201224675 六、發明說明： 【發明所屬之技術領域】 本發明係與使光照射部所射出之光介由形成著圖案之 光罩照射於工作台上之工件的曝光裝置及曝光方法相關^ 【先前技術】 半導體裝置、液晶基板、微機械等需要微細尺寸之加 工的各種電氣構件等的製造上，爲了於工件上形成各種電 子元件等，介由形成著圖案之光罩對工件上照射光，而於 工件上實施光罩圖案之曝光的工序。 第8圖，係傳統曝光裝置之構成例的立體圖。 曝光裝置，其係由射出曝光光之光照射部1、用以保 持形成著用以執行曝光之圖案之光罩Μ的光罩台2、用以保 持執行曝光處理之工件的工作台4、用以將形成於光罩Μ之 圖案投影於工作台4上之工件W的投影透鏡3、用以將執行 曝光處理之工件W搬入工作台4的工件搬入機構20、以及 用以將完成曝光處理之工件W搬出工作台4的工件搬出機 構30等所構成。 此外，曝光裝置，也具備以執行光罩及工件之定位爲 目的之校準機構、及用以控制上述各構成部位之動作的控 制部等，然而，此處將其省略。 光照射部1，於內部，具備著用以放射曝光光之光源 燈、及用以反射來自燈之光的反射鏡等。 工作台4’其係用以保持用以轉錄形成於光罩μ之圖案 201224675 的工件W。工件w ’例如，包括印刷基板、玻璃基板、晶 圓等之各種種類。第8圖中，所圖示之工件w係圓形之晶 圓。 工作台4’裝設者工作台移動機構7。工作台移動機構 7，其係用以使工作台4於工作台4之平面內之XY方向、垂 直於工作台面之Z方向（上下方向）、以及以垂直於工作 台面之軸爲中心之Θ旋轉方向進行移動。 此外，曝光裝置之中，尙有未具備投影透鏡但使光罩 及工件密貼或接近而將光罩圖案轉錄至工件上之曝光裝置 〇 參照第8圖，針對利用該曝光裝置之工件的曝光手續 進行說明。 工件搬入機構20之工件機械手（搬送機械人）21，係 從收容著複數執行曝光處理之工件（晶圓）W的工件載具 22 (晶圓•卡匣）取出工件W。 工件機械手21，係將所取出之工件W搬送至工作台4 並載置於台上。於工作台4之表面，形成著真空吸附孔， 用以吸附保持工件W»此外，於工件W之表面’塗佈著因 爲曝光光而產生反應的抗蝕劑。 執行光罩Μ及工件W之定位後，從光照射部1射出曝光 光。所射出之曝光光，係介由光罩Μ及投影透鏡3而照射於 工件W。形成於光罩Μ之光罩圖案則由投影透鏡3投影於工 件W上而進行曝光。 曝光時間（對工件照射曝光光之時間）係預先進行設 -6- ⑧ 201224675 定。經過曝光時間的話，光照射部1即停止曝光光之射出 而結束曝光處理。 曝光處理結束的話，工件搬出機構30之工件機械手（ 搬送機械人）31，則從工作台4取出工件W。工件機械手 31，將所取出之工件W，搬送並收容於用以收容完成曝光 處理之工件的工件載具（晶圓•卡匣）32。 曝光裝置，至工件載具22沒有未處理之工件W爲止， 重複執行上述動作。此種曝光裝置，例如，專利文獻1所 記載者。 [專利文獻1]專利第3 1 5 2 1 3 3號公報 【發明內容】 工件之曝光處理所必要之合計時間（總曝光處理時間 )，並非只是單純照射曝光光之時間（曝光時間）而已， 尙包含從工作台搬出已完成處理之工件並將未處理之工件 搬入工作台之搬入時間（工件之交換時間）。 例如，假設執行4件工件之曝光處理時。1件工件之曝 光時間爲1 0秒，工作台之工件的交換時間爲5秒。此外， 不考慮光罩及工件之定位時間。 第9圖，係上述時之總曝光處理時間。如該圖所示， 需要6 5秒。其中，工件之交換時間爲2 5秒。於本例時’工 件之交換時間佔了總曝光處理時間之大約4成的時間。工 件之交換時間’係所謂未執行曝光之時間，爲了有效率地 使用曝光裝置，期望能儘量縮短該工件之交換時間。 201224675 爲了縮短工件之交換時間，例如，可以考慮準備2個 工作台，並交互執行曝光處理及工件之搬送。 亦即，對其中一方之工作台上之工件執行曝光處理之 期間，從工件載具將工件搬入並載置於另一方之工作台上 ，曝光處理結束的話，對另一方之工作台上之工件執行曝 光處理，其期間，則將其中一方之工作台上之已完成曝光 之工件取出並搬出至工件載具，同時，將未曝光之工件搬 入其中一方之工作台上。 然而，如上面所述，準備2個工作台，不但裝置構成 較爲複雜，且裝置費用較貴，進而導致成本的提高。 此外，曝光處理及工件之搬入、搬出同時在同一工作 台上實施並不好。因爲，工件之校準及曝光處理中，於載 置著該工件之工作台執行其他工件之搬入、搬出的話，校 準及曝光處理中之工件很有可能因爲移動等而對曝光產生 不良影響》 如上面所示，傳統上，工件之交換時間於總曝光處理 時間中佔了極高之比例，因而導致裝置之利用效率的降低 。此外，爲了縮短工件之交換時間，可以考慮準備2個工 作台，然而，有裝置複雜且價格昂貴的問題。 爲了解決上述傳統技術之問題點，本發明之目的係在 提供，以相對較便宜的裝置構成，卻可縮短工件之交換時 間且提高裝置之利用效率的曝光裝置及曝光方法。 爲了解決上述課題，本發明係使工作台成爲具備：用 以保持複數工件之工件盤、及將工件盤載置於上面並進行 ⑧ -8- 201224675 支持之基台的構造，工件盤及基台係分別構成。準備 可裝卸（分離裝設）於基台之工件盤，將複數工件盤 任意一個裝設於基台上時，以工件盤及基台來構成工 〇 而且’將工件盤從基台分離出來，並將複數之工 置於該工件盤’再將載置著複數工件之工件盤載置於 上’ 一邊移動基台（亦即，工作台）一邊針對載置於 台上之複數工件，同時對每一片實施校準，並以光照 所射出之光介由光罩照射工件，來逐次對各工件進行 處理。 將複數工件盤內之一個工件盤載置於基台上並對 理之工件實施曝光處理之期間，執行將複數未處理之 載置於另一工件盤上之作業，上述曝光處理結束的話 將載置著經過曝光處理之工件的工件盤從基台取出。 而且，將上述載置著未處理工件之工件盤載置於 上，如上面所述，執行曝光處理。此外，同時從由基 出之工件盤回收已完成曝光之工件。 亦即，本發明係以下述方式來解決前述課題。 (1)針對載置於工作台上之複數工件，對每一 行校準，使光照射部所射出之光介由形成著圖案之光 射於工作台上之工件，來逐次對各工件執行曝光處理 光裝置，上述工作台，係由基台、及可裝卸於該基台 用以保持複數工件之工件盤所構成’於該基台上設置 工件盤時，以基台及工件盤來構成上述工作台’此外 複數 中之 作台 件載 基台 工作 射部 曝光 未處 工件 ，再 基台 台取 片進 罩照 之曝 上且 著該 ，準 -9- 201224675 備複數之上述工件盤。 於上述複數之工件盤，配設有用以使上述複數工件定 位於工件盤上之特定位置的定位手段，於上述基台，配設 有上述工件盤定位於特定位置之定位手段、及使該基台於 水平方向移動之移動機構。 (2) 上述（1)之曝光裝置，其係具備：用以將複數 工件載置於上述工件盤之工件搬入手段：及利用上述工件 搬入手段將載置著複數工件之工件盤載置於上述基台之上 的工件盤搬入手段。 (3) 係由基台、及可裝卸於該基台上之用以保持複 數工件之工件盤所構成，於該基台上設置著該工件盤時， 則具有由該基台及該工件盤所構成之工作台的工作台，針 對載置於該工作台上之複數工件，對每一片進行校準，並 以光照射部所射出之光介由形成著圖案之光罩對工作台上 之工件進行照射，而逐次對各工件實施曝光處理之曝光方 法，備有複數之上述工件盤。 上述曝光處理，其係實施：將複數工件載置於該工件 盤之第1工序：將載置著上述複數工件之上述工件盤載置 於基台上之第2工序；一邊移動由上述基台及上述工件盤 所構成之工作台一邊依序實施上述工件盤上之上述複數工 件之曝光的第3工序；將載置著完成曝光之上述複數工件 的上述工件盤從上述基台取出之第4工序；以及；由上述 工件盤取出完成曝光之上述複數工件的第5工序，上述第2 、第3及第4工序之實施中，實施上述第1工序及/或第5工 -10- ⑧ 201224675 序。 本發明’可以得到以下之效果。 (1) 以基台、及可裝卸於該基台上之用以複數工件 之工件盤來構成工作台’而將複數工件載置於工件盤並逐 次對各工件實施曝光處理，故於工作台上執行複數工件之 曝光處理的期間，可以將未處理之工件載置於另―工件盤 ，並從工件盤回收已完成曝光之工件。 此外’因爲係交換載置著複數工件載之各工件盤，故 無需於工作台上逐片交換工件，而可以連續且短時間之方 式實施複數工件之曝光。此外，校準及曝光中，也無需進 行工作台上之工件的交換。 所以，可以並行地實施曝光處理、工件之交換作業， 同時’縮短工件之曝光、交換所需要的時間，進而提高裝 置之利用效率。 (2) 工件盤只要能載置並移送複數之工件者即可， 可以相對較便宜之方式來構成。所以，相較於配設複數工 作台等時，可以較低成本來構成裝置。 【實施方式】 第1圖係本發明之實施例之曝光裝置之基本構成圖。 本實施例之曝光裝置，係由射出曝光光之光照射部1 、用以保持形成著用以執行曝光之圖案之光罩的光罩台2 、用以保持執行曝光處理之工件的工作台4、以及用以將 形成於光罩Μ之圖案投影於工作台4上之工件W的投影透鏡 -11 - 201224675 3等構成。 此外，曝光裝置，尙具備以執行光罩Μ及工件之定位 爲目的之校準機構、及用以控制上述各構成部位之動作的 控制部等，然而，此處將其省略。 光照射部1，於內部，具備用以放射曝光光之光源燈 、及用以反射來自燈之光的反射鏡等》 工作台4，其係用以保持用以轉錄形成於光罩Μ之圖案 的工件W’於本發明，工作台4，係由用以保持複數工件 之上部之工件盤6、及下部之基台5所構成，上部之工件盤 6，係可裝卸於基台5上，將上述工件盤6設置於基台5上時 ，以基台5及工件盤6來構成上述工作台4。 於基台5，裝設著工作台移動機構7。工作台移動機構 7，其係用以使基台5於工作台之平面內之ΧΥ方向、垂直 於工作台面之Ζ方向（上下方向）、以及以面垂於工作台 面之軸爲中心之Θ旋轉方向進行移動。 工件盤6，如上面所述，其係可對基台5進行裝卸（分 離裝設），於工件盤6，如該圖所示，係以相對於工件盤6 而定位於特定位置之方式，載置著複數（該圖中爲4件） 工件W。此外，於基台5上配設有定位手段，而以定位於 基台上之特定位置之方式來設置工件盤6。 本發明，針對1台曝光裝置，準備了複數之相同構成 的工件盤，第1圖，將基台5上之工件盤稱爲6Α，將其他工 件盤稱爲6Β、6C、6D。 如該圖所示，工件盤6Α係設置於基台5上，針對工件 201224675 盤6 A上之每一片工件W進行校準，光照射部1所射出之曝 光光介由形成著圖案之光罩Μ進行照射，而逐次對各工件 W進行曝光處理。 另一方面，於上述工件盤6Α上之工件W進行曝光處理 之期間，從基台5取出其他工件盤6Β、6C、6D。 工件盤6Β，例如，係載置著已完成曝光之工件W的工 件盤，於上述工件盤6Α上之工件進行曝光處理之期間，已 完成曝光之工件W，被從工件盤6Β上回收，而被搬送並收 容於用以收容已完成曝光之工件的工件載具（未圖示）。 此外，工件盤6C、6D，係載置著未曝光之工件的工件 盤，於工件盤6Α上之工件進行曝光處理之期間，從收容著 未曝光之工件之工件載具（未圖示），工件W被搬送至工 件盤6C、6D，而載置、定位於工件盤6C、6D上。 而且’工件盤6Α之曝光處理結束的話，工件盤6Α被 從基台5取出’已完成曝光之工件W，則被從工件盤6Α上 回收’而被搬送並收容於用以收容已完成曝光之工件的工 件載具（未圖示）。 另一方面’於工件盤6C上載置著4件未曝光之工件W 的話’則工件盤6 C被設置於基台5，並如上面所述，執行 曝光處理。重複以上之動作，來執行工件W之曝光處理。 如上面所示’藉由將複數之工件W載置於工件盤6上 並以每一個工件盤6進行交換，與傳統之將已完成處理之 工件逐件搬出工作台並將未處理之工件逐件搬入工作台時 相比’可以縮短工件之交換時間，進而縮短曝光處理整體 -13- 201224675 所需要之時間。 第2圖，係於第1圖所示之曝光裝置配設著工件及工件 盤之搬送機構之本發明之實施例之曝光裝置的構成立體圖 ，第3圖、第4圖，係工件盤及基台之具體的構成例圖。 曝光裝置之構成，係與第1圖所示者相同，而由：用 以射出曝光光之光照射部1、用以保持光罩之光罩台2、用 以保持工件之工作台4、以及投影透鏡3等所構成》光照射 部1，於內部，具備用以放射曝光光之光源燈、及用以反 射來自燈之光的反射鏡等。 工作台4，如前面所述，係由用以保持複數工件之工 件盤6、及基台5所構成，上部之工件盤6，其係可裝卸於 基台5上，於基台5上，設置著上述工件盤6時，以基台5及 工件盤6來構成上述工作台4。於工作台4，如前面所述， 裝設著工作台移動機構7»工作台移動機構7，係使工作台 4之基台5，於工作台4之平面內之XY方向、垂直於工作台 面之Z方向（上下方向）、以及以垂直於工作台面之軸爲 中心之Θ旋轉方向移動。 第3圖，係工件盤6之放大圖。於工件盤6，配設有使 複數之工件定位於工件盤上之特定位置的手段，於本實施 例，定位手段，係於其表面形成著剛好用以供所保持之工 件數之工件嵌入之凹部6 1。 本實施例時，工件係W晶圓，因爲盤6載置著4片晶圓 ，所以’形成4處圓形之凹部61。然而，其只是一個實例 ，載置於工件盤6之工件W的件數，可以爲4件以上，也可 ⑧ -14- 201224675 以爲2件、3件’此外，定位手段，亦可配設定位銷等來取 代凹部6 1。 第4圖’係工件盤6及基台5之關係的剖面圖。第4 (a )圖係工作台從基台分離之狀態，第4 ( b )圖係工件盤裝 設於基台之狀態。 如該圖所示，工件盤6及基台5係分別構成，工件盤6 可裝卸（分離裝設）於基台5。工件盤6，如上面所述，於 表面，只形成著供工件W之數載置之用以保持工件W的凹 部61。此外，於該凹部61，形成有用以提供工件W之吸附 保持用之真空的貫通孔62。此外，於工件盤6之下部（接 觸基台5之側），配設有構成用以執行基台5之定位之定位 手段的定位銷63。 於基台5，形成有以對工件盤6提供工件吸附保持用之 真空爲目的之真空吸附孔52。此外，於基台5之表面（接 觸工件盤6之側），配設有構成嵌合於工件盤6之定位銷63 之定位手段的定位孔5 1。 如第4(b)圖所示，將工件盤6載置於基台5上，並使 定位銷63嵌合於定位孔51的話，基台5之真空吸附孔52與 工件盤6之貫通孔62形成連通，而對工件盤6之凹部6 1供給 真空，而使工件W被吸附保持於凹部6 1內。 工件盤6，如前面所述，1台曝光裝置係使用複數個， 將某一工件盤載置於基台5上來進行曝光處理時，從另一 工件盤將已完成曝光處理之工件W回收至工件載具，此外 ，未處理之工件W被從工件載具載置於工件盤。此外，本 -15- 201224675 發明’需要複數之用以載置複數工件的工件盤6，若未使 用複數之該工件盤6的話’就無法達成本發明之課題之總 曝光處理時間的短縮。 本發明之曝光裝置，複數之工件W被載置於工件盤6 後，再被載置於工作台之基台5。 所以，必須執行從工件載具將未處理工件搬移至工件 盤、從已完成處理之工件工件盤回收至工件載具、將載置 著工件之工件盤搬送至基台5、以及從基台5進行工件盤之 搬送等之作業。此作業’也可以人力來實施，然而，以配 設用以執行該等作業之工件及工件盤之搬送機構爲佳。 用以執行上述工件及工件盤之搬入搬出之工件及工件 盤的搬送機構10,例如，可以爲如第2圖所示之構成。 第2圖中’於載置於第1工件載具放置台17A之第1工件 載具（晶圓•卡匣）16A’收容著要執行曝光處理之未曝 光之工件，於載置於第2工件載具放置台17B之第2工件載 具（晶圓•卡匣）1 6B，則收容著已完成曝光處理之工件 〇 工件移載手段1 4及工件盤搬送手段1 1，其係具備分別 用以保持工件或工件盤之搬送臂的機械人搬送機構。 於工件移載手段14及工件盤搬送手段11，裝設著分別 使工件及工件盤於平面內2方向（XY方向）移動、及使機 械臂141、111之方向進行旋轉移動之工件移載手段移動機 構15、及工件盤搬送手段移動機構12。 此外，於工件移載手段14與工件盤搬送手段12之間， ⑧ -16- 201224675 配設有第1工件盤放置場13A及第2工件盤放置場13B。 工件移載手段14,係利用工件移載機移動手段15,於 上述第1、第2工件載具16A、16B、與載置著工件盤6之第1 、第2工件盤放置場13A、13B之間移動，而以機械臂141， 夾持工件盤6上之工件W並搬送並收容於第2工件載具16B ，以及，將收容於第1工件載具16A之工件W搬送至第1工 件盤放置場13 A而載置於放置在其上之工件盤6之上。 工件盤搬送手段11，係利用工件盤搬送手段移動手段 12，於曝光機之基台5、與第1、第2工件盤放置場13A' 13B之間移動，而以機械臂111，夾持載置著載著於曝光機 之基台5之已完成曝光之工件W的工件盤6並搬送至第2工 件盤放置場13B，以及，夾持放置於第1工件盤放置場13A 之工件盤6並搬送至曝光機之基台5。 於第1工件盤放置場13A，放置著空的工件盤置，利用 工件移載手段14，從工件載具16A移載未處理之工件W。 載置著工件W之工件盤，係由工件盤搬送手段11，被從第 1工件盤放置場13A搬送至基台5上。 於第2工件盤放置場13B，放置著由工件盤搬送手段11 移載而載置之已完成曝光處理之工件W的工件盤，其後， 再以工件移載手段14，將已完成曝光處理之工件W回收至 工件載具13B。空的工件盤，則由工件移載手段14搬送至 第1工件盤放置場13A。 參照第2圖，針對利用工件及工件盤之搬送機構的曝 光裝置之工件的曝光手續進行說明。此外，於本實施例， -17- 201224675 係使用2個用以載置4件晶圓之工件盤（第2圖中，載置於 基台5上之工件盤爲6A，載置於第1工件盤放置場13A之工 件盤爲6B)。 於第1工件載具放置場17A，放置著收容有要執行曝光 處理之工件W的工件載具16A。此外，於第2工件載具放置 場17B，放置著收容有已完成曝光處理之工件的工件載具 16B。 於第1工件盤放置場13A，係放置著空的工件盤6A， 於第2工件盤放置場，則放置著空的工件盤6B (此外，第2 圖，係進一步之作業狀態，爲工件盤6A被載置於基台5上 、工件盤6B被載置於第1工件盤放置場13A之狀態）。 工件移載手段14，係從工件載具16A取出未曝光之工 件W，並將工件W載置於工件盤6A。4件工件W被載置於工 件盤6A的話，工件盤搬送手段11就夾持工件盤6A並搬運 至基台5上。 工件盤6A被載置基台而真空吸附保持著4件工件W的 話，曝光裝置就開始執行工件盤6A上之工件W的逐次曝光 處理。 亦即，如第5圖所示，進行工件盤上之第1工件W 1之 校準，介由光罩對第1工件W1照射曝光光來實施曝光。第 1工件W1之曝光處理結束的話，則停止曝光光之照射，並 以工作台移動機構7移動工作台4，而對第2工件W2，執行 與上述相同之曝光處理。是以，重複執行工件曝光及工作 台4之移動，就可對第3工件W3、第4工件W4實施曝光。 -18- ⑧ 201224675 另一方面，於執行將工件盤6A搬送至工作台4、及對 其上之工件W執行曝光之期間，工件移載手段1 4，則將第 2工件盤放置場13B之工件盤6B搬送至第1工件盤放置場 13A。而且，工件移載手段14，則從工件載具16A取出未 曝光之工件W，並依序將4件工件W載置於工件盤6B。此外 ，第2圖，係對工件盤6A上之工件W實施曝光，並將工件W 移載至工件盤6B之作業的狀態。 工件盤6A上之工件W完成曝光的話，工件盤搬送手段 11從基台5取出工件盤6A，並搬送至第2工件盤放置場13B 。而且，工件盤搬送手段11，將載置著4件工件W之工件 盤6B，從第1工件盤放置場13 A搬送至基台5上。 工件盤6B被移載至基台5並真空吸附保持著4件工件W 的話，則曝光裝置，如上面所述，依序對工件盤6B上之4 件工件實施曝光。 另一方面，工件移載手段14，從第2工件盤放置場13B 上之工件盤6A，依序取出已完成曝光處理之工件W並收容 於工件載具16B。工件移載手段14，若4件已完成曝光之工 件已回收至工件載具16B的話，則將工件盤6A從第2工件盤 放置場13B搬送至第1工件盤放置場13A。 而且’工件移載手段14，從工件載具16 A取出未曝光 之工件W，並依序將4件工件載置於工件盤6 A。 重複上述動作’進行收容於工件載具1 6 A之全部工件 W的曝光處理，並將已完成曝光處理之工件W回收至工件 載具16B。 -19- 201224675 第6圖，係本實施例之總曝光處理時間。 與上述先前技術之例相同，假設對4件工件進行曝光 處理時，1件工件之曝光時間爲1 0秒，此外，忽視光罩及 工件之定位時間。此外，工作台4之工件的交換時間，於 本實施例，係工件盤6之交換時間’然而’其時間係與先 前技術之工件之交換時間相同的5秒。此外’從工件盤6上 之第1工件移動至第2工件之曝光位置之工作台的移動時間 爲1秒。 傳統上，如第9圖所示，於從第1件工件之曝光處理至 第2件工件之曝光處理之間，需要以交換工件爲目的之時 間（5秒）。然而，於本發明，如第6圖所示，從第1件工 件至第2件工件之交換，爲工作台4之移動時間（1秒）， 縮短了工件之交換時間。藉此，4件工件之處理的總曝光 處理時間爲53秒，可以比傳統（第9圖）縮短12秒。 利用工件移載手段14將未曝光工件從工件載具16 A移 載至工件盤6、及從已完成曝光處理之工件之工件盤6回收 至工件載具16B之時間，係於工件盤6上之複數工件W進行 曝光之期間並行實施並於該期間結束。所以，總曝光處理 時間不會變長。 一般而言，於工件載具，係收容著約25件程度之工件 W。假設於工件載具16A只收容著24件工件W的話，則可以 縮短12秒X 6 = 72秒之總曝光時間。 本發明之曝光裝置，相較於傳統之曝光裝置，可以使 工件之交換時間縮短{(載置於工件盤6之工件W之件數）- -20- ⑧ 201224675 1 } χ {(傳統之工件w之交換時間）-(用以將曝光位置從 工件盤6上之第1工件W移至第2工件之工作台移動時間）} 〇 所以，即使載置於工件盤之工件之件數爲2件’相較 於傳統，也可以縮短總曝光處理時間。 此外，依據上式，載置於工件盤6之工件W之件數愈 多則可縮短之工件W交換時間愈多。然而’也可能有以下 之處形，例如，載置於工件盤6之工件W之件數若增加的 話，則利用工件移載手段14從工件盤6回收已完成曝光處 理之工件W、及將未處理之工件W移至工件盤6之時間變長 ，則工件W實施曝光之期間無法完成其動作’而使總曝光 處理時間變長。 所以，載置於工件盤6之工件的件數，應以利用工件 移載手段14將已完成曝光處理之工件W回收至工件盤6、 及將未處理之工件W移至工件盤6之時間在於載置於工件 盤6之工件進行曝光時間之範圍內的方式來進行調整爲佳 〇 此處，與未處理之工件W移至工件盤6、及從工件盤6 回收已完成曝光之工件W的時間相比，工件盤6上之工件W 之曝光處理所需要的時間較短時，將發生工件盤上之工件 之曝光處理結束，載置著下一要進行曝光之工件的工件盤 卻當未準備好的情形，因而產生等待時間而發生時間的損 失。 爲了解決此問題，也可以配設複數台之上述工件之搬 -21 - 201224675 送機構。 第7圖，係配設著2台之工件之搬送機構時的構成例。 如該圖所示，除了第1、第2工件載具放置台17A、17B 、第1、第2工件載具16A、16B以外，當配設有第3、第4工 件載具放置台17C、17D、第3、第4工件載具16C、16D， 於第1、3之工件載具16A、16C，收容著要執行曝光處理之 未曝光之工件，於第2、第3工件載具16B、16D，則收容著 已完成曝光處理之工件。 此外，配設著第1、第2工件移載手段14A、14B，於第 1工件移載手段14A、第2工件移載手段14B、與工件盤搬送 手段12之間，除了第1工件盤放置場13A及第2工件盤放置 場13B以外，尙配設著第3工件盤放置場13C及第4工件盤放 置場13D。 此外，工件盤搬送手段1 1，係利用工件盤搬送手段移 動機構12而於上述第1〜第4工件盤放置場13A〜13D之間 移動之構成。其他構成與第2圖所示者相同。 第7圖所示之工件及工件盤之搬送機構的動作，與前 述第2圖之說明相同。 亦即，首先，將空的工件盤6A〜6D設置於第1〜第4 工件盤放置場13A〜13D » 第1工件移載手段14A，從工件載具16A取出未曝光之 工件W並將工件W載置於工件盤6A。 而且，於利用工件盤搬送手段1 1將工件盤6 A搬送至基 台5、及執行曝光之期間，第1工件移載手段1 4 A，將工件 -22- ⑧ 201224675 盤6B搬送至第1工件盤放置場13A ’並從工件載具16A取出 未曝光之工件W，而依序將4件工件W載置於工件盤6B。 工件盤6A上之工件W之曝光結束，而以工件盤搬送手 段11將工件盤6A搬送至第2工件盤放置場13B的話，則第1 工件‘移載手段14A，從工件盤6A依序取出已完成曝光處理 之工件W並將其收容工件載具16B。而且，將工件盤6A從 第2工件盤放置場13B搬送至第1工件盤放置場13A。 此外，新追加之第2工件移載手段14B也與上述第1工 件移載手段14A之動作並行，而從工件載具16C取出未曝光 之工件W並將工件W載置於工件盤6C。 而且，於利用工件盤搬送手段11將工件盤6C搬送至基 台5、及執行曝光之期間，第2工件移載手段14B，將工件 盤6D搬送至第3工件盤放置場13C，從工件載具16C取出未 曝光之工件W並依據將4件工件W載置於工件盤6D。 工件盤6C上之工件W之曝光結束，而以工件盤搬送手 段11將工件盤6C搬送至第4工件盤放置場13D的話，則第2 工件移載手段14B，從工件盤6C依序取出已完成曝光處理 之工件W並將其收容於工件載具16D收容。而且，將工件 盤6C從第4工件盤放置場13D搬送至第3工件盤放置場13C 〇 如第7圖所示，藉由配設著2台之工件及工件盤之搬送 機構，可以使將未處理之工件移至工件盤6、及從工件盤6 回收已完成曝光之工件之時間節約大約—半的時間，即使 曝光裝置之工件盤6上之工件的曝光時間較短時，也不會 -23- 201224675 發生等待時間，而可以於短時間完成處理。 【圖式簡單說明】 第1圖係本發明之實施例之曝光裝置的基本構成圖。 第2圖係本發明之實施例之曝光裝置的構成立體圖。 第3圖係工件盤之構成例圖。 第4圖係工件盤及基台之詳細構成例的剖面圖。 第5圖係工件之曝光手續的說明圖。 第6圖係本實施例之總曝光處理時間的說明圖。 第7圖係配設著2台工件及工件盤之搬送機構時之構成 例圖。 第8圖係傳統之曝光裝置之構成例的立體圖。 第9圖係傳統之曝光裝置之總曝光處理時間的說明圖 【主要元件符號說明】 1 :光照射部 2 :光罩台 3 :投影透鏡 4 :工作台 5 :基台 6、6A〜6D :工件盤 7 :工作台移動機構 1 0 :工件及工件盤搬送手段 -24 ⑧ 201224675 1 1 :工件盤搬送手段 12:工件盤搬送手段移動機構 13 A〜1 3D :第1〜第4工件盤放置場 1 4 :工件移載手段 1 5 :工件移載手段移動機構 16A〜16D:第1〜第4工件載具（晶圓•卡匣） 17A〜17D:第1〜第4工件載具放置台 5 1 :定位孔 52 :真空吸附孔 6 1 :凹部 62 :貫通孔 63 :定位銷 111 :機械臂 141 :機械臂 Μ :光罩 W :工件 -25 -201224675 VI. Description of the Invention: [Technical Field] The present invention relates to an exposure apparatus and an exposure method for causing light emitted from a light-irradiating portion to be irradiated onto a workpiece on a table through a mask formed with a pattern. [Technology] In the manufacture of various electrical components, such as semiconductor devices, liquid crystal substrates, and micromachines, which require fine processing, in order to form various electronic components on a workpiece, light is irradiated onto the workpiece through a mask formed with a pattern. The step of exposing the mask pattern to the workpiece. Fig. 8 is a perspective view showing a configuration example of a conventional exposure apparatus. An exposure device which is a light illuminating portion 1 for emitting exposure light, a reticle stage 2 for holding a mask rim for forming a pattern for performing exposure, a table 4 for holding a workpiece for performing exposure processing, and a projection lens 3 for projecting a workpiece W formed on a pattern of the mask Μ on the table 4, a workpiece loading mechanism 20 for loading the workpiece W performing the exposure processing into the table 4, and a finishing process for performing exposure processing The workpiece W is carried out by the workpiece unloading mechanism 30 of the table 4 or the like. Further, the exposure apparatus includes a calibration mechanism for performing positioning of the mask and the workpiece, a control unit for controlling the operation of each of the components, and the like, but is omitted here. The light-irradiating portion 1 is internally provided with a light source lamp for radiating exposure light, a mirror for reflecting light from the lamp, and the like. The table 4' is used to hold the workpiece W for transcription of the pattern 201224675 formed in the mask μ. The workpiece w' includes, for example, various types such as a printed substrate, a glass substrate, and a crystal. In Fig. 8, the workpiece w shown is a circular crystal circle. The table 4' installer table moving mechanism 7. The table moving mechanism 7 is configured to rotate the table 4 in the XY direction in the plane of the table 4, in the Z direction (up and down direction) perpendicular to the table surface, and around the axis perpendicular to the table surface. Move in the direction. Further, among the exposure apparatuses, there is an exposure apparatus which does not include a projection lens but which affixes the mask pattern to the workpiece by adhering or approaching the mask and the workpiece, and refers to FIG. 8 for exposure of the workpiece using the exposure apparatus. The procedure is explained. The workpiece robot (transport robot) 21 of the workpiece loading mechanism 20 takes out the workpiece W from the workpiece carrier 22 (wafer, cassette) in which the workpiece (wafer) W that performs the exposure processing is stored. The workpiece robot 21 transports the removed workpiece W to the table 4 and mounts it on the table. On the surface of the table 4, a vacuum suction hole is formed to adsorb and hold the workpiece W». Further, a resist which reacts due to exposure light is applied to the surface of the workpiece W. After the positioning of the mask Μ and the workpiece W is performed, the exposure light is emitted from the light irradiation unit 1. The exposure light that is emitted is irradiated onto the workpiece W via the mask 投影 and the projection lens 3. The mask pattern formed on the mask is projected onto the workpiece W by the projection lens 3 to be exposed. The exposure time (the time when the workpiece is exposed to the exposure light) is set in advance -6-8 201224675. When the exposure time elapses, the light irradiation unit 1 stops the emission of the exposure light and ends the exposure processing. When the exposure processing is completed, the workpiece robot (the transport robot) 31 of the workpiece unloading mechanism 30 takes out the workpiece W from the table 4. The workpiece robot 31 transports the taken-out workpiece W to a workpiece carrier (wafer cassette) 32 for accommodating the workpiece subjected to the exposure processing. The exposure device repeats the above operation until the workpiece carrier 22 has no unprocessed workpiece W. Such an exposure apparatus is described, for example, in Patent Document 1. [Patent Document 1] Patent No. 3 1 5 2 1 3 3 SUMMARY OF THE INVENTION The total time (total exposure processing time) necessary for the exposure processing of the workpiece is not only the time (exposure time) for simply irradiating the exposure light,尙Includes the loading time (workpiece exchange time) when the workpiece that has been processed is removed from the workbench and the unprocessed workpiece is moved into the workbench. For example, assume that the exposure processing of four workpieces is performed. The exposure time of one workpiece is 10 seconds, and the exchange time of the workpiece on the table is 5 seconds. In addition, the positioning time of the mask and the workpiece is not considered. Figure 9 is the total exposure processing time for the above time. As shown in the figure, it takes 6 5 seconds. Among them, the workpiece exchange time is 25 seconds. In this case, the exchange time of the workpiece accounts for about 40% of the total exposure processing time. The exchange time of the workpiece is the time when the exposure is not performed, and in order to use the exposure apparatus efficiently, it is desirable to shorten the exchange time of the workpiece as much as possible. 201224675 In order to shorten the exchange time of the workpiece, for example, it is conceivable to prepare two work stations and perform exposure processing and workpiece transfer. That is, during the exposure processing of the workpiece on one of the worktables, the workpiece is carried from the workpiece carrier and placed on the other workbench, and when the exposure process is completed, the workpiece on the other workbench is finished. The exposure process is performed, during which the workpieces on the workbench of one of the workbench are taken out and carried out to the workpiece carrier, and the unexposed workpieces are loaded onto one of the worktables. However, as described above, the preparation of two work stations not only constitutes a complicated device, but also costs the device more expensively, which leads to an increase in cost. In addition, it is not preferable to perform the exposure processing and the loading and unloading of the workpiece on the same work station. In the calibration and exposure processing of the workpiece, when the other workpiece is loaded or unloaded on the table on which the workpiece is placed, the workpiece in the calibration and exposure processing may have an adverse effect on the exposure due to movement or the like. As shown, conventionally, the exchange time of the workpiece accounts for an extremely high proportion of the total exposure processing time, resulting in a decrease in the utilization efficiency of the device. Further, in order to shorten the exchange time of the workpiece, it is conceivable to prepare two work stations, however, there is a problem that the apparatus is complicated and expensive. In order to solve the above problems of the conventional art, it is an object of the present invention to provide an exposure apparatus and an exposure method which are constructed by a relatively inexpensive apparatus, which can shorten the exchange time of the workpiece and improve the utilization efficiency of the apparatus. In order to solve the above problems, the present invention provides a workbench having a workpiece disk for holding a plurality of workpieces, and a base plate on which the workpiece disk is placed and supported by 8-8-201224675, a workpiece plate and a base plate. They are composed separately. Preparing a workpiece disc that can be loaded and unloaded (separately mounted) on the base, and when any of the plurality of workpiece discs is mounted on the base, the workpiece disc and the base are configured to form a workpiece and the workpiece disc is separated from the base. And placing a plurality of jobs on the workpiece plate and then placing the workpiece on which the plurality of workpieces are placed on the side while moving the base (ie, the table) against the plurality of workpieces placed on the table, and simultaneously Each piece is calibrated, and the light emitted by the illumination is irradiated to the workpiece through the reticle to process the workpieces one by one. When a workpiece disk in a plurality of workpiece disks is placed on the base and the workpiece is subjected to exposure processing, an operation of placing the plurality of unprocessed loads on the other workpiece disk is performed, and the exposure processing is completed. The workpiece disk on which the exposed workpiece is placed is taken out from the base. Further, the above-described workpiece on which the unprocessed workpiece is placed is placed on the disc, and as described above, the exposure processing is performed. In addition, the exposed workpiece is recovered from the base workpiece tray at the same time. That is, the present invention solves the aforementioned problems in the following manner. (1) For each of the plurality of workpieces placed on the table, each row is calibrated, and the light emitted from the light-irradiating portion is subjected to exposure processing for each of the workpieces successively through the workpieces on which the light is formed on the table. In the optical device, the workbench is composed of a base plate and a workpiece plate detachably mounted on the base plate for holding a plurality of workpieces. When the workpiece plate is placed on the base plate, the base plate and the workpiece plate are used to form the work. In addition, in the plural, the workpiece is loaded on the base, and the base is exposed to the workpiece. The base is taken into the cover and exposed to the cover. The above-mentioned workpiece plate is prepared by the -9-201224675. Positioning means for positioning the plurality of workpieces at a specific position on the workpiece disk is disposed on the plurality of workpiece disks, and the positioning means for positioning the workpiece disk at a specific position and the base are disposed on the base A moving mechanism that moves in the horizontal direction. (2) The exposure apparatus according to (1) above, comprising: a workpiece loading means for loading a plurality of workpieces on the workpiece disk: and mounting the workpiece disk on which the plurality of workpieces are placed by the workpiece loading means The workpiece tray above the abutment is moved in. (3) comprising a base plate and a workpiece disk detachably mounted on the base plate for holding a plurality of workpieces, wherein when the workpiece disk is disposed on the base plate, the base plate and the workpiece disk are provided The workbench of the workbench is calibrated for each of the plurality of workpieces placed on the workbench, and the light emitted by the light-irradiating portion is passed through the patterned reticle to the workpiece on the workbench. An exposure method in which irradiation is performed and exposure processing is performed on each workpiece one by one is provided, and a plurality of the above-described workpiece disks are provided. The exposure processing is performed in a first step of placing a plurality of workpieces on the workpiece disk: a second step of placing the workpiece disk on which the plurality of workpieces are placed on a base; and moving the base station And a third step of sequentially performing exposure of the plurality of workpieces on the workpiece disk on a table formed by the workpiece disk; and discharging the workpiece disk on which the plurality of workpieces having been exposed are placed from the base And a fifth step of extracting the plurality of workpieces that have been exposed by the workpiece disk, and performing the first step and/or the fifth work in the implementation of the second, third, and fourth steps. sequence. The present invention can achieve the following effects. (1) Forming a table with a base plate and a workpiece plate for loading and unloading the workpiece on the base plate, and placing a plurality of workpieces on the workpiece plate and sequentially exposing each workpiece to the workpiece, so on the workbench During the exposure processing of the plurality of workpieces, the unprocessed workpiece can be placed on another workpiece tray, and the workpiece that has been exposed is recovered from the workpiece tray. In addition, since the workpieces are loaded by the plurality of workpieces, it is not necessary to exchange the workpieces one by one on the table, and the exposure of the plurality of workpieces can be performed continuously and in a short time. In addition, there is no need to exchange workpieces on the workbench during calibration and exposure. Therefore, the exposure processing and the workpiece exchange operation can be performed in parallel, and the time required for exposure and exchange of the workpiece can be shortened, thereby improving the utilization efficiency of the device. (2) The workpiece disk can be configured in a relatively inexpensive manner as long as it can load and transfer a plurality of workpieces. Therefore, the device can be constructed at a lower cost than when a plurality of workstations are provided. [Embodiment] Fig. 1 is a view showing the basic configuration of an exposure apparatus according to an embodiment of the present invention. The exposure apparatus of the present embodiment is a light irradiation unit 1 that emits exposure light, a mask table 2 for holding a mask that forms a pattern for performing exposure, and a table 4 for holding a workpiece that performs exposure processing. And a projection lens -11 - 201224675 3 for constructing a workpiece W formed on the table 4 by a pattern formed on the mask. Further, the exposure apparatus includes a calibration mechanism for performing positioning of the mask and the workpiece, a control unit for controlling the operation of each of the components, and the like, but is omitted here. The light irradiation unit 1 includes a light source lamp for emitting exposure light and a mirror for reflecting light from the lamp, and the like, and a table 4 for holding a pattern for transcription and formation on the mask The workpiece W is formed by the workpiece tray 6 for holding the upper portion of the plurality of workpieces and the lower base 5, and the upper workpiece tray 6 is detachable from the base 5, When the workpiece disk 6 is placed on the base 5, the table 4 is formed by the base 5 and the workpiece disk 6. On the base 5, a table moving mechanism 7 is mounted. The table moving mechanism 7 is configured to rotate the base 5 in the ΧΥ direction in the plane of the table, perpendicular to the Ζ direction of the table surface (up and down direction), and to rotate around the axis of the table surface. Move in the direction. The workpiece disk 6, as described above, can be attached (detached) to the base 5, and the workpiece disk 6, as shown in the figure, is positioned at a specific position relative to the workpiece disk 6, A plurality of workpieces (four in the figure) are placed on the workpiece W. Further, a positioning means is disposed on the base 5, and the workpiece disk 6 is disposed in a specific position positioned on the base. In the present invention, a plurality of workpiece disks having the same configuration are prepared for one exposure device. In the first drawing, the workpiece disk on the base 5 is referred to as 6 turns, and the other workpiece plates are referred to as 6 turns, 6C, and 6D. As shown in the figure, the workpiece disk 6 is erected on the base 5, and each of the workpieces W on the workpiece 201224675 is calibrated, and the exposure light emitted from the light irradiation unit 1 is formed by a pattern mask. Irradiation is performed, and each workpiece W is subjected to exposure processing one by one. On the other hand, while the workpiece W on the workpiece disk 6 is subjected to the exposure process, the other workpiece disks 6A, 6C, and 6D are taken out from the base 5. The workpiece disk 6 is, for example, a workpiece disk on which the workpiece W having been exposed is placed, and during the exposure process of the workpiece on the workpiece disk 6 , the exposed workpiece W is recovered from the workpiece disk 6 It is transported and housed in a workpiece carrier (not shown) for accommodating the workpiece that has been exposed. Further, the workpiece disks 6C and 6D are a workpiece disk on which an unexposed workpiece is placed, and a workpiece carrier (not shown) that accommodates an unexposed workpiece is received while the workpiece on the workpiece disk 6 is exposed. The workpiece W is conveyed to the workpiece disks 6C and 6D, and placed and positioned on the workpiece disks 6C and 6D. Further, when the exposure processing of the workpiece disk 6 is completed, the workpiece disk 6 is taken out from the base 5, and the workpiece W that has been exposed is recovered from the workpiece disk 6 and transported and stored in the container for receiving the completed exposure. Workpiece carrier for the workpiece (not shown). On the other hand, if four unexposed workpieces W are placed on the workpiece disk 6C, the workpiece disk 6 C is placed on the base 5, and exposure processing is performed as described above. The above actions are repeated to perform the exposure processing of the workpiece W. As shown above, by placing a plurality of workpieces W on the workpiece tray 6 and exchanging them with each of the workpiece trays 6, the workpieces that have been processed have been removed from the table one by one and the unprocessed workpieces are removed one by one. When the part is moved into the workbench, it can shorten the exchange time of the workpiece, and thus shorten the time required for the overall exposure processing-13-201224675. Fig. 2 is a perspective view showing a configuration of an exposure apparatus according to an embodiment of the present invention in which an exposure apparatus shown in Fig. 1 is provided with a workpiece and a workpiece disk transfer mechanism, and Figs. 3 and 4 are a workpiece disk and a base. A detailed example of the structure of the station. The configuration of the exposure apparatus is the same as that shown in Fig. 1, and is composed of a light irradiation unit 1 for emitting exposure light, a mask unit 2 for holding a mask, a table 4 for holding a workpiece, and The light-emitting unit 1 configured by the projection lens 3 or the like includes a light source lamp for radiating exposure light, a mirror for reflecting light from the lamp, and the like. The work table 4, as described above, is composed of a workpiece disk 6 for holding a plurality of workpieces, and a base plate 5, and the upper workpiece plate 6 is detachably mounted on the base 5 on the base 5, When the workpiece disk 6 is provided, the table 4 is formed by the base 5 and the workpiece disk 6. On the table 4, as described above, the table moving mechanism 7»the table moving mechanism 7 is installed, so that the base 5 of the table 4 is in the XY direction in the plane of the table 4, perpendicular to the table surface. The Z direction (up and down direction) and the Θ rotation direction centering on the axis perpendicular to the work surface. Fig. 3 is an enlarged view of the workpiece disk 6. The workpiece tray 6 is provided with means for positioning a plurality of workpieces at a specific position on the workpiece disc. In the embodiment, the positioning means is formed on the surface thereof to be embedded with the workpiece just for the number of workpieces to be held. Concave portion 61. In the present embodiment, the workpiece is a W wafer, and since the wafer 6 is placed on four wafers, four circular recesses 61 are formed. However, it is only an example, and the number of workpieces W placed on the workpiece disk 6 can be 4 or more, or 8 - 14 - 201224675 for 2 pieces and 3 pieces 'in addition, the positioning means can also be configured with a set position. A pin or the like is substituted for the recess 61. Fig. 4 is a cross-sectional view showing the relationship between the workpiece disk 6 and the base 5. The fourth (a) is the state in which the table is separated from the base, and the fourth (b) is the state in which the workpiece is mounted on the base. As shown in the figure, the workpiece disk 6 and the base 5 are respectively configured, and the workpiece disk 6 is detachable (separately mounted) on the base 5. The workpiece disk 6, as described above, is formed on the surface only by the recess 61 for holding the workpiece W for the number of workpieces W. Further, a through hole 62 for providing a vacuum for holding and holding the workpiece W is formed in the recess 61. Further, at a lower portion of the workpiece disk 6 (on the side contacting the base 5), positioning pins 63 constituting a positioning means for performing positioning of the base 5 are disposed. On the base 5, a vacuum suction hole 52 for supplying a vacuum for holding and holding a workpiece to the workpiece disk 6 is formed. Further, on the surface of the base 5 (the side contacting the workpiece disk 6), a positioning hole 51 for constituting a positioning means fitted to the positioning pin 63 of the workpiece disk 6 is disposed. As shown in FIG. 4(b), when the workpiece disk 6 is placed on the base 5 and the positioning pin 63 is fitted into the positioning hole 51, the vacuum suction hole 52 of the base 5 and the through hole of the workpiece disk 6 are formed. 62 is formed in communication, and a vacuum is supplied to the concave portion 61 of the workpiece disk 6, so that the workpiece W is adsorbed and held in the concave portion 61. The workpiece disk 6 has a plurality of exposure devices as described above, and when a certain workpiece disk is placed on the base 5 for exposure processing, the workpiece W that has been subjected to the exposure process is recovered from another workpiece disk. The workpiece carrier, in addition, the unprocessed workpiece W is placed on the workpiece tray from the workpiece carrier. Further, the present invention -15-201224675 requires a plurality of workpiece disks 6 for placing a plurality of workpieces, and if the plurality of workpiece disks 6 are not used, the total exposure processing time of the subject of the present invention cannot be shortened. In the exposure apparatus of the present invention, a plurality of workpieces W are placed on the workpiece tray 6, and are placed on the base 5 of the table. Therefore, it is necessary to carry out the transfer of the unprocessed workpiece from the workpiece carrier to the workpiece tray, the recovery from the workpiece tray that has been processed to the workpiece carrier, the transfer of the workpiece tray on which the workpiece is placed to the base 5, and from the base 5 Perform work such as transferring the workpiece tray. This operation ' can also be carried out manually. However, it is preferable to provide a transfer mechanism for the workpiece and the workpiece disk for performing the work. The conveying mechanism 10 for executing the workpiece and the workpiece tray in which the workpiece and the workpiece disk are carried in and out can be configured as shown in Fig. 2, for example. In Fig. 2, 'the first workpiece carrier (wafer, cassette) 16A' placed on the first workpiece carrier placement table 17A accommodates the unexposed workpiece to be subjected to the exposure processing, and is placed on the second The second workpiece carrier (wafer/cartridge) 16B of the workpiece carrier placement table 17B accommodates the workpieces that have been subjected to the exposure processing, the workpiece transfer device 14 and the workpiece disk transporting device 1 1, respectively. A robot transport mechanism for holding a transfer arm of a workpiece or a workpiece disc. The workpiece transfer means 14 and the workpiece disk transfer means 11 are provided with workpiece transfer means for moving the workpiece and the workpiece disk in two directions (XY direction) in the plane and for rotating the directions of the robot arms 141, 111, respectively. The moving mechanism 15 and the workpiece disk transporting means moving mechanism 12. Further, between the workpiece transfer means 14 and the workpiece disk transfer means 12, the first workpiece disk placement field 13A and the second workpiece disk placement field 13B are disposed from 8 - 16 to 201224675. The workpiece transfer means 14 uses the workpiece transfer machine moving means 15 to place the fields 13A, 13B on the first and second workpiece carriers 16A, 16B and the first and second workpiece carriers on which the workpiece tray 6 is placed. Moving between the workpieces W, the workpiece W on the workpiece disk 6 is held by the robot arm 141, and is transported to the second workpiece carrier 16B, and the workpiece W accommodated in the first workpiece carrier 16A is transferred to the first workpiece. The disk is placed on the field 13 A and placed on top of the workpiece disk 6 placed thereon. The workpiece disk transporting means 11 is moved between the base 5 of the exposure machine and the first and second workpiece disk placement fields 13A' to 13B by the workpiece disk transport means moving means 12, and is clamped by the robot arm 111. The workpiece disk 6 carrying the exposed workpiece W on the base 5 of the exposure machine is placed and transported to the second workpiece disk placement field 13B, and the workpiece disk 6 placed in the first workpiece disk placement field 13A is held. And transported to the base station 5 of the exposure machine. In the first workpiece disk placement field 13A, an empty workpiece disk is placed, and the unprocessed workpiece W is transferred from the workpiece carrier 16A by the workpiece transfer means 14. The workpiece disk on which the workpiece W is placed is transported from the first workpiece disk placement field 13A to the base 5 by the workpiece disk transfer means 11. In the second workpiece disk placement field 13B, the workpiece disk on which the workpiece W having been subjected to the exposure processing carried by the workpiece disk transfer means 11 is placed is placed, and thereafter, the exposure processing is completed by the workpiece transfer means 14. The workpiece W is recovered to the workpiece carrier 13B. The empty workpiece disk is transported by the workpiece transfer means 14 to the first workpiece disk placement field 13A. Referring to Fig. 2, an exposure procedure of a workpiece of an exposure device using a workpiece and a transfer mechanism of a workpiece disk will be described. In addition, in the present embodiment, -17-201224675 uses two workpiece disks for placing four wafers (in FIG. 2, the workpiece disk placed on the base 5 is 6A, and is placed on the first The workpiece disk of the workpiece disk placement field 13A is 6B). In the first workpiece carrier placement field 17A, the workpiece carrier 16A containing the workpiece W on which the exposure processing is to be performed is placed. Further, in the second workpiece carrier placement field 17B, the workpiece carrier 16B containing the workpiece having been subjected to the exposure processing is placed. In the first workpiece disk placement field 13A, an empty workpiece disk 6A is placed, and in the second workpiece disk placement field, an empty workpiece disk 6B is placed (in addition, the second drawing is a further working state, which is a workpiece disk). 6A is placed on the base 5, and the workpiece disk 6B is placed in the state of the first workpiece disk placement field 13A). The workpiece transfer means 14 takes out the unexposed workpiece W from the workpiece carrier 16A, and mounts the workpiece W on the workpiece tray 6A. When the four workpieces W are placed on the workpiece tray 6A, the workpiece tray transporting means 11 holds the workpiece tray 6A and transports it to the base 5. When the workpiece disk 6A is placed on the base and the four workpieces W are vacuum-sucked, the exposure device starts the sequential exposure processing of the workpiece W on the workpiece disk 6A. That is, as shown in Fig. 5, the first workpiece W1 on the workpiece disk is calibrated, and the exposure is performed by irradiating the first workpiece W1 with exposure light through the mask. When the exposure processing of the first workpiece W1 is completed, the irradiation of the exposure light is stopped, and the table 4 is moved by the table moving mechanism 7, and the same exposure processing as described above is performed on the second workpiece W2. Therefore, the third workpiece W3 and the fourth workpiece W4 can be exposed by repeatedly performing the workpiece exposure and the movement of the table 4. -18- 8 201224675 On the other hand, during the execution of the transfer of the workpiece tray 6A to the table 4 and the exposure of the workpiece W thereon, the workpiece transfer means 14 places the second workpiece tray 13B. The workpiece disk 6B is transferred to the first workpiece disk placement field 13A. Further, the workpiece transfer means 14 takes out the unexposed workpiece W from the workpiece carrier 16A, and sequentially loads the four workpieces W on the workpiece disk 6B. Further, Fig. 2 is a view showing a state in which the workpiece W on the workpiece disk 6A is exposed and the workpiece W is transferred to the workpiece disk 6B. When the workpiece W on the workpiece disk 6A is exposed, the workpiece disk transfer unit 11 takes out the workpiece disk 6A from the base 5 and transports it to the second workpiece disk placement field 13B. Further, the workpiece disk transporting means 11 transports the workpiece disk 6B on which four workpieces W are placed, from the first workpiece disk placement field 13 A to the base 5. When the workpiece disk 6B is transferred to the base 5 and the four workpieces W are vacuum-sucked, the exposure apparatus sequentially exposes the four workpieces on the workpiece disk 6B as described above. On the other hand, the workpiece transfer means 14 sequentially takes out the workpiece W which has been subjected to the exposure processing from the workpiece tray 6A on the second workpiece tray placement field 13B, and accommodates it in the workpiece carrier 16B. The workpiece transfer means 14 transports the workpiece disk 6A from the second workpiece disk placement field 13B to the first workpiece disk placement field 13A if the four exposed workpieces have been collected in the workpiece carrier 16B. Further, the workpiece transfer means 14 takes out the unexposed workpiece W from the workpiece carrier 16 A, and sequentially loads four workpieces on the workpiece tray 6 A. The above operation is repeated. The exposure processing of all the workpieces W accommodated in the workpiece carrier 16A is performed, and the workpiece W having been subjected to the exposure processing is collected to the workpiece carrier 16B. -19- 201224675 Fig. 6 is the total exposure processing time of this embodiment. As in the case of the prior art described above, it is assumed that when exposure processing is performed on four workpieces, the exposure time of one workpiece is 10 seconds, and the positioning time of the mask and the workpiece is ignored. Further, the exchange time of the workpiece of the table 4 is, in the present embodiment, the exchange time of the workpiece tray 6 'however' the time is 5 seconds which is the same as the exchange time of the workpiece of the prior art. Further, the movement time of the table from the first workpiece on the workpiece disk 6 to the exposure position of the second workpiece was 1 second. Conventionally, as shown in Fig. 9, the time for exchanging the workpiece (5 seconds) is required between the exposure processing of the first workpiece and the exposure processing of the second workpiece. However, in the present invention, as shown in Fig. 6, the exchange of the workpiece from the first workpiece to the second workpiece is the movement time (1 second) of the table 4, shortening the exchange time of the workpiece. As a result, the total exposure processing time for the processing of the four workpieces is 53 seconds, which can be shortened by 12 seconds compared to the conventional (Fig. 9). The time during which the unexposed workpiece is transferred from the workpiece carrier 16 A to the workpiece tray 6 by the workpiece transfer means 14 and the workpiece tray 6 of the workpiece that has been subjected to the exposure processing is recovered to the workpiece carrier 16B is attached to the workpiece tray 6 The period during which the plurality of workpieces W are exposed is performed in parallel and ends during this period. Therefore, the total exposure processing time does not become longer. In general, about 25 pieces of workpiece W are housed in the workpiece carrier. Assuming that the workpiece carrier 16A accommodates only 24 workpieces W, the total exposure time of 12 seconds X 6 = 72 seconds can be shortened. The exposure apparatus of the present invention can shorten the exchange time of the workpiece compared to the conventional exposure apparatus {(the number of workpieces W placed on the workpiece disk 6) - -20- 8 201224675 1 } χ {(traditional workpiece w exchange time) - (the movement time for moving the exposure position from the first workpiece W on the workpiece disk 6 to the second workpiece)} Therefore, even if the number of workpieces placed on the workpiece disk is 2 The piece 'can reduce the total exposure processing time compared to the conventional one. Further, according to the above formula, the more the number of the workpieces W placed on the workpiece disk 6, the more the workpiece W can be shortened. However, it is also possible to have the following shape. For example, if the number of workpieces W placed on the workpiece disk 6 is increased, the workpiece W that has been subjected to the exposure processing is recovered from the workpiece disk 6 by the workpiece transfer means 14, and When the time during which the unprocessed workpiece W is moved to the workpiece disk 6 becomes long, the operation of the workpiece W during the exposure period cannot be completed, and the total exposure processing time becomes long. Therefore, the number of workpieces placed on the workpiece tray 6 should be recovered by the workpiece transfer means 14 when the workpiece W having been subjected to the exposure processing is recovered to the workpiece tray 6, and the unprocessed workpiece W is moved to the workpiece tray 6. The adjustment is performed in such a manner that the workpiece placed on the workpiece tray 6 is within the exposure time range, and the unprocessed workpiece W is moved to the workpiece tray 6, and the workpiece W having been exposed is recovered from the workpiece tray 6. When the time required for the exposure processing of the workpiece W on the workpiece tray 6 is shorter than the time, the exposure processing of the workpiece on the workpiece tray is completed, and the workpiece tray of the next workpiece to be exposed is placed. Unprepared situations, resulting in a loss of time due to waiting time. In order to solve this problem, it is also possible to provide a plurality of the above-mentioned workpieces to be transported - 21 - 201224675. Fig. 7 is a configuration example of a case where two workpiece transfer mechanisms are arranged. As shown in the figure, in addition to the first and second workpiece carrier placement stages 17A and 17B and the first and second workpiece carriers 16A and 16B, the third and fourth workpiece carrier placement stages 17C are disposed. The 17D, the third and fourth workpiece carriers 16C and 16D, the workpiece carriers 16A and 16C of the first and third, accommodate the unexposed workpieces to be subjected to the exposure processing, and the second and third workpiece carriers 16B. 16D, which houses the workpiece that has been exposed. Further, the first and second workpiece transfer devices 14A and 14B are disposed between the first workpiece transfer device 14A, the second workpiece transfer device 14B, and the workpiece disk transfer device 12, except for the first workpiece disk. In addition to the field 13A and the second workpiece disk placement field 13B, the third workpiece disk placement field 13C and the fourth workpiece disk placement field 13D are disposed. Further, the workpiece disk transporting means 1 1 is configured to move between the first to fourth workpiece disk placing fields 13A to 13D by the workpiece disk transporting means moving mechanism 12. The other configuration is the same as that shown in Fig. 2. The operation of the workpiece and the transfer mechanism of the workpiece disk shown in Fig. 7 is the same as that described in the second drawing. That is, first, the empty workpiece disks 6A to 6D are placed in the first to fourth workpiece disk placement fields 13A to 13D » the first workpiece transfer device 14A, and the unexposed workpiece W is taken out from the workpiece carrier 16A and the workpiece is removed. W is placed on the workpiece tray 6A. Further, during the period in which the workpiece tray 6A is transported to the base 5 by the workpiece disk transporting means 1 and the exposure is performed, the first workpiece transfer means 1 4 A transports the workpiece -22-8 201224675 disk 6B to the first The workpiece tray is placed in the field 13A' and the unexposed workpiece W is taken out from the workpiece carrier 16A, and the four workpieces W are sequentially placed on the workpiece tray 6B. When the exposure of the workpiece W on the workpiece disk 6A is completed, and the workpiece disk 6A is transported to the second workpiece disk placement field 13B by the workpiece disk transporting means 11, the first workpiece 'transfer means 14A is sequentially taken out from the workpiece disk 6A. The exposed workpiece W has been completed and received into the workpiece carrier 16B. Further, the workpiece disk 6A is transferred from the second workpiece disk placement field 13B to the first workpiece disk placement field 13A. Further, the newly added second workpiece transfer means 14B is taken in parallel with the operation of the first workpiece transfer means 14A, and the unexposed workpiece W is taken out from the workpiece carrier 16C and the workpiece W is placed on the workpiece disk 6C. When the workpiece tray 6C is transported to the base 5 by the workpiece disk transporting means 11, and the exposure is performed, the second workpiece transfer means 14B transports the workpiece disk 6D to the third workpiece disk placement field 13C, and the workpiece is loaded from the workpiece. The 16C takes out the unexposed workpiece W and places the four workpieces W on the workpiece tray 6D. When the exposure of the workpiece W on the workpiece disk 6C is completed, and the workpiece disk 6C is transported to the fourth workpiece disk placement field 13D by the workpiece disk transporting means 11, the second workpiece transfer means 14B is sequentially taken out from the workpiece disk 6C. The workpiece W subjected to the exposure processing is received and housed in the workpiece carrier 16D. Further, the workpiece disk 6C is transferred from the fourth workpiece disk placement field 13D to the third workpiece disk placement field 13C. As shown in Fig. 7, by providing two workpieces and a workpiece disk transfer mechanism, it is possible to The time taken for the unprocessed workpiece to be moved to the workpiece tray 6 and the workpiece that has been exposed to be recovered from the workpiece tray 6 is saved for about half of the time, even if the exposure time of the workpiece on the workpiece tray 6 of the exposure device is short. -23- 201224675 A waiting time has occurred and processing can be completed in a short time. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the basic configuration of an exposure apparatus according to an embodiment of the present invention. Fig. 2 is a perspective view showing the configuration of an exposure apparatus according to an embodiment of the present invention. Fig. 3 is a diagram showing an example of the structure of a workpiece disk. Fig. 4 is a cross-sectional view showing a detailed configuration example of a workpiece disk and a base. Fig. 5 is an explanatory view of the exposure procedure of the workpiece. Fig. 6 is an explanatory diagram of the total exposure processing time of the present embodiment. Fig. 7 is a view showing an example of a configuration in which two workpieces and a workpiece tray transfer mechanism are disposed. Fig. 8 is a perspective view showing a configuration example of a conventional exposure apparatus. Fig. 9 is an explanatory diagram of the total exposure processing time of the conventional exposure apparatus [Description of main components] 1 : Light irradiation section 2: Mask table 3: Projection lens 4: Table 5: Base 6, 6A to 6D: Workpiece disk 7: Table moving mechanism 10: Workpiece and workpiece disk transfer means - 24 8 201224675 1 1 : Work disk transfer means 12: Work disk transfer means moving mechanism 13 A to 1 3D : 1st to 4th workpiece disk placement Field 1 4: workpiece transfer means 1 5 : workpiece transfer means moving mechanism 16A to 16D: 1st to 4th workpiece carriers (wafer and cassette) 17A to 17D: 1st to 4th workpiece carrier placing table 5 1 : positioning hole 52 : vacuum suction hole 6 1 : recess 62 : through hole 63 : positioning pin 111 : robot arm 141 : arm Μ : reticle W : workpiece - 25 -