201103848 六、發明說明： 【發明所屬之技術領域】 本發明疋有關於一種基板處理糸統及其基板搬運裝置，且 特別是有關於一種可偵測位置異常之基板及基板缺角的基板 處理系統及其基板搬運裝置。 【先前技術】 在顯示裝置的製程中，由於基板需要經過多道製程程序， 因此必須使用搬運裝置來在各道製程程序之間搬運基板。目前 的作法是藉由機械手臂將基板由儲放匣(Cassette)中取出，並運 送至製程機台上進行製程反應，之後再於製程結束後，從機台 上將基板送回至儲放匣内，以進行一系列的製程步驟。 而且，為獲得儲放E内所存放的基板數量或其他資訊，機 械手臂在伸入儲放匣内拾取基板前，會先在距離儲放匣一特定 =離之處做上昇與下降的動作，以便於藉由設置在機械手臂前 鈿的映射感測器（mapping sensor)來感測存放在儲放匣内之基 板的資訊。 然而，當存放在儲放匣内的基板位置異常而過於突出儲放 籲£外時則谷易發生機械手臂在進行映射感測時撞擊到突出的 基板因而導致基板破損。此時，必須暫停整個搬運流程，並 以人工的方式排除破片。如此一來，將導致維修成本提高及浪 費人力的問題。 此外’近年來顯示面板的尺寸日趨擴大，而大尺寸的玻璃 ^板在運送過程中容易發生缺角或破損的情形，但由於習知的 /土板搬運裝置並沒有偵測缺角的功能因此當具有缺角的基板 3待被移it至製程機台上時’才能因為基板之尺寸不符等因素 而被機台操作者發覺。這樣不僅造成機台操作者的困擾，同時 也會耗費較多的製造工時。 201103848 【發明内容】 有鑑於此，本發明的目的就是在提供一種基板搬運裝置， 其可在做映射感測時，同時偵測欲拾取的基板是否有擺放位置 突出的情況，以避免撞傷基板。 本發明的再一目的是提供一種基板搬運裝置，其可在將基 板運送至製程機台上前，先偵測基板是否有缺角的情況。 本發明的又_目的是提供-種基域理祕，其可在做映 射感測時，同時感測儲放E内的基板是否有突出的情況，以避 免撞傷基板。 本發明的另-目的是提供—種基板處理系統，其可在將基 板從儲放E内取出後，先伯測基板是否有缺角的情況。 本發明提出-種基板搬運裝置，包括域、承載單元以及 至/基板犬出感測器。其中，承載單元適於在一待機位置與 至少:工作位置之間移動，並具有承載面與彼此相對的第一端 及第二端:且第-端係連接至主體。基板突出感測器則是配置 於承載單7L上’並位於其第二端。而且，基板突出感測器具有 第一感測面，其係與承載單元之承載面朝向同一方向。 籲本發明提出-種基板處理系統，包括儲放g與上述基板搬 運裝置。料，儲放E具有多個容置空間，用以儲放多個基板。 而且這些谷置空間是沿一排列方向彼此層疊，基板即是分別 位於對應之容置空間内。此外，承载單元之承载面與基板突出 感測器之第一感測面均朝向此排列方向。 在本發明的較佳實施例中，上述之主體包括一校正平台， 具有彼此相對的第一側邊與第二側邊，而承載單元從工作^置 移至待機位置時，係經由第二側邊朝向第一側邊移動。 在本發明的較佳實施例中，上述之基板搬運裝置更包括多 201103848 =破片感湘，配置於上述校正平台上，並鄰近料第二側 在本發明的較佳實施例中，上述之 單元’配置於校正平台旁’並位於;一置二 的較佳實施例中’上述之基板搬運裝置更包括至 ίΓ ίί感測11，配置於承載單元之轉面上，並鄰近承 載早70的第一端。 在本^明的較佳實施例中，上述之基板搬運裝置更包括-映射感測器(mapping sensor)，配置於承載單元之第二端。而 二器具有第二感測面，其係大致垂直於基:突出感 測器之第一感測面。 載單月端的較佳實施例中，上述之映射感測器設於承 本發明還提出-種基板搬運裝置，包括承載單元、主體及 多1破片感測器。其中，承載單元適於在待機位置與工作位置 ,間移動/並具有—承載面及彼此相對之-第-端與一第二 =接至承載單兀之第一端，並包括具有彼此相對的 1 立置邊之校正平台。承載單元從工作位置移至待 則，經由校正平台的第二側邊朝向第-側邊移動。破 片感測益則疋配置於校正平台上，並鄰近其第二側邊。 本發明更提出—種基板處理系統’包括儲放上述之其 3運襄置。射，儲放£具有多個容置空間，用以儲放多‘ 土而且，這些容置空間是沿一排列方向彼此層疊， ==應之容置空間内。此外，承載單元之承載面係朝 201103848 在本發明的較佳實施例中，上述之破 校正平台之第二側邊而間隔排列。破片感測器係大致平行 在本發明的較佳實施例中，上述之基板 少-位置校正單元’配置於校正平台旁=置 二側邊之間。 位於第一側邊與第 在本發明的較佳實施例中，上述之基板 =置校正感測器’配置於承載單元之承載面上，=201103848 VI. Description of the Invention: [Technical Field] The present invention relates to a substrate processing system and a substrate carrying device thereof, and more particularly to a substrate processing system capable of detecting a substrate with a positional abnormality and a substrate missing angle And its substrate handling device. [Prior Art] In the manufacturing process of the display device, since the substrate needs to go through a plurality of process procedures, it is necessary to use the transfer device to transport the substrate between the respective process programs. The current practice is to remove the substrate from the Cassette by a robotic arm and transport it to the processing machine for process reaction. Then, after the process is finished, the substrate is returned from the machine to the storage device. Inside, to carry out a series of process steps. Moreover, in order to obtain the number of substrates or other information stored in the storage E, the robot arm will first rise and fall at a certain distance from the storage and release device before it is inserted into the storage raft to pick up the substrate. In order to sense the information of the substrate stored in the storage cassette by a mapping sensor disposed on the front of the robot arm. However, when the position of the substrate stored in the storage cassette is abnormal and the storage position is excessively prominent, the valley is liable to cause the mechanical arm to hit the protruding substrate during the mapping sensing, thereby causing the substrate to be damaged. At this point, the entire handling process must be suspended and the fragments removed manually. As a result, it will lead to problems of increased maintenance costs and waste of manpower. In addition, in recent years, the size of display panels has been increasing, and large-sized glass panels are prone to cornering or breakage during transportation, but since conventional/earth board handling devices do not detect the function of missing corners, When the substrate 3 having the corners is to be moved to the process machine, 'the machine can be detected by the machine operator due to factors such as the size of the substrate. This not only causes trouble for the operator of the machine, but also consumes a lot of manufacturing man-hours. SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide a substrate carrying device capable of simultaneously detecting whether a substrate to be picked up has a protruding position during mapping sensing to avoid a collision. Substrate. It is still another object of the present invention to provide a substrate carrying apparatus which can detect whether a substrate has a missing angle before transporting the substrate to the processing machine. Still another object of the present invention is to provide a ground domain sensation which can simultaneously sense whether a substrate in the storage E is protruding when performing mapping sensing to avoid collision of the substrate. Another object of the present invention is to provide a substrate processing system which can detect whether a substrate has a missing angle after the substrate is taken out from the storage E. The present invention provides a substrate handling apparatus comprising a domain, a carrier unit, and a/to-board dog-out sensor. Wherein the carrying unit is adapted to move between a standby position and at least: the working position, and has a first end and a second end opposite the bearing surfaces: and the first end is connected to the main body. The substrate protrusion sensor is disposed on the carrier 7L and is located at its second end. Moreover, the substrate protrusion sensor has a first sensing surface that faces the same direction as the bearing surface of the carrier unit. The present invention proposes a substrate processing system including a storage unit g and the above substrate transporting apparatus. The storage E has a plurality of accommodating spaces for storing a plurality of substrates. Moreover, the valley spaces are stacked one on another in an arrangement direction, and the substrates are respectively located in the corresponding accommodation spaces. In addition, the bearing surface of the carrying unit and the first sensing surface of the substrate protruding sensor are oriented toward the alignment direction. In a preferred embodiment of the present invention, the main body includes a correction platform having a first side and a second side opposite to each other, and the carrying unit moves from the working position to the standby position via the second side. The side moves toward the first side. In a preferred embodiment of the present invention, the substrate carrying device further includes a plurality of 201103848 = fragmentation, disposed on the correction platform, and adjacent to the second side. In a preferred embodiment of the present invention, the unit 'Configured next to the calibration platform' and located; in a preferred embodiment of the second embodiment, the above substrate carrying device further includes a sensing 11 disposed on the rotating surface of the carrying unit and adjacent to the carrying 70 One end. In a preferred embodiment of the present invention, the substrate carrying device further includes a mapping sensor disposed at the second end of the carrying unit. The second device has a second sensing surface that is substantially perpendicular to the base: the first sensing surface of the protruding sensor. In a preferred embodiment of the single-month end, the above-described mapping sensor is also provided in the invention. The substrate carrying device further comprises a carrying unit, a main body and a multi-chip sensor. Wherein, the carrying unit is adapted to move between the standby position and the working position, and has a bearing surface and opposite to each other - the first end and a second one are connected to the first end of the carrying unit, and include opposite to each other 1 Vertical calibration platform. The carrier unit is moved from the working position to the standby, moving toward the first side via the second side of the correction platform. The fragmentation sensing benefit is disposed on the calibration platform adjacent to the second side thereof. The present invention further proposes a substrate processing system that includes storing and storing the above-described three devices. The shooting, storage and storage has a plurality of accommodating spaces for storing a plurality of soils, and the accommodating spaces are stacked one on another in an arrangement direction, and == should be accommodated in the space. In addition, the bearing surface of the carrying unit is oriented toward 201103848. In a preferred embodiment of the invention, the second side of the breaking correction platform is spaced apart. The fragment sensor is substantially parallel. In a preferred embodiment of the invention, the substrate less-position correction unit is disposed between the correction platform and the two sides. Located in the first side and in the preferred embodiment of the present invention, the substrate=correction sensor is disposed on the bearing surface of the carrying unit,
在本發明的較佳實施例中，上述之基板搬運裝 映射感測器（maPPing sensor)，配置於承載單元之第一 二T射感測器具有第二感測面，大致垂直於承載單：之承= 面並朝向上述之儲放匣。 在本發明的較佳實施例中’上述之映射感測器係嵌設 載早元的第二端。 本發明之基板處理系統係在基板搬運裝置中設置有基板突 出感測器，以於承載單元對儲放匣内的基板進行映射感測時， 同時檢知是否有基板過度突出於儲放匣外，因而避免承載單元 在映γ感測過程中撞傷突出的基板。另外，本發明之基板搬運 裝置還可以設置有多個破片感測器，以便於在將基板從儲放匣 内取出後，先檢知基板是否破損，進而確保經由基板搬運裝置 搬運至製程機台上的基板均無破片。 由上述可知’本發明不但能夠有效地提高基板的生產良 率’更可以提升後續製程的運作流暢度。 為讓本發明之上述和其他目的、特徵和優點能更明顯易 懂’下文特舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 201103848 立圖1為本發明之一實施例中基板處理系統的侧面簡單示 意圖，圖2則為圖丨之基板搬運裝置的立體示意圖。請同時參 照圖1及圖2 ’基板處理系統100包括儲放匣110與基板搬運 裝，120。其中，儲放匣11〇具有多個沿排列方向L彼此層疊 的容置空間112，用以儲放多個基板101。而基板1〇1即是分 別位於對應之容置空間112内。 基板，運裝置120包括主體122、承載單元124以及至少 一個基板突出感測器126。其中，承載單元124適於在待機位 φ 置與至少一個工作位置之間移動，並具有承載面125與彼此相 對的第一端121及第二端123，且第一端121係連接至主體 122。具體來說，承載單元124的工作位置係指其在作動時的 所在位置，如拾取基板1〇1時的所在位置或其他工作狀態下的 所在位置。 承上所述’基板突出感測器126則是配置於承載單元124 上，並位於其第二端123，如圖3所示。基板突出感測器126 具有第一感測面127，其係與承載單元124之承載面125朝向 同一方向。具體來說，承載單元124之承載面125與基板突出 φ 感測器126之第一感測面127均朝向儲放匣11〇之容置空間 112的排列方向l。 除此之外’基板搬運裝置12〇更包括一映射感測器 (mapping sensor)128，與基板突出感測器丨26同樣位於承載單 元124的第二端123。值得一提的是，本實施例之映射感測器 128係嵌設於承載單元124的第二端123，但本發明並不限於 此。在其他實施例中，映射感測器128也可以是凸設於承載單 元124的第二端123’如圖4所示。具體來說，映射感測器128 具有第二感測面129，且其所朝向的方向係與基板突出感測器 201103848 126的第一感測面127垂直，也就是朝向儲放匣n〇。 請再參照圖1 ’承載單元124在伸入儲放E 110之容置空 間112拾取基板101之前，會先對儲放匣n〇内的基板1(n進 行映射感測，以得知是否每一容置空間U2内均放置有基板 1〇1，或是依此獲得各基板101的相關資訊。具體來說，在進 行映射感測時’承載單元124之第二端123與儲放匣110之間 的距離為D，且承载單元124係於此處沿容置空間112的排列 方向L移動，以透過映射感測器128對儲存匣11〇内的基板 φ 1〇1進行映射感測。舉例來說，承載單元124之第二端123與 儲放匣110之間的距離約為20釐米至30釐米。 *當承載單元124沿容置空間112的排列方向L移動時， 可藉由基板突出感測器126來感測儲放匣110内的基板1〇1是 否有異常突出的情況。如圖1所示，當儲放匣11〇内至少有一 片基板101突出容置空間112而位於承載單元124之第二端 123的上方時，即可藉由基板突出感測器126感測到此情況， 並，訊號回傳至用控制承載單元124移動的控制系統，而使承 載單元124停止移動，以避免撞擊到突出的基板1〇1。 # 為使熟客此技藝者更加瞭解本發明，下文將舉例說明映射 感測器與基板突出感測器回傳至控制電路的訊號波形，但其並 非用以限定本發明。 ^ 圖5 A為本發明之一實施例中映射感測器所回傳的訊號波 形時序圖，®5B|福本發明之—實施射基錢$感測器所 回傳的訊號波形時序圖。請同時參照圖丨及圖5A，若儲放在 儲存H 110内的基板101均位於正常的位置，則在承載單元 =4沿容置空間112的排列方向L移動時，映射感測器128每 感測到-片基板1(Π，其所回傳的訊號會對應生成一個脈衝波 201103848 形’而接連生成脈衝波形之間的時間差即為承载單元124在相 鄰之基板101之間移動所需的時間。也就是說，如圖1所示， 若儲存匣110内儲放有6片基板101，映射感測器128所回傳 的訊號將會對應生成6個脈衝波形。其中，本實施例之脈衝波 的峰值例如是5V。 另外’由於儲存匣110内的基板101均位於正常的位置， 基板突出感測器126並未感測到任何異狀，因此其所回傳的訊 號波形係與啟動時的訊號波形相同。 圖6A為本發明之另一實施例中映射感測器所回傳的訊號 波形時序圖，圖6B則為本發明之另一實施例中基板突出感測 器所回傳的訊號波形時序圖。請同時參照圖1、圖6A及圖， 在基板突出感測器126未感測到異常突出於儲存匣的基板 101前，映射感測器i28每感測到一片基板iOi，其所回傳的 訊號會對應生成一個脈衝波形。當基板突出感測器126感測到 異常突出的基板1〇1時，其所回傳的訊號波形會上升至峰值 ^例如是5V)，而承載單元124的控制系統即是依據此訊號 停止移動承載單元124。此時，由於承載單元124不再繼續沿 各置空間112的排列方向L移動，因此映射感測器128所傳回 的訊號亦會終止脈衝波形的生成。 以圖1為例’儲存匣u〇内儲放有6片基板1〇1，且映射 f測器128在完成3片基板1〇1的映射感測後，基板突出感測 器126隨即感測到第四片基板1〇1有異常突出的情況，並透過 控制系統停止移動承載單元124，則在映射感測器128所回傳 的訊號波形圖中，僅會出現3個脈衝波形，如圖6a所示。 ^由上述可知’基板搬運裝置120可避免在進行映射感測時 撞傷基板1G卜進而能夠提高基板的生產良率。 201103848 正平主體122可以包括校正平台训，而校 中承口載的第一側邊211與第二側邊213。其 中承載早70 124的待機位置即是位 ί承載單元124從工作位置移動回待機位置mtr正平 口 210的第二側邊213朝向第一側邊211移動。， 特別的是，基板搬運裝置i 2 〇還可 220山，其係配置於校正平台训上，並鄰近校正平台In a preferred embodiment of the present invention, the first substrate transfer sensor (maPPing sensor) has a second sensing surface disposed on the carrier unit, and is substantially perpendicular to the carrier sheet: The bearing surface is facing the above storage. In a preferred embodiment of the invention, the mapping sensor described above is embedded with a second end of the early element. The substrate processing system of the present invention is provided with a substrate protrusion sensor in the substrate transfer device, so that when the carrier unit performs mapping sensing on the substrate in the storage cassette, it is simultaneously detected whether the substrate is excessively protruded from the storage cassette. Therefore, the carrier unit is prevented from colliding with the protruding substrate during the gamma sensing process. In addition, the substrate transfer device of the present invention may further include a plurality of fragment sensors for detecting whether the substrate is damaged after the substrate is taken out from the storage cassette, thereby ensuring transportation to the processing machine via the substrate transfer device. There is no fragment on the upper substrate. From the above, it can be seen that the present invention can not only effectively improve the production yield of the substrate but also improve the operational fluency of the subsequent processes. The above and other objects, features and advantages of the present invention will become more <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; [Embodiment] 201103848 Fig. 1 is a schematic side view of a substrate processing system according to an embodiment of the present invention, and Fig. 2 is a perspective view of the substrate carrying device of Fig. 2. Referring to Figures 1 and 2, the substrate processing system 100 includes a storage cassette 110 and a substrate handling device 120. The storage port 11 has a plurality of accommodating spaces 112 stacked one on another in the arrangement direction L for storing a plurality of substrates 101. The substrate 1〇1 is located in the corresponding accommodating space 112, respectively. The substrate, transport device 120 includes a body 122, a carrier unit 124, and at least one substrate protrusion sensor 126. The carrying unit 124 is adapted to move between the standby position φ and the at least one working position, and has a first end 121 and a second end 123 opposite to each other, and the first end 121 is connected to the main body 122. . Specifically, the working position of the carrying unit 124 refers to the position at which it is actuated, such as the position at which the substrate 1〇1 is picked up or the position in other working states. The substrate protrusion sensor 126 is disposed on the carrier unit 124 and is located at the second end 123 thereof, as shown in FIG. The substrate protrusion sensor 126 has a first sensing surface 127 that faces the bearing surface 125 of the carrier unit 124 in the same direction. Specifically, the bearing surface 125 of the carrying unit 124 and the first sensing surface 127 of the substrate protrusion φ sensor 126 are both oriented toward the arrangement direction l of the housing space 112 of the storage cassette 11 . In addition, the substrate carrying device 12 further includes a mapping sensor 128 located at the second end 123 of the carrier unit 124 as the substrate protruding sensor 丨26. It is worth mentioning that the mapping sensor 128 of this embodiment is embedded in the second end 123 of the carrying unit 124, but the invention is not limited thereto. In other embodiments, the mapping sensor 128 can also be a second end 123' protruding from the carrier unit 124 as shown in FIG. In particular, the mapping sensor 128 has a second sensing surface 129 that is oriented perpendicular to the first sensing surface 127 of the substrate protrusion sensor 201103848 126, that is, toward the storage port. Referring to FIG. 1 again, before the carrying unit 112 picks up the substrate 101 in the accommodating space 112 of the storage E 110, the substrate 1 (n) in the storage 匣n〇 is first sensed to know whether each A substrate 1 〇 1 is placed in a accommodating space U2, or information about each substrate 101 is obtained. Specifically, when the mapping sensing is performed, the second end 123 of the carrying unit 124 and the storage 匣 110 The distance between the carriers is 124, and the carrying unit 124 is moved along the arrangement direction L of the accommodating space 112 to perform mapping sensing on the substrate φ 1 〇 1 in the storage 匣 11 透过 through the mapping sensor 128. For example, the distance between the second end 123 of the carrying unit 124 and the storage raft 110 is about 20 cm to 30 cm. * When the carrying unit 124 moves along the arranging direction L of the accommodating space 112, the substrate can be The sensor 126 is protruded to sense whether the substrate 1〇1 in the storage cassette 110 is abnormally protruded. As shown in FIG. 1, at least one substrate 101 in the storage cassette 11 protrudes from the accommodation space 112. When the second end 123 of the carrying unit 124 is above, it can be sensed by the substrate protrusion sensor 126. In the case, the signal is transmitted back to the control system that is moved by the control carrying unit 124, so that the carrying unit 124 stops moving to avoid the impact on the protruding substrate 1〇1. To make the presenter more familiar with the present invention, the following The signal waveform of the mapping sensor and the substrate protruding sensor back to the control circuit will be exemplified, but it is not intended to limit the present invention. ^ Figure 5 A is a return of the mapping sensor in one embodiment of the present invention Signal waveform timing diagram,®5B|Footprint of the invention - the timing waveform diagram of the signal waveform returned by the sensor. Please refer to FIG. 5A and FIG. 5A, if the substrate 101 stored in the storage H 110 is stored. When the bearing unit=4 moves along the arrangement direction L of the accommodating space 112, the mapping sensor 128 senses the substrate 1 (Π, the signal returned by the mapping sensor correspondingly generates one The time difference between the pulse wave 201103848 and the successively generated pulse waveforms is the time required for the carrier unit 124 to move between adjacent substrates 101. That is, as shown in FIG. 1, if the storage is stored in the buffer 110 There are 6 substrates 101, which are reflected The signal returned by the sensor 128 will generate six pulse waveforms correspondingly, wherein the peak value of the pulse wave in this embodiment is, for example, 5 V. In addition, since the substrate 101 in the storage cassette 110 is in a normal position, the substrate The highlight sensor 126 does not sense any abnormalities, so the signal waveform returned by it is the same as the signal waveform at the time of startup. FIG. 6A is a return of the mapping sensor according to another embodiment of the present invention. FIG. 6B is a timing diagram of signal waveforms returned by the substrate protruding sensor according to another embodiment of the present invention. Referring to FIG. 1 , FIG. 6A and FIG. simultaneously, the substrate protruding sensor 126 is not Before the substrate 101 is sensed to protrude abnormally, the mapping sensor i28 senses one substrate iOi, and the signal returned by the mapping sensor i28 correspondingly generates a pulse waveform. When the substrate protrusion sensor 126 senses the abnormally protruding substrate 1〇1, the signal waveform returned by the substrate protrusion sensor 126 rises to a peak value of, for example, 5V, and the control system of the carrier unit 124 stops moving according to the signal. Carrying unit 124. At this time, since the carrying unit 124 does not continue to move along the arrangement direction L of the respective spaces 112, the signal returned by the mapping sensor 128 also terminates the generation of the pulse waveform. Taking FIG. 1 as an example, the storage substrate has six substrates 1〇1 stored therein, and the mapping f detector 128 performs the mapping sensing of the three substrates 1〇1, and the substrate protruding sensor 126 senses. When the fourth substrate 1〇1 is abnormally protruded and the mobile carrier unit 124 is stopped by the control system, only three pulse waveforms appear in the signal waveform returned by the mapping sensor 128, as shown in the figure. Shown in 6a. As can be seen from the above, the substrate transfer device 120 can prevent the substrate 1G from being damaged when the map sensing is performed, thereby improving the production yield of the substrate. 201103848 The leveling body 122 can include a calibration platform train that aligns the first side 211 and the second side 213 of the mouthpiece. The standby position in which the early 70 124 is carried is that the carrying unit 124 moves from the working position back to the second side 213 of the standby position mtr leveling 210 toward the first side 211. In particular, the substrate handling device i 2 〇 can also be 220 mountain, which is arranged on the calibration platform training and adjacent to the calibration platform.
。需要注意的是’這些破片感· 22g的排列方式及 /、在权正平台210上的位置可以依照實務上基板ι〇ι容易破損 之處來做碰。由於目前基板1G1較料破裂處為兩側角落及 中間侧邊（如圖7A至圖7(：所示），因此本實施例之基板搬 運裝置120例如是包括破片感測器2施、破片感測器2施及 破片感測器220c，且其係大致平行第二側邊213而間隔排列， 但本發明並不限定於此。 請同時參照圖1及圖2,當承載單元124由儲放匣11〇内 拾取基板101之後，承载單元124會經由校正平台210的第二 側邊213朝向第一側邊211移動，以回到其待機位置。在移動 的過程中，即可藉由這些破片感測器22〇來檢知基板1〇1是否 有破損。 詳細來說，這些破片感測器220例如是光感測器。也就是 說’破片感測器220係透過感測其所發出之光束是否被基板 101反射回來判定基板1〇1有無破損。當破片感測器220檢知 基板101有破損時，其傳回控制系統的訊號將會使基板搬運裝 置100停止運作，並通知相關人員以人工的方式排除破片。 圖8A至圖8C分別繪示本發明之不同實施例中破片感測 器所回傳的訊號波形時序圖。請同時參照圖2、圖7A及圖8A， 201103848 當承載單元124所拾取的基板101具有如圖7A所示之破損情 形時’破片感測器220c所回傳的訊號會對應生成一個脈衝波 形’如波形(c)所示。控制系統即是依據此訊號來停止作動基板 搬運裝置120。在此’由於基板101在破片感測器220a與破 片感測器220b所對應處均無破損，因此破片感測器22〇a所傳 回的訊號波形(a)與破片感測器220b所傳回的訊號波形(b)係與 其啟動時的訊號波形相同。 同理可知，當承載單元124所拾取的基板1〇1具有如圖 7B所示之破損情形時，僅有破片感測器22加所回傳的訊號會 生成一個脈衝波形，如圖8B所示。另一方面，當承載單元124 所拾取的基板1〇1具有如圖7C所示之破損情形時，僅有破片 感測器220b所回傳的訊號會生成一個脈衝波形，如圖8C所 示。換s之，控制系統或相關人員可以依據這些破片感測器 220所回傳的訊號得知基板1〇1是否有破損及其破損處。 由上述可知，本發明可避免基板搬運裝置12〇將已破損之 ，板運送至製程機台上，而對後續製程造成影響。值得一提的 是，基板101的破損程度（如裂縫大小）可以依據承載單元 12二的^動速度與破片感測器220連續接收到光束之間的時間 差來推得。 另外，基板搬運裝置100在校正平台210旁更配置有至少 。。組位置校正單元’如圖2所標示之31〇&與。位置校正 早兀31〇a與310b係位於校正平台21〇之第一侧邊2ιι與第二 ^之間，用以校正承載單元124所拾取回的基板101在 早元124上的擺放位置，以避免基板1〇1因擺放位置錯誤 =在搬運過程中受損。具體來說，位置校正單元她例如是 左右位置校正單元，位置校正單元3勘例如是前後位置校正 201103848 左右平移基㈣ 平移基板101在承鮮元124上的x位=31Gb収用以前後 另-方面，基板搬縣置⑽還可以包括結— 感測盗320 ’其係、配置於承載單幻2 近承載單元124的第一端121。二 戟面25上，並鄰 感測面係與承載丄 運裝置U)0例如是包括兩在本實施例中’基板搬. It should be noted that the arrangement of the fragments, the arrangement of 22g, and/or the position on the right platform 210 can be made in accordance with the fact that the substrate ι〇ι is easily damaged. The substrate handling device 120 of the present embodiment includes, for example, the fragment sensor 2, and the fragmentation feeling, because the substrate 1G1 is ruptured at both sides and the middle side (as shown in FIG. 7A to FIG. 7 (:)). The detector 2 applies the fragment sensor 220c, and is arranged substantially parallel to the second side 213, but the invention is not limited thereto. Referring to FIG. 1 and FIG. 2 simultaneously, when the carrying unit 124 is stored After picking up the substrate 101 in the 匣11〇, the carrying unit 124 moves toward the first side 211 via the second side 213 of the calibration platform 210 to return to its standby position. In the process of moving, these fragments can be used. The sensor 22 detects whether the substrate 1〇1 is damaged. In detail, the fragment sensors 220 are, for example, photo sensors. That is to say, the 'fragment sensor 220 transmits the sense through the sensing. Whether the light beam is reflected by the substrate 101 determines whether the substrate 1〇1 is damaged. When the fragment sensor 220 detects that the substrate 101 is damaged, the signal transmitted back to the control system will stop the substrate handling device 100 and notify relevant personnel. Manually exclude fragments 8A to 8C are timing diagrams of signal waveforms returned by the fragment sensor in different embodiments of the present invention. Referring to FIG. 2, FIG. 7A and FIG. 8A, 201103848, the substrate 101 picked up by the carrier unit 124 is shown. When there is a damage situation as shown in FIG. 7A, the signal returned by the fragment sensor 220c will generate a pulse waveform as shown in the waveform (c). The control system stops the actuation of the substrate handling device 120 according to the signal. Here, since the substrate 101 is not damaged at the corresponding position of the fragment sensor 220a and the fragment sensor 220b, the signal waveform (a) and the fragment sensor 220b transmitted by the fragment sensor 22〇a are The signal waveform (b) returned is the same as the signal waveform when it is started. Similarly, when the substrate 1〇1 picked up by the carrying unit 124 has a broken condition as shown in FIG. 7B, only the fragment sensor 22 is used. Adding the returned signal generates a pulse waveform as shown in Fig. 8B. On the other hand, when the substrate 1〇1 picked up by the carrying unit 124 has a broken condition as shown in Fig. 7C, only the fragment sensor is used. The signal returned by 220b will generate a signal The waveform is as shown in Fig. 8C. In other words, the control system or related personnel can know whether the substrate 1〇1 is damaged or damaged according to the signal returned by the fragment sensor 220. The invention can prevent the substrate carrying device 12 from transporting the damaged board to the processing machine, and affecting the subsequent process. It is worth mentioning that the damage degree of the substrate 101 (such as the crack size) can be determined according to the carrying unit 12 In addition, the substrate carrying device 100 is further disposed at least beside the correction platform 210. The group position correcting unit 'is labeled as shown in FIG. 2, and the time difference between the moving speed and the fragment sensor 220 is continuously received. 31〇& The position correction early 31兀a and 310b are located between the first side 2πι and the second side of the calibration platform 21〇, for correcting the position of the substrate 101 picked up by the carrying unit 124 on the early element 124. To avoid the substrate 1〇1 being placed incorrectly = damaged during handling. Specifically, the position correction unit is, for example, a left and right position correction unit, and the position correction unit 3 is, for example, a front and rear position correction 201103848. The left and right translation bases (4) The translation substrate 101 has an x position on the fresh element 124 = 31 Gb. The substrate moving county (10) may further include a junction-sensing thief 320', which is disposed at the first end 121 of the carrying single magical near-bearing unit 124. The second surface 25, and the adjacent sensing surface system and the load carrying device U) 0 include, for example, two in the present embodiment
^ ^ A 弟鳊121與第二端123之間的兩側邊。 =1 夺參照圖1及圖2，當承載單元m伸人η ίίίΓ1時’可藉由位置校正感測器320來檢知基板⑻是 否杨轉移㈣現象，關斷承鮮元12 修正其取纽置。 進碰轉 晋右：士= 基板處理系統係在基板掩運裝置中設 ^基板犬域測器，以於承載單謂儲放_的基板進行映 射感測時，同時檢知是否有基板過度突出於儲放£外，因而避 免承載早兀在映射感測過程中撞傷突出的基板。由此可知 ⑩發明能夠有效地提高基板的生產良率。 此外，本發明之基板搬運裝置還可以設置有多個破片感測 器，以便於在縣板從錢_取出後，先檢知基板是否破 損，進而確保經由基板搬運裝置搬運至製程機台 破片。如此-來，將可提升後續製程的運作流暢度，避免發生、 製私機台因需停機排除破片而延誤製程工時的問題。 雖然本發明已以較佳實施例揭露如上，然其並非用以限定 本發明，任何熟習此技藝者’在不脫離本發明之精神和範圍 内，當可作些狀更動錢飾’因此本發明之倾範圍當視後 12 201103848 附之申請糊朗所界定者為準。 【圖式簡單說明】 圖1為本發明之—實施例中基板處理系統的側面簡單示 意圖。 ' 圖2為圖1之基板搬運裝置的立體示意圖。 圖3為圖2之承載單元的放大示意圖。 圖4本發明之另一實施例中基板處理系統的側面簡單示 意圖。 圖5A為本發明之一實施例中映射感測器所回傳的訊號波 形時序圖。 圖5B為本發明之一實施例中基板突出感測器所回傳的訊 號波形時序圖。 圖6 A為本發明之另一實施例中映射感測器所回傳的訊號 波形時序圖。 圖6 B為本發明之另一實施例中基板突出感測器所回傳的 δίΐ號波形時序圖。 圖7Α至圖7C分別為基板破損的示意圖。 圖8Α至圖8C分別繪示本發明之不同實施例中破片感測 器所回傳的訊號波形時序圖。 【主要元件符號說明】 100 :基板處理系統 101 :基板 110 :儲放匣 112 :容置空間 !2〇 :基板搬運裝置 121:第—端义 13 201103848 122 :主體 123 :第二端 124 :承載單元 125 :承載面 126 :基板突出感測器 127 :第一感測面 128 :映射感測器 129 :第二感測面 210 :校正平台 脅211:第一側邊 213 :第二側邊 220、220a、220b、220c :破片感測器 310a、310b :位置校正單元 320 :位置校正感測器 D :距離 L:排列方向^ ^ A side edge between the younger brother 121 and the second end 123. =1 Referring to FIG. 1 and FIG. 2, when the carrying unit m is extended to η ίίίΓ1, the position correction sensor 320 can be used to detect whether the substrate (8) is transferred (four), and the fresh-keeping element 12 is turned off. Set. Into the touch-to-spinning right: Shi = substrate processing system is set in the substrate masking device to set the substrate dog detector, in order to carry the mapping sensing on the substrate carrying the single-predition storage__, at the same time, whether the substrate is over-exposed In addition to the storage, it is thus avoided to carry the substrate which is damaged by the early impact during the mapping sensing process. From this, it can be seen that the 10 invention can effectively improve the production yield of the substrate. Further, the substrate transfer device of the present invention may be provided with a plurality of chip sensors for detecting whether or not the substrate is damaged after the meter plate is taken out from the money, thereby ensuring transport to the process machine table through the substrate transfer device. In this way, the smoothness of the operation of the subsequent processes can be improved, and the problem of delays in the process time of the machine can be avoided due to the need to stop the machine and eliminate the fragmentation. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and the present invention may be modified as part of the invention without departing from the spirit and scope of the invention. The scope of the deeds shall be subject to the definition of the application for the application of 12 201103848. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic side view of a substrate processing system in an embodiment of the present invention. 2 is a perspective view of the substrate carrying device of FIG. 1. 3 is an enlarged schematic view of the carrying unit of FIG. 2. Figure 4 is a schematic side elevational view of a substrate processing system in accordance with another embodiment of the present invention. FIG. 5A is a timing diagram of signal waveforms returned by a mapping sensor according to an embodiment of the present invention. FIG. 5B is a timing diagram of signal waveforms returned by the substrate protrusion sensor according to an embodiment of the invention. 6A is a timing diagram of signal waveforms returned by a mapping sensor in another embodiment of the present invention. FIG. 6B is a timing diagram of a δίΐ waveform returned by the substrate protrusion sensor according to another embodiment of the present invention. 7A to 7C are schematic views of damage of the substrate, respectively. 8A to 8C are timing diagrams of signal waveforms returned by the fragment sensor in different embodiments of the present invention, respectively. [Description of main component symbols] 100: Substrate processing system 101: Substrate 110: Storage 匣 112: accommodating space! 2 〇: Substrate conveying device 121: First-end meaning 13 201103848 122: Main body 123: Second end 124: Carrying Unit 125: bearing surface 126: substrate protruding sensor 127: first sensing surface 128: mapping sensor 129: second sensing surface 210: correcting platform threat 211: first side 213: second side 220 220a, 220b, 220c: fragment sensor 310a, 310b: position correction unit 320: position correction sensor D: distance L: arrangement direction
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