TW202422758A - Storage system - Google Patents

Abstract

To provide a storage system capable of broadly ensuring available floor space while densely storing products. A storage system 100 which is equipped with: a port 10 in which a first container 11 for storing a semiconductor wafer W is positioned; a transfer device 30 for transferring the semiconductor wafer W from the first container 11 positioned in the port 10 to a second container 12 which stores semiconductor wafers W more densely than does the first container 11; and a storage device 50 which is hung from the ceiling C and has a shelf 55 on which the second container 12 to which the semiconductor wafer W was transferred is placed.

Description

Storage system

The present invention relates to a storage system.

For example, in semiconductor manufacturing equipment, an article, that is, a semiconductor wafer, is stored in a first container, and an overhead transport vehicle transports the first container. Furthermore, in semiconductor manufacturing equipment, the semiconductor wafer is stored in a storage system for the convenience of the manufacturing process. This storage system is known to have a structure in which a transfer device takes out the semiconductor wafer from the transported first container, transfers the taken-out semiconductor wafer to a second container that stores the semiconductor wafer at a higher density than the first container, and stores it in the storage device (for example, refer to patent document 1). [Prior art document] [Patent document]

[Patent Document 1] International Publication No. 2021/044791

[The problem the invention is trying to solve]

In a building where semiconductor manufacturing equipment is installed, it is expected that the floor surface can be used to ensure the passage space and work space for workers, and more processing equipment can be arranged in the building. As mentioned above, even if the semiconductor wafer is transferred from the first container to the second container, if the storage device and the transfer device for storing the second container are installed on the floor surface of the building, it is not good because the storage device and the transfer device occupy the floor surface. Here, in order to reduce the occupied area of the floor surface, a structure of miniaturizing the storage device is considered. However, in this structure, since the storage quantity of the second container is reduced, the number of semiconductor wafers that can be stored is reduced, and there is a possibility that trouble will occur in the manufacturing process.

The purpose of the present invention is to provide a storage system that can store items at a high density and ensure a larger floor space. [Technical means for solving the problem]

The storage system of the present invention comprises: a through hole for placing a first container for storing articles, a transfer device for transferring articles from the first container placed in the through hole to a second container for storing articles at a higher density than the first container, and a storage device arranged in a state of being suspended from a ceiling, the storage device having a shelf for placing the second container to which the articles are transferred. [Effect of the invention]

According to the storage system of the above aspect, the articles can be stored in the second container at a high density. Furthermore, since the storage device for storing the second container is suspended from the ceiling, the storage device does not occupy the floor surface, and a larger floor surface can be secured. As a result, the passage space and work space for the workers can be secured on the floor surface, and more processing devices can be installed in the building.

Furthermore, in the storage system of the above aspect, the opening and the transfer device may be configured to be suspended from the ceiling. According to this configuration, since the opening for placing the first container and the transfer device for transferring the articles from the first container to the second container are suspended from the ceiling, the area required for setting the opening and the transfer device on the floor surface can be reduced, and a larger floor area of vacant space can be ensured. Furthermore, in the storage system of the above aspect, the height of the opening, the transfer device, and the storage device from the floor surface to the lower end thereof may be set to a specified height that the operator can pass through or the device can be set. According to this configuration, since the lower part of the opening, the transfer device, and the storage device can be used for the passage of the operator or the setting of the device, the floor surface can be effectively used.

In the storage system of the above aspect, the storage device is equipped with: a crane, a crane ceiling rail for allowing the crane to travel in a suspended state, and a loading platform for loading the second container of the transferred items by the transfer device, the crane travels on the crane ceiling rail to transport the second container, and has a transfer unit for receiving and delivering the second container to each of the shelf and the loading platform, and the shelf may be arranged along the crane ceiling rail. According to this configuration, by using the crane traveling on the crane ceiling rail, the second container can be efficiently received and delivered to each of the shelf and the loading platform. Furthermore, in the storage system of the above aspect, the shelves may be provided in a plurality of layers in the vertical direction and in a plurality of rows in the horizontal direction below and on the side of the crane roof rail. According to this configuration, since the shelves are provided in a plurality in the vertical direction and in the horizontal direction, a plurality of second containers can be stored in the storage device.

In the storage system of the above aspect, a plurality of cranes may be arranged in the crane ceiling rail. According to this configuration, the second container can be efficiently transported by using a plurality of cranes. In the storage system of the above aspect, the crane ceiling rail may include a bypass rail that surrounds the storage device when viewed from above. According to this configuration, by making the crane bypass the bypass rail, the crane can be moved back and forth in the rail, or it can be moved in a bypass, and when a plurality of cranes are used, interference between the cranes can be prevented.

Furthermore, in the storage system of the above aspect, the ceiling rail for the crane may include a lifting rail that can raise and lower the crane in a suspended state. According to this structure, by arranging the crane on the lifting rail and lowering the lifting rail, the crane can be easily repaired or replaced. Furthermore, in the storage system of the above aspect, the combination of the opening and the transfer device may be arranged in a plurality of sets along the ceiling rail for the crane. According to this structure, since the opening and the transfer device are arranged in a plurality of sets, the operation of transferring the items from the first container to the second container can be performed from a plurality of places, and the transfer operation of the items can be performed efficiently.

In the storage system of the above aspect, there are provided: an overhead transport vehicle for receiving and delivering the first container to the port, and a transport vehicle ceiling rail for allowing the overhead transport vehicle to travel in a suspended state, the transport vehicle ceiling rail having: a plurality of inner loop rails corresponding to the transport destination of the first container, and an inter-loop loop rail for connecting the inner loop rails, and the combination of the port and the transfer device may be provided corresponding to each of the plurality of inner loop rails. According to this configuration, the overhead transport vehicle can receive and deliver the first container to any of the plurality of inner loop rails.

Hereinafter, the implementation method of the present invention will be described with reference to the drawings. However, the present invention is not limited to the contents described below. Moreover, in order to illustrate the implementation method, a portion of the drawings may be enlarged or the proportions may be appropriately changed, such as to emphasize the description, and the shape, size, etc. may be different from the actual product. In the following figures, the directions in the figures are described using the XYZ coordinate system. In this XYZ coordinate system, a plane parallel to the horizontal plane is set as the XY plane. In this XY plane, the travel direction of the overhead transport vehicle 20 and the crane 52 is represented as the X direction, and the direction orthogonal to the X direction is represented as the Y direction. And the direction perpendicular to the XY plane is represented as the Z direction. For each of the X direction, the Y direction, and the Z direction, the direction indicated by the arrow in the figure is the + direction, and the direction opposite to the arrow is the - direction.

Fig. 1 is a diagram showing an example of a storage system 100 of an implementation method as viewed from the X direction. Fig. 2 is a diagram showing an example of a storage device 50 as viewed from the X direction. Fig. 3 is a diagram showing an example of a storage system 100 as viewed from the Z direction. Fig. 4 is a diagram showing an example of a ceiling rail 53 for a crane and a ceiling rail R for a transport vehicle. As shown in Figs. 1 to 4, the storage system 100 includes: a passage 10, a transfer device 30, and a storage device 50. Each of the transfer device 30 and the storage device 50 is configured to be suspended from a ceiling C of a building such as a factory by a suspension metal fitting 5.

The opening 10, the transfer device 30, and the storage device 50 have a predetermined height H from the floor surface F to the lower end thereof, which is set to be higher than the height at which workers can pass through or the device can be installed. Therefore, the lower part of the opening 10, the transfer device 30, and the storage device 50 can be used for workers to pass through or for installing the device, so that the floor surface F of the building can be effectively used. In addition, in the present embodiment, although the opening 10 and the transfer device 30 are arranged in a state of being suspended from the ceiling C, this is not limited to this form. At least one of the opening 10 and the transfer device 30 may be, for example, placed on the floor surface F.

The opening 10 is used to place the first container 11 for storing articles. The opening 10 is used to transfer the first container 11 between the overhead transport vehicle 20 or the worker and the transfer device 30. The opening 10 is provided in a state of being suspended from the ceiling C through the support portion 10a fixed to the frame 30a of the transfer device 30. In addition, the opening 10 may be suspended from the ceiling C by a suspension metal part 5 different from the transfer device 30. As shown in FIG. 3 , although two openings 10 are provided for the transfer device 30, the present invention is not limited to this form, and one or more openings 10 may be provided.

The first container 11 can accommodate a plurality of semiconductor wafers W as articles. The semiconductor wafer W is an example of an article. The first container 11 is, for example, a FOUP (Front Opening Unified Pod) or a FOSB (Front Opening Shipping Box). However, the first container 11 can be any container that can accommodate semiconductor wafers W, and is not limited to a FOUP or a FOSB.

In one first container 11, semiconductor wafers W that have been subjected to the same process or semiconductor wafers W that have not been subjected to the same process are contained in batches, but semiconductor wafers W that have been subjected to processes different from those in one first container 11 may also be contained therein. Here, the processes performed on the semiconductor wafers W include, for example, surface processing, coating processing, exposure processing, etching processing, grinding processing, etc. of the semiconductor wafers W.

FIG5 is a diagram showing an example of the structure of the first container 11. As shown in FIG5, the first container 11 includes a supporting portion 111, an opening portion 112, a cover portion 113, and a flange portion 114. The supporting portion 111 is provided in a plurality in parallel in the vertical direction so as to protrude inward from the side wall of the first container 11. The supporting portion 111 is composed of a set of supporting portions 111 facing each other, and a groove 115 is formed to support a part of the outer periphery of the semiconductor wafer W. The groove 115 is formed in a plurality so as to hold the semiconductor wafer W at fixed intervals in the vertical direction. The size of the opening 112 is set to allow the semiconductor wafer W to enter and exit from the side wall of the first container 11. The cover 113 is, for example, detachably provided at the opening 112. The flange 114 is provided at the top of the first container 11 and is held when being transported by the overhead transport vehicle 20. The first container 11 can accommodate semiconductor wafers W in each of the plurality of slots 115.

The overhead transport vehicle 20 travels along the overhead rail R for transport vehicles provided near the ceiling C. The overhead rail R for transport vehicles is configured to be suspended from the ceiling C by the hanging metal fittings 5. Furthermore, the overhead transport vehicle 20 receives and delivers the first container 11 to the port 10. The first container 11 is transported by the overhead transport vehicle 20 and placed on the port 10. Furthermore, the first container 11 placed on the port 10 is transported from the port 10 to other locations by the overhead transport vehicle 20.

FIG6 is a diagram showing an example of an overhead transport vehicle 20. The overhead transport vehicle 20 includes a traveling portion 21 and a main body 22. The traveling portion 21 includes a traveling drive portion and a plurality of driving wheels 21a (not shown) and travels along the transport vehicle roof rail R. The traveling drive portion may be, for example, an electric motor that is located in the traveling portion 21 and drives the driving wheels 21a, or a linear motor that is located on the transport vehicle roof rail R. The movement of the traveling portion 21 is controlled, for example, by a control device (not shown) provided on the main body 22. The overhead transport vehicle 20 is controlled so as to travel in one direction on the transport vehicle roof rail R.

The main body 22 is suspended from the lower part of the traveling part 21 through the mounting part 22a. The main body 22 includes: a holding part 23 for holding the first container 11, an elevating driving part 24 for lifting the holding part 23, a lateral mechanism 25 for moving the elevating driving part 24 to the side (lateral direction) of the ceiling rail R for the transport vehicle from the main body 22, and an outer cover 26. The holding part 23 holds the first container 11 by gripping and holding the flange part 114 of the first container 11 from above, thereby holding the first container 11 while being suspended. The holding part 23 is, for example, a chuck composed of a plurality of claws 23a that can move forward and backward in the horizontal direction, and the claws 23a are inserted under the flange 114 of the first container 11 and the holding part 23 is raised, thereby holding the first container 11 in a suspended state. The holding part 23 is raised and lowered in a state of being suspended from the lifting drive part 24 by a hanging member 23b such as a wire or a belt.

The lifting and lowering drive unit 24 is, for example, a crane, and lowers the holding unit 23 by ejecting the hanging member 23b, and raises the holding unit 23 by reeling in the hanging member 23b. The lifting and lowering drive unit 24 is controlled by a control device, etc., not shown, to lower or raise the holding unit 23 at a predetermined speed. Furthermore, the lifting and lowering drive unit 24 is controlled by a control device, etc., to hold the holding unit 23 at a target height.

The lateral mechanism 25 has movable plates 25a that are overlapped in the vertical direction, for example. The movable plates 25a are movable to the side of the traveling direction of the traveling portion 21 (in a direction perpendicular to the traveling direction). The lifting and lowering drive portion 24 is installed in the lowermost movable plate 25a. The main body 22 has: a guide member (not shown) that guides the lateral mechanism 25, and a driving portion (not shown) that drives the lateral mechanism 25. The lateral mechanism 25 moves the lifting and lowering drive portion 24 between the lateral position and the storage position along the guide member by the driving force of the driving portion such as an electric motor. The lateral position is a position where the retaining portion 23 protrudes laterally from the main body 22. The storage position is a position where the holding portion 23 is stored in the body 22. In addition, a rotation mechanism for rotating the lifting drive portion 24 (holding portion 23) about an axis in the vertical direction may be provided between the traverse mechanism 25 and the lifting drive portion 24.

The outer cover 26 surrounds the holding portion 23, the lifting drive portion 24, and the lateral mechanism 25, and cuts out a portion where the movable plate 25a can be lateralized by the lateral mechanism 25. The outer cover 26 is configured to surround the first container 11 held by the holding portion 23 when the lifting drive portion 24 is arranged at the storage position by the lateral mechanism 25.

The overhead transport vehicle 20 raises and lowers the first container 11 by the lifting drive 24, and can receive and deliver the first container 11 between any of the two ports 10. The overhead transport vehicle 20 places the first container 11 on the port 10 by lowering the holding portion 23 by the lifting drive 24 while the lifting drive 24 is extended upward toward the port 10 by the extension mechanism 25. Then, the first container 11 placed on the port 10 is held by the holding portion 23, and the first container 11 is received by raising the holding portion 23 by the lifting drive 24.

The transfer device 30 transfers the semiconductor wafer W from the first container 11 placed on the port 10 to the second container 12. Furthermore, the transfer device 30 transfers the semiconductor wafer W from the first container 11 placed on the port 10 by the second container 12. The second container 12 stores the semiconductor wafer W at a higher density than the first container 11. The details of the high density (higher density) will be described later. The transfer device 30 is combined with one or more ports 10. In the example shown in FIG. 3 , the combination includes: one transfer device 30 and two ports 10. However, the present invention is not limited to this form, and a form in which one transfer device 30 and one port 10 are combined into one group is also possible, and a form in which three or more transfer devices 30 and one port 10 are combined into one group is also possible. Furthermore, the combination of the port 10 and the transfer device 30 may be arranged in a plurality of sets along the transport vehicle ceiling rail R and the crane ceiling rail 53.

The transfer device 30 transports the semiconductor wafer W between the first container 11 placed on the port 10 and the second container 12 placed on the stage 51. The transfer device 30 is, for example, an EFEM (Equipment Front End Module). The transfer device 30 takes out the semiconductor wafer W contained in the first container 11 and places it in the second container 12 placed on the stage 51. Furthermore, the transfer device 30 takes out the semiconductor wafer W contained in the second container 12 and places it in the first container 11 placed on the port 10. The storage device 50 will be described in detail later.

The second container 12 stores the semiconductor wafers W transported by the transfer device 30. The second container 12 stores the semiconductor wafers W at a higher density than the first container 11. Here, the density is expressed by the weight (or number) of the semiconductor wafers W relative to the volume of the container. Therefore, in the second container 12, since the intervals between the semiconductor wafers W arranged vertically are arranged narrower than in the first container 11, the number of semiconductor wafers W per unit volume is greater than in the first container 11. That is, the second container 12 can store the semiconductor wafers W at a higher density than the first container 11. For example, in the case where the same number of semiconductor wafers W as in the first container 11 can be stored in one second container 12, the height (length in the vertical direction) of the second container 12 is lower than the height of the first container 11. FIG7 is a schematic perspective view showing an example of the structure of the second container 12. As shown in FIG7, the second container 12 includes a bottom 121, a cover 122, and a plurality of supports 123. The plurality of supports 123 are arranged to be held by the bottom 121 and the cover 122. Each support 123 supports the semiconductor wafer W so that it can be placed thereon.

FIG8 shows an example of a support body 123 constituting the second container 12, (A) is a diagram showing the first support body 123A, and (B) is a diagram showing the second support body 123B. The support body 123, as shown in FIG8, includes: a plurality of first support bodies 123A, and a plurality of second support bodies 123B. The first support body 123A and the second support body 123B are stacked alternately in the up and down direction (Z direction). The first support body 123A and the second support body 123B have the same or almost the same outer edge shape when viewed from above. In addition, viewing from above is equivalent to viewing from above (+Z direction) or below (-Z direction). The first support body 123A includes a frame body 124A and a first holding portion 125A. The first holding portion 125A is formed by extending upward from a plurality of locations (e.g., four locations) of the frame body 124A and then bending downward, and supports the semiconductor wafer W at the front end portion. Similarly, the second support body 123B includes a frame body 124B and a second holding portion 125B, and supports the semiconductor wafer W by the second holding portion 125B.

When the first supporting body 123A and the second supporting body 123B are stacked, the first holding portion 125A and the second holding portion 125B do not overlap in a plan view. Furthermore, when stacked, the first holding portion 125A of the first supporting body 123A passes through the frame 124B of the second supporting body 123B stacked on the first supporting body 123A. Similarly, when stacked, the second holding portion 125B of the second supporting body 123B passes through the frame 124A of the first supporting body 123A stacked on the second supporting body 123B.

The second container 12 is transported between the loading platform 51 and the shelf 55 of the storage device 50 by the crane 52. The second container 12 is taken out from the shelf 55 by the crane 52 and loaded on the loading platform 51. Furthermore, the second container 12 is taken out from the loading platform 51 by the crane 52 and loaded on the shelf 55. The loading platform 51 is in a state of being suspended from the ceiling C by being fixed to the frame 30a of the transfer device 30. In addition, the loading platform 51 may be in a form of being suspended from the ceiling C by a suspension metal part 5 different from the transfer device 30 or the storage device 50. As shown in FIG. 3, one loading platform 51 is provided for the transfer device 30, but it is not limited to this form, and two or more loading platforms may be provided.

The opening and closing device 54 opens and closes the second container 12, and when opened, the semiconductor wafer W can be taken in and out. The opening and closing device 54 is arranged on the +X side and the -X side of the mounting table 51. The opening and closing device 54 can take the semiconductor wafer W in and out by lifting any one of the plurality of first supporting bodies 123A or the second supporting bodies 123B of the second container 12. The opening and closing device 54 is provided corresponding to the mounting table 51, and when a plurality of mounting tables 51 are provided, it is provided on each mounting table 51. The opening and closing device 54 is arranged on the +X side and the -X side of the mounting table 51.

FIG9 is a diagram showing a state where the second container 12 is opened by the opening and closing device 54. As shown in FIG9, the opening and closing device 54 is provided with a support column 56, a first support piece 57, and a second support piece 58. The first support piece 57 and the second support piece 58 can be moved back and forth between the plurality of support bodies 123 by a driving unit (not shown), and can be moved in the vertical direction along the support column 56. In addition, the first support piece 57 and the second support piece 58 are not in contact with the semiconductor wafer W during the opening and closing operation of the second container 12.

The first supporting piece 57 can lift up, for example, the second supporting body 123B, and the second supporting piece 58 can lift up, for example, the first supporting body 123A. The first supporting piece 57 supports and lifts the second supporting body 123B on the upper side of the first supporting body 123A, which is the object of receiving and delivering the semiconductor wafer W. The second supporting piece 58 supports and lifts the first supporting body 123A, which is the object of receiving and delivering the semiconductor wafer W. The interval between the first supporting piece 57 and the second supporting piece 58 is set to form a space D for receiving and delivering the semiconductor wafer W from the first supporting body 123A by the transport unit 31. Furthermore, by lifting the first support body 123A by the second support piece 58, interference with the second support body 123B on the lower side can be avoided when receiving or delivering the semiconductor wafer W.

The transfer device 30 is provided with: a transport unit 31, and a calibrator 32. FIG. 10 is a diagram showing an example of the structure of the transport unit 31. As shown in FIG. 10, the transport unit 31 is provided with: a base 33, a lifting shaft 34, and a support unit 35. The base 33 is fixed to the bottom of the frame 30a (refer to FIG. 1) of the transfer device 30. In addition, the base 33 is configured to be able to move in the X direction along a track in the X direction provided on the frame 30a by a walking drive unit not shown in the figure. The lifting shaft 34 is provided to extend upward (in the +Z direction) from the top of the base 33, and is lifted and lowered (moved in the Z direction) by a lifting drive unit not shown in the figure. The support portion 35 is provided at the upper end of the lifting shaft 34 and is lifted and lowered together with the lifting shaft 34 .

The support portion 35 is provided with: a first arm portion 41, a second arm portion 42, and a gripper portion 43 constituting a mechanical arm (horizontal multi-joint mechanical arm). One end of the first arm portion 41 is provided on the upper surface of the support portion 35 and is rotatable by a driving portion not shown in the figure. One end of the second arm portion 42 is provided at the other end of the first arm portion 41 and is rotatable by a driving portion not shown in the figure. One end of the gripper portion 43 is provided at the other end of the second arm portion 42 and is rotatable by a driving portion not shown in the figure. The other end side of the gripper portion 43 is provided with a mechanical end, such as a suction cup that can adsorb the bottom or top of the semiconductor wafer W.

Furthermore, the gripper 43 can hold the semiconductor wafer W, and the holding form is not particularly limited. Moreover, in the present embodiment, although the support portion 35 has a set of the first arm portion 41, the second arm portion 42, and the gripper 43, it is not limited to this form. The support portion 35 may be provided with a plurality of sets of the first arm portion 41, etc. In this case, the support portion 35 may be rotatable around an axis in the vertical direction.

The dimensions of the transporting portion 31 having the first arm portion 41, the second arm portion 42, and the gripper portion 43 are formed so as to be able to take out the semiconductor wafer W from the first container 11 placed on the opening 10, and further, to be able to accommodate the semiconductor wafer W in the second container 12 placed on the mounting table 51. Therefore, the transporting portion 31 is, for example, a first support body 123A or a second support body 123B that can scoop up and take out the semiconductor wafer W from the first container 11 and place the taken-out semiconductor wafer W on the second container 12 placed on the mounting table 51. In addition, the structure of the transporting portion 31 is not limited to the above-mentioned form. The transporting portion 31 is not limited to the horizontal multi-joint mechanical arm formed by the first arm portion 41, etc., and for example, a form formed by using telescopic components, etc. is also acceptable.

The calibrator 32 is used to detect the deviation of the semiconductor wafer W transported by the transport unit 31 from the reference position. As shown in FIG3 , the calibrator 32 is disposed in the frame 30a of the transfer device 30. The calibrator 32 detects the deviation in the plane direction and the deviation in the rotation direction from the reference position by, for example, rotating the semiconductor wafer W placed by the transport unit 31 and detecting the edge of the semiconductor wafer W. The structure of the calibrator 32 is arbitrary, and any structure that can detect the deviation of the semiconductor wafer W from the reference position is applicable. Furthermore, it is arbitrary whether the transfer device 30 is equipped with the calibrator 32. The transfer device 30 may not be equipped with the calibrator 32.

As shown in FIG. 1 , the storage device 50 includes a loading table 51, a crane 52, a ceiling rail 53 for the crane, an opening and closing device 54, and a shelf 55. The storage device 50 stores the second container 12 containing the semiconductor wafer W. The second container 12 is transported from the shelf 55 to the loading table 51 by the crane 52, and is transported from the loading table 51 to the shelf 55 by the crane 52. A plurality of cranes 52 may be arranged in the ceiling rail 53 for the crane. By using a plurality of cranes 52, the second container 12 can be efficiently transported between the loading table 51 and the shelf 55.

FIG. 11 is a diagram showing an example of the structure of the crane 52. As shown in FIG. 11, the crane 52 is provided with a traveling trolley 61, two columns 62, a lifting platform 63, and a transfer unit 64. The traveling trolley 61 travels in the X direction along the crane ceiling rail 53 suspended from the ceiling C by the suspension metal parts 5 by a traveling drive unit not shown. The traveling trolley 61 is controlled to be reciprocating (movable in one direction and the opposite direction) in the crane ceiling rail 53. The two columns 62 are provided in the up-down direction with a gap between the +X side and the -Y side of the traveling trolley 61. The lifting platform 63 is disposed between the two columns 62, and is lifted and lowered along the columns 62 by a lifting drive unit (not shown). The lifting platform 63 is provided with a transfer unit 64 for transferring the second container 12.

The transfer unit 64 supports the bottom of the bottom 121 of the second container 12 using, for example, a mechanical arm. The crane 52 can move the second container 12 placed on the mounting table 51 toward the shelf 55 and can move the second container 12 placed on the shelf 55 toward the mounting table 51 by using the traveling carriage 61, the lifting platform 63, and the transfer unit 64.

As described above, the opening and closing device 54 forms a space D in the second container 12, and the semiconductor wafer W can be received and delivered by the transport unit 31. After the semiconductor wafer W is stored in the second container 12 through the space D by the transport unit 31, the opening and closing device 54 lowers the first support piece 57 and the second support piece 58, and the first support body 123A and the second support body 123B are overlapped to close the second container 12. The crane 52 scoops up the second container 12 in a closed state from the mounting table 51 to support it and transport it in this state.

The shelf 55 is used to store a plurality of second containers 12. As shown in FIG. 2 and FIG. 3 , the shelf 55 is provided in a frame 55a suspended from the ceiling C by the hanging metal fittings 5, so as to span a plurality of layers in the vertical direction and a plurality of rows in the horizontal direction. The size of the frame 55a is arbitrary, for example, it is provided to match the size of the straight portion of the ceiling rail 53 for the crane when viewed from above. Moreover, the lower end of the frame 55a is provided to be above a predetermined height H (see FIG. 1 ). Furthermore, the shelf 55 may be provided to correspond to the curved portion of the ceiling rail 53 for the crane when viewed from above. Furthermore, the shelf 55 may be provided on the +X and -X sides of the mounting platform 51 as shown in FIG. 3 .

The size of one shelf 55 is set to be able to carry one second container 12. Each shelf 55 may be provided with a gas supply mechanism (not shown) for supplying an inert gas such as nitrogen gas to the second container 12 carried thereon. The shelf 55 is arranged along the crane ceiling rail 53. Specifically, the shelf 55 is provided below and to the side of the crane ceiling rail 53 so as to span a plurality of layers in the vertical direction and a plurality of rows in the horizontal direction, as shown in FIGS. 2 and 4 . Since a plurality of shelves 55 are provided in the vertical and horizontal directions, a plurality of second containers 12 can be stored in the storage device 50. The vertical spacing of the shelves 55 is wider than the height of the second storage container 12 and narrower than the height of the first storage container 11. Unlike the present embodiment, for example, if the vertical spacing of the shelf 55 is made wider than the height of the first storage container 11 in order to store the first storage container 11 on the shelf 55, the storage device 50 will be enlarged in order to store the same number of first storage containers 11 as the second storage containers 12. That is, the storage device 50 of the present embodiment can store the semiconductor wafers W at a higher density than the first container 11 and narrow the vertical spacing of the shelf 55 as described above, thereby realizing storage of a large number of semiconductor wafers W with good space efficiency.

As shown in FIG4 , the crane roof rail 53 includes: bypass rails 53A, 53B, a connecting rail 53C, and a lifting rail 53D. The bypass rail 53B is provided inside the bypass rail 53A. The bypass rails 53A and 53B are provided to surround the roof 55 of the storage device 50 in a plan view. Furthermore, the roof 55 is also provided outside the bypass rail 53A. By having the bypass rails 53A and 53B, the crane 52 can not only reciprocate in the crane ceiling rail 53, but also bypass. When a plurality of cranes 52 are used, interference between the cranes 52 can be prevented.

The connecting rail 53C connects the bypass rail 53A and the bypass rail 53B. The crane 52 can move from the bypass rail 53A to the bypass rail 53B through the connecting rail 53C, and can move from the bypass rail 53B to the bypass rail 53A through the connecting rail 53C. In addition, the crane 52 is provided with an obstacle sensor, and if there is a stopped crane 52 in front of the traveling direction, the traveling is stopped according to the detection result of the obstacle sensor. In this way, even if a plurality of cranes 52 are operating in the crane ceiling rail 53, the cranes 52 can be prevented from interfering with each other.

The lifting rail 53D is provided to branch from a part of the bypass rail 53A. The lifting rail 53D can be raised and lowered in a state where the crane 52 is lowered. By arranging the crane 52 on the lifting rail 53D and lowering the lifting rail 53D, the crane 52 can be lowered to the vicinity of the floor surface F. Therefore, by lowering the lifting rail 53D in which the crane 52 is lowered, the crane 52 can be easily repaired or replaced. In addition, the lifting rail 53D and the part of the rail that branches from the bypass rail 53A and is connected to the lifting rail 53D can also be used as a standby rail for the crane 52. For example, when some of the plurality of cranes 52 are not in operation, unnecessary movement of the cranes 52 that are not in operation can be prevented by placing the cranes 52 on standby on the lifting rail 53D.

The combination of the passage 10 and the transfer device 30 (including the loading platform 51) is configured in multiple sets between the ceiling rail R for the transport vehicle and the ceiling rail 53 for the crane when viewed from above. Because the passage 10 and the transfer device 30 are configured in multiple sets, the operation of transferring the semiconductor wafer W from the first container 11 to the second container 12 can be performed at multiple locations, and the transfer operation of the items can be performed more efficiently. In addition, as shown in FIG. 4, a temporary storage area 60 in which the first container 11 can be temporarily placed can be provided in the ceiling rail R for the transport vehicle. The temporary storage area 60 is, for example, set to be in a state of being suspended from the ceiling C, and is set at a position where the first container 11 can be received and delivered by the overhead transport vehicle 20.

Next, the operation of the storage system 100 of the present embodiment will be described. Figures 12 to 15 are diagrams showing an example of the operation of the storage system 100. The operation of the storage system 100 is controlled by a control device not shown in the figure. The overhead transport vehicle 20 travels on the transport vehicle ceiling rail R in a state where the first container 11 is accommodated in the storage position of the main body 22. The control device instructs the overhead transport vehicle 20 in a manner to move the first container 11 toward the passage 10. The overhead transport vehicle 20 travels along the transport vehicle ceiling rail R in a state where the first container 11 is held by the holding portion 23, moves to the side of the passage 10 and stops, and protrudes the lateral mechanism 25 to arrange the first container 11 above the passage 10. Next, the lifting and lowering driving unit 24 is driven to lower the holding unit 23 and the first container 11, so that the first container 11 is transferred from the holding unit 23 to the port 10 as shown in FIG. 12 .

Next, in the transfer device 30, the transport unit 31, as shown in FIG. 13 , takes out the semiconductor wafer W contained in the first container 11, and transports the taken-out semiconductor wafer W to the calibrator 32. The calibrator 32 receives the semiconductor wafer W from the transport unit 31 and detects the position of the received semiconductor wafer W. The calibrator 32 calculates the position deviation between the detected position of the semiconductor wafer W and the pre-set reference position. The calibrator 32 sends a signal of the calculation result to the transport unit 31.

Next, the transport unit 31 transports the semiconductor wafer W after the positional deviation is corrected by taking it from the calibrator 32. Furthermore, the second container 12 is placed on the mounting table 51 by the crane 52. The opening and closing device 54 forms a space D by opening the second container 12 placed on the mounting table 51. As shown in FIG. 14 , the transport unit 31 places the semiconductor wafer W into the space D of the second container 12 and places the semiconductor wafer W on the first support 123A or the second support 123B of the second container 12. The control device (not shown) acquires the storage layer information about the storage layer of the semiconductor wafer W in the second container 12 in advance, and controls the transport unit 31 to transport the semiconductor wafer W to the designated storage layer. After the semiconductor wafer W is stored, the opening and closing device 54 closes the second container 12.

Next, the crane 52 travels on the crane ceiling rail 53 and stops at the side of the mounting table 51. Next, as shown in FIG. 15 , the crane 52 takes the second container 12 mounted on the mounting table 51 and transports it to a predetermined shelf 55. In this way, the semiconductor wafers W in the first container 11 are stored in the second container 12 and stored in the storage device 50. In addition, when the semiconductor wafers W stored in the second container 12 of the storage device 50 are transferred to the first container 11, the reverse steps are performed.

Fig. 16 is a diagram showing another example of the ceiling rail 53 for crane and the ceiling rail R for transport vehicle. As shown in Fig. 16, in the storage system 100A, the ceiling rail R for transport vehicle has a plurality of inner loop rails R1 and an inter-loop rail R2 when viewed from above. The inner loop rail R1 is provided corresponding to the transport destination of the first container 11, that is, various processing devices and the port 10. The inter-loop rail R2 connects the plurality of inner loop rails R1 to each other. The overhead travelling vehicle 20 can enter any one of the plurality of inner loop rails R1 from the inter-loop rail R2, and can enter the inter-loop rail R2 from the inner loop rail R1.

The crane ceiling rail 53 is configured to be able to bypass the area between the plurality of inner loop rails R1. A plurality of cranes 52 are arranged in the crane ceiling rail 53 (three in the example shown in FIG. 16). The combination of the through-port 10 and the transfer device 30 is arranged in the portion between the inner loop rail R1 and the crane ceiling rail 53 when viewed from above. In the example shown in FIG. 16, the portion between the inner loop rail R1 and the crane ceiling rail 53 has four locations, each of which is provided with one set of the through-port 10 and the transfer device 30. That is, although the through-port 10 and the transfer device 30 are arranged in four sets, this is not limited to this form, and three or less sets are also acceptable.

The storage device 50 is installed along the crane ceiling rail 53 on the inner and outer sides of the bypass rail, that is, the crane ceiling rail 53. According to this structure, the overhead crane 20 can deliver the first container 11 to the port 10 at any of the plurality of inner loop rails R1. The crane 52 can deliver the second container 12 at any of the plurality of platforms 51 or any of the plurality of shelves 55 by traveling on the crane ceiling rail 53.

Thus, according to the storage system 100 of the present embodiment, the semiconductor wafers W can be stored at a high density in the second container 12. Furthermore, because the storage device 50 storing the second container 12 is suspended from the ceiling C, the storage device 50 does not occupy the floor surface F, and a larger free space of the floor surface F can be ensured. As a result, the floor surface F can be provided with a passage space for workers and a work space, or a large number of processing devices can be installed.

Although the embodiments of the present invention are described above, the technical scope of the present invention is not limited to the above-mentioned embodiments. It is obvious that the industry can add various changes or improvements to the above-mentioned embodiments. Moreover, the forms with such changes or improvements are also included in the technical scope of the present invention. One or more of the requirements described in the above-mentioned embodiments may be omitted. Moreover, the requirements described in the above-mentioned embodiments may be appropriately combined. Furthermore, within the scope permitted by law, the disclosure of all the documents of Japanese Patent Application No. 2022-153343 and the above-mentioned embodiments are cited and referred to as part of the description of this article. Moreover, the execution order of each action shown in the implementation method can be implemented in any order as long as the result of the previous action is not used in the next action. Furthermore, even if the actions in the above-mentioned implementation method are described using "first", "next", "then", etc. for convenience, they do not necessarily have to be implemented in this order.

C: Ceiling H: Specified height F: Floor surface R: Ceiling rail for transport vehicle R1: Inner loop rail R2: Interloop rail W: Semiconductor wafer (article) 5: Suspended metal parts 10: Port 11: First container 12: Second container 20: Overhead transport vehicle 30: Transfer device 31: Transport unit 32: Calibrator 40: Transport device 50: Storage device 51: Loading table 52: Crane 53: Ceiling rail for crane 53A, 53B: Orbit rail 53D: Lifting rail 54: Opening and closing device 55: Shelf 64: Transfer department 100,100A: Storage system

[Fig. 1] An example of a storage system of an embodiment as viewed from the X direction. [Fig. 2] An example of a storage device as viewed from the X direction. [Fig. 3] An example of a storage system as viewed from the Z direction. [Fig. 4] An example of a ceiling rail for a crane and a ceiling rail for a transport vehicle. [Fig. 5] An example of a first container. [Fig. 6] An example of an overhead transport vehicle. [Fig. 7] An example of a second container. [Fig. 8] An example of a configuration of the second container. [Fig. 9] An example of a state in which the second container is opened. [Fig. 10] An example of a robot gripper. [Fig. 11] An example of a crane. [Figure 12] A diagram showing a state where the first container is transferred from the overhead transport vehicle to the passage. [Figure 13] A diagram showing a state where an item is transferred from the first container to the calibrator. [Figure 14] A diagram showing a state where an item is transferred from the calibrator to the second container. [Figure 15] A diagram showing a state where the second container is transferred from the loading platform to the shed by a crane. [Figure 16] A diagram showing other examples of a ceiling rail for a crane and a ceiling rail for a transport vehicle.

5: Suspended metal parts

10: Passage

10a: Support part

11: Container 1

12: Container 2

20: Elevated transport vehicle

21: Walking Department

22: Headquarters

23: Maintaining Department

24: Lifting and lowering drive unit

25: Horizontal extension mechanism

26: Outer cover

30:Transfer device

30a:Framework

31: Transportation Department

50: Storage device

51: Loading platform

52: Crane

53: Roof rails for cranes

55: Shed

61: Walking trolley

62:2 Pillars

63: Elevator platform

64:Transfer Department

100: Storage system

C: Roof

F: Floor surface

H: Specified height

R: Roof rails for transport vehicles

W: Semiconductor wafer (item)

Claims (10)

A storage system comprising: a through-hole for placing a first container for storing articles, a transfer device for transferring the articles from the first container placed in the through-hole to a second container for storing the articles at a higher density than the first container, and a storage device arranged in a state of being suspended from a ceiling, the storage device having a shelf for placing the second container to which the articles are transferred. A storage system as claimed in claim 1, wherein the aforementioned passage and the aforementioned transfer device are configured to be suspended from the aforementioned ceiling. As in the storage system of claim 2, the height of the aforementioned opening, the aforementioned transfer device, and the aforementioned storage device from the floor surface to the lower end of each is set to a specified height that can be passed by workers or the device can be set. A storage system as claimed in claim 1, wherein: the storage device comprises: a crane, and a crane ceiling rail for allowing the crane to travel in a suspended state, and a loading platform for loading the second container to which the article is transferred by the transfer device, the crane travels on the crane ceiling rail to transport the second container, and has a transfer unit for receiving and delivering the second container to each of the shelf and the loading platform, the shelf is arranged along the crane ceiling rail. A storage system as claimed in claim 4, wherein the aforementioned shed is provided with a plurality of layers in the vertical direction and a plurality of rows in the horizontal direction below and on the sides of the aforementioned crane roof rail. A storage system as claimed in claim 4, wherein: The aforementioned crane is arranged in plurality on the aforementioned crane ceiling rail. A storage system as claimed in claim 4, wherein the aforementioned crane roof rail includes a bypass rail that surrounds the aforementioned storage device when viewed from above. A storage system as claimed in claim 4, wherein the aforementioned crane ceiling rail includes a lifting rail capable of raising and lowering the aforementioned crane in a suspended state. A storage system as claimed in claim 4, wherein the combination of the aforementioned access opening and the aforementioned transfer device is arranged in a plurality of sets along the aforementioned crane ceiling rail. A storage system as claimed in claim 9, wherein the system comprises: an overhead transport vehicle for receiving and delivering the first container to the aforementioned port, and a transport vehicle ceiling rail for allowing the aforementioned overhead transport vehicle to travel in a suspended state, the aforementioned transport vehicle ceiling rail having: a plurality of internal loop rails corresponding to the transport destination of the aforementioned first container, and an inter-loop loop rail for connecting the aforementioned internal loop rails to each other, the aforementioned combination of the aforementioned port and the aforementioned transfer device is provided corresponding to each of the aforementioned plurality of internal loop rails.

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