TWI661941B - Apparatus and method for manufacturing fine patterned film - Google Patents

Abstract

According to an embodiment, a fine-patterned film manufacturing apparatus is disclosed, including: a frame structure; and a film supply unit including a supply roller mounted on a front side of the frame structure, and wound on the supply roller The base film is supplied to the rear; a belt-type mold portion is rotatably mounted on one side of the frame structure, and has a peripheral portion formed with a fine pattern in an overcast manner; a resin liquid supply portion is mounted to the belt-type mold portion On the upper side, a polydimethylsiloxane resin liquid is supplied and coated on the outer peripheral portion; the resin liquid removing portion is mounted on the upper side of the belt-shaped mold portion and is in a state of being in close contact with the engraved portion of the outer peripheral portion. Removing the polydimethylsiloxane resin solution coated on the engraved portion of the outer peripheral portion; an embossing portion, which is in close contact with the upper portion of the base film supplied from the film supply portion and the belt mold portion, The polydimethylsiloxane resin solution applied on the engraved portion of the outer peripheral portion was transferred onto the upper surface of the base film, and the polydimethyl group with a fine pattern transferred onto the upper surface of the base film was transferred. Silicone resin liquid junction Heat is applied to the structure to cure the finely patterned polydimethylsiloxane resin liquid structure; and a film release section including a recovery roller mounted on the rear side of the frame structure, so that the base film The fine patterned film composed of the double structure of the cured polydimethylsiloxane resin liquid structure with the fine pattern is demolded from the tape-type mold part, and wound on the recovery roll.

Description

Equipment and method for manufacturing fine patterned film

The present invention relates to a device and method for manufacturing a finely patterned film, and more particularly, to a device and method for manufacturing a finely patterned film including a polydimethylsiloxane resin liquid structure with a fine pattern. .

In the MEMS process, as a thermosetting resin often used in cell experiments and microfluidics experiments, polydimethylsiloxane has a molecular weight of 162.38, a melting point and a boiling point of -40 to 50 ° C and 205 ° C, respectively. Transparent material, low surface energy, elastic polymer (elastomer) that is permeable to various liquids and vapors.

Step coverage is excellent, and it can stably adhere to a relatively wide area of the substrate. It not only has biological affinity properties that can be used for cell experiments, but also has low acoustic impedance. Compared with ordinary UV curable resins, it has advantages Materials for various experimental properties are used in a variety of fields.

A silicon resin, which is a polymer having a silicon-oxygen bond as a main axis, is reacted with methyl chloride (CH ₃ Cl) in a crystalline form to synthesize dichlorodimethylsilane. If hydrolyzed, it will form a siloxane bond . The polydimethylsiloxane resin thus produced is used in many fields such as micro-channel production, dry adhesive production, and sound-absorbing material production, and thus must be mass-produced.

Generally speaking, polydimethylsiloxane resin is a manufacturing process that uses a silicone elastic polymer base (silicone Elastomer base) and a curing agent and is cured by an oven (70 ° C). At this time, It takes about 1 hour or more until complete curing is achieved.

Unlike UV-curable resins, which require only a few seconds to tens of seconds to fully cure, polydimethylsiloxane resins require curing time of about 1 hour or more due to their unique characteristics. Therefore, it is difficult to continuously and quickly Production, making it extremely difficult to manufacture according to the requirements of manufacturers that need mass production.

In the past, a method of directly coating a polydimethylsiloxane resin (resin) on a film surface or spraying or coating with a sprayer has a tendency of uneven sample thickness and a slightly thicker residual layer after the imprint process, naturally Will adversely affect the use of the results or subsequent processes.

In order to solve this problem, the fine patterned film manufacturing apparatus of one embodiment supplies and applies polydimethylsiloxane in advance to the outer peripheral portion of the tape-type mold portion patterned in a negative manner by the resin liquid supply portion. In the alkane resin liquid, the polydimethylsiloxane resin liquid applied to the male engraved portion of the outer peripheral portion is removed by the resin liquid removing portion, and the polydimethylsiloxane resin liquid applied to the male engraved portion of the outer peripheral portion is removed. After applying pressure, a polydimethylsiloxane resin coating layer is formed on the outer peripheral portion of the tape mold portion, and then the polydimethylsilicon is applied to the outer peripheral portion of the tape mold portion by the embossing portion. The structure of the oxane resin liquid is transferred to the upper surface of the base film and cured, and a fine patterned film composed of a dual structure of a polydimethylsiloxane resin liquid structure with a fine pattern and the base film can be manufactured.

That is, the fine patterned film manufacturing apparatus of one embodiment uses the resin liquid supply part and the resin liquid removal part to remove the resin liquid applied to the male engraved portion of the belt-shaped outer peripheral portion, and only applies polydimethylsiloxane to the female engraved portion The alkane resin liquid is coated to a uniform thickness, thereby reducing unnecessary resin liquid consumption and reducing the thickness of the residual layer.

Therefore, the fine patterned film manufacturing equipment of one embodiment reduces the amount of resin liquid that is unnecessarily over-supplied in the coating process in the original method, so that the area of the pattern that can be produced is greatly increased relative to the amount of resin liquid consumed. It can be quite efficient in terms of saving costs and using resources. In addition, the fine-patterned film manufacturing equipment of one embodiment uniformly and thinly applies the resin liquid to the belt-type mold portion, thereby reducing the thickness of the residual layer. Compared with the original method, the micro / nanolite can be more stably reproduced. Meter structure. On the other hand, the fine-patterned film manufacturing apparatus of an embodiment quantifies the coating process that was originally performed inaccurately, so that for a fine-patterned film as a result of the process before the imprint lithography process, it is predicted that The thickness of the dimethylsiloxane resin liquid structure.

In addition, in the fine-patterned film manufacturing equipment of an embodiment, the belt-type mold part is a mold part that has been surface-treated with trichloro (1H, 1H, 2H, 2Hperfluorooctyl) silan, and is coated on the belt The polydimethylsiloxane resin liquid structure at the outer peripheral portion of the mold portion can be effectively released from the belt-type mold portion and transferred to the upper surface of the base film.

On the other hand, the fine-patterned film manufacturing equipment of an embodiment further includes an adhesive film connected to the upper surface of the base film by a dry-adhesion method. The dimethylsiloxane resin liquid structure is transferred to the upper surface of the adhesive film and cured, and a triple structure composed of a base film, an adhesive film, and a polydimethylsiloxane resin liquid structure with a fine pattern can be manufactured. Finely patterned film. At this time, on the finely patterned film, the base film and the adhesive film can be reversibly separated. Therefore, the dual structure of the adhesive film and the cured polydimethylsiloxane resin liquid structure can be separated from the base film. Therefore, the cured polydimethylsiloxane resin liquid structure with fine patterns can be separated from the base film and used for various purposes.

The fine patterned film manufacturing apparatus according to an embodiment may include: a frame structure; and a film supply unit including a supply roller installed on a front side of the frame structure, and supplying a base film wound on the supply roller to the rear; A belt-type mold portion is rotatably mounted on one side of the frame structure, and includes an outer peripheral portion formed with a fine pattern in an engraved manner; a resin liquid supply portion is mounted on the upper side of the belt-shaped mold portion, and is supplied from the outer peripheral portion. 1. Coating a polydimethylsiloxane resin liquid; a resin liquid removing portion is installed on the upper side of the belt-type mold portion, and is removed and applied to the outer periphery in a state of being in close contact with the engraved portion of the outer periphery portion. Polydimethylsiloxane resin solution in the engraved portion of the coating portion; an embossing portion, which adheres the upper surface of the base film supplied from the film supply portion to the belt-type mold portion, and applies the coating to the outer peripheral portion The polydimethylsiloxane resin liquid of the engraved portion is transferred to the upper surface of the base film, and the structure of the polydimethylsiloxane resin liquid with a fine pattern transferred to the upper surface of the base film is transferred. Apply heat to make the band fine The polydimethylsiloxane resin liquid structure is cured; and a film release section including a recovery roller mounted on the rear side of the frame structure, so that the base film and the cured finely patterned The finely patterned film composed of the double structure of the polydimethylsiloxane resin liquid structure is demolded from the belt-type mold part and wound on the recovery roll.

The tape mold portion of one embodiment may be made of polyurethane acrylate (PUA), and the tape mold portion of one embodiment may be surface-treated with trichloro (1H, 1H, 2H, 2Hperfluorooctyl) silan. .

The base film supplied from the film supply unit of an embodiment may further include an adhesive film connected to the upper surface of the base film by a dry adhesion method.

The embossing part of an embodiment can make the upper surface of the adhesive film closely contact the tape mold part, and transfer the polydimethylsiloxane resin liquid applied to the engraved part of the outer peripheral part to the adhesive. On the upper surface of the film, heat is applied to the polydimethylsiloxane resin liquid structure with a fine pattern transferred to the upper surface of the adhesive film to make the polydimethylsiloxane liquid structure with a fine pattern The finely patterned film may be composed of a cured triple structure of the finely patterned polydimethylsiloxane resin liquid structure, the adhesive film, and the base film.

On the finely patterned film of an embodiment, the dual structure of the adhesive film and the polydimethylsiloxane resin liquid structure can be separated from the base film.

The resin liquid removing portion of one embodiment may pressurize a polydimethylsiloxane resin liquid applied to the engraved portion of the outer peripheral portion of the belt-type mold portion.

The resin liquid removal part of one embodiment can be attached to the lower surface of this resin liquid supply part.

The polydimethylsiloxane resin solution supplied by the resin solution supply section of an embodiment may be mixed with a silicone elastic polymer base (curing agent) and a curing agent at a ratio of 10: 1 through a degassing process. form.

The base film supplied by the film supply section of one embodiment may be a heat-resistant film.

The embossing section of an embodiment may include a plurality of rotating rollers, and the plurality of rotating rollers are installed at a predetermined interval and at the same height on the frame structure on the rear side of the supply roller, so that the base film supplied by the supply roller is a predetermined The section constitutes a horizontal plane and moves; the belt-shaped mold part can be rolled around the plurality of rotating rollers to realize rotation.

The embossing portion of an embodiment may include a heating plate spaced at a predetermined interval on a lower side of the belt-type mold portion, and the polydimethyl silicon coated on the engraved portion of the outer peripheral portion of the belt-type mold portion. The oxyalkane resin liquid can be cured by the radiant heat released by the heating plate while the upper surface of the base film is transferred into the shape of a fine pattern.

The heating plate of one embodiment may release radiant heat above 100 ° C.

A fine patterned film manufacturing method according to an embodiment provides a fine patterned film manufacturing method including a step of supplying a base film wound on a supply roll to one side, and an outer peripheral portion having a fine pattern formed in an overprint manner. A step of supplying and coating a polydimethylsiloxane resin solution on the outer peripheral portion of the belt-shaped mold portion; and removing the polydimethylsiloxane resin liquid applied on the engraved portion of the outer peripheral portion. Step: The upper surface of the base film is in close contact with the belt-shaped mold portion, and the polydimethylsiloxane resin solution applied to the engraved portion of the outer peripheral portion is transferred to the upper surface of the base film. A step of applying a fine pattern polydimethylsiloxane resin liquid structure transferred to an upper surface of the base film to cure the fine pattern polydimethylsiloxane resin liquid structure; and A step of releasing the fine patterned film composed of the double structure of the base film and the cured polydimethylsiloxane resin liquid structure with the fine pattern from the tape mold portion and rolling it on a recovery roll.

The tape mold portion of one embodiment may be made of polyurethane acrylate (PUA), and the tape mold portion of one embodiment may be surface-treated with trichloro (1H, 1H, 2H, 2Hperfluorooctyl) silan. .

The base film according to an embodiment may further include an adhesive film connected to the upper surface of the base film by a dry adhesion method.

In the method for manufacturing a finely patterned film according to an embodiment, the step of forming a polydimethylsiloxane resin liquid structure with a fine pattern is the step of forming an upper surface of the adhesive film and the tape mold portion. Adhere tightly, transfer the polydimethylsiloxane resin solution applied to the engraved portion of the outer peripheral portion onto the upper surface of the adhesive film, and apply fine pattern polymerization to the upper surface of the adhesive film. Heat is applied to the dimethylsiloxane resin liquid structure to cure the polydimethylsiloxane liquid structure with fine pattern; the fine patterned film may be cured by the cured polydimethyl silicon with fine pattern The triple structure of the silicone resin liquid structure, the adhesive film, and the base film.

On the finely patterned film of an embodiment, the dual structure of the adhesive film and the polydimethylsiloxane resin liquid structure can be separated from the base film.

In the method for manufacturing a fine-patterned film according to an embodiment, the step of removing the polydimethylsiloxane resin solution applied to the male engraved portion of the outer peripheral portion may further include: treating the female engraved portion applied to the outer peripheral portion. Step of pressurizing the polydimethylsiloxane resin solution.

The polydimethylsiloxane resin solution according to an embodiment may be formed by mixing a silicone resin elastic polymer base (curing agent) with a curing agent at a ratio of 10: 1, and forming the polydimethylsiloxane fluid through a degassing process.

In the method for manufacturing a finely patterned film according to an embodiment, the step of applying heat to cure the polydimethylsiloxane resin solution with a fine pattern may include: providing a partition on a lower side of the tape-shaped mold portion; The polydimethylsiloxane resin liquid coated on the engraved portion of the outer peripheral portion of the belt-shaped mold portion with a predetermined interval heating plate is transferred to a fine pattern shape on the upper surface of the base film. At the same time, it is cured by the radiant heat of 100 ° C. or higher released by the heating plate.

The present invention can be applied with various modifications and can have various embodiments. Specific embodiments are exemplarily illustrated in the drawings, and will be described in detail in the detailed description. However, this is not to limit the present invention to a specific embodiment, and it should be understood to include all transformations, equivalents, and alternatives included in the idea and technical scope of the present invention.

The first and second terms can be used to describe various constituent elements, but the constituent elements are not limited by the terms. The terminology is used only for the purpose of distinguishing one constituent element from another.

The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting. As long as the difference is not clearly expressed in the theory of art, the expression of the singular includes the expression of the plural. In this application, terms such as "including" or "having" should be understood as designating the existence of features, numbers, steps, actions, constituent elements, parts, or combinations thereof described in the description, without precluding one or The existence or additional possibility of more than one other feature, number, step, action, constituent element, part or combination thereof.

Hereinafter, various embodiments will be described in detail with reference to the drawings. In describing with reference to the drawings, the same or corresponding constituent elements are given the same reference numerals, and repeated descriptions thereof will be omitted.

1 and 2 are external views of a fine patterned film manufacturing apparatus for manufacturing a finely patterned film 300 including a polydimethylsiloxane resin liquid structure 200 with a fine pattern according to an embodiment.

As shown in FIGS. 1 and 2, the fine-patterned film manufacturing equipment according to an embodiment may include a frame structure 10, a film supply section 20, a resin liquid supply section 30, a resin liquid removal section 40, and a belt mold section 50. Embossing section 60 and film release section 70.

The constituent elements are examined in turn below.

The belt-type mold part 50 according to an embodiment may be rotatably mounted on one side of the frame structure 10, and a fine pattern may be formed on the outer peripheral part in an intaglio manner. In addition, the belt-type mold portion 50 according to one embodiment may be made of polyurethane acrylate (PUA).

In addition, the belt-type mold portion 50 according to one embodiment may be surface-treated with trichloro (1H, 1H, 2H, 2Hperfluorooctyl) silan. Therefore, the surface-treated belt-shaped mold portion 50 has a lower surface energy than in the past, and the polydimethylsiloxane resin liquid structure applied to the outer peripheral portion of the belt-shaped mold portion 50 can be removed from the belt-shaped mold portion 50. Effective demolding. At this time, the polydimethylsiloxane resin liquid structure of one embodiment can be released from the belt-type mold portion 50 and transferred to the base film 100.

In addition, the belt-type mold portion 50 can be wound around a plurality of rotating rollers 61, 62, 63, and 64 mounted at a predetermined interval and mounted at the same height and rotated.

The film supply unit 20 of one embodiment may include a supply roller 21 mounted on the front side of the frame structure 10, and supply the base film 100 wound around the supply roller 21 to the rear.

For example, the base film 100 taken up by the supply roller 21 is continuously supplied to the other side at the rear, and the supplied base film 100 can be changed in direction by the first turning roller 22 to be brought into close contact with the belt-type mold portion 50. In addition, the base film 100 can move in a state of being in a state of being in close contact with the belt-shaped mold portion 50, forming a predetermined area horizontally.

On the other hand, the base film 100 of one embodiment may be a heat-resistant film. For example, as the base film 100, various films such as a polyimide film, a PET film, and an OHP film can be used. However, in order to improve the mold releasability, the surface of the base film 100 may be coated with acrylic or urethane. A series of polymer based films 100.

In addition, the base film 130 according to an embodiment may further include an adhesive film 120 connected to the base film 100 by a dry adhesion method.

For example, the adhesive film 120 may include a heat-resistant film like the base film 100. In addition, various films such as polyimide film, PET film, and OHP film can be used as the adhesive film 120. However, in order to improve the mold release property, the surface of the adhesive film 120 may be coated with acrylic or urethane. Series of polymer adhesive films 120. At this time, the base film 100 and the adhesive film 120 of one embodiment may be connected in a dry manner. The combination of the base film 100 and the adhesive film 120 is reversible, and the base film 100 and the adhesive film 120 may be peeled off from each other. This will be explained in detail with reference to FIG. 7.

The resin liquid supply part 30 according to an embodiment may be installed on the upper side of the belt-type mold part 50, and a polydimethylsiloxane resin liquid 200 may be supplied and coated on the outer peripheral part.

For example, the polydimethylsiloxane resin solution 200 according to an embodiment may be formed by mixing a silicone elastic polymer base (curing agent) with a curing agent at a ratio of 10: 1, and forming the degassing process.

Generally speaking, when the silicone elastic polymer matrix is mixed with the curing agent, bubbles will inevitably occur, and the bubbles generated at this time will cause the mixed liquid composed of microstructures to cause defects. Therefore, the polydimethylsiloxane resin liquid 200 according to an embodiment can be used after mixing the elastic polymer matrix and the curing agent, and then performing a degassing procedure.

In addition, the resin liquid supply portion 30 of one embodiment may supply and apply the polydimethylsiloxane resin liquid 200 not only to the negatively engraved portion of the belt-type mold portion 50 but also to the positively engraved portion.

On the other hand, the belt-type mold portion 50 of one embodiment can be rotated in a state of being wound around a plurality of rotating rollers 61, 62, 63, 64. During the rotation of the belt-type mold portion 50 of the resin liquid supply portion 30 of one embodiment, The polydimethylsiloxane resin liquid 200 may be continuously applied to the entire area of the outer peripheral portion of the belt-shaped mold portion 50.

In addition, the resin liquid supply portion 30 of one embodiment can adjust the resin liquid supply time so that the polydimethylsiloxane resin liquid 200 can be sufficiently coated on the outer peripheral portion of the belt-type mold portion 50. This will be explained in detail with reference to FIG. 9.

The resin liquid removing portion 40 according to an embodiment may be mounted on the upper side of the belt-shaped mold portion 50, and the poly-coating portion applied to the outer portion of the engraved portion may be removed while being in close contact with the portion of the outer portion of the belt-shaped mold portion 50. Methylsilane resin solution 200.

In addition, the resin liquid removal portion 40 of one embodiment may pressurize the polydimethylsiloxane resin liquid 200 applied to the etched portion of the outer peripheral portion of the belt-type mold portion 50.

On the other hand, the belt-type mold portion 50 of one embodiment may be rotated while being wound on a plurality of rotating rollers 61, 62, 63, 64, and the resin liquid removal portion 40 of one embodiment may be rotated during the rotation of the belt-type mold portion 50. The polydimethylsiloxane resin solution 200 applied to the positively engraved portion is removed, and the polydimethylsiloxane resin solution 200 applied to the negatively engraved portion is pressurized.

For example, as shown in FIG. 1, the resin liquid removing portion 40 according to one embodiment may be fixedly mounted on a blade on the upper side of the belt-type mold portion 50 in a state of being set at a predetermined interval from the resin liquid supply portion 30 and moving horizontally. The belt-shaped mold portion 50 is maintained at a predetermined interval.

In addition, the resin liquid removal portion 40 of one embodiment may be mounted on the lower surface of the resin liquid supply portion 30. For example, as shown in FIG. 2, the resin liquid removal section 40 may be configured integrally with the resin liquid supply section 30. At this time, the crack width of the resin liquid supply part 30 can be adjusted to adjust the flow rate of the resin liquid, the height direction position of the resin liquid removal part 40 can be adjusted, and the thickness of the applied resin liquid can be adjusted. For example, the resin liquid removal portion 40 of one embodiment may be mounted on the lower surface of the resin liquid supply portion 30 by adjusting the position in the height direction so as to be in a state of being in close contact with the engraved portion of the outer peripheral portion of the belt-type mold portion 50.

On the other hand, the belt-type mold portion 50 of one embodiment can be rotated while being wound around a plurality of rotating rollers 61, 62, 63, 64. The resin liquid supply portion 30 of one embodiment is just outside the periphery of the belt-type mold portion 50. The polydimethylsiloxane resin solution 200 is applied to the portion, and the resin liquid removing portion 40 can remove the polydimethylsiloxane resin solution 200 applied to the positively engraved portion. The siloxane resin liquid 200 is pressurized.

Therefore, the polydimethylsiloxane resin liquid 200 of one embodiment is uniformly applied to the overlying portion of the outer peripheral portion of the belt-shaped mold portion 50 in which a fine pattern is formed in an overlying manner, and the consumption of unnecessary resin liquid can be reduced. , Can reduce the thickness of the residual layer, and is easily applied to subsequent processes.

The embossing section 60 of one embodiment can closely adhere the upper surface of the base film 100 supplied from the film supply section 20 to the tape mold section 50, and apply polydimethyl methacrylate to the engraved portion of the outer peripheral portion of the tape mold section 50. The siloxane resin liquid 200 is transferred onto the upper surface of the base film 100. At this time, the imprint portion 60 of one embodiment may apply heat to the fine-patterned polydimethylsiloxane resin liquid structure transferred to the upper surface of the base film 100 to make the fine-patterned polydimethylsiloxane The silicone resin liquid structure is cured.

On the other hand, the embossing section 60 of one embodiment may include a plurality of rotating rollers 61, 62, 63, and 64 mounted on the rear side of the supply roller 21 with the frame structure 10 at a predetermined interval and at the same height so as to supply the rollers. The base film 100 supplied by 21 forms a horizontal plane and moves in a predetermined interval. At this time, the belt-type mold portion 50 of one embodiment can be rotated while being wound on the plurality of rotating rollers 61, 62, 63, and 64.

For example, during the rotation of the belt-type mold portion 50 of the embodiment, the embossing portion 60 moves the base film 100 supplied by the supply roller 21 and the belt-type mold portion 50 to form a horizontal plane in a predetermined interval, and simultaneously moves the The polydimethylsiloxane resin solution 200 applied to the engraved portion of the outer peripheral portion of the belt-shaped mold portion 50 is transferred onto the upper surface of the base film 100.

In addition, the embossing section 60 of one embodiment may include a heating plate 65 spaced at a predetermined interval on the lower side of the belt-type mold section 50. At this time, the polydimethylsiloxane resin liquid 200 applied to the engraved portion of the outer peripheral portion of the belt-shaped mold portion 50 can be transferred to the upper surface of the base film 100 in the shape of a precise pattern while using the The radiant heat emitted from the heating plate 65 is cured. At this time, the heating plate 65 of one embodiment can release radiant heat above 100 ° C. At this time, the curing time of the polydimethylsiloxane resin liquid 200 may vary depending on the thickness and the curing temperature, which will be described in detail with reference to FIG. 8.

On the other hand, the base film 130 of one embodiment may further include an adhesive film 120 connected in a dry adhesion manner. At this time, the embossing portion 60 of one embodiment may attach the upper surface of the adhesive film 120 to the tape mold portion 50. Then, the polydimethylsiloxane resin liquid 200 applied to the engraved portion of the outer peripheral portion of the tape-shaped mold portion 50 is transferred to the upper surface of the adhesive film 120, and the upper portion of the adhesive film 120 can be transferred to the upper portion of the adhesive film 120. Applying heat to the polydimethylsiloxane resin structure with a fine pattern on the surface to cure the polydimethylsiloxane resin structure with a fine pattern.

The film release part 70 of one embodiment may include a recovery roll 71 mounted on the rear side of the frame structure 10, and a fine patterned film 300 for curing a polydimethylsiloxane resin liquid structure with a fine pattern from The belt-type mold portion 50 is released from the mold and wound on the recovery roll 71.

For example, the fine-patterned film 300 of one embodiment may include a dual structure of a base film 100 and a polydimethylsiloxane resin liquid structure with a fine pattern.

In addition, the finely patterned film 310 of an embodiment may include a base film 100, an adhesive film 120 connected to the base film 100 in a dry adhesion manner, and a fine pattern polydimethylsiloxane cured on the upper surface of the adhesive film 120. The triple structure of the alkane resin liquid structure. At this time, on the finely patterned film 310, the base film 100 and the adhesive film 120 can be reversibly separated. Therefore, the double structure 330 of the adhesive film 120 and the cured polydimethylsiloxane resin liquid structure 200 can be separated from the substrate. The membrane 100 is obtained by separation. This will be described in detail with reference to FIGS. 7 and 10.

The operation of the fine-patterned film manufacturing equipment is described in detail below in order.

FIG. 3 is a flowchart of a method of manufacturing a finely patterned film 300 including a finely patterned polydimethylsiloxane resin liquid structure 200 according to an embodiment.

In step 100, the film supply section 20 of the fine-patterned film manufacturing apparatus may cause the base film 100 wound on the supply roller 21 to be supplied to one side.

In step 110, the resin liquid supply section 30 of the fine patterned film manufacturing equipment may supply and apply a polydimethylsiloxane resin liquid to the outer peripheral portion of the belt-shaped mold portion 50 in which a fine pattern is formed in an engraved manner on the outer peripheral portion. 200.

For example, the polydimethylsiloxane resin liquid 200 may be formed by mixing a silicone resin elastic polymer base (curing agent) with a curing agent at a ratio of 10: 1, and forming the degassing process.

In addition, the tape mold portion 50 of one embodiment may be made of polyurethane acrylate (PUA), and the tape mold portion 50 of one embodiment may use trichloro (1H, 1H, 2H, 2Hperfluorooctyl) silan ) For surface treatment.

On the other hand, the belt-type mold portion 50 of one embodiment can be rotated in a state of being wound around a plurality of rotating rollers 61, 62, 63, 64. During the rotation of the belt-type mold portion 50 of the resin liquid supply portion 30 of one embodiment, The polydimethylsiloxane resin solution 200 is continuously applied to the entire area of the outer peripheral portion of the belt-shaped mold portion 50.

In step 120, the resin liquid removing portion 40 of the fine patterned film manufacturing equipment may remove the polydimethylsiloxane resin liquid 200 applied to the engraved portion of the outer peripheral portion of the belt-shaped mold portion 50 in step 110. In addition, in step 120, the resin liquid removing portion 40 of the fine patterned film manufacturing equipment may pressurize the polydimethylsiloxane resin liquid 200 applied to the etched portion of the outer peripheral portion of the belt-shaped mold portion 50.

On the other hand, the belt-type mold portion 50 of one embodiment can be rotated while being wound on a plurality of rotating rollers 61, 62, 63, 64. During the rotation of the belt-type mold portion 50 of the resin liquid removal portion 40 of one embodiment, The polydimethylsiloxane resin liquid 200 applied to the positively engraved portion can be removed, and the polydimethylsiloxane resin liquid 200 applied to the negatively engraved portion can be pressurized. Therefore, the polydimethylsiloxane resin liquid 200 of one embodiment can be uniformly applied to the overlying portion of the outer peripheral portion of the belt-type mold portion 50 in which a fine pattern is formed in an overlying manner, thereby reducing unnecessary resin liquid consumption. , Can reduce the thickness of the residual layer, and is easily applied to subsequent processes.

In step 130, the embossing section 60 of the fine-patterned film manufacturing equipment can closely adhere the upper surface of the base film 100 to the belt-shaped mold section 50, and gather the overlying portions coated on the outer peripheral portion of the belt-shaped mold section 50. The dimethylsiloxane resin liquid 200 is transferred onto the upper surface of the base film 100.

The embossing section 60 of one embodiment may include a plurality of rotating rollers 61, 62, 63, 64 installed at a predetermined interval and at the same height on the rear side of the frame structure body 10 at a predetermined interval so that the supply base 21 supplies the base. The film 100 forms a horizontal plane and moves in a predetermined interval. At this time, the belt-type mold portion 50 of one embodiment can be rotated while being wound on the plurality of rotating rollers 61, 62, 63, and 64.

For example, while the embossing section 60 of one embodiment is rotating the belt-shaped mold section 50, the base film 100 supplied by the supply roller 21 and the belt-shaped mold section 50 can be brought into close contact with each other to form a predetermined section horizontal plane and move, The polydimethylsiloxane resin liquid 200 applied to the etched portion of the outer peripheral portion of the belt-shaped mold portion 50 was transferred onto the upper surface of the base film 100.

In step 140, the embossing section 60 of the fine patterned film manufacturing equipment may apply heat to the polydimethylsiloxane resin liquid structure 200 with the fine pattern transferred to the upper surface of the base film 100 in step 130, so that The finely patterned polydimethylsiloxane resin liquid structure 200 is cured.

The embossing section 60 according to one embodiment includes a heating plate 65 spaced at a predetermined interval on the lower side of the belt-shaped mold section 50, and a polydimethylene coated on the etched portion of the outer peripheral portion of the belt-shaped mold section 50 in step 140. The siloxane resin liquid 200 can be transferred to the upper surface of the base film 100 in the shape of a fine pattern while being cured by radiant heat of 100 ° C. or higher released by the heating plate 65.

For example, the heating plate 65 of one embodiment can be provided in various forms and methods, but Ni-Cr or Ni-Fe hot wire can be installed on the STS tube, filled with MgO particles, used in the form of a tube, or inserted between ceramics. The hot wires (Mo, Ni, Ni-Cr, Ti, Ni-Fe, etc.) use the method of making them close to each other with high temperature and pressure.

On the other hand, the base film 130 of one embodiment may further include an adhesive film 120 connected in a dry adhesion manner. At this time, the embossing part 60 of one embodiment may, in step 130, connect the upper surface of the adhesive film 120 and the tape. The mold part 50 is in close contact with each other, and the polydimethylsiloxane resin solution 200 applied to the etched part of the outer peripheral part of the belt mold part 50 is transferred to the upper surface of the adhesive film 120. In step 140, the The polydimethylsiloxane resin liquid structure 200 with a fine pattern transferred to the upper surface of the adhesive film 120 is heated to cure the polydimethylsiloxane liquid structure 200 with a fine pattern.

In step 150, the film release section 70 of the fine-patterned film manufacturing equipment may have a dual structure composed of the fine-patterned polydimethylsiloxane resin liquid structure 200 and the base film 100 cured in step 140. The fine patterned film 300 is released from the belt-type mold portion 50 and wound on a recovery roll 71.

On the other hand, the finely patterned film 310 of an embodiment may include a base film 100, an adhesive film 120 connected to the base film 100 in a dry-adhesive manner, and a fine-patterned polydimethyl silicon cured on the upper surface of the adhesive film 120. The triple structure of the oxane resin liquid structure 200. At this time, on the finely patterned film 310, the base film 100 and the adhesive film 120 can be reversibly separated. Therefore, the double structure 330 of the adhesive film 120 and the cured polydimethylsiloxane resin liquid structure 200 can be separated from the substrate. The membrane 100 is obtained by separation.

FIG. 4 is a flowchart of a method of performing a surface treatment on the belt mold portion 50 of the fine-patterned film manufacturing equipment according to an embodiment.

In order to improve the efficiency of demolding, the tape mold portion 50 of one embodiment may be surface-treated with trichloro (1H, 1H, 2H, 2Hperfluorooctyl) silan, which is a substance that reduces surface energy. Among these, the equipment which performs the surface treatment of the belt type mold part 50 is called a surface treatment equipment.

In step 200, the surface treatment apparatus may spray trichlorosilane on the outer peripheral portion of the belt-type mold portion 50. For example, the surface treatment apparatus may spray L-SAM as a silane series on an outer peripheral portion in which a fine pattern is formed in an etched manner.

In step 210, the surface treatment equipment may dry the trichlorosilane sprayed on the outer peripheral portion of the belt-type mold portion 50 in step 200 for a predetermined time.

In step 220, the surface treatment equipment may use a heat generating device to heat the trichlorosilane dried in step 210. For example, surface treatment equipment can use radiant heat above 120 ° C released by heat-generating equipment to heat trichlorosilane for about 40 minutes or more. Therefore, the dried trichlorosilane in step 210 is vaporized.

In step 230, the surface treatment equipment may cool the trichlorosilane heated in step 220 at normal temperature. For example, the surface treatment equipment can be cooled at normal temperature for about 30 minutes so that the substrate as the silane can be well treated on the surface of the belt-type mold portion 50.

On the other hand, at this time, the surface treatment work of the belt-shaped mold portion 50 can be effectively performed in the cage.

5 and 6 illustrate fine patterning of a dual structure having a base film 100 and a polydimethylsiloxane resin liquid structure 200 with a fine pattern in a fine patterned film manufacturing apparatus according to an embodiment Conceptual diagram of the film 300 generation process.

As shown in FIG. 6, the belt-type mold portion 50 according to one embodiment is installed so that it can be rolled around a plurality of rotating rollers 61, 62, 63, and 64 which are installed at a predetermined interval and at the same height and can be rotated. The pattern is formed with a fine pattern.

As shown in step a in FIG. 5, the polydimethylsiloxane resin liquid 200 according to one embodiment can be supplied and applied to the belt mold portion through the resin liquid supply portion 30 installed on the upper side of the belt mold portion 50. 50 engraved and engraved parts. At this time, as shown in FIG. 6, the polydimethylsiloxane resin liquid 200 according to one embodiment may be continuously applied to the entire area of the outer peripheral portion of the belt-shaped mold portion 50 while the belt-shaped mold portion 50 is rotating.

As shown in step b in FIG. 5, the polydimethylsiloxane resin liquid 200 applied on the entire area of the outer peripheral portion of the belt mold portion 50 can be removed by the resin liquid mounted on the upper side of the belt mold portion 50. The portion 40 is removed or pressurized.

For example, as shown in FIG. 6, during the rotation of the belt-shaped mold portion 50, the polydimethylsiloxane resin liquid 200 applied to the engraved portion of the outer peripheral portion may be removed and applied to the engraved portion of the outer peripheral portion. The polydimethylsiloxane resin liquid 200 may be pressurized. Therefore, as shown in step c in FIG. 5, the polydimethylsiloxane resin solution 200 of one embodiment is uniformly applied to only the etched portion of the outer peripheral portion of the belt mold portion 50, and unnecessary resin can be reduced. Liquid consumption can reduce the thickness of the residual layer and can be easily applied to subsequent processes.

As shown in FIG. 6, the base film 100 according to one embodiment may be continuously supplied by the film supply unit 20 to be in a state of being in close contact with the belt-type mold unit 50 that is wound around a plurality of rotating rollers 61, 62, 63, 64 and rotates. To form a horizontal plane in a predetermined interval and move.

For example, in a state in which the base film 100 of one embodiment is in close contact with the rotating belt-shaped mold portion 50, a predetermined interval horizontal plane is formed between the belt-shaped mold portion 50 and the heating plate 65 and moved.

At this time, as shown in step d in FIG. 5, the polydimethylsiloxane resin liquid 200 applied to the engraved portion of the outer peripheral portion of the belt mold portion 50 can be transferred to the embossing portion 60 on the embossing portion 60. The upper surface of the base film 100. In addition, the fine pattern polydimethylsiloxane resin liquid structure 200 transferred to the upper surface of the base film 100 can be cured by radiant heat emitted from the heating plate 65.

As shown in step e in FIG. 5, the fine patterned film 300 composed of the dual structure of the base film 100 and the polydimethylsiloxane resin liquid structure 200 with a fine pattern may be shown in FIG. 6. The film release portion 70 is used to release the mold from the rotating belt-type mold portion 50. At this time, the release patterned fine patterned film 300 can be taken up by the recovery roller 71.

FIG. 7 illustrates the fine patterning of the triple structure of the fine patterned film manufacturing equipment according to an embodiment, which has a base film 100, an adhesive film 120, and a polydimethylsiloxane liquid structure 200 with a fine pattern. Conceptual diagram of the membrane 310 generation process.

In general, the adhesive may generally include an adhesive in a wet form. For example, adhesive tapes used to coat adhesives on films are widely used as representative wet adhesives. They have excellent adhesion, but are difficult to reuse after a single use. Even if they are separated, there are substrates, specific parts of the body, and buildings. There is a problem that adhesion objects such as walls are damaged, or adhesion substances are left on the surface of the adhesion objects.

The so-called dry bonding method of one embodiment is used to eliminate the problems caused by the use of conventional wet-type adhesives (for example, glue, epoxy resin or other adhesive materials), and the use of a soft material 110 that is not an adhesive material. Forms a reversible adhesive bond between structured surfaces.

For example, the soft material 110 used in the dry bonding method may include a soft surface conforming to the topography of a structured surface (for example, a micro-structure or a nano-structured surface) to form a reversible mechanical interlock. Soft surfaces can be adhered to a structured surface through physical (eg, van der Waals) and / or chemical interactions. At this time, if the soft surface makes physical contact with the structured surface, an adhesive bond is instantly formed between them, and this adhesive bond is reversible.

The adhesive film 120 according to an embodiment may be connected to the base film 100 in a dry manner by using a soft material 110, and the adhesive film 120 connected in a dry manner may be peeled from the base film 100. A representative example of the dry bonding method of an embodiment may be a hook and loop velcro bonding system that mimics a burdock seed, but is not limited thereto.

As shown in FIG. 7, the base film 130 according to an embodiment may further include an adhesive film 120 connected by a dry adhesion method, and a polydimethylsiloxane resin coated on the etched portion of the outer peripheral portion of the tape mold portion 50. The liquid 200 can be transferred onto the upper surface of the adhesive film 120 via the embossing section 60. In addition, the fine pattern polydimethylsiloxane resin liquid structure 200 transferred to the upper surface of the adhesive film 120 can be cured by radiant heat emitted from the heating plate 65.

Therefore, the finely patterned film 310 of an embodiment can be composed of the base film 100, the adhesive film 120 connected to the base film 100 in a dry adhesion manner, and a polydimethylsiloxane with a fine pattern cured on the upper surface of the adhesive film 120. The triple structure of the resin liquid structure 200. At this time, on the finely patterned film 310, the base film 100 and the adhesive film 120 can be reversibly separated. Therefore, the double structure 330 of the adhesive film 120 and the cured polydimethylsiloxane resin liquid structure 200 can be separated from the substrate. The membrane 100 is obtained by separation.

FIG. 8 is a graph illustrating the curing time of the polydimethylsiloxane resin liquid 200 at different thicknesses and curing temperatures in the fine pattern manufacturing equipment of an embodiment .

When heat is applied to the polydimethylsiloxane resin liquid 200, a curing reaction between base polymers occurs with the aid of a platinum catalyst. Generally, it is used for the curing temperature of the polydimethylsiloxane resin liquid 200. 70 ° C. The reason for this is that if heat exceeding 70 ° C. is applied to the polydimethylsiloxane resin liquid 200 by a conventional manufacturing process, there is a concern that damage such as damage to or breakage of material substances such as substrate disintegration or adhesion may occur.

However, when the material of the polydimethylsiloxane resin liquid 200 does not stick but spreads uniformly, as shown in FIG. 8, at a temperature actually higher than 70 ° C., the curing time is shortened.

Therefore, the imprint section 60 of one embodiment uses the radiant heat of 100 ° C. or more released by the heating plate 65 to cure the polydimethylsiloxane resin liquid 200 through indirect heat, so that the curing process can be performed more quickly. In addition, the fine patterned film manufacturing apparatus of one embodiment performs curing at a temperature of 100 ° C. or more, and therefore, in order to prevent deformation of the base film 100 used as a substrate, the base film 100 of one embodiment may be a heat-resistant film. For example, the base film 100 of an embodiment may include a polyimide film, but is not limited thereto.

FIG. 9 is a diagram illustrating various examples of the fine-patterned film 300 at different supply times of the polydimethylsiloxane resin liquid in the fine-pattern manufacturing apparatus of one embodiment.

In general, in order to obtain a engraved structure in a negative mold, a vacuum cavity should be used to fill the resin (resin). When the resin is supplied, if it is not applied in the vertical direction, but in the horizontal direction, the pressure or external force It works, but can use the capillary force to apply resin to the cavity in the mold.

Therefore, the fine patterned film manufacturing equipment of one embodiment does not require a vacuum process, and can use such a capillary force to supply and coat the outer peripheral portion of the belt-type mold portion 50 patterned in a negative manner by the resin liquid supply portion 30. Cloth polydimethylsiloxane resin solution 200. At this time, the resin liquid supply portion 30 of one embodiment can adjust the resin liquid supply time so that the polydimethylsiloxane resin liquid 200 can be sufficiently coated on the outer peripheral portion of the belt-type mold portion 50.

For example, the resin liquid supply time may be the time when the polydimethylsiloxane resin liquid 200 supplied to the outer peripheral portion of the belt-shaped mold portion 50 through the resin liquid supply portion 30 reaches the embossing portion 60, a, b of FIG. 9 And c are diagrams illustrating the appearance of the polydimethylsiloxane resin liquid structure 200 cured on the fine patterned film 300 when the resin liquid supply time is 50 seconds, 100 seconds, and 150 seconds. Illustration. As shown in FIG. 9, in a sufficient case where the resin liquid supply time is about 150 seconds, a polydimethylsiloxane resin liquid structure 200 having a fine pattern with a complete form can be obtained.

FIG. 10 is a diagram illustrating various examples of the fine-patterned polydimethylsiloxane resin liquid structure 200 separated from the fine-patterned film 310 in the fine-pattern manufacturing apparatus of one embodiment.

As described in FIG. 7, the finely patterned film 310 according to an embodiment may include a base film 100, an adhesive film 120 connected to the base film 100 in a dry adhesion manner, and a fine patterned solidified film on the upper surface of the adhesive film 120. The triple structure of the polydimethylsiloxane resin liquid structure 200. At this time, on the finely patterned film 310, the base film 100 and the adhesive film 120 can be reversibly separated. Therefore, as shown in FIG. 10, the adhesive film 120 and the cured polydimethylsiloxane resin liquid structure 200 The double structure 330 can be obtained by being separated from the base film 100.

All documents cited in the present invention, including published documents, patent applications, patents, etc., whether individually cited or specifically combined, may be incorporated into the present invention.

For the understanding of the present invention, reference numerals are described in the preferred embodiments illustrated in the drawings, and specific terms are used to explain the embodiments of the present invention, but the present invention is not limited by the specific terms, and the present invention may Includes all the elements that ordinary artisans can think of.

The specific implementation described in the present invention, as an example, does not limit the scope of the present invention in some way. For the sake of simplicity, the description of the conventional electronic configuration, control system, software, and other functions of the system may be omitted. In addition, the connection or connection member of the lines between the constituent elements illustrated in the drawings exemplarily represents a functional connection and / or a physical or chemical connection. In actual equipment, it can be expressed as a variety of alternatives or additions. Functional connection, physical connection or electrical connection. In addition, if there is no specific expression such as "essential" or "importantly", it may not be a constituent element necessary for its application.

In the description of the present invention (especially the scope of patent application), the use of the term "the" and similar reference terms may cover both the singular and the plural. In addition, in the case where a range is described in the present invention, an invention that applies an individual value belonging to the range (if not described to the contrary) is included as described in the detailed description of the present invention that constitutes the range. The individual values are the same. Finally, if there is no explicit order or reverse description of the steps constituting the method of the present invention, the steps may be performed in an appropriate order. It is not necessarily limited by the order in which these steps are described. In the present invention, the use of all examples or exemplary terms (for example, etc.) is merely used for detailed description, and the scope of the present invention is limited only by the scope of patent application, and is not limited by the examples or exemplary terms. In addition, within the scope of the attached patent application or its equivalent, various modifications, combinations, and changes can be made according to design conditions and factors, which is self-evident for ordinary artisans.

10‧‧‧Frame Structure

20‧‧‧ Membrane Supply Department

21‧‧‧Supply roller

22‧‧‧The first steering roller

30‧‧‧Resin Liquid Supply Department

40‧‧‧Resin liquid removal section

50‧‧‧Belt Mould Department

60‧‧‧Embossing Department

61, 62, 63, 64‧‧‧ rotating roller

65‧‧‧heating plate

70‧‧‧ film release department

71‧‧‧Recycling roller

72‧‧‧Second turning roller

100‧‧‧ base film / step

110‧‧‧ soft material / step

120‧‧‧ Adhesive film / step

130‧‧‧ base film / step

140‧‧‧step

150‧‧‧ steps

200‧‧‧Polydimethylsiloxane resin liquid structure / Polydimethylsiloxane resin liquid / step

210‧‧‧ steps

220‧‧‧step

230‧‧‧ steps

300‧‧‧Fine patterned film / step

310‧‧‧Fine patterned film

330‧‧‧Double Structure

1 and 2 are external views of a fine patterned film manufacturing apparatus for manufacturing a fine patterned film including a polydimethylsiloxane resin liquid structure with a fine pattern according to an embodiment.

FIG. 3 is a flowchart of a method of manufacturing a finely patterned film including a polydimethylsiloxane resin liquid structure with a fine pattern according to an embodiment.

FIG. 4 is a flowchart of a method of performing a surface treatment on a belt mold portion of a fine patterned film manufacturing apparatus according to an embodiment.

5 and 6 are diagrams illustrating the production of a fine patterned film having a dual structure of a base film and a polydimethylsiloxane resin liquid structure with a fine pattern in a fine patterned film manufacturing apparatus of an embodiment Process conceptual illustration.

FIG. 7 is a diagram illustrating the production of a fine patterned film having a triple structure having a base film, an adhesive film, and a polydimethylsiloxane resin liquid structure with a fine pattern in a fine patterned film manufacturing apparatus of an embodiment; Conceptual illustration of process.

FIG. 8 is a graph illustrating the curing time of the polydimethylsiloxane resin solution at different thicknesses and curing temperatures in the fine pattern manufacturing equipment of an embodiment.

FIG. 9 is a diagram illustrating various examples of a fine patterned film at different supply times of a polydimethylsiloxane resin solution in a fine pattern manufacturing apparatus of an embodiment.

Fig. 10 is a diagram illustrating various examples of a fine-patterned polydimethylsiloxane resin liquid structure separated from a fine-patterned film in a fine-pattern manufacturing apparatus of an embodiment.

Domestic hosting information (please note in order of hosting institution, date, and number) None

Information on foreign deposits (please note in order of deposit country, institution, date, and number) None

Claims (19)

A fine patterned film manufacturing equipment, comprising: a frame structure; and a film supply section including a supply roller mounted on a front side of the frame structure, and supplying a base film wound on the supply roller to the rear ; A belt-shaped mold part, which is rotatably mounted on one side of the frame structure by being wound on a plurality of rotating rollers spaced at a predetermined interval and mounted at the same height, and has an outer peripheral part formed with a fine pattern in an overcast manner; resin liquid A supply part is installed on the upper side of the belt mold part, and a polydimethylsiloxane resin liquid is supplied and coated on the outer peripheral part; and a resin liquid removal part is installed on the upper side of the belt mold part. In a state of being in close contact with the engraved portion of the outer peripheral portion, the polydimethylsiloxane resin liquid applied to the engraved portion of the outer peripheral portion is removed; the embossing portion rotates the plurality of rotating rollers to cause the The upper surface of the base film supplied by the film supply unit is in a state of being in close contact with the belt-type mold unit, and moves horizontally in a predetermined section. At the same time, the polydimethylsiloxane coated on the engraved portion of the outer peripheral portion is moved. Alkane The lipid liquid is transferred to the upper surface of the base film, and heat is applied to the finely patterned polydimethylsiloxane resin liquid structure transferred to the upper surface of the base film to make the finely patterned polydimethylsiloxane. A base siloxane resin liquid structure is cured; and a film release section including a recovery roller installed on the rear side of the frame structure, so that the base film and the cured polydimethyl silicon with fine pattern are cured The fine patterned film composed of the double structure of the oxane resin liquid structure is demolded from the belt-shaped mold part and rolled on the recovery roll. The resin liquid removal part is integrally formed with the resin liquid supply part, and the resin liquid removal part It is integrally formed with the resin liquid supply part and is vertically installed on the upper horizontal surface of the belt-type mold part, and is installed at a position biased to the front side of the frame structure, and the height direction position of the resin liquid removal part is adjusted The thickness of the resin liquid is adjusted, and the crack width of the resin liquid supply part is adjusted to adjust the flow rate of the resin liquid. The fine patterned film manufacturing equipment according to claim 1, wherein the belt mold portion is made of polyurethane acrylate (PUA), and the belt mold portion uses trichloro (1H, 1H, 2H) 2Hperfluorooctyl) silan) for surface treatment. The fine patterned film manufacturing equipment according to claim 1, wherein the base film supplied by the film supply unit further includes an adhesive film connected to an upper surface of the base film by a dry adhesion method. The fine-patterned film manufacturing equipment according to claim 3, wherein the embossed portion makes the upper surface of the adhesive film closely contact the tape-shaped mold portion, and applies the polyimide film coated on the engraved portion of the outer peripheral portion. A methylsiloxane resin liquid is transferred onto the upper surface of the adhesive film, and heat is applied to the finely patterned polydimethylsiloxane resin liquid structure transferred to the upper surface of the adhesive film to make the tape The fine-patterned polydimethylsiloxane resin liquid structure is cured, and the fine-patterned film is a triple of the cured fine-patterned polydimethylsiloxane resin liquid structure, the adhesive film, and the base film. Structure composition. The fine patterned film manufacturing apparatus according to claim 4, wherein the double structure of the adhesive film and the polydimethylsiloxane resin liquid structure is separated from the base film on the fine patterned film. The apparatus for manufacturing a fine patterned film according to claim 1, wherein the resin liquid removing portion applies the polydimethylsiloxane resin liquid applied to the engraved portion of the outer peripheral portion of the tape mold portion. Pressure. The fine patterned film manufacturing apparatus according to claim 1, wherein the resin liquid removing portion is mounted on a lower surface of the resin liquid supplying portion. The fine patterned film manufacturing equipment according to claim 1, wherein the polydimethylsiloxane resin solution supplied by the resin solution supply section is mixed with a silicone elastic polymer matrix (silicone Elastomer base) at a ratio of 10: 1. ) And curing agent (Curing agent), formed through the degassing process. The fine patterned film manufacturing apparatus according to claim 1, wherein the base film supplied by the film supply section is a heat-resistant film. The fine patterned film manufacturing apparatus according to claim 1, wherein the embossing section includes a heating plate spaced at a predetermined interval on a lower side of the belt mold section, and is coated on the outer periphery of the belt mold section The polydimethylsiloxane resin solution in the engraved part of the part is cured by the radiant heat released by the heating plate while the upper surface of the base film is transferred into the shape of a fine pattern. The apparatus for manufacturing a fine patterned film according to claim 10, wherein the heating plate releases radiant heat above 100 ° C. A method for manufacturing a finely patterned film, comprising the steps of: supplying a base film rolled on a supply roller to one side; and forming a finely patterned outer peripheral portion on an outer peripheral portion and rolling it at predetermined intervals and at the same time. A step of supplying and applying a polydimethylsiloxane resin liquid to the outer peripheral portion of the belt-type mold portion which is mounted on a plurality of highly-rotated rollers and rotatably mounted; and removing the coating on the engraved portion of the outer peripheral portion. A step of polydimethylsiloxane resin solution; rotating the plurality of rotating rollers, so that the upper surface of the base film supplied by the film supply part is in a state of being in close contact with the belt-type mold part to form a predetermined section horizontal surface While moving, the polydimethylsiloxane resin solution applied to the engraved portion of the outer peripheral portion is transferred to the upper surface of the base film, and a fine pattern is transferred to the upper surface of the base film A step of applying heat to the polydimethylsiloxane resin liquid structure to cure the polydimethylsiloxane liquid structure with fine patterns; and curing the fine film with the base film and the fine pattern Polydimethylsiloxane resin solution The finely-patterned film composed of the double structure of the structure is demolded from the belt-shaped mold part, and rolled up on a recovery roll. The method further includes: the step of supplying and coating the resin liquid is formed integrally with the resin liquid supply part The resin liquid removing section supplies and applies the resin liquid. While adjusting the width of the cracks arranged on the resin liquid supplying section to adjust the flow rate of the resin liquid, the resin liquid removing section is adjusted according to the height direction position of the resin liquid removing section. The thickness of the resin liquid, the resin liquid removing portion integrally formed with the resin liquid supply portion, is vertically installed on the upper horizontal surface of the belt mold portion, and is installed at a position biased to the front side of the frame structure to adjust Resin flow. The method for manufacturing a fine patterned film according to claim 12, wherein the belt mold portion is made of polyurethane acrylate (PUA), and the belt mold portion is made of trichlorosilane (1H, 1H, 2H). 2Hperfluorooctyl) silan) for surface treatment. The method for manufacturing a fine patterned film according to claim 12, wherein the base film further includes an adhesive film connected to the upper surface of the base film by a dry adhesion method. The method for manufacturing a fine patterned film according to claim 14, wherein the step of curing the polydimethylsiloxane resin liquid structure with a fine pattern is the upper surface of the adhesive film and the tape mold. The upper part of the adhesive film is transferred to the upper surface of the adhesive film, and the fine pattern on the upper surface of the adhesive film is transferred to the upper surface of the adhesive film. Heat is applied to the polydimethylsiloxane resin liquid structure to cure the polydimethylsiloxane liquid structure with fine pattern, and the fine patterned film is composed of the cured polydimethylsiloxane with fine pattern A siloxane resin liquid structure, the adhesive film, and a triple structure of the base film. The method for manufacturing a fine patterned film according to claim 15, wherein on the fine patterned film, the double structure of the adhesive film and the polydimethylsiloxane resin liquid structure is separated from the base film. The method for manufacturing a fine patterned film according to claim 12, wherein the step of removing the polydimethylsiloxane resin solution applied to the engraved portion of the outer peripheral portion further includes the following steps: A step of pressurizing the polydimethylsiloxane resin solution in the engraved portion of the part. The method for manufacturing a fine patterned film according to claim 12, wherein the polydimethylsiloxane resin solution is mixed with a silicone elastic polymer base (Curing agent) and a curing agent (Curing agent) at a ratio of 10: 1. ), Formed by the degassing procedure. The method for manufacturing a fine-patterned film according to claim 12, wherein the step of applying heat to cure the polydimethylsiloxane resin solution with a fine pattern is provided in a lower portion of the belt-shaped mold portion. The polydimethylsiloxane resin liquid coated on the heated portion of the tape mold portion and the engraved portion of the outer peripheral portion of the belt-shaped mold portion is transferred into a fine pattern on the upper surface of the base film. At the same time as the shape, it is cured by radiant heat of 100 ° C. or higher released by the heating plate.