TWI268324B - Optoelectronic component emitting electromagnetic radiation and luminous module - Google Patents
Optoelectronic component emitting electromagnetic radiation and luminous moduleInfo
- Publication number
- TWI268324B TWI268324B TW094125054A TW94125054A TWI268324B TW I268324 B TWI268324 B TW I268324B TW 094125054 A TW094125054 A TW 094125054A TW 94125054 A TW94125054 A TW 94125054A TW I268324 B TWI268324 B TW I268324B
- Authority
- TW
- Taiwan
- Prior art keywords
- electromagnetic radiation
- optoelectronic component
- emitting electromagnetic
- luminous module
- component emitting
- Prior art date
Links
- 230000005670 electromagnetic radiation Effects 0.000 title abstract 2
- 230000005693 optoelectronics Effects 0.000 title abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/151—Light emitting diodes [LED] arranged in one or more lines
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/176—Light sources where the light is generated by photoluminescent material spaced from a primary light generating element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004036157.6A DE102004036157B4 (de) | 2004-07-26 | 2004-07-26 | Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Leuchtmodul |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200609454A TW200609454A (en) | 2006-03-16 |
TWI268324B true TWI268324B (en) | 2006-12-11 |
Family
ID=35058132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094125054A TWI268324B (en) | 2004-07-26 | 2005-07-25 | Optoelectronic component emitting electromagnetic radiation and luminous module |
Country Status (8)
Country | Link |
---|---|
US (1) | US8071990B2 (zh) |
EP (1) | EP1771891B1 (zh) |
JP (1) | JP5623003B2 (zh) |
KR (1) | KR101132457B1 (zh) |
CN (1) | CN100501993C (zh) |
DE (1) | DE102004036157B4 (zh) |
TW (1) | TWI268324B (zh) |
WO (1) | WO2006012842A2 (zh) |
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-
2004
- 2004-07-26 DE DE102004036157.6A patent/DE102004036157B4/de not_active Expired - Lifetime
-
2005
- 2005-07-21 EP EP05770747.3A patent/EP1771891B1/de active Active
- 2005-07-21 US US11/658,822 patent/US8071990B2/en active Active
- 2005-07-21 JP JP2007522911A patent/JP5623003B2/ja active Active
- 2005-07-21 WO PCT/DE2005/001283 patent/WO2006012842A2/de active Application Filing
- 2005-07-21 KR KR1020077004307A patent/KR101132457B1/ko active IP Right Grant
- 2005-07-21 CN CNB200580025035XA patent/CN100501993C/zh active Active
- 2005-07-25 TW TW094125054A patent/TWI268324B/zh active
Also Published As
Publication number | Publication date |
---|---|
DE102004036157B4 (de) | 2023-03-16 |
CN1989617A (zh) | 2007-06-27 |
WO2006012842A3 (de) | 2006-05-11 |
CN100501993C (zh) | 2009-06-17 |
WO2006012842A2 (de) | 2006-02-09 |
KR101132457B1 (ko) | 2012-06-05 |
EP1771891B1 (de) | 2015-11-11 |
TW200609454A (en) | 2006-03-16 |
US20090001490A1 (en) | 2009-01-01 |
US8071990B2 (en) | 2011-12-06 |
JP5623003B2 (ja) | 2014-11-12 |
DE102004036157A1 (de) | 2006-02-16 |
JP2008507850A (ja) | 2008-03-13 |
KR20070041589A (ko) | 2007-04-18 |
EP1771891A2 (de) | 2007-04-11 |
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