US34861A
(en)
|
|
1862-04-01 |
|
Improved washing-machine |
US4855194A
(en)
*
|
1988-02-05 |
1989-08-08 |
The United States Of America As Represented By The United States Department Of Energy |
Fuel cell having electrolyte inventory control volume
|
US4866005A
(en)
|
1987-10-26 |
1989-09-12 |
North Carolina State University |
Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
|
US4946547A
(en)
|
1989-10-13 |
1990-08-07 |
Cree Research, Inc. |
Method of preparing silicon carbide surfaces for crystal growth
|
US5210051A
(en)
|
1990-03-27 |
1993-05-11 |
Cree Research, Inc. |
High efficiency light emitting diodes from bipolar gallium nitride
|
US5200022A
(en)
|
1990-10-03 |
1993-04-06 |
Cree Research, Inc. |
Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
|
US5393993A
(en)
|
1993-12-13 |
1995-02-28 |
Cree Research, Inc. |
Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices
|
JPH0738940U
(en)
|
1993-12-22 |
1995-07-14 |
神鋼電機株式会社 |
Support structure of thruster in impact shaker
|
US5523589A
(en)
|
1994-09-20 |
1996-06-04 |
Cree Research, Inc. |
Vertical geometry light emitting diode with group III nitride active layer and extended lifetime
|
JPH10311937A
(en)
|
1997-05-14 |
1998-11-24 |
Japan Aviation Electron Ind Ltd |
Packaging structure of end face light emitting element or light receiving element
|
JP3862870B2
(en)
|
1997-09-25 |
2006-12-27 |
北陸電気工業株式会社 |
Electrical components with solderless terminal fittings
|
JP2000251977A
(en)
|
1999-02-26 |
2000-09-14 |
Fujitsu Ltd |
Power supply terminal
|
US6442832B1
(en)
|
1999-04-26 |
2002-09-03 |
Agilent Technologies, Inc. |
Method for coupling a circuit board to a transmission line that includes a heat sensitive dielectric
|
US6548832B1
(en)
|
1999-06-09 |
2003-04-15 |
Sanyo Electric Co., Ltd. |
Hybrid integrated circuit device
|
DE10016817A1
(en)
|
2000-04-05 |
2001-10-18 |
Mannesmann Vdo Ag |
Color head-up display, especially for a vehicle
|
JP2001294083A
(en)
|
2000-04-14 |
2001-10-23 |
Yazaki Corp |
Interior lighting system for vehicle
|
US6547249B2
(en)
|
2001-03-29 |
2003-04-15 |
Lumileds Lighting U.S., Llc |
Monolithic series/parallel led arrays formed on highly resistive substrates
|
WO2003023857A2
(en)
*
|
2001-09-13 |
2003-03-20 |
Lucea Ag |
Led-luminous panel and carrier plate
|
JP2003303504A
(en)
|
2002-04-10 |
2003-10-24 |
Meiji Natl Ind Co Ltd |
Illumination apparatus using light emitting diode
|
US7224000B2
(en)
|
2002-08-30 |
2007-05-29 |
Lumination, Llc |
Light emitting diode component
|
US7244965B2
(en)
|
2002-09-04 |
2007-07-17 |
Cree Inc, |
Power surface mount light emitting die package
|
JP2004265986A
(en)
|
2003-02-28 |
2004-09-24 |
Citizen Electronics Co Ltd |
High luminance light emitting element, and method for manufacturing the same and light emitting device using the same
|
JP2004311101A
(en)
|
2003-04-03 |
2004-11-04 |
Koito Mfg Co Ltd |
Vehicle head lamp and semiconductor light emitting element
|
WO2005018008A1
(en)
|
2003-08-19 |
2005-02-24 |
Nichia Corporation |
Semiconductor device
|
US20050152145A1
(en)
|
2003-08-28 |
2005-07-14 |
Currie Robert M. |
Vehicle lighting system having an electronic module circuit and light emitting diodes
|
KR100541395B1
(en)
|
2003-09-09 |
2006-01-11 |
삼성전자주식회사 |
Apparatus for stacking semiconductor chips on wafer, method using the apparatus, and semiconductor package manufactured thereby
|
US6982518B2
(en)
|
2003-10-01 |
2006-01-03 |
Enertron, Inc. |
Methods and apparatus for an LED light
|
EP1681728B1
(en)
|
2003-10-15 |
2018-11-21 |
Nichia Corporation |
Light-emitting device
|
JP2005183148A
(en)
|
2003-12-18 |
2005-07-07 |
Tsubakimoto Chain Co |
Lighting system and sorting system
|
US20050199899A1
(en)
|
2004-03-11 |
2005-09-15 |
Ming-Der Lin |
Package array and package unit of flip chip LED
|
JP2005266117A
(en)
|
2004-03-17 |
2005-09-29 |
Rohm Co Ltd |
Plane display
|
JP2005276979A
(en)
|
2004-03-24 |
2005-10-06 |
Matsushita Electric Ind Co Ltd |
Led source
|
US7791061B2
(en)
|
2004-05-18 |
2010-09-07 |
Cree, Inc. |
External extraction light emitting diode based upon crystallographic faceted surfaces
|
US7683391B2
(en)
*
|
2004-05-26 |
2010-03-23 |
Lockheed Martin Corporation |
UV emitting LED having mesa structure
|
KR101095637B1
(en)
|
2004-09-23 |
2011-12-19 |
삼성전자주식회사 |
Light generating device, back light assembly having the light generating device, and display device having the back light assembly
|
DE102004047260B4
(en)
|
2004-09-24 |
2006-08-03 |
Siemens Ag |
Insulating housing with ventilation shaft
|
KR101154801B1
(en)
|
2004-12-03 |
2012-07-03 |
엔지케이 스파크 플러그 캄파니 리미티드 |
Ceramic package for receiving ceramic substrate and light emitting device
|
US7352440B2
(en)
|
2004-12-10 |
2008-04-01 |
Asml Netherlands B.V. |
Substrate placement in immersion lithography
|
US20060139595A1
(en)
|
2004-12-27 |
2006-06-29 |
Asml Netherlands B.V. |
Lithographic apparatus and method for determining Z position errors/variations and substrate table flatness
|
US7939842B2
(en)
|
2005-01-27 |
2011-05-10 |
Cree, Inc. |
Light emitting device packages, light emitting diode (LED) packages and related methods
|
USD528672S1
(en)
|
2005-01-28 |
2006-09-19 |
Matsushita Electric Industrial Co., Ltd. |
LED module
|
JP2006294898A
(en)
|
2005-04-12 |
2006-10-26 |
Sumitomo Metal Electronics Devices Inc |
Package for housing light emitting element
|
USD535262S1
(en)
*
|
2005-06-08 |
2007-01-16 |
Matsushita Electric Industrial Co., Ltd. |
Light emitting diode module
|
US7365371B2
(en)
|
2005-08-04 |
2008-04-29 |
Cree, Inc. |
Packages for semiconductor light emitting devices utilizing dispensed encapsulants
|
WO2007018360A1
(en)
|
2005-08-09 |
2007-02-15 |
Seoul Opto Device Co., Ltd. |
Ac light emitting diode and method for fabricating the same
|
US8563339B2
(en)
|
2005-08-25 |
2013-10-22 |
Cree, Inc. |
System for and method for closed loop electrophoretic deposition of phosphor materials on semiconductor devices
|
US7479660B2
(en)
|
2005-10-21 |
2009-01-20 |
Perkinelmer Elcos Gmbh |
Multichip on-board LED illumination device
|
US7213940B1
(en)
|
2005-12-21 |
2007-05-08 |
Led Lighting Fixtures, Inc. |
Lighting device and lighting method
|
JP4049186B2
(en)
|
2006-01-26 |
2008-02-20 |
ソニー株式会社 |
Light source device
|
KR100819883B1
(en)
*
|
2006-02-17 |
2008-04-07 |
삼성전자주식회사 |
Package of light emitting device and manufacturing method thereof
|
KR100793338B1
(en)
|
2006-02-23 |
2008-01-11 |
삼성전기주식회사 |
Light emitting diode module
|
JP5027427B2
(en)
|
2006-02-23 |
2012-09-19 |
パナソニック株式会社 |
White illumination device using light emitting diode
|
JP4992250B2
(en)
|
2006-03-01 |
2012-08-08 |
日亜化学工業株式会社 |
Light emitting device
|
KR100738933B1
(en)
|
2006-03-17 |
2007-07-12 |
(주)대신엘이디 |
Led module for illumination
|
JP4789672B2
(en)
|
2006-03-29 |
2011-10-12 |
京セラ株式会社 |
Light emitting device and lighting device
|
CN2917018Y
(en)
|
2006-04-10 |
2007-06-27 |
富士康(昆山)电脑接插件有限公司 |
Cable connector assembly
|
TWI301679B
(en)
|
2006-04-14 |
2008-10-01 |
High Power Optoelectronics Inc |
Semiconductor light emitting device and method of fabricating the same
|
EP3422425B1
(en)
|
2006-04-24 |
2022-02-23 |
CreeLED, Inc. |
Side-view surface mount white led
|
JP4605096B2
(en)
|
2006-05-30 |
2011-01-05 |
ソニー株式会社 |
Backlight device and color image display device
|
JP2007335371A
(en)
|
2006-06-19 |
2007-12-27 |
Harison Toshiba Lighting Corp |
Surface lighting device
|
USD570506S1
(en)
|
2006-06-20 |
2008-06-03 |
Matsushita Electric Industrial Co., Ltd. |
Lighting apparatus
|
US8044418B2
(en)
|
2006-07-13 |
2011-10-25 |
Cree, Inc. |
Leadframe-based packages for solid state light emitting devices
|
USD570797S1
(en)
|
2006-07-14 |
2008-06-10 |
Samsung Electro-Mechanics Co., Ltd. |
Light-emitting diode
|
USD593043S1
(en)
|
2006-07-14 |
2009-05-26 |
Samsung Electro-Mechanics Co., Ltd. |
Light emitting diode
|
US20080019130A1
(en)
|
2006-07-24 |
2008-01-24 |
Pei-Choa Wang |
Arrangement of Light-Emitting Diodes Of LED Lamp
|
US7804147B2
(en)
|
2006-07-31 |
2010-09-28 |
Cree, Inc. |
Light emitting diode package element with internal meniscus for bubble free lens placement
|
US7943952B2
(en)
|
2006-07-31 |
2011-05-17 |
Cree, Inc. |
Method of uniform phosphor chip coating and LED package fabricated using method
|
KR100793581B1
(en)
|
2006-08-29 |
2008-01-14 |
엘지이노텍 주식회사 |
Back light unit and display apparatus using its
|
US8425271B2
(en)
|
2006-09-01 |
2013-04-23 |
Cree, Inc. |
Phosphor position in light emitting diodes
|
US7910938B2
(en)
|
2006-09-01 |
2011-03-22 |
Cree, Inc. |
Encapsulant profile for light emitting diodes
|
US20080089072A1
(en)
|
2006-10-11 |
2008-04-17 |
Alti-Electronics Co., Ltd. |
High Power Light Emitting Diode Package
|
USD575246S1
(en)
*
|
2006-11-15 |
2008-08-19 |
Citizen Electronics Co., Ltd. |
Light-emitting diode unit for illuminating an object
|
US9159888B2
(en)
|
2007-01-22 |
2015-10-13 |
Cree, Inc. |
Wafer level phosphor coating method and devices fabricated utilizing method
|
US9024349B2
(en)
|
2007-01-22 |
2015-05-05 |
Cree, Inc. |
Wafer level phosphor coating method and devices fabricated utilizing method
|
USD573553S1
(en)
|
2007-02-09 |
2008-07-22 |
Matsushita Electric Industrial Co., Ltd. |
Light source of light-emitting diode
|
WO2008111504A1
(en)
|
2007-03-12 |
2008-09-18 |
Nichia Corporation |
High-output light emitting device and package used therefor
|
US7510400B2
(en)
|
2007-03-14 |
2009-03-31 |
Visteon Global Technologies, Inc. |
LED interconnect spring clip assembly
|
JP5089212B2
(en)
|
2007-03-23 |
2012-12-05 |
シャープ株式会社 |
LIGHT EMITTING DEVICE, LED LAMP USING THE SAME, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE
|
US7656518B2
(en)
|
2007-03-30 |
2010-02-02 |
Asml Netherlands B.V. |
Method of measuring asymmetry in a scatterometer, a method of measuring an overlay error in a substrate and a metrology apparatus
|
US20080258130A1
(en)
|
2007-04-23 |
2008-10-23 |
Bergmann Michael J |
Beveled LED Chip with Transparent Substrate
|
USD576576S1
(en)
|
2007-05-25 |
2008-09-09 |
Matsushita Electric Industrial Co., Ltd. |
Light source of light emitting diode
|
US7614771B2
(en)
|
2007-07-05 |
2009-11-10 |
Tyco Electronics Corporation |
Wireless controlled light emitting assembly
|
US7621752B2
(en)
|
2007-07-17 |
2009-11-24 |
Visteon Global Technologies, Inc. |
LED interconnection integrated connector holder package
|
JP2009044055A
(en)
|
2007-08-10 |
2009-02-26 |
Toshiba Lighting & Technology Corp |
Led module and led lighting equipment
|
CN101779270B
(en)
|
2007-08-10 |
2013-06-12 |
株式会社尼康 |
Substrate bonding apparatus and substrate bonding method
|
FR2921537A1
(en)
|
2007-09-20 |
2009-03-27 |
Stephane Jebabli |
Power LED lighting device for e.g. tropical freshwater aquarium, has light part integrating series of power LEDs permitting combination of different color temperatures to simulate luminous environment of aquatic medium for aquarium
|
US7611376B2
(en)
|
2007-11-20 |
2009-11-03 |
Tyco Electronics Corporation |
LED socket
|
USD592615S1
(en)
*
|
2007-12-05 |
2009-05-19 |
Citizen Electronics Co., Ltd. |
Light-emitting diode for illuminating an object
|
USD607420S1
(en)
|
2007-12-05 |
2010-01-05 |
Citizen Electronics Co., Ltd. |
Light-emitting diode for illuminating an object
|
TWD128709S1
(en)
|
2007-12-05 |
2009-05-11 |
西鐵城電子股份有限公司 |
Light-emitting diode for illuminating an object
|
CN101459211B
(en)
|
2007-12-11 |
2011-03-02 |
富士迈半导体精密工业(上海)有限公司 |
Solid illuminating device
|
US8167674B2
(en)
|
2007-12-14 |
2012-05-01 |
Cree, Inc. |
Phosphor distribution in LED lamps using centrifugal force
|
US8049237B2
(en)
|
2007-12-28 |
2011-11-01 |
Nichia Corporation |
Light emitting device
|
US8940561B2
(en)
|
2008-01-15 |
2015-01-27 |
Cree, Inc. |
Systems and methods for application of optical materials to optical elements
|
US8058088B2
(en)
|
2008-01-15 |
2011-11-15 |
Cree, Inc. |
Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating
|
USD589470S1
(en)
|
2008-02-01 |
2009-03-31 |
Neobulb Technologies, Inc. |
Light-emitting module
|
TWI360239B
(en)
*
|
2008-03-19 |
2012-03-11 |
E Pin Optical Industry Co Ltd |
Package structure for light emitting diode
|
US7833045B2
(en)
|
2008-03-24 |
2010-11-16 |
Avx Corporation |
Insulation displacement connector (IDC)
|
US8324723B2
(en)
|
2008-03-25 |
2012-12-04 |
Bridge Semiconductor Corporation |
Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump
|
TW200945570A
(en)
|
2008-04-18 |
2009-11-01 |
Top Crystal Technology Inc |
High-voltage LED circuit with multi-staged threshold voltage and diode light-emitting device thereof
|
KR20090011121U
(en)
|
2008-04-25 |
2009-10-29 |
이봉한 |
Captor for vermin
|
WO2009133615A1
(en)
|
2008-05-01 |
2009-11-05 |
株式会社グローバル・アイ |
Lighting apparatus using led
|
WO2009141982A1
(en)
|
2008-05-19 |
2009-11-26 |
株式会社 東芝 |
Linear white light source, and backlight and liquid crystal display device using linear white light source
|
CA128592S
(en)
|
2008-05-20 |
2009-11-30 |
Philips Electronics Ltd |
Led module
|
US7667169B2
(en)
|
2008-05-22 |
2010-02-23 |
Omnivision Technologies, Inc. |
Image sensor with simultaneous auto-focus and image preview
|
US8461613B2
(en)
|
2008-05-27 |
2013-06-11 |
Interlight Optotech Corporation |
Light emitting device
|
JP2009289918A
(en)
|
2008-05-28 |
2009-12-10 |
Alps Electric Co Ltd |
Semiconductor light-emitting device
|
US9147812B2
(en)
|
2008-06-24 |
2015-09-29 |
Cree, Inc. |
Methods of assembly for a semiconductor light emitting device package
|
JP2010009972A
(en)
|
2008-06-27 |
2010-01-14 |
Toshiba Lighting & Technology Corp |
Light emitting module and light emitting device
|
US7859190B2
(en)
|
2008-09-10 |
2010-12-28 |
Bridgelux, Inc. |
Phosphor layer arrangement for use with light emitting diodes
|
US8022626B2
(en)
|
2008-09-16 |
2011-09-20 |
Osram Sylvania Inc. |
Lighting module
|
US8247827B2
(en)
|
2008-09-30 |
2012-08-21 |
Bridgelux, Inc. |
LED phosphor deposition
|
USD603813S1
(en)
|
2008-10-01 |
2009-11-10 |
Toshiba Lighting & Technology Corporation |
Light emitting diode module
|
US20100096642A1
(en)
|
2008-10-20 |
2010-04-22 |
Brilliant Technology Co., Ltd. |
Packaging struture for high power light emitting diode(led) chip
|
US9425172B2
(en)
|
2008-10-24 |
2016-08-23 |
Cree, Inc. |
Light emitter array
|
JP5379465B2
(en)
|
2008-12-17 |
2013-12-25 |
パナソニック株式会社 |
Light emitting device
|
JP2010199547A
(en)
|
2009-01-30 |
2010-09-09 |
Nichia Corp |
Light emitting device and method of manufacturing same
|
US8957435B2
(en)
|
2009-04-28 |
2015-02-17 |
Cree, Inc. |
Lighting device
|
USD615051S1
(en)
*
|
2009-05-05 |
2010-05-04 |
Prolight Opto Technology Corporation |
LED package
|
JP2011009298A
(en)
|
2009-06-23 |
2011-01-13 |
Citizen Electronics Co Ltd |
Light-emitting diode light source device
|
KR101061246B1
(en)
|
2009-07-08 |
2011-08-31 |
한성엘컴텍 주식회사 |
Socket-type LED lamp
|
JP5366688B2
(en)
|
2009-07-16 |
2013-12-11 |
日本航空電子工業株式会社 |
Socket, substrate assembly, and apparatus including the same
|
US9713211B2
(en)
|
2009-09-24 |
2017-07-18 |
Cree, Inc. |
Solid state lighting apparatus with controllable bypass circuits and methods of operation thereof
|
US8901829B2
(en)
|
2009-09-24 |
2014-12-02 |
Cree Led Lighting Solutions, Inc. |
Solid state lighting apparatus with configurable shunts
|
JP2011071242A
(en)
|
2009-09-24 |
2011-04-07 |
Toshiba Lighting & Technology Corp |
Light emitting device and illuminating device
|
USD630171S1
(en)
*
|
2009-10-16 |
2011-01-04 |
Everlight Electronics Co., Ltd. |
Light emitting diode
|
USD615052S1
(en)
|
2009-10-27 |
2010-05-04 |
Citizen Electronics Co. Ltd. |
Light-emitting diode
|
US8337214B2
(en)
|
2009-11-13 |
2012-12-25 |
Cree, Inc. |
Electrical connectors and light emitting device package and methods of assembling the same
|
TWM379163U
(en)
|
2009-11-26 |
2010-04-21 |
Truelight Corp |
Packaging apparatus for high power and high orientation matrix semiconductor light-emitting devices
|
TWM379717U
(en)
|
2009-11-26 |
2010-05-01 |
Alliance Optotek Corp |
Modular illuminating device
|
KR101619832B1
(en)
|
2009-11-30 |
2016-05-13 |
삼성전자주식회사 |
Light emitting diode package, light emitting diode package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
|
US7993025B2
(en)
|
2009-12-01 |
2011-08-09 |
Davinci Industrial Inc. |
LED lamp
|
US8241044B2
(en)
|
2009-12-09 |
2012-08-14 |
Tyco Electronics Corporation |
LED socket assembly
|
USD636899S1
(en)
|
2010-01-28 |
2011-04-26 |
Toshiba Lighting & Technology Corporation |
Light emitting diode module
|
US7955147B1
(en)
|
2010-03-15 |
2011-06-07 |
Zierick Manufacturing Corporation |
Surface mount (SMT) crimp terminal and method of securing wire to same
|
USD645417S1
(en)
|
2010-04-01 |
2011-09-20 |
Citizen Electronics Co., Ltd. |
Light-emitting diode
|
USD640997S1
(en)
*
|
2010-04-01 |
2011-07-05 |
Citizen Electronics Co., Ltd. |
Light-emitting diode
|
US8517572B2
(en)
|
2010-05-06 |
2013-08-27 |
Heathco, Llc |
Method and apparatus pertaining to a cone-shaped lens in combination with a lateral member
|
JP5846408B2
(en)
|
2010-05-26 |
2016-01-20 |
東芝ライテック株式会社 |
Light emitting device and lighting device
|
USD658602S1
(en)
*
|
2010-06-15 |
2012-05-01 |
Toshiba Lighting & Technology Corporation |
Light emitting diode module
|
USD658601S1
(en)
|
2010-06-15 |
2012-05-01 |
Toshiba Lighting & Technology Corporation |
Light emitting diode module
|
USD658603S1
(en)
*
|
2010-06-15 |
2012-05-01 |
Toshiba Lighting & Technology Corporation |
Light emitting diode module
|
US8410679B2
(en)
|
2010-09-21 |
2013-04-02 |
Cree, Inc. |
Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface
|
JP5612991B2
(en)
|
2010-09-30 |
2014-10-22 |
シャープ株式会社 |
LIGHT EMITTING DEVICE AND LIGHTING DEVICE HAVING THE SAME
|
USD669041S1
(en)
*
|
2010-10-05 |
2012-10-16 |
Citizen Electronics Co., Ltd. |
Light-emitting diode
|
USD637564S1
(en)
|
2010-10-19 |
2011-05-10 |
Edison Opto Corporation |
Light emitting diode
|
USD707192S1
(en)
|
2010-11-18 |
2014-06-17 |
Cree, Inc. |
Light emitting device
|
USD721339S1
(en)
*
|
2010-12-03 |
2015-01-20 |
Cree, Inc. |
Light emitter device
|
US8564000B2
(en)
|
2010-11-22 |
2013-10-22 |
Cree, Inc. |
Light emitting devices for light emitting diodes (LEDs)
|
USD712850S1
(en)
|
2010-11-18 |
2014-09-09 |
Cree, Inc. |
Light emitter device
|
USD676000S1
(en)
|
2010-11-22 |
2013-02-12 |
Cree, Inc. |
Light emitting device package
|
US9300062B2
(en)
|
2010-11-22 |
2016-03-29 |
Cree, Inc. |
Attachment devices and methods for light emitting devices
|
US9000470B2
(en)
|
2010-11-22 |
2015-04-07 |
Cree, Inc. |
Light emitter devices
|
USD650760S1
(en)
|
2010-11-22 |
2011-12-20 |
Cree, Inc. |
Light emitting device package
|
US8624271B2
(en)
|
2010-11-22 |
2014-01-07 |
Cree, Inc. |
Light emitting devices
|
US8575639B2
(en)
|
2011-02-16 |
2013-11-05 |
Cree, Inc. |
Light emitting devices for light emitting diodes (LEDs)
|
US9490235B2
(en)
|
2010-11-22 |
2016-11-08 |
Cree, Inc. |
Light emitting devices, systems, and methods
|
USD706231S1
(en)
|
2010-12-03 |
2014-06-03 |
Cree, Inc. |
Light emitting device
|
USD683708S1
(en)
|
2010-12-09 |
2013-06-04 |
Nichia Corporation |
Light emitting diode
|
USD702653S1
(en)
|
2011-10-26 |
2014-04-15 |
Cree, Inc. |
Light emitting device component
|
US8809880B2
(en)
|
2011-02-16 |
2014-08-19 |
Cree, Inc. |
Light emitting diode (LED) chips and devices for providing failure mitigation in LED arrays
|
US8455908B2
(en)
|
2011-02-16 |
2013-06-04 |
Cree, Inc. |
Light emitting devices
|
EP2503214B1
(en)
|
2011-03-24 |
2016-05-18 |
OSRAM GmbH |
Mounting structure for solid-state light sources
|
US20130058099A1
(en)
|
2011-09-02 |
2013-03-07 |
Soraa, Inc. |
High Intensity Light Source with Interchangeable Optics
|
USD705181S1
(en)
|
2011-10-26 |
2014-05-20 |
Cree, Inc. |
Light emitting device component
|
CN104081112B
(en)
|
2011-11-07 |
2016-03-16 |
克利公司 |
High voltage array light-emitting diode (LED) device, equipment and method
|
USD689451S1
(en)
|
2012-01-24 |
2013-09-10 |
Toyoda Gosei Co., Ltd. |
Light emitting diode
|
US9343441B2
(en)
|
2012-02-13 |
2016-05-17 |
Cree, Inc. |
Light emitter devices having improved light output and related methods
|
CN104115291A
(en)
|
2012-02-13 |
2014-10-22 |
克利公司 |
Improved light emitting devices and methods
|
US9240530B2
(en)
|
2012-02-13 |
2016-01-19 |
Cree, Inc. |
Light emitter devices having improved chemical and physical resistance and related methods
|
US9735198B2
(en)
|
2012-03-30 |
2017-08-15 |
Cree, Inc. |
Substrate based light emitter devices, components, and related methods
|