USD823492S1 - Light emitting device - Google Patents
Light emitting device Download PDFInfo
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- USD823492S1 USD823492S1 US29/579,906 US201629579906F USD823492S US D823492 S1 USD823492 S1 US D823492S1 US 201629579906 F US201629579906 F US 201629579906F US D823492 S USD823492 S US D823492S
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- United States
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- light emitting
- emitting device
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Claims (1)
- The ornamental design for a light emitting device, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/579,906 USD823492S1 (en) | 2016-10-04 | 2016-10-04 | Light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/579,906 USD823492S1 (en) | 2016-10-04 | 2016-10-04 | Light emitting device |
Publications (1)
Publication Number | Publication Date |
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USD823492S1 true USD823492S1 (en) | 2018-07-17 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US29/579,906 Active USD823492S1 (en) | 2016-10-04 | 2016-10-04 | Light emitting device |
Country Status (1)
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US (1) | USD823492S1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10539274B2 (en) * | 2014-11-11 | 2020-01-21 | Toyoda Gosei Co., Ltd. | Light emitting device |
USD879787S1 (en) * | 2017-11-21 | 2020-03-31 | Hangzhou Chipjet Technology Co., Ltd. | Data processing equipment |
USD880484S1 (en) * | 2018-04-26 | 2020-04-07 | Hangzhou Chipjet Technology Co., Ltd. | Data processing equipment |
US10804251B2 (en) | 2016-11-22 | 2020-10-13 | Cree, Inc. | Light emitting diode (LED) devices, components and methods |
USD926351S1 (en) * | 2019-10-15 | 2021-07-27 | Shenzhen Thankshome Technology Co., Ltd | Smart modular lighting |
USD966208S1 (en) * | 2020-12-02 | 2022-10-11 | Citizen Electronics Co., Ltd. | Light emitting diode |
USD989011S1 (en) * | 2021-01-26 | 2023-06-13 | Citizen Electronics Co., Ltd. | Light emitting diode |
Citations (247)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4855194A (en) | 1988-02-05 | 1989-08-08 | The United States Of America As Represented By The United States Department Of Energy | Fuel cell having electrolyte inventory control volume |
US4946547A (en) | 1989-10-13 | 1990-08-07 | Cree Research, Inc. | Method of preparing silicon carbide surfaces for crystal growth |
US5200022A (en) | 1990-10-03 | 1993-04-06 | Cree Research, Inc. | Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product |
US5210051A (en) | 1990-03-27 | 1993-05-11 | Cree Research, Inc. | High efficiency light emitting diodes from bipolar gallium nitride |
JPH06291236A (en) | 1993-03-30 | 1994-10-18 | Hitachi Cable Ltd | Semiconductor device |
USRE34861E (en) | 1987-10-26 | 1995-02-14 | North Carolina State University | Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
US5393993A (en) | 1993-12-13 | 1995-02-28 | Cree Research, Inc. | Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices |
JPH0738940Y2 (en) | 1991-05-13 | 1995-09-06 | スタンレー電気株式会社 | LED indicator light |
US5523589A (en) | 1994-09-20 | 1996-06-04 | Cree Research, Inc. | Vertical geometry light emitting diode with group III nitride active layer and extended lifetime |
JPH10311937A (en) | 1997-05-14 | 1998-11-24 | Japan Aviation Electron Ind Ltd | Packaging structure of end face light emitting element or light receiving element |
US6093053A (en) | 1997-09-25 | 2000-07-25 | Hokuriku Electric Industry Co., Ltd. | Electric component with soldering-less terminal fitment |
US6224430B1 (en) | 1999-02-26 | 2001-05-01 | Fujitsu Limited | Power supply terminal assembly |
JP2001131517A (en) | 1999-11-02 | 2001-05-15 | Hitachi Ltd | Thermosetting adhesive material and method for producing the same and use |
JP2001294083A (en) | 2000-04-14 | 2001-10-23 | Yazaki Corp | Interior lighting system for vehicle |
US20020047189A1 (en) | 2000-10-20 | 2002-04-25 | Yoshinori Miyaki | Semiconductor device and its manufacturing method |
US6503780B1 (en) | 2000-07-05 | 2003-01-07 | Amkor Technology, Inc. | Wafer scale image sensor package fabrication method |
US6548832B1 (en) | 1999-06-09 | 2003-04-15 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
TW540169B (en) | 2001-03-29 | 2003-07-01 | Lumileds Lighting Llc | Monolithic series/parallel LED arrays formed on highly resistive substrates |
JP2003192442A (en) | 2001-12-26 | 2003-07-09 | Toshiba Corp | Aluminum nitride substrate, aluminum nitride substrate having thin film, and submount material for laser light- emitting element obtained by using the same |
JP2003303504A (en) | 2002-04-10 | 2003-10-24 | Meiji Natl Ind Co Ltd | Illumination apparatus using light emitting diode |
US20040079957A1 (en) | 2002-09-04 | 2004-04-29 | Andrews Peter Scott | Power surface mount light emitting die package |
JP2004228413A (en) | 2003-01-24 | 2004-08-12 | Kyocera Corp | Package for housing light emitting element and light emitting device |
US20040169466A1 (en) | 2002-12-24 | 2004-09-02 | Toyoda Gosei Co., Ltd. | Light emitting diode and light emitting diode array |
US20040196663A1 (en) | 2003-04-03 | 2004-10-07 | Koito Manufacturing Co., Ltd. | Vehicular headlamp and semiconductor light emitting element |
JP2004311948A (en) | 2003-03-27 | 2004-11-04 | Seiko Epson Corp | Semiconductor device, electronic apparatus, and method for manufacturing semiconductor device |
US20050073244A1 (en) | 2003-10-01 | 2005-04-07 | Chou Der Jeou | Methods and apparatus for an LED light |
US6909051B2 (en) | 1999-04-26 | 2005-06-21 | Agilent Technologies, Inc. | Method and apparatus for coupling a circuit board to a transmission line that includes a heat sensitive dielectric |
JP2005183148A (en) | 2003-12-18 | 2005-07-07 | Tsubakimoto Chain Co | Lighting system and sorting system |
US20050152145A1 (en) | 2003-08-28 | 2005-07-14 | Currie Robert M. | Vehicle lighting system having an electronic module circuit and light emitting diodes |
US20050199899A1 (en) | 2004-03-11 | 2005-09-15 | Ming-Der Lin | Package array and package unit of flip chip LED |
JP2005266117A (en) | 2004-03-17 | 2005-09-29 | Rohm Co Ltd | Plane display |
JP2005276979A (en) | 2004-03-24 | 2005-10-06 | Matsushita Electric Ind Co Ltd | Led source |
KR100505838B1 (en) | 1997-03-18 | 2005-10-21 | 세이코 엡슨 가부시키가이샤 | Semiconductor device and its manufacturing method |
US20050264172A1 (en) | 2004-05-26 | 2005-12-01 | Lockheed Martin | UV emitting LED having mesa structure |
JP2006066786A (en) | 2004-08-30 | 2006-03-09 | Seiwa Electric Mfg Co Ltd | Light emitting diode |
US7034778B1 (en) | 2000-04-05 | 2006-04-25 | Mannesmann Vdo Ag | Color head-up display, in particular for a vehicle |
US7055987B2 (en) | 2001-09-13 | 2006-06-06 | Lucea Ag | LED-luminous panel and carrier plate |
US20060139595A1 (en) | 2004-12-27 | 2006-06-29 | Asml Netherlands B.V. | Lithographic apparatus and method for determining Z position errors/variations and substrate table flatness |
US20060147746A1 (en) | 2004-12-03 | 2006-07-06 | Ngk Spark Plug Co., Ltd. | Ceramic substrate, ceramic package for housing light emitting element |
US20060180818A1 (en) | 2003-07-30 | 2006-08-17 | Hideo Nagai | Semiconductor light emitting device, light emitting module and lighting apparatus |
US20060186418A1 (en) | 2004-05-18 | 2006-08-24 | Edmond John A | External extraction light emitting diode based upon crystallographic faceted surfaces |
USD528672S1 (en) | 2005-01-28 | 2006-09-19 | Matsushita Electric Industrial Co., Ltd. | LED module |
USD528996S1 (en) * | 2004-10-14 | 2006-09-26 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
JP2006294898A (en) | 2005-04-12 | 2006-10-26 | Sumitomo Metal Electronics Devices Inc | Package for housing light emitting element |
US20070018295A1 (en) | 2003-09-09 | 2007-01-25 | Samsung Electronics Co., Ltd. | Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby |
US20070029664A1 (en) | 2005-08-05 | 2007-02-08 | Cree Microwave, Llc. | Integrated circuit package and method of assembling the same |
US20070029569A1 (en) | 2005-08-04 | 2007-02-08 | Peter Andrews | Packages for semiconductor light emitting devices utilizing dispensed encapsulants and methods of packaging the same |
US20070057364A1 (en) | 2005-09-01 | 2007-03-15 | Wang Carl B | Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof |
USD541761S1 (en) | 2005-06-08 | 2007-05-01 | Matsushita Electric Industrial Co., Ltd. | Light emitting diode module |
US7213940B1 (en) | 2005-12-21 | 2007-05-08 | Led Lighting Fixtures, Inc. | Lighting device and lighting method |
US7224000B2 (en) | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
US20070131954A1 (en) | 2003-10-15 | 2007-06-14 | Nichia Corporation | Light emitting device |
US20070158668A1 (en) | 2005-08-25 | 2007-07-12 | Cree, Inc. | Close loop electrophoretic deposition of semiconductor devices |
US20070194336A1 (en) | 2006-02-17 | 2007-08-23 | Samsung Electronics Co., Ltd. | Light emitting device package and method of manufacturing the same |
JP2007227680A (en) | 2006-02-23 | 2007-09-06 | Matsushita Electric Works Ltd | White lighting system using light-emitting diode |
JP2007266357A (en) | 2006-03-29 | 2007-10-11 | Kyocera Corp | Light emitting device and illuminator |
US20070241345A1 (en) | 2006-04-14 | 2007-10-18 | High Power Optoelectronics, Inc. | Semiconductor light-emitting device and method of fabricating the same |
US20070247855A1 (en) | 2004-10-04 | 2007-10-25 | Kabushiki Kaisha Toshiba | Light Emitting Device,Lighting Equipment or Liquid Crystal Display Device Using Such Light Emitting Device |
US20070246730A1 (en) | 2003-02-28 | 2007-10-25 | Nodoka Oishi | Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode |
US20070253209A1 (en) | 2006-04-27 | 2007-11-01 | Cree, Inc. | Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same |
US20070252523A1 (en) | 2004-08-18 | 2007-11-01 | Masakatsu Maeda | Ceramic Substrate for Mounting a Light Emitting Element and Method for Manufacturing the Same |
JP2007323857A (en) | 2006-05-30 | 2007-12-13 | Sony Corp | Backlight device and color image display device |
JP2007335371A (en) | 2006-06-19 | 2007-12-27 | Harison Toshiba Lighting Corp | Surface lighting device |
KR100793338B1 (en) | 2006-02-23 | 2008-01-11 | 삼성전기주식회사 | Light emitting diode module |
US20080019130A1 (en) | 2006-07-24 | 2008-01-24 | Pei-Choa Wang | Arrangement of Light-Emitting Diodes Of LED Lamp |
US20080026498A1 (en) | 2006-07-31 | 2008-01-31 | Eric Tarsa | Light emitting diode package element with internal meniscus for bubble free lens placement |
US20080054279A1 (en) | 2006-09-01 | 2008-03-06 | Hussell Christopher P | Phosphor Position in Light Emitting Diodes |
US20080055901A1 (en) | 2006-08-29 | 2008-03-06 | Toshiba Lighting & Technology Corporation | Illumination apparatus having a plurality of semiconductor light-emitting devices |
US20080054284A1 (en) | 2006-09-01 | 2008-03-06 | Hussell Christopher P | Encapsulant Profile for Light Emitting Diodes |
US20080054286A1 (en) | 2005-01-27 | 2008-03-06 | Cree, Inc. | Light emitting device packages, light emitting diode (LED) packages and related methods |
US20080078664A1 (en) | 2004-09-24 | 2008-04-03 | Siemens Aktiengesellschaft | Dielectric Housing Having a Ventilation Shaft |
US20080079017A1 (en) | 2006-07-31 | 2008-04-03 | Cree, Inc. | Method of uniform phosphor chip coating and led package fabricated using method |
US20080089072A1 (en) | 2006-10-11 | 2008-04-17 | Alti-Electronics Co., Ltd. | High Power Light Emitting Diode Package |
US20080106723A1 (en) | 2004-12-10 | 2008-05-08 | Asml Netherlands B.V. | Substrate placement in immersion lithography |
USD570506S1 (en) | 2006-06-20 | 2008-06-03 | Matsushita Electric Industrial Co., Ltd. | Lighting apparatus |
USD570797S1 (en) | 2006-07-14 | 2008-06-10 | Samsung Electro-Mechanics Co., Ltd. | Light-emitting diode |
WO2008069204A1 (en) | 2006-12-04 | 2008-06-12 | Alps Electric Co., Ltd. | Light emitting device and projector |
US7391046B2 (en) | 2004-03-26 | 2008-06-24 | Koito Manufacturing Co., Ltd. | Light source module and vehicle front lamp |
US20080153344A1 (en) | 2006-12-22 | 2008-06-26 | Tyco Electronics | Surface mount poke in connector |
US7393237B2 (en) | 2006-04-10 | 2008-07-01 | Hon Hai Precision Ind. Co., Ltd. | Cable assembly with light emitting diode |
US20080164484A1 (en) | 2005-03-14 | 2008-07-10 | Seoul Semiconductor Co., Ltd. | Light Emitting Apparatus |
KR20080002564U (en) | 2007-01-08 | 2008-07-11 | 광성전기산업(주) | Lamp with light emitting diode module |
USD573553S1 (en) * | 2007-02-09 | 2008-07-22 | Matsushita Electric Industrial Co., Ltd. | Light source of light-emitting diode |
US20080173884A1 (en) | 2007-01-22 | 2008-07-24 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US20080179611A1 (en) | 2007-01-22 | 2008-07-31 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US20080191222A1 (en) | 2005-08-09 | 2008-08-14 | Seoul Opto Device Co., Ltd. | Ac Light Emitting Diode and Method for Fabricating the Same |
USD576576S1 (en) | 2007-05-25 | 2008-09-09 | Matsushita Electric Industrial Co., Ltd. | Light source of light emitting diode |
US20080219003A1 (en) | 2006-08-29 | 2008-09-11 | Jun Seok Park | Backlight Unit and Liquid Crystal Display Apparatus Including the Same |
US20080224166A1 (en) | 2007-03-14 | 2008-09-18 | Glovatsky Andrew Z | Led interconnect spring clip assembly |
USD577690S1 (en) * | 2007-05-25 | 2008-09-30 | Matsushita Electric Industrial Co., Ltd. | Light source of light emitting diode |
US20080239318A1 (en) | 2007-03-30 | 2008-10-02 | Asml Netherlands B.V. | Method of measuring asymmetry in a scatterometer, a method of measuring an overlay error in a substrate and a metrology apparatus |
JP2008244075A (en) | 2007-03-27 | 2008-10-09 | Sharp Corp | Light-emitting device |
KR20080092239A (en) | 2006-01-26 | 2008-10-15 | 소니 가부시끼 가이샤 | Light source device and display device |
US20080258130A1 (en) | 2007-04-23 | 2008-10-23 | Bergmann Michael J | Beveled LED Chip with Transparent Substrate |
US20090009103A1 (en) | 2007-07-05 | 2009-01-08 | Tyco Electronics Corporation | Wireless controlled light emitting assembly |
US7479660B2 (en) | 2005-10-21 | 2009-01-20 | Perkinelmer Elcos Gmbh | Multichip on-board LED illumination device |
US20090023323A1 (en) | 2007-07-17 | 2009-01-22 | Lin Jeff C | LED Interconnection Integrated Connector Holder Package |
KR20090011121A (en) | 2007-07-25 | 2009-02-02 | 엘지이노텍 주식회사 | Light emitting device package and method for manufacturing the same |
USD586303S1 (en) | 2006-11-15 | 2009-02-10 | Citizen Electronics Co., Ltd. | Light-emitting diode unit for illuminating an object |
JP2009044055A (en) | 2007-08-10 | 2009-02-26 | Toshiba Lighting & Technology Corp | Led module and led lighting equipment |
FR2921537A1 (en) | 2007-09-20 | 2009-03-27 | Stephane Jebabli | Power LED lighting device for e.g. tropical freshwater aquarium, has light part integrating series of power LEDs permitting combination of different color temperatures to simulate luminous environment of aquatic medium for aquarium |
USD589470S1 (en) | 2008-02-01 | 2009-03-31 | Neobulb Technologies, Inc. | Light-emitting module |
USD591248S1 (en) | 2007-12-05 | 2009-04-28 | Citizen Electronics Co., Ltd. | Light-emitting diode for illuminating an object |
US20090122514A1 (en) | 2006-03-17 | 2009-05-14 | Dae Shin Led Co., Ltd. | Led module for illumination |
USD592615S1 (en) | 2007-12-05 | 2009-05-19 | Citizen Electronics Co., Ltd. | Light-emitting diode for illuminating an object |
CN101438630A (en) | 2006-04-18 | 2009-05-20 | 科锐Led照明科技公司 | Lighting device and lighting method |
US20090130889A1 (en) | 2007-11-20 | 2009-05-21 | Tyco Electronics Corporation | Led socket |
USD593043S1 (en) | 2006-07-14 | 2009-05-26 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode |
US20090166657A1 (en) | 2007-12-28 | 2009-07-02 | Nichia Corporation | Light emitting device |
US20090206718A1 (en) | 2008-02-20 | 2009-08-20 | Toyoda Gosei Co., Ltd. | LED lamp module |
US20090239409A1 (en) | 2008-03-24 | 2009-09-24 | Avx Corporation | Insulation displacement connector (idc) |
USD602451S1 (en) | 2008-05-20 | 2009-10-20 | Koninklijke Philips Electronics N.V. | LED module |
US20090261374A1 (en) | 2007-03-12 | 2009-10-22 | Nichia Corporation | High output power light emitting device and packaged used therefor |
US20090262527A1 (en) | 2008-04-18 | 2009-10-22 | Top Crystal Technology, Inc. | High-Voltage Light Emitting Diode Circuit Having a Plurality of Critical Voltages and Light Emitting Diode Device Using the Same |
WO2009133615A1 (en) | 2008-05-01 | 2009-11-05 | 株式会社グローバル・アイ | Lighting apparatus using led |
USD603813S1 (en) | 2008-10-01 | 2009-11-10 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
WO2009141982A1 (en) | 2008-05-19 | 2009-11-26 | 株式会社 東芝 | Linear white light source, and backlight and liquid crystal display device using linear white light source |
US20090289169A1 (en) | 2008-05-22 | 2009-11-26 | Omnivision Technologies, Inc. | Image sensor with simultaneous auto-focus and image preview |
JP2009289918A (en) | 2008-05-28 | 2009-12-10 | Alps Electric Co Ltd | Semiconductor light-emitting device |
US20090315061A1 (en) | 2008-06-24 | 2009-12-24 | Cree, Inc. | Methods of assembly for a semiconductor light emitting device package |
US20090322197A1 (en) | 2008-06-30 | 2009-12-31 | Rene Helbing | Light emitting device having a transparent thermally conductive layer |
USD607420S1 (en) | 2007-12-05 | 2010-01-05 | Citizen Electronics Co., Ltd. | Light-emitting diode for illuminating an object |
JP2010009972A (en) | 2008-06-27 | 2010-01-14 | Toshiba Lighting & Technology Corp | Light emitting module and light emitting device |
US7649209B2 (en) | 2006-04-24 | 2010-01-19 | Cree, Inc. | Side-view surface mount white LED |
US20100078664A1 (en) | 2008-09-30 | 2010-04-01 | Rene Peter Helbing | Led phosphor deposition |
US20100078669A1 (en) | 2008-09-29 | 2010-04-01 | Seoul Semiconductor Co., Ltd. | Light emitting device and lead frame for the same |
US20100096642A1 (en) | 2008-10-20 | 2010-04-22 | Brilliant Technology Co., Ltd. | Packaging struture for high power light emitting diode(led) chip |
US20100103660A1 (en) | 2008-10-24 | 2010-04-29 | Cree Led Lighting Solutions, Inc. | Array layout for color mixing |
USD615052S1 (en) | 2009-10-27 | 2010-05-04 | Citizen Electronics Co. Ltd. | Light-emitting diode |
USD615051S1 (en) | 2009-05-05 | 2010-05-04 | Prolight Opto Technology Corporation | LED package |
JP2010103541A (en) | 2008-10-27 | 2010-05-06 | Asm Assembly Automation Ltd | Direct die bonding using heated bond head |
US20100141182A1 (en) | 2008-09-10 | 2010-06-10 | Bridgelux, Inc. | Phosphor layer arrangement for use with light emitting diodes |
US20100139836A1 (en) | 2007-08-10 | 2010-06-10 | Takahiro Horikoshi | Substrate Bonding Apparatus and Substrate Bonding Method |
US20100155763A1 (en) | 2008-01-15 | 2010-06-24 | Cree, Inc. | Systems and methods for application of optical materials to optical elements |
JP2010147189A (en) | 2008-12-17 | 2010-07-01 | Panasonic Electric Works Co Ltd | Light-emitting device |
US20100193822A1 (en) | 2009-01-30 | 2010-08-05 | Nichia Corporation | Light emitting semiconductor device and method of manufacture thereof |
US7780313B2 (en) | 2008-03-19 | 2010-08-24 | E-Pin Optical Industry Co. Ltd | Package structure for light emitting diode |
USD622876S1 (en) * | 2008-04-25 | 2010-08-31 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
JP2010192109A (en) | 2010-06-08 | 2010-09-02 | Sharp Corp | Playback device and recording device |
JP2010199167A (en) | 2009-02-24 | 2010-09-09 | Sumitomo Metal Electronics Devices Inc | Package for housing light-emitting element, and light-emitting device |
US20100252851A1 (en) | 2007-10-31 | 2010-10-07 | Cree, Inc. | Led package with increased feature sizes |
KR20100111255A (en) | 2009-04-06 | 2010-10-14 | 크리, 인코포레이티드 | High voltage low current surface emitting led |
US20100264799A1 (en) | 2009-04-20 | 2010-10-21 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led lamp |
US20100270567A1 (en) | 2009-04-28 | 2010-10-28 | Cree, Inc. | Lighting device |
USD626666S1 (en) | 2009-09-01 | 2010-11-02 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
US7825578B2 (en) | 2006-03-01 | 2010-11-02 | Nichia Corporation | Yellow light emitting device with high luminance |
CN101876406A (en) | 2009-12-14 | 2010-11-03 | 东莞市光宇新能源科技有限公司 | Technique for manufacturing high-power light emitting diode (LED) lamp |
USD627493S1 (en) | 2009-09-01 | 2010-11-16 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
USD628318S1 (en) | 2009-11-18 | 2010-11-30 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
USD628312S1 (en) | 2009-09-01 | 2010-11-30 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
USD628722S1 (en) | 2009-11-18 | 2010-12-07 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
US20100320483A1 (en) | 2009-06-23 | 2010-12-23 | Citizen Electronics Co., Ltd. | Light-emitting diode apparatus |
USD630171S1 (en) | 2009-10-16 | 2011-01-04 | Everlight Electronics Co., Ltd. | Light emitting diode |
KR20110004632A (en) | 2009-07-08 | 2011-01-14 | 한성엘컴텍 주식회사 | Led lamp of socket combination |
US7872418B2 (en) | 2007-03-23 | 2011-01-18 | Sharp Kabushiki Kaisha | Light emitting device and method for manufacturing the same |
US20110012143A1 (en) | 2005-01-10 | 2011-01-20 | Cree, Inc. | Solid state lighting component |
US20110013400A1 (en) | 2009-07-16 | 2011-01-20 | Japan Aviation Electronics Industry, Limited | Socket, circuit board assembly, and apparatus having the same |
US20110043137A1 (en) | 2009-08-19 | 2011-02-24 | Cree Led Lighting Solutions, Inc. | White light color changing solid state lighting and methods |
KR20110021639A (en) | 2009-08-26 | 2011-03-04 | 파라곤 세미컨덕터 라이팅 테크놀로지 컴퍼니 리미티드 | Quasi-optical led package structure for increasing color render index and brightness |
US20110065241A1 (en) | 2008-03-25 | 2011-03-17 | Bridge Semiconductor Corporation | Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump |
US20110068674A1 (en) | 2009-09-24 | 2011-03-24 | Toshiba Lighting & Technology Corporation | Light-emitting device and illumination device |
US20110068696A1 (en) | 2009-09-24 | 2011-03-24 | Van De Ven Antony P | Solid state lighting apparatus with configurable shunts |
US20110068702A1 (en) | 2009-09-24 | 2011-03-24 | Cree Led Lighting Solutions, Inc. | Solid state lighting apparatus with controllable bypass circuits and methods of operation thereof |
USD636899S1 (en) | 2010-01-28 | 2011-04-26 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
CN102044602A (en) | 2009-10-23 | 2011-05-04 | 亿光电子工业股份有限公司 | Packaging structure of light-emitting diode |
USD637564S1 (en) | 2010-10-19 | 2011-05-10 | Edison Opto Corporation | Light emitting diode |
US20110111537A1 (en) | 2007-06-08 | 2011-05-12 | Ching-Tai Cheng | High thermal conductivity substrate for a semiconductor device |
US20110116275A1 (en) | 2009-11-13 | 2011-05-19 | Kevin Todd Sheek | Electrical connectors and light emitting device package and methods of assembling the same |
US20110121323A1 (en) | 2009-11-26 | 2011-05-26 | Cheng Ju Wu | Packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity |
US20110127912A1 (en) | 2009-11-30 | 2011-06-02 | Young Jin Lee | Led package, led package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof |
JP2011108744A (en) | 2009-11-13 | 2011-06-02 | Sharp Corp | Light-emitting device, and method for producing the same |
US20110128730A1 (en) | 2009-12-01 | 2011-06-02 | Hua-Jung Chiu | LED lamp |
US7955147B1 (en) | 2010-03-15 | 2011-06-07 | Zierick Manufacturing Corporation | Surface mount (SMT) crimp terminal and method of securing wire to same |
US20110136394A1 (en) | 2009-12-09 | 2011-06-09 | Tyco Electronics Corporation | Led socket assembly |
US20110148327A1 (en) | 2009-12-21 | 2011-06-23 | Van De Ven Antony P | High cri adjustable color temperature lighting devices |
USD640997S1 (en) | 2010-04-01 | 2011-07-05 | Citizen Electronics Co., Ltd. | Light-emitting diode |
US20110176316A1 (en) | 2011-03-18 | 2011-07-21 | Phipps J Michael | Semiconductor lamp with thermal handling system |
US7994518B2 (en) | 2007-12-11 | 2011-08-09 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode |
US20110193109A1 (en) | 2010-02-08 | 2011-08-11 | Loh Ban P | Led light module |
KR20110008161U (en) | 2010-02-11 | 2011-08-18 | (주)비젼테크솔루션 | A device for LED lamp reflecting shade |
US20110221330A1 (en) | 2010-03-09 | 2011-09-15 | Cree, Inc. | High cri lighting device with added long-wavelength blue color |
USD645417S1 (en) | 2010-04-01 | 2011-09-20 | Citizen Electronics Co., Ltd. | Light-emitting diode |
US8022626B2 (en) | 2008-09-16 | 2011-09-20 | Osram Sylvania Inc. | Lighting module |
KR20110104336A (en) | 2010-03-16 | 2011-09-22 | 엘지이노텍 주식회사 | Light emitting diode package and fabricating method thereof |
WO2011129203A1 (en) | 2010-04-16 | 2011-10-20 | 日亜化学工業株式会社 | Light-emitting device |
US8044418B2 (en) | 2006-07-13 | 2011-10-25 | Cree, Inc. | Leadframe-based packages for solid state light emitting devices |
JP2009503888A5 (en) | 2005-09-14 | 2011-10-27 | ||
JP2011228369A (en) | 2010-04-16 | 2011-11-10 | Nichia Chem Ind Ltd | Light emitting device |
US8058088B2 (en) | 2008-01-15 | 2011-11-15 | Cree, Inc. | Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating |
US20110291151A1 (en) | 2010-05-26 | 2011-12-01 | Toshiba Lighting & Technology Corporation | Light emitting device and lighting apparatus |
USD650760S1 (en) | 2010-11-22 | 2011-12-20 | Cree, Inc. | Light emitting device package |
US20120032226A1 (en) | 2008-06-24 | 2012-02-09 | Wen-Herng Su | Light Emitting Diode Submount with High Thermal Conductivity for High Power Operation |
US8119534B2 (en) | 2003-08-19 | 2012-02-21 | Nichia Corporation | Semiconductor light emitting device with protrusions to improve external efficiency and crystal growth |
EP1640792B1 (en) | 2004-09-23 | 2012-03-07 | Samsung Electronics Co., Ltd. | Backlight assembly and display apparatus having the backlight assembly |
WO2012029360A1 (en) | 2010-08-30 | 2012-03-08 | シャープ株式会社 | Illumination device and display device |
JP2012079855A (en) | 2010-09-30 | 2012-04-19 | Sharp Corp | Light-emitting device and luminaire having the same |
US8167674B2 (en) | 2007-12-14 | 2012-05-01 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
USD658601S1 (en) | 2010-06-15 | 2012-05-01 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
USD658603S1 (en) | 2010-06-15 | 2012-05-01 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
USD658602S1 (en) | 2010-06-15 | 2012-05-01 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
JP2012089551A (en) | 2010-10-15 | 2012-05-10 | Toshiba Lighting & Technology Corp | Lighting device |
US20120126257A1 (en) | 2010-11-22 | 2012-05-24 | Jesse Colin Reiherzer | Light emitting devices and methods |
US20120126255A1 (en) | 2010-11-22 | 2012-05-24 | Hussell Christopher P | Light emitting devices and methods |
WO2012071138A2 (en) | 2010-11-22 | 2012-05-31 | Cree, Inc. | Attachment devices and methods for light emitting devices |
EP2302286A3 (en) | 2009-09-25 | 2012-06-27 | Toshiba Lighting & Technology Corporation | Lamp and lighting equipment |
US20120175643A1 (en) | 2011-01-09 | 2012-07-12 | Bridgelux, Inc. | Packaging Photon Building Blocks Having Only Top Side Connections in an Interconnect Structure |
US20120193651A1 (en) | 2010-11-22 | 2012-08-02 | Edmond John A | Light emitting devices, systems, and methods |
WO2012109225A1 (en) | 2011-02-07 | 2012-08-16 | Cree, Inc. | Components and methods for light emitting diode (led) lighting |
US20120205689A1 (en) | 2011-02-16 | 2012-08-16 | Welch Erin R F | Light emitting devices and methods |
US20120241807A1 (en) | 2011-03-24 | 2012-09-27 | Osram Ag | Mounting Structure for Solid State Light Sources |
CN101636887B (en) | 2007-03-16 | 2012-10-10 | 皇家飞利浦电子股份有限公司 | Vertical extended cavity surface emission laser and method for manufacturing a light emitting component of the same |
USD669041S1 (en) | 2010-10-05 | 2012-10-16 | Citizen Electronics Co., Ltd. | Light-emitting diode |
US20120299022A1 (en) | 2011-02-16 | 2012-11-29 | Hussell Christopher P | Light emitting devices and methods |
US20120313135A1 (en) | 2010-02-24 | 2012-12-13 | Citizen Electronics Co., Ltd. | Mounting board and structure of the same |
USD676000S1 (en) | 2010-11-22 | 2013-02-12 | Cree, Inc. | Light emitting device package |
EP2560219A1 (en) | 2010-04-16 | 2013-02-20 | Nichia Corporation | Light-emitting device and manufacturing method for light-emitting device |
US20130058099A1 (en) | 2011-09-02 | 2013-03-07 | Soraa, Inc. | High Intensity Light Source with Interchangeable Optics |
US8410679B2 (en) | 2010-09-21 | 2013-04-02 | Cree, Inc. | Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface |
WO2013070696A1 (en) | 2011-11-07 | 2013-05-16 | Cree, Inc. | High voltage array light emitting diode (led) devices, fixtures and methods |
USD683708S1 (en) | 2010-12-09 | 2013-06-04 | Nichia Corporation | Light emitting diode |
US8461613B2 (en) | 2008-05-27 | 2013-06-11 | Interlight Optotech Corporation | Light emitting device |
EP2327930B1 (en) | 2009-11-26 | 2013-07-17 | Alliance Optotek Co.,Ltd. | Modular lighting device |
US20130200406A1 (en) | 2012-02-07 | 2013-08-08 | Cree, Inc. | Ceramic-based light emitting diode (led) devices, components, and methods |
US20130200420A1 (en) | 2012-02-07 | 2013-08-08 | Cree, Inc. | Ceramic-based light emitting diode (led) devices, components, and methods |
US20130207142A1 (en) | 2012-02-13 | 2013-08-15 | Jesse Colin Reiherzer | Light emitter devices having improved chemical and physical resistance and related methods |
US20130207130A1 (en) | 2012-02-13 | 2013-08-15 | Jesse Colin Reiherzer | Light emitter devices having improved light output and related methods |
WO2013122831A1 (en) | 2012-02-13 | 2013-08-22 | Cree, Inc. | Improved light emitting devices and methods |
US20130214674A1 (en) | 2003-04-01 | 2013-08-22 | Sharp Kabushiki Kaisha | Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus |
US8517572B2 (en) | 2010-05-06 | 2013-08-27 | Heathco, Llc | Method and apparatus pertaining to a cone-shaped lens in combination with a lateral member |
USD689451S1 (en) | 2012-01-24 | 2013-09-10 | Toyoda Gosei Co., Ltd. | Light emitting diode |
US20130256711A1 (en) | 2012-03-30 | 2013-10-03 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
US20130256710A1 (en) | 2007-10-31 | 2013-10-03 | Cree, Inc. | Multi-chip light emitter packages and related methods |
WO2013148573A1 (en) | 2012-03-30 | 2013-10-03 | Cree, Inc. | Ceramic-based light emitting diode (led) devices, components and methods |
US20130270592A1 (en) | 2012-03-30 | 2013-10-17 | Cree, Inc. | Submount based surface mount device (smd) light emitter components and methods |
USD702653S1 (en) | 2011-10-26 | 2014-04-15 | Cree, Inc. | Light emitting device component |
USD705181S1 (en) | 2011-10-26 | 2014-05-20 | Cree, Inc. | Light emitting device component |
USD706231S1 (en) | 2010-12-03 | 2014-06-03 | Cree, Inc. | Light emitting device |
USD707192S1 (en) | 2010-11-18 | 2014-06-17 | Cree, Inc. | Light emitting device |
WO2014093813A1 (en) | 2012-12-14 | 2014-06-19 | Cree, Inc. | Ceramic-based light emitting diode (led) devices, components and methods |
EP1670073B1 (en) | 2003-09-30 | 2014-07-02 | Kabushiki Kaisha Toshiba | Light emitting device |
US20140217433A1 (en) | 2010-11-22 | 2014-08-07 | Cree, Inc. | Light emitter devices and methods for light emitting diode (led) chips |
US8809880B2 (en) | 2011-02-16 | 2014-08-19 | Cree, Inc. | Light emitting diode (LED) chips and devices for providing failure mitigation in LED arrays |
USD712850S1 (en) | 2010-11-18 | 2014-09-09 | Cree, Inc. | Light emitter device |
USD721339S1 (en) | 2010-12-03 | 2015-01-20 | Cree, Inc. | Light emitter device |
USD738542S1 (en) | 2013-04-19 | 2015-09-08 | Cree, Inc. | Light emitting unit |
USD739565S1 (en) | 2013-06-27 | 2015-09-22 | Cree, Inc. | Light emitter unit |
USD740453S1 (en) | 2013-06-27 | 2015-10-06 | Cree, Inc. | Light emitter unit |
-
2016
- 2016-10-04 US US29/579,906 patent/USD823492S1/en active Active
Patent Citations (300)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE34861E (en) | 1987-10-26 | 1995-02-14 | North Carolina State University | Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
US4855194A (en) | 1988-02-05 | 1989-08-08 | The United States Of America As Represented By The United States Department Of Energy | Fuel cell having electrolyte inventory control volume |
US4946547A (en) | 1989-10-13 | 1990-08-07 | Cree Research, Inc. | Method of preparing silicon carbide surfaces for crystal growth |
US5210051A (en) | 1990-03-27 | 1993-05-11 | Cree Research, Inc. | High efficiency light emitting diodes from bipolar gallium nitride |
US5200022A (en) | 1990-10-03 | 1993-04-06 | Cree Research, Inc. | Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product |
JPH0738940Y2 (en) | 1991-05-13 | 1995-09-06 | スタンレー電気株式会社 | LED indicator light |
JPH06291236A (en) | 1993-03-30 | 1994-10-18 | Hitachi Cable Ltd | Semiconductor device |
US5393993A (en) | 1993-12-13 | 1995-02-28 | Cree Research, Inc. | Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices |
US5523589A (en) | 1994-09-20 | 1996-06-04 | Cree Research, Inc. | Vertical geometry light emitting diode with group III nitride active layer and extended lifetime |
KR100505838B1 (en) | 1997-03-18 | 2005-10-21 | 세이코 엡슨 가부시키가이샤 | Semiconductor device and its manufacturing method |
JPH10311937A (en) | 1997-05-14 | 1998-11-24 | Japan Aviation Electron Ind Ltd | Packaging structure of end face light emitting element or light receiving element |
US6093053A (en) | 1997-09-25 | 2000-07-25 | Hokuriku Electric Industry Co., Ltd. | Electric component with soldering-less terminal fitment |
US6224430B1 (en) | 1999-02-26 | 2001-05-01 | Fujitsu Limited | Power supply terminal assembly |
US6909051B2 (en) | 1999-04-26 | 2005-06-21 | Agilent Technologies, Inc. | Method and apparatus for coupling a circuit board to a transmission line that includes a heat sensitive dielectric |
US6548832B1 (en) | 1999-06-09 | 2003-04-15 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
JP2001131517A (en) | 1999-11-02 | 2001-05-15 | Hitachi Ltd | Thermosetting adhesive material and method for producing the same and use |
US7034778B1 (en) | 2000-04-05 | 2006-04-25 | Mannesmann Vdo Ag | Color head-up display, in particular for a vehicle |
JP2001294083A (en) | 2000-04-14 | 2001-10-23 | Yazaki Corp | Interior lighting system for vehicle |
US6503780B1 (en) | 2000-07-05 | 2003-01-07 | Amkor Technology, Inc. | Wafer scale image sensor package fabrication method |
US20020047189A1 (en) | 2000-10-20 | 2002-04-25 | Yoshinori Miyaki | Semiconductor device and its manufacturing method |
TW540169B (en) | 2001-03-29 | 2003-07-01 | Lumileds Lighting Llc | Monolithic series/parallel LED arrays formed on highly resistive substrates |
US7055987B2 (en) | 2001-09-13 | 2006-06-06 | Lucea Ag | LED-luminous panel and carrier plate |
JP2003192442A (en) | 2001-12-26 | 2003-07-09 | Toshiba Corp | Aluminum nitride substrate, aluminum nitride substrate having thin film, and submount material for laser light- emitting element obtained by using the same |
JP2003303504A (en) | 2002-04-10 | 2003-10-24 | Meiji Natl Ind Co Ltd | Illumination apparatus using light emitting diode |
US7224000B2 (en) | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
US20040079957A1 (en) | 2002-09-04 | 2004-04-29 | Andrews Peter Scott | Power surface mount light emitting die package |
US20040169466A1 (en) | 2002-12-24 | 2004-09-02 | Toyoda Gosei Co., Ltd. | Light emitting diode and light emitting diode array |
JP2004228413A (en) | 2003-01-24 | 2004-08-12 | Kyocera Corp | Package for housing light emitting element and light emitting device |
US20070246730A1 (en) | 2003-02-28 | 2007-10-25 | Nodoka Oishi | Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode |
JP2004311948A (en) | 2003-03-27 | 2004-11-04 | Seiko Epson Corp | Semiconductor device, electronic apparatus, and method for manufacturing semiconductor device |
US7208838B2 (en) | 2003-03-27 | 2007-04-24 | Seiko Epson Corporation | Semiconductor device, circuit board, and electronic instrument suitable for stacking and having a through hole |
US20130214674A1 (en) | 2003-04-01 | 2013-08-22 | Sharp Kabushiki Kaisha | Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus |
US20040196663A1 (en) | 2003-04-03 | 2004-10-07 | Koito Manufacturing Co., Ltd. | Vehicular headlamp and semiconductor light emitting element |
US20060180818A1 (en) | 2003-07-30 | 2006-08-17 | Hideo Nagai | Semiconductor light emitting device, light emitting module and lighting apparatus |
US8119534B2 (en) | 2003-08-19 | 2012-02-21 | Nichia Corporation | Semiconductor light emitting device with protrusions to improve external efficiency and crystal growth |
US20050152145A1 (en) | 2003-08-28 | 2005-07-14 | Currie Robert M. | Vehicle lighting system having an electronic module circuit and light emitting diodes |
US20070018295A1 (en) | 2003-09-09 | 2007-01-25 | Samsung Electronics Co., Ltd. | Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby |
EP1670073B1 (en) | 2003-09-30 | 2014-07-02 | Kabushiki Kaisha Toshiba | Light emitting device |
US20050073244A1 (en) | 2003-10-01 | 2005-04-07 | Chou Der Jeou | Methods and apparatus for an LED light |
US7812365B2 (en) | 2003-10-15 | 2010-10-12 | Nichia Corporation | Heat dissipation member, semiconductor apparatus and semiconductor light emitting apparatus |
US7482636B2 (en) | 2003-10-15 | 2009-01-27 | Nichia Corporation | Light emitting device |
US20070131954A1 (en) | 2003-10-15 | 2007-06-14 | Nichia Corporation | Light emitting device |
JP2005183148A (en) | 2003-12-18 | 2005-07-07 | Tsubakimoto Chain Co | Lighting system and sorting system |
US20050199899A1 (en) | 2004-03-11 | 2005-09-15 | Ming-Der Lin | Package array and package unit of flip chip LED |
JP2005266117A (en) | 2004-03-17 | 2005-09-29 | Rohm Co Ltd | Plane display |
JP2005276979A (en) | 2004-03-24 | 2005-10-06 | Matsushita Electric Ind Co Ltd | Led source |
US7391046B2 (en) | 2004-03-26 | 2008-06-24 | Koito Manufacturing Co., Ltd. | Light source module and vehicle front lamp |
US20060186418A1 (en) | 2004-05-18 | 2006-08-24 | Edmond John A | External extraction light emitting diode based upon crystallographic faceted surfaces |
US20050264172A1 (en) | 2004-05-26 | 2005-12-01 | Lockheed Martin | UV emitting LED having mesa structure |
US20070252523A1 (en) | 2004-08-18 | 2007-11-01 | Masakatsu Maeda | Ceramic Substrate for Mounting a Light Emitting Element and Method for Manufacturing the Same |
JP2006066786A (en) | 2004-08-30 | 2006-03-09 | Seiwa Electric Mfg Co Ltd | Light emitting diode |
EP1640792B1 (en) | 2004-09-23 | 2012-03-07 | Samsung Electronics Co., Ltd. | Backlight assembly and display apparatus having the backlight assembly |
US20080078664A1 (en) | 2004-09-24 | 2008-04-03 | Siemens Aktiengesellschaft | Dielectric Housing Having a Ventilation Shaft |
US20070247855A1 (en) | 2004-10-04 | 2007-10-25 | Kabushiki Kaisha Toshiba | Light Emitting Device,Lighting Equipment or Liquid Crystal Display Device Using Such Light Emitting Device |
USD528996S1 (en) * | 2004-10-14 | 2006-09-26 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
US20060147746A1 (en) | 2004-12-03 | 2006-07-06 | Ngk Spark Plug Co., Ltd. | Ceramic substrate, ceramic package for housing light emitting element |
US20080106723A1 (en) | 2004-12-10 | 2008-05-08 | Asml Netherlands B.V. | Substrate placement in immersion lithography |
US20060139595A1 (en) | 2004-12-27 | 2006-06-29 | Asml Netherlands B.V. | Lithographic apparatus and method for determining Z position errors/variations and substrate table flatness |
US20110012143A1 (en) | 2005-01-10 | 2011-01-20 | Cree, Inc. | Solid state lighting component |
US20080054286A1 (en) | 2005-01-27 | 2008-03-06 | Cree, Inc. | Light emitting device packages, light emitting diode (LED) packages and related methods |
USD528672S1 (en) | 2005-01-28 | 2006-09-19 | Matsushita Electric Industrial Co., Ltd. | LED module |
US20080164484A1 (en) | 2005-03-14 | 2008-07-10 | Seoul Semiconductor Co., Ltd. | Light Emitting Apparatus |
JP2006294898A (en) | 2005-04-12 | 2006-10-26 | Sumitomo Metal Electronics Devices Inc | Package for housing light emitting element |
USD541761S1 (en) | 2005-06-08 | 2007-05-01 | Matsushita Electric Industrial Co., Ltd. | Light emitting diode module |
KR20080033496A (en) | 2005-08-04 | 2008-04-16 | 크리 인코포레이티드 | Packages for semiconductor light emitting devices utilizing dispensed encapsulants and methods of packaging the same |
US20070029569A1 (en) | 2005-08-04 | 2007-02-08 | Peter Andrews | Packages for semiconductor light emitting devices utilizing dispensed encapsulants and methods of packaging the same |
US20070029664A1 (en) | 2005-08-05 | 2007-02-08 | Cree Microwave, Llc. | Integrated circuit package and method of assembling the same |
US20080191222A1 (en) | 2005-08-09 | 2008-08-14 | Seoul Opto Device Co., Ltd. | Ac Light Emitting Diode and Method for Fabricating the Same |
US20070158668A1 (en) | 2005-08-25 | 2007-07-12 | Cree, Inc. | Close loop electrophoretic deposition of semiconductor devices |
US8563339B2 (en) | 2005-08-25 | 2013-10-22 | Cree, Inc. | System for and method for closed loop electrophoretic deposition of phosphor materials on semiconductor devices |
US20070057364A1 (en) | 2005-09-01 | 2007-03-15 | Wang Carl B | Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof |
JP2009503888A5 (en) | 2005-09-14 | 2011-10-27 | ||
US7479660B2 (en) | 2005-10-21 | 2009-01-20 | Perkinelmer Elcos Gmbh | Multichip on-board LED illumination device |
US7213940B1 (en) | 2005-12-21 | 2007-05-08 | Led Lighting Fixtures, Inc. | Lighting device and lighting method |
KR20080092239A (en) | 2006-01-26 | 2008-10-15 | 소니 가부시끼 가이샤 | Light source device and display device |
US20070194336A1 (en) | 2006-02-17 | 2007-08-23 | Samsung Electronics Co., Ltd. | Light emitting device package and method of manufacturing the same |
JP2007227680A (en) | 2006-02-23 | 2007-09-06 | Matsushita Electric Works Ltd | White lighting system using light-emitting diode |
KR100793338B1 (en) | 2006-02-23 | 2008-01-11 | 삼성전기주식회사 | Light emitting diode module |
US7825578B2 (en) | 2006-03-01 | 2010-11-02 | Nichia Corporation | Yellow light emitting device with high luminance |
US20090122514A1 (en) | 2006-03-17 | 2009-05-14 | Dae Shin Led Co., Ltd. | Led module for illumination |
JP2007266357A (en) | 2006-03-29 | 2007-10-11 | Kyocera Corp | Light emitting device and illuminator |
US7393237B2 (en) | 2006-04-10 | 2008-07-01 | Hon Hai Precision Ind. Co., Ltd. | Cable assembly with light emitting diode |
US20070241345A1 (en) | 2006-04-14 | 2007-10-18 | High Power Optoelectronics, Inc. | Semiconductor light-emitting device and method of fabricating the same |
CN101438630A (en) | 2006-04-18 | 2009-05-20 | 科锐Led照明科技公司 | Lighting device and lighting method |
US8733968B2 (en) | 2006-04-18 | 2014-05-27 | Cree, Inc. | Lighting device and lighting method |
US7649209B2 (en) | 2006-04-24 | 2010-01-19 | Cree, Inc. | Side-view surface mount white LED |
US20070253209A1 (en) | 2006-04-27 | 2007-11-01 | Cree, Inc. | Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same |
US7655957B2 (en) | 2006-04-27 | 2010-02-02 | Cree, Inc. | Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same |
JP2007323857A (en) | 2006-05-30 | 2007-12-13 | Sony Corp | Backlight device and color image display device |
JP2007335371A (en) | 2006-06-19 | 2007-12-27 | Harison Toshiba Lighting Corp | Surface lighting device |
USD573731S1 (en) | 2006-06-20 | 2008-07-22 | Matsushita Electric Industrial Co., Ltd. | Lighting apparatus |
USD570506S1 (en) | 2006-06-20 | 2008-06-03 | Matsushita Electric Industrial Co., Ltd. | Lighting apparatus |
US8044418B2 (en) | 2006-07-13 | 2011-10-25 | Cree, Inc. | Leadframe-based packages for solid state light emitting devices |
USD593043S1 (en) | 2006-07-14 | 2009-05-26 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode |
USD570797S1 (en) | 2006-07-14 | 2008-06-10 | Samsung Electro-Mechanics Co., Ltd. | Light-emitting diode |
US20080019130A1 (en) | 2006-07-24 | 2008-01-24 | Pei-Choa Wang | Arrangement of Light-Emitting Diodes Of LED Lamp |
US7804147B2 (en) | 2006-07-31 | 2010-09-28 | Cree, Inc. | Light emitting diode package element with internal meniscus for bubble free lens placement |
US20080026498A1 (en) | 2006-07-31 | 2008-01-31 | Eric Tarsa | Light emitting diode package element with internal meniscus for bubble free lens placement |
US7943952B2 (en) | 2006-07-31 | 2011-05-17 | Cree, Inc. | Method of uniform phosphor chip coating and LED package fabricated using method |
US20080079017A1 (en) | 2006-07-31 | 2008-04-03 | Cree, Inc. | Method of uniform phosphor chip coating and led package fabricated using method |
US20080219003A1 (en) | 2006-08-29 | 2008-09-11 | Jun Seok Park | Backlight Unit and Liquid Crystal Display Apparatus Including the Same |
US20080055901A1 (en) | 2006-08-29 | 2008-03-06 | Toshiba Lighting & Technology Corporation | Illumination apparatus having a plurality of semiconductor light-emitting devices |
US20080054279A1 (en) | 2006-09-01 | 2008-03-06 | Hussell Christopher P | Phosphor Position in Light Emitting Diodes |
US8425271B2 (en) | 2006-09-01 | 2013-04-23 | Cree, Inc. | Phosphor position in light emitting diodes |
US20080054284A1 (en) | 2006-09-01 | 2008-03-06 | Hussell Christopher P | Encapsulant Profile for Light Emitting Diodes |
US20080089072A1 (en) | 2006-10-11 | 2008-04-17 | Alti-Electronics Co., Ltd. | High Power Light Emitting Diode Package |
USD586303S1 (en) | 2006-11-15 | 2009-02-10 | Citizen Electronics Co., Ltd. | Light-emitting diode unit for illuminating an object |
WO2008069204A1 (en) | 2006-12-04 | 2008-06-12 | Alps Electric Co., Ltd. | Light emitting device and projector |
US20080153344A1 (en) | 2006-12-22 | 2008-06-26 | Tyco Electronics | Surface mount poke in connector |
KR20080002564U (en) | 2007-01-08 | 2008-07-11 | 광성전기산업(주) | Lamp with light emitting diode module |
US20080179611A1 (en) | 2007-01-22 | 2008-07-31 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US20080173884A1 (en) | 2007-01-22 | 2008-07-24 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
USD573553S1 (en) * | 2007-02-09 | 2008-07-22 | Matsushita Electric Industrial Co., Ltd. | Light source of light-emitting diode |
US20090261374A1 (en) | 2007-03-12 | 2009-10-22 | Nichia Corporation | High output power light emitting device and packaged used therefor |
US20080224166A1 (en) | 2007-03-14 | 2008-09-18 | Glovatsky Andrew Z | Led interconnect spring clip assembly |
CN101636887B (en) | 2007-03-16 | 2012-10-10 | 皇家飞利浦电子股份有限公司 | Vertical extended cavity surface emission laser and method for manufacturing a light emitting component of the same |
US7872418B2 (en) | 2007-03-23 | 2011-01-18 | Sharp Kabushiki Kaisha | Light emitting device and method for manufacturing the same |
JP2008244075A (en) | 2007-03-27 | 2008-10-09 | Sharp Corp | Light-emitting device |
US20080239318A1 (en) | 2007-03-30 | 2008-10-02 | Asml Netherlands B.V. | Method of measuring asymmetry in a scatterometer, a method of measuring an overlay error in a substrate and a metrology apparatus |
US20080258130A1 (en) | 2007-04-23 | 2008-10-23 | Bergmann Michael J | Beveled LED Chip with Transparent Substrate |
USD577690S1 (en) * | 2007-05-25 | 2008-09-30 | Matsushita Electric Industrial Co., Ltd. | Light source of light emitting diode |
USD576576S1 (en) | 2007-05-25 | 2008-09-09 | Matsushita Electric Industrial Co., Ltd. | Light source of light emitting diode |
US20110111537A1 (en) | 2007-06-08 | 2011-05-12 | Ching-Tai Cheng | High thermal conductivity substrate for a semiconductor device |
US20090009103A1 (en) | 2007-07-05 | 2009-01-08 | Tyco Electronics Corporation | Wireless controlled light emitting assembly |
US20090023323A1 (en) | 2007-07-17 | 2009-01-22 | Lin Jeff C | LED Interconnection Integrated Connector Holder Package |
KR20090011121A (en) | 2007-07-25 | 2009-02-02 | 엘지이노텍 주식회사 | Light emitting device package and method for manufacturing the same |
JP2009044055A (en) | 2007-08-10 | 2009-02-26 | Toshiba Lighting & Technology Corp | Led module and led lighting equipment |
US20100139836A1 (en) | 2007-08-10 | 2010-06-10 | Takahiro Horikoshi | Substrate Bonding Apparatus and Substrate Bonding Method |
FR2921537A1 (en) | 2007-09-20 | 2009-03-27 | Stephane Jebabli | Power LED lighting device for e.g. tropical freshwater aquarium, has light part integrating series of power LEDs permitting combination of different color temperatures to simulate luminous environment of aquatic medium for aquarium |
US20100252851A1 (en) | 2007-10-31 | 2010-10-07 | Cree, Inc. | Led package with increased feature sizes |
US20130256710A1 (en) | 2007-10-31 | 2013-10-03 | Cree, Inc. | Multi-chip light emitter packages and related methods |
US20090130889A1 (en) | 2007-11-20 | 2009-05-21 | Tyco Electronics Corporation | Led socket |
USD591248S1 (en) | 2007-12-05 | 2009-04-28 | Citizen Electronics Co., Ltd. | Light-emitting diode for illuminating an object |
USD607420S1 (en) | 2007-12-05 | 2010-01-05 | Citizen Electronics Co., Ltd. | Light-emitting diode for illuminating an object |
USD618635S1 (en) | 2007-12-05 | 2010-06-29 | Citizen Electronics Co., Ltd. | Light-emitting diode for illuminating an object |
USD592615S1 (en) | 2007-12-05 | 2009-05-19 | Citizen Electronics Co., Ltd. | Light-emitting diode for illuminating an object |
US7994518B2 (en) | 2007-12-11 | 2011-08-09 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode |
US8167674B2 (en) | 2007-12-14 | 2012-05-01 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
US20090166657A1 (en) | 2007-12-28 | 2009-07-02 | Nichia Corporation | Light emitting device |
US8058088B2 (en) | 2008-01-15 | 2011-11-15 | Cree, Inc. | Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating |
US20100155763A1 (en) | 2008-01-15 | 2010-06-24 | Cree, Inc. | Systems and methods for application of optical materials to optical elements |
USD589470S1 (en) | 2008-02-01 | 2009-03-31 | Neobulb Technologies, Inc. | Light-emitting module |
US20090206718A1 (en) | 2008-02-20 | 2009-08-20 | Toyoda Gosei Co., Ltd. | LED lamp module |
US7780313B2 (en) | 2008-03-19 | 2010-08-24 | E-Pin Optical Industry Co. Ltd | Package structure for light emitting diode |
US20090239409A1 (en) | 2008-03-24 | 2009-09-24 | Avx Corporation | Insulation displacement connector (idc) |
US20110065241A1 (en) | 2008-03-25 | 2011-03-17 | Bridge Semiconductor Corporation | Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump |
US20090262527A1 (en) | 2008-04-18 | 2009-10-22 | Top Crystal Technology, Inc. | High-Voltage Light Emitting Diode Circuit Having a Plurality of Critical Voltages and Light Emitting Diode Device Using the Same |
USD622876S1 (en) * | 2008-04-25 | 2010-08-31 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
WO2009133615A1 (en) | 2008-05-01 | 2009-11-05 | 株式会社グローバル・アイ | Lighting apparatus using led |
WO2009141982A1 (en) | 2008-05-19 | 2009-11-26 | 株式会社 東芝 | Linear white light source, and backlight and liquid crystal display device using linear white light source |
USD602451S1 (en) | 2008-05-20 | 2009-10-20 | Koninklijke Philips Electronics N.V. | LED module |
US20090289169A1 (en) | 2008-05-22 | 2009-11-26 | Omnivision Technologies, Inc. | Image sensor with simultaneous auto-focus and image preview |
US8461613B2 (en) | 2008-05-27 | 2013-06-11 | Interlight Optotech Corporation | Light emitting device |
JP2009289918A (en) | 2008-05-28 | 2009-12-10 | Alps Electric Co Ltd | Semiconductor light-emitting device |
US20120032226A1 (en) | 2008-06-24 | 2012-02-09 | Wen-Herng Su | Light Emitting Diode Submount with High Thermal Conductivity for High Power Operation |
US20090315061A1 (en) | 2008-06-24 | 2009-12-24 | Cree, Inc. | Methods of assembly for a semiconductor light emitting device package |
JP2010009972A (en) | 2008-06-27 | 2010-01-14 | Toshiba Lighting & Technology Corp | Light emitting module and light emitting device |
US20090322197A1 (en) | 2008-06-30 | 2009-12-31 | Rene Helbing | Light emitting device having a transparent thermally conductive layer |
US20100141182A1 (en) | 2008-09-10 | 2010-06-10 | Bridgelux, Inc. | Phosphor layer arrangement for use with light emitting diodes |
US20100253248A1 (en) | 2008-09-10 | 2010-10-07 | Bridgelux, Inc. | Phosphor layer arrangement for use with light emitting diodes |
JP2012503331A (en) | 2008-09-16 | 2012-02-02 | オスラム・シルバニア・インコーポレイテッド | Lighting module |
US8022626B2 (en) | 2008-09-16 | 2011-09-20 | Osram Sylvania Inc. | Lighting module |
US20100078669A1 (en) | 2008-09-29 | 2010-04-01 | Seoul Semiconductor Co., Ltd. | Light emitting device and lead frame for the same |
US20100078664A1 (en) | 2008-09-30 | 2010-04-01 | Rene Peter Helbing | Led phosphor deposition |
USD603813S1 (en) | 2008-10-01 | 2009-11-10 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
US20100096642A1 (en) | 2008-10-20 | 2010-04-22 | Brilliant Technology Co., Ltd. | Packaging struture for high power light emitting diode(led) chip |
US20100103660A1 (en) | 2008-10-24 | 2010-04-29 | Cree Led Lighting Solutions, Inc. | Array layout for color mixing |
TW201029146A (en) | 2008-10-24 | 2010-08-01 | Cree Led Lighting Solutions | Array layout for color mixing |
JP2010103541A (en) | 2008-10-27 | 2010-05-06 | Asm Assembly Automation Ltd | Direct die bonding using heated bond head |
JP2010147189A (en) | 2008-12-17 | 2010-07-01 | Panasonic Electric Works Co Ltd | Light-emitting device |
US20100193822A1 (en) | 2009-01-30 | 2010-08-05 | Nichia Corporation | Light emitting semiconductor device and method of manufacture thereof |
JP2010199167A (en) | 2009-02-24 | 2010-09-09 | Sumitomo Metal Electronics Devices Inc | Package for housing light-emitting element, and light-emitting device |
KR20100111255A (en) | 2009-04-06 | 2010-10-14 | 크리, 인코포레이티드 | High voltage low current surface emitting led |
US20100264799A1 (en) | 2009-04-20 | 2010-10-21 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led lamp |
US20100270567A1 (en) | 2009-04-28 | 2010-10-28 | Cree, Inc. | Lighting device |
USD615051S1 (en) | 2009-05-05 | 2010-05-04 | Prolight Opto Technology Corporation | LED package |
US20100320483A1 (en) | 2009-06-23 | 2010-12-23 | Citizen Electronics Co., Ltd. | Light-emitting diode apparatus |
KR20110004632A (en) | 2009-07-08 | 2011-01-14 | 한성엘컴텍 주식회사 | Led lamp of socket combination |
US20110013400A1 (en) | 2009-07-16 | 2011-01-20 | Japan Aviation Electronics Industry, Limited | Socket, circuit board assembly, and apparatus having the same |
US20110043137A1 (en) | 2009-08-19 | 2011-02-24 | Cree Led Lighting Solutions, Inc. | White light color changing solid state lighting and methods |
KR20110021639A (en) | 2009-08-26 | 2011-03-04 | 파라곤 세미컨덕터 라이팅 테크놀로지 컴퍼니 리미티드 | Quasi-optical led package structure for increasing color render index and brightness |
USD626666S1 (en) | 2009-09-01 | 2010-11-02 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
USD628312S1 (en) | 2009-09-01 | 2010-11-30 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
USD627493S1 (en) | 2009-09-01 | 2010-11-16 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
US20110068702A1 (en) | 2009-09-24 | 2011-03-24 | Cree Led Lighting Solutions, Inc. | Solid state lighting apparatus with controllable bypass circuits and methods of operation thereof |
EP2302283A2 (en) | 2009-09-24 | 2011-03-30 | Toshiba Lighting & Technology Corporation | Light-emitting device and illumination device |
US20110068696A1 (en) | 2009-09-24 | 2011-03-24 | Van De Ven Antony P | Solid state lighting apparatus with configurable shunts |
US20110068674A1 (en) | 2009-09-24 | 2011-03-24 | Toshiba Lighting & Technology Corporation | Light-emitting device and illumination device |
EP2302286A3 (en) | 2009-09-25 | 2012-06-27 | Toshiba Lighting & Technology Corporation | Lamp and lighting equipment |
USD630171S1 (en) | 2009-10-16 | 2011-01-04 | Everlight Electronics Co., Ltd. | Light emitting diode |
CN102044602A (en) | 2009-10-23 | 2011-05-04 | 亿光电子工业股份有限公司 | Packaging structure of light-emitting diode |
USD615052S1 (en) | 2009-10-27 | 2010-05-04 | Citizen Electronics Co. Ltd. | Light-emitting diode |
JP2011108744A (en) | 2009-11-13 | 2011-06-02 | Sharp Corp | Light-emitting device, and method for producing the same |
US20110116275A1 (en) | 2009-11-13 | 2011-05-19 | Kevin Todd Sheek | Electrical connectors and light emitting device package and methods of assembling the same |
USD628722S1 (en) | 2009-11-18 | 2010-12-07 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
USD628318S1 (en) | 2009-11-18 | 2010-11-30 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
US20110121323A1 (en) | 2009-11-26 | 2011-05-26 | Cheng Ju Wu | Packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity |
EP2327930B1 (en) | 2009-11-26 | 2013-07-17 | Alliance Optotek Co.,Ltd. | Modular lighting device |
US20110127912A1 (en) | 2009-11-30 | 2011-06-02 | Young Jin Lee | Led package, led package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof |
US20110128730A1 (en) | 2009-12-01 | 2011-06-02 | Hua-Jung Chiu | LED lamp |
US20110136394A1 (en) | 2009-12-09 | 2011-06-09 | Tyco Electronics Corporation | Led socket assembly |
CN101876406A (en) | 2009-12-14 | 2010-11-03 | 东莞市光宇新能源科技有限公司 | Technique for manufacturing high-power light emitting diode (LED) lamp |
US20110148327A1 (en) | 2009-12-21 | 2011-06-23 | Van De Ven Antony P | High cri adjustable color temperature lighting devices |
USD636899S1 (en) | 2010-01-28 | 2011-04-26 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
US20110193109A1 (en) | 2010-02-08 | 2011-08-11 | Loh Ban P | Led light module |
KR20110008161U (en) | 2010-02-11 | 2011-08-18 | (주)비젼테크솔루션 | A device for LED lamp reflecting shade |
US20120313135A1 (en) | 2010-02-24 | 2012-12-13 | Citizen Electronics Co., Ltd. | Mounting board and structure of the same |
US20110221330A1 (en) | 2010-03-09 | 2011-09-15 | Cree, Inc. | High cri lighting device with added long-wavelength blue color |
US7955147B1 (en) | 2010-03-15 | 2011-06-07 | Zierick Manufacturing Corporation | Surface mount (SMT) crimp terminal and method of securing wire to same |
KR20110104336A (en) | 2010-03-16 | 2011-09-22 | 엘지이노텍 주식회사 | Light emitting diode package and fabricating method thereof |
USD640997S1 (en) | 2010-04-01 | 2011-07-05 | Citizen Electronics Co., Ltd. | Light-emitting diode |
USD645417S1 (en) | 2010-04-01 | 2011-09-20 | Citizen Electronics Co., Ltd. | Light-emitting diode |
EP2560219A1 (en) | 2010-04-16 | 2013-02-20 | Nichia Corporation | Light-emitting device and manufacturing method for light-emitting device |
JP2011228369A (en) | 2010-04-16 | 2011-11-10 | Nichia Chem Ind Ltd | Light emitting device |
WO2011129203A1 (en) | 2010-04-16 | 2011-10-20 | 日亜化学工業株式会社 | Light-emitting device |
US8517572B2 (en) | 2010-05-06 | 2013-08-27 | Heathco, Llc | Method and apparatus pertaining to a cone-shaped lens in combination with a lateral member |
US20110291151A1 (en) | 2010-05-26 | 2011-12-01 | Toshiba Lighting & Technology Corporation | Light emitting device and lighting apparatus |
JP2010192109A (en) | 2010-06-08 | 2010-09-02 | Sharp Corp | Playback device and recording device |
USD658602S1 (en) | 2010-06-15 | 2012-05-01 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
USD658603S1 (en) | 2010-06-15 | 2012-05-01 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
USD658601S1 (en) | 2010-06-15 | 2012-05-01 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
WO2012029360A1 (en) | 2010-08-30 | 2012-03-08 | シャープ株式会社 | Illumination device and display device |
US8410679B2 (en) | 2010-09-21 | 2013-04-02 | Cree, Inc. | Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface |
JP2012079855A (en) | 2010-09-30 | 2012-04-19 | Sharp Corp | Light-emitting device and luminaire having the same |
USD669041S1 (en) | 2010-10-05 | 2012-10-16 | Citizen Electronics Co., Ltd. | Light-emitting diode |
JP2012089551A (en) | 2010-10-15 | 2012-05-10 | Toshiba Lighting & Technology Corp | Lighting device |
USD637564S1 (en) | 2010-10-19 | 2011-05-10 | Edison Opto Corporation | Light emitting diode |
USD712850S1 (en) | 2010-11-18 | 2014-09-09 | Cree, Inc. | Light emitter device |
USD707192S1 (en) | 2010-11-18 | 2014-06-17 | Cree, Inc. | Light emitting device |
US20120126257A1 (en) | 2010-11-22 | 2012-05-24 | Jesse Colin Reiherzer | Light emitting devices and methods |
TWI481072B (en) | 2010-11-22 | 2015-04-11 | Cree Inc | Light emitting devices and methods |
US20140097453A1 (en) | 2010-11-22 | 2014-04-10 | Cree, Inc. | Light emitting devices for light emitting diodes (leds) |
US8564000B2 (en) | 2010-11-22 | 2013-10-22 | Cree, Inc. | Light emitting devices for light emitting diodes (LEDs) |
USD676000S1 (en) | 2010-11-22 | 2013-02-12 | Cree, Inc. | Light emitting device package |
USD676395S1 (en) | 2010-11-22 | 2013-02-19 | Cree, Inc. | Light emitting device package |
US20120250310A1 (en) | 2010-11-22 | 2012-10-04 | Hussell Christopher P | Attachment devices and methods for light emitting devices |
CN103329290B (en) | 2010-11-22 | 2017-09-29 | 科锐公司 | Luminescent device and method |
US9300062B2 (en) | 2010-11-22 | 2016-03-29 | Cree, Inc. | Attachment devices and methods for light emitting devices |
US20160013164A1 (en) | 2010-11-22 | 2016-01-14 | Cree, Inc. | Light emitter devices and methods for light emitting diode (led) chips |
USD667803S1 (en) | 2010-11-22 | 2012-09-25 | Cree, Inc. | Light emitting device package |
US9209354B2 (en) | 2010-11-22 | 2015-12-08 | Cree, Inc. | Light emitting devices for light emitting diodes (LEDs) |
US9203004B2 (en) | 2010-11-22 | 2015-12-01 | Cree, Inc. | Light emitting devices for light emitting diodes (LEDs) |
WO2012071136A2 (en) | 2010-11-22 | 2012-05-31 | Cree, Inc. | Light emitting devices and methods |
TWI502772B (en) | 2010-11-22 | 2015-10-01 | Cree Inc | Light emitting devices and methods |
EP2643862A4 (en) | 2010-11-22 | 2015-05-27 | Cree Inc | Light emitting devices and methods |
WO2012071138A2 (en) | 2010-11-22 | 2012-05-31 | Cree, Inc. | Attachment devices and methods for light emitting devices |
US8624271B2 (en) | 2010-11-22 | 2014-01-07 | Cree, Inc. | Light emitting devices |
US9000470B2 (en) | 2010-11-22 | 2015-04-07 | Cree, Inc. | Light emitter devices |
US20120126255A1 (en) | 2010-11-22 | 2012-05-24 | Hussell Christopher P | Light emitting devices and methods |
US20140217433A1 (en) | 2010-11-22 | 2014-08-07 | Cree, Inc. | Light emitter devices and methods for light emitting diode (led) chips |
US20140183577A1 (en) | 2010-11-22 | 2014-07-03 | Cree, Inc. | Light emitting devices for light emitting diodes (leds) |
US20120193651A1 (en) | 2010-11-22 | 2012-08-02 | Edmond John A | Light emitting devices, systems, and methods |
WO2012071139A3 (en) | 2010-11-22 | 2012-07-12 | Cree, Inc. | Light emitting devices and methods |
USD650760S1 (en) | 2010-11-22 | 2011-12-20 | Cree, Inc. | Light emitting device package |
EP2643861A2 (en) | 2010-11-22 | 2013-10-02 | Cree, Inc. | Light emitting devices and methods |
USD721339S1 (en) | 2010-12-03 | 2015-01-20 | Cree, Inc. | Light emitter device |
USD706231S1 (en) | 2010-12-03 | 2014-06-03 | Cree, Inc. | Light emitting device |
USD683708S1 (en) | 2010-12-09 | 2013-06-04 | Nichia Corporation | Light emitting diode |
US20120175643A1 (en) | 2011-01-09 | 2012-07-12 | Bridgelux, Inc. | Packaging Photon Building Blocks Having Only Top Side Connections in an Interconnect Structure |
US8354684B2 (en) | 2011-01-09 | 2013-01-15 | Bridgelux, Inc. | Packaging photon building blocks having only top side connections in an interconnect structure |
WO2012109225A1 (en) | 2011-02-07 | 2012-08-16 | Cree, Inc. | Components and methods for light emitting diode (led) lighting |
US20130003375A1 (en) | 2011-02-07 | 2013-01-03 | Hussell Christopher P | Components and methods for light emitting diode (led) lighting |
US20140097454A1 (en) | 2011-02-16 | 2014-04-10 | Cree, Inc. | Light emitting devices for light emitting diodes (leds) |
US20120205689A1 (en) | 2011-02-16 | 2012-08-16 | Welch Erin R F | Light emitting devices and methods |
US8575639B2 (en) | 2011-02-16 | 2013-11-05 | Cree, Inc. | Light emitting devices for light emitting diodes (LEDs) |
US8455908B2 (en) | 2011-02-16 | 2013-06-04 | Cree, Inc. | Light emitting devices |
US9194567B2 (en) | 2011-02-16 | 2015-11-24 | Cree, Inc. | High voltage array light emitting diode (LED) devices and fixtures |
US8729589B2 (en) | 2011-02-16 | 2014-05-20 | Cree, Inc. | High voltage array light emitting diode (LED) devices and fixtures |
US20120299022A1 (en) | 2011-02-16 | 2012-11-29 | Hussell Christopher P | Light emitting devices and methods |
US20150207040A1 (en) | 2011-02-16 | 2015-07-23 | Cree, Inc. | Light emitting devices for light emitting diodes (leds) |
US8994057B2 (en) | 2011-02-16 | 2015-03-31 | Cree, Inc. | Light emitting devices for light emitting diodes (LEDS) |
US8921869B2 (en) | 2011-02-16 | 2014-12-30 | Cree, Inc. | Method of providing light emitting device |
US20140240974A1 (en) | 2011-02-16 | 2014-08-28 | Cree, Inc. | High voltage array light emitting diode (led) devices and fixtures |
US8809880B2 (en) | 2011-02-16 | 2014-08-19 | Cree, Inc. | Light emitting diode (LED) chips and devices for providing failure mitigation in LED arrays |
US20110176316A1 (en) | 2011-03-18 | 2011-07-21 | Phipps J Michael | Semiconductor lamp with thermal handling system |
US20120241807A1 (en) | 2011-03-24 | 2012-09-27 | Osram Ag | Mounting Structure for Solid State Light Sources |
EP2751471A4 (en) | 2011-09-02 | 2015-07-15 | Cree Inc | Light emitting devices, systems, and methods |
US20130058099A1 (en) | 2011-09-02 | 2013-03-07 | Soraa, Inc. | High Intensity Light Source with Interchangeable Optics |
WO2013032737A2 (en) | 2011-09-02 | 2013-03-07 | Cree, Inc. | Light emitting devices, systems, and methods |
USD702653S1 (en) | 2011-10-26 | 2014-04-15 | Cree, Inc. | Light emitting device component |
USD736725S1 (en) | 2011-10-26 | 2015-08-18 | Cree, Inc. | Light emitting device component |
USD705181S1 (en) | 2011-10-26 | 2014-05-20 | Cree, Inc. | Light emitting device component |
CN104081112B (en) | 2011-11-07 | 2016-03-16 | 克利公司 | High voltage array light-emitting diode (LED) device, equipment and method |
WO2013070696A1 (en) | 2011-11-07 | 2013-05-16 | Cree, Inc. | High voltage array light emitting diode (led) devices, fixtures and methods |
WO2013096431A1 (en) | 2011-12-23 | 2013-06-27 | Cree, Inc. | Improved light emitting devices and methods |
JP5937696B2 (en) | 2011-12-23 | 2016-06-22 | クリー インコーポレイテッドCree Inc. | Improved light emitting device and light emitting method |
USD689451S1 (en) | 2012-01-24 | 2013-09-10 | Toyoda Gosei Co., Ltd. | Light emitting diode |
US20130200406A1 (en) | 2012-02-07 | 2013-08-08 | Cree, Inc. | Ceramic-based light emitting diode (led) devices, components, and methods |
US20130200420A1 (en) | 2012-02-07 | 2013-08-08 | Cree, Inc. | Ceramic-based light emitting diode (led) devices, components, and methods |
US20130207142A1 (en) | 2012-02-13 | 2013-08-15 | Jesse Colin Reiherzer | Light emitter devices having improved chemical and physical resistance and related methods |
US20130207130A1 (en) | 2012-02-13 | 2013-08-15 | Jesse Colin Reiherzer | Light emitter devices having improved light output and related methods |
WO2013122831A1 (en) | 2012-02-13 | 2013-08-22 | Cree, Inc. | Improved light emitting devices and methods |
US20130270592A1 (en) | 2012-03-30 | 2013-10-17 | Cree, Inc. | Submount based surface mount device (smd) light emitter components and methods |
WO2013148573A1 (en) | 2012-03-30 | 2013-10-03 | Cree, Inc. | Ceramic-based light emitting diode (led) devices, components and methods |
US20130256711A1 (en) | 2012-03-30 | 2013-10-03 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
US8895998B2 (en) | 2012-03-30 | 2014-11-25 | Cree, Inc. | Ceramic-based light emitting diode (LED) devices, components and methods |
WO2014093813A1 (en) | 2012-12-14 | 2014-06-19 | Cree, Inc. | Ceramic-based light emitting diode (led) devices, components and methods |
USD738542S1 (en) | 2013-04-19 | 2015-09-08 | Cree, Inc. | Light emitting unit |
USD740453S1 (en) | 2013-06-27 | 2015-10-06 | Cree, Inc. | Light emitter unit |
USD739565S1 (en) | 2013-06-27 | 2015-09-22 | Cree, Inc. | Light emitter unit |
Non-Patent Citations (224)
Title |
---|
"DuPont Ti-Pure titanium dioxide, Titanium Dioxide for Coatings," Jan. 2012, pp. 1-28, DuPont,USA. |
"Technical Guide, Reflectance Materials and Coatings," Jan. 2012, pp. 1-26, Labsphere,USA. |
"Thick-Film Ceramic Substrates Design Guide," Mar. 2012, pp. 1-16, CoorsTek, Colorado,USA. |
Advisory Action for U.S. Appl. No. 13/224,850 dated Nov. 9, 2015. |
Advisory Action for U.S. Appl. No. 13/800,284 dated Jan. 4, 2016. |
Appeal Decision for Japanese Design Application No. 2012-031548 dated Jun. 17, 2015. |
Bridgelux Product Data Sheet-1 page. |
Chinese Decision to Grant for Application No. 201230472866.4 dated Jan. 24, 2013. |
Chinese Decision to Grant for Application No. 201230652789 dated Jul. 17, 2013. |
Chinese Notice of Grant for Application No. 201230130915.6 dated Jul. 3, 2013. |
Chinese Notice of Grant for Application No. 201230652790.3 dated Jun. 26, 2013. |
Chinese Notice of Grant for Application No. 201230652840.3 dated Jul. 26, 2013. |
Chinese Notice of Grant for Chinese Application No. 201180065495 dated Jun. 29, 2017. |
Chinese Notice to Grant for Application No. 201330361367.2 dated Oct. 8, 2013. |
Chinese Office Action for Application No. 201180061776.9 dated Feb. 22, 2016. |
Chinese Office Action for Application No. 201180061776.9 dated Jun. 10, 2015. |
Chinese Office Action for Application No. 201180065495.0 dated Jan. 14, 2016. |
Chinese Office Action for Application No. 201180065495.0 dated May 29, 2015. |
Chinese Office Action for Application No. 201180065708.X dated Jun. 23, 2015. |
Chinese Office Action for Application No. 201230472866.4 dated Nov. 14, 2012. |
Chinese Office Action for Application No. 201280066174.7 dated Jun. 3, 2015. |
Chinese Office Action for Application No. 201380009124.X dated Apr. 6, 2016. |
Chinese Office Action for Application No. CN 2012/30130915.6 dated Feb. 27, 2013. |
Chinese Office Action for Application No. CN 2012/30130915.6 dated Oct. 24, 2012. |
Chinese Office Action for Application Serial No. CN 2012/30130915.6 dated Jul. 12, 2012. |
Citizen Co. Product Data Sheet-4 pages http://ce.citizen.co.jp/lighting_led/en/products/index.html. |
Design U.S. Appl. No. 29/379,636 for "Light Emitting Device Package" filed Nov. 22, 2011. |
Design U.S. Appl. No. 29/380,387 for "Light Emitting Device Package" filed Dec. 3, 2010. |
Design U.S. Appl. No. 29/404,913 for "Light Emitting Device Component" filed Oct. 26, 2011. |
Design U.S. Appl. No. 29/408,955 for "Light Emitting Device Package" filed Dec. 19, 2011. |
European Notice of Publication for Application No. 12827778.7 dated Jun. 12, 2014. |
European Patent Office Communication pursuant to Rule 114(2) EPC for Application No. 20110843026 dated Sep. 24, 2014. |
European Patent Office Communication pursuant to Rule 114(2) EPC for Application No. 2011-0843773 dated Aug. 20, 2014. |
European Search Report for Application No. 11 84 3026 dated Apr. 17, 2015. |
Ex Parte Quayle Action for U.S. Appl. No. 13/671,089 dated Aug. 13, 2013. |
Extended European Search Report for Application No. 12849022.4 dated Jun. 16, 2015. |
Final Office Action for U.S. Appl. No. 13/224,850 dated Jul. 22, 2015. |
Final Office Action for U.S. Appl. No. 13/224,850 dated May 30, 2014. |
Final Office Action for U.S. Appl. No. 13/282,172 dated Sep. 17, 2014. |
Final Office Action for U.S. Appl. No. 13/296,812 dated Apr. 23, 2015. |
Final Office Action for U.S. Appl. No. 13/800,284 dated Oct. 22, 2015. |
Final Office Action for U.S. Appl. No. 13/836,940 dated Apr. 17, 2015. |
Final Office Action for U.S. Appl. No. 29/425,831 dated Jun. 10, 2014. |
International Search Report and Written Opininon for Application No. PCT/US2013/033704 dated Jun. 26, 2013. |
International Search Report and Written Opininon for Application No. PCT/US2013/074998 dated Apr. 3, 2014. |
International Search Report and Written Opinion for Application No. PCT/US2012/051344 dated Feb. 28, 2013. |
International Search Report and Written Opinion for Application No. PCT/US2012/063861 dated Mar. 18, 2013. |
International Search Report and Written Opinion for Application No. PCT/US2012/070589 dated Apr. 22, 2013. |
International Search Report and Written Opinion for Application No. PCT/US2013/025307 dated May 15, 2013. |
International Search Report and Written Opinion for Application Serial No. PCT/US2011/058596 dated Jun. 18, 2012. |
International Search Report and Written Opinion for Application Serial No. PCT/US2011/058601 dated May 24, 2012. |
International Search Report and Written Opinion for Application Serial No. PCT/US2011/058603 dated May 23, 2012. |
Japanese Appeal Decision for Application No. 2014-24357 dated Feb. 25, 2016. |
Japanese Decision of Registration for Application No. 2012-023963 dated Jun. 4, 2013. |
Japanese Decision of Registration for Application No. 2012-026117 dated Jun. 4, 2013. |
Japanese Decision of Registration for Application No. 2013-018279 dated Jan. 15, 2014. |
Japanese Decision to Grant for Application No. JP 2014-548830 dated Apr. 19, 2016. |
Japanese Office Action for Application No. 2012-023963 dated Feb. 26, 2013. |
Japanese Office Action for Application No. 2012-026117 dated Feb. 26, 2013. |
Japanese Office Action for Application No. 2012-031548 dated Nov. 5, 2013. |
Japanese Office Action for Application No. 2012031548 dated Sep. 1, 2014. |
Japanese Office Action for Application No. 2012-031549 dated Jun. 4, 2013. |
Japanese Office Action for Application No. 2012-031549 dated May 25, 2015. |
Japanese Office Action for Application No. 2012-031549 dated Nov. 5, 2013. |
Japanese Office Action for Application No. 2012031549 dated Sep. 1, 2014. |
Japanese Office Action for Application No. 2013/540955 dated Jul. 7, 2015. |
Japanese Office Action for Application No. 2013-540955 dated Dec. 15, 2015. |
Japanese Office Action for Application No. 2013-540955 dated Jan. 20, 2015. |
Japanese Office Action for Application No. 2014-548830 dated May 19, 2015. |
Japanese Office Action for Application No. 2014-548830 dated Nov. 10, 2015. |
Japanese Office Action for Application No. JP 2013-540955 dated Apr. 26, 2016. |
Korean Certificate of Design Patent for Application No. 2012-0020196 dated Jul. 14, 2014. |
Korean Certificate of Design Patent for Application No. 2012-0020197 dated Jul. 14, 2014. |
Korean Decision of Rejection for Application No. 10-2013-7015669 dated Nov. 6, 2014. |
Korean Decision to Decline Amendment and Decision of Rejection for Application No. 10-2013-7015669 dated Dec. 26, 2014. |
Korean Notice of Allowance for Application No. 30-2012-0020196 dated Apr. 21, 2014. |
Korean Notice of Allowance for Application No. 30-2012-0020197 dated Apr. 21, 2014. |
Korean Notice of Rejection for Application No. KR 30-2012-0020198 dated Jan. 14, 2014. |
Korean Office Action for Application No. 10-2013-7015669 dated Jun. 3, 2014. |
Korean Office Action for Application No. 10-2014-7014959 dated Nov. 9, 2015. |
Korean Office Action for Application No. 30-2012-0020196 dated Aug. 13, 2013. |
Korean Office Action for Application No. 30-2012-0020197 dated Aug. 13, 2013. |
Korean Office Action for Application No. 30-2012-0020198 dated Aug. 13, 2013. |
Korean Trial Decision for Application No. 30-2012-0020198 dated Jul. 29, 2014. |
Non-Final Office Action for Application No. 13/224,850 dated Sep. 5, 2013. |
Non-Final Office Action for U.S. Appl. No. 13/028,972 dated Oct. 10, 2012. |
Non-Final Office Action for U.S. Appl. No. 13/104,558 dated Jan. 3, 2013. |
Non-Final Office Action for U.S. Appl. No. 13/224,850 dated Dec. 18, 2014. |
Non-Final Office Action for U.S. Appl. No. 13/224,850 dated Feb. 8, 2016. |
Non-Final Office Action for U.S. Appl. No. 13/282,172 dated Mar. 21, 2014. |
Non-Final Office Action for U.S. Appl. No. 13/282,172 dated May 11, 2015. |
Non-Final Office Action for U.S. Appl. No. 13/296,812 dated Oct. 30, 2014. |
Non-Final Office Action for U.S. Appl. No. 13/435,912 dated Jan. 11, 2013. |
Non-Final Office Action for U.S. Appl. No. 13/436,247 dated Nov. 7, 2013. |
Non-Final Office Action for U.S. Appl. No. 13/671,089 dated Mar. 29, 2013. |
Non-Final Office Action for U.S. Appl. No. 13/793,882 dated Nov. 15, 2013. |
Non-Final Office Action for U.S. Appl. No. 13/800,284 dated Jun. 4, 2015. |
Non-Final Office Action for U.S. Appl. No. 13/836,709 dated Sep. 30, 2014. |
Non-Final Office Action for U.S. Appl. No. 13/836,940 dated Oct. 7, 2014. |
Non-Final Office Action for U.S. Appl. No. 14/043,494 dated Jun. 20, 2014. |
Non-Final Office Action for U.S. Appl. No. 14/052,201 dated Jun. 19, 2014. |
Non-Final Office Action for U.S. Appl. No. 14/148,102 dated Dec. 5, 2014. |
Non-Final Office Action for U.S. Appl. No. 14/148,102 dated Jun. 20, 2014. |
Non-Final Office Action for U.S. Appl. No. 14/189,500 dated Jul. 15, 2014. |
Non-Final Office Action for U.S. Appl. No. 14/673,263 dated Jun. 30, 2015. |
Non-Final Office Action for U.S. Appl. No. 29/380,387 dated Apr. 25, 2012. |
Non-Final Office Action for U.S. Appl. No. 29/425,831 dated Dec. 24, 2013. |
Non-Final Office Action for U.S. Appl. No. 29/451,177 dated Dec. 30, 2013. |
Notice of Allowance for Application No. 13/028,972 dated Feb. 28, 2013. |
Notice of Allowance for Application No. 13/104,558 dated Aug. 28, 2013. |
Notice of Allowance for Application No. 29/404,913 dated Jun. 25, 2013. |
Notice of Allowance for U.S. Appl. No. 13/028,972 dated May 23, 2013. |
Notice of Allowance for U.S. Appl. No. 13/104,558 dated Jul. 1, 2013. |
Notice of Allowance for U.S. Appl. No. 13/282,172 dated Dec. 23, 2015. |
Notice of Allowance for U.S. Appl. No. 13/282,172 dated Nov. 16, 2015. |
Notice of Allowance for U.S. Appl. No. 13/336,540 dated Jan. 31, 2013. |
Notice of Allowance for U.S. Appl. No. 13/435,912 dated Jun. 19, 2013. |
Notice of Allowance for U.S. Appl. No. 13/436,247 dated Jun. 18, 2014. |
Notice of Allowance for U.S. Appl. No. 13/671,089 dated Oct. 22, 2013. |
Notice of Allowance for U.S. Appl. No. 13/793,882 dated Mar. 12, 2014. |
Notice of Allowance for U.S. Appl. No. 13/908,597 dated Aug. 20, 2014. |
Notice of Allowance for U.S. Appl. No. 14/043,494 dated Apr. 17, 2015. |
Notice of Allowance for U.S. Appl. No. 14/043,494 dated Dec. 10, 2014. |
Notice of Allowance for U.S. Appl. No. 14/043,494 dated Jul. 30, 2015. |
Notice of Allowance for U.S. Appl. No. 14/052,201 dated Nov. 28, 2014. |
Notice of Allowance for U.S. Appl. No. 14/148,102 dated Apr. 22, 2015. |
Notice of Allowance for U.S. Appl. No. 14/148,102 dated Jul. 31, 2015. |
Notice of Allowance for U.S. Appl. No. 14/168,561 dated Nov. 28, 2014. |
Notice of Allowance for U.S. Appl. No. 14/189,500 dated Jan. 23, 2015. |
Notice of Allowance for U.S. Appl. No. 14/189,500 dated Jul. 17, 2015. |
Notice of Allowance for U.S. Appl. No. 14/189,500 dated May 14, 2015. |
Notice of Allowance for U.S. Appl. No. 29/379,636 dated Aug. 4, 2011. |
Notice of Allowance for U.S. Appl. No. 29/404,913 dated Nov. 27, 2013. |
Notice of Allowance for U.S. Appl. No. 29/407,084 dated Aug. 21, 2012. |
Notice of Allowance for U.S. Appl. No. 29/407,084 dated May 18, 2012. |
Notice of Allowance for U.S. Appl. No. 29/408,955 dated May 7, 2012. |
Notice of Allowance for U.S. Appl. No. 29/408,955 dated Oct. 4, 2012. |
Notice of Allowance for U.S. Appl. No. 29/412,166 dated Dec. 24, 2013. |
Notice of Allowance for U.S. Appl. No. 29/412,168 dated Dec. 20, 2013. |
Notice of Allowance for U.S. Appl. No. 29/417,220 dated Jan. 10, 2014. |
Notice of Allowance for U.S. Appl. No. 29/425,831 dated Sep. 4, 2014. |
Notice of Allowance for U.S. Appl. No. 29/451,177 dated Apr. 25, 2014. |
Notice of Allowance for U.S. Appl. No. 29/459,231 dated May 11, 2015. |
Notice of Allowance for U.S. Appl. No. 29/459,233 dated May 21, 2015. |
Notice of Allowance for U.S. Appl. No. 29/487,954 dated Mar. 30, 2015. |
Notice of Issuance for Chinese Application No. 201280066174.7 dated Dec. 11, 2015. |
Notice of Publication for U.S. Appl. No. 14/043,494 dated Apr. 10, 2014. |
Notice of Publication for U.S. Appl. No. 14/052,201 dated Apr. 10, 2014. |
Notice ofAllowance for U.S. Appl. No. 29/380,387 dated Sep. 18, 2012. |
Notification of Grant for Chinese Patent Application No. 2012/30099913.5 dated Aug. 7, 2012. |
Notification of Grant for Chinese Patent Application No. 2012/30099954.4 dated Aug. 17, 2012. |
Notification of Grant for Chinese Patent Application No. 2012/30099981.1 dated Aug. 17, 2012. |
Notification of Granting Patent Right for Design for Application Serial No. CN 2011/30139847.5 dated Apr. 26, 2012. |
Notification of Granting Patent Right for Design for Application Serial No. CN 2011/30166527.9 dated Apr. 6, 2012. |
Office Action/Restriction Requirement for U.S. Appl. No. 13/028,972 dated Jul. 25, 2012. |
Online definition of the term "non-linear", http://thefreedictionary.com/nonlinear, accessed on May 17, 2014. |
Restriction Requirement for U.S. Appl. No. 13/282,172 dated Nov. 26, 2013. |
Restriction Requirement for U.S. Appl. No. 13/436,247 dated Aug. 1, 2013. |
Restriction Requirement for U.S. Appl. No. 13/671,089 dated Feb. 7, 2013. |
Restriction Requirement for U.S. Appl. No. 13/793,882 dated Sep. 20, 2013. |
Restriction Requirement for U.S. Appl. No. 13/836,709 dated Jun. 19, 2014. |
Restriction Requirement for U.S. Appl. No. 13/836,940 dated Jun. 17, 2014. |
Restriction Requirement for U.S. Appl. No. 13/908,597 dated Mar. 20, 2014. |
Restriction Requirement for U.S. Appl. No. 14/043,494 dated Mar. 20, 2014. |
Restriction Requirement for U.S. Appl. No. 14/052,201 dated Mar. 20, 2014. |
Restriction Requirement for U.S. Appl. No. 14/148,102 dated Apr. 24, 2014. |
Restriction Requirement for U.S. Appl. No. 14/168,561 dated Jul. 1, 2014. |
Restriction Requirement for U.S. Appl. No. 14/679,948 dated Feb. 24, 2016. |
Restriction Requirement for U.S. Appl. No. 29/404,913 dated Feb. 15, 2013. |
Restriction Requirement for U.S. Appl. No. 29/412,166 dated Oct. 25, 2013. |
Restriction Requirement for U.S. Appl. No. 29/412,168 dated Oct. 25, 2013. |
Restriction Requirement for U.S. Appl. No. 29/417,220 dated Sep. 27, 2013. |
Restriction Requirement for U.S. Appl. No. 29/425,831 dated Sep. 30, 2013. |
Restriction Requirement for U.S. Appl. No. 29/451,177 dated Sep. 27, 2013. |
Restriction Requirement for U.S. Appl. No. 29/452,692 dated Dec. 4, 2014. |
Restriction Requirement for U.S. Appl. No. 29/459,231 dated Feb. 13, 2015. |
Restriction Requirement for U.S. Appl. No. 29/459,233 dated Feb. 23, 2015. |
Supplemental Notice of Allowability for U.S Appl. No. 14/043,494 dated May 28, 2015. |
Supplemental Notice of Allowance for U.S. Appl. No. 29/404,913 dated Feb. 20, 2014. |
Supplemental Notice of Allowance for U.S. Appl. No. 29/459,233 dated Aug. 13, 2015. |
Supplementary European Search Report for Application No. 11 84 3026 dated Apr. 28, 2015. |
Supplementary European Search Report for Application No. 12827778.7 dated Jun. 11, 2015. |
Taiwanese Notice of Allowance for Application No. 100141887 dated May 28, 2015. |
Taiwanese Notice of Allowance for Application No. 100141889 dated Dec. 8, 2014. |
Taiwanese Notice of Allowance for Application No. 101302309 dated Jun. 5, 2013. |
Taiwanese Notice of Allowance for Application No. 101307667 dated Feb. 7, 2014. |
Taiwanese Notice of Allowance for Application No. 102300058 dated Jan. 17, 2014. |
Taiwanese Notice of Allowance for Application No. 102300059 dated Jan. 17, 2014. |
Taiwanese Notice of Allowance for Application No. 102301394 dated Nov. 8, 2013. |
Taiwanese Notice of Allowance for Application No. 102301395 dated Nov. 8, 2013. |
Taiwanese Notice of Allowance for Application No. 102301581 dated Dec. 17, 2013. |
Taiwanese Notice of Allowance for Application No. 102301582 dated Jan. 13, 2014. |
Taiwanese Notice of Allowance for Application No. 102301583 dated Dec. 17, 2013. |
Taiwanese Notice of Allowance for Application No. 102301584 dated Jan. 13, 2014. |
Taiwanese Notice of Allowance for Application No. 102301585 dated Dec. 17, 2013. |
Taiwanese Office Action for Application No. 100141887 dated Sep. 11, 2014. |
Taiwanese Office Action for Application No. 100141888 dated Mar. 11, 2014. |
Taiwanese Office Action for Application No. 100141889 dated Aug. 6, 2014. |
Taiwanese Office Action for Application No. 101149281 dated Jun. 12, 2015. |
Taiwanese Office Action for Application No. 101302309 dated Jan. 23, 2013. |
Taiwanese Office Action for Application No. 102300058 dated Aug. 23, 2013. |
Taiwanese Office Action for Application No. 102300059 dated Oct. 1, 2013. |
Taiwanese Office Action for Application No. 102301394 dated Jul. 15, 2013. |
Taiwanese Office Action for Application No. 102301395 dated Jul. 15, 2013. |
Taiwanese Office Action for Application No. 102301581 dated Sep. 6, 2013. |
Taiwanese Office Action for Application No. 102301582 dated Sep. 6, 2013. |
Taiwanese Office Action for Application No. 102301583 dated Sep. 6, 2013. |
Taiwanese Office Action for Application No. 102301584 dated Sep. 6, 2013. |
Taiwanese Office Action for Application No. 102301585 dated Sep. 6, 2013. |
Taiwanese Search Report for Application No. 101302309 dated Jan. 14, 2013. |
Taiwanese Search Report for Application No. 102300058 dated Apr. 29, 2013. |
Taiwanese Search Report for Application No. 102300059 dated Apr. 17, 2013. |
Taiwanese Search Report for Application No. 102301394 dated Jul. 9, 2013. |
Taiwanese Search Report for Application No. 102301395 dated Jul. 9, 2013. |
U.S. Appl. No. 11/473,089, filed Jun. 21, 2006. |
U.S. Appl. No. 11/656,759, filed Jan. 22, 2007. |
U.S. Appl. No. 11/899,790, filed Sep. 7, 2007. |
U.S. Appl. No. 12/014,404, filed Jan. 15, 2008. |
U.S. Appl. No. 12/717,048, filed Mar. 3, 2010. |
U.S. Appl. No. 13/028,972 for "Light Emitting Devices and Methods" filed Feb. 16, 2011. |
U.S. Appl. No. 13/104,558 for "Light Emitting Devices and Methods" filed May 10, 2011. |
U.S. Appl. No. 13/224,850 for "Light Emitting Device Component" filed Sep. 2, 2011. |
U.S. Appl. No. 13/336,540 dated Dec. 23, 2011. |
U.S. Appl. No. 29/379,636 for "Light Emitting Device Package" filed Nov. 22, 2010. |
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