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TW200700686A - Heat pipe - Google Patents

Heat pipe

Info

Publication number
TW200700686A
TW200700686A TW094120074A TW94120074A TW200700686A TW 200700686 A TW200700686 A TW 200700686A TW 094120074 A TW094120074 A TW 094120074A TW 94120074 A TW94120074 A TW 94120074A TW 200700686 A TW200700686 A TW 200700686A
Authority
TW
Taiwan
Prior art keywords
heat pipe
housing
section
core member
work fluid
Prior art date
Application number
TW094120074A
Other languages
Chinese (zh)
Inventor
Jeng-Ming Pai
Original Assignee
Yuh Cheng Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yuh Cheng Chemical Co Ltd filed Critical Yuh Cheng Chemical Co Ltd
Priority to TW094120074A priority Critical patent/TW200700686A/en
Priority to US11/184,813 priority patent/US20060283575A1/en
Publication of TW200700686A publication Critical patent/TW200700686A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Rigid Pipes And Flexible Pipes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a heat pipe, including a housing, a work fluid and a core member, in which the inner side of the housing is hollow and provided has a chamber, the work fluid is provided in the chamber of the housing. The core member is provided on the inner wall of the housing for absorbing the work fluid. The core member has a first section and a second section. The porosity of the first section is different from that of the second section, the core member has functions of capillarity and serves as a passageway, so that the heat conduction of the heat pipe can be sufficiently increased.
TW094120074A 2005-06-16 2005-06-16 Heat pipe TW200700686A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094120074A TW200700686A (en) 2005-06-16 2005-06-16 Heat pipe
US11/184,813 US20060283575A1 (en) 2005-06-16 2005-07-20 Heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094120074A TW200700686A (en) 2005-06-16 2005-06-16 Heat pipe

Publications (1)

Publication Number Publication Date
TW200700686A true TW200700686A (en) 2007-01-01

Family

ID=37572205

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094120074A TW200700686A (en) 2005-06-16 2005-06-16 Heat pipe

Country Status (2)

Country Link
US (1) US20060283575A1 (en)
TW (1) TW200700686A (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100498185C (en) * 2006-04-21 2009-06-10 富准精密工业(深圳)有限公司 Heat pipe
CN100480612C (en) * 2006-04-28 2009-04-22 富准精密工业(深圳)有限公司 Heat pipe
CN100513974C (en) * 2006-05-19 2009-07-15 富准精密工业(深圳)有限公司 Hot pipe
US20090166005A1 (en) * 2007-12-29 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Vapor chamber
TW201036527A (en) * 2009-03-19 2010-10-01 Acbel Polytech Inc Large-area liquid-cooled heat-dissipation device
TW201038899A (en) * 2009-04-17 2010-11-01 Young Bright Technology Corp Heat pipe
US20100294475A1 (en) * 2009-05-22 2010-11-25 General Electric Company High performance heat transfer device, methods of manufacture thereof and articles comprising the same
TW201116794A (en) * 2009-11-10 2011-05-16 Pegatron Corp Vapor chamber and manufacturing method thereof
TW201127266A (en) * 2010-01-20 2011-08-01 Pegatron Corp Vapor chamber and manufacturing method thereof
GB201009264D0 (en) * 2010-06-03 2010-07-21 Rolls Royce Plc Heat transfer arrangement for fluid washed surfaces
TW201237341A (en) * 2011-03-10 2012-09-16 Cooler Master Co Ltd Flat type heat pipe with multi sections and method of manufacturing the same
EP2527776A1 (en) * 2011-05-24 2012-11-28 Thermal Corp. Capillary device for use in heat pipe and method of manufacturing such capillary device
JP6302116B1 (en) * 2017-04-12 2018-03-28 古河電気工業株式会社 heat pipe
WO2020018484A1 (en) * 2018-07-18 2020-01-23 Thermal Corp. Heat pipes having wick structures with variable permeability
CN113784584B (en) * 2021-08-19 2023-03-24 联想(北京)有限公司 Heat dissipation piece and electronic equipment
WO2023035294A1 (en) * 2021-09-13 2023-03-16 江苏大学 Bionic sweat gland and bionic skin

Also Published As

Publication number Publication date
US20060283575A1 (en) 2006-12-21

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