JP7249012B2 - Conductive ball inspection and repair equipment - Google Patents

Description

The present invention relates to a conductive ball inspection and repair device.

As a conductive ball inspection and repair device, there is Patent Document 1 below. The ball inspection and repair device of Patent Document 1 includes an inspection device and a repair device. The inspection device inspects whether or not the conductive balls are normally mounted on the electrodes of the workpiece. When the inspection device detects a location where the conductive ball is not normally mounted, the repair device repairs the location so that the conductive ball is normally mounted.

JP 2017-34175 A

However, the ball inspection and repair device of Patent Document 1 includes an imaging device that captures an image of at least a portion to be repaired by the repair device, and an operator visually confirms the target captured by the imaging device. It does not have a display device to display as an image. As a result, according to the ball inspection and repair device of Patent Document 1, the operator cannot visually recognize at least the portion to be repaired by the repair device.

A problem to be solved by the present invention is to provide a conductive ball inspection and repair device that allows an operator to visually recognize at least a portion to be repaired by the repair device.

The conductive ball inspection and repair device of the present invention comprises an inspection device having an inspection unit for inspecting whether or not the conductive ball is normally mounted on the electrode of the work, and the inspection unit checks whether the conductive ball is normally mounted. A repair device having a repair unit that repairs a portion so that the conductive ball is mounted normally when a portion is detected as not being mounted, an imaging device that captures an image of at least the portion to be repaired by the repair unit, and an imaging device a display device for displaying an object imaged by the operator as an image for the operator to visually recognize, the imaging device being arranged on the side where the operator is positioned with respect to the repair section, and the display device being the display device is held by a holding portion that can be adjusted to move in the vertical direction and adjusted to rotate around a vertical axis.

In the conductive ball inspection and repair device of the present invention, the display device is arranged on the repair device side and is held by a holding portion that can adjust the movement of the display device in the vertical direction and adjust the rotation about the vertical axis. In addition, it is preferable that an operating unit that outputs an instruction signal by being operated by an operator is provided, and that the operating unit is arranged in the line-of-sight direction of the operator toward the display device.

In the conductive ball inspection and repair device of the present invention, the imaging device includes an optical section that magnifies the target, an imaging section that captures an image of the target magnified by the optical section, and an imaging section that is magnified by the optical section and captured by the imaging section. and an illumination unit that illuminates an object to be illuminated.

In the conductive ball inspection and repair apparatus of the present invention, it is preferable that the imaging device has a laser pointer that points to the object when the field of view of the imaging unit is positioned at the object.

In the conductive ball inspection and repair device of the present invention, the imaging device includes an X-direction movement adjustment unit that can adjust the movement of the imaging device in the X direction, which is the horizontal direction, and a Y-direction movement adjustment unit capable of moving and adjusting the imaging device in the Y direction orthogonal to the X direction and the Y direction; It is preferable that the device is arranged via a rotation adjusting portion capable of rotating and adjusting around an axis in the X direction.

In the conductive ball inspection and repair device of the present invention, the repair unit includes a flux transfer unit that transfers flux to an electrode on which no conductive ball is mounted, and a flux transfer unit that transfers the flux transferred by the flux transfer unit to the electrode. and a surplus conductive ball removing unit for removing surplus conductive balls mounted on the workpiece.

In the conductive ball inspection and repair device of the present invention, the flux transfer section, the conductive ball mounting section, and the excess conductive ball removing section are arranged in the horizontal direction, that is, the X direction, and the imaging device moves the imaging device horizontally. The X-direction movement adjustment unit, which can be manually adjusted in the X direction, and the imaging device are positioned at respective positions corresponding to the flux transfer unit, the conductive ball mounting unit, and the surplus conductive ball removing unit. and a positioning stop for stopping.

In the conductive ball inspection and repair device of the present invention, the flux transfer section, the conductive ball mounting section, and the excess conductive ball removing section are arranged in the horizontal direction, that is, the X direction, and the imaging device moves the imaging device horizontally. An X-direction movement adjustment unit capable of adjusting movement in the X direction, which is the direction, and an imaging device automatically moved in the X direction and corresponding to the flux transfer unit, the conductive ball mounting unit, and the excess conductive ball removal unit, respectively. It is preferable that it is arranged via an automatic movement stop portion that automatically stops at the position of .

In the conductive ball inspection and repair device of the present invention, the inspection unit includes a main inspection unit that inspects whether or not the conductive ball is normally mounted on the electrode of the work, and the main inspection unit checks whether the conductive ball is normally mounted. It is preferable to have a verification inspection unit for checking the location when an unmounted location is detected.

In the conductive ball inspection and repair apparatus of the present invention, a calibration unit is provided. and position information in the Z direction, which is the vertical direction perpendicular to the Y direction.

In the conductive ball inspection and repair apparatus of the present invention, the calibration unit includes an XY position information acquisition unit that acquires X-direction position information and Y-direction position information of the repair unit, and a Z-direction position information of the repair unit. It is preferable to have a Z position information acquisition unit that acquires the .

In the conductive ball inspection and repair apparatus of the present invention, a stage on which a workpiece is placed, a stage transport section for transporting the stage in X and Y directions which are horizontal and perpendicular to each other, and an inspection section in the Z direction, which is a vertical direction perpendicular to the X and Y directions, and a repair unit transport unit that transports the repair unit in the Z direction.

According to the conductive ball inspection and repair device of the present invention, the operator can visually recognize at least the portion to be repaired by the repair device.

FIG. 1 is an overall schematic plan view showing an embodiment of a conductive ball inspection and repair device according to the present invention. FIG. 2 is a schematic front view showing a part (schematic view taken along line II-II in FIG. 1). FIG. 3 is a schematic side view showing a part (schematic view taken along line III-III in FIG. 1). FIG. 4 is a schematic perspective view showing a workpiece, a calibration section, a stage, and a stage transfer section. FIG. 5 is a block diagram showing the components. FIG. 6 is a schematic explanatory diagram showing a workpiece and conductive balls. FIG. 6A is a schematic explanatory diagram showing a state in which the conductive balls are normally mounted on the electrodes of the workpiece. FIG. 6(B) shows a state in which the conductive ball is not normally mounted on the electrode of the work and no conductive ball is mounted on the electrode of the work (missing ball state). ) is a schematic explanatory diagram showing . FIG. 6(C) shows a state in which the conductive ball is not properly mounted on the electrode of the work and is positioned outside the electrode of the work (shift ball state). It is a schematic explanatory drawing. FIG. 6D is a schematic diagram showing a state in which the conductive balls are not normally mounted on the electrodes of the work, and extra (superfluous) conductive balls are mounted on the work (surplus ball state). It is an explanatory diagram. FIG. 7 is a flow explanatory diagram showing steps.

Hereinafter, one example of an embodiment (example) of a conductive ball inspection and repair device according to the present invention will be described in detail with reference to the drawings. In this specification, left, right, front, rear, top, and bottom are left, right, front, back, top, and bottom when an operator views the electrically conductive ball inspection and repair device of the present invention. In the drawings, since they are schematic diagrams, the main constituent parts are illustrated, and the illustration of the constituent parts other than the main constituent parts is omitted.

(Explanation of configuration of embodiment)
The configuration of the conductive ball inspection and repair device according to this embodiment will be described below. Note that Patent Document 1 may be referred to for the conductive ball inspection and repair device according to this embodiment.

In FIGS. 1 to 3, reference numeral "1" denotes the conductive ball inspection and repair device according to this embodiment. In FIGS. 1 to 4, "X1" is the "left side", "X2" is the "right side", "Y1" is the "front side", and "Y2" is the "back side". , "Z1" is the "upper side", and "Z2" is the "lower side". Furthermore, in FIG. 1, the code "IP" is the eye position of the operator (not shown).

Here, the horizontal "X direction" is "X1-X2 direction, left and right direction", the horizontal "Y direction" is "Y1-Y2 direction, front and back direction", and the vertical direction is "Z direction". is "Z1-Z2 direction, vertical direction". The X direction, Y direction, and Z direction are orthogonal to each other.

(Description of work W)
As shown in FIGS. 1-4, the work W is a wafer in this example. The work W is made of single crystal silicon and has a thin disc shape. On one surface of the work W, a plurality of square integrated circuit chips C are formed and arranged vertically and horizontally. The number of integrated circuit chips C is determined based on the diameter of the workpiece W. As shown in FIG. The diameter of the work W is, for example, 50 mm to 300 mm. Moreover, the thickness of the work W is, for example, 0.5 mm to 1 mm. On the other hand, the length of one side of the integrated circuit chip C is, for example, 30 mm.

The disk-shaped workpiece W needs to be oriented before the work process. Therefore, a straight line portion (not shown) or a notch portion (not shown) is provided on the circumferential edge of the workpiece W to serve as a mark for alignment. Also, the work W has different structures and numbers of integrated circuit chips C for each circuit design. Therefore, the workpiece W is provided with a recognition mark (not shown) for recognizing the workpiece W for each circuit design.

As shown in FIG. 6, conductive balls B are mounted on a workpiece W (a plurality of integrated circuit chips C) by a conductive ball mounting device (not shown). That is, one surface of the workpiece W is provided with a pad-like or land-like electrode E. As shown in FIG. A conductive ball B is mounted on the electrode E with a flux F bonded thereto.

The diameter of the conductive ball B is, for example, 50 μm to 60 μm. The conductive ball B is made of a conductive member. For example, it may be a metal ball such as solder, gold or silver, or a ball obtained by applying conductive plating to the surface of a resin ball or a ceramic ball.

(Description of Mounting State of Conductive Ball B)
FIG. 6 shows a state in which the conductive ball mounting apparatus mounts the conductive ball B on the workpiece W. FIG. That is, FIG. 6A shows a state in which the conductive ball B is normally mounted on the electrode E of the workpiece W (normal ball state). FIG. 6B shows a state in which the conductive ball B is not normally mounted on the electrode E of the work W, and the conductive ball B is not mounted on the electrode E of the work W, that is, the conductive ball B indicates a state in which there is no ball (missing ball state). FIG. 6(C) shows a state in which the conductive ball B is not properly mounted on the electrode E of the work W, and the conductive ball B is positioned outside the electrode E of the work W ( shift ball state). FIG. 6D shows a state in which the conductive ball B is not normally mounted on the electrode E of the work W, and an extra (extra) conductive ball B1 is mounted on the work W (surplus ball state).

In this way, when the conductive ball mounting apparatus mounts the conductive balls B on the work W, all the conductive balls B are properly mounted on the electrodes E of the work W as shown in FIG. It doesn't necessarily have to be. That is, as shown in FIGS. 6B, 6C, and 6D, there are cases where the conductive balls B are not properly mounted on the electrodes E of the work W. FIG. Therefore, after the conductive ball mounting apparatus mounts the conductive ball B on the work W, it is necessary to inspect whether or not the conductive ball B is properly mounted on the electrode E of the work W. Further, when the conductive ball B is not properly mounted on the electrode E of the work W, it is necessary to correct so that the conductive ball B is properly mounted on the electrode E of the work W.

Here, as shown in FIG. 6A, a portion where the conductive ball B is normally mounted on the electrode E of the workpiece W is hereinafter referred to as a "normal portion". Further, as shown in FIGS. 6B, 6C, and 6D, a portion where the conductive ball B is not properly mounted on the electrode E of the workpiece W is hereinafter referred to as a "defective portion". Furthermore, the normal part and the defective part are hereinafter collectively referred to as "parts". The locations indicate one electrode E, one conductive ball B, and their surroundings.

(Description of the conductive ball inspection and repair device 1)
The conductive ball inspection and repair device 1 inspects whether or not the conductive ball B is normally mounted on the electrode E of the work W after the conductive ball mounting device mounts the conductive ball B on the work W. . In addition, the conductive ball inspection and repair device 1 is configured so that the conductive ball B is normally mounted on the electrode E of the work W when the conductive ball B is not normally mounted on the electrode E of the work W. fix it.

As shown in FIGS. 1 to 3, the conductive ball inspection and repair device 1 includes an inspection device 2, a repair device 3, an imaging device 4, and a display device 5. FIG. 1 to 5, the conductive ball inspection and repair device 1 includes a calibration unit 6, a stage transport unit 7, inspection unit transport units 20Z and 21Z, repair unit transport units 30Z and 31Z, 32Z, a control unit 8, an operation unit 80, a detection unit 81, and a drive unit 82. Further, as shown in FIGS. 1 to 5, the conductive ball inspection and repair apparatus 1 includes a pedestal 10, a support member 11, a load port 12, a pre-aligner 13, a stage 14, and a carrier as a work carrier. A robot 15 and a workpiece recognition information acquisition unit 16 are provided.

The gantry 10 is installed on a floor surface or an installation surface (not shown). Although not shown, the gantry 10 is provided with walls and a ceiling that form a working space. Here, the work space is assumed to be a space surrounded by the four sides of the frame 10 in FIG. Inside the work space are an inspection device 2, a repair device 3, an imaging device 4, a display device 5, a calibration section 6, a stage transport section 7, inspection section transport sections 20Z and 21Z, repair section transport sections 30Z, 31Z and 32Z, A detection unit 81, a drive unit 82, a support member 11, a pre-aligner 13, a stage 14, a transfer robot 15, and a workpiece recognition information acquisition unit 16 are arranged. Further, an operation unit 80 and a load port 12 are arranged outside the work space. Note that the control unit 8 is arranged either outside the work space or inside the work space. Also, the operation unit 80 may be arranged inside the work space.

As shown in FIGS. 1 to 3, the support members 11 are arranged on the right and rear sides of the upper surface of the pedestal 10. As shown in FIGS. The support member 11 consists of two struts 110 , two arms 111 and one girder 112 . The lower ends of the two columns 110 are fixed to the left and right sides of the upper surface of the pedestal 10, respectively, and the two columns 110 are provided in the Z direction. The rear ends of the two arms 111 are fixed to the upper end of the support 110, and the two arms 111 are provided in the Y direction. Left and right ends of one girder 112 are fixed to front ends of two arms 111, and one girder 112 is provided in the X direction.

As shown in FIG. 1 , the load port 12 is arranged outside on the left side of the gantry 10 . A transfer container 17 (so-called FOUP) is placed on the table surface (upper surface) of the load port 12 . The transport container 17 is transported to or from the load port 12 by a ceiling monorail or a floor traveling robot (not shown). The transfer container 17 stores the workpiece W in a sealed state. The transport container 17 is provided with a door for loading and unloading the workpiece W. As shown in FIG. The door of the transport container 17 is opened and closed by a drive section controlled based on a control signal from the control section 8 .

As shown in FIG. 1 , the pre-aligners 13 are arranged on the left side and rear side of the upper surface of the pedestal 10 . The pre-aligner 13 aligns the center and orientation of the work W based on the marks of the straight portion or notch portion of the work W before inspection by the inspection device 2 . The pre-aligner 13 is driven based on control signals from the controller 8 .

As shown in FIGS. 1 to 4, the stage 14 is transported in the X direction and the Y direction by the stage transport section 7. FIG. A workpiece W is placed on the upper surface of the stage 14 . The position of the stage 14 shown in FIGS. 1 and 2 is the initial position.

As shown in FIG. 1 , the transfer robot 15 is arranged on the left side of the upper surface of the gantry 10 and on the front side of the pre-aligner 13 . The transport robot 15 transports the work W between the transport container 17 and the pre-aligner 13 and between the pre-aligner 13 and the stage 14 . A door for loading and unloading the work W is provided on the wall between the transfer container 17 on the outside of the work space and the pre-aligner 13 on the inside of the work space. The transport robot 15 is driven based on control signals from the controller 8 . The door in the wall is opened and closed by a drive section controlled based on control signals from the control section 8 .

As shown in FIGS. 1 and 2, the workpiece recognition information acquisition unit 16 is composed of a camera 160, a lens 161, and a lighting fixture 162 in this example. The work recognition information acquisition section 16 is provided in the flux transfer section 30 of the repair device 3 . Note that the workpiece recognition information acquisition section 16 may be provided at a location other than the flux transfer section 30 .

Here, the position information acquired by the calibration unit 6 of the workpiece recognition information acquisition unit 16 is the position information of the center of the lower end (tip) of the lens 161 (the optical axis of the lens 161).

After aligning the center and orientation of the work W by the pre-aligner 13 , the work recognition information acquisition unit 16 acquires the recognition information of the work W from the recognition mark of the work W on the stage 14 . Then, the work recognition information acquisition section 16 outputs the acquired work recognition information to the control section 8 as a detection signal. As a result, the work W is recognized via the control unit 8 as to what type of circuit design the work W has.

(Description of Stage Transfer Unit 7)
As shown in FIGS. 1 to 4, the stage transfer section 7 is arranged on the upper surface of the pedestal 10, in front of the support member 11 and on the right side of the transfer robot 15. As shown in FIGS. The stage transport unit 7 transports the stage 14 in X and Y directions, which are horizontal directions and are orthogonal to each other. The stage transport section 7 includes an X-direction fixing section (X-direction guide section) 70X, an X-direction moving section 71X, an X-direction driving section, a Y-direction fixing section (Y-direction guide section) 70Y, and a Y-direction moving section 71Y. and a Y-direction drive unit.

The X-direction fixed portion 70X is fixed to the upper surface of the gantry 10 in the X-direction. The X-direction moving portion 71X is attached to the X-direction fixing portion 70X so as to be movable in the X direction. The X-direction driving section is, for example, a servomotor, and moves the X-direction moving section 71X in the X-direction, which is the longitudinal direction of the X-direction fixing section 70X. The X-direction driving section is driven based on a control signal from the control section 8. FIG.

The Y-direction fixing portion 70Y is fixed in the Y-direction to the upper surface of the X-direction moving portion 71X. The Y-direction moving portion 71 is attached to the Y-direction fixed portion 70 so as to be movable in the Y direction. The Y-direction driving section is, for example, a servomotor, and moves the Y-direction moving section 71Y in the Y-direction, which is the longitudinal direction of the Y-direction fixing section 70Y. The Y-direction driving section is driven based on a control signal from the control section 8. FIG. 1 to 4, the X-direction moving portion 71X and the Y-direction fixing portion 70Y are shown integrally.

(Description of Inspection Section Transfer Sections 20Z and 21Z)
As shown in FIG. 2, the inspection unit transport units 20Z and 21Z provide a main inspection unit 20 and a verification inspection unit 21 (hereinafter referred to as "each unit 20 and 21 of the inspection unit") as inspection units of the inspection apparatus 2. , are conveyed in the Z direction, which is the vertical direction perpendicular to the X and Y directions.

The inspection unit conveying unit 20Z of the main inspection unit 20 includes a Z-direction fixing unit (Z-direction guide unit), a Z-direction moving unit, and a Z-direction driving unit 200Z. The Z-direction fixed part is fixed on the front left side of the girder 112 . The Z-direction moving part is attached to the Z-direction fixed part so as to be movable in the Z direction. The Z-direction driving section 200Z is, for example, a servomotor, and moves the Z-direction moving section in the Z-direction, which is the longitudinal direction of the Z-direction fixing section. The Z-direction driving section 200Z drives based on a control signal from the control section 8. FIG.

Similarly, the inspection unit transport unit 21Z of the verification inspection unit 21 is composed of a Z-direction fixing unit (Z-direction guide unit), a Z-direction moving unit, and a Z-direction driving unit 210Z. The Z direction fixed part is fixed on the front surface of the girder 112 and on the left side of the Z direction fixed part of the inspection part transfer part 20Z of the main inspection part 20 . The Z-direction moving part is attached to the Z-direction fixed part so as to be movable in the Z direction. The Z-direction driving section 210Z is, for example, a servomotor, and moves the Z-direction moving section in the Z-direction, which is the longitudinal direction of the Z-direction fixing section. The Z-direction driving section 210Z drives based on a control signal from the control section 8. FIG.

(Description of Repair Section Transfer Sections 30Z, 31Z, and 32Z)
As shown in FIGS. 2 and 3, repair section transport sections 30Z, 31Z, and 32Z include a flux transfer section 30, a conductive ball mounting section 31, and an excess conductive ball removing section 32 (hereinafter referred to as a , "each section 30, 31, 32 of the repair section") are transported in the Z direction, which is the vertical direction perpendicular to the X and Y directions.

The repair section conveying section 30Z of the flux transfer section 30 is composed of a Z-direction fixing section (Z-direction guide section), a Z-direction moving section, and a Z-direction driving section 300Z. The Z direction fixed part is fixed to the middle of the front surface of the girder 112 . The Z-direction moving part is attached to the Z-direction fixed part so as to be movable in the Z direction. The Z-direction driving section 300Z is, for example, a servomotor, and moves the Z-direction moving section in the Z-direction, which is the longitudinal direction of the Z-direction fixing section. The Z-direction drive section 300Z drives based on the control signal from the control section 8. FIG.

Similarly, the repair section conveying section 31Z of the conductive ball mounting section 31 is composed of a Z-direction fixing section (Z-direction guide section), a Z-direction moving section, and a Z-direction driving section 310Z. The Z-direction fixed portion is fixed to the front surface of the girder 112 on the right side of the Z-direction fixed portion of the repair portion conveying portion 30Z of the flux transfer portion 30 . The Z-direction moving part is attached to the Z-direction fixed part so as to be movable in the Z direction. The Z-direction driving section 310Z is, for example, a servomotor, and moves the Z-direction moving section in the Z-direction, which is the longitudinal direction of the Z-direction fixing section. The Z-direction driving section 310Z drives based on a control signal from the control section 8. FIG.

Similarly, the repair section conveying section 32Z of the surplus conductive ball removing section 32 is composed of a Z-direction fixing section (Z-direction guide section), a Z-direction moving section, and a Z-direction driving section 320Z. The Z-direction fixed portion is fixed to the front surface of the girder 112 on the right side of the Z-direction fixed portion of the repair portion conveying portion 32Z of the surplus conductive ball removing portion 32 . The Z-direction moving part is attached to the Z-direction fixed part so as to be movable in the Z direction. The Z-direction driving section 320Z is, for example, a servomotor, and moves the Z-direction moving section in the Z-direction, which is the longitudinal direction of the Z-direction fixing section. The Z-direction drive section 320Z drives based on the control signal from the control section 8. FIG.

(Description of calibration section 6)
The calibration unit 6 obtains X-direction position information, Y-direction position information, and Z-direction position information (hereinafter referred to as “X-, Y-, and Z-direction position information”) of each unit 30, 31, and 32 of the repair unit. ). The positional information of each part 30, 31, 32 of the repair part in the X, Y, and Z directions is the top end (lower end) of the flux transfer pin 300 of the flux transfer part 30, the conductive ball mounting nozzle 310 of the conductive ball mounting part 31, and so on. This is the positional information of the tip (lower end) and the tip (lower end) of the redundant conductive ball removing nozzle 320 of the redundant conductive ball removing section 32 in the X, Y, and Z directions. Then, the position of the work W is calibrated based on the position information acquired by the calibration unit 6 .

As shown in FIGS. 1 and 2, the calibration section 6 is fixed to the stage 14 . The calibration section 6 has an XY position information acquisition section 60 and a Z position information acquisition section 61 .

The XY position information acquisition unit 60 acquires the X-direction position information and the Y-direction position information of each unit 30, 31, and 32 of the repair unit, and outputs them to the control unit 8 as detection signals. The XY position information acquisition unit 60 is a camera in this example.

The Z-position information acquisition unit 61 acquires the Z-direction position information of each unit 30, 31, and 32 of the repair unit, and outputs it to the control unit 8 as a detection signal. The Z position information acquisition unit 61 is a contact sensor or a contact displacement sensor in this example.

Similarly, the calibration unit 6 acquires position information in the X, Y, and Z directions of each unit 20 and 21 of the inspection unit and position information in the X, Y, and Z directions of the work recognition information acquisition unit 16. and output to the control unit 8 as a detection signal.

(Description of inspection device 2)
The inspection device 2 inspects whether or not the conductive balls B are normally mounted on the electrodes E of the workpiece W. As shown in FIGS. 1 and 2, the inspection apparatus 2 has a main inspection section 20 and a verification inspection section 21 as inspection sections.

The main inspection section 20 is provided in the Z-direction moving section of the inspection section transport section 20Z. The verification inspection unit 21 is provided in the Z-direction moving unit of the inspection unit transport unit 21Z. As a result, the main inspection section 20 and the verification inspection section 21 are arranged laterally in the X direction.

The main inspection unit 20 inspects whether or not the conductive balls B are normally mounted on the electrodes E of the workpiece W. The main inspection section 20 consists of a camera 200, a lens 201, and a lighting fixture 202 in this example. The field of view (angle of view) of the camera 200 of the main inspection section 20 is a range in which one or a plurality of integrated circuit chips C on the workpiece W can be imaged. Further, by making the lens 201 of the main inspection unit 20 have a zoom function, the magnification of the camera 200 of the main inspection unit 20 can be changed to arbitrarily change the imaging range.

Here, the X-, Y-, and Z-direction position information acquired by the calibration unit 6 of the main inspection unit 20 is the position information of the center of the lower end (tip) of the lens 201 (the optical axis of the lens 201).

The main inspection unit 20 captures images of a plurality of integrated circuit chips C on the workpiece W one by one with the camera 200, and obtains information as to whether or not the conductive balls B are normally mounted on the electrodes E of the workpiece W. get. The main inspection section 20 outputs the acquired information to the control section 8 as a detection signal. Based on the information acquired by the main inspection unit 20, the control unit 8 inspects whether or not the conductive balls B are normally mounted on the electrodes E of the workpiece W.

When the main inspection unit 20 detects a defective portion, the verification inspection unit 21 confirms the defective portion. The verification inspection unit 21 is composed of a camera 210 , a lens 211 and a lighting fixture 212 in this example. The field of view (angle of view) of the camera 210 of the verification inspection unit 21 is, even if narrow, a range in which one location can be imaged. Therefore, the magnification of the lens 211 of the verification inspection section 21 is greater than the magnification of the lens 201 of the main inspection section 20 .

Here, the X-, Y-, and Z-direction position information acquired by the calibration unit 6 of the verification inspection unit 21 is the position information of the center of the lower end (tip) of the lens 211 (the optical axis of the lens 211).

The verification inspection unit 21 captures an image of the defective portion detected by the main inspection unit 20 with the camera 210 and obtains information as to whether or not repair by the repair device 3 is necessary. The verification inspection unit 21 outputs the acquired information to the control unit 8 as a detection signal. The information acquired by the verification inspection unit 21 is displayed on the display device 5 as an image. By viewing the image displayed on the display device 5, the operator can confirm whether or not repair by the repair device 3 is required.

(Description of repair device 3)
When the main inspection unit 20 detects a defective portion and the verification inspection unit 21 determines that the defective portion needs to be repaired, the repair device 3 performs fix it. As shown in FIGS. 1 and 2 , the repair device 3 has a flux transfer section 30 , a conductive ball mounting section 31 , and an excess conductive ball removing section 32 .

The flux transfer section 30 is provided in the Z-direction moving section of the repair section conveying section 30Z. The conductive ball mounting portion 31 is provided in the Z-direction moving portion of the repair portion transfer portion 31Z. The surplus conductive ball removing section 32 is provided in the Z-direction moving section of the repair section conveying section 32Z. As a result, the flux transfer portion 30, the conductive ball mounting portion 31, and the surplus conductive ball removing portion 32 are arranged left and right in the X direction.

The flux transfer unit 30 transfers the flux F to the electrodes E on which the conductive balls B are not mounted. A flux transfer pin 300 is attached to the flux transfer portion 30 via a pin holder, a lock mechanism, and a position measurement sensor. Here, the position information acquired by the calibration unit 6 of the flux transfer unit 30 is the position information of the center of the lower end (tip) of the flux transfer pin 300 as described above.

A flux supply tray 301 is arranged below the flux transfer pins 300 via a Y-direction moving mechanism 302 . The Y-direction moving mechanism 302 is composed of a fixed portion (guide portion), a moving portion, and a driving portion 303 . The drive unit 303 is, for example, a servomotor, and moves the moving unit in the Y direction, which is the longitudinal direction of the fixed unit. As a result, the flux supply tray 301 moves in the Y direction to be positioned under the flux transfer pins 300 or retracted from under the flux transfer pins 300 . The drive section 303 drives based on the control signal from the control section 8 .

The flux transfer pin 300 applies an appropriate amount of flux F from a flux supply tray 301 located below. After the flux supply tray 301 is retracted from below, the flux transfer pin 300 moves down in the Z direction to transfer the flux F to the electrode E in the missing ball state.

The conductive ball mounting section 31 mounts the conductive ball B on the electrode E via the flux F transferred by the flux transfer section 30 . A conductive ball mounting nozzle 310 is attached to the conductive ball mounting portion 31 via a nozzle holder, a locking mechanism, and a position measuring sensor. Here, the positional information acquired by the calibration unit 6 of the conductive ball mounting part 31 is the positional information of the center of the lower end (tip) of the conductive ball mounting nozzle 310 as described above.

A conductive ball supply tray 311 is arranged below the conductive ball mounting nozzle 310 via a Y-direction moving mechanism 312 . The Y-direction moving mechanism 312 includes a fixed portion (guide portion), a moving portion, and a driving portion 313 . The drive unit 313 is, for example, a servomotor, and moves the moving unit in the Y direction, which is the longitudinal direction of the fixed unit. As a result, the conductive ball supply tray 311 moves in the Y direction to be positioned under the conductive ball mounting nozzle 310 or withdrawn from under the conductive ball mounting nozzle 310 . The drive section 313 drives based on a control signal from the control section 8 .

The conductive ball mounting nozzle 310 sucks one conductive ball B from the conductive ball supply tray 311 positioned below. After the conductive ball supply tray 311 is retracted from below, the conductive ball mounting nozzle 310 is lowered in the Z direction and mounted on the flux F of the electrode E in the missing ball state.

The redundant conductive ball removing unit 32 removes the redundant conductive balls B1 mounted on the workpiece W in excess. A surplus conductive ball removing nozzle 320 is attached to the surplus conductive ball removing unit 32 via a nozzle holder, a locking mechanism, and a position measuring sensor. Here, the positional information acquired by the calibration unit 6 of the redundant conductive ball removing unit 32 is the positional information of the center of the lower end (tip) of the redundant conductive ball removing nozzle 320 as described above.

A surplus conductive ball receiving tray 321 is arranged below the surplus conductive ball removing nozzle 320 via a Y-direction moving mechanism 322 . The Y-direction moving mechanism 322 is composed of a fixed portion (guide portion), a moving portion, and a driving portion 323 . The drive unit 323 is, for example, a servomotor, and moves the moving unit in the Y direction, which is the longitudinal direction of the fixed unit. As a result, the surplus conductive ball receiving tray 321 moves in the Y direction to be positioned under the surplus conductive ball removing nozzle 320 or retracted from under the surplus conductive ball removing nozzle 320 . The drive section 323 drives based on a control signal from the control section 8 .

The surplus conductive ball removing nozzle 320 moves down in the Z direction to suck the surplus conductive balls B1 while the surplus conductive ball receiving tray 321 is retracted from below. Further, the surplus conductive ball removing nozzle 320 rises in the Z direction and delivers the sucked surplus conductive balls B1 to the surplus conductive ball receiving tray 321 positioned below.

The redundant conductive ball removing nozzle 320 also removes the shifted conductive balls B shown in FIG. 6(C).

(Explanation of imaging device 4)
The image capturing device 4 captures images of at least portions to be repaired by the repair units 30 , 31 , and 32 . The imaging device 4 is arranged on the side where the operator is positioned, that is, on the front side of the repair device 3 .

As shown in FIGS. 1 and 3, the imaging device 4 has a lens 40 as an optical section, a camera 41 as an imaging section, a lighting fixture 42 as an illumination section, and a laser pointer 43 . In FIG. 3 , the symbol “L”, the solid line arrow and the double-pointed arrow indicate the optical axis of the lens 40 and the imaging direction (field of view) of the camera 41 . A symbol “L1” and a solid line arrow indicate the irradiation direction of the illumination light of the lighting device 42 . The symbol “L2” and the solid line arrow indicate the irradiation direction of the laser beam of the laser pointer 43, that is, the pointing direction.

The lens 40 magnifies the object (at least the portion to be repaired by each portion 30, 31, 32 of the repair portion). Camera 41 captures an image of an object magnified by lens 40 . The illuminator 42 illuminates an object that is magnified by the lens 40 and imaged by the camera 41 . The laser pointer 43 points to the optical axis L of the lens 40 when manually positioning an object to be magnified and imaged on the optical axis L of the lens 40 (imaging direction of the camera 41). This makes it easy to visually align the object with the optical axis L of the lens 40 .

As indicated by the two-pointed arrow in FIG. 3, the imaging device 4 images the lower end of the conductive ball-mounted nozzle 310 and its surroundings. Further, although not shown, the imaging device 4 images the lower end of the flux transfer pin 300 and its surroundings and the lower end of the excess conductive ball removing nozzle 320 and its surroundings.

The imaging device 4 outputs the captured image to the control unit 8 as a signal. The image captured by the imaging device 4 is enlarged and displayed on the display device 5 via the control unit 8 .

(The X-direction movement adjustment section 4X, the Y-direction movement adjustment section 4Y, the Z-direction movement adjustment section 4Z, and the rotation adjustment section 4D of the imaging device 4 (hereinafter referred to as "adjustment sections 4X, 4Y, 4Z, and 4D") explanation)
As shown in FIGS. 1 and 3, the imaging device 4 is arranged on the upper surface of the pedestal 10 via respective adjustment units 4X, 4Y, 4Z, and 4D.

The X-direction movement adjustment unit 4X can move and adjust the imaging device 4 in the X direction, which is the horizontal direction. The X-direction movement adjusting section 4X is composed of a fixing section (guide section) 40X, a moving section 41X, and an automatic movement stopping section 42X as a driving section.

The fixed part 40X is fixed on the upper surface of the pedestal 10, on the front side of the X-direction fixed part 70X, and parallel to the X-direction fixed part 70X, that is, in the X direction. The moving portion 41X is attached to the fixed portion 40X so as to be movable in the X direction.

The automatic movement stopping unit 42X is, for example, a servomotor. The automatic movement stopping part 42X automatically moves the moving part 41X in the X direction, which is the longitudinal direction of the fixed part 40X. Further, the automatic movement stopping unit 42X automatically stops the moving unit 41X at positions corresponding to the parts 30, 31, and 32 of the repair part (hereinafter referred to as "positions of the parts 30, 31, and 32 of the repair part"). Let The automatic movement stopping section 42X automatically stops driving based on a control signal from the control section 8. FIG.

The Z-direction movement adjustment unit 4Z can move and adjust the imaging device 4 in the Z direction, which is the vertical direction. The Z-direction movement adjusting section 4Z is composed of a fixed section (guide section) 40Z, a moving section 41Z, and an adjusting section 42Z.

The fixing portion 40Z is arranged in the Z direction, and the lower end of the fixing portion 40Z is fixed to the upper end surface of the moving portion 41X of the X-direction movement adjusting portion 4X. The moving part 41Z is attached to the fixed part 40Z so as to be movable in the Z direction. The adjuster 42Z is a member that adjusts the movement of the moving part 41Z in the Z direction with respect to the fixed part 40Z by an adjustment operation performed by the operator.

The Y-direction movement adjustment unit 4Y can move and adjust the imaging device 4 in the Y direction, which is the horizontal direction. The Y-direction movement adjusting section 4Y is composed of a fixed section (guide section) 40Y, a moving section 41Y, and an adjusting section 42Y.

The fixing portion 40Y is arranged in the Y direction, and the front end of the fixing portion 40Y is fixed to the upper end surface of the moving portion 41Z of the Z-direction movement adjusting portion 4Z. The moving portion 41Y is attached to the fixed portion 40Y so as to be movable in the Y direction. The adjustment portion 42Y is a member that is adjusted by an operator to move the moving portion 41Y in the Y direction with respect to the fixed portion 40Y.

The rotation adjustment unit 4D can rotate and adjust the imaging device 4 around an axis in the X direction (hereinafter referred to as "X axis"). The rotation adjusting portion 4D includes a fixing portion (guide portion) 40D, a rotating portion 41D, and an adjusting portion 42D.

The fixing portion 40D is arranged in the Y direction, and the front end of the fixing portion 40D is fixed to the upper surface of the rear end portion of the moving portion 41Y of the Y-direction movement adjusting portion 4Y. The rotating portion 41D is attached to the fixed portion 40D so as to be rotatable around the X axis. The adjusting portion 42D is a member that is adjusted to rotate the rotating portion 41D about the X-axis with respect to the fixed portion 40D by an adjustment operation performed by the operator. The imaging device 4 is attached to the rotating portion 41D.

As described above, the imaging device 4 automatically moves between the repair units 30, 31, and 32 under the control of the control unit 8 and stops driving the automatic movement stop unit 42X, and the repair units 30, 31, It automatically stops at position 32. Further, the imaging device 4 is adjusted in the Y direction, the Z direction, and the directions around the X axis by manual adjustment by the operator of the Y-direction movement adjustment section 4Y, the Z-direction movement adjustment section 4Z, and the rotation adjustment section 4D.

(Description of the display device 5)
The display device 5 enlarges and displays the object imaged by the imaging device 4 as an image visually recognized by the operator. As shown in FIGS. 1 and 2, the display device 5 has a holding portion 50 . The display device 5 is arranged on the repair device 3 side. That is, the display device 5 is arranged on the right side of the repair device 3 and the imaging device 4 and on the rear side of the imaging device 4 . In FIG. 1, the code|symbol "L3" shows the line-of-sight direction to the display apparatus 5 of an operator.

The holding unit 50 adjusts the movement of the display device 5 in the Z direction, which is the vertical direction, and adjusts the rotation about the axis in the Z direction (hereinafter referred to as the “Z axis”). The holding portion 50 includes a holding metal fitting 51 , a Z-direction movement adjustment portion 52 , a Z-direction stop 53 , a rotation adjustment portion 54 , and a rotation stop 55 .

The Z-direction movement adjusting section 52 has a Z-direction fixing section and a Z-direction moving section attached to the Z-direction fixing section so as to be movable and adjustable in the Z direction. The Z-direction stopper 53 is fixed to the Z-direction fixed portion after the Z-direction moving portion is moved and adjusted in the Z direction.

The rotation adjustment portion 54 has a rotation fixing portion and a rotating portion attached to the rotation fixing portion so as to be capable of adjusting rotation around the Z axis. The rotation stopper 55 is fixed to the rotation fixing portion after adjusting the rotation of the rotation portion around the Z axis.

The left end of the holding metal fitting 51 is fixed to the middle of the support 110 on the right side of the support member 11 . A Z-direction movement adjusting portion 52 is provided at the right end of the holding metal fitting 51 . A rotation adjustment portion 54 is provided in the Z-direction movement adjustment portion 52 . The display device 5 is provided in the rotation adjusting section 54 . The display device 5 is adjusted to move in the Z direction and adjusted to rotate about the Z axis via the holding portion 50 .

As described above, the height and orientation of the display device 5 are adjusted by the holding unit 50 to match the operator's eye position IP, that is, the line-of-sight direction L3 of the operator toward the display device 5 .

(Description of the control unit 8, the operation unit 80, the detection unit 81, and the driving unit 82)
As shown in FIG. 5 , the conductive ball inspection and repair device 1 includes a control section 8 , an operation section 80 , a detection section 81 and a drive section 82 .

The operation unit 80 outputs an instruction signal to the control unit 8 by being operated by an operator. The operation unit 80 is arranged on the line-of-sight direction L3 toward the display device 5 of the operator. In this example, the operation unit 80 is composed of the display device 5 and a separate screen (such as a touch panel, not shown). The operator touches the screen of the operation unit 80 while watching the image displayed on the display device 5 . Thereby, each device of the conductive ball inspection and repair device 1 according to this embodiment is operated and adjusted. Operation unit 80 and display device 5 are configured by, for example, a user interface or HMI.

The detection unit 81 detects information necessary for the process of inspection by each unit 20, 21 of the inspection unit and information necessary for the process of repair by each unit 30, 31, 32 of the repair unit, and outputs the detected information to the control unit 8 as a detection signal. do. The detection unit 81 includes the camera 160 of the workpiece recognition information acquisition unit 16, the camera 200 of the main inspection unit 20, the camera 210 of the verification inspection unit 21, the XY position information acquisition unit 60, and the Z position information acquisition unit 61. .

The control unit 8 receives the instruction signal output from the operation unit 80 and the detection signal output from the detection unit 81, and based on the instruction signal and the detection signal, each unit 20, 21 of the inspection unit performs inspection and repair. Each section 30, 31, 32 of the section controls the process of correction. The control unit 8 is an information processing device, and is composed of, for example, an electronic control unit (ECU). The control unit 8 includes a microcontroller and other electronic circuits. A microcontroller includes a processor and memory. A processor is at least one of a CPU, MPU, or GPU. The memory includes ROM and RAM. The processor executes programs stored in ROM or loaded into RAM.

The drive section 82 drives based on the control signal output from the control section 8 . The drive unit 82 includes a drive unit for the door of the transfer container 17, a drive unit for the door on the wall, the transfer robot 15, the pre-aligner 13, the X-direction drive unit and the Y-direction drive unit of the stage transfer unit 7, and the Z-direction drive unit 200Z. , 210Z, 300Z, 310Z, 320Z, drive units 303, 313, 323 and automatic movement stop 42X.

(Description of the action of the embodiment)
The conductive ball inspecting and repairing apparatus 1 according to this embodiment is constructed as described above, and the operation thereof will be described below with reference to the flowchart of FIG. 7 showing the steps.

First, the operator manually operates the operation unit 80 to start the operation of the conductive ball inspection and repair device 1 . Alternatively, under the control of the control unit 8, the operation of the conductive ball inspection and repair device 1 is automatically started (start).

The door of the transport container 17 and the door of the wall are opened. The transfer robot 15 takes out the work W from the transfer container 17 and carries it into the conductive ball inspection and repair apparatus 1 (carrying in S1 of the work W). At the same time, the door of the transport container 17 and the door in the wall are closed. A transfer robot 15 sets the work W on the pre-aligner 13 . The pre-aligner 13 aligns the center and orientation of the work W (alignment of the center of the work W S2).

The transfer robot 15 sets the workpiece W from the pre-aligner 13 onto the stage 14 at the initial position. The work W is positioned at the work recognition information acquisition section 16 via the stage transport section 7 and the calibration section 6, and is recognized by the work recognition information acquisition section 16 (work W recognition S3).

Next, the plurality of integrated circuit chips C of the workpiece W are positioned in the main inspection section 20 via the stage transport section 7 and the calibration section 6, respectively, and are inspected by the main inspection section 20 (main inspection section 20). Inspection S4 of section 20).

Based on the inspection by the main inspection unit 20, the control unit 8 determines whether or not there is a defective portion in the plurality of integrated circuit chips C of the workpiece W (whether there is a defective portion? S5). Here, if there is no defective portion, the process proceeds to the following stage (process) S11. On the other hand, if there is a defective portion, the process proceeds to the next stage (process) S6.

The defective portion is positioned in the verification inspection unit 21 via the stage transportation unit 7 and the calibration unit 6, and is inspected for confirmation by the verification inspection unit 21 (inspection S6 of the verification inspection unit 21). ). That is, the defective portion is imaged by the camera 210 of the inspection unit 21 for verification, and the imaged image is enlarged and displayed on the display device 5 .

The operator visually recognizes the image of the defective portion enlarged and displayed on the display device 5, and determines whether or not correction is necessary (correction required? S7). Then, when the operator determines that "there is no need for correction", he/she operates the operation unit 80 to proceed to the following stage (process) S11. On the other hand, when the operator determines that "correction is necessary", he/she operates the operation unit 80 to proceed to the next stage (process) S8.

The defective portion is located in each section 30 , 31 , 32 of the repair section via the stage transport section 7 and the calibration section 6 . Then, the defective portion is repaired by each section 30, 31, 32 of the repair section (repair device 3 repairs the defective portion S8). The working conditions in which each part 30, 31, 32 of the repair part corrects the defective portion are as follows.

That is, when the defective portion is in the missing ball state shown in FIG. 6(B). In this case, first, the flux transfer pin 300 of the flux transfer portion 30 transfers the flux F to the electrode E on which the conductive balls B are not mounted. Next, the conductive ball mounting nozzle 310 of the conductive ball mounting portion 31 mounts the conductive ball B on the flux F transferred to the electrode E. As shown in FIG.

When the defective portion is in the shift ball state shown in FIG. 6(C). In this case, the surplus conductive ball removing nozzle 320 of the surplus conductive ball removing section 32 first removes the conductive ball B that is out of the electrode E. Then, as shown in FIG. Next, the flux transfer pin 300 of the flux transfer unit 30 transfers the flux F to the electrode E from which the conductive ball B has been removed. Then, the conductive ball mounting nozzle 310 of the conductive ball mounting portion 31 mounts the conductive ball B on the flux F transferred to the electrode E. As shown in FIG.

When the defective portion is in the surplus ball state shown in FIG. 6(D). In this case, the redundant conductive balls B are removed by the redundant conductive ball removing nozzles 320 of the redundant conductive ball removing section 32 . As described above, each of the parts 30, 31, and 32 of the repair section repairs the defective portion.

In this stage (process) S8, the image capturing device 4 captures an image of the defective portion to be repaired by the respective units 30, 31, and 32 of the repair unit. The imaged object is enlarged and displayed on the display device 5 . The operator can visually check the object enlarged and displayed on the display device 5 to confirm that the defective portion has been corrected by the respective units 30, 31, and 32 of the repair unit.

After the defective portion is corrected, the process proceeds to the next stage (process) S9. The corrected defective portion is positioned in the verification inspection section 21 via the stage transport section 7 and the calibration section 6, and is reconfirmed by the verification inspection section 21 (reinspection S9 of the verification inspection section 21). ). That is, the corrected defective portion is imaged by the camera 210 of the inspection unit 21 for verification, and the imaged image is enlarged and displayed on the display device 5 .

The operator visually reconfirms the image of the corrected defective portion enlargedly displayed on the display device 5, and re-determines whether or not re-correction is necessary (re-correction required? S10). ). Then, when the operator determines that "there is no need for re-correction", he/she operates the operation unit 80 to proceed to the following stage (process) S11. On the other hand, if the operator determines that "there is a need for re-correction", he/she operates the operation unit 80 to proceed to the previous stage (process) S8 again.

There are no defective parts, no need for correction, and no need for re-correction. In this case, the stage 14 is returned to the initial position. At the same time, the door of the transport container 17 and the door in the wall are opened. The transport robot 15 unloads the work W on the stage 14 from the conductive ball inspection and repair apparatus 1 and stores it in the transport container 17 (unloading S11 of the work W). At the same time, the door of the transport container 17 and the door in the wall are closed.

Thus, the operation of the conductive ball inspection and repair device 1 is completed (end).

(Description of effects of the embodiment)
The conductive ball inspection and repair device 1 according to this embodiment has the above-described configuration and operation, and the effects thereof will be described below.

The conductive ball inspection and repair device 1 according to this embodiment includes an imaging device 4 that captures an image of at least a portion to be repaired by each unit 30, 31, and 32 of the repair unit, and an operator visually recognizes the target captured by the imaging device 4. and a display device 5 for displaying an image to be displayed. As a result, according to the conductive ball inspection and repair device 1 according to this embodiment, the operator can visually recognize at least the portions to be repaired by the respective parts 30, 31, and 32 of the repair section.

That is, in the conductive ball inspection and repair device 1 according to this embodiment, when the operator operates the operation unit 80 to adjust the positions of the parts 30, 31, and 32 of the repair unit, the operator can enlarge the display on the display device 5. image can be seen. As a result, the conductive ball inspection and repair device 1 according to this embodiment can accurately adjust the positions of the parts 30, 31, and 32 of the repair section, and further adjust the positions of the parts 30, 31, and 32 of the repair section. You can see the situation. As a result, the conductive ball inspection and repair device 1 according to this embodiment can perform highly reliable position adjustment of the parts 30, 31, and 32 of the repair section.

The conductive ball inspection and repair device 1 according to this embodiment includes a holding part 50 that can adjust the movement of the display device 5 in the vertical direction Z and rotate it around the Z axis. As a result, in the conductive ball inspection and repair device 1 according to this embodiment, the height and orientation of the display device 5 are adjusted to the operator's eye position IP, that is, the operator's line of sight direction L3 to the display device 5. . As a result, the conductive ball inspection and repair device 1 according to this embodiment is highly reliable and can be visually recognized by the operator.

In the conductive ball inspection and repair device 1 according to this embodiment, the imaging device 4 is arranged on the operator side with respect to the repair device 3 . As a result, according to the conductive ball inspection and repair device 1 according to this embodiment, the direction in which the imaging device 4 images the respective parts 30, 31, and 32 of the repair section (the optical axis L of the lens 40 and the camera 41 imaging direction) and the direction in which the operator looks at each part 30, 31, 32 of the repair section (the operator's eye position IP and the operator's line-of-sight direction L3 to the display device 5) match. As a result, the conductive ball inspection and repair apparatus 1 according to this embodiment can visually recognize the images of the respective parts 30, 31, and 32 of the repair part, which are images displayed on the display device 5, without discomfort.

The conductive ball inspection and repair device 1 according to this embodiment is a device in which the imaging device 4 has an optical section 40 , an imaging section 41 and an illumination section 42 . As a result, the conductive ball inspection and repair device 1 according to this embodiment magnifies and illuminates the target imaged by the imaging unit 41 (at least the portions to be repaired by the respective units 30, 31, and 32 of the repair unit) by the optical unit 40. It can be displayed on the display device 5 as an image brightly illuminated by the portion 42 . As a result, the conductive ball inspection and repair device 1 according to this embodiment allows the operator to visually recognize a large and bright object on the display device 5, so that the positions of the parts 30, 31, and 32 of the repair section can be adjusted with high reliability. can.

The conductive ball inspection and repair device 1 according to this embodiment is a device in which the imaging device 4 has a laser pointer 43 . As a result, in the conductive ball inspection and repair device 1 according to this embodiment, when the area to be enlarged is aligned with the field of view of the imaging device 4 (the optical axis L of the lens 40 and the imaging direction of the camera 41), the operator By visually observing the irradiation direction L2 of the laser beam of the pointer 43, it can be easily adjusted.

According to the conductive ball inspection and repair device 1 according to this embodiment, the imaging device 4 includes the X-direction movement adjustment section 4X, the Y-direction movement adjustment section 4Y, the Z-direction movement adjustment section 4Z, and the rotation adjustment section 4D. and have As a result, the conductive ball inspection and repair device 1 according to this embodiment can adjust the direction (angle) of the object (at least the parts to be repaired by the repair units 30, 31, and 32) imaged by the imaging device 4. FIG.

In the conductive ball inspection and repair device 1 according to this embodiment, the repair device 3 has a repair section, and the repair section includes a flux transfer section 30, a conductive ball mounting section 31, and an excess conductive ball removing section 32. , having As a result, the conductive ball inspection/repair device 1 according to this embodiment can repair the defective portion by the respective portions 30, 31, and 32 of the repair portion.

In the conductive ball inspection and repair device 1 according to this embodiment, the parts 30, 31, and 32 of the repair section are arranged in the X direction, and the imaging device 4 has an automatic movement stopping section 42X. As a result, the conductive ball inspection and repair device 1 according to this embodiment automatically moves the imaging device 4 in the X direction by the automatic movement stopping unit 42X, and moves the imaging device 4 to the positions of the parts 30, 31, and 32 of the repair unit. , can be automatically stopped. As a result, the conductive ball inspection and repair device 1 according to this embodiment can move the imaging device 4 to a desired location (the positions of the respective portions 30, 31, and 32 of the repair section) in a short period of time, so that efficient work can be obtained. be done.

In the conductive ball inspection and repair device 1 according to this embodiment, the inspection device 2 has an inspection section, and the inspection section has a main inspection section 20 and a verification inspection section 21 . As a result, the conductive ball inspection and repair device 1 according to this embodiment can inspect whether or not the conductive balls B are normally mounted on the electrodes E of the workpiece W by the main inspection section 20 . Moreover, in the conductive ball inspection and repair device 1 according to this embodiment, the portion detected by the main inspection unit 20 can be confirmed by the inspection unit 21 for verification.

The conductive ball inspection and repair apparatus 1 according to this embodiment determines the position of the workpiece W based on the X-direction position information, the Y-direction position information, and the Z-direction position information of the parts 30, 31, and 32 of the repair section. It has a calibration section 6 for calibrating. As a result, the conductive ball inspection and repair apparatus 1 according to this embodiment accurately aligns the portion to be repaired on the workpiece W with the portion to be repaired by each of the repair units 30, 31, and 32 by the calibration unit 6. be able to.

In the conductive ball inspection and repair device 1 according to this embodiment, the calibration section 6 has an XY position information acquisition section 60 and a Z position information acquisition section 61 . As a result, the conductive ball inspection and repair apparatus 1 according to this embodiment uses the XY position information acquisition unit 60 and the Z position information acquisition unit 61 of the calibration unit 6 to determine the location of the workpiece W to be corrected and the repair unit. The portions to be corrected by the respective units 30, 31, and 32 can be matched more accurately.

The conductive ball inspection and repair device 1 according to this embodiment has a stage 14, a stage transport section 7, inspection section transport sections 20Z and 21Z, and repair section transport sections 30Z, 31Z and 32Z. As a result, the conductive ball inspection and repair apparatus 1 according to this embodiment moves the work W to the positions of the parts 20 and 21 of the inspection part and the parts 30, 31 and 32 of the repair part by the stage 14 and the stage transfer part 7. can be transported to and from each location. Moreover, the conductive ball inspection and repair apparatus 1 according to this embodiment can transport the parts 20 and 21 of the inspection part to the inspection position where the workpiece W was transported by the inspection part transport parts 20Z and 21Z. In addition, the conductive ball inspection and repair device 1 according to this embodiment can transport the parts 30, 31, and 32 of the repair section to the repair positions to which the work W has been transported by the repair section transport sections 30Z, 31Z, and 32Z.

The conductive ball inspection and repair device 1 according to this embodiment has a pre-aligner 13 . As a result, the conductive ball inspection and repair apparatus 1 according to this embodiment can align the center and orientation of the workpiece W with the pre-aligner 13 before inspection by the respective parts 20 and 21 of the inspection section.

A conductive ball inspection and repair device 1 according to this embodiment has a pre-aligner 13 and a workpiece recognition information acquisition section 16 . As a result, the conductive ball inspection and repair apparatus 1 according to this embodiment can recognize the work W by the work recognition information acquisition unit 16 after the center and orientation of the work W are aligned by the pre-aligner 13 .

A conductive ball inspection and repair apparatus 1 according to this embodiment has a transfer container 17 , a pre-aligner 13 , a stage 14 and a transfer robot 15 . As a result, the conductive ball inspection and repair apparatus 1 according to this embodiment moves the work W between the transport container 17 and the pre-aligner 13 and between the pre-aligner 13 and the stage 14 by the transport robot 15. can be transported

A conductive ball inspection and repair device 1 according to this embodiment includes an operation unit 80 , a detection unit 81 , and a control unit 8 . The operation unit 80 outputs an instruction signal to the control unit 8 by being operated by an operator. The detection unit 81 detects information necessary for the process of inspection by each unit 20, 21 of the inspection unit and information necessary for the process of repair by each unit 30, 31, 32 of the repair unit, and outputs the detected information to the control unit 8 as a detection signal. do. The control unit 8 receives the instruction signal output from the operation unit 80 and the detection signal output from the detection unit 81, and based on the instruction signal and the detection signal, each unit 20, 21 of the inspection unit performs inspection and repair. Each section 30, 31, 32 of the section controls the process of correction. As a result, in the conductive ball inspection and repair device 1 according to this embodiment, the inspection units 20 and 21 inspect based on the control of the control unit 8, and the repair units 30, 31, and 32 control the control unit. Correction based on the control of 8.

In the conductive ball inspection and repair device 1 according to this embodiment, the display device 5 is arranged on the repair section side, and the operation section 80 is arranged in the line-of-sight direction L3 toward the display device 5 of the operator. As a result, in the conductive ball inspection and repair device 1 according to this embodiment, the direction L3 in which the operator views the display device 5 and the direction in which the operator views the operation unit 80 are almost the same. That is, the change in the line-of-sight direction of the operator is small. As a result, the conductive ball inspection and repair apparatus 1 according to this embodiment places less burden on the operator, allows the operator to accurately visually recognize the display device 5, and can operate the operation unit 80 accurately.

(Description of examples other than the embodiment)
In addition, in the above-described embodiment, a wafer is explained as the work W. As shown in FIG. However, in the present invention, the workpiece may be a circuit board in addition to the wafer.

In the above-described embodiment, an example will be described in which the automatic movement stopping unit 42X automatically moves the imaging device 4 in the X direction and automatically stops at the positions of the parts 30, 31, and 32 of the repair unit. It is. However, in the present invention, the technique of manually moving the imaging device 4 in the X direction and manually positioning and stopping the imaging device 4 at the positions of the parts 30, 31, and 32 of the repair section by the positioning stop section. may be used. As the positioning stopping portion, for example, a through hole (hereinafter referred to as a "first through hole") is provided in the imaging device 4, and a through hole (hereinafter referred to as a "first through hole") is provided at each portion 30, 31, 32 of the repair portion. 2 through holes”) are provided. Then, the first through hole and the second through hole are aligned, and a pin is inserted into the first through hole and the second through hole. According to this technique, the manufacturing cost of the conductive ball inspection and repair device 1 can be reduced.

Furthermore, in the above embodiment, the case where one display device 5 is provided will be described. However, in the present invention, a plurality of display devices 5 may be provided.

Furthermore, in the above-described embodiment, the case where the operation unit 80 is arranged on the line-of-sight direction L3 toward the display device 5 of the operator will be described. However, in the present invention, the operation unit 80 may not necessarily be arranged on the line-of-sight direction L3 toward the display device 5 of the operator.

In addition, this invention is not limited by the said embodiment.

Reference Signs List 1 conductive ball inspection and repair device 10 pedestal 11 support member 110 post 111 arm 112 girder 12 load port 13 pre-aligner 14 stage 15 transport robot (work transport unit)
16 Work Recognition Information Acquisition Unit 160 Camera 161 Lens 162 Lighting Fixture 17 Transport Container (FOUP)
2 inspection device 20 main inspection unit (inspection unit)
200 Camera 201 Lens 202 Lighting fixture 20Z Inspection unit transport unit of main inspection unit 20 200Z Z direction drive unit 21 Inspection unit for verification (inspection unit)
210 Camera 211 Lens 212 Lighting fixture 21Z Inspection unit transport unit of verification inspection unit 21 210Z Z-direction drive unit 3 Repair device 30 Flux transfer unit (repair unit)
300 flux transfer pin 301 flux tray 302 Y-direction moving mechanism 303 drive section 30Z repair section conveying section of flux transfer section 30 300Z Z-direction drive section 31 conductive ball mounting section (repair section)
310 Conductive ball mounting nozzle 311 Conductive ball supply tray 312 Y-direction moving mechanism 313 Driving section 31Z Repair section conveying section of conductive ball mounting section 31 310Z Z-direction driving section 32 Surplus conductive ball removing section (repair section)
320 Surplus conductive ball removing nozzle 321 Surplus conductive ball receiving tray 322 Y-direction moving mechanism 323 Driving unit 32Z Repair unit transport unit of surplus conductive ball removing unit 32 320Z Z-direction driving unit 4 Imaging device 40 Lens 41 Camera (imaging unit )
42 lighting equipment (lighting part)
43 laser pointer 4D rotation adjustment part 40D fixed part (guide part)
41D rotating portion 42D adjusting portion 4X X-direction movement adjusting portion 40X fixing portion (guide portion)
41X moving unit 42X automatic movement stopping unit (driving unit)
4Y Y direction movement adjustment part 40Y Fixed part (guide part)
41Y moving part 42Y adjusting part 4Z Z direction movement adjusting part 40Z fixed part (guide part)
41Z Moving Part 42Z Adjusting Part 5 Display Device 50 Holding Part 51 Holding Bracket 52 Z Direction Movement Adjusting Part 53 Z Direction Stopper 54 Rotation Adjusting Part 55 Rotation Stopper 6 Calibration Part 60 XY Position Information Acquisition Part 61 Z Position information acquisition unit 7 Stage transport unit 70X X direction fixing unit (X direction guide unit)
71X X direction moving part 70Y Y direction fixing part (Y direction guide part)
71Y Y-direction moving unit 8 control unit 80 operation unit 81 detection unit 82 driving unit B conductive ball B1 extra (extra) conductive ball C integrated circuit chip C
E Electrode F Flux IP Operator's eye position L Optical axis of lens 40 (imaging direction of camera 41)
L1 Direction of irradiation of illumination light from illumination device 42 L2 Direction of irradiation of laser light from laser pointer 43 L3 Direction of line of sight of operator toward display device 5 W Work X1 Left side X2 Right side Y1 Front side Y2 Rear side Z1 upper side Z2 lower side

Claims (12)

an inspection device having an inspection unit for inspecting whether or not the conductive balls are normally mounted on the electrodes of the workpiece;
a repair device having a repair unit that, when the inspection unit detects a location where the conductive ball is not properly mounted, repairs the location so that the conductive ball is properly mounted;
an imaging device positioned at least in the repair section and capturing an image of the portion to be repaired by the repair section;
a display device for displaying the target imaged by the imaging device as an image for an operator to visually recognize;
with
The imaging device is arranged on the side where the operator is positioned with respect to the repair unit,
A conductive ball inspection and repair device characterized by: The display device
arranged on the repair device side,
With a holding part that can adjust the movement of the display device in the vertical direction and adjust the rotation about the vertical axis,
is held and
Equipped with an operation unit that outputs an instruction signal when operated by an operator,
The operation unit is arranged in a line-of-sight direction of the operator toward the display device,
The conductive ball inspection and repair device according to claim 1, characterized in that: The imaging device is
an optical unit that magnifies the target;
an imaging unit that captures an image of the target magnified by the optical unit;
an illumination unit that illuminates the object that is magnified by the optical unit and imaged by the imaging unit;
having
The conductive ball inspection and repair device according to claim 1 or 2, characterized in that: The imaging device is
a laser pointer that points to the target when the field of view of the imaging unit is positioned on the target;
having
The conductive ball inspection and repair device according to claim 3, characterized in that: The imaging device is
an X-direction movement adjustment unit capable of moving and adjusting the imaging device in the X direction, which is the horizontal direction;
a Y-direction movement adjustment unit capable of moving and adjusting the imaging device in a Y-direction that is horizontal and perpendicular to the X-direction;
a Z-direction movement adjustment unit capable of moving and adjusting the imaging device in a Z direction, which is a vertical direction orthogonal to the X direction and the Y direction;
a rotation adjusting unit capable of rotating and adjusting the imaging device about the X-direction axis;
located through the
The conductive ball inspection and repair device according to claim 1, characterized in that: The repair section is
a flux transfer unit that transfers flux to the electrodes on which the conductive balls are not mounted;
a conductive ball mounting unit that mounts the conductive ball on the electrode via the flux transferred by the flux transfer unit;
a surplus conductive ball removing unit that removes surplus conductive balls that are surplusly mounted on the workpiece;
having
The conductive ball inspection and repair device according to claim 1, characterized in that: The flux transfer section, the conductive ball mounting section, and the surplus conductive ball removing section are arranged in the X direction, which is a horizontal direction,
The imaging device is
an X-direction movement adjustment unit that can manually adjust the movement of the imaging device in the X direction, which is the horizontal direction;
a positioning stop unit that positions and stops the imaging device at respective positions corresponding to the flux transfer unit, the conductive ball mounting unit, and the surplus conductive ball removing unit;
located through the
The conductive ball inspection and repair device according to claim 6, characterized in that: The flux transfer section, the conductive ball mounting section, and the surplus conductive ball removing section are arranged in the X direction, which is a horizontal direction,
The imaging device is
an X-direction movement adjustment unit capable of moving and adjusting the imaging device in the X direction, which is the horizontal direction;
an automatic movement stopping unit for automatically moving the imaging device in the X direction and automatically stopping the imaging device at respective positions corresponding to the flux transfer unit, the conductive ball mounting unit, and the surplus conductive ball removing unit; ,
located through the
The conductive ball inspection and repair device according to claim 6, characterized in that: The inspection unit
a main inspection unit that inspects whether or not the conductive balls are normally mounted on the electrodes of the workpiece;
a verifying inspection unit that, when the main inspection unit detects a location where the conductive ball is not properly mounted, checks the location;
having
The conductive ball inspection and repair device according to claim 1, characterized in that: Equipped with a calibration section,
The calibration unit
X-direction position information and Y-direction position information, which are horizontal directions and are mutually orthogonal, and Z-direction position information, which is a vertical direction orthogonal to the X and Y directions, of the repair section and to get
The conductive ball inspection and repair device according to claim 1, characterized in that: The calibration unit
an XY position information acquisition unit that acquires the X-direction position information and the Y-direction position information of the repair unit;
a Z position information acquisition unit that acquires position information of the repair unit in the Z direction;
having
The conductive ball inspection and repair device according to claim 10, characterized in that: a stage on which the workpiece is placed;
a stage transport unit that transports the stage in X and Y directions that are horizontal and perpendicular to each other;
an inspection unit transport unit that transports the inspection unit in a Z direction that is a vertical direction orthogonal to the X direction and the Y direction;
a repair section conveying section that conveys the repair section in the Z direction;
having
The conductive ball inspection and repair device according to claim 1, characterized in that:

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