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TWI256994B - Heat column - Google Patents

Heat column

Info

Publication number
TWI256994B
TWI256994B TW093119408A TW93119408A TWI256994B TW I256994 B TWI256994 B TW I256994B TW 093119408 A TW093119408 A TW 093119408A TW 93119408 A TW93119408 A TW 93119408A TW I256994 B TWI256994 B TW I256994B
Authority
TW
Taiwan
Prior art keywords
column
cover plate
heat
hollow
heat column
Prior art date
Application number
TW093119408A
Other languages
Chinese (zh)
Other versions
TW200600741A (en
Inventor
Yency Chen
Chi-Feng Lin
Chin-Ming Chen
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW093119408A priority Critical patent/TWI256994B/en
Priority to US10/974,841 priority patent/US20060000581A1/en
Priority to JP2005188152A priority patent/JP2006017452A/en
Publication of TW200600741A publication Critical patent/TW200600741A/en
Application granted granted Critical
Publication of TWI256994B publication Critical patent/TWI256994B/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat column includes a hollow column, a cover plate and a hollow tube. A taper or at least one bulge is applied to the inner surface of the hollow column. The hollow tube penetrates the cover plate and for guiding working fluid passing therethrough into the hollow column. The cover plate has a relatively raising surface around periphery thereof so that heat dispersion areas of the heat column is increased.
TW093119408A 2004-06-30 2004-06-30 Heat column TWI256994B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW093119408A TWI256994B (en) 2004-06-30 2004-06-30 Heat column
US10/974,841 US20060000581A1 (en) 2004-06-30 2004-10-28 Cylindrical heat pipes
JP2005188152A JP2006017452A (en) 2004-06-30 2005-06-28 Heat column

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093119408A TWI256994B (en) 2004-06-30 2004-06-30 Heat column

Publications (2)

Publication Number Publication Date
TW200600741A TW200600741A (en) 2006-01-01
TWI256994B true TWI256994B (en) 2006-06-21

Family

ID=35512705

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093119408A TWI256994B (en) 2004-06-30 2004-06-30 Heat column

Country Status (3)

Country Link
US (1) US20060000581A1 (en)
JP (1) JP2006017452A (en)
TW (1) TWI256994B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100437001C (en) * 2005-05-13 2008-11-26 鸿富锦精密工业（深圳）有限公司 Vacuum liquid filling device and vacuum liquid filling method
GB201005861D0 (en) 2010-04-08 2010-05-26 S & P Coil Products Ltd A method an an apoparatus for constructing a heat pipe
JP5686562B2 (en) * 2010-09-24 2015-03-18 奇▲こう▼科技股▲ふん▼有限公司 Flat heat pipe sealing structure
US20190113289A1 (en) * 2017-10-12 2019-04-18 Microsoft Technology Licensing, Llc Sealing a heat pipe
CN112665442B (en) * 2020-12-23 2022-08-23 无锡卡兰尼普热管理技术有限公司 Sealing structure and sealing method applied to aluminothermic circuit board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3769674A (en) * 1972-10-10 1973-11-06 Isothermics Method for producing heat pipes
US4020898A (en) * 1973-02-14 1977-05-03 Q-Dot Corporation Heat pipe and method and apparatus for fabricating same
US4106171A (en) * 1974-11-29 1978-08-15 Hughes Aircraft Company Method for closure of heat pipes and device fabricated thereby
DE3433984C2 (en) * 1984-09-15 1986-07-24 Daimler-Benz Ag, 7000 Stuttgart Heat pipe made of aluminum or steel
US5308920A (en) * 1992-07-31 1994-05-03 Itoh Research & Development Laboratory Co., Ltd. Heat radiating device
US6916430B1 (en) * 1996-10-25 2005-07-12 New Qu Energy Ltd. Superconducting heat transfer medium
JP3354487B2 (en) * 1998-05-28 2002-12-09 シャープ株式会社 Image forming device
TW575156U (en) * 2003-05-08 2004-02-01 Jiun-Guang Luo Heat pipe

Also Published As

Publication number Publication date
US20060000581A1 (en) 2006-01-05
JP2006017452A (en) 2006-01-19
TW200600741A (en) 2006-01-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees