TW202006431A - Liquid crystal panel manufacturing method - Google Patents

Abstract

This liquid crystal panel manufacturing method according to the present invention comprises at least: a laser emission step for forming a readily etchable modified line (20) by emitting a laser beam along a line that is on a glass base material (50) for multi-chamfering and is to be cut in a shape corresponding to a liquid crystal panel; and a scribe groove formation step for forming a scribe groove on a color filter substrate (14), the scribe groove being formed along a line to be cut in a region of a terminal part. The laser emission step comprises a normal operation mode for emitting a laser beam onto a place not adjacent to an electrode terminal part, and a light collection region adjustment mode for emitting a laser beam onto a place adjacent to the electrode terminal part. In the light collection region adjustment mode, a light collection region is adjusted so that the light collection region does not reach an intermediate layer.

Description

Liquid crystal panel manufacturing method

The present invention relates to a method of manufacturing a liquid crystal panel in order to obtain a liquid crystal panel having a plurality of desired shapes from a glass base material for multiple chamfering.

In general, in the manufacture of glass panels such as liquid crystal panels and cover glasses, a process of obtaining a plurality of glass panels of a desired shape from a glass base material for multiple chamfering is performed. For example, in the manufacture of liquid crystal panels, a method of simultaneously manufacturing a plurality of liquid crystal panels with one set of glass base materials and then dividing the glass base materials into individual liquid crystal panels (so-called multiple chamfering) is widely used. Next, when dividing the glass base material, a technique of dicing and splitting, laser peeling, and etching is often used.

However, when the dicing method is used, it is difficult to form a glass panel having a rounded outline. In addition, in the laser peeling process, it is easy to cause a poor state in which the processing speed is slow or fouling due to peeling debris occurs.

Here, in the past, the technique of obtaining a plurality of glass panels by dividing a glass base material for multiple chamfering by an etching process has begun to attract attention. The etching process is used to obtain a protective glass of a desired shape. Recently, a plurality of predetermined shapes are obtained from a glass base material for multiple chamfering, which is used to perform multiple chamfering on a liquid crystal panel formed by bonding an array substrate and a color filter substrate. Of liquid crystal panels have also begun to use etching (for example, refer to Patent Document 1). [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2016-224201

[Problems to be solved by the invention]

However, in the etching process, in addition to etching in the thickness direction of the glass panel, side etching is also performed in a direction perpendicular thereto. Therefore, in the etching process, it is difficult to form the cut surface of the glass panel at a slight right angle to the main surface. For example, when the liquid crystal panel is subjected to multiple chamfering by etching, the influence of side etching in the direction perpendicular to the thickness direction of the glass base material is considered because the glass base material needs to be provided with space between the liquid crystal panels, There will be many cases where the decorner efficiency becomes worse.

An object of the present invention is to provide a method for manufacturing a liquid crystal panel, which can minimize the influence of side etching accompanying etching processing. [Means for solving the problem]

The present invention is a method for manufacturing a liquid crystal panel, which obtains a plurality of predetermined shapes from a glass base material for multiple chamfering, which is used for multiple chamfering of a liquid crystal panel formed by arranging an array substrate and a color filter substrate facing each other with a sandwiched intermediate layer LCD panel. Although a liquid crystal layer is mentioned as a representative example of the intermediate layer, the intermediate layer also includes a void region where liquid crystal is not filled.

The method for manufacturing a liquid crystal panel includes at least a laser irradiation step and a cutting groove forming step. In the laser irradiation step, the laser beam is irradiated by cutting along a predetermined line corresponding to the shape of the liquid crystal panel in the glass substrate for multiple chamfering, and the predetermined line is cut along the shape to the glass base material for multiple chamfering Modified lines with easily etched properties are formed.

In the dicing groove formation step, the color filter substrate is cut along a predetermined line along the terminal portion area for removing the electrode terminal portion of the array substrate in the color filter substrate to form a dicing groove .

The laser irradiation step includes a normal operation mode when irradiating laser light to a position not adjacent to the electrode terminal portion, and a light collection area adjustment mode when irradiating laser light to a position adjacent to the electrode terminal portion. In the light collection area adjustment mode, the light collection area is adjusted so that the light collection area does not reach the intermediate layer. In the light collection area adjustment mode, for example, an optical system such as a lens may be adjusted to shorten the light collection area or to displace the light collection area away from the intermediate layer.

By adopting the above-mentioned method, for example, because the etching liquid easily penetrates along the modified line or the etching process is easily shortened, the influence of side etching can be minimized.

Furthermore, when laser light is irradiated at a position adjacent to the electrode terminal portion, the laser light collection area cannot reach the intermediate layer, and the energy of the laser light is not transmitted to the intermediate layer. As a result, the terminal wiring pattern arranged in the electrode terminal portion is prevented from being scattered due to the dissipation of the laser energy, or a defective state due to heat is generated at another position of the electrode terminal portion.

The above-mentioned method of manufacturing a liquid crystal panel further includes: an etching step in which the modified line is etched by contacting the glass base material for multi-chamfering with the etching solution. By etching the modified line, a cutting groove can be formed along the line to cut along the shape. For the cutting groove, for example, by applying physical stress or thermal stress to divide the liquid crystal panel along a predetermined cutting line, the liquid crystal panel can be chamfered.

In particular, the laser light collection area does not reach the intermediate layer at a position adjacent to the electrode terminal portion, which suppresses the occurrence of a bad state that corrodes the terminal wiring of the electrode terminal portion due to excessive penetration of the etchant in the vicinity of the electrode terminal portion .

In addition, when a functional film that is corroded by etching is formed on the array substrate or the color filter substrate, the functional film is covered with an etching-resistant protective film or an etching-resistant layer, and then the protective film is patterned It is also possible to provide a step of exposing the opening necessary to etch the shape to cut a predetermined line or the like.

By forming openings at positions corresponding to the shape cutting lines in the etch-resistant thin film or the etch-resistant layer, the functional film can be protected (for example, a protective film such as an overcoat layer or a transparent conductive film such as ITO or an organic conductive film) And etch the modified lines in the glass base material for multiple chamfering. [Effect of invention]

According to the present invention, in the liquid crystal panel manufacturing method, the influence of side etching accompanying the etching process can be suppressed to a minimum. Furthermore, it is possible to suppress the occurrence of a defective state in which the terminal wiring pattern in the vicinity of the electrode terminal portion is scattered, or the terminal wiring in the electrode terminal portion is corroded due to the excessive penetration of the etchant.

Hereinafter, an embodiment of the method for manufacturing a liquid crystal panel of the present invention will be described using drawings. FIG. 1(A) shows a schematic configuration of a liquid crystal panel 10 according to an embodiment of the present invention. As shown in the figure, the liquid crystal panel 10 is configured such that the array substrate 12 and the color filter substrate 14 are sandwiched by sandwiching an intermediate layer such as a liquid crystal layer. The configurations of the array substrate 12 and the color filter substrate 14 can be the same as those of the known configuration, and therefore the description will be omitted here.

The array substrate 12 has an electrode terminal 122 provided so as to extend from a region bonded to the color filter substrate 14. A plurality of circuits are connected to the electrode terminal portion 122, and the liquid crystal panel 10 and other circuits are accommodated in a housing, for example, to configure a smartphone 100 as shown in FIG. 1(B).

Next, an example of a method of manufacturing the liquid crystal panel 10 will be described. As shown in FIG. 2(A) and FIG. 2(B), in general, the liquid crystal panel 10 is manufactured as a glass base material 50 for multiple chamfering that includes a plurality of them. Next, the glass base material 50 for multiple chamfering is divided to obtain a single liquid crystal panel 10.

In this embodiment, for convenience, a description will be given to a case where six liquid crystal panels 10 are arranged in a matrix of 3 rows and 2 columns, and a transparent thin film (a transparent conductive film such as an ITO film and an organic conductive film, or a transparent Protective film, etc.) 17 is processed by the glass base material 50 for multiple chamfering. However, the number of liquid crystal panels 10 included in the glass base material 50 for multiple chamfering is not limited, and can be appropriately increased or decreased.

The glass base material 50 for multiple chamfering first, as shown in FIGS. 3(A) and 3(B), cuts a predetermined line along the shape corresponding to the shape (contour) of the liquid crystal panel 10 to form the modified line 20. The modified wire 20 is, for example, a silk array formed by arranging a plurality of silk layers formed by beam pulses (beam diameter of about 1 to 5 μm) irradiated by pulse laser such as picosecond laser or femtosecond laser ( (Refer to FIG. 4(A) and FIG. 4(B)). The modified line 20, for example, as shown in FIGS. 4(A) and 4(B), has a tear line shape having a plurality of through holes or a modified layer. The modified wire 20 has a property that it is easier to etch than other positions in the glass base material 50 for multiple chamfering. Of course, the shape of the modified wire 20 is not limited to this shape, and it may be other shapes.

If the array substrate 12, the color filter substrate 14, and the transparent film 17 are processed by one laser beam at the same time, there is a possibility that the liquid crystal layer will have a bad state. Therefore, in this embodiment, the laser processing as shown in FIGS. 3(C) and 3(D) can suppress the occurrence of such a bad state. That is, as shown in FIG. 3(C), the laser beam is irradiated after the focus adjustment and intensity adjustment are performed in such a manner that the modified line 20 is formed only on the array substrate 12 from the array substrate 12 side, making it difficult for energy to be transmitted to the vicinity of the liquid crystal layer. can. In this state, if the glass base material 50 for multiple chamfering can be divided by applying a physical action or a thermal action, the laser processing ends here.

On the other hand, when it is difficult to divide the glass base material 50 for multiple chamfering in this state, as shown in FIG. 3(D), this time from the side of the color filter substrate 14 that becomes the opposite side, only the color filter The substrate 14 may be irradiated with laser light after performing focus adjustment and intensity adjustment so as to form the modified line 20. By performing the processing as shown in FIG. 3(D), although the number of laser processing steps is increased, the occurrence of a defective state in the liquid crystal layer can be suppressed, and the division of the glass base material 50 for multiple chamfering can be easily performed .

The light beam from the picosecond laser is controlled to be different in the light collecting area by its operation mode. For example, in this embodiment, the normal operation mode is used when laser light is irradiated to a position not adjacent to the electrode terminal portion 122, and the light collection area adjustment mode is used when laser light is irradiated to a position adjacent to the electrode terminal portion 122.

5(A) and 5(B) show the laser light irradiation state in the normal operation mode, and FIGS. 5(C) and 5(D) show the laser light irradiation state in the light collection area adjustment mode. The normal operation mode is an operation mode used when laser light is irradiated to a position not adjacent to the electrode terminal portion 122. On the other hand, the light collection area adjustment mode is an operation mode adopted when laser light is irradiated to a position adjacent to the electrode terminal portion 122.

In any of the normal operation mode and the light collection area adjustment mode, the focal point of the laser light is located at the central portion in the thickness direction of the processing substrate in the array substrate 12 or the color filter substrate 14 The mode within the range of the thickness of the substrate being processed is controlled. However, even when the focal point of the laser light is located in the central portion in the thickness direction of the processing substrate in the array substrate 12 or the color filter substrate 14, there is a laser light collection area that exceeds the thickness range of the processing substrate and In the case of intermediate layers or other substrates.

Therefore, as shown in FIGS. 5(C) and 5(D), in the light collection area adjustment mode, the light collection area is specifically adjusted so that the light collection area does not reach the intermediate layer. As a method of adjusting the light collection area, there is an option to move any of the optical systems such as a laser head or an objective lens away from the multi-de-angle glass base material 50, or to use an optical system to narrow the light collection area It is arranged on the optical path of laser light.

When laser light is irradiated to a position adjacent to the electrode terminal portion 122, the light collection area is specifically adjusted so that the light collection area does not reach the intermediate layer to prevent the terminal wiring pattern around the electrode terminal portion 122 from dissolving and scattering. In addition, corrosion of the terminal wiring due to the excessive penetration of the etchant during etching is also prevented.

After forming a modified line 20 in the glass base material 50 for multiple chamfering along a predetermined line, the glass base material 50 for multiple chamfering is shown in FIG. 6(A) and FIG. 6(B). An etching resistant film 16 having etching resistance is attached to the main surface of. Among them, as the etching-resistant film 16, polyethylene having a thickness of 50 to 75 μm is used. However, the configuration of the etching-resistant thin film 16 is not limited to this. For example, like polypropylene, polyvinyl chloride, olefin resin, etc., those who are resistant to the etching liquid for etching glass can be appropriately selected and used.

After the attachment of the etching-resistant film 16 is completed, as shown in FIG. 6(C), a predetermined line is cut along the shape corresponding to the shape of the liquid crystal panel 10 taken out, and the laser beam is irradiated to the etching-resistant film 16. By the irradiation of the laser beam, the etching-resistant thin film 16 is removed along the line to be cut along the shape. Next, the opening portion of the etching-resistant thin film 16 is formed along the line to be cut along the shape. As a result, as in the configuration shown in FIG. Will be exposed to the outside.

After the above laser processing is completed, as shown in FIG. 7, the glass base material 50 for multi-chamfering is introduced into the etching apparatus 300 and subjected to etching treatment with an etching solution such as hydrofluoric acid and hydrochloric acid. In the etching apparatus 300, the glass base material 50 for multiple beveling is conveyed by the conveyance roller, and the single or both sides of the glass base material 50 for beveling multiple are contacted with the etching liquid in the etching chamber The glass base material 50 is etched. In addition, in the rear stage of the etching chamber in the etching apparatus 300, since a washing chamber for washing the etching liquid adhering to the glass base material 50 for multiple beveling is provided, the glass base material 50 for multiple beveling is used to remove the etching The state of the liquid is discharged from the etching device 300.

As an example of a method of contacting the glass base material 50 for multiple chamfering with an etching solution, as shown in FIG. 8(A), there are etching chambers 302 of the etching apparatus 300, and the glass base material 50 for multiple chamfering is spray-etched. Liquid spray etching. In addition, instead of spray etching, as shown in FIG. 8(B), in the overflow type etching chamber 304, a configuration may be used in which the glass base material 50 for multiple beveling is transferred while contacting the overflowing etching liquid.

Furthermore, as shown in FIG. 8(C), immersion etching in which the single or plural multiple chamfering contained in the carrier is immersed in the glass base material 50 immersed in the etching bath 306 containing the etching solution may be used.

In either case, in the etching process, it is important that the shape cutting line penetrates in the thickness direction without dividing the glass base material 50 for multiple chamfering. Therefore, in the etching process (particularly in the second half of the etching process), it is necessary to slow down the etching rate and control the etching amount accurately. In this embodiment, although the dilute hydrofluoric acid of 2% by weight or less is used to perform the etching treatment at a slow speed of 3 μm/min or less, it is not limited to this method.

The etching rate is not slowed down in the entire etching process, and the fast etching rate is initially adopted and gradually slowed down, which can shorten the etching process time. For example, a configuration in which the concentration of hydrofluoric acid in the etching solution decreases as it enters the rear stage of the etching apparatus 300 may be adopted.

When the glass base material 50 for multiple chamfering passes through the etching apparatus 300, the modified wire 20 is etched. In the modified line 20, the etching liquid is penetrated faster than in other positions, and by dissolving the glass along the line, the color filter substrate can be easily cut by the modified line 20. In addition, even if damage or the like occurs during laser irradiation, the damage easily disappears.

After the etching process is completed, the attached etching-resistant film 16 is peeled off. Next, in the glass base material 50 for multiple chamfering, as shown in FIGS. 9(A) to 9(C), electrode terminals for forming the array substrate 12 facing the color filter substrate 14 are formed The processing of cutting the groove 30 by the terminal portion where the area of the portion 122 is removed. In this embodiment, a cutting wheel (wheel cutter) 250 is used to form a terminal portion cutting groove 30 inside a region facing the electrode terminal portion 122 of the array substrate 12 in the color filter substrate 14. The terminal portion cutting groove 30 is formed along the terminal portion by cutting a predetermined line in order to remove the area facing the electrode terminal portion 122 of the array substrate 12 in the color filter substrate 14.

After the formation of the terminal part cutting groove 30 by the dicing wheel 250 is completed, it proceeds to the division of the glass base material 50 for multiple chamfering and the removal of the region facing the electrode terminal part 122. In the glass base material 50 for multiple chamfering, a modified wire 20 is formed by laser wire processing, and by etching this modified line again, the glass base material for multiple chamfering can be removed with only a slight mechanical pressure 50 is divided in the modification line 20. For example, by applying a small pressing force or tensile force to the glass base material 50 for multiple chamfering, or by providing a small amount of ultrasonic vibration, as shown in FIG. 10, the glass base material 50 for multiple chamfering can be divided without being damaged .

Since the etching process is not intentionally completely cut off, the occurrence of a bad state in which the end faces of the liquid crystal panel 10 separated during the etching conflict with each other is prevented. Moreover, the glass base material 50 for multiple chamfering which maintains the state which was not completely cut after the etching process (maintaining a large state) can also be transported. Furthermore, since the etching solution does not reach the electrode terminal portion, it is not necessary to protect the electrode terminal portion with a masking agent having etching resistance. In addition, since at least the center portion of the end surface of the liquid crystal panel 10 is subjected to etching treatment, the strength (for example, bending strength) of the liquid crystal panel becomes higher as compared with the case of cutting by laser processing alone.

11(A) to 11(C) show the schematic configuration of the divided liquid crystal panel 10. As shown in the figure, the end face of the liquid crystal panel 10 is approximately at a right angle to the main face. For example, the cone widths (L1 to L4 in FIG. 11(C)) generated at the respective end surfaces of the array substrate 12 and the color filter substrate 14 having plate thicknesses of about 0.15 mm to 0.25 mm can be suppressed to 50 μm or less ( Mostly 20 ~ 35μm).

Therefore, when the liquid crystal panel 10 is manufactured, since the influence of the side etching hardly occurs, it is possible to design the glass base material 50 for multiple chamfering in which the liquid crystal panels 10 are arranged close to each other. For example, if there is a gap of approximately 10 μm in total with a laser width of 2 μm+α, the glass base material 50 for multiple chamfering can be properly separated into individual liquid crystal panels 10.

The description of the above embodiment is exemplified in all points, and is not a limitation. The scope of the present invention is indicated not by the above-mentioned embodiments but by the scope of patent application. In addition, the scope of the present invention includes all modifications within the meaning and scope equivalent to the scope of the patent application.

10‧‧‧LCD panel 12‧‧‧Array substrate 14‧‧‧Color filter substrate 16‧‧‧Etching film 17‧‧‧Transparent film 20‧‧‧Modification line 30‧‧‧Terminal part cut groove 50‧‧‧Multi-angle glass base material 100‧‧‧Smartphone 122‧‧‧electrode terminal 250‧‧‧Cutting wheel 300‧‧‧Etching device 302, 304‧‧‧Etching chamber 306‧‧‧Etching tank

[Fig. 1] A diagram showing a schematic configuration of a liquid crystal panel according to an embodiment of the present invention. [Fig. 2] A diagram showing a schematic configuration of a glass base material for multiple chamfering including a plurality of liquid crystal panels. [Fig. 3] A diagram showing a process included in an embodiment of a method of manufacturing a liquid crystal panel. [Fig. 4] A diagram showing a process included in an embodiment of a glass panel manufacturing method. [Fig. 5] An explanatory diagram of a normal operation mode and a light collecting area adjustment mode at the time of laser irradiation. [Fig. 6] A diagram showing processes included in an embodiment of a method of manufacturing a liquid crystal panel. [Fig. 7] A diagram showing an example of an etching apparatus to which the present invention is applied. [Fig. 8] A diagram showing changes in the etching process to which the present invention is applied. [Fig. 9] A diagram showing an outline of the dicing method of the glass base material for multiple chamfering. [Fig. 10] A schematic diagram showing a glass base material for multiple chamfering in a divided state. [Fig. 11] A diagram showing the characteristics of the configuration of a liquid crystal panel.

12‧‧‧Array substrate

14‧‧‧Color filter substrate

17‧‧‧Transparent film

20‧‧‧Modification line

50‧‧‧Multi-angle glass base material

Claims (2)

A method for manufacturing a liquid crystal panel, which obtains a liquid crystal panel with a plurality of predetermined shapes from a glass base material for multiple chamfering, which is used to multi-de-angle a liquid crystal panel formed by arranging an array substrate and a color filter substrate opposite to a sandwiched intermediate layer , At least contains: The laser beam is irradiated by irradiating laser light along a shape cutting line corresponding to the shape of the liquid crystal panel in the glass base material for multiple chamfering, and the line cutting predetermined line along the shape is formed on the glass base material for multiple chamfering. Steps of laser irradiation of the modified line of the nature; For the aforementioned color filter substrate, a cutting groove forming step of cutting a predetermined line along the terminal portion area for removing the electrode terminal portion area of the array substrate in the color filter substrate to form a cutting groove; The laser irradiation step includes: a normal operation mode when irradiating laser light to a position not adjacent to the electrode terminal portion, and a light collection area adjustment mode when irradiating laser light to a position adjacent to the electrode terminal portion; In the aforementioned light collecting area adjustment mode, the light collecting area is adjusted so that the light collecting area does not reach the aforementioned intermediate layer. The method for manufacturing a liquid crystal panel according to claim 1 further includes an etching step of etching the modified line by contacting the glass base material for multiple chamfering with an etching solution.

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