CN100564606C - Apparatus for continuous electrodepositing of metallic film and method thereof - Google Patents
Apparatus for continuous electrodepositing of metallic film and method thereof Download PDFInfo
- Publication number
- CN100564606C CN100564606C CNB2005101278104A CN200510127810A CN100564606C CN 100564606 C CN100564606 C CN 100564606C CN B2005101278104 A CNB2005101278104 A CN B2005101278104A CN 200510127810 A CN200510127810 A CN 200510127810A CN 100564606 C CN100564606 C CN 100564606C
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- electroplate liquid
- metallic film
- plating tank
- band
- liquid
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Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2005101278104A CN100564606C (en) | 2005-12-06 | 2005-12-06 | Apparatus for continuous electrodepositing of metallic film and method thereof |
Applications Claiming Priority (1)
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CNB2005101278104A CN100564606C (en) | 2005-12-06 | 2005-12-06 | Apparatus for continuous electrodepositing of metallic film and method thereof |
Publications (2)
Publication Number | Publication Date |
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CN1793434A CN1793434A (en) | 2006-06-28 |
CN100564606C true CN100564606C (en) | 2009-12-02 |
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CNB2005101278104A Expired - Fee Related CN100564606C (en) | 2005-12-06 | 2005-12-06 | Apparatus for continuous electrodepositing of metallic film and method thereof |
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CN (1) | CN100564606C (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8529738B2 (en) | 2005-02-08 | 2013-09-10 | The Trustees Of Columbia University In The City Of New York | In situ plating and etching of materials covered with a surface film |
US8496799B2 (en) | 2005-02-08 | 2013-07-30 | The Trustees Of Columbia University In The City Of New York | Systems and methods for in situ annealing of electro- and electroless platings during deposition |
JP2008537782A (en) | 2005-04-08 | 2008-09-25 | ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク | Method for monitoring plating and etching baths |
WO2008070786A1 (en) | 2006-12-06 | 2008-06-12 | The Trustees Of Columbia University In The City Of New York | Microfluidic systems and methods for screening plating and etching bath compositions |
US8985050B2 (en) | 2009-11-05 | 2015-03-24 | The Trustees Of Columbia University In The City Of New York | Substrate laser oxide removal process followed by electro or immersion plating |
CN101942682A (en) * | 2010-06-28 | 2011-01-12 | 重庆长安工业(集团)有限责任公司 | Process and special equipment for plating copper on special steel piece with deep/blind hole |
CN102758241B (en) * | 2011-04-29 | 2016-04-27 | 通用电气公司 | Remove outer field device, the system and method for metal or metal composite wire rod |
CN103160908A (en) * | 2011-12-09 | 2013-06-19 | 财团法人金属工业研究发展中心 | Electrodeposition apparatus and processing machine thereof |
CN104178725A (en) * | 2014-07-31 | 2014-12-03 | 法瑞钠(济南)焊接器材有限公司 | Automatic boron coating device for welding wires |
CN104818512B (en) * | 2015-04-18 | 2017-01-25 | 北京工业大学 | Device and method for preparing magnetically soft alloy continuous films through electric deposition of soluble separated anodes |
CN104862769A (en) * | 2015-05-16 | 2015-08-26 | 中北大学 | Electroplate liquid circulating filtration system |
CN109306508B (en) * | 2018-09-30 | 2020-05-05 | 湖州金业电镀有限公司 | Electroplating unit convenient to adjust liquid level of electroplating water tank |
CN109735880A (en) * | 2019-03-04 | 2019-05-10 | 深圳市汇美新科技有限公司 | A kind of ultrathin film electrochemical deposition system |
CN111135873A (en) * | 2019-12-24 | 2020-05-12 | 郑州大学 | Device and method for continuously preparing carbon nanotube fiber composite electrolysis water hydrogen evolution catalyst |
CN110983381B (en) * | 2019-12-26 | 2021-02-09 | 有研亿金新材料有限公司 | Method for preparing superfine tungsten powder by electrolyzing ammonium tungstate solution |
CN112011809A (en) * | 2020-08-20 | 2020-12-01 | 中南大学 | Precise electroforming integrated automatic control method and system based on modularization |
CN111910228A (en) * | 2020-08-31 | 2020-11-10 | 惠州市钰芯电子材料有限公司 | Alloy film electrodeposition equipment and application thereof in preparation of Au80Sn20 eutectic solder |
CN112626581B (en) * | 2020-12-10 | 2024-03-29 | 厦门海辰新材料科技有限公司 | Electroplating device and method for plating conductive base film |
CN113445084B (en) * | 2021-07-30 | 2022-05-24 | 福建清景铜箔有限公司 | Electrolytic copper foil raw foil device |
CN113522046A (en) * | 2021-08-27 | 2021-10-22 | 东北电力大学 | Metal microfiltration membrane and preparation method and application thereof |
CN114438565B (en) * | 2022-02-21 | 2023-07-18 | 湖南昇通新材料科技有限公司 | Electromagnetic shielding fabric electric brush nickel plating production equipment and method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1053818A (en) * | 1989-09-13 | 1991-08-14 | 古尔德有限公司 | The processing method and the electrolytic solution that are used for the controlled paillon foil of printed circuit board (PCB) and its character and produce this paillon foil |
CN1189544A (en) * | 1997-01-30 | 1998-08-05 | 天津市有色金属研究所 | Method and appts. for continuously electrolytic deposition on conductive multiporous mesh belt |
CN1523137A (en) * | 2003-02-17 | 2004-08-25 | 未来金属株式会社 | Apparatus and process for manufacturing metallic fiber by electromoulding |
-
2005
- 2005-12-06 CN CNB2005101278104A patent/CN100564606C/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1053818A (en) * | 1989-09-13 | 1991-08-14 | 古尔德有限公司 | The processing method and the electrolytic solution that are used for the controlled paillon foil of printed circuit board (PCB) and its character and produce this paillon foil |
CN1189544A (en) * | 1997-01-30 | 1998-08-05 | 天津市有色金属研究所 | Method and appts. for continuously electrolytic deposition on conductive multiporous mesh belt |
CN1523137A (en) * | 2003-02-17 | 2004-08-25 | 未来金属株式会社 | Apparatus and process for manufacturing metallic fiber by electromoulding |
Also Published As
Publication number | Publication date |
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CN1793434A (en) | 2006-06-28 |
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ASS | Succession or assignment of patent right |
Owner name: ANTAI SCIENCE AND TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: IRON AND STEEL RESEARCH GEUERAL INST.; APPLICANT Effective date: 20070914 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20070914 Address after: 100081 No. 76 South College Road, Beijing, Haidian District Applicant after: Antai Science and Technology Co., Ltd. Address before: 100081 No. 76 South College Road, Beijing, Haidian District Applicant before: Central Iron & Steel Research Institute Co-applicant before: Antai Science and Technology Co., Ltd. |
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Granted publication date: 20091202 Termination date: 20171206 |
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CF01 | Termination of patent right due to non-payment of annual fee |