JP7261404B2 - Manufacturing method of connecting device - Google Patents

Description

The present invention relates to a connection device used for inspecting characteristics of an object to be inspected.

Using silicon photonics technology, a semiconductor element (hereinafter referred to as an "optical device") having an electric circuit for propagating electrical signals and an optical circuit for propagating optical signals is formed on a silicon substrate or the like. In order to inspect the characteristics of optical devices in a wafer state, optical fibers or the like are used as optical connectors for connecting optical devices and inspection equipment.

For example, there is disclosed a method of acquiring the characteristics of an optical device to be inspected by bringing the tip of an optical fiber held in a probe body close to it (see Patent Document 1).

U.S. Patent Application Publication No. 2006/0008226A1

In optical device inspection, the optical device and the inspection apparatus are connected using a connection device that connects an electrical connector for propagating an electrical signal to the optical device and an optical connector for propagating an optical signal to the optical device. is effective. However, development of such a connection device has not progressed.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a connection device capable of connecting both an electrical connector for propagating an electrical signal and an optical connector for propagating an optical signal to an optical device, and a method for manufacturing the same.

According to another aspect of the present invention, there is provided a method of manufacturing a connection device used for testing a semiconductor device having an electrical signal terminal through which an electrical signal propagates and an optical signal terminal through which an optical signal propagates, comprising: an optical signal terminal; fixing the optical connector to the block with the optical connection end portion of the optical connector to be optically connected exposed on the main surface of the block; Attaching the block to the circuit board and placing the electrical contact on the circuit board such that the electrical contact end of the electrical contact is positioned at a predetermined position with reference to the positional information of the optical contact end. and the step of installing the electrical connector on the circuit board includes the step of detecting the amount of deviation of the position of the optical connection end from the set position; A connection device comprising the steps of: calculating the position of an end; and installing an electrical connector on a circuit board so that the electrical connection end is arranged at the position calculated with reference to the amount of deviation. A manufacturing method is provided.

According to the present invention, it is possible to provide a connecting device capable of connecting both an electrical connector for propagating an electrical signal and an optical connector for propagating an optical signal to an optical device, and a manufacturing method thereof.

It is a mimetic diagram showing the composition of the connecting device concerning the embodiment of the present invention. FIG. 4 is a schematic perspective view showing an example of a position adjustment mechanism of the connection device according to the embodiment of the invention; It is a schematic diagram for demonstrating the manufacturing method of the connection device which concerns on embodiment of this invention (the 1). It is a schematic diagram for demonstrating the manufacturing method of the connection device which concerns on embodiment of this invention (part 2). FIG. 2 is a schematic plan view showing an example of arrangement of optical connectors and electrical connectors of the connection device according to the embodiment of the present invention; FIG. 4 is a schematic perspective view showing an example of the stiffener structure of the connection device according to the embodiment of the present invention; It is a perspective view showing composition of a connection device concerning an embodiment of the present invention. FIG. 4 is a schematic perspective view showing a structural example in which a block and a capillary of the connection device according to the embodiment of the present invention are fixed; FIG. 9 is a plan view showing region A in FIG. 8; FIG. 9 is a perspective view showing the shape of a fixing pillar in the configuration example shown in FIG. 8; FIG. 9 is a plan view showing the shape of a block in the configuration example shown in FIG. 8; FIG. 9 is a cross-sectional view perpendicular to the thickness direction, showing the shape of the capillary of the configuration example shown in FIG. 8;

Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the thickness ratio of each part is different from the actual one. In addition, it is a matter of course that there are portions with different dimensional relationships and ratios between the drawings. The embodiments shown below exemplify devices and methods for embodying the technical idea of the present invention. is not specific to

The connection device according to the embodiment of the present invention shown in FIG. 1 is used for testing an optical device having an electrical signal terminal through which an electrical signal propagates and an optical signal terminal through which an optical signal propagates. Although the optical device is not particularly limited, a silicon photonics chip, a VCSEL, or the like can be assumed. The connection device shown in FIG. 1 includes an optical connector 100 that optically connects with an optical signal terminal of an optical device, and an electrical connector 200 that electrically connects with an electrical signal terminal of the optical device. The optical connector 100 and the electrical connector 200 are arranged close to each other at a position corresponding to the distance between the optical signal terminal and the electrical signal terminal of one optical device. When the optical connector 100 is optically connected to the optical signal terminal, the optical signal propagates between the optical signal terminal and the optical connector 100 . Normally, the optical signal terminal and the optical connector 100 are optically connected in a non-contact state close to each other. The timing at which the optical connector 100 is connected to the optical signal terminal and the timing at which the electrical connector 200 is connected to the electrical signal terminal may be the same or a time difference may occur. The point is that both the optical connector 100 and the electrical connector 200 can be simultaneously connected to the optical device.

The connection device functions as a probe card that connects the inspection device with the optical device to be inspected. Although not shown, the optical device to be inspected is placed in the connection device with the surface on which the optical signal terminal and the electrical signal terminal (hereinafter collectively referred to as "signal terminals") are directed downward in FIG. placed opposite to. When measuring the optical device, the optical connection end 101 of the optical connector 100 is optically connected to the optical signal terminal of the optical device, and the electrical connection end 201 of the electrical connector 200 is connected to the electrical signal terminal of the optical device. Connect electrically. As a result, for example, an electrical signal is input to the optical device from the electrical connection end portion 201 of the electrical connector 200, and an optical signal output from the optical device is input to the optical connection end portion 101 of the optical connector 100. , the optical signal is detected by a measuring device such as a tester (not shown).

An optical fiber or the like is preferably used for the optical connector 100 . For example, an optical signal enters from an optical signal terminal of an optical device to an end face of an optical fiber arranged near the optical signal terminal. However, an optical component having an optical waveguide can be used for the optical connector 100 without being limited to the optical fiber. An optical waveguide such as an optical fiber is formed with a refractive index equivalent to that of an optical device. For example, in order to correspond to a silicon photonics device, the optical connector on the probe card side is also made of a material matching the refractive index of silicon.

A probe or the like made of a conductive material is preferably used as the electrical connector 200 . For example, a cantilever type probe is used for the electrical connector 200 . However, the type of probe that can be used for the electrical connector 200 is not limited to the cantilever type, and any type of probe can be used.

As shown in FIG. 1, the connection device includes a block 10 for fixing the optical connector 100 with the optical connection end portion 101 of the optical connector 100 exposed on the main surface (first main surface), and has a circuit board 20 on which is mounted. An electric circuit electrically connected to the electric connector 200 is formed on the circuit board 20 . A printed circuit board (PCB board) or the like is preferably used for the circuit board 20 . The electrical connector 200 is installed on the circuit board 20 while being electrically connected to a joint pad 21 provided on the circuit board 20 .

The joint pads 21 are connected to connection terminals 23 arranged on the circuit board 20 via an electric circuit (not shown) formed on the circuit board 20 . The connection terminals 23 are arranged on the main surface of the circuit board 20 opposite to the main surface on which the electrical connectors 200 are installed. The connection terminal 23 is electrically connected to the inspection device.

The other end of the optical connector 100 optically coupled to the optical connection end 101 via the optical waveguide is connected to the inspection device. The optical connector 100 is connected to an inspection device via a component such as an optical connector. At this time, the optical signal may be converted into an electrical signal according to the specifications of the inspection device, or the optical signal may be directly input to the inspection device.

The optical connector 100 and the electrical connector 200 are installed in the connection device with a predetermined positional accuracy so that they are accurately connected to the signal terminals of the optical device to be inspected during inspection. That is, when the relative positional relationship between the optical connection end portion 101 of the optical connector 100 and the electrical connection end portion 201 of the electrical connector 200 is within a predetermined range, and the connection device and the optical device are aligned. , the optical connector 100 and the electrical connector 200 are accurately connected to the signal terminals of the optical device. Here, "accurately connecting" means connecting the optical connector 100 and the electrical connector 200 to the signal terminals of the optical device to be inspected so as to obtain a predetermined measurement accuracy.

Regarding the positions of the electrical connector 200 and the optical connector 100, there is an allowable range of positions (hereinafter referred to as "optimal positions") where predetermined measurement accuracy can be obtained by connecting to the signal terminals of the optical devices. The permissible range of the optimum position is a range in which a signal can be obtained with desired accuracy and intensity if the electrical connector 200 and the optical connector 100 are positioned within that range. This allowable range is appropriately set according to the accuracy required for inspection, the performance of the connector, and the like. For example, when an optical fiber is used for the optical connector 100, the allowable range of the position of the optical connector 100 is set according to the numerical aperture NA of the optical fiber.

The allowable range of the optimum position of the optical connector 100 is narrower than the allowable range of the optimum position of the electrical connector 200 . In the manufacture of the connection device shown in FIG. 1, as will be described later, after alignment of the optical connector 100 with a small allowable range is performed, the position of the optical connector 100 is adjusted to match the position of the electrical connector 200. I do.

In the connection device shown in FIG. 1 , the optical connector 100 is fixed to the block 10 by fitting the capillary 15 for fixing the optical connector 100 through the block 10 . That is, a through hole is formed in the capillary 15 with a required positional accuracy, and the optical connector 100 inserted into this through hole is fixed. Thereby, the optical connector 100 can be installed in the block 10 with a predetermined positional accuracy.

Any number of through-holes may be formed in the capillary 15 . For example, if one optical device has four optical signal terminals, a capillary 15 having four through holes is prepared for each optical device. Alternatively, when one optical device has one optical signal terminal, the capillary 15 having four through holes may be prepared for every four optical devices.

Note that if the optical connector 100 can be placed in the block 10 with the required positional accuracy, the capillary 15 may not be used. For example, the block 10 is divided into two parts, and V-shaped grooves for arranging the optical connectors 100 are formed in the mating surfaces of the divided parts. The V-shaped grooves are formed so that openings are formed on the mating surfaces and the openings are aligned when the divided portions are overlapped. The optical connector 100 can be fixed inside the block 10 by overlapping the two parts with the optical connector 100 arranged in the V-shaped groove. V-shaped grooves are easier to process than forming through-holes, and can increase dimensional accuracy. A V-shaped groove may be formed only in one portion of the divided block 10 .

A stiffener 30 having higher rigidity than the circuit board 20 is fixed to the circuit board 20 . The stiffener 30 secures the mechanical strength of the connecting device so that the circuit board 20 does not bend, and is used as a support for fixing each component of the connecting device.

A guide plate 60 through which the optical connector 100 penetrates is arranged on the first main surface of the block 10 . A guide pin 70 fixed to the stiffener 30 is inserted into a through hole provided in the guide plate 60 . This defines the position of the guide plate 60 . The guide plate 60 is provided with an opening area so that the alignment marks 22 formed on the circuit board 20 can be visually observed. By arranging the guide plate 60 on the first main surface of the block 10 , it is possible to easily confirm the position of the alignment mark 22 used when installing the block 10 on the circuit board 20 .

In the connection device shown in FIG. 1, the block 10 is attached to the circuit board 20 so as to be movable along the direction perpendicular to the first main surface (hereinafter referred to as "thickness direction"). That is, block 10 is not fixed to circuit board 20 . A gap is provided between the guide plate 60 and the circuit board 20 . Therefore, the block 10 can move in the thickness direction with respect to the stiffener 30 and the circuit board 20 fixed to the stiffener 30 . In addition, by providing a gap between the guide plate 60 and the circuit board 20 , it is possible to suppress the influence of the uneven surface of the circuit board 20 from reaching the guide plate 60 .

The connection device shown in FIG. 1 includes a position adjustment mechanism 40 that adjusts the relative position of the block 10 with respect to the circuit board 20. As shown in FIG. The position adjustment mechanism 40 is composed of a plate-shaped extension spring 41 that pulls the block 10 in one direction in the thickness direction, and a plate-shaped compression spring 42 that pushes the block 10 in the direction opposite to the direction in which the extension spring 41 is pulled. ing. The position of the block 10 in the thickness direction is defined by the balance between the pulling force F1 by the pull spring 41 and the pushing force F2 by the compression spring 42 . In order to stabilize the block 10 at a predetermined position, the elastic forces of the tension spring 41 and the compression spring 42 are set in advance.

As shown in FIG. 1, the central portion of the extension spring 41 is fixed to the second main surface of the block 10 facing the first main surface, and both ends of the extension spring 41 are pressed against the stiffeners 30 to elastically contact each other. there is More specifically, as shown in FIG. 2 , a first bolt 51 passes through the central portion of the extension spring 41 and is fixed to the second main surface of the block 10 .

On the other hand, as shown in FIG. 2, one end of the compression spring 42 is fixed to the stiffener 30 by the second bolt 52, and the other end is pressed against the second main surface of the block 10 to make elastic contact. ing. The extension spring 41 and the compression spring 42 are fixed to the circuit board 20 via the stiffener 30 .

The position of the block 10 in the thickness direction can also be finely adjusted by, for example, screwing the second bolt 52 to the stiffener 30 and adjusting the tightening method. Thus, the combination of the tension spring 41 and the compression spring 42 functions as a position adjustment mechanism that moves the block 10 relative to the stiffener 30 and the circuit board 20 .

A method of manufacturing the connection device shown in FIG. 1 will be described below. A case in which an optical fiber is used for the optical connector 100 and a cantilever probe is used for the electrical connector 200 will be described below as an example.

First, an optical fiber whose end is terminal-treated is prepared as the optical connector 100 . "Terminal processing" includes lens processing, polishing, coating stripping processing, and processing for attaching an optical connector to the other end of the end to be the optical connection end 101 .

Then, as shown in FIG. 3, the optical connector 100 is installed on the block 10 so that the optical connection end portion 101 is exposed on the first main surface of the block 10 . For example, the capillary 15 through which the optical connector 100 is passed is fixed to the block 10 . At this time, the amount of protrusion of the optical connector 100 was adjusted so that the optical connection end portion 101 was exposed from the first main surface of the block 10 at a predetermined height, and the optical connector 100 was installed at a predetermined position. After confirming that, the capillary 15 is fixed.

Next, the guide plate 60 is attached to the first main surface of the block 10 . Then, the block 10 is attached to a predetermined position on the circuit board 20 . For example, the block 10 is inserted into a cavity formed at a predetermined position on the circuit board 20 . At this time, the block 10 is attached to the circuit board 20 while being aligned using the alignment marks 22 formed on the circuit board 20 as marks. Positioning the block 10 and the circuit board 20 is facilitated by arranging the guide plate 60 provided with the opening area for exposing the alignment mark 22 on the block 10 .

Then, the stiffener 30 is fixed to the circuit board 20 . At this time, the position of the guide plate 60 is set by the guide pin 70 fixed to the stiffener 30, as shown in FIG.

Next, as shown in FIG. 2, the tension spring 41 and the compression spring 42 are attached to the block 10 and the stiffener 30 . Then, the positions of the pull spring 41 and the push spring 42 are fixed. At this time, not only the adjustment of the position in the thickness direction but also the adjustment in the direction perpendicular to the thickness direction is performed. The reference for position adjustment is the main surface of the circuit board 20 .

Next, the electrical connector 200 is installed on the circuit board 20 . At this time, the positional information of the optical connector 100 is referenced to position the electrical connector 200 as follows.

First, the positional information of the optical connector 100 is analyzed, and the amount of deviation (hereinafter simply referred to as "the amount of deviation") of the position of the optical connection end portion 101 from the preset position is detected. Then, the optimum position of the electrical connection end portion 201 of the electrical connector 200 is calculated with reference to the positional deviation amount of the optical connection end portion 101 .

For example, by comparing the predetermined set coordinates of the optical connection end 101 of the optical connector 100 with the coordinates of the optical connection end 101 of the optical connector 100 actually installed in the block 10, the optical connection is determined. A displacement amount of the position of the end portion 101 is detected. Then, the coordinates of the position of the electrical connection end 201 are set so that the positional deviation of the electrical connection end 201 from predetermined set coordinates is the same as the positional deviation of the optical connection end 101 . decide.

At this time, the position of the electrical connection end portion 201 of the electrical connector 200 may be determined by statistically processing the amount of deviation. For example, a histogram of variation in the amount of deviation is created, and the average value and variation (deviation) of the amount of deviation are calculated. Then, the position of the electrical connection end portion 201 of the electrical connector 200 is calculated so as to have a predetermined relative position with respect to the optical connection end portion 101 of the optical connector 100 .

After that, the electrical connector 200 is joined to the joint pad 21 of the circuit board 20 so that the electrical connection end portion 201 is arranged at the calculated position. With the above, the connection device shown in FIG. 1 is completed.

FIG. 5 shows an example of positions of the optical connection end 101 of the optical connector 100 and the electrical connection end 201 of the electrical connector 200 . In the example shown in FIG. 5, the electrical connection ends 201 of the four electrical connectors 200 are arranged so as to pair with the optical connection ends 101 of the four optical connectors 100, respectively. As a result, four optical devices, for example, having one electrical signal terminal and one optical signal terminal as a pair, can be tested continuously or simultaneously.

In this way, it is possible to provide a connecting apparatus having optical connectors 100 and electrical connectors 200 for connecting two or more optical devices to signal terminals at the same time, corresponding to inspection of a wafer on which a plurality of optical devices are formed. can. Alternatively, an optical device having four optical signal terminals and four electrical signal terminals can be tested using four optical connectors 100 and four electrical connectors 200 . As a result, the optical signals of a plurality of optical devices can be collectively collected and measured, so that the efficiency of inspection can be improved and the inspection time can be shortened.

By setting the electrical connector 200 on the circuit board 20 with reference to the positional information of the optical connector 100 as described above, the relative positional relationship between the optical connection end portion 101 and the electrical connection end portion 201 can be determined. The positional accuracy can be kept within the desired range. As a result, the optical connector 100 and the electrical connector 200 can be simultaneously connected to the signal terminals of the optical device with high accuracy. As a result, accurate measurement of optical devices becomes possible.

Note that the bonding pads 21 and the alignment marks 22 are preferably formed simultaneously in the same process steps when the circuit board 20 is formed. Thereby, the accuracy of the relative positions of the bonding pads 21 and the alignment marks 22 can be increased according to the manufacturing accuracy of the process steps. As a result, when the alignment mark 22 is used for alignment, the bonding pad 21 can also be aligned with high accuracy.

In order to obtain the mechanical strength of the connection device, the stiffener 30 is formed with a certain degree of thickness. On the other hand, if the block 10 is thickened, it becomes difficult to arrange the optical connector 100 . For this reason, as shown in FIG. 6, for example, the stiffener 30 is formed with a recess in which the block 10 is arranged. FIG. 6 shows an example in which four openings 300 are formed inside one recess formed in the stiffener 30, in which the blocks 10 are respectively arranged. FIG. 7 shows an example in which four blocks 10 each having a guide plate 60 are arranged on a circuit board 20 fixed to a stiffener 30 . In FIG. 7, illustration of components such as the optical connector 100, the electrical connector 200, and the connection terminals 23 arranged on the upper surface of the circuit board 20 is omitted.

The size of each concave portion of the stiffener 30 and the number of blocks 10 arranged therein can be arbitrarily set according to the mechanical strength required of the stiffener 30 and the size of the blocks 10 . By fixing a plurality of blocks 10 to the stiffener 30, it is possible to inspect a plurality of optical devices at the same time or to inspect a large-area optical device.

8 and 9, the capillary 15 is pressed against the block 10 and fixed by a fixing column 16 inserted between the block 10 and the capillary 15. As shown in FIGS. 9 is a plan view of area A in FIG. 8. FIG. As shown in FIG. 10, the fixing pillar 16 is cylindrical, and the block 10 is formed with an insertion hole into which the fixing pillar 16 is inserted. The fitting holes extend in the thickness direction of the block 10 parallel to the cavities in which the capillaries 15 are fitted. That is, as shown in FIG. 11, a fitting hole 12 extending parallel to the cavity 11 is formed in the block 10 around the cavity 11 into which the capillary 15 is fitted. The fitting hole 12 is formed continuously along the longitudinal direction of the cavity 11, and the capillary 15 fitted into the cavity 11 and the side surface of the fixing column 16 fitted into the fitting hole 12 are in contact with each other.

FIG. 12 shows a cross-sectional view perpendicular to the thickness direction of the capillary 15 . The capillary 15 is formed with a through hole 150 through which the optical connection end portion 101 penetrates, and a groove 151 for fitting the fixing column 16 is formed in the side surface thereof in the thickness direction. After fitting the capillary 15 into the cavity 11 , the capillary 15 is fixed to the block 10 by fitting the fixing column member 16 into the fitting hole 12 . An example in which the capillaries 15 are fixed to the block 10 by the three fixing pillars 16 has been described above.

Alignment of the capillary 15 and the block 10 is performed, for example, as follows. The capillary 15 and the block 10 are set in a jig designed in advance so that the outer shape of the block 10 and the reference hole 152 formed in the capillary 15 fit within a predetermined accuracy. At this time, the capillary 15 is set by inserting the reference hole 152 into the reference pin attached to the tool. After that, the capillary 15 is rotated and adjusted so that the position of the optical connector 100 and the outer shape of the block 10 are within the design tolerance. After the outer shape of the block 10 and the position of the optical connector 100 are adjusted, the fixing column 16 is inserted to fix the capillary 15 . After that, the block 10 to which the capillary 15 is fixed is removed from the tool.

(Other embodiments)
Although the present invention has been described by way of embodiments as described above, the discussion and drawings forming part of this disclosure should not be understood to limit the present invention. Various alternative embodiments, implementations and operational techniques will become apparent to those skilled in the art from this disclosure. That is, the present invention naturally includes various embodiments and the like that are not described here.

DESCRIPTION OF SYMBOLS 10... Block 15... Capillary 20... Circuit board 21... Joint pad 30... Stiffener 40... Position adjustment mechanism 41... Pull spring 42... Push spring 60... Guide plate 70... Guide pin 100... Optical connector 101... Optical connection end 200... Electrical connector 201... Electrical connection end

Claims (7)

A method for manufacturing a connection device used for testing a semiconductor device having an electrical signal terminal for propagating an electric signal and an optical signal terminal for propagating an optical signal,
fixing the optical connector to the block with the optical connection end of the optical connector to be optically connected to the optical signal terminal exposed on the main surface of the block;
attaching the block to a circuit board such that the main surface of the block is exposed;
referring to the positional information of the optical connection end and installing the electrical contact on the circuit board so that the electrical connection end of the electrical contact is arranged at a predetermined position;
installing the electrical connector on the circuit board,
detecting the amount of deviation of the position of the optical connection end from a set position;
calculating the position of the electrical connection end with reference to the amount of deviation;
and installing the electrical connector on the circuit board such that the electrical connection end portion is arranged at the position calculated with reference to the deviation amount. Method. 2. The method of manufacturing a connection device according to claim 1 , wherein the position of the electrical connection end is calculated by statistically processing the amount of deviation. 3. The method of manufacturing a connecting device according to claim 1 , wherein the optical connector is fixed to the block by fixing a capillary for fixing the optical connector in a state in which the optical connector is passed through the block. . A fixing post is inserted into an insertion hole formed around a cavity of the block in which the capillary is fitted and extends parallel to the cavity, and the side surface of the fixing post is brought into contact with the capillary. 4. The manufacturing method of the connection device according to claim 3 , wherein the is pressed against the block and fixed. attaching the block to the circuit board so as to be movable along a thickness direction perpendicular to the main surface;
5. The manufacturing of the connecting device according to any one of claims 1 to 4, further comprising fixing a position adjusting mechanism to the circuit board for adjusting the relative position of the block with respect to the circuit board. Method. the position adjustment mechanism,
a plate-like extension spring that pulls the block in one of the thickness directions;
and a plate-shaped compression spring that pushes the block in a direction opposite to the pulling direction of the extension spring,
6. The method of manufacturing a connecting device according to claim 5 , wherein the position of the block in the thickness direction is defined by the balance between the pulling force of the pull spring and the pushing force of the compression spring. further comprising affixing a stiffener to the circuit board that is stiffer than the circuit board;
bringing the extension spring fixed to the block into elastic contact with the stiffener;
7. The method of manufacturing a connection device according to claim 6 , wherein the compression spring fixed to the stiffener is brought into elastic contact with the block.

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