CN108568928A - The manufacturing method of resin sealing apparatus, resin molding method and resin forming product - Google Patents
The manufacturing method of resin sealing apparatus, resin molding method and resin forming product Download PDFInfo
- Publication number
- CN108568928A CN108568928A CN201810181874.XA CN201810181874A CN108568928A CN 108568928 A CN108568928 A CN 108568928A CN 201810181874 A CN201810181874 A CN 201810181874A CN 108568928 A CN108568928 A CN 108568928A
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- Prior art keywords
- flow path
- gas flow
- resin
- vacuum degree
- mould
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Links
- 229920005989 resin Polymers 0.000 title claims abstract description 148
- 239000011347 resin Substances 0.000 title claims abstract description 148
- 238000007789 sealing Methods 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000000465 moulding Methods 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 238000007493 shaping process Methods 0.000 claims abstract description 101
- 239000000463 material Substances 0.000 claims description 16
- 230000008676 import Effects 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000005259 measurement Methods 0.000 claims 2
- 230000006837 decompression Effects 0.000 abstract description 33
- 239000007789 gas Substances 0.000 description 96
- 239000000758 substrate Substances 0.000 description 16
- 230000004888 barrier function Effects 0.000 description 8
- 238000005187 foaming Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 6
- 238000000748 compression moulding Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 239000006260 foam Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
- B29C2043/561—Compression moulding under special conditions, e.g. vacuum under vacuum conditions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
- B29C2043/561—Compression moulding under special conditions, e.g. vacuum under vacuum conditions
- B29C2043/563—Compression moulding under special conditions, e.g. vacuum under vacuum conditions combined with mechanical pressure, i.e. mould plates, rams, stampers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2791/00—Shaping characteristics in general
- B29C2791/004—Shaping under special conditions
- B29C2791/006—Using vacuum
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The present invention relates to the manufacturing methods of a kind of resin sealing apparatus, resin molding method and resin forming product.The cob webbings situations such as the present invention inhibits lead to be bent, resin is leaked out and is not filled by and the decompression that inside modules can be formed.Resin sealing apparatus has shaping module (1), the control unit (8) of vacuum degree, decompressing unit (3) and vacuum meter (2).The control unit (8) of vacuum degree have vacuum degree control valve (6), switching valve (4,5) and vacuum degree control unit (9).Between the shaping module (1) and switching valve (4,5) for the 1st gas flow path (30a) for linking shaping module (1) and decompressing unit (3) via switching valve (4,5), it is linked with the 2nd gas flow path (33a) linked with vacuum degree control valve (6).
Description
Technical field
The present invention relates to the manufacturing methods of a kind of resin sealing apparatus, resin molding method and resin forming product.
Background technology
A kind of resin sealing apparatus has been recorded in Japanese Patent Laid-Open 2008-143186 bulletins (patent document 1),
Be by resin put into in the die cavity being formed between the mold of upper and lower opposite direction come the resin sealing apparatus for being sealed/shaping,
Has pressure adjustmenting mechanism in the confined space comprising final mold cavity space, the pressure adjustmenting mechanism can be via can be from
The air flow circuit that connects outside confined space and the pressure in confined space depressurize/adjust.
Invention content
But in the resin sealing apparatus recorded in patent document 1, when by pressure adjustmenting mechanism come to confined space
When interior pressure is depressurized, there are resins excessively to foam, and generates and contact drawing for be installed on substrate by the resin to have foamed
The situation of lead bending (wire sweep) caused by line etc..In addition, there is also the resins to have foamed to conduct in a substrate, and
The case where resin leaks out is generated from frame.
On the other hand, when the pressure in confined space is high, gap and shortcoming etc. are generated in sealing resin sometimes and is not filled out
It fills.
According to embodiment disclosed herein, it is possible to provide a kind of resin sealing apparatus comprising：Shaping module；Vacuum
The control unit of degree, to control shaping module inside vacuum degree；Decompressing unit, to be carried out to the inside of shaping module
Decompression；And vacuum meter, the vacuum degree to the inside to shaping module are measured；The control unit of vacuum degree have to
Adjust shaping module inside gas discharge rate vacuum degree control valve, to adjust depend on decompressing unit finishing die
The switching valve of the discharge rate of the gas of the inside of block and to the true of the inside corresponding to the shaping module measured by vacuum meter
Reciprocal of duty cycle connects shaping module and decompressing unit via switching valve to adjust the control unit of the vacuum degree of vacuum degree control valve
Between the shaping module and switching valve of 1st gas flow path of knot, it is linked with the 2nd gas flow path linked with vacuum degree control valve.
According to embodiment disclosed herein, it is possible to provide a kind of resin molding method comprising：Electronics zero will be installed
The tabular component of part supply to the inside of shaping module it is opposite with the die face of the 1st mould to the 2nd mould die face on step；It will
Resin material is supplied to the step in the die cavity of the 1st mould；The step of resin material is heated；Keep the 1st mould and the 2nd mould close
The step of；The step of inside of shaping module is depressurized；1st mould and the 2nd mould are molded (mold clamping)
Step；And by making to harden made of the hardening of the resin material after heating after the step of molding the 1st mould with the 2nd mould
Resin, to electronic component carry out resin seal the step of；And the step of being depressurized includes to be adjusted across warp by switching valve
The discharge rate for the gas that the 1st gas flow path of shaping module and decompressing unit connection is discharged by switching valve, and pass through
Vacuum degree control valve links to adjust the 1st gas flow path between shaping module and switching valve and pass through with vacuum degree control valve
The step of being discharged into discharge rate of gas of 2nd the be discharged into discharge of gas flow path.
According to embodiment disclosed herein, it is possible to provide a kind of manufacturing method of resin forming product passes through the tree
Fat manufacturing process manufactures resin forming product.
According to embodiment disclosed herein, it is possible to provide a kind of bending of inhibition lead, resin leak out and be not filled by etc. at
Simultaneously the resin sealing apparatus of decompression of inside modules, resin molding method and resin forming product can be formed in shape unfavorable condition
Manufacturing method.
Described and other purposes, feature, situation and the advantage of the present invention will understand according to associated with the attached drawing of accompanying
The detailed description below about the present invention and become clear.
Description of the drawings
Fig. 1 is the schematical composition figure of the resin sealing apparatus of embodiment 1.
Fig. 2 is phase when indicating to depressurize the pressure of the inside of shaping module using the resin sealing apparatus of reference example
Variation for the pressure (vacuum degree) [support (Torr)] of the inside of the shaping module by the time [second] from decompression
An example figure.
Fig. 3 is indicated using the resin sealing apparatus of embodiment 1 and the resin sealing apparatus of reference example to shaping module
The inside relative to the shaping module by the time [second] from decompression when being depressurized of the pressure of inside pressure
Another figure of the variation of power (vacuum degree) [Torr].
A part for the step of Fig. 4 is an example to the method for resin-sealing of embodiment 1 carries out graphic schematical
Sectional view.
A part for the step of Fig. 5 is an example to the method for resin-sealing of embodiment 1 carries out graphic schematical
Sectional view.
A part for the step of Fig. 6 is an example to the method for resin-sealing of embodiment 1 carries out graphic schematical
Sectional view.
A part for the step of Fig. 7 is an example to the method for resin-sealing of embodiment 1 carries out graphic schematical
Sectional view.
A part for the step of Fig. 8 is an example to the method for resin-sealing of embodiment 1 carries out graphic schematical
Sectional view.
A part for the step of Fig. 9 is an example to the method for resin-sealing of embodiment 1 carries out graphic schematical
Sectional view.
A part for the step of Figure 10 is an example to the method for resin-sealing of embodiment 1 carries out graphic schematical
Sectional view.
A part for the step of Figure 11 is an example to the method for resin-sealing of embodiment 1 carries out graphic schematical
Sectional view.
A part for the step of Figure 12 is an example to the method for resin-sealing of embodiment 1 carries out graphic schematical
Sectional view.
A part for the step of Figure 13 is an example to the method for resin-sealing of embodiment 1 carries out graphic schematical
Sectional view.
Figure 14 is the schematical composition figure of the variation of the shaping module of embodiment 1.
Figure 15 is the schematical composition figure of the resin sealing apparatus of embodiment 2.
[explanation of symbol]
1：Shaping module；
2：Vacuum meter；
2a：Vacuum meter near atmospheric pressure；
2b：The vacuum meter of condition of high vacuum degree；
3：Decompressing unit；
4：Big/small switching valve of flow；
5：Opening/closing switching valve；
6：Vacuum degree control valve/proportion magnetic valve；
7：Controller/proportional solenoid valve control device；
8：The control unit of vacuum degree；
9：The control unit of vacuum degree；
10：The flow of gas to be switched to big or small signal；
11：Indicate the signal of the desired value of vacuum degree；
12、13：Indicate the signal of the measured value of current vacuum degree；
14：Switching signal；
15：The switching part of sensor signal switching part/vacuum meter；
16：Signal；
21：Disk is fixed in lower part；
22：Mobile unit；
23：Clamping；
24：Movable plate；
25：Lower die；
26：Upper mold；
27：Disk is fixed on top；
28、30、31、32、33、81、82：Piping；
28a、31a、32a、81a、82a：Gas flow path；
29：Column；
30a：Gas flow path/first gas flow path；
33a：Gas flow path/second gas flow path；
41：Gas flow path；
42：O-ring；
43a：Upper mold extraneous gas barrier structure；
43b：Lower die extraneous gas barrier structure；
44：Lateral members；
45：Die cavity；
46：Floor members；
47：Elastic component；
51：Mold release film；
52：Resin material；
53：Lead；
54：Electronic component；
55：Substrate；
61：Molten resin；
62：Hardening resin；
71：Foamex.
Specific implementation mode
Hereinafter, being illustrated to embodiment.Furthermore in the attached drawing for the explanation of embodiment, the same reference
Symbolic indication is the same as a part or considerable part.
[embodiment 1]
Fig. 1 shows the schematical composition of the resin sealing apparatus of embodiment 1 figures.The resin seal of embodiment 1 fills
It sets and has multiple shaping modules 1, the decompressing unit 3 depressurized to the inside to shaping module 1 and to control into
The control unit 8 of one vacuum degree of the vacuum degree of the inside of shape module 1.
Shaping module 1 has：Lower die 25, with lower die 25 it is opposite to upper mold 26, fix to the top of fixed upper mold 26
The lower part of disk 27, the movable plate 24 that lower die 25 can be fixed, the clamping 23 that movable plate 24 can be made to move, fixed clamping 23
Fixed disk 21 and the column 29 being arranged between top fixation disk 27 and lower part fixation disk 21.
Disk 21, clamping 23 and movable plate 24 are fixed by lower part to constitute mobile unit 22.Clamping 23 along
Column 29 fixes disk 21 from lower part and fixes the direction that disk 27 extends toward upper, and movable plate 24 is made to move freely in the up-down direction.By
This, mobile unit 22 make lower die 25 relative to upper mold 26 opposite movement (lower die 25 relative to upper mold 26 relatively close to
The movement in the direction that the movement in direction and lower die 25 are relatively far from relative to upper mold 26) become possible.Furthermore it can also profit
It replaces column 29 that disk 27 (side) is fixed on top with the block of wall-like and fixes disk 21 (side) connection with lower part.
Resin sealing apparatus has the vacuum meter 2 for measuring the vacuum degree of the inside of shaping module 1 in turn and to adjust
Save the opening/closing switching valve 5 for being discharged into discharge rate of the gas of the inside of shaping module 1.Opening/closing switching valve 5 is consolidated with may pass through top
Price fixing 27 and one end connection of the gas flow path 28a of the inside of piping 28 being connected to the inside of shaping module 1.Piping 28 it is interior
The other end of the gas flow path 28a in portion links via opening/closing switching valve 5 with the gas flow path 30a of the inside of piping 30.Vacuum
The gas flow path 28a of the inside for the piping 28 that meter 2 and opening/closing switching valve 5 and top are fixed between disk 27 links.
One end of the decompressing unit 3 and gas flow path 31a of the inside of piping 31 links, the other end warp of gas flow path 31a
Linked with the gas flow path 30a of the inside of piping 30 by big/small switching valve of flow 4.Decompressing unit 3 can make shaping module 1
Internal gas passes through top to fix disk 27, gas flow path 28a, opening/closing switching valve 5, gas flow path 30a, big/small switching of flow
Valve 4 and gas flow path 31a and be discharged, thus the pressure of the inside of shaping module 1 is depressurized.Big/small switching valve of flow 4 can
Adjust the discharge rate of gas when being depressurized come the pressure of the inside to shaping module 1 by decompressing unit 3.It is single as decompression
Member 3, such as vacuum pump can be used etc..Furthermore when resin sealing apparatus only have there are one shaping module 1 when, can not also use
Opening/closing switching valve 5.
The control unit 8 of vacuum degree has：Big/small switching valve 4 of flow, vacuum degree control valve (proportion magnetic valve) 6, control
Device (proportional solenoid valve control device) 7, the control unit 9 of vacuum degree and sensor signal switching part (switching part of vacuum meter) 15.
Vacuum degree control valve 6 via the gas flow path 33a of piping 33 and with big/small switching valve of flow 4 and opening/closing switching valve
The gas flow path 30a connections of the inside of piping 30 between 5.In addition, in vacuum degree control valve 6, with can be out of piping 32
The mode of the gases such as one end importing air of the gas flow path 32a in portion is linked with the other end of gas flow path 32a.From gas flow path
The gas that one end of 32a is imported may pass through gas flow path 32a, vacuum degree control valve 6, gas flow path 33a, gas flow path 30a,
Opening/closing switching valve 5, gas flow path 28a and top fix disk 27 and are directed into the inside of shaping module 1.
In the resin sealing apparatus of embodiment 1, the vacuum degree of the inside of shaping module 1 is measured by vacuum meter 2,
Indicate the signal 13 of the measured value of the current vacuum degree of the inside of shaping module 1 via sensor signal switching part 15 and often
It is sent in the control unit 9 of vacuum degree.Furthermore such as when there is multiple vacuum meters 2 as described later, sensor signal switching
Portion 15 can switch vacuum meter 2 by receiving switching signal 14 from the control unit 9 of vacuum degree.
The control unit 9 of vacuum degree is according to the signal 13 of the measured value of the current vacuum degree of received expression, towards flow
The flow that the gas gas flow path 31a will be passed through to be discharged from gas flow path 30a is sent in greatly/small switching valve 4 switch to
Big or small signal 10.Big/small switching valve of flow 4 is to be expelled to the gas in gas flow path 31a from gas flow path 30a as a result,
Discharge rate become big or any one small mode and be roughly adjusted.
The signal 11 that the control unit 9 of vacuum degree will be indicated as the desired value of the vacuum degree of the inside of shape module 1 is sent to control
In device 7 processed, on the other hand, according to the signal 13 of the measured value of the received current vacuum degree of expression, it will indicate currently
The signal 12 of the measured value of vacuum degree is sent to often in controller 7.Controller 7 is according to the vacuum degree of the inside of shaping module 1
The difference of desired value and the measured value of the vacuum degree of the inside of received current shaping module 1 adjust vacuum degree control
Valve 6, and meticulously adjust the import volume that the gas in gas flow path 33a is directed into from gas flow path 32a.
In this way, in the resin sealing apparatus of embodiment 1, the row of the gas by the way that big/small switching valve of flow 4 will be utilized
It the rough adjusting of output and is combined, can be reduced using the careful adjusting of the import volume of the gas of vacuum degree control valve 6
Overshoot (overshoot) amount of the decompression of the desired value of pressure when the decompression of inside relative to shaping module 1 starts.Flow
The switching time of greatly/small switching valve 4 for example can correspond to the decompression of the desired value of the pressure of the inside relative to shaping module 1
The time (speed) of the desired value of the pressure of the inside of overshoot and arrival shaping module 1 determines.
Phase when Fig. 2 indicates to depressurize the pressure of the inside of shaping module 1 using the resin sealing apparatus of reference example
For the one of the variation of the pressure (vacuum degree) [Torr] of the inside of the shaping module 1 by the time [second] from decompression
Example.Herein, careful tune of the resin sealing apparatus of reference example except the import volume for not carrying out gas using vacuum degree control valve 6
Section, and using big/small switching valve 4 of flow by the discharge rate of gas be only set as flow it is big other than, pass through the resin with embodiment 1
The identical condition of sealing device and identical method depressurize come the pressure of the inside to shaping module 1.In addition, reference example
The variation of the pressure of the inside of shaping module 1 is indicated by the comparison of the desired value of the pressure of the inside with shaping module 1.
As shown in Fig. 2, in the case of reference example, there are gas discharge amounts to become larger, the pressure one of the inside of shaping module 1
The case where lower sub- decline (air introduction, which chases after, to be unable to catch up with).At this point, in the case of desired value of the setting close to atmospheric pressure side, sometimes
The pressure overshoot of the inside of shaping module 1 and be unable to control.That is, formation can not take into account pump capacity (gas discharge amount) and air can
The amount of importing is come the range that is controlled.If the pressure of this inside for meaning shaping module 1 it is constant at defined pressure hereinafter,
Then it is unable to control.
When by big/small switching valve of flow by the discharge rate of gas be set as flow it is small when, since gas discharge amount is small, because
Even if this can also control the pressure of the inside of shaping module 1 in the case of desired value of the setting close to atmospheric pressure side.But
Be, since gas discharge amount is small, setting close to inlet side desired value in the case of, reach sometimes this desired value when
Between become evening.
Therefore, the flow of the discharge rate of gas is used with the small switching of flow greatly by flow big/small switching valve 4, by
This even close to the desired value of atmospheric pressure side, can also control the pressure of the inside of shaping module 1, and even close to vacuum
The desired value of side can also be suppressed to the time delay of the desired value of the pressure up to the inside of shaping module 1.For example, it is also possible to
The flow of big/small switching valve of flow 4 is set as small until defined pressure, switching stream when below pressure as defined in becoming
Big/small switching valve 4 is measured to use flow big.Switching time of big/small switching valve of flow 4 etc. can also in advance by test etc. come
It determines.Even if by big/small switching valve 4 of flow by the discharge rate of gas be set as flow it is small in the case of, in order to inhibit to set
The foaming of fat can also adjust vacuum degree control valve 6 and be directed into gas flow path 30a to increase when the speed of decompression is big
Thus the import volume of gas inhibits the speed of decompression.In addition, the discharge rate of gas is set by big/small switching valve of flow 4
For flow it is small in the case of, in order to inhibit the foaming of resin, when the speed of decompression is too small, can flow is big/small switching valve 4 cut
It is big changing flow into, and adjusts vacuum degree control valve 6, being increased towards in gas flow path 30a with can inhibit the degree of foaming of resin
Gas import volume come inhibit decompression speed.Alternatively, it is also possible to since decompression at the end of decompression until pass through flow
In the state that the discharge rate of gas is maintained big by greatly/small switching valve 4, vacuum degree control valve 6 is only adjusted, can inhibit resin
The degree of foaming make towards the gas import volume in gas flow path 30a from gradually changing to small greatly.
In addition, as shown in figure 3, in the resin sealing apparatus of embodiment 1, since the overshoot of decompression can be reduced, because
This can be easy to carry out rank by each desired value (750Torr, 600Torr, 450Torr, 300Torr and 150Torr) of vacuum degree
The decompression of section property.On the other hand, in the resin sealing apparatus of the big reference example of the overshoot of decompression, it is difficult to such as embodiment 1
Resin sealing apparatus press each desired value of vacuum degree like that and carry out interim decompression.
Hereinafter, with reference to Fig. 4~Figure 13 schematical sectional view to using the implementation of the resin sealing apparatus of embodiment 1
An example of the method for resin-sealing of mode 1 illustrates.First, as shown in figure 4, to be fixed on the upper mold that top is fixed on disk 27
The die face of 26 die face and the lower die 25 being fixed on movable plate 24 it is mutually opposite to mode be arranged.Furthermore it is fixed on top
Disk 27 is internally provided with the gas stream of the gas flow path 28a connections of piping 28 shown in the inside of shaping module 1 and Fig. 1
Road 41.
The respective edge of disk 27 and movable plate 24 is fixed on top, upper mold extraneous gas is configured with via O-ring 42
Barrier structure 43a and lower die extraneous gas barrier structure 43b.To fix the upper mold extraneous gas barrier structure of 27 side of disk on top
Also the mode that O-ring 42 is configured between the lower die extraneous gas barrier structure 43b of 24 side 43a and movable plate is constituted.
Lower die 25 has floor members 46, surrounds the lateral members 44 around floor members 46 and configure in side structure
Elastic component 47 between part 44 and movable plate 24.The sky that lower die 25 is surrounded in the top of floor members 46 by lateral members 44
It is interior that there is die cavity 45.Die cavity 45 is for keeping resin material.
Then, as shown in figure 5, by as the tabular component for being equipped with the electronic component 54 being electrically connected by lead 53
It is kept in the supply to the die face of upper mold 26 of substrate 55, and (is graininess tree in embodiment 1 by resin material 52
Fat) it supplies and is kept into the die cavity 45 of lower die 25 via mold release film 51.
Furthermore as tabular component, such as can enumerate：Metal substrate, resin substrate, glass substrate, ceramic substrate, circuit
Substrate, semiconductor wafer or lead frame etc..
It as resin material 52, is not particularly limited, such as can be the thermosetting resins such as epoxy resin or silicones,
It can also be thermoplastic resin.Include the compound of thermosetting resin or thermoplastic resin in part of alternatively, it is also possible to be
Material.As the form of supply to the resin in the resin sealing apparatus of embodiment 1, such as can enumerate：Particulate resins, liquid
The resin etc. of shape resin, the resin of sheet, the resin of tablet shape or powder shaped.
Then, as shown in fig. 6, being heated to resin material 52 to make its melting, molten resin (mobility is thus made
Resin) 61.
Then, as shown in fig. 7, movable plate 24 is made to move upward, and keep lower die 25 close with upper mold 26.Top as a result,
The upper mold extraneous gas barrier structure 43a of fixed 27 side of the disk and lower die extraneous gas barrier structure 43b of 24 side of movable plate via
O-ring 42 between the two and touch, to stop extraneous gas.
Then, as shown in figure 8, the gas of the inside of shaping module 1 is made to be discharged across gas flow path 41, to forming
It is depressurized the inside of module 1.At this point, molten resin 61 foams and becomes Foamex 71.It is being shaped as molten resin 61
The reasons why foaming when the decompression of the inside of module 1, it is contemplated that (i) resin material 52 melt when be involved in gas, (ii) melting
Being volatilized into contained in the moisture and (iii) molten resin 61 contained in resin 61 is graded.
Herein, in the resin sealing apparatus of embodiment 1, the row of the gas by the way that big/small switching valve of flow 4 will be utilized
The rough adjusting of output and be combined using the careful adjusting of the import volume of the gas of vacuum degree control valve 6, can at
It is slowly depressurized the inside of shape module 1.The decompression for reducing the inside of shaping module 1 than previous (reference example) as a result, is opened
The overshoot of decompression when the beginning, therefore for example as shown in figure 9, can inhibit the expansion drastically of Foamex 71.Therefore, it can reduce
The generation for a problem that being leaked out by the caused lead bending of the excessively foaming of molten resin 61 and resin.
In addition, in the resin sealing apparatus of embodiment 1, the pressure of the inside of shaping module 1 can be fully reduced, because
This can also inhibit to generate gap in the hardening resin 62 for sealing electronic component 54 by subsequent steps and lack
It is deficient etc. to be not filled by.
Furthermore using the decompression of the inside of the shaping module of the resin sealing apparatus of embodiment 11 for example as shown in figure 3,
It slowly reduces with can also making the pressure stage property of the inside of shaping module 1, and reaches the desired value of final vacuum degree.Even if
In this case as well, it is possible to inhibit the expansion drastically of Foamex 71.
In addition, the decompression using the inside of the shaping module 1 of the resin sealing apparatus of embodiment 1 can also be in decompression
Initial stage makes vacuum degree get higher and (pressure of the inside of shaping module 1 be made to be lower), and so that vacuum degree is lower thereafter (makes forming
The pressure of the inside of module 1 is got higher) after, so that vacuum degree is got higher again.By so operating, can make to melt in the initial stage of decompression
Melt resin 61 foams, and the bubble of Foamex 71 is crushed thereafter by low vacuum degree, and again by the inside of shaping module 1
Until pressure reduction to desired value.
In addition, as shown in Figure 10, movable plate 24 is made further to be moved upward to make lower die 25 further be connect with upper mold 26
Closely, become the state that lateral members 44 press substrate 55 via mold release film 51, thus can further suppress makes shaping module 1
Resin when internal vacuum degree is got higher leaks out.Furthermore even if in the case where becoming this state, it can also be by side structure
Venthole is arranged come to being depressurized in die cavity in the upper surface of part 44.
Then, as shown in figure 11, the molding of lower die 25 and upper mold 26 is carried out.Lower die 25 and the molding of upper mold 26 for example pass through
Make movable plate 24 further move upward come until the electronic component 54 on substrate 55 is immersed in molten resin 61 into
Row.Herein, it after the defined time, can also be cut opening/closing from making electronic component 54 be immersed in molten resin 61
The closing of valve 5 is changed, the pressure of the inside of shaping module 1 is thus kept.
Then, make molten resin 61 hard in the state that the electronic component 54 on substrate 55 is immersed in molten resin 61
Change.As a result, as shown in figure 12, resin seal is carried out to the electronic component 54 on substrate 55 by hardening resin 62 by makes tree
Resin-formed product.In the embodiment 1, resin forming product is being carried out comprising substrate 55 and on substrate 55 by hardening resin 62
The electronic component 54 of resin seal.
Then, as shown in figure 13, so that movable plate 24 is moved downward to make lower die 25 be detached from upper mold 26, thus make to take off
Mould film 51 is detached from hardening resin 62.Thereafter, resin forming product is unloaded from upper mold 26, thus can get resin forming product.
The method of resin-sealing of embodiment 1 is not particularly limited to the method, such as may include or not comprising passing through
Compress moulding method carrys out other steps other than the step of carrying out compression molding to resin material (compression molding step).It is described its
He is also not particularly limited step, such as can also be that will will be completed by the intermediate cut-out manufactured by compression molding step
The cut-out step of the compression molded product separation of product.More specifically, for example, can also manufacture by compression molding come to configuration exist
Multiple chips on one substrate carry out intermediate made of compression molding (resin seal), and then pass through the cut-out step
Intermediate is cut off, and is separated into an other chip and obtains the compression molded product (finished goods) of resin seal.In addition, implementing
Method other than the method for resin-sealing of mode 1 compress moulding method such as can be used for metaideophone manufacturing process.
In the embodiment 1, the case where having vacuum meter 2 to resin sealing apparatus is illustrated, but for example such as
Shown in Figure 14, resin sealing apparatus can also have vacuum meter 2a and condition of high vacuum degree near atmospheric pressure vacuum meter 2b this
Two vacuum meters are as vacuum meter 2.In the case, it can correspond to situation and more accurately measure the inside of shaping module 1
Pressure.The gas of vacuum meter 2a and the piping 28 being attached between opening/closing switching valve 5 and top fixation disk 27 near atmospheric pressure
The gas flow path 82a connections of piping 82 on flow path 28a.The vacuum meter 2b of condition of high vacuum degree and be attached at opening/closing switching valve 5 with
The gas flow path 81a connections of the piping 81 on the gas flow path 28a of the piping 28 between disk 27 are fixed on top.It is attached as atmospheric pressure
The example of close vacuum meter can enumerate diaphragm vacuum gauge (diaphragm vacuum gauge) etc., be used as condition of high vacuum degree
Vacuum meter example, Pirani ga(u)ge (pirani vacuum gauge) etc. can be enumerated.
In the embodiment 1, as the control unit of vacuum degree 9, such as programmable logic controller (PLC) can be used
(Programmable Logic Controller, PLC), microcomputer or personal computer etc..
In the embodiment 1, use ratio solenoid valve is illustrated as the case where vacuum degree control valve 6, but made
For vacuum degree control valve 6, can also be replaced using electropneumatic controller (electro-pneumatic regulator) etc.
Proportion magnetic valve.In addition, as controller 7, as long as can be current according to the expression received by the control unit 9 from vacuum degree
The signal 12 of the measured value of vacuum degree controls vacuum degree control valve, is then not particularly limited.
In the embodiment 1, to controlled by the control unit 8 of a vacuum degree and a decompressing unit 3 it is multiple at
The case where pressure (vacuum degree) of the inside of shape module 1, is illustrated, but the quantity of shaping module 1 and is not limited, finishing die
Block 1 can also be one.Shaping module 1 can increase or decrease.Furthermore when controlling the pressure of inside of multiple shaping modules 1,
Such as can also holding pressure rear to the inner pressure relief 30 seconds or so of a shaping module 1 (by the shaping module 1 through decompression
Opening/closing switching valve 5 becomes " closing "), the inside of other shaping modules 1 is depressurized thereafter (by the opening of other shaping modules 1/
It closes switching valve 5 and becomes "ON").That is, can only to control a shaping module 1 inside pressure (vacuum degree) needed for time into
Row control, controls the pressure (vacuum degree) of the inside of other shaping modules 1 immediately after.Therefore, vacuum degree can be passed through
Control unit 8 and a decompressing unit 3 expeditiously control the pressure (vacuum degree) of the inside of multiple shaping modules 1.
[embodiment 2]
Figure 15 indicates the schematical composition figure of the resin sealing apparatus of embodiment 2.The resin seal of embodiment 2 fills
Set has feature at following aspect：It is attached at the other end of the gas flow path 32a of the inside of the piping 32 on vacuum degree control valve 6
Link with the gas flow path 31a for the piping 31 being attached in decompressing unit 3, and flow is replaced using opening/closing switching valve 5
Greatly/small switching valve 4.
In the resin sealing apparatus of embodiment 2, the control unit 9 of vacuum degree indicates currently true according to received
The signal 13 of the measured value of reciprocal of duty cycle decides whether to be discharged across gas flow path 31a from gas flow path 30a, and according to this decision
Signal 16 is sent in opening/closing switching valve 5, opening/closing switching valve 5 determines that opening and closing switching valve, which is become "ON", still to be become
" closing ".The rough adjusting and utilization vacuum degree control valve 6 of the discharge rate of the gas of opening/closing switching valve 5 will be utilized as a result,
The careful adjusting of the discharge rate of gas is combined (for example, opening and closing switching valve is set as "ON" until defined pressure is
Only, the pressure as defined in become hereinafter, if be set as " closing ", and start with the adjusting of vacuum degree control valve), thus to forming
The inside of module 1 is depressurized, even if in this case as well, it is possible in the same manner as the resin sealing apparatus of embodiment 1, than elder generation
Preceding compare slowly depressurizes the inside of shaping module 1.Such as following control can be carried out：It, will at the beginning of decompression
The opening/closing switching valve 5 of 1 side of shaping module is set as "ON", and the opening/closing switching valve 5 of the control unit 8 of vacuum degree is set as " closing ",
In order to inhibit the foaming of resin, when the speed of decompression is too small, vacuum degree control valve 6 is adjusted, can inhibit the foaming of resin
Degree increases increases the speed of decompression towards the gas discharge amount in gas flow path 30a, thereafter by the control unit of vacuum degree 8
Opening/closing switching valve 5 is set as "ON".
Therefore, in the resin sealing apparatus of embodiment 2, subtracting for the inside relative to shaping module 1 can also be reduced
The overshoot of the decompression of the desired value of pressure when pressing off the beginning, and decompression is sufficiently carried out to the inside of shaping module 1, therefore with
The resin sealing apparatus of embodiment 1 similarly, can reduce the lead bending for excessively being foamed by resin caused and resin leaks out
A problem that generation, and can also inhibit in the hardening resin that the electronic component to resin forming product is sealed
Gap and shortcoming etc. is generated to be not filled by.
Explanation other than described in embodiment 2 is identical as embodiment 1, therefore does not repeat its explanation herein.
Embodiment and variation are illustrated as described above, but by the embodiment and the composition of variation
Proper combination is also scheduled from initial institute.
Embodiments of the present invention are illustrated, but this revealed embodiment is considered as in all respects
To illustrate rather than carrying out limiter.The scope of the present invention is represented by claim, and is intended to encompass and claim is impartial contains
Being had altered in justice and range.
Claims (16)
1. a kind of resin sealing apparatus, it is characterised in that including：
Shaping module；
The control unit of vacuum degree, to control the shaping module inside vacuum degree；
Decompressing unit depressurizes to the inside to the shaping module；And
Vacuum meter, the vacuum degree to the inside to the shaping module are measured；
The control unit of the vacuum degree has to adjust the vacuum degree of the discharge rate of the gas of the inside of the shaping module
Control valve, to adjust depend on the decompressing unit the shaping module inside gas discharge rate switching valve,
And adjust the vacuum degree control to the vacuum degree of the inside corresponding to the shaping module measured by the vacuum meter
The control unit of the vacuum degree of valve processed, and
In the forming for the 1st gas flow path for linking the shaping module and the decompressing unit via the switching valve
Between module and the switching valve, it is linked with the 2nd gas flow path linked with the vacuum degree control valve.
2. resin sealing apparatus according to claim 1, it is characterised in that in the shaping module and the 2nd gas stream
On the 1st gas flow path between road, and then have to adjust the gas of the inside of the shaping module is discharged into discharge
2nd switching valve of amount.
3. resin sealing apparatus according to claim 1, it is characterised in that by the vacuum degree control valve come adjust from
2nd gas flow path is directed into the import volume of the gas in the 1st gas flow path.
4. resin sealing apparatus according to claim 1, it is characterised in that by the vacuum degree control valve come adjust from
1st gas flow path is expelled to the discharge rate of the gas in the 2nd gas flow path.
5. resin sealing apparatus according to claim 1, it is characterised in that the shaping module have the 1st mould, with it is described
1st mould relative to the 2nd mould and make the 1st mould relative to the 2nd mould relatively close to direction movement with it is opposite
Movement in the direction that the 2nd mould is relatively far from becomes possible mobile unit,
1st mold is spare to keep the die cavity of resin material,
2nd mould can keep the tabular component for being equipped with electronic component.
6. resin sealing apparatus according to claim 5, it is characterised in that the mobile unit has to described in fixation
The movable plate of 1st mould is fixed to the clamping that keeps the movable plate movable and to the 1st of the fixation clamping
Disk,
The shaping module has in turn fixes disk to the 2nd of fixation the 2nd mould, and the 2nd fixation disk has in inside
By the 3rd gas flow path of the 1st gas flow path and the interior bonds of the shaping module,
The vacuum meter has measurement range 2nd vacuum meter different from the 1st vacuum meter of the 1st vacuum meter and vacuum degree,
1st vacuum meter links via the 4th gas flow path and with the 1st gas flow path, and the 2nd vacuum meter is via the 5th gas
Flow path and with the 1st gas flow path link.
7. resin sealing apparatus according to any one of claim 1 to 6, it is characterised in that pass through a vacuum degree
Control unit control the vacuum degree of the inside of multiple shaping modules with decompressing unit.
8. a kind of resin molding method, it is characterised in that including：
By the tabular component for being equipped with electronic component supply to the inside of shaping module it is opposite with the die face of the 1st mould to the 2nd
Step in the die face of mould；
Resin material is supplied to the step in the die cavity of the 1st mould；
The step of resin material is heated；
Make the 1st mould and the close step of the 2nd mould；
The step of inside of the shaping module is depressurized；
The step of 1st mould and the 2nd mould are molded；And
The resin material after making heating after the step of being molded to the 1st mould and the 2nd mould is by harden
At hardening resin, to the electronic component carry out resin seal the step of；And
Described the step of being depressurized include by switching valve come adjust across via the switching valve by by the shaping module
The discharge rate of gas being discharged with the 1st gas flow path of decompressing unit connection, and by vacuum degree control valve come adjust from
The 1st gas flow path between the shaping module and the switching valve passes through the 2nd linked with the vacuum degree control valve
The step of being discharged into discharge rate of gas of the be discharged into discharge of gas flow path.
9. resin molding method according to claim 8, it is characterised in that described the step of being depressurized is in turn comprising logical
The 2nd switching valve that has on the 1st gas flow path crossed between the shaping module and the 2nd gas flow path is adjusted
The step of discharge rate for the gas being discharged across the 1st gas flow path.
10. resin molding method according to claim 8, it is characterised in that in described the step of being depressurized, make institute
It reduces with stating the pressure stage property of the inside of shaping module.
11. resin molding method according to claim 8, it is characterised in that by the vacuum degree control valve come adjust from
2nd gas flow path is directed into the import volume of the gas in the 1st gas flow path.
12. resin molding method according to claim 8, it is characterised in that by the vacuum degree control valve come adjust from
1st gas flow path is expelled to the discharge rate of the gas in the 2nd gas flow path.
13. resin molding method according to claim 8, it is characterised in that include system the step of the progress resin seal
The step of making resin forming product,
The resin molding method includes the step of taking out the resin forming product in turn.
14. resin molding method according to claim 8, it is characterised in that the shaping module have the 1st mould, with it is described
1st mould it is opposite to the 2nd mould, fix disk to the 2nd of fixation the 2nd mould and make the 1st mould relative to the described 2nd
Mould relatively close to the movement in direction and the movement in the direction being relatively far from relative to the 2nd mould become possible movable
Unit,
1st mold is spare to keep the die cavity of resin material,
2nd mould can keep the tabular component for being equipped with electronic component,
The 2nd fixation disk has the 3rd gas of the interior bonds by the 1st gas flow path Yu the shaping module in inside
Flow path,
The mobile unit have the movable plate to fixation the 1st mould, to keep the movable plate movable clamping,
And disk is fixed to the 1st of the fixation clamping,
It is linked with vacuum meter on the 1st gas flow path between the shaping module and the 2nd gas flow path,
The vacuum meter has measurement range 2nd vacuum meter different from the 1st vacuum meter of the 1st vacuum meter and vacuum degree,
1st vacuum meter links via the 4th gas flow path and with the 1st gas flow path, and the 2nd vacuum meter is via the 5th gas
Flow path and with the 1st gas flow path link.
15. the resin molding method according to any one of claim 8 to 14, it is characterised in that pass through vacuum degree
Control unit controls the vacuum degree of the inside of multiple shaping modules with a decompressing unit.
16. a kind of manufacturing method of resin forming product, it is characterised in that by according to described in any one of claim 8 to 15
Resin molding method manufactures resin forming product.
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|---|---|---|---|
| JP2017042616A JP6785690B2 (en) | 2017-03-07 | 2017-03-07 | Resin sealing device, resin molding method and manufacturing method of resin molded products |
| JP2017-042616 | 2017-03-07 |
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| KR (1) | KR102232403B1 (en) |
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| JP7345322B2 (en) | 2019-09-03 | 2023-09-15 | 株式会社ディスコ | Resin coating method and resin coating equipment |
| CN111906982B (en) * | 2020-07-21 | 2021-04-02 | 南昌华越塑料制品有限公司 | Extrusion device capable of adjusting output plastic quantity |
| WO2023145366A1 (en) * | 2022-01-31 | 2023-08-03 | 株式会社フジ機工 | Vacuum pressure-reducing device, and underfill charging method and defoamed charging method using same |
| WO2024111255A1 (en) * | 2022-11-21 | 2024-05-30 | 株式会社村田製作所 | Compressed resin sealing and molding device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0756923A1 (en) * | 1995-08-01 | 1997-02-05 | Bridgestone Corporation | Apparatus and methods for molding expanded synthetic resin |
| JPH09290443A (en) * | 1996-04-26 | 1997-11-11 | Towa Kk | Method for resin seal molding of electronic part and apparatus therefor |
| JP2008143186A (en) * | 2008-01-08 | 2008-06-26 | Sumitomo Heavy Ind Ltd | Method for sealing resin |
| CN105965915A (en) * | 2015-03-11 | 2016-09-28 | 富士重工业株式会社 | Device for molding of composite material and method therefor |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3539100B2 (en) * | 1996-10-24 | 2004-06-14 | 株式会社ブリヂストン | Molding method and molding method for synthetic resin foam molding |
| JPH1119967A (en) * | 1997-06-30 | 1999-01-26 | Dainippon Printing Co Ltd | In-mold decorating injection molding apparatus and its method |
| JP2000073102A (en) * | 1998-08-28 | 2000-03-07 | Toyota Motor Corp | Method for estimating reduced pressure gas concentration and method for switching gas route utilizing estimation of gas concentration |
| JP5148175B2 (en) * | 2007-06-06 | 2013-02-20 | 住友重機械工業株式会社 | Resin sealing device and resin sealing method |
| JP4990039B2 (en) * | 2007-06-18 | 2012-08-01 | 大亜真空株式会社 | Pressure sensor output correction method and pressure sensor output correction apparatus |
| KR20110082422A (en) * | 2010-01-11 | 2011-07-19 | 삼성전자주식회사 | Molding apparatus and molding method |
| CN104619759B (en) * | 2012-07-31 | 2018-03-30 | 科思创德国股份有限公司 | Prepare the vacuum assist method of polyurethane foam |
| JP6491508B2 (en) * | 2015-03-23 | 2019-03-27 | Ｔｏｗａ株式会社 | Resin sealing device and method of manufacturing resin molded product |
-
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- 2017-03-07 JP JP2017042616A patent/JP6785690B2/en active Active
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- 2018-02-27 KR KR1020180023367A patent/KR102232403B1/en active IP Right Grant
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0756923A1 (en) * | 1995-08-01 | 1997-02-05 | Bridgestone Corporation | Apparatus and methods for molding expanded synthetic resin |
| US5723152A (en) * | 1995-08-01 | 1998-03-03 | Bridgestone Corporation | Apparatus for vacuum molding expanded synthetic resin parts |
| JPH09290443A (en) * | 1996-04-26 | 1997-11-11 | Towa Kk | Method for resin seal molding of electronic part and apparatus therefor |
| JP2008143186A (en) * | 2008-01-08 | 2008-06-26 | Sumitomo Heavy Ind Ltd | Method for sealing resin |
| CN105965915A (en) * | 2015-03-11 | 2016-09-28 | 富士重工业株式会社 | Device for molding of composite material and method therefor |
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| JP2018144371A (en) | 2018-09-20 |
| CN108568928B (en) | 2021-02-02 |
| KR102232403B1 (en) | 2021-03-26 |
| TWI666105B (en) | 2019-07-21 |
| TW201832895A (en) | 2018-09-16 |
| KR20180102494A (en) | 2018-09-17 |
| JP6785690B2 (en) | 2020-11-18 |
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