TWI699445B - Evaporation cover and manufacturing method thereof - Google Patents

Abstract

The present invention provides a vapor deposition cover and a method of manufacturing the same. In a vapor deposition cover in the form of a frame supporting the cover body, it is possible to increase the size of the vapor deposition cover while suppressing the increase in manufacturing cost and maintain the vapor deposition cover. The flatness can ensure good reproduction accuracy and deposition accuracy.

The vapor deposition cover 1 includes a cover body 2 provided with a vapor deposition pattern 6 composed of a plurality of independent vapor deposition through holes 5 and a reinforcement frame 3 composed of a metal plate material with a low thermal linear expansion coefficient. The cover body and the frame body are connected through the metal layer 8 into an inseparable body. The upper frame 16 and the lower frame 17 formed in the same shape constitute the frame 3, and the upper and lower frames 16 and 17 are joined through the adhesive layer 18 to be integrated. Thereby, the frame body 3 can be formed of a thinner metal plate material. Therefore, the thickness deviation of the entire frame body 3 can be reduced, and the strain caused by thermal expansion caused by the plate thickness deviation can be suppressed.

Description

Evaporation cover and manufacturing method thereof

The present invention relates to a vapor deposition cover and a manufacturing method thereof, and more particularly to a vapor deposition cover in the form of a frame supporting the cover body and a manufacturing method thereof. The present invention can be applied to a vapor deposition mask suitable for use when forming a light-emitting layer of an organic EL element, and a manufacturing method thereof.

In mobile devices such as smartphones and tablet terminals with display devices, for the purpose of reducing the weight of the device and increasing the driving time for a long time, organic EL displays that are lighter and consume less power have begun to replace liquid crystal displays. The organic EL display is manufactured by forming a light-emitting layer (evaporation layer) of an organic EL element on a substrate (evaporation target) by a vapor deposition mask method. In this case, a large-sized vapor deposition mask with more mask bodies is used, and more products can be manufactured by one vapor deposition operation, so that the manufacturing cost of the organic EL display can be reduced. Therefore, manufacturers of organic EL displays have increased their expectations for the enlargement of the vapor deposition mask.

The vapor deposition mask used for the vapor deposition mask method is disclosed in Patent Document 1, for example. In this patent document 1, a metal cover (cover body) having a plurality of cover portions (evaporation patterns) and a frame (frame) constitute a vapor deposition cover. The frame (frame) is formed into a frame shape and tensioned. The state of the metal cover is made of unchanging steel material that fixes it. The metal cover is joined to the frame by spot welding.

This type of vapor deposition mask has also been proposed by the applicant, for example, as disclosed in Patent Document 2. The vapor deposition cover is composed of a plurality of cover main bodies provided with a vapor deposition pattern, and a reinforcing frame body joined to the cover main body to be integral and inseparable. The frame is made of unchanging steel material (material with low thermal linear expansion coefficient), The outer periphery of each cover main body is joined to the frame surrounding the cover main body by a metal layer formed by electroforming.

[Prior Technical Literature]

[Patent Literature]

Patent Document 1: Japanese Patent Application Publication No. 2004-323888

Patent Document 2: Japanese Patent Application Publication No. 2005-15908

As shown in the vapor deposition hoods of Patent Literature 1 and Patent Literature 2, the frame that fixes and holds the metal hood and the frame body of the reinforced hood body is made of an unchanging steel material, so that even if the working environment during deposition is a high temperature environment, The expansion of the vapor deposition mask can also be suppressed, and the reproduction accuracy and vapor deposition accuracy of the vapor deposition layer (light emitting layer) can be ensured. However, the metal cover of the vapor deposition cover of Patent Document 1 is fixed and held to the frame in a tensioned state. However, when the vapor deposition cover is enlarged, the area of the metal cover not supported by the frame becomes larger, and the metal cover is not supported by the frame due to its own weight. , The metal cover will warp and deform. Therefore, reduction in reproduction accuracy and vapor deposition accuracy cannot be avoided.

In this regard, in the vapor deposition cover of Patent Document 2, each cover body is joined to the frame surrounding the cover body. Therefore, even when the vapor deposition cover is enlarged, the cover body due to its own weight does not occur. The warping deformation can ensure the reproduction accuracy and deposition accuracy of the deposited layer. However, even a frame made of an unchanging steel material swells slightly during the vapor deposition operation. In addition, although the frame is formed of a metal plate made of a non-steel material, generally, the plate thickness of the metal plate that is generally circulated has a deviation in thickness, and therefore, the plate thickness varies depending on the position of the frame. Therefore, there are situations in which the amount of expansion of each part of the frame is different, and the difference in the amount of expansion causes the vapor deposition cover to be neat. Body strain. When strain occurs in the vapor deposition mask in this way, the flatness of the vapor deposition mask deteriorates, and reproduction accuracy and vapor deposition accuracy are extremely reduced. This strain becomes remarkable as the frame body is enlarged. Although the occurrence of strain caused by the thickness deviation of this main material can be suppressed by managing the manufacturing steps of the metal sheet, specially manufactured and used main materials with small thickness deviation, the main material of this part is expensive, which leads to the evaporation cover The manufacturing cost has risen. Here, the thickness deviation refers to the width of the thickness deviation from the standard size of the metal plate material.

The object of the present invention is to provide a vapor deposition cover and a method of manufacturing the same. In a vapor deposition cover in which the cover body is supported by a frame, the increase in manufacturing cost can be suppressed while the vapor deposition cover can be increased in size. Maintaining the flatness of the vapor deposition cover can ensure good reproduction accuracy and vapor deposition accuracy of the vapor deposition layer.

The vapor deposition cover of the present invention includes: a cover main body 2 provided with a vapor deposition pattern 6 composed of a plurality of independent vapor deposition through holes 5; and a reinforcement frame 3 disposed around the cover main body 2 and is composed of low The thermal expansion coefficient is composed of sheet metal. The above-mentioned vapor deposition cover is characterized in that the cover body 2 and the frame body 3 are joined through the metal layer 8 to form an inseparable body, and the frame body 3 is composed of an upper frame 16 and a lower frame 17 formed in the same shape, and the upper frame 16 and the lower frame The frame 17 is integrated by joining through the adhesive layer 18.

A plurality of frame bodies 3 are stacked, and frame bodies 3 adjacent to each other in the stacking direction are joined through an adhesive layer 19.

The upper frame 16 and the lower frame 17 are joined in a state where the convex arc surface or the concave arc surface faces each other, and the two-dimensional or three-dimensional curved surface of the upper frame 16 and the lower frame 17 are offset, and the frame body 3 is formed flat.

W2

W1×1.1。 The cover body 2 is formed in a rectangular shape, and a plurality of cover bodies 2 are arranged in a matrix. The frame body 3 includes an outer peripheral frame 10 and a lattice frame-like vertical frame 12 and a horizontal frame 13 that define a plurality of cover openings 11 in the outer peripheral frame 10. When the width dimension of the vertical frame 12 parallel to the long side of the cover body 2 is W1, and the width dimension of the horizontal frame 13 parallel to the short side of the cover body 2 is W2, the width dimension W1 of the vertical frame 12 And the width dimension W2 of the horizontal frame 13 is set to satisfy the inequality W1

W2

W1×1.1.

A form in which the metal layer 8 and the cover main body 2 are integrally formed can be adopted.

The vapor deposition cover includes a supporting frame 46 fixed to the lower surface of the frame 3 and an auxiliary frame 47 fixed to the lower surface of the supporting frame 46. The support frame 46 is formed with a frame opening 48 corresponding to the cover opening 11 of the frame body 3. The frame opening 48 is formed in an opening shape that is slightly larger than the cover opening 11, and the entire vertical frame 12 and the horizontal frame 13 of the frame body 3 are supported The frame 46 supports. In addition, the auxiliary frame 47 is formed in a frame shape, and the peripheral edge of the support frame 46 is supported by the auxiliary frame 47.

The vapor deposition mask of the vapor deposition mask manufacturing method of the present invention includes: a mask body 2 having a vapor deposition pattern 6 formed by a plurality of independent vapor deposition through holes 5 in a pattern formation area 4; and a reinforcement frame 3, It is arranged around the cover body 2 and is made of sheet metal with low thermal linear expansion coefficient. The method of manufacturing a vapor deposition mask is characterized by comprising: a frame body forming step to form a reinforcing frame body 3; a patterning step in which a resist body 29a corresponding to the vapor deposition through hole 5 is provided on the surface of the concave mold 24 Primary pattern resist 29; in the first electroforming step, the primary pattern resist 29 is used to electroform metal plating on the concave mold 24, and a plurality of primary patterns corresponding to the cover body 2 are formed on the concave mold 24 at predetermined positions Electroformed layer 30; frame arrangement step, while positioning the primary electroformed layer 30 corresponding to each cover opening 11 of the frame 3 in the cover opening 11, the frame is placed on the cavity 24 3; The second electroforming step, covering the surface of the frame body 3 and the pattern formation area 4 of the cover body 2 In the state of the surface of the outer periphery 4a, the metal layer 8 is formed by electroforming, and the primary electroforming layer 30 and the frame body 3 are joined into an inseparable unit through the metal layer 8; and the peeling step is integrated from the concave mold 24 The primary electroforming layer 30, the frame body 3, and the metal layer 8 are peeled off. The frame body formation step includes a joining step to form the frame body 3. The aforementioned joining step joins the two frames 16, 16 with the adhesive layer 18 in a state where the convex or concave surfaces of the upper frame 16 and the lower frame 17 face each other. 17, and in a state where the two-dimensional curved surface or three-dimensional curved surface of the upper frame 16 and the lower frame 17 are offset, the frame body 3 is formed into a flat shape.

In addition, the vapor deposition mask of the vapor deposition mask manufacturing method of the present invention includes: a mask body 2 having a vapor deposition pattern 6 formed by a plurality of independent vapor deposition through holes 5 in a pattern formation area 4; and a reinforcement frame 3. It is arranged around the cover body 2 and is made of sheet metal with low thermal linear expansion coefficient. The method of manufacturing a vapor deposition mask is characterized by comprising: a frame body forming step to form a reinforcing frame body 3; a patterning step in which a primary pattern having a resist body 29a corresponding to the mask body 2 is provided on the surface of the concave mold 24 Resist 29; frame arrangement step, paste the adhesive resist 43 on the entire upper surface of the concave mold 24 including the primary pattern resist 29, and on this basis, surround the primary pattern resist 29, in The frame body 3 is adhered and fixed on the concave mold 24; the adhesive resist 43 except for the adhesive resist 43 located on the lower surface of the frame body 3 is removed; the integrated electroforming step is to cover except for the resist body 29a The surface of the concave mold 24 and the surface of the frame body 3 are electroformed and electroplated metal, thereby integrally forming the primary electroforming layer 30 constituting the cover body 2 and the metal layer 8 that combines the cover body 2 and the frame body 3; and, peeling In the step, the electroforming layer 30, the metal layer 8 and the frame body 3 are peeled off from the female mold 24 once. The frame body formation step includes a joining step to form the frame body 3. The aforementioned joining step joins the two frames 16, 16 with the adhesive layer 18 in a state where the convex or concave surfaces of the upper frame 16 and the lower frame 17 face each other. 17, and offset the two-dimensional or three-dimensional surface of the upper frame 16 and the lower frame 17 In the state of being warped in the shape of a three-dimensional curved surface, the frame 3 is formed into a flat shape.

In one patterning step, the photoresist layer 25 is laminated on the surface of the conductive concave mold 24, and then the pattern film 26 having the light-transmitting holes 26a corresponding to the primary patterning is laminated on the surface of the photoresist layer 25, Thus, the front-stage body 27 for patterning is formed. In a state where the temperature of the pre-patterning body 27 and the furnace temperature of the ultraviolet irradiation device are preheated to the furnace temperature during the exposure operation, the ultraviolet irradiation device exposes the photoresist layer 25.

The temperature range of the electroforming solution used in the first electroforming step and the temperature range of the electroforming solution used in the second electroforming step are set to be approximately the same temperature range.

According to the vapor deposition mask of the present invention, the difference in the amount of expansion due to heat of each part of the frame 3 can be reduced, and the occurrence of strain of the frame 3 due to thermal expansion can be suppressed. Specifically, the thinner the thickness dimension of the generally circulating metal sheet, which is the main material of the frame body 3, the more the number of passes through the rolls in the manufacturing step. Therefore, the thinner the plate thickness, the smaller the thickness deviation. Therefore, the frame body 3 is composed of the upper frame 16 and the lower frame 17, and the upper and lower frames 16, 17 are joined through the adhesive layer 18 to be integrated, so that the frame body 3 having the same thickness as the conventional one can be used. The frame body 3 is formed by a thin metal plate material, so the thickness deviation of the entire frame body 3 can be reduced. Thereby, even if it is a large-sized vapor deposition cover, the occurrence of strain due to thermal expansion caused by the thickness deviation of the metal plate material can be suppressed. In addition, the main material uses a thin metal plate that is generally circulated, so there is no need to use a dedicated metal plate to form the frame 3. As described above, according to the present invention, it is possible to increase the size of the vapor deposition mask while suppressing the increase in manufacturing costs, and to maintain the flatness of the vapor deposition mask, thereby ensuring good reproduction accuracy and vapor deposition accuracy. In addition, according to the frame 3 in which the adhesive layer 18 is inserted between the upper frame 16 and the lower frame 17, an external force is applied to warp and deform the vapor deposition mask. At this time, the frame body 3 is only soft and elastically deformed by the amount of the adhesive layer 18, so that the damage of the vapor deposition cover can be effectively prevented.

When a plurality of frame bodies 3 are stacked, and the frame bodies 3 adjacent in the stacking direction are joined to each other through the adhesive layer 19, when the frame body 3 having the same thickness as the conventional one is formed, a thinner metal plate can be used to form the frame The body 3 can therefore suppress the occurrence of strain due to thermal expansion caused by the thickness deviation of the metal plate material. Therefore, it is possible to increase the size of the vapor deposition mask, and to maintain the flatness of the vapor deposition mask, so that it is possible to further ensure good reproduction accuracy and vapor deposition accuracy of the vapor deposition layer. In addition, by increasing the adhesive layers 18 and 19 that join the frame bodies 3, it is possible to elastically deform more flexibly with respect to external force, and therefore, it is possible to more effectively prevent damage to the vapor deposition cover.

When the two-dimensional curved surface or the three-dimensional curved surface of the upper frame 16 and the lower frame 17 are offset to form the frame body 3 in a flat shape, the slight warpage caused by the metal plate can be eliminated, and the The flatness can further ensure the good reproduction accuracy and deposition accuracy of the vapor deposition layer.

W2

W1×1.1時，能使橫框13的剖面積與縱框12的剖面積相同，或比其大，而且，橫框13的長度比縱框12的長度小，因此，縱框12被橫框13可靠地支撑，進而能阻止長度長的縱框12由於自重而撓曲變形。因此，能阻止因自重而產生的框體3的變形，實現蒸鍍罩的大型化，還能維持蒸鍍罩的平坦度，從而能將蒸鍍層的再現精度及蒸鍍精度高精度化。另外，能將縱框12及橫框13的剛性整體地大致均勻化，因此，在施加使蒸鍍罩1翹曲變形的外力的情况下，能使外力均勻分散而消除局部性地集中，能有效地防止蒸鍍罩1的變形、破損。而且，橫框13的寬度尺寸 W2設成W2

W1×1.1，因此，能抑制因橫框13的剖面積變大至所需以上而引起的框體3的重量增加，從而能在消除整個蒸鍍罩的重量無意義地變大的同時，增强框體3的構造强度和剛性。 When the width dimension W1 of the vertical frame 12 and the width dimension W2 of the horizontal frame 13 are set to satisfy the inequality W1

W2

When W1×1.1, the cross-sectional area of the horizontal frame 13 can be the same as or larger than the cross-sectional area of the vertical frame 12, and the length of the horizontal frame 13 is smaller than the length of the vertical frame 12. Therefore, the vertical frame 12 is framed by the horizontal frame. 13 is reliably supported, thereby preventing the long vertical frame 12 from flexing and deforming due to its own weight. Therefore, deformation of the frame body 3 due to its own weight can be prevented, the vapor deposition mask can be enlarged, and the flatness of the vapor deposition mask can be maintained, so that the reproduction accuracy of the vapor deposition layer and the precision of the vapor deposition can be improved. In addition, the rigidity of the vertical frame 12 and the horizontal frame 13 can be made substantially uniform as a whole. Therefore, when an external force that warps and deforms the vapor deposition cover 1 is applied, the external force can be uniformly dispersed and localized concentration can be eliminated. The deformation and damage of the vapor deposition cover 1 are effectively prevented. Moreover, the width dimension W2 of the horizontal frame 13 is set to W2

W1×1.1, therefore, it is possible to suppress the increase in the weight of the frame 3 caused by the cross-sectional area of the horizontal frame 13 becoming larger than necessary, thereby eliminating the meaningless increase in the weight of the entire vapor deposition mask and strengthening The structural strength and rigidity of the frame 3.

When the metal layer 8 and the cover body 2 are integrally formed, and the cover body 2 and the frame body 3 are combined into an inseparable body, the man-hours for separately forming the metal layer 8 and joining the cover body 2 and the frame body 3 can be saved. The steps required for manufacturing are simplified and the time can be shortened. Therefore, the manufacturing cost of the vapor deposition mask can be reduced.

When the support frame 46 supports the entire vertical frame 12 and the horizontal frame 13 of the frame body 3, and the auxiliary frame 47 supports the periphery of the support frame 46, the structural strength and rigidity of the entire vapor deposition cover are further enhanced, and the vapor deposition cover can be prevented. By flexing and deforming to maintain flatness, the reproducibility and deposition accuracy of the vapor-deposition layer can be made more accurate.

According to the method of manufacturing the vapor deposition mask of the present invention, in the frame formation step, the two-dimensional or three-dimensional curved surface of the upper frame 16 and the lower frame 17 are offset in a flat state and joined together. The slight warpage caused by the sheet metal further improves the flatness. Therefore, it is possible to achieve an increase in size while suppressing an increase in manufacturing costs, and to maintain flatness, so that a vapor deposition mask that can ensure good reproducibility and vapor deposition accuracy of the vapor deposition layer can be obtained.

According to the other manufacturing method of the vapor deposition mask of the present invention, the man-hours for forming the metal layer 8 can be saved, the steps required for manufacturing can be simplified, the time can be shortened, and the flatness can be further improved in the same manner as described above. Therefore, it is possible to increase the size while suppressing the increase in manufacturing costs. The flatness can also be maintained, and a vapor deposition mask that can ensure good reproduction accuracy and vapor deposition accuracy of the vapor deposition layer can be obtained.

When in one patterning step, the temperature of the patterning front-stage body 27 and the furnace temperature of the ultraviolet irradiation device are preheated to the furnace temperature during the exposure operation, and the ultraviolet radiation is performed. During the exposure operation of the photoresist layer 25 by the irradiation device, the primary pattern resist 29 having a good position accuracy and a desired shape can be provided on the concave mold 24. Specifically, the concave mold 24, the photoresist layer 25, and the pattern film 26 constituting the patterning front-stage body 27 have different thermal linear expansion coefficients. Therefore, when the pre-patterning body 27 is stored in the furnace at a temperature lower than the temperature in the furnace during the exposure operation, and the exposure operation is performed, the pre-patterning body 27 is heated and expanded due to the irradiation of ultraviolet rays. While the relative positional relationship of 24, 25, and 26 is shifted, the exposure operation is performed. Along with this, the positional accuracy of the primary pattern resist 29 with respect to the concave mold 24 is reduced, and it cannot be exposed to the shape of the desired primary pattern resist 29. The decrease in the position accuracy and shape defects of the primary pattern resist 29 affect the formation of the cover body 2 in the first electroforming step or the integrated electroforming step, resulting in a cover body that cannot be formed with the desired dimensional accuracy by electroforming 2 questions. However, by preheating the temperature in the furnace of the patterning front-stage body 27 and the ultraviolet irradiation device to the furnace temperature during the exposure operation, the temperature rise due to ultraviolet irradiation is eliminated, and the thermal expansion of the patterning front-stage body 27 can be prevented. Therefore, the primary pattern resist 29 with good position accuracy and a shape as expected can be provided on the concave mold 24, and the cover body 2 with good dimensional accuracy can be formed, which can contribute to the reproducibility and deposition accuracy of the deposited layer. High precision.

When the temperature range of the electroforming liquid used in the first electroforming step and the second electroforming step is set to be approximately the same, and the primary electroforming layer 30 and the frame 3 are joined together by the metal layer 8 as the metal layer When it is inseparable and integral, the cover body 2 can be joined to the frame body 3 while preventing thermal expansion. Therefore, the position accuracy of the joining position of the cover main body 2 with respect to the frame body 3 can be improved, and a vapor deposition cover can be obtained that improves the reproducibility and vapor deposition accuracy of the vapor deposition layer.

1‧‧‧Evaporation Hood

2‧‧‧Cover body

3‧‧‧Frame

4‧‧‧Pattern forming area

4a‧‧‧Outer periphery

5‧‧‧Evaporated through hole

6‧‧‧Evaporation pattern

8‧‧‧Metal layer

10‧‧‧Outer frame

11‧‧‧Hood opening

12‧‧‧Vertical frame

13‧‧‧Horizontal frame

16‧‧‧Upper frame

17‧‧‧Bottom frame

18‧‧‧Adhesive layer

19‧‧‧Adhesive layer

24‧‧‧Concave mold

25‧‧‧Photoresist layer

26‧‧‧Pattern mold

26a‧‧‧Light hole

27‧‧‧Composition front body

29‧‧‧One-time pattern resist

29a‧‧‧Resist body

30‧‧‧One-time electroforming layer

43‧‧‧Adhesive resist

46‧‧‧Support frame

47‧‧‧Auxiliary frame

48‧‧‧Frame opening

W1‧‧‧Width of vertical frame

W2‧‧‧Width of horizontal frame

Fig. 1 is a longitudinal sectional front view showing the main part of a vapor deposition mask according to a first embodiment of the present invention.

Fig. 2 is a perspective view showing the entire vapor deposition cover according to the first embodiment of the present invention.

Fig. 3 is a longitudinal cross-sectional side view showing the vapor deposition hood of the first embodiment of the present invention.

Fig. 4 is a plan view showing the main part of the vapor deposition mask according to the first embodiment of the present invention.

Fig. 5 is a plan view of the frame of the vapor deposition mask according to the first embodiment of the present invention.

Fig. 6 is an explanatory diagram showing the first stage of the frame forming step in the method of manufacturing the vapor deposition mask according to the first embodiment of the present invention.

Fig. 7 is an explanatory diagram showing the latter part of the frame forming step in the method of manufacturing the vapor deposition mask according to the first embodiment of the present invention.

Fig. 8 is an explanatory diagram showing a patterning step and a first electroforming step in the method of manufacturing a vapor deposition mask according to the first embodiment of the present invention.

Fig. 9 is an explanatory diagram showing an activation process step of the method of manufacturing the vapor deposition mask according to the first embodiment of the present invention.

Fig. 10 is an explanatory diagram showing a secondary patterning step, a frame arrangement step, a second electroforming step, and a peeling step in the method of manufacturing a vapor deposition mask according to the first embodiment of the present invention.

Fig. 11 is a longitudinal sectional front view showing the main part of a vapor deposition mask according to a second embodiment of the present invention.

12 is an explanatory diagram showing a frame arrangement step, a second electroforming step, and a peeling step of the vapor deposition mask according to the second embodiment of the present invention.

Fig. 13 is a longitudinal sectional front view showing the main part of a vapor deposition mask according to a third embodiment of the present invention.

Fig. 14 is an explanatory diagram showing a patterning step and a first electroforming step in a method of manufacturing a vapor deposition mask according to a third embodiment of the present invention.

15 is an explanatory diagram showing the secondary patterning step, the frame arrangement step, the second electroforming step, and the peeling step of the method of manufacturing the vapor deposition mask according to the third embodiment of the present invention.

Fig. 16 is a longitudinal sectional front view showing a main part of a vapor deposition mask according to a fourth embodiment of the present invention.

Fig. 17 is an explanatory diagram showing a method of manufacturing a vapor deposition mask according to a fourth embodiment of the present invention.

Fig. 18 is a longitudinal sectional front view showing a vapor deposition cover according to a fifth embodiment of the present invention.

Fig. 19 is an exploded perspective view showing a vapor deposition cover according to a fifth embodiment of the present invention.

Fig. 20 is a plan view of a vapor deposition mask according to a fifth embodiment of the present invention.

Fig. 21 is an exploded perspective view showing a modification of the vapor deposition cover according to the fifth embodiment of the present invention.

(First Embodiment) FIGS. 1 to 10 show the first embodiment of the vapor deposition mask and the manufacturing method of the present invention. In addition, the dimensions such as thickness and width in FIGS. 1 to 10 in this embodiment do not show actual conditions, but are the dimensions shown schematically. The same applies to the drawings of the following embodiments.

As shown in FIGS. 2 and 3, the vapor deposition cover 1 includes a plurality of cover main bodies 2 and a reinforcement frame 3 arranged around the cover main body 2 so as to surround the cover main body 2. The cover main body 2 is formed in a rectangle with rounded corners, and has a pattern formation area 4 inside. A vapor deposition pattern 6 composed of a plurality of independent vapor deposition through holes 5 is formed in the pattern formation area 4. As shown in FIG. 4, in the cover body 2, a plurality of joint through holes 7 are provided on the entire circumference of the outer peripheral edge 4 a of the pattern formation area 4.

The cover body 2 is formed by electroforming by using electroplated metal formed of nickel as a raw material to make. The thickness of the cover main body 2 is preferably in the range of 10 to 20 μm, and is set to 12 μm in this embodiment. Regarding the size of the cover body 2 in a plan view, the size in the long side direction is set to 108 mm, and the size in the short side direction is set to 62 mm, and 30 cover bodies 2 are arranged in a matrix of 6 columns and 5 rows. In addition, the cover main body 2 can be formed using nickel alloys such as nickel-cobalt and other electroplating metals as raw materials in addition to nickel. When applying the vapor deposition mask 1 of this embodiment to the vapor deposition mask for organic EL elements, the vapor deposition pattern 6 is formed so that it may correspond to the light emitting layer of an organic EL element.

As shown in FIG. 5, the frame body 3 includes an outer peripheral frame 10, a lattice frame-shaped vertical frame 12 and a horizontal frame 13 that define a cover opening 11 in the outer peripheral frame 10. The vertical frame 12 is set to be parallel to the long side of the cover body 2, and the horizontal frame 13 is set to be parallel to the short side of the cover body 2. In the present embodiment, the frame body 3 is formed of a metal plate material, which is a metal plate material with a low thermal linear expansion coefficient formed of an invariable steel material that is a nickel-iron alloy, and the frame body 3 is formed to have For sufficient wall thickness, the thickness dimension is set to 1.6 mm. In addition, in a plan view, the size of the frame body 3 is set to 460×730 mm, and the size of the cover opening 11 is set to 110 mm in the long side direction, and 64 mm in the short side direction. The frame body 3 may be formed of a super non-steel material or the like which is a nickel-iron-cobalt alloy, and its thickness can be set to, for example, about 1 to 5 mm. In addition, the use of invariable steel materials and super unvarying steel materials as the forming materials of the frame body 3 is because the thermal linear expansion coefficient is extremely small, and the dimensional change of the cover body 2 caused by the thermal influence of the vapor deposition step can be well suppressed.

W2

W1×1.1。在本實施形態中，將縱框12的寬度尺寸W1設定為10mm，將橫框13的寬度尺寸W2設定為10.64mm。從而，當將橫框13的寬度尺寸W2設為比縱框12的寬度尺寸W1大時，能使橫框13的剖面積 比縱框12的剖面積大，而且，橫框13的長度比縱框12的長度小，因此，縱框12被橫框13可靠地支撑，能阻止長度長的縱框12由於自重而撓曲變形。因此，阻止因自重而引起的框體3的變形而能實現蒸鍍罩1的大型化，還能維持蒸鍍罩1的平坦度，從而能將蒸鍍圖案的再現精度及蒸鍍精度高精度化。另外，由於能將縱框12及橫框13的剛性整體大致均勻化，因此，在施加了使蒸鍍罩1撓曲變形的外力的情况下，使外力均勻地分散而能消除局部性地集中，從而能有效地防止蒸鍍罩1的變形、破損。而且，橫框13的寬度尺寸W2設成W2

W1×1.1，因此，能抑制因橫框13的剖面積變大至所需以上而引起的框體3的重量增加，從而能在消除整個蒸鍍罩的重量無意義地變大的同時，增强框體3的構造强度和剛性。 When the width dimension of the vertical frame 12 is set to W1 and the width dimension of the horizontal frame 13 is set to W2, the width dimension W1 of the vertical frame 12 and the width dimension W2 of the horizontal frame 13 are set to satisfy the inequality W1

W2

W1×1.1. In this embodiment, the width dimension W1 of the vertical frame 12 is set to 10 mm, and the width dimension W2 of the horizontal frame 13 is set to 10.64 mm. Therefore, when the width dimension W2 of the horizontal frame 13 is larger than the width dimension W1 of the vertical frame 12, the cross-sectional area of the horizontal frame 13 can be made larger than the cross-sectional area of the vertical frame 12, and the length of the horizontal frame 13 is longer than that of the vertical frame 12. Since the length of the frame 12 is small, the vertical frame 12 is reliably supported by the horizontal frame 13, and the vertical frame 12 having a long length can be prevented from flexing and deforming due to its own weight. Therefore, the deformation of the frame 3 due to its own weight can be prevented, and the size of the vapor deposition cover 1 can be increased, and the flatness of the vapor deposition cover 1 can be maintained, so that the reproduction accuracy of the vapor deposition pattern and the deposition accuracy can be highly precise.化. In addition, since the overall rigidity of the vertical frame 12 and the horizontal frame 13 can be substantially uniformized, when an external force that flexes and deforms the vapor deposition cover 1 is applied, the external force is uniformly dispersed and localized concentration can be eliminated. Therefore, deformation and damage of the vapor deposition cover 1 can be effectively prevented. Moreover, the width dimension W2 of the horizontal frame 13 is set to W2

W1×1.1, therefore, it is possible to suppress the increase in the weight of the frame 3 caused by the cross-sectional area of the horizontal frame 13 becoming larger than necessary, thereby eliminating the meaningless increase in the weight of the entire vapor deposition mask and strengthening The structural strength and rigidity of the frame 3.

As shown in Figures 1 and 6(a), the frame body 3 is composed of an upper frame 16 and a lower frame 17 that are formed into the same thickness and size and the same shape, and the upper frame 16 and the lower frame 17 are joined through an adhesive layer 18 to be integrated.化. In detail, as shown in FIG. 6(b), the upper frame 16 and the lower frame 17 are joined in a state where the arc surfaces are opposed to each other, and in a state where the two-dimensional curved surface warping is offset, the frame body 3 is formed as Flat. In addition, the above-mentioned two-dimensional curved surface warpage is a slight warpage caused by a metal sheet, and sometimes it is a three-dimensional curved surface warpage. In this embodiment, a sheet-like uncured photosensitive dry film resist is used for the adhesive layer 18, and after the upper frame 16 and the lower frame 17 are joined, the excess adhesive layer 18 is removed. The adhesive layer 18 can also use various commercially available adhesives. The thickness dimensions of the upper and lower frames 16 and 17 constituting the frame 3 are set to the same thickness because it is easy to join in a state in which the two-dimensional curved surface warpage is offset, and the frame 3 is formed into a flat shape. The convex arc surface may be a concave arc surface, and may include both the convex arc surface and the concave arc surface. In addition, as long as they can be joined in a flat shape while offsetting the two-dimensional curved surface warpage, the thickness dimensions of the upper and lower frames 16 and 17 may be different.

As described above, when the two-dimensional curved surface warpage of the upper frame 16 and the lower frame 17 is offset, when the frame body 3 is joined to form a flat shape, the slight warpage caused by the metal plate can be eliminated, and furthermore Further improvement of flatness can also ensure good reproduction accuracy and deposition accuracy of the vapor-deposition layer.

As shown in FIG. 1, in this embodiment, a pair (plurality) of frame bodies 3 formed by the above method are laminated, and the frame bodies 3 adjacent in the lamination direction are joined to each other through an adhesive layer 19. The thickness dimensions of the upper and lower frames 16 and 17 constituting the upper frame body 3 are respectively set to 0.3 mm, and the thickness dimensions of the upper and lower frames 16 and 17 constituting the lower frame body 3 are respectively set to 0.5 mm.

In FIG. 1, symbol 8 indicates a metal layer formed on the upper surface of the outer peripheral edge 4 a of the pattern formation area 4 of the cover body 2. The metal layer 8 is formed by stacking nickel by electroforming. Each cover body 2 is respectively provided with a cover opening 11, and the outer peripheral edge 4a of the pattern formation area 4 of the cover body 2 and the frame body 3 are joined into an inseparable unit by using a metal layer 8 formed by electroforming. As shown in FIGS. 1 and 4, the metal layer 8 covers the upper surface of the outer periphery 4a of the pattern formation area 4, the upper surface of the frame body 3, the side surface facing the pattern formation area 4, and the gap between the cover body 2 and the frame body 3. Part, and formed into a cross-sectional hat shape. In addition, the metal layer 8 is also formed in the bonding through hole 7 to improve the bonding strength between the cover body 2 and the frame body 3. In addition, the metal layer 8 can be formed from nickel alloys such as nickel-cobalt and other electroplated metals in addition to nickel.

6 to 10 show the method of manufacturing the vapor deposition mask 1 of the present embodiment. Here, first, the frame formation step is performed to form the reinforcement frame 3.

(Frame Formation Step) First, a cutting step is performed, that is, using, for example, a wire electric discharge machine having a small thermal influence on the metal plate material, the upper frame 16 and the lower frame 17 are cut out of the metal plate material to the size. Then, the mask opening forming step is performed, that is, the upper frame 16 and the lower frame 17 cut out are etched, By laser processing, as shown in FIG. 6(a), a plurality of openings as cover openings 11 are formed. Then, the joining step is performed, that is, as shown in FIG. 6(b), in a state where the convex arc surfaces of the upper frame 16 and the lower frame 17 caused by the metal sheet are opposed to each other, the two frames 16, 17 are used with an adhesive layer 18 By joining, the frame 3 is formed in a flat shape in a state in which the warpage of the two-dimensional curved surface is offset. The adhesive layer 18 is made of a sheet-like uncured photosensitive dry film resist.

Then, the fixing step is performed, that is, as shown in FIG. 6(c), it is passed between the upper and lower rotating rollers 22 and 22 arranged in a predetermined size between the rollers to perform nip pressing. The excess adhesive layer 18 (the part exposed to the outside of the cover opening 11 and the outer peripheral frame 10) is removed (developed), and the frame 3 is obtained. In this way, a sheet-like uncured photosensitive dry film resist is used for the adhesive layer 18 because the uncured photosensitive dry film resist has adhesiveness and is a raw material that is also used in a patterning step described later. Therefore, there is no need to separately prepare other commercially available adhesives, etc., and the manufacturing cost of the vapor deposition cover 1 can be reduced accordingly. In addition, in the cutting step, a laser cutter can also be used to cut the upper and lower frames 16, 17 while cooling the metal sheet.

As shown in FIG. 7(a), each of the above-mentioned steps is performed to manufacture a pair of frame bodies 3 from metal plates having different thicknesses. These frame bodies 3 are laminated as shown in FIG. 7(b), and the frame bodies 3 are joined to each other with an adhesive layer 19 made of a sheet-shaped uncured photosensitive dry film resist. Then, as shown in FIG. 7(c), the lamination step is performed even if it passes between the upper and lower rotating rollers 22 arranged in a predetermined inter-roller size while being nipped and pressed. Thus, a pair of stacked frame bodies 3 are obtained.

(Pre-patterning body forming step) As shown in FIG. 8(a), a photoresist layer 25 is formed on the surface of a concave mold 24 made of, for example, stainless steel or brass having conductivity. The photoresist layer 25 is formed by laminating one or more sheets of a negative-type sheet-like photosensitive dry film resist and bonding them by thermocompression to have a predetermined thickness. Then, it has the vapor deposition through hole 5 and the bonding through hole 7 (a The pattern film 26 (glass cover) corresponding to the light-transmitting hole 26a of the sub-patterning) is closely attached to the photoresist layer 25, thereby obtaining the patterned front-stage body 27.

(Preheating step) Preheat the patterning front-stage body 27 to the temperature in the furnace of the ultraviolet irradiation device during the exposure operation using, for example, a hot plate, a preheating furnace, or the like. While preheating the patterned front-stage body 27, the inside of the furnace of the ultraviolet irradiation device is also preheated to the furnace temperature during the exposure operation. The preheating in the furnace of the ultraviolet irradiation device is performed by lighting the ultraviolet lamp 28 in a state in which the irradiation target is not stored in the furnace or in a state in which a virtual cavity mold (cavity mold+photoresist layer+protective film) is stored. The pre-patterning body 27 and the furnace are preheated to, for example, 23±3°C. In addition, the maximum temperature in the furnace of the ultraviolet irradiation device for the exposure operation is about 26°C.

(One patterning step) After the preheating of the furnace of the ultraviolet irradiation device and the patterning front body 27 is completed, the patterning front body 27 is stored in the furnace of the ultraviolet irradiation device, as shown in FIG. 8(a), with an ultraviolet lamp 28 UV light is irradiated for exposure, and development and drying are performed. Then, as shown in FIG. 8(b), the unexposed part is melted and removed, thereby forming a primary pattern resist having a resist body 29a corresponding to the vapor deposition through hole 5 and the bonding through hole 7 on the concave mold 24 29. Therefore, when the exposure operation is performed while the furnace interior of the ultraviolet irradiation device and the patterning front-stage body 27 are preheated to the temperature in the furnace during the exposure operation, the heating and expansion of the patterning front-stage body 27 due to ultraviolet irradiation can be eliminated, and further In the case where the exposure operation is performed while the relative positional relationship of the three above 24, 25, and 26 is shifted. Therefore, it is possible to provide the primary pattern resist 29 with a good position accuracy and a desired shape on the concave mold 24, which can contribute to the reproducibility of the vapor deposition layer and the high accuracy of the vapor deposition accuracy.

(The first electroforming step) Next, put the above-mentioned concave mold 24 into the electroforming tank whose temperature condition of the electroforming liquid is 40~50℃ initially, as shown in FIG. 8(c), in the previous resist body 29a Within the range of the height of φ, the surface of the concave mold 24 that is not covered by the resist body 29a is electroformed once to form the electroplated metal formed of nickel to form the primary electroformed layer 30, that is, the layer of the cover body 2. Then, as shown in FIG. 8(d), the resist body 29a is melted and removed to obtain a cover body 2 having a vapor deposition pattern 6 composed of a plurality of independent vapor deposition through holes 5 and bonding through holes 7 . In addition, in FIG. 8(d), reference numeral 30a indicates a primary plating layer formed between the cover bodies 2 and 2 and removed by the peeling step described later.

(Activation treatment step) As shown in FIG. 9(a), after the photoresist layer 33 is formed on the entire surface of the primary electroforming layer 30, 30a, the light-transmitting hole corresponding to the peripheral portion of the bonding through hole 7 is formed. The pattern film 34 of 34a is closely adhered to and stored in the furnace of the ultraviolet irradiation device, and is irradiated with ultraviolet light with an ultraviolet lamp 28 to perform exposure, thereby performing development and drying processes. The photoresist layer 33 here is formed by laminating one or more sheets of a negative-type sheet-like photosensitive dry film resist and bonding them by thermocompression in the same manner as before, and is formed into a predetermined thickness. Then, the photoresist layer 33 of the unexposed portion is melted away, and as shown in FIG. 9(b), a pattern resist 35 having an opening 35a corresponding to the peripheral portion of the bonding via 7 is obtained. That is, the pattern resist 35 is formed so that only the peripheral portion of the bonding through hole 7 is exposed on the surface.

Then, the part of the primary electroformed layer 30 exposed in the opening 35a of the pattern resist 35, that is, the primary electroformed layer 30 around the junction via 7 is subjected to activation treatments such as pickling and electrolytic treatment, as shown in FIG. 9 ( c) The pattern resist 35 is melted and removed as shown. In FIG. 9(c), the symbol 36 indicates the portion subjected to the activation treatment. In detail, the inner wall surface of the joint through hole 7 and the upper surface of the primary electroformed layer 30 around the joint through hole 7 are activated.化处理。 Treatment. When the activation treatment is performed on the periphery of the bonding through hole 7 in this way, the bonding strength between the primary electroforming layer 30 and the metal layer 8 formed by the second electroforming step described later can be significantly improved compared to the untreated case. . In addition, instead of the previous activation treatment, a thin layer of impact nickel, matt nickel, or the like may be formed on the primary electroformed layer 30 around the junction via 7. Thereby, the bonding strength between the peripheral portion of the bonding through hole 7 and the metal layer 8 can also be improved.

(Secondary patterning step and frame arrangement step) As shown in FIG. 10(a), a photoresist layer 38 is formed on the entire surface of the concave mold 24 including the formation portions of the primary electroforming layers 30 and 30a. The photoresist layer 38 is formed by laminating one or more sheets of a negative-type sheet-like photosensitive dry film resist and thermocompression bonding in the same manner as before, and is formed into a predetermined thickness. Then, the pattern film 39 having the light-transmitting holes 39a corresponding to the pattern formation area 4 is closely attached and stored in the furnace of the ultraviolet irradiation device, and the ultraviolet light is irradiated with the ultraviolet lamp 28 to perform exposure, thereby performing development and drying processes. . In this state, a photoresist layer 38 is obtained in which the part (38a) of the pattern formation region 4 is exposed and the other part (38b) is not exposed (see FIG. 10(b)).

Then, as shown in FIG. 10( b ), the frame body 3 is assembled on the female mold 24 so as to surround the primary electroforming layer 30 while being aligned. Here, the adhesiveness of the unexposed photoresist layer 38b is used to temporarily fix the frame 3 to the concave mold 24. As shown in FIG. 10(c), the unexposed photoresist layer 38b exposed on the surface is melted and removed, thereby forming a secondary pattern resist 40 having a resist body 40a covering the pattern formation region 4. At this time, the unexposed photoresist layer 38b located on the lower surface of the frame 3 is covered by the frame 3, and remains on the concave mold 24 without being removed by melting.

(Second electroforming step) Put the above-mentioned concave mold 24 into the electroforming bath with an initial temperature of 23±3°C, as shown in FIG. 10(d), at the outer peripheral edge 4a facing the pattern formation area 4 The upper surface of the primary electroforming layer 30, the surface of the frame body 3, the surface of the concave mold 24 exposed to the surface between the frame body 3 and the primary electroforming layer 30, and the bonding through hole 7 are electroformed by nickel The metal layer 8 is formed by electroplating metal. Thereby, the primary plating layer 30 and the frame body 3 can be joined with the metal layer 8 Into an inseparable one.

(Peeling step) After peeling the primary electroforming layer 30 and the metal layer 8 from the female mold 24, the primary electroforming layer 30a located on the lower surface of the frame body 3 is peeled from the two layers 30, 8. Finally, the secondary pattern resist 40 and the unexposed photoresist layer 38b are removed, and the vapor deposition mask 1 shown in FIG. 3 is obtained.

In this embodiment, the temperature region of the electroforming liquid in the first electroforming step is set to a temperature region higher than the temperature region of the electroforming liquid in the second electroforming step. Thereby, the frame body 3 can be maintained in a state where tension is applied to the cover main body 2 in a direction that shrinks inward. Therefore, the amount of expansion of the cover main body 2 when the temperature rises in the vapor deposition furnace is absorbed by this tension, and the occurrence of displacement and wrinkles of the cover main body 2 relative to the frame 3 due to expansion can be prevented.

(Second Embodiment) FIGS. 11 and 12 show a second embodiment of the vapor deposition mask and the manufacturing method thereof of the present invention. As shown in FIG. 11, in this embodiment, the difference from the previous first embodiment is to prevent the internal stress caused by joining the cover body 2 and the frame body 3 into an inseparable integral metal layer 8. When the strain of the frame body 3 occurs, the metal layer 8 is not formed on the upper surface of the frame body 3 other than the periphery of the cover opening 11, so that the metal layer 8 is cut off and the stress relief portion 42 is provided.

The frame body 3 of the first embodiment is surrounded by a metal layer 8 on its upper surface and the two edges of the cover opening 11 continuous with the upper surface. Therefore, when the metal layer 8 is formed by electroforming, internal stress is generated When it is formed in the state of, strains are generated in the frame 3 due to the above-mentioned internal stress, which may adversely affect the flatness of the vapor deposition cover 1. However, as shown in the present embodiment, by providing the stress relief portion 42, the internal stress of the metal layer 8 is released through the stress relief portion 42, so that the occurrence of strain in the frame 3 can be prevented. In addition, the so-called "metal layer "8-cut" means that as long as the metal layer 8 is not continuously formed on the entire upper surface of the frame body 3, the aspect is not limited to the aspect of this embodiment. The other is the same as the first embodiment, so the same members are denoted Descriptions of the same symbols are omitted, and they are the same in the following embodiments.

In the method of manufacturing the vapor deposition mask 1 of this embodiment, the step of forming a resist 42a corresponding to the stress relief portion 42 on the upper surface of the frame 3 is performed at the end of the frame forming step, so that the frame A resist body 42a is provided on the upper surface of 3. The following steps from the front-stage body formation step to the second composition step are described in the first embodiment in Figure 8 (a) ~ (d), Figure 9 (a) ~ (c), and Figure 10 (a) The methods shown are the same, but the first electroforming step is performed in a state where the temperature range of the electroforming liquid is initially 23±2°C.

(Frame body arrangement step) As shown in FIG. 12(a), the frame body 3 provided with the resist body 42a is assembled on the concave mold 24 so as to surround the primary electroforming layer 30 while being aligned. Here, the adhesiveness of the unexposed photoresist layer 38b is used to temporarily fix the frame 3 to the concave mold 24. As shown in FIG. 12(b), the unexposed photoresist layer 38b exposed on the surface is melted and removed, thereby forming a secondary pattern resist 40 having a resist body 40a covering the pattern formation region 4. At this time, the unexposed photoresist layer 38b located on the lower surface of the frame 3 is covered by the frame 3, and remains on the concave mold 24 without being removed by melting.

(Second Electroforming Step) Put the above-mentioned concave mold 24 into the electroforming bath with an initial temperature of 23±3°C, as shown in FIG. 12(c), at the outer peripheral edge 4a facing the pattern formation area 4 The upper surface of the primary electroforming layer 30, the surface of the frame body 3 not covered by the resist 42a, the surface of the concave mold 24 exposed on the surface between the frame body 3 and the primary electroforming layer 30, and the bonding The metal layer 8 is formed by electroforming a plated metal formed of nickel in the hole 7. Thereby, the primary plating layer 30 and the frame body 3 can be joined by the metal layer 8 into an inseparable unit. In this embodiment, the The temperature range of the electroforming liquid used in the casting step and the second electroforming step is set to be the same (23±3°C). This prevents the primary electroformed layer 30, that is, the cover body 2 from being joined to the frame body 3 while thermally expanding. Therefore, the position accuracy of the joining position of the cover body 2 with respect to the frame body 3 can be improved, and the steam can be obtained. A vapor deposition cover with higher accuracy of plating reproduction and deposition accuracy. In addition, in the first electroforming step and the second electroforming step, the lower the temperature of the electroforming liquid in the electroforming tank is set, the more the thermal expansion of the primary electroforming layer 30 and the metal layer 8 can be suppressed as much as possible. At this time, the temperature of the electroforming solution in the electroforming tank in the first electroforming step and the temperature of the electroforming solution in the electroforming tank in the second electroforming step are more preferably set to be the same or to have a deviation of ±3°C.

(Peeling step) After peeling the primary electroforming layer 30 and the metal layer 8 from the female mold 24, the primary electroforming layer 30a located on the lower surface of the frame body 3 is peeled from the two layers 30, 8. Finally, the secondary pattern resist 40, the resist body 42a, and the unexposed photoresist layer 38b are removed, and the vapor deposition mask 1 provided with the stress relief portion 42 shown in FIG. 11 is obtained.

(Third Embodiment) FIGS. 13 to 15 show a third embodiment of the vapor deposition mask and its manufacturing method of the present invention. As shown in FIG. 13, in this embodiment, the difference from the previous first embodiment lies in the fact that a frame 3 is used to form the frame 3 to reinforce the cover body 2, and the cover body 2 in which the metal layer 8 penetrates is eliminated. The bonding through hole7. The upper frame 16 and the lower frame 17 of this embodiment are formed with a 0.8 mm metal plate material as the main material, and the frame body 3 is set to the same thickness as the previous first embodiment.

14 and 15 show the method of manufacturing the vapor deposition mask 1 of the present embodiment. Here, first, the frame formation step shown in Fig. 6 described in the first embodiment is performed to form the reinforcement frame 3.

(Frame formation step) First, a cutting step is performed, that is, using, for example, metal A wire electric discharge machine or the like with a small thermal influence of the sheet material cuts the upper frame 16 and the lower frame 17 from the sheet metal. Then, a mask opening forming step is performed, that is, etching and laser processing are performed on the cut-out upper frame 16 and the lower frame 17, thereby forming a plurality of openings as the mask opening 11 as shown in FIG. 6(a). Then, the joining step is performed, that is, as shown in FIG. 6(b), in a state where the convex arc surfaces of the upper frame 16 and the lower frame 17 caused by the metal sheet are opposed to each other, the two frames 16, 17 are used with an adhesive layer 18 By joining, the frame 3 is formed in a flat shape in a state in which the warpage of the two-dimensional curved surface is offset. The adhesive layer 18 is made of a sheet-like uncured photosensitive dry film resist.

Then, the fixing step is performed, that is, as shown in FIG. 6(c), it is passed between the upper and lower rotating rollers 22 and 22 arranged in a predetermined size between the rollers to perform nip pressing. The excess adhesive layer 18 (the part exposed to the outside of the cover opening 11 and the outer peripheral frame 10) is removed (developed), and the frame 3 is obtained. Therefore, a sheet-like uncured photosensitive dry film resist is used for the adhesive layer 18 because the uncured photosensitive dry film resist has adhesiveness and is a raw material that is also used in a patterning step described later. Therefore, there is no need to separately prepare other commercially available adhesives, etc., and the manufacturing cost of the vapor deposition cover 1 can be reduced accordingly.

(Pre-patterning body forming step) As shown in FIG. 14(a), a photoresist layer 25 is formed on the surface of a concave mold 24 made of, for example, stainless steel or brass having conductivity. The photoresist layer 25 is formed by laminating one or more sheets of a negative-type sheet-like photosensitive dry film resist and bonding them by thermocompression to have a predetermined thickness. Then, the pattern film 26 (glass cover) having the light-transmitting holes 26a corresponding to the vapor deposition through holes 5 is closely attached to the photoresist layer 25, thereby obtaining the patterning precursor 27.

(Preheating step) Preheat the patterning front-stage body 27 to the temperature in the furnace of the ultraviolet irradiation device during the exposure operation using, for example, a hot plate, a preheating furnace, or the like. While preheating the patterned front-stage body 27, the inside of the furnace of the ultraviolet irradiation device is also preheated to the furnace temperature during the exposure operation. Ultraviolet light The preheating in the furnace of the irradiation device is performed by lighting the ultraviolet lamp 28 in a state in which the irradiation target is not stored in the furnace, or in a state in which a virtual cavity mold (cavity mold+photoresist layer+protective film) is stored. The pre-patterning body 27 and the furnace are preheated to, for example, 23±3°C. In addition, the maximum temperature in the furnace of the ultraviolet irradiation device for the exposure operation is about 26°C.

(One patterning step) After the preheating of the furnace of the ultraviolet irradiation device and the patterning front-stage body 27 is completed, the patterning front-stage body 27 is stored in the furnace of the ultraviolet irradiation device, as shown in FIG. 14(a), with an ultraviolet lamp 28 UV light is irradiated for exposure, and development and drying are performed. Then, as shown in FIG. 14(b), the unexposed part is melted and removed, thereby forming a primary pattern resist 29 having a resist body 29a corresponding to the vapor deposition through hole 5 (primary patterning) on the concave mold 24 . Therefore, when the exposure operation is performed while the furnace interior of the ultraviolet irradiation device and the patterning front-stage body 27 are preheated to the temperature in the furnace during the exposure operation, the heating and expansion of the patterning front-stage body 27 due to ultraviolet irradiation can be eliminated, and further In the case where the exposure operation is performed while the relative positional relationship of the three above 24, 25, and 26 is shifted. Therefore, it is possible to provide the primary pattern resist 29 with a good position accuracy and a desired shape on the concave mold 24, which can contribute to the reproducibility of the vapor deposition layer and the high accuracy of the vapor deposition accuracy.

(The first electroforming step) Next, put the above-mentioned concave mold 24 into the electroforming tank whose temperature condition of the electroforming solution is 40~50℃ initially, as shown in FIG. 14(c), in the previous resist body Within the range of the height of 29a, a plated metal made of nickel is electroformed on the surface of the concave mold 24 not covered by the resist body 29a at a time to form the primary electroformed layer 30, that is, the layer serving as the cover body 2. Then, as shown in FIG. 14(d), the resist body 29a is melted and removed, thereby obtaining the cover body 2 having the vapor deposition pattern 6 composed of a plurality of independent vapor deposition through holes 5.

(Second composition step and frame arrangement step) As shown in Figure 15(a), in The photoresist layer 38 is formed on the entire surface of the concave mold 24 including the formation portion of the primary electroforming layer 30. The photoresist layer 38 is formed by laminating one or more sheets of a negative-type sheet-like photosensitive dry film resist and thermocompression bonding in the same manner as before, and is formed into a predetermined thickness. Then, the pattern film 39 having the light-transmitting holes 39a corresponding to the pattern formation area 4 is closely attached and stored in the furnace of the ultraviolet irradiation device, and the ultraviolet light is irradiated with the ultraviolet lamp 28 to perform exposure, thereby performing development and drying processes. . In this state, a photoresist layer 38 is obtained in which the part (38a) of the pattern formation region 4 is exposed and the other part (38b) is not exposed (see FIG. 15(b)). In addition, in this embodiment, an activation treatment step may be performed before the secondary patterning step, so that the primary electroformed layer 30 serving as the outer peripheral edge 4a of the pattern formation region 4 may be subjected to activation treatments such as pickling and electrolysis.

Then, as shown in FIG. 15(b), the frame body 3 is assembled on the female mold 24 so as to surround the primary electroforming layer 30 while being aligned. Here, the adhesiveness of the unexposed photoresist layer 38b is used to temporarily fix the frame 3 to the concave mold 24. As shown in FIG. 15(c), the unexposed photoresist layer 38b exposed on the surface is melted and removed to form a secondary pattern resist 40 having a resist body 40a covering the pattern formation region 4. At this time, the unexposed photoresist layer 38b located on the lower surface of the frame 3 is covered by the frame 3, and remains on the concave mold 24 without being removed by melting.

(Second electroforming step) Then, put the above-mentioned concave mold 24 into the electroforming tank whose temperature condition of the electroforming solution is initially 23±3°C, as shown in FIG. 15(d), on the outer periphery facing the pattern formation area 4 The upper surface of the primary electroforming layer 30 of the rim 4a, the surface of the frame body 3, and the surface of the concave mold 24 exposed on the surface between the frame body 3 and the primary electroforming layer 30 are formed by electroforming electroplated metal formed of nickel Metal layer 8. As a result, the primary plating layer 30 and the frame body 3 can be joined by the metal layer 8 to form an inseparable unit.

(Peeling step) After the primary electroforming layer 30 and the metal layer 8 are peeled off from the female mold 24 On the basis of the above, the primary electroforming layer 30a located on the lower surface of the frame 3 is peeled off from the two layers 30, 8. Finally, the secondary pattern resist 40 and the unexposed photoresist layer 38b are removed, and the vapor deposition mask 1 shown in FIG. 13 is obtained.

(Fourth Embodiment) FIGS. 16 and 17 show a fourth embodiment of the vapor deposition mask and the manufacturing method thereof of the present invention. As shown in FIG. 16, the difference between this embodiment and the previous embodiments is that although the cover body 2 and the frame body 3 are joined together with a metal layer 8 to be inseparable, the metal layer 8 and the cover body The primary electroforming layer 30 of 2 is integrally formed. Therefore, when the metal layer 8 and the cover body 2 are integrally formed, the man-hours for separately forming the metal layer 8 and joining the cover body 2 and the frame body 3 are saved, thereby simplifying the steps required for manufacturing and shortening the time. The manufacturing cost of the vapor deposition cover 1 is reduced.

FIG. 17 shows a method of manufacturing the vapor deposition mask 1 of the present embodiment. Here, first, the frame formation steps shown in FIGS. 6 and 7 described in the first embodiment are performed to form the reinforcement frame 3.

(Frame Formation Step) First, a cutting step is performed, that is, using, for example, a wire electric discharge machine having a small thermal influence on the metal plate material, the upper frame 16 and the lower frame 17 are cut out of the metal plate material to the size. Then, a mask opening forming step is performed, that is, etching and laser processing are performed on the cut-out upper frame 16 and the lower frame 17, thereby forming a plurality of openings as the mask opening 11 as shown in FIG. 6(a). Then, the joining step is performed, that is, as shown in FIG. 6(b), in a state where the convex arc surfaces of the upper frame 16 and the lower frame 17 caused by the metal sheet are opposed to each other, the two frames 16, 17 are used with an adhesive layer 18 By joining, the frame 3 is formed in a flat shape in a state in which the warpage of the two-dimensional curved surface is offset. The adhesive layer 18 is made of a sheet-like uncured photosensitive dry film resist.

Then, proceed to the fixing step, as shown in Figure 6(c), to pass the configuration The upper and lower rotating rollers 22 and 22 having a predetermined size between the rollers are nipped and pressed. The excess adhesive layer 18 (the part exposed to the outside of the cover opening 11 and the outer peripheral frame 10) is removed (developed), and the frame 3 is obtained. Therefore, a sheet-like uncured photosensitive dry film resist is used for the adhesive layer 18 because the uncured photosensitive dry film resist has adhesiveness and is a raw material that is also used in a patterning step described later. Therefore, there is no need to separately prepare other commercially available adhesives, etc., and the manufacturing cost of the vapor deposition cover 1 can be reduced accordingly.

As shown in FIG. 7(a), each of the above-mentioned steps is performed to manufacture a pair of frame bodies 3 from metal plates having different thicknesses. These frame bodies 3 are laminated as shown in FIG. 7(b), and the frame bodies 3 are joined to each other with an adhesive layer 19 made of a sheet-shaped uncured photosensitive dry film resist. Then, as shown in FIG. 7(c), the lamination step is performed even if it passes between the upper and lower rotating rollers 22, 22 arranged in a predetermined inter-roller size and is nipped and pressed. Thus, a pair of stacked frame bodies 3 are obtained.

(Pre-patterning body forming step) As shown in FIG. 17(a), a photoresist layer 25 is formed on the surface of a concave mold 24 made of, for example, stainless steel or brass having conductivity. The photoresist layer 25 is formed by laminating one or more sheets of a negative-type sheet-like photosensitive dry film resist and bonding them by thermocompression to have a predetermined thickness. Then, the pattern film 26 (glass cover) having the light-transmitting holes 26a corresponding to the cover body 2 is closely attached to the photoresist layer 25, thereby obtaining the patterned pre-stage body 27.

(Preheating step) Preheat the patterning front-stage body 27 to the temperature in the furnace of the ultraviolet irradiation device during the exposure operation using, for example, a hot plate, a preheating furnace, or the like. While preheating the patterned front-stage body 27, the inside of the furnace of the ultraviolet irradiation device is also preheated to the furnace temperature during the exposure operation. The preheating in the furnace of the ultraviolet irradiation device is performed by lighting the ultraviolet lamp 28 in a state in which the irradiation target is not stored in the furnace or in a state in which a virtual cavity mold (cavity mold+photoresist layer+protective film) is stored. The pre-patterning body 27 and the furnace are preheated to, for example, 23±3°C. In addition, the ultraviolet radiation device for exposure work The maximum temperature in the furnace is about 26°C.

(One patterning step) After the preheating of the furnace of the ultraviolet irradiation device and the patterning front body 27 is completed, the patterning front body 27 is stored in the furnace of the ultraviolet irradiation device, as shown in FIG. 17(a), with an ultraviolet lamp 28 UV light is irradiated for exposure, and development and drying are performed. Then, as shown in FIG. 17(b), the unexposed part is melted and removed, thereby forming a primary pattern resist 29 having a resist body 29a corresponding to the mask body 2 (primary patterning) on the concave mold 24. Therefore, when the exposure operation is performed while the furnace interior of the ultraviolet irradiation device and the patterning front-stage body 27 are preheated to the temperature in the furnace during the exposure operation, the heating and expansion of the patterning front-stage body 27 due to ultraviolet irradiation can be eliminated, and further In the case where the exposure operation is performed while the relative positional relationship of the three above 24, 25, and 26 is shifted. Therefore, it is possible to provide the primary pattern resist 29 with a good position accuracy and a desired shape on the concave mold 24, which can contribute to the reproducibility of the vapor deposition layer and the high accuracy of the vapor deposition accuracy.

(Frame Arranging Step) Then, as shown in FIG. 17(c), an adhesive resist 43 is formed on the entire surface of the concave mold 24 including the formation portion of the primary pattern resist 29. The adhesive resist 43 is formed by laminating one or more sheets of a negative-type sheet-like photosensitive dry film resist and thermocompression bonding in the same way as before, and is formed into a predetermined thickness. Then, the frame body 3 is assembled while being aligned on the concave mold 24 so as to surround the primary pattern resist 29. Here, the adhesiveness of the unexposed adhesive resist 43 is used to temporarily fix the frame 3 to the concave mold 24. As shown in FIG. 17(d), the unexposed adhesive resist 43 exposed on the surface is melted and removed. At this time, the adhesive resist 43 located on the lower surface of the frame 3 is covered by the frame 3 and remains on the concave mold 24 without being removed by melting.

(Integral electroforming step) Put the above-mentioned concave mold 24 into the initial temperature condition of the electroforming liquid An electroforming tank starting at 23±3°C, as shown in Fig. 17(e), electroforming a plated metal made of nickel on the surface of the concave mold 24 not covered by the resist 29a and the surface of the frame 3 The metal layer 8 is formed. Thereby, the primary electroformed layer 30 constituting the cover body 2 and the metal layer 8 that joins the cover body 2 and the frame 3 can be integrally formed.

(Peeling step) After the primary electroforming layer 30, the metal layer 8 and the frame body 3 are integrally peeled off from the female mold 24, the adhesive resist located on the lower surface of the frame body 3 is removed from the two layers 30 and 8 43, thereby obtaining the vapor deposition mask 1 shown in FIG. 16.

According to the manufacturing method of the fourth embodiment described above, the man-hours for forming the metal layer 8 can be omitted, the steps required for manufacturing can be simplified, the time can be shortened, and the rigidity of the frame 3 can be enhanced in the same manner as described above. Therefore, while further suppressing an increase in manufacturing cost, it is possible to achieve an increase in size, maintain flatness, and obtain a vapor deposition cover 1 that can ensure good reproducibility and vapor deposition accuracy of the vapor deposition layer.

(Fifth Embodiment) FIGS. 18 to 20 show a fifth embodiment of the vapor deposition mask of the present invention. As shown in FIG. 18, the vapor deposition cover 1 of the present embodiment includes a support frame 46 fixed to the lower surface of the frame 3 and an auxiliary frame 47 fixed to the lower surface of the support frame 46. The outer shape of the supporting frame 46 and the auxiliary frame 47 is consistent with the frame body 3. As shown in FIGS. 19 and 20, a frame opening 48 corresponding to the cover opening 11 of the frame 3 is formed in the support frame 46, and the frame opening 48 is formed in an opening shape that is slightly larger than the cover opening 11. The entire vertical frame 12 and horizontal frame 13 of the frame body 3 are supported by the support frame 46. Furthermore, the auxiliary frame 47 is formed in a frame shape, and the four edges of the support frame 46 are supported by the auxiliary frame 47. After aligning the vapor deposition cover 1, the support frame 46, and the auxiliary frame 47, respectively, the three parts 1, 46, and 47 are joined and integrated by spot welding. Welding points 49 for spot welding are provided at the four corners and the peripheral edge portions on the extension lines of the vertical frame 12 and the horizontal frame 13 (see FIG. 20).

As described above, when the entire vertical frame 12 and the horizontal frame 13 of the frame body 3 are supported by the support frame 46, and the peripheral edge of the support frame 46 is supported by the auxiliary frame 47, the structural strength of the entire vapor deposition cover can be further enhanced. The vapor deposition cover 1 is prevented from being flexed and deformed and the flatness is maintained, and the reproduction accuracy of the vapor deposition layer and the deposition accuracy can be further improved.

Fig. 21 shows a modification of the fifth embodiment of the vapor deposition cover of the present invention. In the present embodiment, the vapor deposition cover 1 has ten cover bodies 2 arranged in a matrix of two columns and five rows. Three vapor deposition covers 1 are manufactured, and the three vapor deposition covers 1 are supported by the support frame 46 and the auxiliary frame 47. Specifically, first, one vapor deposition cover 1 is prepared and fixed to the support frame 46 after adjusting the position and tension. This fixing is to fix the corner portions of the frame 3 and the peripheral portions on the extension lines of the vertical frame 12 and the horizontal frame 13 by spot welding. The remaining two vapor deposition covers 1 are also fixed to the support frame 46 in the same manner. Finally, the auxiliary frame 47 is fixed (spot welding) on the side opposite to the side of the vapor deposition cover 1 to which the support frame 46 is fixed. Therefore, when a plurality of vapor deposition masks 1 are supported by the support frame 46 and the auxiliary frame 47, the relative positions of the adjacent vapor deposition masks 1 can be finely adjusted and arranged, and the adjacent vapor deposition masks can be increased. 1. The relative position accuracy of the cover body 2. Therefore, good reproduction accuracy and vapor deposition accuracy can be ensured. In addition, the vapor deposition cover 1 of a desired size can be freely set.

As described above, in the vapor deposition mask and vapor deposition mask manufacturing method of each of the above embodiments, the upper frame 16 and the lower frame 17 constitute the frame body 3, and the upper and lower frames 16, 17 are joined through the adhesive layer 18 to be integrated. When forming the frame body 3 with the same thickness as the conventional one, a thinner metal plate material can be used to form the frame body 3, and the thickness deviation of the entire frame body 3 can be reduced. Thereby, even if it is a large-scale vapor-deposition cover 1, the generation|occurrence|production of the strain caused by the thermal expansion caused by the thickness deviation of a metal plate material can be suppressed. In addition, since a thin metal plate that is generally circulated is used as the main material, it is not necessary to use a dedicated metal plate to form the frame 3. As described above, the vapor deposition according to the above embodiments The cover can achieve an increase in the size of the vapor deposition cover 1 while suppressing an increase in manufacturing costs, and can maintain the flatness of the vapor deposition cover 1, thereby ensuring good reproduction accuracy and vapor deposition accuracy. In addition, according to the frame body 3 in which the adhesive layer 18 is inserted between the upper frame 16 and the lower frame 17, when an external force that flexes and deforms the vapor deposition cover 1 is applied, the frame body 3 elastically deforms only the amount of the adhesive layer 18 Therefore, the damage of the vapor deposition cover 1 can be effectively prevented.

In addition, in the vapor deposition masks of the first, second, fourth, and fifth embodiments, a plurality of frame bodies 3 are stacked, and frame bodies 3 adjacent in the stacking direction are joined to each other through the adhesive layer 19, so that the In the conventional frame body 3 having the same thickness, a thinner metal plate material can be used to form the frame body 3. Therefore, it is possible to further suppress the occurrence of strain due to thermal expansion caused by the thickness deviation of the metal plate material.

As shown in each of the above-mentioned embodiments, the number of sheets and the arrangement of the cover main body 2 having the vapor deposition cover 1 are not limited to those shown in the above-mentioned embodiments. In addition, the cover main body 2 does not have to be plural, but may be one. Prior to the joining step of the upper and lower frames 16, 17, the upper and lower frames 16 and 17 cut out can be punched using upper and lower metal molds for forming curved surfaces to produce a two-dimensional or three-dimensional curved surface. In this case, by forming a two-dimensional curved surface or a three-dimensional curved surface constituting a line-symmetric relationship, the frame body 3 can be easily formed into a flat shape in the subsequent joining step. The primary electroforming layer 30 and the metal layer 8 may also be provided in a double-layer structure of bright nickel and matt nickel electroformed thereon. In this case, the bright nickel is difficult to adhere to the concave mold 24, and the step of peeling the vapor deposition cover 1 from the concave mold 24 in the manufacturing process can be advanced efficiently.

1‧‧‧Evaporation Hood

2‧‧‧Cover body

3‧‧‧Frame

4‧‧‧Pattern forming area

4a‧‧‧Outer periphery

5‧‧‧Evaporated through hole

6‧‧‧Evaporation pattern

7‧‧‧Joint through hole

8‧‧‧Metal layer

11‧‧‧Hood opening

12‧‧‧Vertical frame

13‧‧‧Horizontal frame

16‧‧‧Upper frame

17‧‧‧Bottom frame

18‧‧‧Adhesive layer

19‧‧‧Adhesive layer

Claims (10)

A vapor deposition cover comprising: a cover body (2) provided with a vapor deposition pattern (6) composed of a plurality of independent vapor deposition through holes (5); and a reinforcement frame (3), which is arranged in the cover The periphery of the main body (2) is made of sheet metal with a low thermal linear expansion coefficient. The above-mentioned vapor deposition cover is characterized in that the cover main body (2) and the frame body (3) are connected into an inseparable unit through the metal layer (8), The frame body (3) is composed of an upper frame (16) and a lower frame (17) formed in the same shape, and the upper frame (16) and the lower frame (17) are joined through an adhesive layer (18) to be integrated. Such as the vapor deposition cover of the first item of the patent application, in which a plurality of frame bodies (3) are laminated, and the frame bodies (3) adjacent to each other in the lamination direction are joined to each other through an adhesive layer (19). For example, the vapor deposition cover of item 1 or 2 of the scope of patent application, in which the upper frame (16) and the lower frame (17) are joined in a state where the convex arc surface or the concave arc surface faces each other, and the upper frame (16) is offset When the two-dimensional or three-dimensional curved surface of the lower frame (17) and the lower frame (17) are warped, the frame (3) is formed into a flat shape. For example, the vapor deposition cover of item 1 or 2 of the scope of patent application, wherein the cover body (2) is formed in a rectangular shape, a plurality of cover bodies (2) are arranged in a matrix, and the frame body (3) has an outer peripheral frame (10) and A lattice frame-like vertical frame (12) and horizontal frame (13) are divided into a plurality of cover openings (11) in the outer peripheral frame (10), and a vertical frame (12) parallel to the long side of the cover body (2) ) Is set to W1, and the width of the horizontal frame (13) parallel to the short side of the cover body (2) is set to W2, the width of the vertical frame (12) is W1 and the horizontal frame (13) is The width dimension W2 is set to satisfy the inequality W1

W2

W1 ×1.1. For example, the vapor deposition cover of item 1 or 2 in the scope of patent application, wherein the metal layer (8) and the cover body (2) are integrally formed. For example, the vapor deposition cover of item 1 or 2 of the scope of patent application is further equipped with: a supporting frame (46), which is fixed on the lower surface of the frame body (3); and an auxiliary frame (47), which is fixed to the supporting frame (46) On the lower surface of the support frame (46), a frame opening (48) corresponding to the cover opening (11) of the frame body (3) is formed, and the frame opening (48) is formed to be a circle larger than the cover opening (11) The shape of the opening, the vertical frame (12) and the horizontal frame (13) of the frame body (3) are supported by the support frame (46), the auxiliary frame (47) is formed into a frame shape, and the periphery of the support frame (46) is supported by the auxiliary frame (47) Support. A method for manufacturing a vapor deposition mask, the vapor deposition mask includes: a mask body (2) having a vapor deposition pattern (6) formed by a plurality of independent vapor deposition through holes (5) in a pattern formation area (4); And a reinforcement frame (3), which is arranged around the cover body (2) and is composed of a metal plate with a low thermal linear expansion coefficient. The method for manufacturing the vapor deposition cover is characterized in that it includes: a frame body forming step to form a reinforcement Use a frame (3); one patterning step, a primary pattern resist (29) with a resist body (29a) corresponding to the vapor deposition through hole (5) is provided on the surface of the concave mold (24); In the electroforming step, a pattern resist (29) is used to electroform metal plating on the concave mold (24), and a plurality of one corresponding to the cover body (2) is formed on the concave mold (24) at a predetermined position Electroformed layer (30); the frame arrangement step is to align the primary electroformed layer (30) corresponding to each cover opening (11) of the frame (3) in the cover opening (11) At the same time, the frame (3) is arranged on the concave mold (24); the second electroforming step is to cover the surface of the frame (3) and the outer periphery (4a) of the pattern formation area (4) of the cover body (2) In the state of the surface, the metal layer (8) is formed by electroforming, and the primary electroforming layer (30) and the frame body (3) are joined into an inseparable unit through the metal layer (8); and the peeling step, The electroformed layer (30), the frame body (3) and the metal layer (8) are integrally peeled off from the female mold (24), and the frame body forming step includes a bonding step to form the frame body (3). The bonding step is above When the convex or concave surfaces of the frame (16) and the lower frame (17) are facing each other, the upper frame (16) and the lower frame (17) are joined with the adhesive layer (18), and the upper frame is offset (16) The frame body (3) is formed into a flat shape in a state where the two-dimensional curved surface or the three-dimensional curved surface of the lower frame (17) is warped. A method for manufacturing a vapor deposition mask, comprising: a mask body (2) having a vapor deposition pattern (6) formed by a plurality of independent vapor deposition through holes (5) in a pattern formation area (4) And a reinforcement frame (3), which is arranged around the cover body (2) and is composed of a metal sheet with a low thermal linear expansion coefficient. The method for manufacturing the vapor deposition cover is characterized by comprising: a frame body forming step, forming Reinforcement frame (3); one patterning step, a primary pattern resist (29) with a resist body (29a) corresponding to the mask body (2) is set on the surface of the concave mold (24); The frame arrangement step is to paste the adhesive resist (43) on the entire upper surface of the concave mold (24) including the primary pattern resist (29), and on this basis, to surround the primary pattern resist (29) Way, the frame (3) is adhered and fixed on the concave mold (24); the step of removing the adhesive resist (43) except the adhesive resist (43) located on the lower surface of the frame (3); In the electroforming step, the surface of the concave mold (24) except the resist body (29a) and the surface of the frame body (3) are electroformed and plated with metal in a state of covering, thereby integrally forming the primary part of the cover body (2) The electroformed layer (30) and the metal layer (8) that joins the cover body (2) and the frame (3); and, in the peeling step, the electroformed layer (30) and the metal are integrally peeled from the die (24). The layer (8) and the frame body (3) include a joining step in the frame body forming step to form the frame body (3). The joining step is on the convex or concave arc surfaces of the upper frame (16) and the lower frame (17) In the state where the faces face each other, the upper frame (16) and the lower frame (17) are joined by the adhesive layer (18), and the two-dimensional or three-dimensional curved surface of the upper frame (16) and the lower frame (17) is offset In a warped state, the frame (3) is formed into a flat shape. For example, the manufacturing method of the vapor deposition mask of item 7 or 8 of the scope of patent application, wherein in a patterning step, a photoresist layer (25) is laminated on the surface of a conductive concave mold (24), and then a photoresist layer (25) The surface of the resist layer (25) is laminated with a pattern film (26) having light-transmitting holes (26a) corresponding to one patterning, thereby forming a patterning precursor (27). The temperature and ultraviolet rays of the patterning precursor (27) are In a state where the temperature in the furnace of the irradiation device is preheated to the temperature in the furnace during the exposure operation, the ultraviolet irradiation device exposes the photoresist layer (25). For example, the manufacturing method of the vapor deposition hood in the scope of the patent application, wherein the temperature range of the electroforming liquid used in the first electroforming step and the temperature range of the electroforming liquid used in the second electroforming step Set to approximately the same temperature zone.

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