TWI693760B - Connecting device and method of manufacturing same - Google Patents

Abstract

This invention provides a connecting device capable of connecting an electrical connector for transmitting electrical signals and an optical connector for transmitting optical signals to an optical component and a manufacturing method thereof. The connecting device of the present invention is used for inspection of a semiconductor element having an electrical signal terminal for transmitting electrical signals and an optical signal terminal for transmitting optical signals. The connecting device comprises an optical connector 100 that is optically connected to an optical signal terminal, and an electrical connector 200 that is electrically connected to the electrical signal terminal.

Description

Connecting device and its manufacturing method

The present invention relates to a connecting device for inspection of characteristics of an object to be inspected.

Using silicon photonics (Silicon Photonics) technology, a semiconductor device (hereinafter referred to as a "device") having an electrical circuit that transmits electrical signals and an optical circuit that transmits optical signals is formed on a silicon substrate, etc. In order to check the characteristics of the optical element in the wafer state, optical fibers and the like are used as optical connectors that connect the optical element and the inspection device.

For example, a method has been disclosed in which the tip of the optical fiber held in the probe body is approached to obtain the characteristics of the optical element to be inspected (refer to Patent Document 1).

[Prior Technical Literature] [Patent Literature]

Patent Document 1: US Patent Application Publication No. 2006/0008226A1

In the inspection of optical elements, it is effective to connect the optical element and the inspection device by using a connecting device that connects an electrical connector that transmits electrical signals to the optical element and an optical connector that transmits optical signals to the optical element . However, no progress has been made in the development of such connection devices.

An object of the present invention is to provide a connection device and a manufacturing method thereof that can connect both an electrical connector transmitting electrical signals and an optical connector transmitting optical signals to optical elements.

According to one aspect of the present invention, there is provided a connection device for inspection of a semiconductor device having an electrical signal terminal transmitting an electrical signal and an optical signal terminal transmitting an optical signal. The connection device includes: optical connection The connector is optically connected to the optical signal terminal; and the electrical connector is electrically connected to the electrical signal terminal.

According to another aspect of the present invention, there is provided a method of manufacturing a connection device for inspection of a semiconductor device having an electrical signal terminal for transmitting electrical signals and an optical signal terminal for transmitting optical signals. The manufacturing method includes the following steps: fixing the optical connector to the block in a state where the optical connection end of the optical connector optically connected to the optical signal terminal is exposed on the main surface of the block Steps of mounting the block on the circuit board in such a way that the main surface of the block is exposed; and referring to the position information of the optical connection end, the electrical connection end of the electrical connector is arranged at a predetermined position The step of providing the electrical connector on the circuit board.

According to the present invention, it is possible to provide a connection device capable of connecting both an electrical connector transmitting an electrical signal and an optical connector transmitting an optical signal to an optical element, and a manufacturing method thereof.

10‧‧‧ block

11‧‧‧Empty

12‧‧‧Embedded hole

15‧‧‧Capillary

16‧‧‧Fixed column

20‧‧‧ circuit board

21‧‧‧joint pad

22‧‧‧Alignment mark

23‧‧‧Connecting terminal

30‧‧‧Reinforcement

40‧‧‧Position adjustment mechanism

41‧‧‧tension spring

42‧‧‧Press spring

51‧‧‧First bolt

52‧‧‧Second bolt

60‧‧‧Guide plate

70‧‧‧Guide pin

100‧‧‧Optical connector

101‧‧‧Optical connection end

150‧‧‧Through hole

151‧‧‧Ditch

152‧‧‧Datum hole

200‧‧‧Electrical connector

201‧‧‧Electrical connection end

300‧‧‧Opening

A‧‧‧Region

F1‧‧‧pull power

F2‧‧‧Pressing force

NA‧‧‧Number of openings

FIG. 1 is a schematic diagram showing the structure of a connection device according to an embodiment of the present invention.

FIG. 2 is a schematic perspective view showing an example of the position adjustment mechanism of the connection device of the embodiment of the present invention.

FIG. 3 is a schematic diagram (No. 1) for explaining the manufacturing method of the connection device of the embodiment of the present invention.

FIG. 4 is a schematic diagram (No. 2) for explaining the manufacturing method of the connection device of the embodiment of the present invention.

FIG. 5 is a schematic plan view showing an example of the arrangement of optical connectors and electrical connectors of a connection device according to an embodiment of the present invention.

FIG. 6 is a schematic perspective view showing an example of the structure of a stiffener of a connecting device according to an embodiment of the present invention.

FIG. 7 is a perspective view showing the configuration of the connection device of the embodiment of the present invention.

FIG. 8 is a schematic perspective view showing a configuration example of a block and a capillary of a connecting device according to an embodiment of the present invention.

FIG. 9 is a plan view showing the area A of FIG. 8.

Fig. 10 is a perspective view showing the shape of the fixing column material in the configuration example shown in Fig. 8.

FIG. 11 is a plan view showing the shape of the block of the configuration example shown in FIG. 8.

FIG. 12 is a cross-sectional view showing the shape of the capillary shown in FIG. 8 perpendicular to the thickness direction.

Next, an embodiment of the present invention will be described with reference to the drawings. In the description of the following drawings, the same or similar symbols are given to the same or similar parts. However, the drawings are only schematics, and it should be noted that the thickness ratio of each part is different from the actual situation. In addition, of course, the drawings also include parts having different dimensional relationships or ratios. The embodiments shown below are examples of devices or methods for embodying the technical idea of the present invention. The embodiments of the present invention do not limit the materials, shapes, structures, arrangements, etc. of the constituent parts to the following Describe each.

The connection device according to the embodiment of the present invention shown in FIG. 1 is used for inspection of optical elements having electrical signal terminals for transmitting electrical signals and optical signal terminals for transmitting optical signals. In terms of optical devices, although not particularly limited, silicon photonics (Silicon Photonics) chips, VCSEL (Vertical-Cavity Surface-Emitting Laser, vertical cavity surface emitting laser), etc. can be assumed. The connection device shown in FIG. 1 includes: an optical connector 100 that is optically connected to the optical signal terminal of the optical element; and an electrical connector 200 that is electrically connected to the electrical signal terminal of the optical element. The optical connector 100 and the electrical connector 200 are arranged so as to be close to the position corresponding to the distance between the optical signal terminal and the electrical signal terminal of one optical element. When the optical connector 100 and the optical signal terminal are optically connected, an optical signal is transmitted between the optical signal terminal and the optical connector 100. Generally, the optical signal terminal and the optical connector 100 are optically connected in a non-contact state close to each other. The time at which the optical connector 100 is connected to the optical signal terminal and the time at which the electrical connector 200 is connected to the electrical signal terminal may have a time difference at the same time. In short, as long as both the optical connector 100 and the electrical connector 200 can be connected to the optical element at the same time.

The connection device functions as a probe card that connects the inspection device and the optical element to be inspected. The optical element to be inspected is not shown, but it is on the surface on which the optical signal terminal and the electrical signal terminal (hereinafter collectively referred to as "signal terminal") are formed, facing the connection device in the downward direction in FIG. 1 To the ground configuration. When measuring an optical element, the optical connection end 101 of the optical connector 100 is optically connected to the optical signal terminal of the optical element, and the electrical connection end 201 of the electrical connector 200 is electrically connected to the electrical signal terminal of the optical element connection. Thereby, for example, an electrical signal is input from the electrical connection end 201 of the electrical connector 200 to the optical element, and the optical signal output from the optical element is input to the optical connection end 101 of the optical connector 100, and The optical signal is detected by a measuring device such as a tester (not shown).

In the optical connector 100, an optical fiber or the like is preferably used. For example, the optical signal is injected from the optical signal terminal of the optical element to the end surface of the optical fiber disposed near the optical signal terminal. However, it is not limited to the optical fiber, and an optical component having an optical waveguide may be used for the optical connector 100. Optical waveguide systems such as optical fibers are formed so as to have the same refractive index as the optical element. For example, in order to correspond to the silicon photonic element, the optical connector on the probe card side is also formed of a material matching the refractive index of silicon.

The electrical connector 200 preferably uses a probe made of a conductive material or the like. For example, a cantilever type probe is used for the electrical connector 200. However, the type of probe used in the electrical connector 200 is not limited to the cantilever type, and any type of probe can be used.

As shown in FIG. 1, the connection device includes: a block 10 that fixes the optical connector 100 in a state where the optical connection end 101 of the optical connector 100 is exposed on the main surface (first main surface); and The circuit board 20 is mounted with the block 10. On the circuit board 20, an electrical circuit electrically connected to the electrical connector 200 is formed. The circuit board 20 is preferably a printed board (PCB board) or the like. The electrical connector 200 is electrically connected to the bonding pad 21 provided on the circuit board 20 and is provided on the circuit board 20.

The bonding pad 21 is connected to the connection terminal 23 arranged on the circuit board 20 via an electric circuit (not shown) formed on the circuit board 20. The connection terminal 23 is arranged on the main surface opposite to the main surface on which the power supply connector 200 of the circuit board 20 is provided. The connection terminal 23 is electrically connected to the inspection device.

In addition, the other end of the optical connector 100 optically coupled with the optical connection end 101 is connected to the inspection device. The optical connector 100 is connected to the inspection apparatus via components such as an optical connector. At this time, the optical signal can be converted into an electrical signal according to the specifications of the inspection device, or the optical signal can be directly input to the inspection device.

The optical connector 100 and the electrical connector 200 are provided on the connection device with a predetermined position accuracy so as to be correctly connected to the signal terminal of the optical element to be inspected during inspection. That is, the relative positional relationship between the optical connection end 101 of the optical connector 100 and the electrical connection end 201 of the electrical connector 200 is within a predetermined range, and when the connection device is aligned with the optical element, the optical connection The connector 100 and the electrical connector 200 are correctly connected to the signal terminal of the optical element. Here, "correctly connected" means that the optical connector 100 and the electrical connector 200 are connected to the signal terminal of the optical element to be inspected in such a way that predetermined measurement accuracy can be obtained.

Regarding the positions of the electrical connector 200 and the optical connector 100, there is an allowable range at a position (hereinafter referred to as "optimum position") where a predetermined measurement accuracy is obtained by connecting to the signal terminal of the optical element. The allowable range of the optimal position refers to the range where the signal can be obtained with the desired accuracy or strength if the electrical connector 200 or the optical connector 100 is located in the range. The allowable range is appropriately set according to the accuracy required for inspection or the performance of the connector. For example, when an optical fiber is used for the optical connector 100, the allowable range of the position of the optical connector 100 is set according to the number of openings NA of the optical fiber and the like.

The allowable range of the optimal position of the optical connector 100 is narrower than that of the electrical connector 200. In the manufacture of the connection device shown in FIG. 1, as described later, after the alignment of the optical connector 100 with a smaller allowable range is performed, the electrical connector is made according to the position of the optical connector 100 Counterpoint of 200.

In the connection device shown in FIG. 1, the capillary 15 that fixes the optical connector 100 in a state where the optical connector 100 is penetrated is embedded in the block body 10, thereby fixing the optical connector 100 to the block body 10 . In other words, the through hole is formed in the capillary 15 with the required position accuracy, and the optical connector 100 inserted into the through hole is fixed. With this, the optical connector 100 can be installed on the block 10 with a predetermined position accuracy.

The number of through holes formed in the capillary 15 is arbitrary. For example, when there are four optical signal terminals included in one optical element, a capillary 15 formed with four through holes is prepared for each optical element. Alternatively, when one optical element has one optical signal terminal, a capillary 15 having four through holes formed on four optical elements may be prepared.

In addition, if the optical connector 100 can be arranged on the block body 10 with the required position accuracy, the capillary 15 may not be used. For example, the block 10 is divided into two parts, and V-shaped grooves for arranging the optical connector 100 are formed on the butted surfaces of the divided parts. The V-shaped groove is formed with openings on the butting surface, and is formed in such a manner that the openings will coincide when the divided portions are overlapped. In a state where the optical connector 100 is arranged in a V-shaped groove, the two parts are overlapped, whereby the optical connector 100 can be fixed inside the block body 10. The processing of V-shaped grooves is easier than the formation of through-holes, and the dimensional accuracy can be improved. In addition, a V-shaped groove may be formed only in one part of the divided block 10.

The circuit board 20 is fixed with a reinforcement 30 having a higher rigidity than the circuit board 20. The reinforcing member 30 ensures the mechanical strength of the connection device so that the circuit board 20 does not flex, and is used as a support for fixing each of the component parts of the connection device.

In addition, a guide plate 60 through which the optical connector 100 penetrates is arranged on the first main surface of the block 10. A guide pin 70 fixed to the reinforcement 30 is inserted into the through hole provided in the guide plate 60. With this, the position of the guide plate 60 is defined. An opening area is provided in the guide plate 60 so that the alignment mark 22 formed on the circuit board 20 can be visually observed. By arranging the guide plate 60 on the first main surface of the block 10, the position of the alignment mark 22 used when the block 10 is placed on the circuit board 20 can be easily confirmed.

In the connection device shown in FIG. 1, the block 10 is mounted on the circuit board 20 so as to be movable in a direction perpendicular to the first main surface (hereinafter referred to as “thickness direction”). In other words, the block 10 is not fixed to the circuit board 20. Furthermore, a gap is provided between the guide plate 60 and the circuit board 20. Therefore, the block 10 can move in the thickness direction with respect to the reinforcement 30 and the circuit board 20 fixed to the reinforcement 30. In addition, by providing a gap between the guide plate 60 and the circuit board 20, it is possible to suppress the influence on the guide plate 60 when the surface of the circuit board 20 is not flat.

The connection device shown in FIG. 1 includes a position adjustment mechanism 40 that adjusts the relative position of the block body 10 with respect to the circuit board 20. The position adjustment mechanism 40 is configured to include: a plate-shaped tension spring 41 that pulls the block body 10 toward one side in the thickness direction; and a plate-shaped pressing spring 42 that presses the block in a direction opposite to the pulling direction of the tension spring 41体10。 10. Furthermore, the position of the block 10 in the thickness direction is defined by the balance of the pulling force F1 derived from the pulling spring 41 and the pressing force F2 of the pressing spring 42. In order to stabilize the block body 10 at a predetermined position, the elastic forces of the tension spring 41 and the pressing spring 42 are set in advance.

As shown in FIG. 1, the central portion of the tension spring 41 is fixed to the second main surface of the block 10 opposed to the first main surface, and both ends of the tension spring 41 are pressed against the reinforcement 30 to elastically contact. More specifically, as shown in FIG. 2, the first bolt 51 penetrates the central portion of the tension spring 41 and is fixed to the second main surface of the block body 10.

On the other hand, as shown in FIG. 2, one end of the pressing spring 42 is fixed to the reinforcing member 30 by the second bolt 52, and the other end is pressed against the second main surface of the block 10 to be elastic Ground contact. The tension spring 41 and the pressing spring 42 are fixed to the circuit board 20 via the reinforcement 30.

In addition, for example, by screwing the second bolt 52 to the reinforcement 30 and adjusting the tightening method of the screw, the position of the block 10 in the thickness direction can also be finely adjusted. In this way, the combination of the tension spring 41 and the pressing spring 42 functions as a position adjustment mechanism that relatively moves the block 10 relative to the reinforcement 30 and the circuit board 20.

The method of manufacturing the connection device shown in FIG. 1 will be described below. The following exemplarily describes a case where an optical fiber is used for the optical connector 100 and a cantilever-type probe is used for the electrical connector 200.

First, as the optical connector 100, an optical fiber that has been subjected to terminal treatment for the end portion is prepared. The term “end processing” refers to the processing or polishing of the lens as the end of the optical connection end 101, the process of removing the coating layer, or the process of attaching the optical connector to the other end.

Furthermore, as shown in FIG. 3, the optical connector 100 is provided on the block 10 so that the optical connection end 101 is exposed on the first main surface of the block 10. For example, the capillary 15 penetrating the optical connector 100 is fixed to the block 10. At this time, the amount of protrusion of the optical connector 100 is adjusted so that the optical connection end 101 is exposed from the first main surface of the block 10 at a predetermined height, and it is confirmed that the optical connector 100 has been set at a predetermined position and fixed Capillary 15.

Next, the guide plate 60 is attached to the first main surface of the block 10. Furthermore, the block 10 is mounted at a predetermined position on the circuit board 20. For example, the block 10 is inserted into a cavity formed at a predetermined position on the circuit board 20. At this time, the alignment mark 22 formed on the circuit board 20 is used as a mark, and the block 10 is mounted on the circuit board 20 at the same time. By arranging the guide plate 60 provided with the opening area where the alignment mark 22 is exposed to the block 10, the block 10 and the circuit board 20 can be easily aligned.

Furthermore, the reinforcement 30 is fixed to the circuit board 20. At this time, as shown in FIG. 4, the position of the guide plate 60 is set by the guide pin 70 fixed to the reinforcement 30.

Next, as shown in FIG. 2, the tension spring 41 and the pressing spring 42 are attached to the block body 10 and the reinforcement 30. Furthermore, the positions of the tension spring 41 and the pressing spring 42 are fixed. At this time, not only the position adjustment in the thickness direction but also the direction parallel to the thickness direction is adjusted. The reference for position adjustment is the main surface of the circuit board 20.

Next, the electrical connector 200 is provided on the circuit board 20. At this time, the electrical connector 200 is positioned by referring to the position information of the optical connector 100 as follows.

First, the position information of the optical connector 100 is analyzed, and the amount of deviation from the preset setting position (hereinafter referred to as "the amount of deviation") is detected for the position of the optical connection end 101. Furthermore, with reference to the amount of deviation of the position of the optical connection end 101, the optimal position of the electrical connection end 201 of the electrical connector 200 is calculated.

For example, the predetermined set coordinates of the optical connection end 101 of the optical connector 100 are compared with the coordinates of the optical connection end 101 actually provided on the optical connector 100 of the block 10, and the optical connection is detected The amount of deviation of the position of the end 101. Furthermore, the amount of deviation of the position of the electrical connection end 201 from the predetermined set coordinate will be determined in the same manner as the amount of deviation of the position of the optical connection end 101, coordinate.

At this time, the deviation amount can also be statistically processed to determine the position of the electrical connection end 201 of the electrical connector 200. For example, a histogram of unevenness of deviations is created, and the average value of deviations or unevenness (deviations) are calculated. Furthermore, the position of the electrical connection end 201 of the electrical connector 200 is calculated so that the optical connection end 101 of the optical connector 100 becomes a predetermined relative position.

After that, the electrical connector 200 is bonded to the bonding pad 21 of the circuit board 20 so that the electrical connection end 201 is arranged at the calculated position. In the above manner, the connection device shown in FIG. 1 is completed.

FIG. 5 shows an example of the positions of the optical connection end 101 of the optical connector 100 and the electrical connection end 201 of the electrical connector 200. In the example shown in FIG. 5, the electrical connection ends 201 of the four electrical connectors 200 are arranged in pairs with each of the optical connection ends 101 of the four optical connectors 100. In this way, for example, for an optical element having a pair of one electrical signal terminal and one optical signal terminal, four optical elements can be inspected continuously or simultaneously.

In this way, corresponding to the inspection of the wafer on which a plurality of optical elements are formed, a connection device having the optical connector 100 and the electrical connector 200 connected to the signal terminals is provided for two or more optical elements. Alternatively, an optical element having four optical signal terminals and four electrical signal terminals may be inspected using four optical connectors 100 and four electrical connectors 200. In this way, the optical signals of a plurality of optical elements can be collectively captured for measurement, so the inspection efficiency can be improved and the inspection time can be shortened.

As described above, the electrical connector 200 is provided on the circuit board 20 with reference to the position information of the optical connector 100, whereby the relative positional relationship between the optical connection end 101 and the electrical connection end 201 can be controlled to a desired The range of location accuracy. In this way, the optical connector 100 and the electrical connector 200 can be simultaneously connected to the signal terminal of the optical element with high accuracy. As a result, accurate measurement of the optical element can be performed.

In addition, the bonding pad 21 and the alignment mark 22 are preferably formed at the same time in the same process steps when the circuit board 20 is formed. Thereby, the accuracy of the relative position of the bonding pad 21 and the alignment mark 22 can be improved according to the manufacturing accuracy of the manufacturing steps. As a result, when the alignment mark 22 is used for alignment, the bonding pad 21 can also be aligned with high accuracy.

In order to obtain the mechanical strength of the connection device, the reinforcing member 30 is formed to have a certain thickness. On the other hand, when the block 10 is thickened, it will be difficult to configure the optical connector 100. Therefore, for example, as shown in FIG. 6, the reinforcement 30 is formed with a concave portion where the block 10 is to be arranged. In FIG. 6, an example is shown in which four openings 300 in which the blocks 10 are arranged are formed inside one recess formed in the reinforcement 30. FIG. 7 shows an example in which four blocks 10 with guide plates 60 are arranged on a circuit board 20 fixed to a reinforcement 30, respectively. In FIG. 7, the optical connector 100 or the electrical connector 200 is omitted, and the connection terminal 23 and the like disposed on the upper surface of the circuit board 20 are shown.

The size of the concave portion of each of the reinforcing members 30 or the number of blocks 10 arranged inside can be arbitrarily set according to the mechanical strength required by the reinforcing members 30 or the size of the blocks 10. By fixing the plurality of blocks 10 to the reinforcing member 30, it is possible to inspect the plurality of optical elements at the same time, or inspect the optical elements of a large area.

In addition, the capillary 15 is, for example, as shown in FIGS. 8 to 9, and is fixed by being pressed against the block 10 by the fixing column 16 interposed between the block 10 and the capillary 15. FIG. 9 is a plan view of the area A of FIG. 8. As shown in FIG. 10, the fixing column 16 is cylindrical, and an insertion hole into which the fixing column 16 is to be inserted is formed in the block 10. The insertion hole extends in the thickness direction of the block 10 parallel to the cavity into which the capillary 15 is inserted. That is, as shown in FIG. 11, an insertion hole 12 extending parallel to the cavity 11 is formed in the block 10 around the cavity 11 into which the capillary 15 is inserted. The insertion hole 12 is continuously formed along the longitudinal direction of the cavity 11, and the capillary 15 inserted into the cavity 11 comes into contact with the side surface of the fixing column 16 inserted into the insertion hole 12.

FIG. 12 is a cross-sectional view perpendicular to the thickness direction of the capillary 15. In the capillary tube 15, a through hole 150 is formed through which the optical connection end 101 penetrates, and a groove 151 fitted into the fixing column 16 is formed on the side surface in the thickness direction. After the capillary 15 is inserted into the cavity 11, the fixing column 16 is inserted into the insertion hole 12, thereby fixing the capillary 15 to the block 10. In the above, the example in which the capillary 15 is fixed to the block 10 by three fixing pillars 16 is shown.

The alignment of the capillary 15 and the block 10 is performed in the following manner, for example. The capillary 15 and the block 10 are provided on an auxiliary tool designed in advance to control the outer shape of the block 10 and the reference hole 152 formed in the capillary 15 to a predetermined accuracy. At this time, the reference hole 152 is inserted into the reference pin attached to the auxiliary tool to provide the capillary 15. After that, the capillary 15 is rotated and adjusted in such a manner that the position of the optical connector 100 and the outer shape of the block 10 fall within the design allowable range. When the outer shape of the block 10 and the position of the optical connector 100 are adjusted, the fixing column 16 is inserted to fix the capillary 15. After that, the block body 10 to which the capillary 15 is fixed is removed from the auxiliary tool.

(Other implementations)

As described above, although the present invention is described based on the implementation type, it should not be construed that the discussion and drawings constituting a part of this disclosure limit the present inventor. Those with ordinary knowledge in the technical field to which the present invention belongs should understand that various alternative implementation types, embodiments, and application techniques can be made from the disclosure. That is, the present invention naturally includes various embodiments and the like not described herein.

10‧‧‧ block

15‧‧‧Capillary

20‧‧‧ circuit board

21‧‧‧joint pad

22‧‧‧Alignment mark

23‧‧‧Connecting terminal

30‧‧‧Reinforcement

40‧‧‧Position adjustment mechanism

41‧‧‧tension spring

42‧‧‧Press spring

51‧‧‧First bolt

60‧‧‧Guide plate

70‧‧‧Guide pin

100‧‧‧Optical connector

101‧‧‧Optical connection end

200‧‧‧Electrical connector

201‧‧‧Electrical connection end

Claims (16)

A connection device used for inspection of a semiconductor element having an electric signal terminal transmitting an electric signal and an optical signal terminal transmitting an optical signal. The connecting device includes: an optical connector, which is optically connected to the aforementioned optical signal terminal; The electrical connector is electrically connected to the electrical signal terminal; the block body fixes the optical connection in a state where the optical connection end optically connected to the optical signal terminal of the optical connector is exposed on the main surface A circuit board for inserting the block and forming an electrical circuit electrically connected to the electrical connector; the electrical connector is provided on the circuit board. The connection device as described in item 1 of the patent application scope is provided on the substrate on which a plurality of the semiconductor elements are formed, and includes the light for simultaneously connecting the two or more semiconductor elements to the electrical signal terminal and the optical signal terminal Connector and the aforementioned electrical connector. The connection device as described in item 1 of the patent application scope further includes a capillary for fixing the optical connector in a state where the optical connector is penetrated; the capillary is embedded in the block. The connection device as described in item 3 of the patent application scope further includes a fixing post which is inserted into the insertion hole and contacts the capillary sideways to press the capillary against the block to fix it, The insertion hole extends parallel to the cavity of the block into which the capillary is inserted and is formed around the cavity. The connection device according to any one of claims 2 to 4, wherein the block system is mounted on the circuit board so as to be movable in a thickness direction perpendicular to the main surface; It is further provided with a position adjustment mechanism that adjusts the relative position of the block with respect to the circuit board. The connection device according to item 5 of the patent application scope, wherein the position adjustment mechanism includes: a plate-shaped tension spring that pulls the block toward one of the thickness directions; and a plate-shaped pressing spring that faces the The direction opposite to the pulling direction of the tension spring presses the block; the position of the thickness direction of the block is defined by the balance of the pulling force from the tension spring and the pressing force of the pressure spring. The connection device as described in item 6 of the patent application scope further includes a reinforcement member fixed to the circuit board and having a higher rigidity than the circuit board; the tension spring fixed to the block body elastically contacts the reinforcement member; The pressing spring fixed to the reinforcing member elastically contacts the block. The connection device as described in item 7 of the patent application scope further includes a guide plate disposed on the main surface of the block and through which the optical connector penetrates; a through hole provided in the guide plate is inserted and fixed to The guide pin of the aforementioned reinforcement. A manufacturing method of a connecting device, which is used for inspecting a semiconductor element having an electric signal terminal transmitting an electric signal and an optical signal terminal transmitting an optical signal; the manufacturing method of the connecting device includes the following steps: The step of fixing the optical connector to the block in a state where the optical connection end of the optical connector optically connected to the optical signal terminal is exposed on the main surface of the block; the main surface of the block becomes The step of mounting the aforementioned block on the circuit board by way of the exposed state; and The step of arranging the electrical connector on the circuit board in such a manner that the electrical connection end of the electrical connector is arranged at a predetermined position with reference to the position information of the optical connection end. The method for manufacturing a connection device as described in item 9 of the patent application range, wherein the step of installing the electrical connector on the circuit board includes the following stages; the position of the optical connection end is detected from the set position The stage of the amount of deviation; the stage of calculating the position of the electrical connection end with reference to the amount of deviation; and the electrical connector in such a manner that the electrical connection end is arranged at the position calculated with reference to the deviation It is provided at the stage of the aforementioned circuit board. The method for manufacturing a connection device as described in item 10 of the patent application scope processes the deviation amount statistically to calculate the position of the end of the electrical connection. The method for manufacturing a connection device according to any one of claims 9 to 11, wherein the capillary that fixes the optical connector in a state where the optical connector is penetrated is fixed to the block, Thereby, the optical connector is fixed to the block. According to the method of manufacturing a connection device described in item 12 of the patent application scope, a fixing column is inserted into an insertion hole, the side of the fixing column contacts the capillary, and the capillary is pressed against the block and fixed The insertion hole extends parallel to the cavity of the block into which the capillary is inserted and is formed around the cavity. The method for manufacturing a connection device as described in any one of items 9 to 11 of the patent application scope further includes the following steps: installing the block in such a way that it can move along the thickness direction perpendicular to the main surface The circuit board; a position adjusting mechanism that adjusts the relative position of the block with respect to the circuit board is fixed to the circuit board. According to the manufacturing method of the connection device described in item 14 of the patent application range, the position adjustment mechanism is constituted by a plate-shaped tension spring and a plate-shaped pressing spring, the plate-shaped tension spring is directed toward one side in the thickness direction Pull the block, the plate-shaped pressing spring presses the block in the opposite direction to the pulling direction of the pulling spring; the balance is provided by the pulling force from the pulling spring and the pressing force of the pressing spring The position in the thickness direction of the block. The method of manufacturing a connection device as described in item 15 of the patent application scope further includes the step of fixing a reinforcement member having a higher rigidity than the circuit board to the circuit board; and elastically contacting the tension spring fixed to the block The reinforcing member; the pressing spring fixed to the reinforcing member elastically contacts the block body.

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