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TWI358379B - A wafer container with at least one latch - Google Patents

A wafer container with at least one latch Download PDF

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Publication number
TWI358379B
TWI358379B TW097130938A TW97130938A TWI358379B TW I358379 B TWI358379 B TW I358379B TW 097130938 A TW097130938 A TW 097130938A TW 97130938 A TW97130938 A TW 97130938A TW I358379 B TWI358379 B TW I358379B
Authority
TW
Taiwan
Prior art keywords
wafer
wafer cassette
door
opening
door body
Prior art date
Application number
TW097130938A
Other languages
Chinese (zh)
Other versions
TW201006740A (en
Inventor
Chin Ming Lin
Ming Long Chiu
Original Assignee
Gudeng Prec Industral Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Gudeng Prec Industral Co Ltd filed Critical Gudeng Prec Industral Co Ltd
Priority to TW097130938A priority Critical patent/TWI358379B/en
Priority to US12/200,953 priority patent/US20100038281A1/en
Publication of TW201006740A publication Critical patent/TW201006740A/en
Application granted granted Critical
Publication of TWI358379B publication Critical patent/TWI358379B/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67373Closed carriers characterised by locking systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67376Closed carriers characterised by sealing arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67379Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Description

1358379 2011年11月24日修正替換頁 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種前開式晶圓盒,特別是關於一種配置於前 Γ 開式晶圓盒之門體中的門閂結構(Latch)。 【先前技術】 半導體晶圓由於需經過各種不同流程的處理且需配合製程設 備,因此會被搬運到不同的工作站。為了方便晶圓的搬運且避免 受到外界的污染,常會利用一密封容器以供自動化設備輸送。請 -癱 W 參考第1圖所示,係習知技術之晶圓盒示意圖。此晶圓盒是一種 前開式晶圓盒(Front Opening Unified Pod,FOUP),係具有一盒體 10及一門體20,盒體10内部係設有複數個插槽11可水平容置複 數個晶圓,且在盒體10之一側面係具有一開口 12可供晶圓的載 出及載入,而門體20具有一個外表面21及一個内表面22,門體 20係藉由内表面22與盒體10的開口 12相結合,用以保護盒體 10内部的複數個晶圓。此外,在門體20的外表面21上配置至少 一個門閂開孔23,用以開啟或是封閉前開式晶圓盒。在上述前開 φ 式晶圓盒中,由於半導體晶圓係水平地置於盒體10内部,因此, 在前開式晶圓盒搬運過程中需有一晶圓限制件(wafer restraint),以 避免晶圓因震動而產生異位或往盒體10的開口 12方向移動。 請參考第2圖所示,係一美國公告專利6,736,268所揭露之一 種前開式晶圓盒之門體示意圖。如第2圖所示,門體20之内表面 22配置有一凹陷區域24,此凹陷區域24係從内表面22的頂端221 延伸到底端222且係在左右二個門閂結構230(於門體内部)之間, 而在凹陷區域24中再進一步配置有晶圓限制件模組,此晶圓限制 件模組係由左右二個晶圓限制件100所組成,而在每一個晶圓限 5 丄观379 2011年11月24曰修正替換頁 制件10G上係、具有複數個晶圓接觸頭11G,以利用此晶圓接觸頭 7頂持其相對的晶圓,避免晶圓在傳送過程中因震動而異位或往 •πα·σ # @移動n上述晶圓限制件模組係設置於門體 20内表面22的凹陷區域24之中,這使得晶圓僅能貼平門體2〇 其内表面22或僅能稍微落入凹陷區域24,無法有效地讓晶圓落入 凹陷區域24以縮短前開式晶圓盒前後徑的尺寸。此外,晶圓限制 件^與晶圓摩擦所產生的微粒粉塵容易累積在凹陷區域24内, 在清、潔上需先把晶圓限制件模組與門體2()内表面22之凹陷區域 24刀離’如此反覆的分離及組裝,容易造成晶圓限制件模組的鬆 此外,於另一件美國專利5,711,427中係揭露出前開式晶圓盒 之門體20中的門閂結構23〇示意圖。如第3圖所示。門體與 里體10的結合方式主要是在門體2()中(即外表面η及内表面a 之間)<的兩側分別設置活動式插梢231,且在盒體1〇開口處之邊緣 附近設有插孔(未顯示於圖中)可與插梢231相對應,並利用設 ;門體20外表面21上之門閃開孔的轉動,使插梢231與插孔互 相結合進而達到將門體2〇固定於盒體1()之目的,其中利用門問 開孔的轉動來控制插梢231的往返活動係透過―個圓形之凸輪 (cam) 232即可達成。 一而在半導體廠的實施操縱中,前開式晶圓盒的開啟主要藉由 一晶圓裝載機構(未顯示於圖中),晶圓裝載機構係、至少具有一開 門(未顯7F於圖令),晶圓褒載機構係利用此開啟閃插入前開式 2盒之門體2〇外表面21上的門問開孔23,並轉動凸輪232以 帶動活動式插梢23丨完成開啟或是封閉前開式晶圓盒。 另外,其他已揭露的前開式晶圓盒之門體中的門問結構之 ^ US5,915,562^85,957,292^US6622883 and US6902063 等。這坻門閂蛀媸达 20u年11月以日修正替換頁 其活動⑽與煙接合時,達職密之目的, 一彈性1氣密件卡=向方向上產生位移’以便藉由活動式插梢將 成二二,:的曝利皆是由複雜的機械結構來組 :除了 Β增加故障率外,也會在操動的過程令,產 固彈=成:_污染;此外,經由活動式插梢的位移來卡 '、A/、軋密的效果欠佳,無法長時間保持氣密。 且,在目前常見的前開式晶圓盒之門體20内表面上 有一些限制件,以便門體20蓋合 皮曰配置 圓接觸’使得晶圓被完全固定,以降低晶圓η:: ,過程而產生異位。而為了避免限制件與晶圓接二 〇而造成晶圓的碰撞及摩擦;因此,如第4圖所示 露一種,元件86配置在_23。中的= 之間’ S凸輪232轉動並帶動活動式插梢231封閉前開 式晶圓盒的過程中,此彈神开杜] 置於門f本 發揮阻尼的效果,使得配 接)^ 的限制件可以在和緩且平順的狀態下與晶圓 接觸,如此便可解決碰撞及摩擦的問題。這歧 卿,_,718、US7,168,587 福卿,182,2〇3 等。缺而一^括 側向牽引的方式,容易在活動式插梢23〗移動之方向上產生一: 移力1 ^會造成無法卡入盒體1〇之插孔中,致使盒體ι〇與門體 20無法蓋合n也會增加前開式晶圓盒之製造成本。 【發明内容】 依據先前技術之前開式晶圓盒之門體結構中,其門閂均θ 複雜的機械結構來㈣’除了會增加輯率外,也會在操動的尚 程中,產生太多的機械摩擦,而可能造成晶圓的污I為此,= 發明之-主要目的在於提供—種前開式晶圓盒中配置有凸輪1 7 1358379 閂結構,使J:.、晋叙设罢说从„ 加丨年丨1月24曰修正替換頁 叫之結月動裝置僅於卜平面上進行往返運動,故可以簡化 凸輪之門二I: ’主!目的在於提供一種前開式晶圓盒中配置有 -平面上I/彳藉由滑輪之設計’使其凸輪帶動滑動裝置於單 低污染往返運動時’可降低往返運動時的摩擦力,故可以降 Λ齡月之再一主要目的在於提供一種前間式晶圓盒申配置有 凸輪之門閂結構,其可在門閂結構 稱之間形成一凹陷區域,使得此凹 :此有效的容置晶圓’故可縮短前開式晶圓盒前後徑的尺寸, 且讓整體晶圓盒的重心較集中於晶圓冬 日曰圓皿的正中央,以增加晶圓盒的丨 穩疋度。 本發明還有一主要目的在於提供一前開式晶圓盒中配置有凸 輪之^1結構,其可在門體之内表面上配置晶圓限制件,可以有效 地固定晶圓。 為達上述之各項目的,本發明揭露_種前開式晶圓盒,包括一 盒體’盒體内部係設有複數個插槽以容置複數個晶圓,且在各體之 -侧面係形成-開口可供複數個晶圓之輸入及輸出,而盒體開口處 之邊緣配置至少-對插孔,以及—門體,係具有—外表面及—内 表面且於門體之邊緣配置至少—對與上述插孔相應之閃孔,門體灣 係以内表面與盒體之開口相結合’並用以保護盒體内部之複數個晶 圓,其中前開式晶圓盒之特徵在於:門體之内表面配置一凹陷區域 且凹陷區域係位於兩6出平台之間,每—凸出平台内部配置一門問 結構,門閃結構包括輪及-對滑動裝置,凸輪上配置有—對 弧形導槽與此對滑動裝置之-端上的導桿扣接,而每—個滑動裝 置皆有-滑槽可供固定於凸出平台内部之至少一個滑輪嵌入,二 使滑動裝置藉由轉動此對&輪將這些滑動裝置之另一端於上述之 13583.79 2011年11月24日修正替換頁 插孔與閃孔中進行前進及後退之往返運動。 本發明接著揭露一種前開式晶圓盒,包括一盒體,盒體内部係 設有複數個插槽以容置複數個晶圓,且在盒體之一側面係形成一開 口可供複數個晶圓之輸入及輸出,而盒體開口處之邊緣配置至少 對插孔,以及一門體,係具有一外表面及一内表面且於門體之邊 緣配置至少一對與上述插孔相應之閂孔,門體係以内表面與盒體 之開口相結合,並用以保護盒體内部之複數個晶圓,其中前開式晶 圓里之特徵在於:門體外表面及内表面之間係配置至少一門閂結 構:門問結構包括-凸輪及一對滑動裝置,凸輪上配置有一對J ^導槽與此對滑動|置之—端上的導桿扣接,而每—個滑動裝置 皆有-滑槽可供配置於門體外表面及内表面之間的至少_個滑輪 嵌广’以使滑動裝置可藉由轉動凸輪將這些滑動裝置之另一端於 上述之插孔與門孔中進行前進及後退之往返運動。 【實施方式】 更運用之技術内容、發明目的及其達成之功效有 楚的揭露,兹於下詳細說明之,並請一 圖不及圖號。 請參考第5圖,係本發明之前開式晶圓盒之門體2 G中的門閃 、、’口構60上視圖。如第气园糾- 斤不,門體2〇中包含有一對門閂結構 60 ’而每一個門閃姓播μ技—^ ° 1门、,.。構60係包括—凸輪62及一對與凸 扣接之滑動裴置64,其中,凸輪62係斤 兩鈿 相對應的滑動裝置64扣接,而#^ s以提供給 扣接而母—個滑動裝置64皆 可供配置於門體20外表面乃肉矣& 月槽642 卜录面及内表面之間的滑輪66嵌入。 姑接著’請參考第6八圖,係第5圖中之凸輪62與滑動裝置料 接觸端之放大示意圖。如篦6 v 士弟6A圖所示,滑動裝置64經由 上的導桿644(於滑動穿罟另一品、也 田,' 知 裝置另面)與凸輪62上的導槽621扣接在 9 一起,JL巾 、 牛u片口胲in晉換貝 導槽621係呈一藏狀結構。當門體20要將盒體1〇 62 * 12關閉時’會先將門體2〇與盒體10結合,然後轉動凸輪 如虽凸輪62被轉動時,位於其上的導槽621也會被同時帶動; ^逆時針方向;^疋轉9〇纟;报明顯地滑動裝置Μ會被導槽 兩側的門體20推’使得滑動裝置64之另一端之平面㈣ 緣附、斤體2G上的問孔27並伸人位於盒體1G開口 12處之邊 ίο二孔27相對應之插孔(未顯示於圖中)中,使得盒體 ” 1體0結合成-體以完成關閉盒體10之動作。當凸輪62 二二方向旋轉9。度時,則滑動裝置64之平二 體1G與門體2°可以分開。故本發明可藉由對凸輪62的 得滑動裝置64於插孔與問孔27之中進行前進及後退之 此外’在滑動裝置64被凸輪62帶動的過1358379 November 24, 2011 Revision Replacement Page IX, Invention Description: [Technical Field] The present invention relates to a front opening wafer cassette, and more particularly to a door body disposed in a front open wafer cassette Latch structure. [Prior Art] Semiconductor wafers are transported to different workstations because they need to be processed through various processes and need to be matched with the process equipment. In order to facilitate wafer handling and avoid external contamination, a sealed container is often used for automated equipment delivery. Please -瘫 W Refer to Figure 1 for a diagram of the wafer cassette of the prior art. The wafer cassette is a front opening type pod (FOUP) having a box body 10 and a door body 20, and the box body 10 is internally provided with a plurality of slots 11 for horizontally accommodating a plurality of crystals. The circle has an opening 12 on one side of the casing 10 for loading and loading of the wafer, and the door body 20 has an outer surface 21 and an inner surface 22, and the door body 20 is supported by the inner surface 22 The opening 12 of the casing 10 is combined to protect a plurality of wafers inside the casing 10. Further, at least one latch opening 23 is disposed on the outer surface 21 of the door body 20 for opening or closing the front opening wafer cassette. In the above-mentioned front-opening φ wafer cassette, since the semiconductor wafer is horizontally placed inside the casing 10, a wafer restraint is required in the front opening wafer cassette handling process to avoid wafers. The position is shifted by the vibration or moved toward the opening 12 of the casing 10. Please refer to FIG. 2, which is a schematic diagram of a door of a front opening wafer cassette disclosed in US Pat. No. 6,736,268. As shown in FIG. 2, the inner surface 22 of the door body 20 is provided with a recessed area 24 extending from the top end 221 of the inner surface 22 to the bottom end 222 and attached to the left and right latch structures 230 (in the interior of the door body) Between the recessed regions 24, a wafer constraining module is further disposed. The wafer constraining module is composed of two wafer limiting members 100, and each wafer is limited to 5 丄. View 379 November 24, 2011 Correction of the replacement page 10G system, with a plurality of wafer contacts 11G, to use the wafer contact head 7 to hold its opposite wafer, to avoid wafers in the process of transmission Vibrating and ectopic or toward πα·σ # @moving n The wafer constraining module is disposed in the recessed area 24 of the inner surface 22 of the door body 20, so that the wafer can only be affixed to the door body 2 The inner surface 22 may only slightly fall into the recessed area 24, and the wafer may not be effectively allowed to fall into the recessed area 24 to shorten the size of the front and rear diameter of the front open wafer cassette. In addition, the particulate dust generated by the wafer restraint and the wafer is easily accumulated in the recessed area 24, and the recessed area of the wafer restricting member module and the inner surface 22 of the door body 2 is first cleaned and cleaned. The separation and assembly of the 24 knives is so easy to cause the wafer limiter module to be loosened. In another U.S. Patent 5,711,427, the latch structure 23 in the door body 20 of the front open wafer cassette is revealed. 〇 Schematic. As shown in Figure 3. The combination of the door body and the inner body 10 is mainly provided with a movable insertion piece 231 on both sides of the door body 2 (), that is, between the outer surface η and the inner surface a), and is opened in the casing 1 A jack (not shown) is disposed near the edge of the door to correspond to the plug 231, and the rotation of the door flash opening on the outer surface 21 of the door body 20 is utilized to make the plug 231 and the jack mutually The purpose of fixing the door body 2〇 to the casing 1() is achieved by combining the rotation of the door opening to control the reciprocating movement of the insertion piece 231 through a circular cam 232. In the implementation of the semiconductor factory, the opening of the front opening wafer cassette is mainly by a wafer loading mechanism (not shown), and the wafer loading mechanism has at least one opening door (not shown in the figure). The wafer loading mechanism utilizes the opening of the door opening 23 on the outer surface 21 of the door 2 of the front opening 2 box, and rotates the cam 232 to drive the movable pin 23 to open or close. Front open wafer cassette. In addition, the disclosed door structure of the door of the front open type wafer cassette is US 5,915,562,85,957,292, US6622883 and US6902063. This door latches up to 20u years in November to replace the page with its activity (10) when it is engaged with the smoke, for the purpose of confidentiality, an elastic 1 airtight member card = displacement in the direction 'to make it possible by the movable tip In 22:: The exposure is composed of complex mechanical structures: in addition to increasing the failure rate, it will also be in the process of operation, the production of solids = _ pollution; in addition, through the movable tip The displacement to the card ', A /, the effect of rolling density is not good, can not maintain airtight for a long time. Moreover, there are some limiting members on the inner surface of the door body 20 of the conventional front open type wafer cassette, so that the door body 20 is covered with the skin contact circular contact so that the wafer is completely fixed to reduce the wafer η:: The process produces an ectopic. In order to avoid the collision and friction of the wafer in order to avoid the connection between the limiting member and the wafer; therefore, as shown in Fig. 4, the element 86 is disposed at _23. In the middle of the 'S cam 232 rotates and drives the movable spigot 231 to close the front open wafer cassette, this elastic shovel is placed on the door f to play the damping effect, so that the mating) ^ limit The piece can be brought into contact with the wafer in a gentle and smooth state, so that the problem of collision and friction can be solved. This dissert, _, 718, US7, 168, 587 Fu Qing, 182, 2 〇 3 and so on. The lack of a lateral traction method makes it easy to produce a movement in the direction of the movable insertion tip 23: The displacement force 1 ^ causes the cartridge to be inserted into the socket of the casing 1 , causing the cartridge to be The failure of the door body 20 to cover n also increases the manufacturing cost of the front opening wafer cassette. SUMMARY OF THE INVENTION According to the prior art, in the door structure of the open wafer cassette, the mechanical structure of the door latch θ is complicated (4) 'In addition to increasing the rate, it will also generate too much in the running process. Mechanical friction, which may cause the contamination of the wafer I, = the invention - the main purpose is to provide a type of front-opening wafer cassette with a cam 1 7 1358379 latch structure, so that J:. From the 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨The main purpose of the configuration is that the I/彳 on the plane is designed to 'make the cam to drive the sliding device in a single low-pollution reciprocating motion to reduce the friction during the reciprocating motion, so that the main purpose of reducing the age of the moon is to provide A front-end wafer cassette is configured with a cam latch structure, which can form a recessed area between the latch structure, so that the recess: the effective accommodating wafer can shorten the front and rear diameter of the front open wafer cassette Size, and let the whole wafer The center of gravity of the cartridge is concentrated in the center of the wafer winter tray to increase the stability of the wafer cassette. Another main object of the present invention is to provide a structure in which a cam is disposed in a front opening wafer cassette. The wafer restriction member can be disposed on the inner surface of the door body, and the wafer can be effectively fixed. For the above purposes, the present invention discloses a front opening wafer cassette, including a box body a plurality of slots are provided for accommodating a plurality of wafers, and a side opening-opening is provided for inputting and outputting a plurality of wafers, and an edge of the opening of the box body is configured with at least a pair of jacks. And a door body having an outer surface and an inner surface and disposed at least at an edge of the door body - a flash hole corresponding to the jack, the inner surface of the door body is combined with the opening of the box body and used for protection a plurality of wafers inside the casing, wherein the front opening wafer cassette is characterized in that: a concave area is arranged on the inner surface of the door body, and the concave area is located between the two 6-out platforms, and a door structure is arranged inside each protruding platform , the door flash structure includes the wheel and - For the sliding device, the cam is provided with a pair of arcuate guide grooves and a guide rod on the end of the pair of sliding devices, and each of the sliding devices has a sliding groove for fixing at least the inside of the protruding platform. A pulley is embedded, and the sliding device moves the pair of the other end of the sliding device to the above-mentioned 13583.79 November 24, 2011 to correct the reciprocating movement of the replacement page jack and the flash hole by rotating the pair of & The invention further discloses a front opening wafer cassette, comprising a box body having a plurality of slots therein for accommodating a plurality of wafers, and forming an opening on one side of the box body for a plurality of crystals The input and output of the circle, and the edge of the opening of the box is disposed at least with respect to the jack, and a door body having an outer surface and an inner surface and at least one pair of latch holes corresponding to the jacks disposed at the edge of the door body The door system combines the inner surface with the opening of the casing and is used to protect a plurality of wafers inside the casing. The front opening wafer is characterized in that at least one latch structure is disposed between the outer surface of the door and the inner surface: The door structure includes a cam and a pair of sliding devices, and the cam is provided with a pair of J^ guiding grooves and the pair of sliding guides on the sliding side, and each sliding device has a chute. Having at least one pulley disposed between the outer surface of the door and the inner surface to enable the sliding device to advance and retreat the other end of the sliding device into the jack and the door hole by rotating the cam . [Embodiment] The technical content, the purpose of the invention, and the effects achieved by it are disclosed in detail, and are explained in detail below, and please refer to the figure number. Please refer to Fig. 5, which is a top view of the door flash and the mouth structure 60 in the door body 2G of the open wafer cassette of the present invention. For example, the gas garden is not correct, the door body 2〇 contains a pair of latch structures 60 ’ and each door flashes the surname μ technology — ^ ° 1 door, . The structure 60 includes a cam 62 and a pair of sliding members 64 connected to the male fasteners, wherein the cam 62 is fastened by the corresponding sliding device 64, and the #^ s is provided for the fastening and the female sliding The device 64 can be embedded in a pulley 66 disposed on the outer surface of the door body 20 between the meat bowl & the moon groove 642 recording surface and the inner surface. Please refer to Figure 68, which is an enlarged view of the contact end of the cam 62 and the sliding device in Figure 5. As shown in Fig. 6 v, the slide device 64 is fastened to the guide groove 621 on the cam 62 via the upper guide rod 644 (sliding through the other product, the field, the other side of the device). , JL towel, cattle u piece mouth 胲 in the Jin change Bay channel 621 is a Tibetan structure. When the door body 20 is to close the casing 1 〇 62 * 12, the door body 2 先 will be first combined with the casing 10, and then the rotating cam, if the cam 62 is rotated, the guide groove 621 located thereon will be simultaneously Driven; ^ counterclockwise direction; ^ 疋 turn 9 〇纟; reported that the sliding device Μ will be pushed by the door 20 on both sides of the guide groove 'so that the other end of the sliding device 64 plane (four) edge attached, on the body 2G The hole 27 is extended and the person located at the opening 12 of the casing 1G ίο corresponds to the corresponding hole (not shown in the figure), so that the casing 1 body 0 is combined into a body to complete the closing of the casing 10. When the cam 62 rotates by 9. degrees in the second and second directions, the flat body 1G of the sliding device 64 can be separated from the door body by 2°. Therefore, the present invention can be used in the jack by the sliding device 64 of the cam 62. In addition, the advancement and retreat of the hole 27 are further described as 'the slide device 64 is driven by the cam 62.

=之進《642嵌入有至少一個滑輪66,因此,可以降J 進料返運動時的摩擦^在本發明之實施财,凸輪Μ =疋金屬其也可以是高分子塑膠材質所形成,本發明並 =以限制。而凸輪62其外形可以係圓形 :圓=此外,滑動裝置64在靠一 ^ ”以彈片68之-端連接在一起,而此定位彈片μ 在門體2。上。故當凸輪62轉動時(例如逆時針方向旋轉 二度二滑動裝置64會被凸輪62向門體2〇之問孔”方向推,使 ^月^置64之平面646得以穿過門體2〇上的問孔”,此時, :二吏::位彈片6刚縮。接著’當門體2〇要打開時( %針方向旋轉90度),隨著凸輪62順時針方向轉動 也會依據虎克料所提供之力,帶動滑動裝置 =8 之位置。在本發明之實施财,滑動裝置64及^1^= 是金屬姑暂甘u 2〇11年U月24曰修正替換頁 =材質,其也可以是高分子塑膠材質所形成,本發明並不加 ^ 而滑輪66之材質亦則未加以限制。 地配6B圖所示,在一較佳實施例中,滑輪66係成對 1體20的外表面及内表面之間,且彼此相距—適當距 t時輪662及滑輪664嵌入在滑動裝置64之滑⑽ 646 - /輪66料以正確且平順地料滑動裝置64之平面 646得以穿過門體2〇上的閃孔”。 十曲 戈二上述均是以一個凸輪62及-個滑動裝置64來 -兑月門閃、..。構60之操作過程,但實際上,每一個凸輪^係斑一 對滑動裝置64相接觸,且每一 ’〜、 構州請參考第5圖)。 内部係配置有一對門閃結 接著:請再參考第7圖,本發明之滑動裝置料其 可以係不固定在門辨, w 坪乃08 ΤΓ ^ ,, ,疋位彈片68可以係與滑動裝置64 — =,二1片:8 一端可固定於滑動裝置64在靠近凸輪62端 ^ / 片68另—端則固定於或接近於滑動裝置64之 之:=6::外’如第7圖、第8Α圖及請圖所示 在π動裝置64罪近門體2〇端的平面_上,可進一 ¥輪撥才干643。此導輪撥桿643之—端係可活 ’ 之上,而導輪撥捍643之另_ *力十面646 便滑動裝置64被凸輪62帶1 ^可再滑輪6431連接,以 問…平順地滑!Γ::Γ 以穿過位於門體㈣ 擦而產生污祕。其中,插孔28中,如此方不會因為摩 ⑷相同,用以容置導輪;^上的插孔28外形可與導輪撥桿 ^ y 于643及滑動裝置64之平面646。 ^考弟9圓,係本發明之門閃 輪62轉動時(例如:逆時針方向旋轉90度),滑时置 _向門體2〇之㈣方向推,使得滑動裝置= 11 1358379 、 2011年1丨月24日修正替換頁= into the "642 embedded with at least one pulley 66, therefore, can reduce the friction of the J feed back movement ^ in the implementation of the present invention, the cam Μ = 疋 metal can also be formed of polymer plastic material, the present invention And = limit. The cam 62 can be rounded in shape: round = in addition, the sliding device 64 is connected together at the end of the elastic piece 68, and the positioning elastic piece μ is on the door body 2. Therefore, when the cam 62 rotates (For example, rotating the second-degree sliding device 64 counterclockwise will be pushed by the cam 62 in the direction of the hole of the door body 2, so that the plane 646 of the frame 64 can pass through the hole on the door body 2", When: 2:: The spring 6 is just shrinking. Then, when the door 2 is opened (% of the needle is rotated 90 degrees), the rotation of the cam 62 in the clockwise direction is also based on the force provided by the tiger. In the implementation of the present invention, the sliding device 64 and ^1^= are metal gu gu gu 2 〇 11 years U month 24 曰 correction replacement page = material, which can also be a polymer The plastic material is formed, the invention is not added, and the material of the pulley 66 is not limited. As shown in Fig. 6B, in a preferred embodiment, the pulley 66 is formed on the outer surface and the inner surface of the body 20. Between the surfaces, and at a distance from each other - the wheel 662 and the pulley 664 are embedded in the sliding device (10) 646 - / wheel 66 of the sliding device 64 at the proper distance t The plane 646 of the slide device 64 can pass through the flash hole on the door body 2". The above is a cam 62 and a sliding device 64 - the moonlight flashes, .. 60 The operation process, but in fact, each of the cams is in contact with a pair of sliding devices 64, and each '~, the state is referred to Figure 5). The internal system is provided with a pair of door flash junctions. Next, please refer to FIG. 7 again. The sliding device of the present invention may not be fixed to the door, and w ping is 08 ΤΓ ^ , , , , , , , , , , , , , , , , , , , , , , , , — =, two pieces: 8 one end can be fixed to the sliding device 64 near the end of the cam 62 / the other end of the piece 68 is fixed at or close to the sliding device 64: = 6:: outside 'as shown in Figure 7, In the figure 8 and the figure shown above, in the plane _ of the π-moving device 64 near the end of the door body 2, a round-trip 643 can be entered. The end of the guide wheel lever 643 can be alive, and the other side of the guide wheel dial 643 can be connected by the cam 62 with the 1 ^ re-slider 6431 to ask for smoothness. Ground slip! Γ::Γ Smudged by rubbing through the door (4). Among them, the jack 28 is not so the same as the motor (4) for accommodating the guide wheel; the jack 28 on the upper surface can be aligned with the guide wheel lever y 643 and the plane 646 of the sliding device 64. ^Kaodi 9 round, when the door flash wheel 62 of the present invention rotates (for example: 90 degrees counterclockwise rotation), when sliding, it is pushed toward the (4) direction of the door body 2, so that the sliding device = 11 1358379, 2011 Correction replacement page on January 24

以及位於其上的一對導輪撥桿⑷可以穿過門體上的問孔W 且滑輪643i可以平順地滑入盒體1〇之插孔^。很明顯地,此時, 定位彈片Μ已被愿縮。接著,當門體2〇要打開時(例如:順時 針方向旋轉90度),隨著㈣62轉動,定位彈片Μ也會依據虎 克定律所提供之力,帶動滑動裝置64之另—端之平面_恢復至 開啟狀態之位置。當然,上述定位彈片68其亦可以係一端固定於 =動裝置64在靠近凸輪62端之附近,而另—端則固枝導輪撥 桿643,使導輪撥桿643亦能較順利地恢復至開啟狀態之位置。在 施例中,滑動裝置…定位彈片⑽以及導輪撥桿⑷ 4疋’材質’其也可以是高分子材質塑膠所形成本發明並 不加以限制。而滑輪66之材質亦則未加以限制。 此=請參閱第1〇圖所示,係本發明之-種晶圓盒之示意圖。 H係-種前開式晶圓盒,主要係包括—盒體ι〇及 ^體Η)的其中-個側面係有一開口 12可提供晶圓的輸入以 及輸出,而門體20則是具有一外表面21及一内表面22,門體Μ 的外表面21係配置至少—個間開孔(未顯示於第U)圖中)’用以 開啟或是封閉前開式晶圓盒,而在門體2〇的内表面22 户 係配置有-凹陷區域24且凹陷區域24係位於兩凸出平台 間’其中兩凸出平台25之内部係配置著前述之門心構 陷區域24的主要目的係用來承接盒體1〇内部的複數 減少整個晶圓盒的前後經尺寸,而在兩凸出平台: 圓限制件模組3G,除了可限制晶圓往開口方向移動外,也 控制晶圓進入凹陷區域24的量。 了用來 上述門體2〇内表面22凹陷區域24的長度係盎各體 的插槽U間距及晶圓數量有關。以㈠的晶圓而二對於晶^ 12 2011年11月24日修正替換頁 之間的間距’產業間已有標準規定,以期達到最大的晶圓承載密 ,同時能容納機器手臂伸人進行晶圓輸人及輸出;而目前常見的 曰圓现係大約可奋置25片晶圓。然而,本發明凹陷區域24的寬 度及深度,則可較有彈性,當門體20的厚度維持不變時,將凹陷 區域24的深度設的較大’則可允許晶圓較進入凹陷區域%,而此 時凹陷區域24的寬度也需隨之增大。 人其次,請參閱第η圖及第12圖所示,係本發明之一種晶圓 盒其晶圓限制件模組及其固定於門體之示意圖。晶圓限制件模組 馨 30係具有-長條形底座3卜長條形底座31係有二長邊31[及二 丑邊31S,—長邊31L中有-長邊31L係與凹陷區域24相鄰, ^在上述相鄰的長邊31L上係形成複數個間隔排列之彎延部%, 每個考延部32與其自由端之間形成近似半圓形之凸出部32c, 而在近似半圓形之凸出部32c上配置有一中央導槽32g,以藉由 半圓形之凸出部32C之中央導槽32G與晶圓接觸,可限制相對應 的晶圓往開口方向移動。 上述近辦®形之凸出部3 2 C其中央導槽3 2 G個來承接晶 圓中央導才a 32G的寬度可以跟晶圓的厚度相同,可讓晶圓陷入 _ 財央導槽32G中’以避免晶圓的上下移動。而在中央導槽32g 其接觸晶圓的表面係可包覆一種耐磨耗材,例如:PEEK材質,以 =低對晶圓的摩擦。此外’晶圓限制件模組3〇可以係一體成形的 '。構且可以由一種材質所組成或是由兩種不同的材質製成,例 如.將底座31及彎延部32以一種材質製成並且在彎延部上再 形成另-種树質的半圓形之凸出部32C。报明顯的,長條形的底 f ^1與f延部32係形成一角度’此角度約為1〇〜6〇度。由於凹 陷區域24兩旁的晶圓限制件模組3〇係對稱的,因此,當晶圓限 制件核組30在限制晶圓時(如第13圖所示),可以產生一僅往晶圓 13 1358379 2011年11月24曰修正替換頁 中心點方向推的合力,不會造成晶圓左右的晃動。而晶圓限制件 核組30除了此限制晶圓往開口方向移動外,也讓晶圓幾乎完全的 落入凹區域24中,使晶圓盒的前後徑尺寸縮小,且讓整體晶圓 盈的重。較-集中於晶圓盒的正中央,以增加晶圓盒的穩定度。而如 第11圖所不’由於彎延部32上的複數個半圓形之&出部32C之 間係有缺π g]此彎延部32會比較有彈形,係可允許晶圓的壓迫 而有些許的變形。 此外由第12圖及第13圖可知,底座31係具有複數個安裝 孔33’而内表面22上相對於這些個安裝孔^處則有突出柱%, h曰圓限制件核組30以卡入(snap 〇n)的方式固定於門體2〇内表 面22凹陷區域24㊆旁的凸出平台25上。當然,為了生產的方便, 亦似可將晶圓限制件模組3〇直接與門體2〇内表面22 一體成形, 以避免晶圓限制件模組3G的脫落。接著,請參考帛Μ圖及第 14B圖日區域24兩旁的晶圓限制件模組3〇亦可以係—體成 形此ϋ成形的結構係具有—孔洞34以對應門體2〇的凹陷區 域24。而此-體成形的結構可以係用卡入㈣叩⑽)的方式固定於 門體20内表面22亦或是直接與門體2〇内表面22 一體成形。 其次,請參閱第15圖所示,係本發明之另一種晶圓盒之示意 圖。此刖開式晶圓盒與上述第1〇圖之晶圓盒相同,係包含一盒體 1〇及-門體2G’不同的是固定於門體2()内表面22凹陷區域24 兩旁的晶圓限制件模組400係與上述晶圓限制件模組3〇不同。如 第16圖及第17A圖所不’凹陷區域24兩旁的晶圓限制件模組彻 係由複數個間隔排列之晶圓限制件4〇靠成,且每—個晶圓限制 牛〇 /、凹區域24另-邊的限制件模組4〇〇上相對的晶圓限制 2 40對齊,其中每一個限制件4〇係具有一基部41,基部μ係固 疋於門體20内表面22上,而基部41有一侧邊係鄰近凹陷區域 13583.79 且在上述側邊向各體10的門加丨年η月24日修正替換頁 凹陷區域24中央處延伸:曲:二延伸成-彎曲部42後,轉往 署於_f 使這些複數個曲臂43係配 =:!Γ的上方兩側,而在上述曲臂43與彎曲部42交接 二桩觸:一弟一接觸端44’而曲臂43的自由端則係具有-第 二开广45。如第17Α圖所示,每一個晶圓限制件40可以係一 的彈性結構(例如··熱塑性彈性結構),當門體Μ與盒體ι〇 ^&或剛要結合時,晶圓限制件⑼的第—接觸端4And a pair of guide wheel levers (4) located thereon can pass through the hole W on the door body and the pulley 643i can smoothly slide into the socket of the casing 1 . Obviously, at this time, the positioning shrapnel has been forced to shrink. Then, when the door body 2 is to be opened (for example, 90 degrees clockwise rotation), with the (four) 62 rotation, the positioning elastic piece Μ will also drive the other end plane of the sliding device 64 according to the force provided by Hooke's law. _Revert to the position of the open state. Of course, the positioning elastic piece 68 can also be fixed at one end to the vicinity of the end of the cam 62, and the other end is fixed to the guide wheel lever 643, so that the guide wheel lever 643 can be recovered smoothly. To the position of the open state. In the embodiment, the sliding device ... positioning elastic piece (10) and the guide wheel lever (4) 4 疋 'material' may also be formed of a polymer material plastic without limitation. The material of the pulley 66 is also not limited. This is shown in Figure 1 and is a schematic view of a wafer cassette of the present invention. The H-series front-opening wafer cassettes, mainly including one of the casings and the body, have an opening 12 for providing input and output of the wafer, and the door 20 has an outer portion. The surface 21 and an inner surface 22, the outer surface 21 of the door body 系 is disposed with at least one opening (not shown in the U) (for opening or closing the front opening wafer cassette, and the door body) The inner surface 22 of the 2 〇 is configured with a recessed area 24 and the recessed area 24 is located between the two protruding platforms. The main purpose of the inner structure of the two protruding platforms 25 is to arrange the aforementioned gate centering recessed area 24 The plurality of interiors of the housing 1 减少 reduce the front and rear dimensions of the entire wafer cassette, and in the two protruding platforms: the circular limiting module 3G, in addition to restricting the movement of the wafer in the opening direction, also controls the wafer to enter the recessed area. The amount of 24. The length U of the recessed area 24 of the inner surface 22 of the door body 2 is related to the slot U pitch of the body and the number of wafers. With (a) wafer and two for crystal ^ 12 November 24, 2011 revised replacement page spacing between the industry's existing standards, in order to achieve maximum wafer load density, while able to accommodate the robot arm extension The round input and output; and the current common round is now about 25 wafers. However, the width and depth of the recessed region 24 of the present invention may be more flexible. When the thickness of the gate body 20 is maintained, the larger depth of the recessed region 24 may allow the wafer to enter the recessed region. At this time, the width of the recessed area 24 also needs to increase. Secondly, referring to FIG. 11 and FIG. 12, it is a schematic diagram of a wafer constraining module of the wafer cassette of the present invention and its fixing to the door body. The wafer restriction member module 30 has a long strip base 3 and a long strip base 31 having two long sides 31 [and two ugly sides 31S, - a long side 31L - a long side 31L and a recessed area 24 Adjacent, ^ is formed on the adjacent long side 31L by a plurality of spaced portions of the curved portion %, and each of the test portion 32 and the free end thereof form an approximately semicircular projection 32c, and is approximated A semi-circular projection 32c is provided with a central guide groove 32g for contacting the wafer by the central guide groove 32G of the semi-circular projection 32C, thereby restricting the corresponding wafer from moving in the opening direction. The above-mentioned near-shaped protruding portion 3 2 C has a central guiding groove 3 2 G to support the center of the wafer, and the width of the a 32G can be the same as the thickness of the wafer, which can cause the wafer to sink into the channel. 'To avoid the up and down movement of the wafer. In the central guiding groove 32g, the surface contacting the wafer can be coated with a wear-resistant consumable, for example, PEEK material, to lower the friction of the wafer. In addition, the "wafer limiter module 3" can be integrally formed. The structure may be composed of one material or two different materials, for example, the base 31 and the curved portion 32 are made of one material and another semi-circle of the tree is formed on the curved portion. The convex portion 32C. It is obvious that the elongated bottom f ^1 forms an angle with the f extension 32. This angle is about 1 〇 6 〇. Since the wafer limiter module 3 on both sides of the recessed area 24 is symmetrical, when the wafer limiter core set 30 is in the limit wafer (as shown in FIG. 13), a wafer only 13 can be generated. 1358379 On November 24th, 2011, the combined force of the center point of the replacement page was corrected, and the wafer was not shaken left or right. In addition to restricting the movement of the wafer in the opening direction, the wafer limiting member core group 30 also allows the wafer to almost completely fall into the concave region 24, so that the front and back diameter of the wafer cassette is reduced, and the overall wafer is surplus. weight. More focused on the center of the wafer cassette to increase the stability of the wafer cassette. However, as shown in FIG. 11, the curved portion 32 is relatively elastic due to the absence of π g between the plurality of semicircular & portions 32C on the curved portion 32. The oppression and a slight deformation. In addition, as can be seen from FIGS. 12 and 13 , the base 31 has a plurality of mounting holes 33 ′ and the inner surface 22 has a protruding column % with respect to the mounting holes, and the h限制 circular limiting member core group 30 is a card. The manner of inserting (snap 〇n) is fixed on the protruding platform 25 next to the recessed area 24 of the inner surface 22 of the door body 2 . Of course, for the convenience of production, it is also possible to integrally form the wafer restriction member module 3 directly with the inner surface 22 of the door body 2 to prevent the wafer restriction member module 3G from falling off. Next, please refer to the map and the wafer restriction member module 3 on both sides of the 14th day region 24, which may also be formed by forming the structure of the crucible having a hole 34 corresponding to the recessed portion 24 of the door body 2〇. . The body-formed structure may be fixed to the inner surface 22 of the door body 20 by means of a snap-in (four) 叩 (10) or directly formed integrally with the inner surface 22 of the door body 2 . Next, please refer to Fig. 15, which is a schematic view of another wafer cassette of the present invention. The split wafer cassette is the same as the wafer cassette of the first drawing, and comprises a box body 1 and a door body 2G' which are fixed on both sides of the recessed area 24 of the inner surface 22 of the door body 2 (). The wafer stopper module 400 is different from the wafer stopper module 3 described above. As shown in Fig. 16 and Fig. 17A, the wafer restriction member on both sides of the recessed region 24 is completely formed by a plurality of spaced-apart wafer restriction members 4, and each wafer is limited to a calf/, The concave portion 24 is further aligned on the opposite side of the spacer module 4, wherein each of the limiting members 4 has a base 41 which is fixed to the inner surface 22 of the door 20. And the base portion 41 has a side edge adjacent to the recessed area 13583.79 and is extended to the center of the recessed area 24 of the replacement page at the side of the door 10 of the body 10 on the side of the above-mentioned side: the curve: the second extension into the curved portion 42 To the _f, the plurality of crank arms 43 are coupled to the upper sides of the =:! ,, and the above-mentioned curved arms 43 and the curved portion 42 are handed over to the two piles: one brother and one contact end 44' and the crank arms The free end of 43 has a second opening 45. As shown in Fig. 17, each of the wafer restricting members 40 may be provided with an elastic structure (e.g., a thermoplastic elastic structure), and the wafer is restricted when the door body is combined with the case or the film. The first contact end of the piece (9)

的連線(体罐門體2G的内側面22互相平行。此時,晶 2先跟第二接觸端45接觸,當晶圓接觸第二接觸端45時,會 使者曲部42產生形變且槓桿帶動曲臂43,使曲臂43上的另一接 觸端即第-接觸端44依序地接觸晶圓。此時,如第nB圖所示, 門體2〇係與盒體1〇密合且晶圓限制件4〇的第一接觸端44及第 :接觸端45的連線(44_45)跟門體2〇的内表面22形成一夹角。很 清楚的’每-個晶圓限制件40係以兩個接觸端與晶圓產生接觸, 係可以穩固地頂持晶圓或限制晶圓往開口方向移動,可降低晶圓 在,輸過程中’因為震動而產生微粒粉塵。此外,也讓晶圓有效 的洛入凹陷區域24中,以縮短晶圓盒的前後徑尺寸。 。上述晶圓限制件40其彎曲部42係一彈性結構(例如··熱塑性 彈性結構)’係有—彎曲的角度,因此當Η體20與盒體1()從未密 合到密合時’此彎曲角度係會改變,使第一接觸端44依序第二接 觸端45與晶圓接觸。此外,彎曲部42與曲臂43可以係兩種不同 :才質,像是不同硬度的塑膠,可使彎曲部42產生較大的形變而曲 臂43係較不容易形變。而第一接觸端44及第二接觸端衫亦可各 具有-凹陷’使晶圓能陷人凹陷中,避免晶圓上下移動。此外, 複數個晶圓限制件4G可以係形成於—底座,且此底座係、固定於門 體20的内表面22。當然’複數個晶圓限制件4〇也可以係跟門體 15 丄妁8379 2011年11月24日修正替換頁 的内表面22直接-體成形’可降低生產所需的成本。 接著,請參閱第18圖所示,係本發明之再一種晶圓盒之示意 圖。此前開式晶圓盒與上述第15圖之晶圓盒相同,係包含一盒體 W及—門體20’不同的是固定於門體2〇内表面22凹陷區域以 =旁的晶圓限制件模組猶其每—個晶圓限制件係具有三個接觸 =°如第19圖及第20A圖所示,凹陷區域24兩旁的晶圓限制件 =0係由複數個晶圓限制件5〇所排列組成,且每一個晶圓限 與凹陷區域24另一邊的限制件模組上相對的晶圓限 =50對齊’其中每一個晶圓限制件%係具有—基部Μ,基部 -固接定於:的内表面22上,而其另-端… 區域24 臂52具有二自由端,其中較遠離凹陷 二中央處的:的白自:端形成—第一接觸端54’而較靠近凹陷區域 臂53 =有/端係更進一步與-第二曲臂叫第二曲 3貝丨係具有一第二接觸端”及一第三接觸端%。 性二圓限制件5〇的基部51係-彈性結構(例如:献塑性彈 係至少具有—彎曲處,當門體2〇與盒 二 要結合時,晶圓限制件5〇的埜木…〇或剛 陷區域24的表面上方^ ^ 53係平貼或稍微懸空於凹 角度產生改L:::二時^ 53上的第二接觸端55帶及動第弟,^ FIM- A 及第二接觸端56接觸晶圓。此時,如坌 圖所不,當Η體20與盒體1()密 f如第細 及第一曲臂52所槓桿帶動而遠離凹陷區域:的表面係被基部51 制件50的第—接觸端54、 域的表面,且晶圓限 圓接觸。报明顯的,由於 端55及第二接觸端56係跟晶 於晶圓,係可較穩固地限:晶圓限制件50係提供三個接觸端 J曰曰圓在開口方向正中央移動或開口較 1358379 2〇11年11月24日修正替換頁 兩旁的方向移動。當然,本實施例亦可以在第一曲臂52的二個自 由端之間並且靠近門體20内表面22的一側邊上配置有一樞紐 57’此樞紐57係固定於門體2〇内表面22,如此當基部51形變時 或其彎曲處角度改變時可較穩固地槓桿帶動第一曲臂52及第二曲 臂53 ’使第一接觸端54、第二接觸端55及第三接觸端%皆能緊 密的與晶圓接觸。 而如同前述兩個接觸端之實施例,此複數個晶圓限制件5〇其 中的每-個晶圓限制件50可以係一體成形的彈性結構(例如:熱 φ 帛性彈性結構)’其基部51與第-曲臂52或第二曲臂53亦可以 係不同材質或彈性結構(例如:熱塑性彈性結構),像是不同硬度的 塑膠,可使基部51有較大的形變而曲臂係較不容易形變。當然, 第一接觸端54、第二接觸端55及第三接觸端%亦可以具有:凹 陷,可以使晶圓陷入凹陷中,避免晶圓上下移動。而上述複數個 晶圓限制件50亦可以係先形成於一底座,而此底座係固定於門體 20的内表面22或複數個晶圓限制件5〇直接係跟門體2〇的内表面 22直接一體成形。 此外,本發明之門體20的内表面22係可以為一平面,可以 # 係、沒有凹陷的,而在内表面22與外表面21之間配置有至少一個 門閃結構60,而-較佳之實施例中係配置有一對門閃結構6〇。由 於門閃結構60與前述之實施例相同,故不再贅述。此外,為了使 門體20與盒體10蓋合時,能夠固定已放置於盒體10中的複數個 晶圓’因此可以在上述平面的内表面22上配置有至少一限制件模 組或接近中央區域的地方置有至少—限制件模組。而本發明對 此限制件模組之結構或是形式並不加以限制,故其可以包括前述之 限制件Μ組30、限制件模組4〇〇或是限制件模組5〇〇或是類似之 H同樣地’由於限制件模組之詳細構造與前述之實施例相同, 17 1358379 201丨年11月24日修正替換頁 故不再贅述。 很明顯地,本發明之門閂結構60在凸輪62的帶動下,滑動 裝置64只進行前進及後退之往返運動,而沒有再任何縱向(即垂The wiring (the inner side surfaces 22 of the body can body 2G are parallel to each other. At this time, the crystal 2 first contacts the second contact end 45, and when the wafer contacts the second contact end 45, the curved portion 42 is deformed and the lever is deformed. The crank arm 43 is driven to sequentially contact the other contact end on the crank arm 43, that is, the first contact end 44. At this time, as shown in the nth figure, the door body 2 is closely adhered to the case body 1 And the connection (44_45) of the first contact end 44 and the contact end 45 of the wafer limiting member 4〇 forms an angle with the inner surface 22 of the door body 2〇. It is clear that each wafer restriction member The 40 series makes contact with the wafer with two contact ends, which can firmly hold the wafer or restrict the movement of the wafer to the opening direction, which can reduce the particle dust generated by the vibration during the process of the wafer. The wafer is effectively inserted into the recessed region 24 to shorten the front and rear diameter of the wafer cassette. The curved portion 42 of the wafer restricting member 40 is an elastic structure (for example, a thermoplastic elastic structure) Angle, so when the carcass 20 and the case 1 () are never tight to close, the bending angle will change, making the first The contact end 44 contacts the wafer in sequence with the second contact end 45. In addition, the curved portion 42 and the curved arm 43 can be two different types: a plastic such as a plastic of different hardness can cause a large deformation of the curved portion 42. The curved arm 43 is less likely to be deformed, and the first contact end 44 and the second contact end shirt may each have a - recessed shape to enable the wafer to be trapped in the recess to prevent the wafer from moving up and down. In addition, the plurality of wafers The limiting member 4G can be formed on the base, and the base is fixed to the inner surface 22 of the door body 20. Of course, the plurality of wafer limiting members 4 can also be attached to the door body 15 丄妁 8379 November 24, 2011 The daily correction of the inner surface 22 of the replacement page can be reduced to the cost required for production. Next, please refer to Fig. 18, which is a schematic view of still another wafer cassette of the present invention. The wafer cassette of the above-mentioned FIG. 15 is the same, and comprises a box body W and a door body 20' which are fixed to the recessed area of the inner surface 22 of the door body 2 to be adjacent to the wafer restriction member module. The wafer limiter has three contacts = ° as shown in Fig. 19 and Fig. 20A, recessed area 2 The wafer limiter =0 on both sides is composed of a plurality of wafer limit members 5 ,, and each wafer limit is aligned with the wafer limit of 50 on the other side of the recessed portion 24. Each of the wafer restriction members has a base portion Μ, the base portion is fixed to the inner surface 22 of the substrate, and the other end portion of the region 24 has two free ends, which are farther away from the center of the recess 2 The white self: the end is formed - the first contact end 54' is closer to the recessed area arm 53 = the end / end is further with - the second curved arm is called the second curved 3 shell has a second contact end" and a third contact end %. The base portion 51 of the second circular restriction member 5 is an elastic structure (for example, the plastic elastic system has at least a curved portion, and when the door body 2 is combined with the cartridge 2, the wafer restriction member 5 〇 wild wood ... 〇 or just above the surface of the area 24 ^ ^ 53 is flat or slightly suspended in the concave angle to produce a change L::: 2 o ^ 53 on the second contact end 55 with the first brother, ^ FIM- A and second contact end 56 contact the wafer. At this time, as shown in the figure, when the body 20 and the case 1 () are densely f as the first and the left arm 52 are pulled by the lever and away from the recessed area: the surface is the first of the base 51 member 50. The surface of the contact end 54, the surface, and the wafer is in a circular contact. Obviously, since the end 55 and the second contact end 56 are crystallized on the wafer, the film can be relatively stable: the wafer limiting member 50 provides three contact ends, and the J-circle moves or opens in the center of the opening direction. The movement in the direction of the replacement page is corrected on November 24, 2011. Of course, in this embodiment, a hinge 57' can be disposed between the two free ends of the first crank arm 52 and adjacent to the inner surface 22 of the door body 20, and the hinge 57 is fixed to the inner surface of the door body 2 22, when the base portion 51 is deformed or the angle of the bend is changed, the first crank arm 52 and the second crank arm 53' can be driven by the lever relatively firmly to make the first contact end 54, the second contact end 55 and the third contact end % can be in close contact with the wafer. As with the two embodiments of the two contact ends, each of the plurality of wafer restriction members 5 can be integrally formed with an elastic structure (for example, a heat φ elastic elastic structure). 51 and the first-curved arm 52 or the second curved arm 53 may also be made of different materials or elastic structures (for example, thermoplastic elastic structure), such as plastics of different hardness, which can make the base portion 51 have a large deformation and the curved arm system is relatively Not easy to deform. Of course, the first contact end 54, the second contact end 55 and the third contact end % may also have recesses, which can trap the wafer into the recess and prevent the wafer from moving up and down. The plurality of wafer limiting members 50 may also be formed on a base, and the base is fixed to the inner surface 22 of the door body 20 or a plurality of wafer limiting members 5 directly contacting the inner surface of the door body 2〇. 22 directly integrated. In addition, the inner surface 22 of the door body 20 of the present invention may be a flat surface, which may be non-recessed, and at least one door flash structure 60 is disposed between the inner surface 22 and the outer surface 21, and preferably In the embodiment, a pair of door flash structures 6〇 are arranged. Since the gate flash structure 60 is the same as the foregoing embodiment, it will not be described again. In addition, in order to cover the door body 20 with the casing 10, a plurality of wafers that have been placed in the casing 10 can be fixed. Therefore, at least one restriction module can be disposed on the inner surface 22 of the plane. At least the restriction module is placed in the central area. The structure or the form of the restriction module of the present invention is not limited, and thus may include the foregoing restriction member set 30, the restriction member module 4 or the restriction member module 5 or the like. H is similarly 'because the detailed structure of the restriction module is the same as that of the previous embodiment, and the replacement page is amended on November 24, 2011, and will not be described again. Obviously, the latch structure 60 of the present invention is driven by the cam 62, and the sliding device 64 only performs the reciprocating motion of the forward and reverse movements without any longitudinal (ie, vertical)

直)方向上產生位移,因此,本發明之門閂結構6〇係一較簡單的 設計。當本發明之門體20與盒體1〇蓋合時,固定於門體2〇内表 面22之複數個晶圓限制件50係直接與晶圓接觸在一起,且凸輪 62係帶動一對滑動裝置64向門體2〇之邊緣移動,然後將滑動裝 置64之前端平面646穿過門體2〇上的閂孔27並卡固在盒體1〇 開口 12處邊緣附近並與閃孔27相對應之插孔28中。最後 1,可再 經由-充氣裝置對配置於門體2〇與盒體1G之間的氣密件(未顯 示於圖中)進行充氣,以使得盒體1〇内部與外部隔離。 ·,、· 雖然本發明以前述之較佳實施例揭露如上,然其並非用以限 =本,明’任何熟習相像技藝者,在不脫離本發明之精神和範圍 :=作些許之更動與潤飾,因此本發明之專利保護範圍 本忒明書所附之申請專利範圍所界定者為準。 、 【圖式簡單說明】 第1圓係習知之前開式晶圓盒之示意圖;Displacement occurs in the straight direction, and therefore, the latch structure 6 of the present invention is a relatively simple design. When the door body 20 of the present invention is closed with the casing 1 , the plurality of wafer restraints 50 fixed to the inner surface 22 of the door body 2 are directly in contact with the wafer, and the cam 62 drives a pair of sliding The device 64 moves toward the edge of the door body 2, and then passes the front end plane 646 of the sliding device 64 through the latch hole 27 on the door body 2 and is clamped near the edge of the opening 12 of the casing 1 and corresponds to the flash hole 27. In the jack 28. Finally, the airtight member (not shown) disposed between the door body 2'' and the casing 1G can be inflated via the -inflator to isolate the inside of the casing 1 from the outside. The present invention has been disclosed in the foregoing preferred embodiments, and is not intended to limit the scope of the invention, and the invention may be practiced without departing from the spirit and scope of the invention. The scope of the patent protection of the present invention is defined by the scope of the patent application attached to the specification. [Simplified description of the drawing] The first circular system is a schematic diagram of the open wafer cassette before the conventional method;

第2圖係習知之前開式晶圓盒之門體示音圖. =係習知之前開式晶圓盒之另—門體示意圖, · 第4圖係習知之前開式晶圓盒之又另 立 第5圖係本發明之前開式晶圓盒之-種門體不:圖; 第6A圖及第6B®係、本發明第5圖中之二:士圖; 意圖; 之門閂結構之部份放大 第7圖係本發明之前開式晶圓盒 第8A圖及第8B圖係本發明第 放大示意圖; 之另一 7圖中 種門體示意圖; 之門問結構之滑動裝置 之 18 1358379 2011年11月24日修正替換頁 第9圖係本發明之門閂結構之關閉時之示意圖; 第10圖係本發明之一種前開式晶圓盒之示意圖; 第11圖係本發明之一種前開式晶圓盒其晶圓限制件模組之示 意圖; 第12圖係本發明之一種前開式晶圓盒其晶圓限制件模組固定 於門體之示意圖; 第13圖係本發明之一種前開式晶圓盒其晶圓限制件模組於限 制晶圓之示意圖;Figure 2 is a schematic diagram of the door of the open wafer cassette. It is a schematic diagram of the door opening of the open wafer cassette before the conventional method, and the fourth figure is the conventional open wafer cassette. Further, FIG. 5 is a front view of the open wafer cassette of the present invention: FIG. 6A and 6B®, and FIG. 5 of the present invention: the map; the intention; the latch structure 7 is a magnified schematic view of the present invention; FIG. 8A and FIG. 8B are front views of the present invention; FIG. 8 is a schematic view of the door of the other; 1358379 November 24, 2011, the revised replacement page, FIG. 9 is a schematic view of the closure structure of the present invention; FIG. 10 is a schematic view of a front opening wafer cassette of the present invention; and FIG. 11 is a front opening of the present invention. Schematic diagram of a wafer reel module of the wafer cassette; FIG. 12 is a schematic view of a front opening wafer cassette of the present invention, wherein the wafer restriction module is fixed to the door body; and FIG. 13 is a front opening of the present invention. Schematic diagram of a wafer cassette with a wafer limiter module for limiting the wafer;

第14A圖係本發明之一種前開式晶圓盒其左右晶圓限制件模 組一體成形之示意圖; 第14B圖係本發明之一種前開式晶圓盒其左右晶圓限制件模 組一體成开)結構固定於門體之示意圖; 第15圖係本發明之另-種前開式晶圓盒之示意圖; 第16圖係本發明之另一種前開式晶圓盒其晶圓限制件模組之 第17 A目係本發明之另一種前開式晶圓盒其晶圓限制件剛接 觸晶圓之示意圖; 第ΠΒ ®係本發明之另一種前開式晶圓盒其 制晶圓之示意圖; 第18圖係本發明之再—種前開式晶圓盒之示意圖; 第立 19圖係、本發明之再一種前開式晶圓盒其晶圓限制件模組之 開式晶圓盒其晶圓限制件未接 第20A圖 係本發明之再一種前 觸晶圓之示意圖;及 盒其晶圓限制件於限 第細圖—係、本發明之再—種前開式晶圓 .制晶圓之不意圖。 1358379 【主要元件符號說明】 10 盒體 12 開口 21 外表面 24 凹陷區域 26 突出柱 28 插孔 30 限制件模組 31S 短邊 32 彎延部 32G 中央導槽 34 孔洞 400 限制件模組 41 基部 43 曲臂 45 第二接觸端 50 限制件 52 第一曲臂 54 第一接觸端 56 第三接觸端 2011年11月24日修正替換頁 插槽 門體 内表面 凸出平台 閂孔 底座 長邊 半圓形之凸出部 安裝孔 限制件 彎曲部 第一接觸端 限制件模組 基部 第二曲臂 第二接觸端 枢紐 20 1358379 2011年11月24曰修正替換頁 W 晶E] 60 門閂結構 62 凸輪 621 導槽 64 滑動裝置 642 滑槽 644 導桿 643 導輪撥桿 6431 滑輪 646 平面 66 滑輪 662 滑輪 664 滑輪 68 定位彈片 2114A is a schematic view showing a front-opening wafer cassette of the present invention, wherein the left and right wafer restriction modules are integrally formed; and FIG. 14B is a front opening wafer cassette of the present invention, wherein the left and right wafer restriction modules are integrally formed. FIG. 15 is a schematic view showing another type of front opening wafer cassette of the present invention; and FIG. 16 is another front opening type wafer cassette of the present invention. 17 A is a schematic view of another front opening wafer cassette of the present invention, the wafer restriction member is just in contact with the wafer; the third embodiment is a schematic diagram of another wafer of the front opening wafer cassette of the present invention; A schematic diagram of a re-opening type wafer cassette of the present invention; a second embodiment of the present invention, a front-opening wafer cassette of the present invention, an open wafer cassette of the wafer restriction module, and a wafer restriction member thereof Figure 20A is a schematic diagram of still another front touch wafer of the present invention; and the wafer limiter of the box is limited to the detail drawing, and the present invention is not intended to be a wafer. 1358379 [Description of main components] 10 Box 12 Opening 21 Outer surface 24 Recessed area 26 Studed column 28 Jack 30 Restrictor module 31S Short side 32 Curved part 32G Center guide groove 34 Hole 400 Restriction module 41 Base 43 Curved arm 45 second contact end 50 limiting member 52 first curved arm 54 first contact end 56 third contact end November 24, 2011 correction replacement page slot door inner surface protruding platform latch hole base long side semicircle Protrusion mounting hole restraining member bending portion first contact end limiting member module base second crank arm second contact end pivot 20 1358379 November 24, 2011 Correction replacement page W Crystal E] 60 Door latch structure 62 Cam 621 Guide groove 64 Slide device 642 Chute 644 Guide rod 643 Guide wheel lever 6431 Pulley 646 Plane 66 Pulley 662 Pulley 664 Pulley 68 Positioning spring 21

Claims (1)

1358379 十、申請專利範圍: 2____ 1· 一種則開式晶圓盒,主要包括一盒體,該盒體内部係設有複數 個插槽以容置複數個晶圓,且在該盒體之一側面係形成一開口 可供該複數個晶圓之輸入及輸出,而該盒體開口處之邊緣配置 至少一對插孔,以及-門體,係具有一外表面及一内表面且於 該門體之邊緣配置至少一對與該對插孔相應之閃孔該門體係 以該内表面與該盒體之該開口相結合,並用以保護該盒體内部 之該複數個晶圓,其中該前開式晶圓盒之特徵在於: 該門體之該内表面配置一凹陷區域且該凹陷區域係位於兩 凸出平口之間,每-邊凸出平台内部係配置一門閃結構,該門 構C括&輪’其上酉己置―對狐形導槽,—對滑動裝置, -端係具有—導桿可與該凸輪上的導槽扣接,至少一個滑 7係配置料凸出平台内部且嵌人於該滑動裝置之-滑槽 二另以=位彈片,該定位彈片一端係與該滑動裝置連接而 該對-與該㈣進: 2.盒,其心輪之材 ^ 、出.孟屬及円分子塑膠材料。 之°」專利範圍第1項所述之前開式晶圓盒,其中該滑動梦置 之材料係自下列组人_ g屮. μ β動裝置 4·如申請專利二 屬及高分子塑膠材料。 τ切專利靶圍第i項所述之前 料係自下列組合中選出.’其中該滑輪之材 5·如申…: 屬及而分子塑膠材料。 月】軏圍第1項所述之前開式 之材料係自下列組合中入 圓|其中遠定位彈片 6.如申往| ° 孟屬及尚分子塑膠材料。 二,專利範圍第!項所述之前開 才抖 動裂置之另-端上配置一對導輪撥桿。|進—步於該滑 22 7.如申士主奎丨,2011年11月24曰修正替換頁 之材i传白第6項所述之前開式晶圓盒,其中該導輪撥桿 8 , 下列組合中選出:金屬及高分子材料塑膠。 .導第6項所述之前開式晶圓盒,其進二步於該對 爷輪撥柃上各配置一滑輪。 1項所述之前開式晶圓盒,其進-步於該兩 一限制件模組。1358379 X. Patent Application Range: 2____ 1· An open-type wafer cassette mainly includes a box body having a plurality of slots therein for accommodating a plurality of wafers, and one of the cassettes The side surface forms an opening for inputting and outputting the plurality of wafers, and the edge of the opening of the box body is provided with at least one pair of jacks, and the door body has an outer surface and an inner surface and is adjacent to the door Configuring at least one pair of flash holes corresponding to the pair of jacks, the door system is coupled to the opening of the box body to protect the plurality of wafers inside the box body, wherein the front opening The wafer cassette is characterized in that: the inner surface of the door body is provided with a recessed area and the recessed area is located between the two convex flat ports, and each door is protruded from the platform to configure a door flash structure. & wheel 'the upper 酉 酉 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对And embedded in the sliding device - the chute two One end of the positioning elastic piece is connected with the sliding device, and the pair - and the (four) are advanced: 2. The box, the material of the heart wheel ^, the genus and the molecular plastic material. The prior open wafer cassette described in the first paragraph of the patent range, wherein the material of the sliding dream is from the following group _ g屮. μ β moving device 4 · as claimed in the patent genus and polymer plastic materials. Prior to the description of item i of the τ cut patent target, the material is selected from the following combinations. 'The material of the pulley 5 · 申...: genus and molecular plastic materials. Month] The material of the previous open type mentioned in item 1 is rounded from the following combinations | Among them, the telescopic piece is far away. 6. For example, it is a molecular plastic material. Second, the scope of patents! A pair of guide wheel levers are disposed on the other end of the previously described dithering. |Into the step of the slide 22 7. For example, Shen Shizhu Kui, November 24, 2011, amend the replacement page material i pass the white open box, the guide wheel lever 8, the following Selected from the combination: metal and polymer plastic. In the pre-opening wafer cassette described in Item 6, the second step is to arrange a pulley on each of the pair of wheels. The one of the previously opened wafer cassettes is advanced to the two-piece limiting module. Μ’二申:ί利範圍第9項所述之前開式晶圓盒’其中該些限制件 2 Ί、有-底座並經由該底座將該限制件模組固定於該四出平 ^且該底i之-長邊上形成複數個間隔排列之彎延部,每 β彎延部與其自由端之間形成近似半圓形之凸出部,且每— 該限制件模組上的每-該近似半圓形之凸出部上配置一中央導 槽’以藉由該半圓形之凸出部之中央導槽與晶圓接觸。 U.如申請專利範圍第Η)項所述之前開式晶圓盒,其中該凸出部之 中央導槽與晶圓接觸的地方係表面包覆一耐磨耗材。Μ '二申: The prior open wafer cassette described in item 9 of the ί利范围, wherein the restriction members 2 有 have a base and the fixing member module is fixed to the four outlets via the base a plurality of spaced-apart bends are formed on the long side of the bottom i, and an approximately semi-circular projection is formed between each of the β-curved portions and the free end thereof, and each of the limit member modules A central guide groove is disposed on the approximately semicircular projection to contact the wafer by the central guide of the semicircular projection. U. The open wafer cassette as described in the scope of the patent application, wherein the central guide groove of the projection is in contact with the wafer to cover a wear-resistant material. 9.如申請專利範圍第 凸出平台上各配置 12. 如申請專利範圍第9項所述之前開式晶m中該些限制件 模組係由複數個間隔排列之限制件所組成,每一該限制件與該 凹陷區域另一邊緣之限制件模組上之限制件對齊,其中每一哕 限制件係具有一基部,該基部係固定於該門體之該内表面上了 而該些基部於鄰近該凹陷區域之一側邊上’連接一彎曲部後, 每一該彎曲部進一步向該凹陷區域中央處延伸成一曲臂,其中 該些曲臂係配置於該凹陷區域之上方。 13. 如申請專利範圍第12項所述之前開式晶圓盒,其中該限制件係 一種彈性元件。 ' 14·如申請專利範圍第12項所述之前開式晶圓盒,其中該曲臂與該 彎曲部交接處形成一第一接觸端,而該曲臂之自由端係形^二 第二接觸端。 23 Ϊ358379 2011年11月24日修正替換頁 15·如申請專利範圍第9項所述之前開式晶圓盒,其中該限制件模 組係由複數個限制件排列所組成,每一該限制件與該凹陷區域 另一邊緣之限制件模組上之限制件對齊,其中每一該限制件具 有一基部,該基部之一端係固定於該門體之該内表面上,而其 另一端係與一第一曲臂連接,該第一曲臂具有二自由端,其中 較遠離該凹陷區域中央處之自由端形成一第一接觸端,而相對 該第一接觸端之另一自由端更進一步與一第二曲臂連接,該第 二曲臂係具有一第二接觸端及一第三接觸端。 16.如申請專利範圍第15項所述之前開式晶圓盒,其中該第一曲臂 在該二自由端之間並且靠近該内表面之一側邊上係配置有_拖 紐。 中該框紐與該 17.如申請專利範圍第16項所述之前開式晶圓盒, 内表面固定。 18 :種:開式晶圓盒,主要包括一盒體,該盒體内部 個插槽以容置複數個晶圓,且在該盒體之一側面係形成一開口 了供該複數個晶圓之輸入及輪屮 至小㈣, 輸出而该盒體開口處之邊緣配置 至夕-對插孔,以及-門體,係具有—外表面及—内表面 ^門體之邊緣配置至少—對與該對插孔相應之閃孔,該門體係 之該複數個晶圓,其中該前開式㈣該盒體内部 6玄門體之該内表面與該外表面之間係配置 構,該門閂結構包括一凸輪,1 門閂結 動裝置,其-端係具有一導桿;==形導槽,-對滑 -個滑輪,配置輪的導槽扣接,至少 該滑動震置之-滑射,以及—定位彈片,卜==二嵌入於 與5亥滑動裝置連接而其另一端係與該門體連接’以使該滑= 24 丄306379 置藉A兮几认 2011年1丨月24曰修正替換頁 二=之轉動使得該對滑動裝置之另-端於該對插孔 〃^閂孔中進行前進及後退之往返運動。 專圍第18項所述之前開式晶圓盒 2二=合中選出:金屬及高分子塑膠材料。 之材二 21.如申枝糞丨 ,,屬及尚分子塑膠材料。 :n圍第18項所述之相式晶圓盒 22 =列組合中選出:金屬及高分子塑膠材料。中一材 :圍第18項所述之相式晶,其中該定位彈 材料係自下列組合中選出:金屬及高分 乂 23. 如申請專利範圍第 ,材料。 動…另—:二=:圓盒’其進-步於該滑 24. ^ =專利範圍第23項所述之前開式 2二:=自下顺合中選出:金屬及高分子_= 。月㈣_帛23項所述之相式 導輪撥桿上各配置—滑輪。 1 ”進步於該對 申叫專利範圍第18項所述之前開式曰人 27 !:Γ表面之接近中央區域配置至二二件::步於該門 體之該内表面配置至卜限制件模組。曰圓盈’其進一步於該門 259. If the application scope of the patent scope is on the protruding platform, each of the configurations is 12. In the prior open crystal m, as described in claim 9, the restriction module is composed of a plurality of spacers arranged at intervals, each of which The restricting member is aligned with the restricting member on the restricting member module of the other edge of the recessed portion, wherein each of the restricting members has a base fixed to the inner surface of the door body and the base portions After connecting a curved portion to a side of the recessed portion, each of the curved portions further extends toward a center of the recessed portion to form a curved arm, wherein the curved arm portions are disposed above the recessed portion. 13. The open wafer cassette of claim 12, wherein the restriction member is an elastic member. [14] The prior open wafer cassette according to claim 12, wherein the intersection of the curved arm and the curved portion forms a first contact end, and the free end of the curved arm is shaped by a second contact end. 23 Ϊ 358379 November 24, 2011 Revision Replacement Page 15 The prior open wafer cassette as described in claim 9 wherein the restriction module is composed of a plurality of restriction members, each of the restriction members Aligning with a restriction member on the other end of the recessed portion of the recessed portion, wherein each of the restricting members has a base, one end of the base is fixed to the inner surface of the door body, and the other end is coupled to a first crank arm connected, the first crank arm having two free ends, wherein a free end located farther from the center of the recessed area forms a first contact end, and the other free end of the first contact end is further A second crank arm is coupled to the second crank arm and has a second contact end and a third contact end. 16. The open wafer cassette of claim 15, wherein the first crank arm is disposed with a drag between the two free ends and adjacent one of the sides of the inner surface. The frame and the 17. the open wafer cassette as described in claim 16 of the patent application, the inner surface is fixed. 18: a type: an open wafer cassette, which mainly comprises a box body, wherein the inner slot of the box body accommodates a plurality of wafers, and an opening is formed on one side of the box body for the plurality of wafers The input and the rim to the small (four), the output and the edge of the opening of the box are arranged to the eve-to-jack, and the door body has the outer surface and the inner surface of the door body. Corresponding flash holes of the pair of jacks, the plurality of wafers of the door system, wherein the front opening type (4) is configured between the inner surface of the inner side of the box body and the outer surface, and the latch structure comprises a cam, a latching device having a guide rod at its end; a == guide groove, a pair of slip-on pulleys, a guide groove of the arrangement wheel, at least the sliding shock-slip, and - Positioning the shrapnel, Bu == two is embedded in the 5 Hai sliding device and the other end is connected to the door body to make the sliding = 24 丄 306379 L. A 兮 认 2011 2011 2011 丨 24 24 24 24 24 Page 2 = rotation causes the other end of the pair of sliding devices to advance and retreat in the pair of jacks Reciprocating motion. Before the opening of the wafer cassette described in Item 18, 2nd = Hezhong selected: metal and polymer plastic materials. The second material 21. Such as Shenzhi manure, is a monk molecular plastic material. : n Around the phase wafer cassette described in item 18 22 = column combination selected: metal and polymer plastic materials.中材: The phase crystal described in Item 18, wherein the positioning material is selected from the following combinations: metal and high score 乂 23. For the scope of patent application, material. Move... another:: two =: round box 'the step into the slip 24. ^ = before the 23rd paragraph of the patent scope open 2 2: = selected from the next suffix: metal and polymer _ =. The configuration of the phase guide pulley on the month (four) _ 帛 23 items - pulley. 1 "Advance to the opening of the 曰 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 Module. 曰圆盈' its further to the door 25
TW097130938A 2008-08-14 2008-08-14 A wafer container with at least one latch TWI358379B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW097130938A TWI358379B (en) 2008-08-14 2008-08-14 A wafer container with at least one latch
US12/200,953 US20100038281A1 (en) 2008-08-14 2008-08-29 Front Opening Unified Pod with latch component

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TW097130938A TWI358379B (en) 2008-08-14 2008-08-14 A wafer container with at least one latch

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US20100038281A1 (en) 2010-02-18
TW201006740A (en) 2010-02-16

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