying part of the excess conductive ball removing part 32 320Z: Z-direction drive unit 40: Fixed plate 41: The first lighting device (the lowest lighting device) 410: Frame Parts 411B: blue light-emitting element group (blue LED) 411R: Red light-emitting element group (red LED) 412: Space 413: Light Diffusion Parts 42: Second lighting device (intermediate lighting device) 420: Frame Parts 421: Red light-emitting element group (red LED) 422: Space 43: The third lighting device (the top lighting device) 430: Frame Parts 431: Red light-emitting element group (red LED) 432: Space 5: Display device 6: Calibration Department 7: Workbench handling department 70X: X-direction fixing part (X-direction guide part) 71X: X direction moving part 70Y: Y-direction fixing part (Y-direction guide part) 71Y: Y direction moving part B: Conductive ball B1: redundant (unnecessary) conductive balls C: Optical axis of lens 201 (same straight line) E: electrode F: Flux L1: light (blue light or red light) L2: light (red light) L3: light (red light) L10: Diffuse light L11: Reflected Light L12: Reflected Light P: Inspection site W: workpiece X1: Left X2: Right Y1: Front (front) side Y2: Rear (inside, opposite) side Z1: upper side Z2: lower side θ: Incident angle

FIG. 1 is an overall schematic plan view showing an embodiment of a conductive ball inspection and repair apparatus according to the present invention. FIG. 2 is a schematic front view showing a part (a view taken along the line II-II in FIG. 1 ). FIG. 3 is a schematic vertical cross-sectional view (cross-sectional view taken along line III-III in FIG. 1 ) showing a part. FIG. 4 is an enlarged schematic vertical cross-sectional view showing a three-layer lighting device. FIG. 5 is a conceptual explanatory diagram showing an optical path during inspection. 6 is a schematic bottom view showing an arrangement state of light-emitting element groups, in which FIG. 6(A) is a schematic bottom view showing a state in which blue LEDs and red LEDs are alternately arranged in the circumferential direction, and FIG. 6(B) It is a schematic bottom view of a state where blue LEDs and red LEDs are arranged on concentric circles. FIG. 7 is an explanatory diagram (a graph) showing the spectral reflectance of copper (Cu). In FIG. 7 , the vertical axis represents the reflectance (%), and the horizontal axis represents the wavelength (nm). FIG. 8 is an explanatory diagram (a graph) showing the spectral reflectance of a tin alloy (Sn alloy). In FIG. 8 , the vertical axis represents the reflectance (%), and the horizontal axis represents the wavelength (nm). 9 is a schematic explanatory diagram showing a workpiece and conductive balls, in which FIG. 9(A) is a schematic explanatory diagram showing a state in which the conductive ball is normally attached to the electrode of the workpiece, and FIG. 9(B) is a schematic diagram showing a state where the conductive ball is normally attached to the electrode of the workpiece A schematic explanatory diagram of a state in which the conductive ball is not normally mounted on the electrode of the workpiece, and a state in which the conductive ball is not mounted on the electrode of the workpiece, that is, a state in which there is no conductive ball (absence of solder balls), in FIG. 9 (C) is a schematic explanatory diagram showing a state in which the conductive ball is not normally attached to the electrode of the workpiece, and the conductive ball is located at a position deviated from the electrode of the workpiece (the solder ball offset state), in FIG. 9 ( D) is a schematic explanatory diagram showing a state in which the conductive balls are not normally mounted on the electrodes of the workpiece, and a state in which extra (unnecessary) conductive balls are mounted on the workpiece (the remaining solder balls). FIG. 10 is an explanatory diagram showing a process flow.

1: Conductive ball inspection and repair device

10: Bracket

11: Support parts

110: Pillar

111: Arm

112: Beam

12: Load port

13: Pre-aligner

14: Workbench

15: Handling robot (workpiece handling department)

16: Workpiece identification information acquisition department

17: Handling Containers (FOUP)

2: Inspection device

20: Main Inspection Department (Inspection Department)

21: Inspection section for verification (inspection section)

3: Repair device

30: Flux transfer part (repair part)

302: Y direction moving mechanism

303: Drive Department

31: Conductive ball mounting part (repair part)

312: Y direction moving mechanism

313: Drive Department

32: Residual conductive ball removal part (repair part)

322: Y direction moving mechanism

323: Drive Department

5: Display device

6: Calibration Department

7: Workbench handling department

70X: X-direction fixing part (X-direction guide part)

70Y: Y direction fixing part (Y direction guide part)

71X: X direction moving part

71Y: Y direction moving part

W: workpiece

X1: Left

X2: Right

Y1: Front (front) side

Y2: Rear (inside, opposite) side

Claims (6)

A conductive ball inspection and repair device, comprising an inspection device and a repair device, wherein the inspection device has an inspection portion for inspecting whether a conductive ball is normally attached to an electrode of a workpiece, and the repair device has a repair portion , when the inspection part detects a part where the conductive ball is not normally installed, the repair part performs correction on the part so that the conductive ball is installed normally; the inspection part has : a camera and a lens, an illuminating device, the illuminating device is provided with multiple layers along the vertical direction between the camera, the lens and the workpiece, and illuminates the workpiece; the multilayered illuminating devices respectively have: A ring-shaped frame member with a space provided in the central portion, and a plurality of light-emitting element groups are provided on the frame member; the workpiece is a substrate on which wiring is formed; among the multilayered lighting devices, are arranged The lighting devices other than the lighting device at the position closest to the workpiece are lighting devices that mainly illuminate the wiring of the workpiece. The conductive ball inspection and repair apparatus according to claim 1, wherein the light-emitting element group is arranged in a ring shape following the ring shape of the frame member; the center of the lens and the center of the frame member on the same straight line. The conductive ball inspection and repairing device according to claim 1 or 2, wherein the light-emitting element group of the lighting device is arranged at a position closest to the workpiece among the multi-layered lighting devices consists of multiple groups, The wavelengths of light emitted by the light-emitting element groups of the plurality of groups are different for each group. The apparatus for inspecting and repairing a conductive ball according to claim 3, wherein the illuminating device arranged at the position closest to the workpiece among the multilayer illuminating devices has a light diffusing member that diffuses the light. The component enters the light emitted from the light-emitting element group and emits the light toward the workpiece as diffused light. The apparatus for inspecting and repairing a conductive ball according to claim 3, wherein among the multilayered lighting apparatuses, the lighting apparatus disposed at the position closest to the workpiece is mainly responsible for the electrical conductivity. A lighting device that illuminates the ball. The conductive ball inspection and repairing device according to claim 1 or 2, wherein the light-emitting element group of the lighting device is arranged at a position closest to the workpiece among the multi-layered lighting devices It consists of a plurality of groups; the wavelengths of light emitted by the light-emitting element groups of the plurality of groups are different for each group of the plurality of groups; among the multi-layered lighting devices, all the light-emitting element groups are arranged at the position closest to the workpiece. The wavelength of the light emitted by the light-emitting element group of the lighting device other than the lighting device is longer than the shortest wavelength of the light emitted by the light-emitting element group of the plurality of groups.

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