TW201832895A - Resin sealing device, resin molding method, and manufacturing method of resin molded article capable of suppressing molding defect conditions such as wire sweep, resin leakage, and unfilling, and performing pressure reduction inside the molding mold set - Google Patents

Abstract

This invention relates to a resin sealing device, a resin molding method, and a manufacturing method of a resin molded article. This invention suppresses molding defect conditions such as wire sweep, resin leakage, and unfilling, and can perform pressure reduction inside the molding mold set. The resin sealing device is provided with a molding mold set (1), a vacuum degree control unit (8), a pressure reduction unit (3), and a vacuum gauge (2). The vacuum degree control unit (8) is provided with a vacuum degree control valve (6), switching valves (4, 5), and a vacuum degree control part (9). A first gas flow path (30a) between the molding mold sets (1) and the switching valves (4, 5), which makes the molding mold sets (1) and the pressure reduction unit (3) connected through the switching valves (4, 5), is connected with a second gas flow path (33a) which is connected with the vacuum degree control valve (6).

Description

Resin sealing device, resin molding method, and manufacturing method of resin molded product

The present invention relates to a resin sealing device, a resin molding method, and a method for manufacturing a resin molded product.

Japanese Patent Laid-Open No. 2008-143186 (Patent Document 1) describes a resin sealing device that is a resin sealing device that inserts resin into a cavity formed between molds facing each other to perform sealing / molding. It is provided with a pressure adjustment mechanism in the closed space including the final cavity space, and the pressure adjustment mechanism can reduce / adjust the pressure in the closed space via an air flow path that can be connected from outside the closed space.

However, in the resin sealing device described in Patent Document 1, when the pressure in the closed space is reduced through the pressure adjustment mechanism, the resin is excessively foamed, and the foamed resin is contacted and mounted on the substrate. Wire sweep caused by a lead. In addition, there may be a case where the foamed resin is conducted in the substrate and resin leakage occurs from the frame.

On the other hand, when the pressure in the closed space is high, voids, defects, and the like may not be filled in the sealing resin.

According to the embodiments disclosed herein, a resin sealing device may be provided, which includes: a forming module; a vacuum degree control unit for controlling the vacuum degree inside the forming module; and a pressure reducing unit for controlling the forming module And a vacuum gauge for measuring the degree of vacuum inside the forming module; the control unit for the degree of vacuum includes a degree controlling valve for adjusting the amount of gas discharged from the inside of the forming module; The degree of vacuum of the vacuum degree control valve is adjusted by adjusting a switching valve that depends on the amount of gas discharged inside the forming module of the decompression unit and corresponding to the degree of vacuum inside the forming module measured by a vacuum gauge. And a second gas flow path connected to the vacuum degree control valve between the forming module and the switching valve of the first gas flow path connecting the forming module and the pressure reducing unit via the switching valve.

According to the embodiment disclosed herein, a resin molding method can be provided, which includes supplying a plate-shaped member on which an electronic component is mounted into a molding module, and a mold of a second mold facing the mold surface of the first mold. Step on the surface; step of supplying the resin material into the cavity of the first mold; step of heating the resin material; step of bringing the first mold close to the second mold; decompressing the inside of the molding module A step of mold clamping the first mold and the second mold; and a hardened resin obtained by hardening the heated resin material after the step of clamping the first mold and the second mold, A step of resin sealing the electronic parts; and a step of reducing the pressure includes adjusting a discharge valve to adjust a discharge amount of a gas discharged through a first gas flow path connecting the molding module and the decompression unit through the change valve, And a step of adjusting a discharge amount of the gas discharged from the first gas flow path between the molding module and the switching valve through the second gas flow path connected to the vacuum control valve through the vacuum degree control valve. .

According to the embodiment disclosed herein, there can be provided a method for manufacturing a resin molded product, which is capable of manufacturing a resin molded product through the resin molding method.

According to the embodiments disclosed herein, it is possible to provide a resin sealing device capable of suppressing molding defects such as lead bending, resin leakage, and non-filling, and capable of reducing the pressure inside a molding module, a resin molding method, and a method for manufacturing a resin molded product. .

The and other objects, features, aspects, and advantages of the present invention will become clear from the following detailed description of the present invention understood in association with the accompanying drawings.

Hereinafter, embodiments will be described. It should be noted that in the drawings for explaining the embodiments, the same reference symbols indicate the same or corresponding portions.

[Embodiment 1] Fig. 1 shows a schematic configuration diagram of a resin sealing device according to Embodiment 1. The resin sealing device of the first embodiment includes a plurality of forming modules 1, a decompression unit 3 for decompressing the inside of the forming module 1, and a vacuum for controlling the degree of vacuum in the inside of the forming module 1. Degree of control unit 8.

The molding module 1 includes a lower mold 25, an upper mold 26 facing the lower mold 25, an upper fixing plate 27 for fixing the upper mold 26, a movable plate 24 for fixing the lower mold 25, and a movable plate 24 for moving the movable plate 24. The mold clamping mechanism 23, a lower fixed disk 21 that fixes the mold clamping mechanism 23, and a post 29 provided between the upper fixed disk 27 and the lower fixed disk 21.

The movable unit 22 is configured by the lower fixed plate 21, the mold clamping mechanism 23, and the movable plate 24. The mold clamping mechanism 23 allows the movable platen 24 to move freely in the vertical direction along the direction in which the column 29 extends from the lower platen 21 to the upper platen 27. Accordingly, the movable unit 22 moves the lower mold 25 relative to the upper mold 26 (movement of the direction in which the lower mold 25 is relatively close to the upper mold 26 and the direction in which the lower mold 25 is relatively far away from the upper mold 26. Mobile) becomes possible. In addition, instead of the column 29, a wall-shaped block may be used to connect the upper fixing plate 27 (side surface) and the lower fixing plate 21 (side surface).

The resin sealing device further includes a vacuum gauge 2 for measuring the degree of vacuum inside the molding module 1, and an on / off switching valve 5 for adjusting the amount of gas to be discharged and discharged inside the molding module 1. The on / off switching valve 5 is connected to one end of a gas flow path 28 a inside a pipe 28 that can pass through the upper fixed plate 27 and communicate with the inside of the molding module 1. The other end of the gas flow path 28 a inside the piping 28 is connected to the gas flow path 30 a inside the piping 30 via the on / off switching valve 5. The vacuum gauge 2 and the gas flow path 28 a inside the pipe 28 between the on / off switching valve 5 and the upper fixed plate 27 are connected.

The decompression unit 3 is connected to one end of a gas flow path 31 a inside the piping 31, and the other end of the gas flow path 31 a is connected to a gas flow path 30 a inside the piping 30 via a flow rate large / small switching valve 4. The decompression unit 3 allows the gas inside the molding module 1 to pass through the upper fixed plate 27, the gas flow path 28a, the on / off switching valve 5, the gas flow path 30a, the flow rate large / small switching valve 4, and the gas flow path 31a. Then, the pressure is discharged, thereby reducing the pressure inside the forming module 1. The flow rate large / small switching valve 4 can adjust a gas discharge amount when the pressure in the forming module 1 is reduced through the decompression unit 3. As the decompression unit 3, for example, a vacuum pump can be used. Furthermore, when the resin sealing device has only one molding module 1, the on / off switching valve 5 may not be used.

The vacuum degree control unit 8 includes a flow rate large / small switching valve 4, a vacuum degree control valve (proportional solenoid valve) 6, a controller (proportional solenoid valve controller) 7, a vacuum degree control unit 9, and a sensor signal. Switching unit (switching unit for vacuum gauge) 15.

The vacuum degree control valve 6 is connected to the gas flow path 30 a inside the piping 30 between the flow rate large / small switching valve 4 and the open / close switching valve 5 via the gas flow path 33 a of the piping 33. In addition, the other end of the gas flow path 32 a is connected to the vacuum degree control valve 6 so that a gas such as air can be introduced from one end of the gas flow path 32 a inside the pipe 32. The gas introduced from one end of the gas flow path 32a can pass through the gas flow path 32a, the vacuum degree control valve 6, the gas flow path 33a, the gas flow path 30a, the on / off switching valve 5, the gas flow path 28a, and the upper fixed plate 27 and introduced into the molding module 1.

In the resin sealing device of the first embodiment, the degree of vacuum inside the molding module 1 is measured by the vacuum gauge 2, and a signal 13 indicating a current measurement value of the degree of vacuum in the molding module 1 is switched via a sensor signal. The unit 15 is often sent to the control unit 9 for the degree of vacuum. When there are a plurality of vacuum gauges 2 as described later, for example, the sensor signal switching unit 15 can switch the vacuum gauges 2 by receiving a switching signal 14 from the vacuum degree control unit 9.

The control unit 9 for the degree of vacuum transmits a signal 13 for the flow rate large / small switching valve 4 to be discharged from the gas flow path 30a through the gas flow path 31a based on the received signal 13 indicating the current measurement value of the vacuum degree. The gas flow is switched to a large or small signal 10. Thereby, the flow rate large / small switching valve 4 is roughly adjusted so that the discharge amount of the gas discharged from the gas flow path 30a to the gas flow path 31a becomes large or small.

The control unit 9 for the degree of vacuum sends a signal 11 indicating a target value of the degree of vacuum inside the molding module 1 to the controller 7. On the other hand, based on the received signal 13 indicating the measured value of the current degree of vacuum A signal 12 indicating the measured value of the current degree of vacuum is often sent to the controller 7. The controller 7 adjusts the vacuum degree control valve 6 according to the difference between the target value of the degree of vacuum inside the forming module 1 and the measured value of the degree of vacuum inside the current forming module 1 and finely adjusts from The amount of gas introduced into the gas flow path 33a by the gas flow path 32a.

As described above, in the resin sealing device of the first embodiment, the rough adjustment of the gas discharge amount using the flow rate large / small switching valve 4 and the fine adjustment of the gas introduction amount using the vacuum control valve 6 are combined. It is possible to reduce the amount of overshoot of the decompression with respect to the target value of the pressure at the start of decompression inside the forming module 1. The switching timing of the flow rate large / small switching valve 4 may correspond to, for example, the amount of reduced pressure overshoot to the target value of the internal pressure of the forming module 1 and the time to reach the target value of the internal pressure of the forming module 1 ( Speed).

FIG. 2 shows the pressure (vacuum degree) inside the molding module 1 with respect to the elapsed time [second] from the start of the pressure reduction when the pressure inside the molding module 1 is reduced using the resin sealing device of the reference example. [Torr] An example of the change. Here, the resin sealing device of the reference example does not use the vacuum degree control valve 6 to finely adjust the gas introduction amount, and uses the flow rate large / small switching valve 4 to set the gas discharge amount only to a large flow rate, and transmits through The resin sealing device of the first embodiment reduces the pressure inside the molding module 1 under the same conditions and the same method. In addition, a change in the pressure inside the molding module 1 of the reference example is expressed by comparison with a target value of the pressure inside the molding module 1.

As shown in FIG. 2, in the case of the reference example, the gas discharge amount may increase, and the pressure inside the molding module 1 may suddenly drop (atmosphere introduction may not catch up). At this time, when a target value near the atmospheric pressure side is set, the pressure inside the molding module 1 may overshoot and may not be controlled. In other words, a range in which the pump capacity (gas discharge amount) and the amount that can be introduced into the atmosphere cannot be controlled simultaneously is formed. This means that if the pressure inside the molding module 1 does not become a predetermined pressure or less, it cannot be controlled.

When the gas discharge volume is set to a small flow rate through the flow rate large / small switching valve, the gas discharge volume is small, so even when a target value close to the atmospheric pressure side is set, the pressure inside the molding module 1 can be controlled . However, since the gas discharge amount is small, when a target value close to the vacuum side is set, the time to reach this target value may be late.

Therefore, by switching the high and low flow rates of the gas discharge volume through the high / small flow switching valve 4, the internal pressure of the forming module 1 can be controlled even if the target value is near the atmospheric pressure side, and even if It is a target value close to the vacuum side, and a time delay of the target value of the pressure reaching the inside of the forming module 1 can be suppressed. For example, the flow rate of the flow rate large / small switching valve 4 may be made small until it reaches a predetermined pressure, and when the flow rate becomes smaller than a predetermined pressure, the flow rate large / small switching valve 4 may be switched to use a large flow. The switching timing and the like of the flow rate large / small switching valve 4 can also be determined in advance through experiments and the like. In order to suppress the foaming of the resin even when the gas discharge volume is set to a small flow rate through the flow rate switching valve 4, in order to suppress the foaming of the resin, the vacuum control valve 6 can be adjusted to increase the introduction when the speed of pressure reduction is large. The amount of gas introduced into the gas flow path 30a suppresses the speed of pressure reduction. In addition, when the gas discharge volume is set to be small through the flow rate switching valve 4, in order to suppress foaming of the resin, the flow rate switching valve 4 can be switched when the decompression speed is too small. The flow rate is large, and the vacuum degree control valve 6 is adjusted to increase the amount of gas introduced into the gas flow path 30a to the extent that the foaming of the resin can be suppressed to suppress the speed of decompression. In addition, it is also possible to adjust the vacuum control valve 6 only in the state where the gas discharge volume is maintained to be large through the flow rate large / small switching valve 4 from the start of the decompression to the end of the decompression, so as to suppress the development of the resin. The degree of the bubble gradually changes the amount of gas introduced into the gas flow path 30a from large to small.

In addition, as shown in FIG. 3, in the resin sealing device according to the first embodiment, since the amount of decompression overshoot can be reduced, each target value of the vacuum degree (750 Torr, 600 Torr, 450 Torr, 300 Torr, and 150 Torr) for easy stepwise decompression. On the other hand, in the resin sealing device of the reference example in which the amount of overshoot of the decompression is large, it is difficult to perform stepwise decompression at each target value of the degree of vacuum like the resin sealing device of the first embodiment.

An example of the resin sealing method according to the first embodiment using the resin sealing device according to the first embodiment will be described below with reference to the schematic cross-sectional views of FIGS. 4 to 13. First, as shown in FIG. 4, the die surface of the upper die 26 fixed to the upper fixed plate 27 and the die surface of the lower die 25 fixed to the movable plate 24 are provided to face each other. Furthermore, a gas flow path 41 is provided inside the upper fixing plate 27 to connect the inside of the molding module 1 with the gas flow path 28 a of the piping 28 shown in FIG. 1.

On the edges of the upper fixed plate 27 and the movable plate 24, an upper mold outer gas barrier member 43a and a lower mold outer gas barrier member 43b are arranged via O-rings 42. It is configured such that an O-ring 42 is also arranged between the upper die outer air blocking member 43a on the upper fixed plate 27 side and the lower die outer air blocking member 43b on the movable plate 24 side.

The lower mold 25 includes a bottom member 46, a side member 44 surrounding the periphery of the bottom member 46, and an elastic member 47 disposed between the side member 44 and the movable plate 24. The lower mold 25 has a cavity 45 in a space surrounded by the side members 44 above the bottom member 46. The cavity 45 is used to hold a resin material.

Next, as shown in FIG. 5, a substrate 55 as a plate-shaped member on which electronic components 54 electrically connected through a lead 53 are mounted is supplied to the mold surface of the upper mold 26 to be held, and a resin material 52 (in Embodiment 1) is held. Resin (granular resin) is supplied to the cavity 45 of the lower mold 25 through the release film 51 and held.

Examples of the plate-shaped member include a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor wafer, and a lead frame.

The resin material 52 is not particularly limited, and may be, for example, a thermosetting resin such as epoxy resin or silicone resin, or a thermoplastic resin. Moreover, it may be a composite material including a thermosetting resin or a thermoplastic resin in part. Examples of the form of the resin supplied to the resin sealing device of Embodiment 1 include granular resin, liquid resin, sheet resin, tablet resin, and powder resin.

Next, as shown in FIG. 6, the resin material 52 is heated and melted, thereby producing a molten resin (flowable resin) 61.

Then, as shown in FIG. 7, the movable platen 24 is moved upward, and the lower mold 25 and the upper mold 26 are brought closer to each other. Accordingly, the upper mold external air blocking member 43a on the upper fixed disk 27 side and the lower mold external air blocking member 43b on the movable disk 24 side are closely contacted via the O-ring 42 therebetween, thereby blocking external air.

Then, as shown in FIG. 8, the gas inside the forming module 1 is exhausted through the gas flow path 41, and the inside of the forming module 1 is decompressed. At this time, the molten resin 61 is foamed to become the foamed resin 71. As reasons for the foaming of the molten resin 61 during decompression inside the molding module 1, (i) the gas involved when the resin material 52 is melted, (ii) the moisture contained in the molten resin 61, and ( iii) Volatile components and the like contained in the molten resin 61.

Here, in the resin sealing device according to the first embodiment, rough adjustment of the gas discharge amount using the flow rate large / small switching valve 4 and fine adjustment of the gas introduction amount using the vacuum control valve 6 are performed. In combination, the inside of the molding module 1 can be slowly decompressed. This can reduce the overshoot amount of the decompression at the start of the decompression of the inside of the molding module 1 compared to the previous (reference example). Therefore, as shown in FIG. 9, for example, rapid expansion of the foamed resin 71 can be suppressed. Therefore, it is possible to reduce occurrence of defects such as lead bending and resin leakage caused by excessive foaming of the molten resin 61.

In addition, in the resin sealing device of the first embodiment, since the pressure inside the molding module 1 can be sufficiently reduced, it is also possible to suppress the occurrence of voids and defects in the hardened resin 62 that seals the electronic component 54 through the steps described later. Etc. not filled.

In addition, as shown in FIG. 3, for example, the pressure inside the molding module 1 using the resin sealing device of the first embodiment may be gradually reduced to gradually reduce the pressure inside the molding module 1 and reach the final vacuum. Target value of degree. Even in this case, rapid expansion of the foamed resin 71 can be suppressed.

In addition, the decompression of the inside of the molding module 1 by the resin sealing device of the first embodiment may increase the degree of vacuum at the initial stage of the pressure reduction (lower the pressure inside the molding module 1), and then temporarily After the degree of vacuum is reduced (the pressure inside the molding module 1 is increased), the degree of vacuum is increased again. With this operation, the molten resin 61 can be foamed in the initial stage of decompression, and then the foam of the foamed resin 71 can be pulverized with a low degree of vacuum, and the pressure inside the molding module 1 can be reduced to the target value again. .

In addition, as shown in FIG. 10, the movable platen 24 is moved further upward to bring the lower mold 25 and the upper mold 26 closer to each other, and the side member 44 is pressed against the substrate 55 through the release film 51, thereby further suppressing the The resin leaks out when the degree of vacuum inside the molding module 1 becomes high. Furthermore, even in this state, the inside of the mold cavity can be decompressed by providing a vent hole in the upper surface of the side member 44.

Then, as shown in FIG. 11, the lower mold 25 and the upper mold 26 are clamped. The clamping of the lower mold 25 and the upper mold 26 is performed, for example, by moving the movable disk 24 further upward until the electronic component 54 on the substrate 55 is immersed in the molten resin 61. Here, after the electronic component 54 is immersed in the molten resin 61 for a predetermined time, the on / off switching valve 5 may be closed to maintain the pressure inside the molding module 1.

Then, the molten resin 61 is hardened in a state where the electronic component 54 on the substrate 55 is immersed in the molten resin 61. Thereby, as shown in FIG. 12, the electronic component 54 on the substrate 55 is resin-sealed through the hardened resin 62 to produce a resin molded product. In the first embodiment, the resin molded product includes a substrate 55 and an electronic component 54 that is resin-sealed through the substrate 55 through the cured resin 62.

Next, as shown in FIG. 13, the movable platen 24 is moved downward to separate the lower mold 25 from the upper mold 26, thereby separating the release film 51 from the hardened resin 62. Thereafter, the resin-molded product is removed from the upper mold 26, whereby a resin-molded product can be obtained.

The resin sealing method according to the first embodiment is not particularly limited to the above method, and may include, for example, steps other than the step of compressing the resin material by a compression molding method (compression molding step). The other steps are not particularly limited. For example, the cutting step may be a cutting step of cutting the intermediate product produced by the compression molding step to separate the compression-molded product from the finished product. More specifically, for example, an intermediate product obtained by compression-molding (resin sealing) a plurality of wafers arranged on one substrate by compression molding may be manufactured, and the intermediate product may be cut by the cutting step. The resin is separated into individual wafers to obtain a resin-sealed compression-molded product (finished product). In addition, the resin sealing method according to the first embodiment can be used for a method other than a compression molding method such as a transfer molding method.

In the first embodiment, the case where the resin sealing device is provided with one vacuum gauge 2 has been described. For example, as shown in FIG. 14, the resin sealing device may include a vacuum gauge 2 a near atmospheric pressure and a vacuum gauge for high vacuum. The two vacuum gauges 2b serve as the vacuum gauge 2. In this case, the pressure inside the forming module 1 can be measured more accurately in accordance with the situation. The vacuum gauge 2a near the atmospheric pressure is connected to the gas flow path 82a of the pipe 82 connected to the gas flow path 28a of the pipe 28 between the on / off switching valve 5 and the upper fixed plate 27. A high-vacuum gauge 2b is connected to a gas flow path 81a of a pipe 81 connected to a gas flow path 28a of a pipe 28 between the on / off switching valve 5 and the upper fixed plate 27. Examples of the vacuum gauge near the atmospheric pressure include a diaphragm vacuum gauge, and examples of the vacuum gauge for high vacuum include a pirani vacuum gauge.

In the first embodiment, as the control unit 9 for the degree of vacuum, for example, a programmable logic controller (PLC), a microcomputer, or a personal computer can be used.

In the first embodiment, a case where a proportional solenoid valve is used as the vacuum degree control valve 6 has been described. However, as the vacuum degree control valve 6, an electro-pneumatic regulator may be used instead of the proportional solenoid valve. . The controller 7 is not particularly limited as long as the controller 7 can control the vacuum degree control valve 6 based on the signal 12 indicating the current vacuum degree measurement value received from the vacuum degree control unit 9.

In the first embodiment, the case where the pressure (vacuity) inside the plurality of forming modules 1 is controlled through one vacuum control unit 8 and one decompression unit 3 has been described, but the number of forming modules 1 There is no limitation, and one molding module 1 may be used. The forming module 1 can be increased or decreased. Furthermore, when controlling the internal pressure of a plurality of forming modules 1, for example, the inside of one forming module 1 may be decompressed for about 30 seconds and then the pressure may be maintained (the opening / closing of the decompressed forming module 1 may be opened / closed). The switching valve 5 becomes “closed”), and then the inside of the other forming module 1 is decompressed (the opening / closing switching valve 5 of the other forming module 1 becomes “open”). That is, it is possible to control only the time required to control the pressure (degree of vacuum) inside the one molding module 1 and then immediately control the pressure (degree of vacuum) inside the other molding module 1. Therefore, it is possible to efficiently control the pressure (degree of vacuum) inside the plurality of forming modules 1 through the control unit 8 and the decompression unit 3 of the degree of vacuum.

[Embodiment 2] FIG. 15 shows a schematic configuration diagram of a resin sealing device according to Embodiment 2. The resin sealing device of the second embodiment is characterized in that the other end of the gas flow path 32 a inside the pipe 32 connected to the vacuum control valve 6 and the gas flow path 31 a of the pipe 31 connected to the pressure reduction unit 3 Is connected, and an on / off switching valve 5 is used instead of the flow rate large / small switching valve 4.

In the resin sealing device of the second embodiment, the vacuum degree control unit 9 determines whether to discharge from the gas flow path 30a through the gas flow path 31a based on the received signal 13 indicating the measured value of the current vacuum degree, and Based on this decision, the signal 16 is transmitted to the on / off switching valve 5, and the on / off switching valve 5 decides whether to turn the on / off switching valve to "open" or "closed". Thus, a rough adjustment of the gas discharge amount using the on / off switching valve 5 and a fine adjustment of the gas discharge amount using the vacuum degree control valve 6 are combined (for example, the on-off switching valve is set to "open "If the pressure reaches a predetermined pressure or lower, it will be set to" closed "and the adjustment of the vacuum control valve will be started), thereby reducing the pressure inside the molding module 1 even in this case. Similarly to the resin sealing device of the first embodiment, the inside of the molding module 1 may be decompressed more slowly than before. For example, when the pressure reduction is started, the on / off switching valve 5 on the molding module 1 side is set to “on”, and the on / off switching valve 5 of the vacuum control unit 8 is set to “on” Closed ", in order to suppress the foaming of the resin, when the decompression speed is too small, the vacuum degree control valve 6 is adjusted to increase the amount of gas discharged to the gas flow path 30a in order to suppress the foaming of the resin to increase the pressure of the decompression. Speed, and thereafter the on / off switching valve 5 of the control unit 8 for the degree of vacuum is set to "open".

Therefore, in the resin sealing device of the second embodiment, it is possible to reduce the overshoot amount of the decompression with respect to the target value of the pressure at the start of the decompression in the molding module 1 and to sufficiently reduce the inside of the molding module 1. Since the pressure is reduced, similar to the resin sealing device of the first embodiment, it is possible to reduce the occurrence of defects such as lead bending and resin leakage caused by excessive foaming of the resin, and it is also possible to suppress the occurrence of damage to the electronic parts of the resin molded product. The voids and defects in the sealed hardened resin are not filled.

The descriptions other than the above in Embodiment 2 are the same as those in Embodiment 1, and therefore descriptions thereof are not repeated here.

Although the embodiment and the modification have been described as above, the configurations of the embodiment and the modification are appropriately combined from the beginning.

The embodiments of the present invention have been described, but the embodiments disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.

1‧‧‧forming module

2‧‧‧ Vacuum Gauge

2a‧‧‧ Vacuum gauge near atmospheric pressure

2b‧‧‧Vacuum gauge for high vacuum

3‧‧‧ Decompression unit

4‧‧‧Flow large / small switching valve

5‧‧‧ open / close switching valve

6‧‧‧Vacuum Control Valve / Proportional Solenoid Valve

7‧‧‧Controller / Proportional Solenoid Controller

8‧‧‧ vacuum control unit

9‧‧‧ Vacuum control unit

10‧‧‧ is used to switch the flow of the gas into a large or small signal

11‧‧‧Signal representing the target value of the degree of vacuum

12, 13‧‧‧ signal indicating the current measured value of vacuum degree

14‧‧‧ switch signal

15‧‧‧ Sensor Signal Switching Unit / Vacuum Gauge Switching Unit

16‧‧‧ signal

21‧‧‧ Lower fixed plate

22‧‧‧ mobile unit

23‧‧‧Clamping mechanism

24‧‧‧Movable plate

25‧‧‧ lower mold

26‧‧‧ Upper mold

27‧‧‧ Upper fixed plate

28, 30, 31, 32, 33, 81, 82‧‧‧ Piping

28a, 31a, 32a, 81a, 82a‧‧‧Gas flow path

29‧‧‧columns

30a‧‧‧gas flow path / first gas flow path

33a‧‧‧gas flow path / second gas flow path

41‧‧‧Gas flow path

42‧‧‧O-ring

43a‧‧‧ Upper gas barrier member

43b‧‧‧ Outer gas barrier member

44‧‧‧Side components

45‧‧‧cavity

46‧‧‧ Underside members

47‧‧‧ Elastic member

51‧‧‧Release film

52‧‧‧resin material

53‧‧‧Leader

54‧‧‧Electronic parts

55‧‧‧ substrate

61‧‧‧ molten resin

62‧‧‧hardened resin

71‧‧‧foaming resin

FIG. 1 is a schematic configuration diagram of a resin sealing device according to a first embodiment. FIG. 2 shows the pressure (vacuum degree) inside the molding module with respect to the elapsed time [second] from the start of the decompression when the pressure inside the molding module is reduced using the resin sealing device of the reference example [ An example of a change in Torr]. 3 is a diagram showing a molding module with respect to an elapsed time [second] from the start of decompression when the pressure inside the molding module is reduced using the resin sealing device of the first embodiment and the resin sealing device of a reference example. Another example of changes in internal pressure (degree of vacuum) [Torr]. FIG. 4 is a schematic cross-sectional view illustrating part of the steps of an example of the resin sealing method according to the first embodiment. 5 is a schematic cross-sectional view illustrating a part of the steps of an example of the resin sealing method of the first embodiment. FIG. 6 is a schematic cross-sectional view illustrating a part of the steps of an example of the resin sealing method according to the first embodiment. FIG. 7 is a schematic cross-sectional view illustrating a part of the steps of an example of the resin sealing method according to the first embodiment. FIG. 8 is a schematic cross-sectional view illustrating part of the steps of an example of the resin sealing method according to the first embodiment. FIG. 9 is a schematic cross-sectional view illustrating a part of the steps of an example of the resin sealing method according to the first embodiment. FIG. 10 is a schematic cross-sectional view illustrating part of the steps of an example of the resin sealing method according to the first embodiment. FIG. 11 is a schematic cross-sectional view illustrating a part of the steps of an example of the resin sealing method of the first embodiment. FIG. 12 is a schematic cross-sectional view illustrating a part of the steps of an example of the resin sealing method of the first embodiment. FIG. 13 is a schematic cross-sectional view illustrating a part of the steps of an example of the resin sealing method according to the first embodiment. FIG. 14 is a schematic configuration diagram of a modified example of the molding module according to the first embodiment. 15 is a schematic configuration diagram of a resin sealing device according to a second embodiment.

Claims (16)

A resin sealing device includes: a forming module; a vacuum degree control unit for controlling the vacuum degree inside the forming module; a decompression unit for decompressing the inside of the forming module; and A vacuum gauge for measuring a vacuum degree inside the forming module; the vacuum degree control unit includes a vacuum degree control valve for adjusting a gas discharge amount inside the forming module; A switching valve that adjusts the amount of gas discharged inside the forming module of the decompression unit and adjusts the degree of vacuum corresponding to the inside of the forming module measured by the vacuum gauge The vacuum degree control unit of the vacuum degree control valve switches between the forming module and the first gas flow path of the first gas flow path connecting the forming module and the decompression unit through the switching valve. A second gas flow path connected to the vacuum control valve is connected between the valves. The resin sealing device according to item 1 of the scope of patent application, wherein the first gas flow path between the forming module and the second gas flow path is further provided to adjust the forming module. The second switching valve that discharges and discharges the gas inside. The resin sealing device according to item 1 of the patent application scope, wherein the resin sealing device adjusts the gas introduction from the second gas flow path into the first gas flow path through the vacuum degree control valve. Imported amount. The resin sealing device according to item 1 of the patent application scope, wherein the resin sealing device adjusts the pressure of the gas discharged from the first gas flow path into the second gas flow path through the vacuum degree control valve. Discharge. The resin sealing device according to item 1 of the scope of patent application, wherein the molding module includes a first die, a second die facing the first die, and the first die facing the first die. A movable unit in which a movement in a direction in which the two molds are relatively close and a movement in a direction that is relatively away from the second mold is possible, the first mold is reserved to hold a cavity of a resin material, and the second mold A plate-like member on which electronic components are mounted can be held. According to the resin sealing device according to item 5 of the scope of patent application, the movable unit includes a movable plate for fixing the first mold, a mold clamping mechanism for moving the movable plate, and the fixed unit. A first fixed plate of a mold clamping mechanism, the forming module further includes a second fixed plate for fixing the second mold, and the second fixed plate is provided with an internal connection between the first gas flow path and the first gas flow path. A third gas flow path that is internally connected to the molding module, the vacuum gauge includes a first vacuum gauge and a second vacuum gauge having a measurement range different from the first vacuum gauge, and the first vacuum gauge passes through A fourth gas flow path is connected to the first gas flow path, and the second vacuum gauge is connected to the first gas flow path through a fifth gas flow path. The resin sealing device according to any one of claims 1 to 6, wherein the resin sealing device controls a plurality of the vacuum sealing units through one vacuum control unit and one pressure reducing unit. The degree of vacuum inside the forming module. A resin molding method includes the steps of: supplying a plate-shaped member on which an electronic component is mounted to a mold surface of a second mold that is opposed to a mold surface of a first mold inside a molding module; and supplying a resin material to the mold. A step in the cavity of the first mold; a step of heating the resin material; a step of bringing the first mold close to the second mold; a step of decompressing the inside of the molding module A step of clamping the first mold and the second mold; and hardening the heated resin material after the step of clamping the first mold and the second mold, A step of resin sealing the electronic component; and the step of reducing the pressure includes adjusting through a switching valve a valve that connects the forming module and the pressure reducing unit through the switching valve. The discharge amount of the gas discharged from the first gas flow path is adjusted by the vacuum degree control valve to pass through the first gas flow path between the forming module and the switching valve and the vacuum degree control The second gas flow path connected to the valve is discharged Step into the body of the discharge amount. The resin molding method according to item 8 of the patent application scope, wherein the step of reducing the pressure further includes passing through the first gas flow path provided between the molding module and the second gas flow path. A step of adjusting a discharge amount of a gas discharged through the first gas flow path by a second switching valve. The resin molding method according to item 8 of the scope of patent application, wherein in the step of performing pressure reduction, the pressure inside the molding module is gradually reduced. The resin molding method according to item 8 of the scope of the patent application, wherein the resin molding method is to adjust the amount of the resin introduced from the second gas flow path into the first gas flow path through the vacuum control valve. The amount of gas introduced. The resin molding method according to item 8 of the scope of the patent application, wherein the resin molding method is to adjust the discharge from the first gas flow path to the second gas flow path through the vacuum degree control valve. Exhaust gas. The resin molding method according to item 8 of the patent application scope, wherein the step of performing resin sealing includes a step of manufacturing a resin molded product, and the resin molding method further includes a step of taking out the resin molded product. The resin molding method according to item 8 of the scope of patent application, wherein the molding module includes a first mold, a second mold opposed to the first mold, and a second fixing for fixing the second mold. A disk, and a movable unit that enables movement in a direction in which the first mold is relatively close to the second mold and movement in a direction that is relatively distant from the second mold, the first mold The second mold can hold a plate-shaped member on which an electronic component is mounted, and the second fixing plate includes therein the first gas flow path and the inside of the molding module. A third gas flow path that is connected, the movable unit includes a movable plate for fixing the first mold, a mold clamping mechanism for moving the movable disk, and a first mold for fixing the mold clamping mechanism. A fixed plate is connected to a vacuum gauge on the first gas flow path between the molding module and the second gas flow path, and the vacuum gauge includes a first vacuum gauge, and a measurement range and a degree of vacuum degree. A second vacuum gauge different from the first vacuum gauge, said first vacuum gauge passing through a fourth gas flow And the first gas passage coupling, and the second gauge connected to the first gas flow passage 5 through the first gas flow passage. The resin molding method according to any one of claims 8 to 14, in which the resin molding method is to control a plurality of the molding modules through a vacuum control unit and a decompression unit. Degree of vacuum inside. A method of manufacturing a resin molded article, wherein the method of manufacturing a resin molded article is a method of manufacturing a resin molded article by the resin molding method according to any one of claims 8 to 15 of a patent application scope.