TWI578015B - Flexible substrate and manufacturing method thereof and manufacturing method of package of environmental sensitive electronic element - Google Patents

Description

Flexible substrate, manufacturing method thereof and package of environmentally sensitive electronic component

The present invention relates to a substrate, a method for fabricating the same, and a method for fabricating the package, and more particularly to a method for fabricating a flexible substrate, a method for fabricating the same, and a package for environmentally sensitive electronic components.

The organic electroluminescent diode is a semiconductor component that converts electrical energy into light energy, which has high conversion efficiency, self-luminescence, ultra-thin structure, high brightness, high luminous efficiency, high contrast, and short response time ( It can be used in many electronic products because it can reach a few microseconds, has a wide viewing angle, low power consumption, a large operating temperature range, and flexible panels.

In order to increase the light extraction efficiency of the organic electroluminescent diode, the easiest way is to change the structural design of the carrier substrate. Generally, the carrier substrate can be adhered to a layer having a structural surface, or a photonic crystal or a nanostructure can be formed by photolithography to achieve the desired light scattering effect. However, if the external bonding method is adopted, the adhesion between the carrier substrate and the externally applied adhesive layer is liable to be detached by an external force, resulting in a problem of poor structural reliability. If the lithography method is used, in the process of fabricating a photonic crystal or a nanostructure, more processing steps and process equipment are required, and thus the manufacturing cost cannot be reduced.

The present invention provides a method of fabricating a flexible substrate, which is capable of producing a flexible substrate having better structural reliability and improved light extraction efficiency of the light-emitting element.

The present invention provides a method of fabricating a package of environmentally sensitive electronic components to produce a package of environmentally sensitive electronic components having better light extraction efficiency.

The invention provides a flexible substrate which has better structural reliability and can improve the light extraction efficiency of the light-emitting element in subsequent product applications.

The present invention provides a method of fabricating a flexible substrate comprising the following steps. A carrier is provided. A material layer has been formed on the carrier, wherein the material layer has an upper surface and a lower surface opposite to each other and a plurality of recesses, and the lower surface is in contact with the carrier, and the recess extends from the upper surface of the material layer toward the lower surface. A release layer is formed on the upper surface of the material layer, wherein the release layer is conformal to the material layer. A hybrid polymer layer is applied to the release layer, wherein the mixed polymer layer has a plurality of scattering particles. A settling step is performed to cause the scattering particles in the mixed polymer layer to settle to the bottom of the mixed polymer layer to be in direct contact with the release layer. The mixed polymer layer is separated from the carrier to form a flexible substrate having a plurality of protrusions and partially scattering particles exposed outside the protrusions.

The present invention also provides a method of fabricating a package of environmentally sensitive electronic components, which includes the following steps. A carrier is provided. A material layer has been formed on the carrier, wherein the material layer has an upper surface and a lower surface opposite to each other and a plurality of recesses, and the lower surface is in contact with the carrier, and the recess extends from the upper surface of the material layer toward the lower surface. A release layer is formed on the upper surface of the material layer, wherein the release layer is conformal to the material layer. A mixed polymer layer is applied to the release layer with a plurality of scattering particles in the mixed polymer layer. A settling step is performed to cause the scattering particles in the mixed polymer layer to settle to the bottom of the mixed polymer layer to be in direct contact with the release layer. An environmentally sensitive electronic component is formed on the mixed polymer layer. The mixed polymer layer and the environmentally sensitive electronic components thereon are separated from the carrier to form a package having a plurality of protrusions and partially scattering the particles exposed to environmentally sensitive electronic components outside the protrusions.

The present invention also provides a method of fabricating a flexible substrate comprising the following steps. A carrier is provided. The carrier has a first surface and a second surface opposite to each other and a plurality of recesses, wherein the recess extends from the first surface toward the second surface. A release layer is formed on the first surface of the carrier, wherein the release layer is conformal to the carrier. A mixed polymer layer is applied to the release layer with a plurality of scattering particles in the mixed polymer layer. A settling step is performed to cause the scattering particles in the mixed polymer layer to settle to the bottom of the mixed polymer layer to be in direct contact with the release layer. The mixed polymer layer is separated from the carrier to form a flexible substrate having a plurality of protrusions and partially scattering particles exposed outside the protrusions.

The invention further provides a flexible substrate comprising a substrate and a plurality of scattering particles. The substrate has one of a first surface and a second surface opposite each other and a plurality of protrusions on the second surface. The scattering particles are distributed in the substrate and are located at the protrusions, wherein the partially scattering particles are exposed outside the protrusions, and the absolute value of the difference between the refractive index of each scattering particle and the refractive index of the substrate is divided by each scattering particle The ratio of the refractive index is greater than or equal to 25%.

Based on the above, since the present invention passes the scattering particles in the mixed polymer layer to the bottom of the mixed polymer layer to directly contact the release layer through the sedimentation step, the mixed polymer layer and the release layer are subjected to the separation step. When the layer is separated, a flexible substrate having a protruding portion and partially scattering particles exposed to the protruding portion can be formed. In other words, the present invention can produce a flexible substrate which has both good structural reliability and improved light extraction efficiency of the light-emitting element.

The above described features and advantages of the present invention will be more apparent from the following description.

1A to 1F are schematic cross-sectional views showing a method of fabricating a flexible substrate according to an embodiment of the present invention. Referring first to FIG. 1A, with respect to the method of manufacturing the flexible substrate of the present embodiment, first, a carrier 10 is provided in which a material layer 20 has been formed on the carrier 10, and the material layer 20 has an upper surface opposite to each other. 21 and the lower surface 23 and the plurality of recesses 22, while the lower surface 23 is in contact with the carrier 10, and the recess 22 extends from the upper surface 21 toward the lower surface 23. In the present embodiment, the material of the carrier 10 is, for example, a glass substrate, and the material of the material layer 20 is, for example, a polymer material, such as a photoresist material. Of course, the material layer 20 may also be made of a metal (for example, titanium or molybdenum), a metal oxide (for example, alumina), a non-metal oxide (for example, cerium oxide, titanium oxide), or a non-metal nitride (for example, A tantalum nitride), a non-metal oxynitride (for example, bismuth oxynitride), a ceramic material, or a composite material composed of the above materials. It should be noted that the material layer 20 of the embodiment may be a continuous film layer, and the recesses 22 may be independent recesses 22, or the material layer 20 may be a discontinuous film layer, that is, the material layer 20 may be A plurality of independent cylinders (not shown) are formed, and the recesses 22 are formed between the adjacent two cylinders, and the shapes of the material layer 20 and the recesses 22 are not limited thereto. In addition, as shown in FIG. 1A, the recessed portion 22 of the embodiment may extend from the upper surface 21 to the lower surface 23 and expose a portion of the carrier 10. However, in other embodiments not shown, the recess 22 may not be exposed. Out of the carrier 10.

Next, referring to FIG. 1B, a release layer 30 is formed on the upper surface 21 of the material layer 20, wherein the release layer 30 is conformal to the material layer 20. That is, the release layer 30 also has a plurality of recesses 32. Here, the material of the release layer 30 is, for example, poly-para-xylylene (parylene), but is not limited thereto.

Next, referring to FIG. 1C, a mixed polymer layer 110 is coated on the release layer 30, wherein the mixed polymer layer 110 has a plurality of scattering particles 112 therein. In the present embodiment, the material of the mixed polymer layer 110 is, for example, polyamidamine (PI).

Next, referring to FIG. 1D, a sedimentation step, such as gravity sedimentation, centrifugal sedimentation or electrostatic adsorption sedimentation, is performed to cause the scattering particles 112 in the mixed polymer layer 110 to settle to the bottom of the mixed polymer layer 110 to be separated from the release layer. Layer 30 is in direct contact. That is, the scattering particles 112 in the mixed polymer layer 110 settle into the recesses 32 of the release layer 30, and at least a portion of the scattering particles 112 are in direct contact with the release layer 30.

Thereafter, referring to FIG. 1E, the mixed polymer layer 110 is separated from the carrier 10 to form a flexible substrate 100 having a plurality of protrusions 114 and a surface of the partially scattering particles 112 exposed to the outside of the protrusions 114. In detail, a lift-off step is performed to separate the mixed polymer layer 110 from the release layer 30 to form the flexible substrate 100 having the protrusions 114 and the partial scattering particles 112 exposed to the outside of the protrusions 114. So far, the fabrication of the flexible substrate 100 has been completed.

Since the present embodiment is based on the material layer 20, the release layer 30 and the mixed polymer layer 110 are sequentially formed thereon, and the scattering particles 112 in the mixed polymer layer 110 are sedimented to the mixed polymer layer through the sedimentation step. The bottom of the 110 is in direct contact with the release layer 30. Therefore, when the separation step is performed to separate the mixed polymer layer 110 from the release layer 30, the flexible substrate 100 having the protruding portion 114 and partially scattering the particles 112 exposed to the outside of the protruding portion 114 can be formed. Compared with the conventional method for forming a flexible substrate having a scattering surface, the manufacturing method of the flexible substrate 100 of the present embodiment can be simultaneously manufactured, and the manufacturing cost can be reduced. The flexible substrate 100 has better structural reliability and improved light extraction efficiency of the light-emitting element.

It is to be noted that, in order to increase the light extraction efficiency of the flexible substrate 100 to a light-emitting element (not shown), after the step of FIG. 1E, that is, after the step of separating, please refer to FIG. 1F, The surface of the flexible substrate 100a is completed by performing a surface treatment step to increase the area of the portion of the scattering particles 112 exposed to the protrusions 114. Moreover, this embodiment does not limit the step of separating the mixed polymer layer 110 from the carrier 10. In other embodiments not shown, a lift-off step can also be performed to separate the release layer 30 and the mixed polymer layer 110 thereon from the material layer 20. Thereafter, a surface treatment step (for example, an etching process) is performed on the release layer 30 to expose a portion of the scattering particles 112 in the mixed polymer layer 110 to form a protrusion 114 and a portion of the scattering particles 112 are exposed to the protrusion. The flexible substrate 100 other than 114. The above-described manufacturing steps are still within the scope of the present invention, and do not depart from the scope of the present invention.

Further, it should be noted that the present invention does not limit the shape of the depressed portion 22 of the material layer 20, although the shape of the depressed portion 22 referred to herein is embodied as a semicircular shape. However, in other embodiments not shown, the shape of the recess 22 may be a rectangle, a triangle, a trapezoid or other polygons, and still belong to the technical solution that can be adopted by the present invention without departing from the scope of the present invention.

Structurally, referring again to FIG. 1F, in the present embodiment, the flexible substrate 100a includes a mixed polymer layer 110 and scattering particles 112, wherein the mixed polymer 110 can be regarded as a substrate and has one opposite to each other. The first surface 111 and a second surface 113 and a protrusion 114 on the second surface 113. The scattering particles 112 are distributed in the hybrid polymer 110 and are located at the protrusions 114 with portions of the scattering particles 112 exposed outside of the protrusions 114. In particular, each of the scattering particles 112 has a refractive index of n1, and the mixed polymer 110 has a refractive index of n2, and ∣n1-n2∣/n1≧25%. That is, the absolute value of the difference between the refractive index n1 of each scattering particle 112 and the refractive index n2 of the substrate 110 divided by the refractive index n1 of each scattering particle 112 is greater than or equal to 25%. In short, in addition to having better structural reliability, the flexible substrate 100a of the present embodiment can effectively improve the light extraction efficiency of the light-emitting element (not shown) in subsequent product applications.

It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

2A-2B are cross-sectional views showing a partial step of a method of fabricating a flexible substrate according to another embodiment of the present invention. Referring to FIG. 2B, the flexible substrate 100b of the present embodiment is similar to the flexible substrate 100a of FIG. 1F, but the main difference is that the flexible substrate 100b of the embodiment further includes a gas barrier layer. 120, wherein the gas barrier layer 120 is disposed on the mixed polymer layer 110, and the gas barrier layer 120 is composed of at least one organic material layer 122 (only two layers are schematically shown in FIG. 2B) and at least one inorganic material layer 124 (Fig. 2) 2B is only schematically shown in two layers) alternately stacked, and the refractive index of the organic material layer 122 is different from the refractive index of the inorganic material layer 124. In other embodiments not shown, the gas barrier layer may be formed by stacking at least two inorganic material layers, wherein the inorganic material layers have different refractive indices from each other; or the gas barrier layer may be a single layer with appropriate resistance a layer of a gas-like organic material, a single layer of an inorganic material layer having a suitable gas barrier property, or a single layer of an organic-inorganic hybrid composite material layer having a suitable gas barrier property, which still belongs to the technical solution applicable to the present invention, without departing from the present invention. The scope of the invention to be protected.

In the process, the flexible substrate 100b of the present embodiment can be fabricated in substantially the same manner as the flexible substrate 100a of the previous embodiment, and after the step of FIG. 1D, that is, after the sedimentation step is performed and the separation step is performed. Previously, referring to FIG. 2A, a gas barrier layer 120 is formed on the first surface 111 of the mixed polymer layer 110, wherein the gas barrier layer 120 is formed by alternately stacking the organic material layer 122 and the inorganic material layer 124 in a manner of deposition. And the refractive index of the organic material layer 122 is different from the refractive index of the inorganic material layer 124. Next, referring to FIG. 1E, the fabrication of the flexible substrate 100b of FIG. 2B can be completed. Thereafter, the step of FIG. 1F can also be selectively performed, that is, a surface treatment step is performed to achieve the desired technical effect.

Since the opposite surfaces of the flexible substrate 100b of the present embodiment have a gas barrier layer 120 and a scattering structure (ie, the protrusions 114 and the partial scattering particles 112 are exposed to the protrusions 114), respectively, in subsequent applications. When a light-emitting element (not shown) is disposed on the gas barrier layer 120 of the flexible substrate 100b, the light emitted by the light-emitting element may first pass through the gas barrier layer 120 to produce a refractive effect, and then pass through the protruding portion 114. The scattering of the scattering particles 112 achieves an effect of improving the light extraction efficiency of the light-emitting element.

3A-3C are cross-sectional views showing a partial step of a method of fabricating a package of environmentally sensitive electronic components according to an embodiment of the invention. The package of the environmentally sensitive electronic component of the present embodiment can be fabricated after the step of forming the flexible substrate 100 (or 100a) in FIG. 1D, that is, after the sedimentation step and before the separation step, please refer to the figure. 3A, an environmentally sensitive electronic component 210 is formed on the hybrid polymer layer 110. Thereafter, referring to FIG. 3B and FIG. 3C, a step of separating is performed to separate the mixed polymer layer 110 and the environmentally sensitive electronic component 210 thereon from the release layer 30 to form an environmentally sensitive electronic component package. 200. Here, the environmentally sensitive electronic component package 200 is composed of a flexible substrate 100 and an environmentally sensitive electronic component 210. The first surface 111 of the flexible substrate 100 is provided with an environmentally sensitive electronic component 210, and the flexibility is provided. The second surface 113 of the substrate 100 has a protrusion 114 thereon and a portion of the scattering particles 112 are exposed to the protrusion 114.

Of course, in order to increase the light extraction efficiency of the environmentally sensitive electronic component 210 of the flexible substrate 100, after the step of FIG. 3B, that is, after the step of separating, please refer to FIG. 3C, and further including performing a surface treatment step. The fabrication of the package 200a of environmentally sensitive electronic components is accomplished by increasing the area of the portion of the scattering particles 112 that is exposed outside of the protrusions 114. It is worth mentioning that this embodiment does not limit the step of separating the hybrid polymer layer 110 and the environmentally sensitive electronic component 210 thereon from the carrier 10. In other embodiments not shown, a lift-off step can be performed to separate the release layer 30 and the mixed polymer layer 110 and the environmentally sensitive electronic component 210 from the material layer 20 thereon. Thereafter, a surface treatment step (for example, an etching process) is performed on the release layer 30 to expose a portion of the scattering particles 112 in the mixed polymer layer 110 to form a protrusion 114 and a portion of the scattering particles 112 are exposed to the protrusion. The flexible substrate 100 other than 114. The above-described manufacturing steps are still within the scope of the present invention, and do not depart from the scope of the present invention.

The fabrication of the package 200 (or 200a) of the environmentally sensitive electronic component of the present embodiment can integrate the flexible substrate 100 (or 100a) with the process of the environmentally sensitive electronic component 210. That is, the flexible substrate 100 (or 100a) and the environmentally sensitive electronic component 210 can be fabricated in the same cavity. Therefore, the manufacturing method of the package 200 (or 200a) of the environmentally sensitive electronic component of the present embodiment has the advantages that the process steps are simple and the cost of purchasing the process equipment can be reduced. Furthermore, the light emitted by the environmentally sensitive electronic component 210 of the present embodiment can pass through the scattering of the protruding portion 114 and the scattering particles 112 underneath, thereby achieving the effect of improving the light extraction efficiency of the environmentally sensitive electronic component 210. That is, the package 200 (or 200a) of the environmentally sensitive electronic component of the present embodiment has better light extraction efficiency.

4A-4C are cross-sectional views showing a partial step of a method of fabricating a package of environmentally sensitive electronic components according to another embodiment of the present invention. The environment-sensitive electronic component package of the present embodiment can be formed after the step of forming the flexible substrate 100b in FIG. 2A, that is, after the gas barrier layer 120 is formed. Referring to FIG. 4A, an environmentally sensitive electronic component 210 is formed. On the gas barrier layer 120. Thereafter, please refer to FIG. 4B and FIG. 4C simultaneously, and perform a separation step to separate the mixed polymer layer 110 and the gas barrier layer 120 and the environmentally sensitive electronic component 210 from the release layer 30 to form an environmentally sensitive layer. The package 200b of the electronic component. Here, the package 200b of the environmentally sensitive electronic component is composed of the flexible substrate 100b' and the environmentally sensitive electronic component 210.

Of course, in order to increase the light extraction efficiency of the environmentally sensitive electronic component 210 of the flexible substrate 100b', after the step of FIG. 4B, that is, after the step of separating, please refer to FIG. 4C, and further includes performing a surface treatment step. In order to increase the area in which the partial scattering particles 112 are exposed outside the protruding portion 114, that is, the flexible substrate 100b is formed, the fabrication of the package 200c of the environmentally sensitive electronic component is completed.

The fabrication of the package 200b (or 200c) of the environmentally sensitive electronic component of the present embodiment integrates the process of the flexible substrate 100b with the environmentally sensitive electronic component 210. That is, the flexible substrate 100b and the environmentally sensitive electronic component 210 can be fabricated in the same cavity. Therefore, the manufacturing method of the package 200b (or 200c) of the environmentally sensitive electronic component of the present embodiment has the advantages that the process steps are simple and the cost of purchasing the process equipment can be reduced. Furthermore, the light emitted by the environmentally sensitive electronic component 210 of the present embodiment may first be refracted by the gas barrier layer 120, and then the scattering of the protruding portion 114 and the scattering particles 112 may be used to improve the environmentally sensitive electronic component 210. The effect of light extraction efficiency. That is, the package 200b (or 200c) of the environmentally sensitive electronic component of the present embodiment has better light extraction efficiency.

It is worth mentioning that the present invention does not limit the matching form of the carrier 10 and the material layer 20, although the surface of the carrier 10 mentioned here is a plane, and the material layer 20 is disposed on the surface of the carrier 10. And having a recess 22 . In other embodiments, referring to FIG. 5, the carrier 10a of the present embodiment has a first surface 12a and a second surface 14a and a plurality of recesses 16a opposite to each other, wherein the recess 16a is formed by the first surface 12a. Extending toward the second surface 14a. The above-mentioned manner can also achieve the structural design that the subsequently completed flexible substrate has the protruding portion and the partially scattering particles are exposed outside the protruding portion, and still belongs to the technical solution that can be adopted by the present invention without departing from the scope of the present invention. . Therefore, in other embodiments not shown, the carrier 10a having the recess 16a as mentioned in the above embodiment may also be selected, and those skilled in the art may refer to the description of the foregoing embodiment, that is, on the bearer. The step of forming a release layer, applying a mixed polymer layer, performing a sedimentation step on the scattering particles, and separating the mixed polymer layer from the carrier are sequentially performed on the device 10a to complete the fabrication of the flexible substrate.

In summary, since the present invention separates the scattering particles in the mixed polymer layer to the bottom of the mixed polymer layer through the sedimentation step to directly contact the release layer, the mixed polymer layer is subjected to the separation step. When separated from the release layer, a flexible substrate having protrusions and partially scattering particles exposed to the protrusions can be formed. In other words, the present invention can produce a flexible substrate which has both good structural reliability and improved light extraction efficiency of the light-emitting element. Furthermore, the method for fabricating the package of environmentally sensitive electronic components of the present invention can integrate the process of the flexible substrate and the environmentally sensitive electronic component, thereby reducing the number of manufacturing steps and reducing the cost of purchasing the process equipment.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

10, 10a. . . Carrier

12a. . . First surface

14a. . . Second surface

16a, 22, 32. . . Depression

20. . . Material layer

twenty one. . . Upper surface

twenty three. . . lower surface

30. . . Release layer

100, 100a, 100b, 100b’. . . Flexible substrate

110. . . Mixed polymer layer

111. . . First surface

112. . . Scattering particle

113. . . Second surface

114. . . Protruding

120. . . Gas barrier

122. . . Organic material layer

124. . . Inorganic material layer

200, 200a, 200b, 200c. . . Environmentally sensitive electronic component package

210. . . Environmentally sensitive electronic components

1A to 1F are schematic cross-sectional views showing a method of fabricating a flexible substrate according to an embodiment of the present invention.

2A-2B are cross-sectional views showing a partial step of a method of fabricating a flexible substrate according to another embodiment of the present invention.

3A-3C are cross-sectional views showing a partial step of a method of fabricating a package of environmentally sensitive electronic components according to an embodiment of the invention.

4A-4C are cross-sectional views showing a partial step of a method of fabricating a package of environmentally sensitive electronic components according to another embodiment of the present invention.

FIG. 5 is a cross-sectional view of a carrier according to an embodiment of the present invention.

100a. . . Flexible substrate

110. . . Mixed polymer layer

111. . . First surface

112. . . Scattering particle

113. . . Second surface

114. . . Protruding

Claims (28)

A method of fabricating a flexible substrate, comprising: providing a carrier having a material layer formed thereon, wherein the material layer has an upper surface and a lower surface opposite to each other and a plurality of recesses, and the lower surface Contacting the carrier, and the recesses extend from the upper surface of the material layer toward the lower surface; forming a release layer on the upper surface of the material layer, wherein the release layer is associated with the material layer Forming a mixed polymer layer on the release layer, wherein the mixed polymer layer has a plurality of scattering particles; performing a sedimentation step to cause the scattering particles in the mixed polymer layer to settle to Mixing the bottom of the polymer layer to directly contact the release layer; and separating the mixed polymer layer from the carrier to form a plurality of protrusions and partially exposing the scattering particles to the protrusions External flexible substrate. The method for fabricating a flexible substrate according to claim 1, wherein the material of the material layer comprises a polymer material. The method for fabricating a flexible substrate according to claim 1, wherein the material of the material layer comprises a photoresist material. The method for fabricating a flexible substrate according to claim 1, wherein the material layer comprises a single metal, a metal vapor, a non-metal oxide, a non-metal nitride, a non-metal oxide, and a ceramic material. Or a composite material composed of the above materials. The method for fabricating a flexible substrate according to claim 1, wherein the material of the release layer comprises poly-para-xylylene (parylene). The method for producing a flexible substrate according to claim 1, wherein the material of the mixed polymer layer comprises polyamidamine (PI). The method for fabricating a flexible substrate according to claim 1, further comprising: forming a gas barrier layer on the mixed polymer layer before separating the mixed polymer layer from the carrier, wherein the resist The gas layer is composed of at least one organic material layer and at least one inorganic material layer stacked on each other, and the organic material layer has a refractive index different from that of the inorganic material layer. The method for fabricating a flexible substrate according to claim 1, further comprising: forming a gas barrier layer on the mixed polymer layer before separating the mixed polymer layer from the carrier, wherein the resist The gas layer is composed of at least two inorganic material layers stacked on each other, and the refractive indices of the inorganic material layers are different from each other. The method for fabricating a flexible substrate according to claim 1, further comprising: forming a gas barrier layer on the mixed polymer layer before separating the mixed polymer layer from the carrier, wherein the resist The gas layer comprises a single layer of organic-inorganic composite layer, a single organic layer or a single inorganic layer. The method for producing a flexible substrate according to claim 1, wherein the step of separating the mixed polymer layer from the carrier is carried out Included: performing a detachment step to separate the mixed polymer layer from the release layer to form the flexible substrate having the protrusions and partially exposing the scattering particles to the outside of the protrusions. The method for fabricating a flexible substrate according to claim 10, further comprising: after performing the detaching step, further comprising removing a portion of the mixed polymer layer by an etching process to increase a portion of the scattering The area of the particle that is exposed outside of the protrusions. The method for fabricating a flexible substrate according to claim 1, wherein the step of separating the mixed polymer layer from the carrier comprises: performing a detachment step to cause the release layer and the release layer thereof Separating the mixed polymer layer from the material layer; and after performing the detachment step, removing the release layer by an etching process to expose a portion of the scattering particles in the mixed polymer layer to form The protrusions and portions of the scattering particles are exposed to the flexible substrate outside the protrusions. A method of fabricating a package of environmentally sensitive electronic components, comprising: providing a carrier having a material layer formed thereon, wherein the material layer has an upper surface and a lower surface opposite to each other and a plurality of recesses, and The lower surface is in contact with the carrier, and the recesses extend from the upper surface of the material layer toward the lower surface; Forming a release layer on the upper surface of the material layer, wherein the release layer is conformal to the material layer; coating a mixed polymer layer on the release layer, wherein the mixed polymer layer has a plurality of Scattering particles; performing a sedimentation step to cause the scattering particles in the mixed polymer layer to settle to the bottom of the mixed polymer layer to directly contact the release layer; forming an environmentally sensitive electronic component for the mixing And separating the mixed polymer layer and the environmentally sensitive electronic component thereon from the carrier to form a plurality of protrusions and partially exposing the scattering particles to the protrusions A package of environmentally sensitive electronic components. The method for fabricating a package of environmentally sensitive electronic components according to claim 13, wherein the material of the material layer comprises a polymer material. The method for fabricating a package of environmentally sensitive electronic components according to claim 13, wherein the material of the material layer comprises a photoresist material. The method for fabricating a package of environmentally sensitive electronic components according to claim 13, wherein the material of the material layer comprises a single metal, a metal oxide, a non-metal oxide, a non-metal nitride, and a non-metal oxynitride. , a ceramic material or a composite material composed of the above materials. The method for fabricating a package of environmentally sensitive electronic components according to claim 13, wherein the material of the release layer comprises a pair of two Toluene (Poly-para-xylylene, parylene). The method for fabricating a package of environmentally sensitive electronic components according to claim 13, wherein the material of the mixed polymer layer comprises polyamidamine (PI). The method for fabricating a package of environmentally sensitive electronic components according to claim 13 , further comprising: forming a gas barrier layer on the mixed polymer before forming the environmentally sensitive electronic component on the mixed polymer layer On the layer, wherein the gas barrier layer is composed of at least one organic material layer and at least one inorganic material layer stacked on each other, and the organic material layer has a refractive index different from that of the inorganic material layer. The method for fabricating a package of environmentally sensitive electronic components according to claim 13 , further comprising: forming a gas barrier layer on the mixed polymer before forming the environmentally sensitive electronic component on the mixed polymer layer On the layer, wherein the gas barrier layer is composed of at least two inorganic material layers stacked on each other, and the refractive indexes of the inorganic material layers are different from each other. The method for fabricating a package of environmentally sensitive electronic components according to claim 13 , further comprising: forming a gas barrier layer on the mixed polymer before forming the environmentally sensitive electronic component on the mixed polymer layer On the layer, wherein the gas barrier layer comprises a single layer of organic-inorganic composite material layer, a single organic layer or a single inorganic layer. Environmentally sensitive electronic elements as described in claim 13 A method of fabricating a package, wherein the step of separating the mixed polymer layer and the environmentally sensitive electronic component thereon from the carrier comprises: performing a detachment step to cause the mixed polymer layer and thereon The environmentally sensitive electronic component is separated from the release layer to form a package having the protrusions and the portion of the scattering particles exposed to the environmentally sensitive electronic components outside the protrusions. The method for fabricating the package of the environmentally sensitive electronic component of claim 22, further comprising: after performing the detaching step, further comprising removing a portion of the mixed polymer layer by an etching process to increase a portion The scattering particles are exposed to an area outside the protrusions. The method for fabricating a package of environmentally sensitive electronic components according to claim 13, wherein the step of separating the mixed polymer layer and the environmentally sensitive electronic component thereon from the carrier comprises: performing a a step of separating the release layer and the mixed polymer layer and the environmentally sensitive electronic component from the material layer; and after performing the detachment step, removing the release layer by an etching process to A portion of the scattering particles in the mixed polymer layer are exposed to form a package having the protrusions and a portion of the scattering particles exposed to the environmentally sensitive electronic components outside the protrusions. A method of fabricating a flexible substrate, comprising: providing a carrier having a first surface and a second surface opposite to each other and a plurality of recesses, wherein the recesses are oriented by the first surface Second surface extension; Forming a release layer on the first surface of the carrier, wherein the release layer is conformal to the carrier; coating a mixed polymer layer on the release layer, wherein the mixed polymer layer has a plurality of scattering particles; performing a sedimentation step to cause the scattering particles in the mixed polymer layer to settle to the bottom of the mixed polymer layer to directly contact the release layer; and to make the mixed polymer layer The carrier is separated to form a flexible substrate having a plurality of protrusions and portions of the scattering particles exposed to the protrusions. A flexible substrate comprising: a substrate having a first surface and a second surface opposite to each other and a plurality of protrusions on the second surface; and a plurality of scattering particles distributed on the substrate And located in the protrusions, wherein a portion of the scattering particles are exposed outside the protrusions, and an absolute value of a difference between a refractive index of each of the scattering particles and a refractive index of the substrate is divided by each of the scattering The ratio of the refractive indices of the particles is greater than or equal to 25%. The flexible substrate of claim 26, wherein the material of the substrate comprises a mixed polymer. The flexible substrate of claim 27, wherein the mixed polymer comprises polyamidamine (PI).