TW202307281A - Electroplating device structure for fan-out panel grade packaging and electroplating including an electroplating tank, an electrode driving unit and at least one hanging rack - Google Patents

Abstract

Provided is an electroplating device structure for fan-out panel grade packaging and electroplating, including an electroplating tank, an electrode driving unit and at least one hanging rack, wherein the electrode driving unit includes two corresponding rotating shafts which are eccentrically provided with a plurality of turntables. Each of the turntables is disposed in a turntable seat. Each of the turntable seats is combined with a driving frame. Each turntable is driven by a driving motor to eccentrically rotate and is linked with the driving frame to form circular arc motion. The at least one hanging rack is provided with an electrode plate and is disposed on the driving frame. The electrode plate is driven by the driving frame to synchronously form a circular arc motion in the electroplating tank, by which an electroplating solution in the electroplating tank can be uniformly stirred. The stirring range is wide, the temperature of the electroplating solution is uniform, and components of the electroplating solution surrounding an electroplated object are continuously updated, so that the optimal current density and deposition velocity are maintained, the efficiency of electroplating for thickening a clad layer of the electroplated object is increased, and the uniformity of the thickness, conductivity and aesthetics of the clad layer are improved.

Description

Electroplating equipment structure for fan-out panel level packaging electroplating

The invention relates to an electroplating equipment structure for fan-out panel level packaging electroplating, which is an electroplating equipment structure that can improve the efficiency of electroplating processing when applied to electroplating processing.

At present, electroplating processing technology mainly deposits a thin layer of other metals on the surface of metal workpieces by electrolysis. Electroplating process includes pre-plating treatment (such as degreasing, derusting), plating metal layer and post-plating treatment (such as passivation, dehydrogenation) and other processes.

Electroplating is used to prevent corrosion of products, repair worn parts, increase durability, reflectivity, conductivity and aesthetics, etc. During electroplating, the object to be plated is used as the cathode, and the same metal material as the plating metal is used as the anode, which are respectively hung on the pole rod and immersed in the electrolyte containing the plating composition, and the current is passed through. In addition to being made of copper, the pole can also be made of stainless steel or titanium-clad copper. The anode is divided into insoluble anodes (such as: titanium plate, titanium mesh, platinum titanium mesh), supplemented with copper powder to add copper ions for electroplating; this kind of anode titanium plate will not disappear, but copper powder needs to be added regularly. There are also soluble anodes (such as copper balls and copper plates). During the electroplating process, the copper balls will slowly dissolve and separate copper ions in the electroplating solution.

However, during the electroplating process, more electric lines of force are usually gathered at the edge and tip of the plated object or electrode plate, that is, more cations are gathered. This phenomenon is called the tip effect or the edge effect.

Tip effect or edge effect tends to make the tip or edge of the plated product produce Thickening, burrs, or scorching of the raw plating layer. For example, the electroplating carrier of fan-out panel level package has a large size or dense pattern electroplating circuit and high aspect ratio. If electroplating is performed with the current electroplating processing technology, the tip effect or edge effect will be greater.

Furthermore, the electroplating carrier of fan-out panel-level packaging is a non-conductive panel. It uses a sputtering machine to sputter thin copper to metallize the surface layer, and then electroplate the copper layer. However, due to the large area of the electroplating carrier, the electroplating copper layer The resistance value is too high, resulting in poor electroplating processing efficiency of thickened coating, and the thickness of the coating is uneven, and the conductivity and aesthetics are not good.

At present, although some electroplating equipment tries to overcome the above-mentioned problems by moving the electroplating carrier back and forth in the electroplating tank to uniformly stir the electroplating solution, the electroplating carrier only simply moves left and right and cannot stir the electroplating solution. Stirring is performed in directions other than the middle, left, and right directions, so the electroplating solution cannot be stirred evenly and the stirring range is small, and the electroplating processing efficiency is still not good.

Yes, based on the concept of continuous improvement and innovation of products, the inventor of the present invention is based on years of professional experience in this field, as well as active research and development thinking, through countless actual design experiments, resulting in the generation of the present invention.

The purpose of the present invention is to provide an electroplating equipment structure for fan-out panel level packaging electroplating which can improve the efficiency of electroplating processing.

In order to achieve the above-mentioned purpose, the structure of the electroplating equipment for fan-out panel level packaging electroplating of the present invention includes an electroplating tank, an electrode driving unit, and at least one hanger, wherein the electroplating tank is used to accommodate the electroplating solution; the electrode driving unit The unit is adjacent to the electroplating tank. The electrode drive unit includes a fixed frame, and the fixed frame is pivotally connected with two corresponding rotating shafts. Each of the turntables is arranged in a turntable seat, and each of the turntable seats is jointly combined with a drive frame, which is arranged above the electroplating tank, and a drive motor uses a drive shaft to rotate the shaft and drive the turntable Eccentric rotation, the eccentric rotation of the turntable drives the turntable seat and the drive frame to form an arc-shaped movement; the hanger is used to set an electrode plate, and the electrode plate is used to set an object to be plated. On the driving frame, the electrode plate is placed in the electroplating tank.

Driven by the drive frame, the electrode plate moves synchronously in an arc shape in the electroplating tank, which can uniformly stir the electroplating solution in the electroplating tank with a large stirring range, so that the temperature of the electroplating solution is uniform, and the surrounding area of the plated object can be uniformly stirred. The composition of the electroplating solution is continuously updated to maintain the best current density and deposition speed, improve the efficiency of the electroplating process for thickening the coating of the plated object, and improve the uniformity, conductivity and aesthetics of the coating thickness.

The following is only a detailed description based on specific embodiments and drawings, so that your review committee can have a further understanding and understanding of the various functions and characteristics of the present invention.

10: Plating tank

11: jet pipe

12: Cooling pipe

13: overflow tank

14: Liquid supply pipe

15: Filter unit

16: Recovery tube

17:Circulation pump

18: filter

111: Nozzle

141: Flow window

20: Electrode drive unit

21: fixed frame

22: Shaft

23: turntable

24: turntable seat

25: Drive frame

26: Drive motor

27: drive shaft

251: slot

30: hanger

31: electrode plate

32: to be plated

33: Electrode shutter

301: inserting part

311: electrode plate body

312: panel

40: electrode plate placement unit

41: Groove

50: Control unit

60: Press unit

61: Pressure rod

70: Hanging device

Fig. 1 is a perspective view of the present invention.

Figure 2 is a three-dimensional exploded view of the present invention and electrode plates.

Fig. 3 is a perspective view of an example of use of the electrode plate placement unit of the present invention.

Fig. 4 is a partially cutaway perspective view of an electroplating tank of the present invention.

Fig. 5 is a perspective view of the structure of the circulation and return pipeline of the electroplating solution installed outside the electroplating bath of the present invention.

Fig. 6 is a perspective view of the use example of the hanger and the electrode plate hung on the drive frame of the electrode drive unit of the present invention.

Figure 6A is a perspective view of an example of use of the pressing unit of the present invention.

Fig. 7 to Fig. 10 are diagrams showing examples of electroplating of the object to be plated according to the present invention.

Please refer to FIG. 1 to FIG. 4 , the structure of the electroplating equipment for fan-out panel level packaging electroplating of the present invention includes an electroplating tank 10 , an electrode driving unit 20 , and at least one hanger 30 . It will be explained in detail below:

The electroplating tank 10 is used for accommodating electroplating solution.

The electrode driving unit 20 is adjacent to the electroplating tank 10, and the electrode driving unit 20 includes a fixed frame 21, the fixed frame 21 is pivotally connected with two corresponding rotating shafts 22, and the rotating shafts 22 are provided with several rotating disks 23 in an eccentric shape, Each of the turntables 23 is arranged in a turntable seat 24, and each of the turntable seats 24 is jointly combined with a drive frame 25, which is arranged above the electroplating tank 10, and a drive motor 26 drives the drive frame 27 by a drive shaft 27. The rotating shaft 22 rotates and drives the turntable 23 to rotate eccentrically, and the turntable seat 24 and the driving frame 25 form an arc-shaped movement by means of the eccentric rotation of the turntable 23 .

Wherein the two ends of the drive shaft 27 can change directions through the gear mechanism and simultaneously drive the rotating shaft 22 to rotate synchronously.

The hanger 30 is used for setting an electrode plate 31 , and the electrode plate 31 is used for setting an object to be plated 32 . The hanger 30 is hung on the driving frame 25 so that the electrode plate 31 is located in the electroplating tank 10 .

It is worth mentioning that an embodiment of the object to be plated 32 may include but not limited to a plated carrier of a fan-out panel level package.

In one embodiment, it further includes an electrode plate placing unit 40, and the upper side of the electrode plate placing unit 40 has several corresponding grooves 41, so that the hanger 30 can be hung in the grooves 41, and the electrode plate 31 can be Hanging on the hanger 30, the electrode plate placement unit 40 provides the electrode plate 31 without electroplating Temporary storage during processing.

In one embodiment, it further includes a control unit 50 for setting and adjusting various electroplating process control parameter values and control actions and functions.

Please refer to FIG. 2 , in one embodiment, the electrode plate 31 includes an electrode plate body 311 and a panel 312 that can be disassembled and replaced, so as to facilitate the installation and replacement of the object to be plated 32 .

Please refer to Figure 3, the electrode plate 31 can further be combined with an electrode shield 33, and the electroplating process of the object to be plated 32 can be enhanced by the diversion and guidance of the electrode shield 33 to the electroplating solution jet. efficiency.

Please refer to Fig. 4, in one embodiment, the electroplating tank 10 has several spray pipes 11, and the spray pipe 11 can eject the electroplating solution jet flow toward the electrode plate 31 by setting several nozzles 111, so that The plating process is performed on the object 32 of the electrode plate 31 .

In one embodiment, there is a set of cooling pipes 12 in the electroplating tank 10, and the cooling pipes 12 are defined as zigzag loops. Flowing ice water is placed in the cooling pipes 12 to control and maintain the electroplating solution in the electroplating tank 10. Appropriate temperature, avoid the temperature being too high or too low, because the temperature of the electroplating solution will affect the layering of copper during the copper plating process of the plated object. When the temperature is too high, it will affect the cracking of the electroplating solution. When the temperature is too low, the layering efficiency of copper will be affected.

In one embodiment, an overflow tank 13 is provided on one side of the electroplating tank 10, so that when the liquid level of the electroplating solution in the electroplating tank 10 is too high, it can be discharged from the through hole provided on the surface of the overflow tank 13.

Please refer to shown in Fig. 5, in one embodiment, these spray pipes 11 are communicated with a liquid supply pipe 14, and this liquid supply pipe 14 is connected with a filtration unit 15, and this electroplating tank 10 is externally connected with a recovery pipe 16, the The recovery pipe 16 communicates with a circulation pump 17, and the other end of the circulation pump 17 communicates with the filter unit 15 for The circulation pump 17 can suck the electroplating solution in the electroplating tank 10, and send the electroplating solution into the electroplating tank 10 through the filter unit 15, the liquid supply pipe 14, and the jet tubes 11 to form a circulation backflow of the electroplating solution function, and the electroplating solution is filtered by the filter unit 15 to maintain the quality.

The liquid supply pipe 14 may have several flow windows 141 for observing and sensing the flow and status of the electroplating solution, so as to control the flow of the electroplating solution.

Please refer to Figures 6 and 6A, in one embodiment, the hanger 30 is provided with an insertion portion 301 on both sides respectively, and the drive frame 25 is provided with a slot 251 corresponding to the insertion portion 301. The insertion part 301 is inserted into the slot 251, and a pressing unit 60 is arranged on the drive frame 25 and one side of the slot 251. The pressing unit 60 can be selected from a hydraulic mechanism and has a pressing rod 61 for The insertion portion 301 is strongly pressed down by the pressing rod 61 to be inserted into the slot 251 , thereby improving the stability and conductivity of the hanger 30 .

The above is the introduction of each component of the present invention and its composition, and then the use characteristics and effects of the present invention are introduced as follows:

Please refer to Figures 6 and 6A, the hanger 30 and the electrode plate 31 can be hung on the driving frame 25 of the electrode driving unit 20 by a hanging device 70 .

Please refer to Figures 7 to 10, the present invention can drive the driving frame 25 to form an arc-shaped movement through the driving motor 26 of the electrode driving unit 20, and then drive the driving frame 25 to make the electrode plate 31 in the electroplating tank 10 synchronously forms an arc-like movement, which can uniformly stir the electroplating solution in the electroplating tank 10 and has a large stirring range, so that the temperature of the electroplating solution is uniform, and the composition of the electroplating solution around the object 32 to be plated is continuously updated to maintain the best Excellent current density and deposition speed can improve the electroplating processing efficiency of the plated object 32 to thicken the coating, and improve the uniformity, conductivity and aesthetics of the coating thickness.

Please refer to shown in Figure 10, in one embodiment, the bottom of the electroplating tank 10 has a The filter 18 is used to prevent relatively large foreign matters such as screws from flowing into the circulation and return pipeline of the electroplating solution.

The above is the embodiment of this case, which is only for the convenience of explanation, and should not limit the meaning of this case, that is, all kinds of transformation designs made according to the scope of the listed patent application should be included in the scope of the patent of this case.

10: Plating tank

11: jet pipe

13: overflow tank

15: Filter unit

16: Recovery tube

20: Electrode drive unit

21: fixed frame

22: Shaft

23: turntable

24: turntable seat

25: Drive frame

26: Drive motor

27: drive shaft

30: hanger

31: electrode plate

33: Electrode shutter

301: inserting part

40: electrode plate placement unit

50: Control unit

60: Press unit

61: Pressure rod

Claims (10)

An electroplating equipment structure for fan-out panel level packaging electroplating, including: An electroplating tank for containing electroplating solution; An electrode driving unit is adjacent to the electroplating tank. The electrode driving unit includes a fixed frame, and the fixed frame is pivotally connected with two corresponding rotating shafts. The rotating shafts are provided with several rotating discs in an eccentric shape, and each of the rotating discs is arranged on a In the turntable seat, each of the turntable seats is combined with a driving frame, which is arranged above the electroplating tank, and a driving motor rotates the rotating shaft through a drive shaft and drives the eccentric rotation of the turntable, and the eccentric shape of the turntable Rotate and link the turntable seat and the driving frame to form an arc-shaped motion; and At least one hanger is used to set an electrode plate, and the electrode plate is used to set an object to be plated. The hanger is hung on the driving frame so that the electrode plate is located in the electroplating tank. The electroplating equipment structure for fan-out panel level packaging electroplating as described in claim 1, which further includes an electrode plate placement unit, and the upper side of the electrode plate placement unit has several corresponding grooves for the hanger to hang Located in the groove, the electrode plate can be hung on the hanger. The structure of electroplating equipment for fan-out panel level packaging electroplating as described in claim 1, further comprising a control unit for setting and adjusting control parameter values of electroplating processing and controlling actions and functions. The electroplating equipment structure for fan-out panel level packaging electroplating as described in claim 1, wherein the electrode plate includes an electrode plate body and a panel that can be movably assembled, disassembled and replaced. The electroplating equipment structure for fan-out panel level packaging electroplating according to claim 1, wherein the electroplating tank has several spray pipes, and the spray pipes can spray the electroplating solution jet flow towards the electrode plate by arranging several nozzles , and the electroplating process can be performed on the plated object of the electrode plate. The electroplating equipment structure for fan-out panel level packaging electroplating as described in claim 1, wherein the electroplating There is a group of cooling pipes in the tank, and the cooling pipes are defined as zigzag loops. Flowing ice water is placed in the cooling pipes to control and maintain the temperature of the electroplating solution in the electroplating tank. According to the electroplating equipment structure for fan-out panel level packaging electroplating as described in claim 1, an overflow tank is provided on one side of the electroplating tank, which can be used for the overflow tank when the liquid level of the electroplating solution in the electroplating tank is too high. The through hole set on the surface of the launder discharges. The electroplating equipment structure for fan-out panel level packaging electroplating as described in Claim 1, wherein, the spray pipes are connected to a liquid supply pipe, the liquid supply pipe is connected to a filter unit, and the electroplating tank is externally connected to a recovery pipe , the recovery pipe is connected to a circulation pump, and the other end of the circulation pump is connected to the filter unit, so that the circulation pump can suck the electroplating solution in the electroplating tank, and pass the electroplating solution through the filter unit, the liquid supply pipe, The spray pipes are sent into the electroplating tank to form the circulation and backflow of the electroplating solution, and the electroplating solution is filtered by the filter unit; and the liquid supply pipe has several flow windows. The electroplating equipment structure for fan-out panel level packaging electroplating as described in claim 1, wherein, the hanger is respectively provided with an insertion part on both sides, and the drive frame is provided with a slot corresponding to the insertion part, and The insertion part is inserted into the slot, and a pressing unit is provided on the drive frame and one side of the slot. The pressing unit can be selected from a hydraulic mechanism and has a pressing rod, which can be used to forcefully press down the The insertion part is inserted into the slot. The electroplating equipment structure for fan-out panel level packaging electroplating as described in claim 1, wherein the bottom of the electroplating tank has a filter to prevent relatively large foreign matter from flowing into the electroplating solution circulation return line.

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