200922788 九、發明說明： 【發明所屬之技術領域】 本發明係有關感光性積層體之製造系統，係具備有將 基板預先加熱至既定溫度的加熱裝置，及將感光性薄片貼 附於已加熱到既定溫度之該基板的積層裝置。 【先前技術】 例如，在液晶面板用基板、印刷配線用基板、PDP面 板用基板，係將具有感光材料（感光性樹脂）層的感光性 薄片體（感光性薄片）貼附於基板表面而作爲感光性積層 體所構成。此感光性薄片體，係將感光材料層與保護薄膜 依序積層於可撓性塑膠支撐體上。 製造上述感光性薄片體時，通常玻璃基板或樹脂基板 等的基板，係預先被加熱到既定的溫度。而且，保護薄膜 部分或整體被剝離之感光性薄片與已加熱的基板，係藉由 構成積層裝置之一對的積層輥子間所夾持加熱，而於該基 板上熱壓接感光材料層。接著，藉由從基板將可撓性塑膠 支撐體剝離，而製造感光性積層體。 例如，在日本專利特開平8 — 1 8 3 1 4 6號公報所揭示之 乾保護膜（dry resist film)的積層方法，如第8圖所示，基 板預熱部1、積層部2、基板冷卻部3、基板上薄膜切斷部 4及薄膜除去部5係基於運送部6之沿著基板7的運送方向 而配裝。 在基板預熱部1，藉由預熱加熱器1 a基板7已加熱到 既定的溫度之後，將此基板7送出到積層部2。在積層部2 200922788 配置有一對積層輥子2a、2b’基板7與乾保護膜8被輸送 到該積層輥子2a、2b間。因此乾保護膜8被熱壓接在基板 Ί。 可是，在上述之習知技術，在基板預熱部1與建構成 積層部2之積層輥子2a、2b的基板插入側之間（以下，也 稱爲橋跨部分），因爲基板7暴露在室內的空氣中，所以 該基板7的溫度容易降低。然而，在積層時基板7的面內 溫度分佈會影響到積層品質，所以該基板7的面內溫度均 勻性，成爲維持積層品質的重要關鍵。 因此，在積層時，基板7有必要確保所期望的溫度’ 例如，估計基於室內空氣之溫度降低，可考慮將該基板7 的設定溫度設定較目標溫度更高。可是，隨著在橋跨部分 之基板7的運送速度之變動，同時由於該基板7之周緣部 分的溫度降低較中央部分更大等，在該橋跨部分之該基板 7的面內溫度均句性會降低。 【發明内容】 本發明係在解決此般之問題者，其之目的’在於提供 一種感光性積層體之製造系統，其能有效地阻止加熱裝置 與積層裝置之橋跨部分的基板之溫度降低’同時可提高該 s板之面內溫度的均勻性。 本發明係有關一種感光性積層體之製造系統’具備有 :加熱裝置，用以將基板預先加熱至既定的溫度；及、積 層裝置，用以將感光性薄片貼附於已加熱到既定溫度之該 基板。 200922788 而且，在加熱裝置與積層裝置之間，配裝有進給機構 ，用以將基板運送到該積層裝置之貼附處理位置；及、保 溫機構，用以將已加熱至既定溫度之該基板保溫至該貼附 處理位置的附近。 在本發明，於加熱裝置與積層裝置之間，基板係藉由 進給機構運送到該積層裝置之貼附處理位置，同時藉由保 溫機構保溫於既定溫度直到該貼附處理位置的附近。因此 ，基板能有效地阻止加熱裝置與積層裝置之橋跨部分的溫 度降低，同時可提高該基板之面內溫度的均勻性。藉此， 可良好且確實地維持積層品質。 伴同附上之圖式之其次之適當實施形態例的說明，相 信可更明瞭上述之目的及其他目的、特徵及優點。 【實施方式】 較佳的實施形態例之描述 如第1圖所示，有關本發明之第1實施形態的感光性 積層體之製造系統20，係在液晶或有機EL用彩色濾光片 的製作過程，進行將長狀感光性薄片2 2的感光性樹脂層2 8 (後述）對玻璃基板24之熱轉印作業。 如第2圖所示，被使用於製造系統20之感光性薄片22 ，係將可撓性基底薄膜（支撐體）2 6、感光性樹脂層（感 光材料層）28、及保護薄膜30積層所構成。 如第1圖所示，製造系統20具備有：，係收容把感光 性薄片22捲繞爲圓筒狀之感光性薄片捲22a，將來自感光 性薄片捲22a之該感光性薄片22送出之薄片送出機構32 200922788 •，在所送出之感光性薄片22之保護薄膜30，形成作爲可於 寬度方向切斷之半切割部位3 4 (參照第2圖）之加工機構 3 6 ;以及，使一部分具有非黏著部3 8 a的黏著標籤3 8 (參 照第3圖）黏著於保護薄膜30之標篆黏著機構40。 在標籤黏著機構40的下游，配裝有：用於將感光性薄 片22從間歇運送變更爲連續運送之貯存部機構42;以既定 的長度間隔使保護薄膜30從該感光性薄片22剝離之剝離 機構44;將玻璃基板24在加熱到既定的溫度狀態下運送到 貼附位置之加熱裝置45 ;以及，將藉由剝離該保護薄膜30 而露出之感光性樹脂層28貼附於該玻璃基板24的積層裝 置46。此外，以下將藉由積層裝置46將感光性薄片22貼 附於玻璃基板2 4之被處理物，稱爲貼附基板2 4 a。 在積層裝置46之貼附位置的上游附近，配裝有直接檢 測感光性薄片22之作爲邊界位置的半切割部位34的檢測 機構47,同時在該積層裝置46的下游配裝有將各玻璃基板 24間之該感光性薄片22切斷之基板間薄片切斷機構48。 在此基板間薄片切斷機構48的上游，設置有在運轉開始時 及運轉結束時使用的薄片切斷機構4 8a。 在薄片送出機構3 2的下游附近，配裝有將大致使用完 畢之感光性薄片22的後端，與新使用之感光性薄片22的 前端黏著之黏著台49。在此黏著台49的下游’爲了控制由 於感光性薄片捲22a之捲繞偏差所致之寬度方向的偏差’ 而配裝有薄膜端末位置檢測器5 1。 加工機構36被配置在輥子對50的下游’該輥子對50 200922788 係爲了計算被收容捲繞在薄片送出機構32之感光性薄片 捲22a的捲徑。此加工機構36，係具備有單一的圓刀刃52 ，此圓刀刃5 2，係朝感光性薄片2 2的寬度方向行走’在該 感光性薄片2 2之既定的位置形成半切割部位3 4 ° 如第2圖所示，半切割部位34，有必要至少切斷保護 薄膜30,實際上，爲了確實切斷此保護薄膜30而設定圓刀 刃5 2的切入深度爲可切入到感光性樹脂層2 8甚至於到基 底薄膜26。 半切割部位34，係設定玻璃基板24之間隔者’例如， 被設定成從該玻璃基板24的兩端部分別向內側各自進入 1 0mm的位置。被玻璃基板24間乏半切割部位3 4夾住的部 分具有在後述積層裝置46中將感光性樹脂層28框緣狀地 貼附於前述玻璃基板24時作爲遮罩的機能。 標籤黏著機構40，係爲了對應玻璃基板24間而留下保 護薄膜30的殘留部分30b，供應連結剝離側前方的剝離部 分30aa與剝離側後方的剝離部分30ab之黏著標籤38。如 第2圖所示，保護薄膜3 0，係夾住殘留部分3 Ob，先被剝 離之部分作爲前方的剝離部分30aa，另一方面後被剝離之 部分作爲後方的剝離部分3 0 ab。 如第3圖所示，黏著標籤3 8，係構成帶冊狀，例如， 以與保護薄膜3 0同一樹脂材所形成。黏著標籤3 8，係於中 央部具有不塗布黏著劑之非黏著部（含微黏著）3 8 a，同時 在此非黏著部38a的兩側，即，在該黏著標籤38之長度方向 兩端部，具有被黏著於前方之剝離部分30aa的第1黏著部38b 200922788 ，與被黏著於後方之剝離部分3Oab的第2黏著部38c。 如第1圖所示，標籤黏著機構40，係具備最多7片之 黏著標籤38各以既定間隔隔開而可貼附之吸附墊54a〜54g ，同時在依據該吸附墊54a〜54g之該黏著標籤38的貼附位 置，配置用於自下方保持感光性薄片22的可升降自如的承 台5 6 〇 貯存部機構42,爲了吸收上游側之感光性薄片22的間 歇運送，與下游側之該感光性薄片22的連續運送之速度差 ，再者爲了防止張力的變動，具備可擺動自如之2列的輥 子60所構成的調節輥子61。此外，輥子60依照儲藏量可 爲1列或3列以上。 配置在此貯存部機構42之下游的剝離機構44，具備用 於減低感光性薄片22之送出側的張力變動，穩定積層時之 張力吸入鼓62。在吸入鼓62的附近，配置有剝離輥子63 ，同時透過此剝離輥子63從感光性薄片22以銳角的剝離 角所剝離之保護薄膜30，係除了殘留部分30b以外而被保 護薄膜捲取部64所捲取。 在剝離機構44的下游測，配裝有可將張力賦予感光性 薄片22的張力控制機構66。張力控制機構66，係具備有 缸體68,而在此缸體68的驅動作用下，藉由張力調節輥子 70的擺動變位，可調整此張力調節輥子70滑動接觸之感光 性薄片2 2的張力。此外，張力控制機構6 6，係依照需要使 用即可，亦可省略。 檢測機構47，係具備雷射感測器及光感測器（Ph〇to_ -10 - 200922788 sensor)等之光電感測器72，該光電感測器72，係直接檢測 半切割部位34之楔子狀的溝形狀部，及依據保護薄膜30 之厚度的階層差’或依據此等組合之變化，而將此檢測信 號作爲境界位置信號。光電感測器7 2，係被配置與支撐輥 子73對向。此外’替代光電感測器72，亦可使用非接觸變 位計和C C D照相機等的畫像檢查手段等。 加熱裝置45，係如第4圖所示具備：運送機構74，用 以將玻璃基板24沿箭頭C方向運送；及，沿著依據該運送 機構74之運送方向而配裝之複數個，至少第1加熱機構76 及第2加熱機構7 8。 ’ 運送機構74，係具備朝箭頭C方向配裝之複數個樹脂 製圓盤狀運送輥子80’該運送輥子80，係被配裝在構成第 1加熱機構76之本體部76a內及構成第2加熱機構78之本 體部7 8 a內。 第1加熱機構76，係被配置在朝箭頭c方向而比第2 加熱機構78更上游側，固定台84設置裝載在基台82上。 在固定台84上，如第4圖及第5圖所示，設置一對朝箭頭 C方向相互平行延伸存在之導軌86，在此導軌86上，配裝 本體部76a僅可朝箭頭C方向進退既定距離L1。 本體部7 6a’係在箭頭C方向前端部及箭頭C方向後 端部分別設置聯鎖（i n t e r 1 〇 c k)(未圖示），可保持該本體部 7 6a於進退位置。本體部76a的後退位置，即，在玻璃基板 24的入口側，設置有機器人柵欄88。在本體部76a內，位 於運送輕子80的上方，例如，設置有板式的第1紅外線加 -11 - 200922788 熱器90a。 第2加熱機構78，係具備有本體部78a，在該本體部 78a設置有：延伸到積層裝置46附近的進給機構92，用以 將玻璃基板24運送到該積層裝置46的貼附處理位置；第3 紅外線加熱器（保溫機構）90c，.用以將加熱於既定溫度該 玻璃基板24保溫直到該貼附處理位置的附近；以及退避機 構94，用以將該本體部78a可對該積層裝置46移動。 在本體部7 8 a，被形成連通於後述之框體9 6內的開口 98，同時在該本體部78a內，位於複數個運送輥子80的上 方’例如’板式的第2紅外線加熱器90b被設置延伸到箭 頭C方向。此外，第1及第2紅外線加熱器90a、90b亦可 使用熱風加熱器。 在本體部78a之箭頭C方向前端側的側面，框體96延 伸到玻璃基板24的寬度方向（第5圖中，箭頭D方向）而 固定。在框體96內沿著箭頭C方向配置複數個樹脂製圓盤 狀運送輥子8 0 a建構成進給機構9 2，同時位於該運送輥子 80的上方，設置有板式第3紅外線加熱器90c (或熱風加 熱器）。在框體9 6形成開口 9 6 a用以將玻璃基板2 4送到 積層裝置46。 退避機構94，係具備有一對第2導軌1〇〇在基台82 上朝箭頭D方向相互平行延伸，在此第2導軌100上，配 置可軌台102可朝箭頭D方向進退。在可動台i 〇2朝箭頭 D方向的進退位置’設置有未圖示之聯鎖，可保持該可動 台1 0 2於兩位置。 -12- 200922788 在可動台1 0 2上，朝箭頭C方向相互 一對導軌104，在該導軌1〇4上，配置本體 C方向進退。本體部78a，係被固定在箭頭 接近積層裝置46。另一方面，亦可固定在 位置。 本體部78a對箭頭C1方向僅移動既另 ，沿著導軌1〇〇可朝箭頭D方向移動。朝I 動距離L 1，係被設定爲當進給機構92朝. 時，不會干涉到積層裝置46的尺寸，同時 移動距離L2，係被設定爲作業者對該積層 種維修作業時，本體部7 8 a不會干涉的尺 此外，在運送機構74亦可採用配裝有 起板，建構成使玻璃基板24浮起而朝箭羅 如第1圖所示，在加熱裝置45的上游 存部1 1 0用以收容複數個玻璃基板24。5 除了投入及取出口以外之3方的側面，附 單元（或風道單元）112。風扇單元112, 110內進行噴出去除靜電清淨空氣。被收 1 1 0之各玻璃基板24，係被設置於機器人 的吸附墊1 1 6吸附取出，而搬入加熱裝置 積層裝置46，係具備被配裝於上下， 温度的積層用橡膠輥子120a、120b。在橡膠 ，支撐輥子122a、122b與其滑動接觸，同時 藉由輥子夾持部124按壓於橡膠輥子120b 平行延伸設置有 部7 8 a可朝箭頭 C方向前端位置 箭頭C方向後端 |的距離L1之後 乾頭C1方向之移 箭頭D方向移動 向箭頭D方向之 ^裝置4 6進行種 寸。 未圖示的空氣浮 i c方向運送。 ;，設置有基板儲 ϊ基板儲存部11 〇 設有除麈用風扇 係對基板儲存部 容在基板儲存部 1 1 4之手部1 1 4 a 45。 同時加熱到既定 ;輥子 1 20a、1 20b 該支撐輥子122b 側。 -13- 200922788 在橡膠輥子1 20a的附近，配裝有可移動的防止接觸輥 子126用以防止感光性薄片22接觸到該橡膠輥子120a。在 積層裝置46的上游附近’配裝有預備加熱部127用以預備 加熱感光性薄片22到預先既定的温度。此預備加熱部1 27 係，例如，具備有紅外線棒狀加熱器等的加熱手段。 積層裝置46與基板間薄片切斷機構48之間，配裝有 薄膜運送輥子128a與基板運送輥子128b。在基板間薄片切 斷機構4 8的下游側，配置有冷卻機構1 3 0，同時在此冷卻 機構1 3 0的下游側，配置有基底剝離機構1 3 2。冷卻機構 130在藉由基板間薄片切斷機構48切斷貼附基板24a間的 感光性薄片22之後，對此貼附基板24a供應冷風施'以冷卻 處理。具體上，冷風温度爲10 °C、風量被設定爲1.0〜2.0m3 / mln。此外，亦可不使用冷卻機構1 30，而以後述之感光 性積層體儲存器1 46自然冷卻。又，亦可基於室內風進行 送風以替代冷風。 配置於冷卻機構130下游的基底剝離機構132,係具備 有從貼附基板24a的下方吸附之複數個吸附墊1 34，前述貼 附基板24a被此吸附墊134吸附保持的狀態下，藉由機器 人手柄1 36將基底薄膜26及殘留部分30b剝離。在吸附墊 1 34之上游、下游及兩側配裝有去除靜電之鼓風機（未圖示 )而從4方的側面對貼附基板24a的積層部分整體噴射去 除靜電空氣。此外，爲了去除灰塵亦可將機台作成垂直、 或作成傾斜、又或翻過來進行剝離。 在基底剝離機構1 32的下游，設置有感光性積層體儲 -14- 200922788 存器1 46用以收容複數個感光性積層體+丨4〇。從貼附基板 24a將基底薄膜26及殘留部分30b在基底剝離機構132剝 離之感光性積層體140’係被設置於機器人142之手部142a 的吸附墊1 4 4所吸附而取出，並收容於感光性積層體儲存 器14 6。此外’手柄部14 2 a亦可不依賴吸附，例如，使用 基於摩擦之保持方式。 在感光性積層體儲存器146，於投入及取出口以外之3 方的側面，附設有除塵用風扇單元（或風道單元）112。風 扇單元112’係對感光性積層體儲存器146內進行吹出去除 靜電之清淨空氣。 在製造系統20，雖將薄片送出^機構32、加工機構36 、標籤黏著機構4 0、貯存部機構4 2、剝離機構44、張力控 制機構66 ’以及、檢測機構47配置於積層裝置46的上方 ，·但與此相反’亦可從該薄片送出機構3 2至該檢測機構4 7 ，配置於該積層裝置46的下方，使感光性薄片22的上下 成爲相反’而將感光性樹脂層2 8貼附於玻璃基板2 4的下 側，又，亦可將該製造系統20整體建構成於直線上。 製造系統20，係藉由積層製程控制部150而控制整體 ，在此製造系統20的每一個各機能部，例如，設置積層控 制部1 5 2、基板加熱控制部1 5 4及基底剝離控制部1 5 6等， 此等係藉由製程內網路而相互連接。 積層製程控制部1 5 0，係被連接於工廠網路，將來自 未圖示之工廠CPU的指示資訊（條件設定及生產資訊）的 生產管理及運轉管理等進行用以生產的資訊處理。 -15- 200922788 積層控制部1 5 2，係作爲製程整體的主機進行各 部的控制，根據藉由檢測機構4 7所檢測之感光性薄^ 之半切割部位3 4的位置資訊，例如，建構成控制加熱 45的控制機構。 基底剝離控制部1 5 6，係從積層裝置46供應之貼 板24a將基底薄膜26剝離，再者，於下游製程進行控 光性積層體1 40的排出動作，同時操作控制該貼附基括 及該感光性積層體1 40的資訊。 製造系統20內，係藉由間隔壁1 60被隔間成第1 室162a與第2無塵室162b。在第1無塵室162a收容 片送出機構32到張'力控制機構66,同時在第2無塵室 ’收容從檢測機構47以後。第1無塵室162a與第2 室162b，係通過貫通部164予以連通。 關於該製造系統20的動作’說明如下。 首先，如第1圖所示’在加工機構36，圓刀刃52 光性薄片22的寬度方向移動，將此感光性薄片22從 薄膜30切入到感光材料層28甚至到基底薄膜26爲止 成半切割部位3 4 (參照第2圖）。苒者，感光性薄片 係如第1圖所示，對應保護薄膜3 0之殘留部分3 〇b的 朝箭頭A方向運送之後被停止’而在圓刀刃52的行走 下形成半切割部位34。藉此’在感光性薄片.22，夾著 部分3 0 b而設置有前方的剝離邰分3 0 a a與後方的剝離 30ab(參照第2圖）。 接著，感光性薄片22 ’係被運送到標籤黏著機^ 機能 t 22 裝置 附基 制感 ：24a 無塵 從薄 162b 無塵 於感 保護 而形 22 > 尺寸 作用 殘留 部分 1 40 -16 - 200922788 ，保護薄膜3 0之既定的貼附部位被配置在承台5 6上。 標籤黏著機構40 ’既定張數的黏著標籤38藉由吸附 5 4a~5 4g而被吸附保持，各黏著標籤38跨越保護薄膜30 殘留部分30b ’將前方的剝離部分30aa與後方的剝離部 30ab黏著成一體（參照第3圖）。 例如，經黏著7片的黏著標籤3 8之感光性薄片2 2， 第1圖所示，透過貯存部機構42防止送出測的張力變動 ，連續被運送到剝離機構44。在剝離機構44，感光性薄 22之基底薄膜26被吸入鼓62吸附保持，同時保護薄膜 留下殘留部分30b而從該感光性薄片22被剝離。此保護 膜ί〇,係藉由剝離輥子63以銳角的剝離角被剝離而被保 薄膜捲取部64所捲取。 在剝離機構44的作用下，保護薄膜30留下殘留部 3〇b而從基底薄膜26剝離之後，感光性薄片22 ’係透過 力控制機構66進行張力調整，再者，在檢測機構47藉 光電感測器72進行半切割部位34的檢測。 感光性薄片2 2，係根據半切割部位3 4的檢測資訊’ 在薄膜運送輥子1 2 8 a的旋轉作用下，定量被運送到積層 置46。其時，接觸防止輥子126在上方待機，同時配置 膠輥子120b於下方。 另一方面，在加熱裝置45，對應於積層裝置46中之 層溫度而設定第1及第2加熱機構76、78內的加熱溫虔 例如，積層溫度爲1 1 〇 °C時，藉由第1及第2紅外線加熱 9 〇a、90b而設定第1及第2加熱機構76、78內的加熱溫 在 墊 的 分 如 後 片 30 薄 護 分 張 由 而 裝 橡 積 〇 器 度 -17- 200922788 爲1 2 0 °C左右。 因此，機器人114把持被收容在基板儲藏器110之玻 璃基板24，而將此玻璃基板24搬入第1加熱機構76。在 第1加熱機構7 6內，如第4圖所示，玻璃基板24在第1 紅外線加熱器90a的加熱作用下被升溫後’該玻璃基板24 藉由運送機構7 4送到第2加熱機構7 8。 在第2加熱機構78內，玻璃基板24藉由第2紅外線 加熱器90b加熱，此玻璃基板24藉由第3紅外線加熱器90c 被維持在既定的溫度狀態下’藉由進給機構92送到積層裝 置46。在積層裝置46，玻璃基板24對應於感光性薄片22 之感光性樹脂層28的貼附部分暫時被配置在橡膠輥子 1 2 0 a、1 2 0 b 間。 在此狀態下，藉由輥子夾持部1 24使支承輥子1 22及 橡膠輥子12 0b上升，玻璃基板24以既定的加壓壓力被夾 進橡膠輥子120a、120b間。再者，在橡膠輥子120a的旋轉 作用下，感光性樹脂層28藉由加熱熔融而轉印（積層）於 此玻璃基板24。 在此，作爲積層條件’速度爲/ min~10.0m/_.min ，橡膠輥子120a、120b的溫度爲80°C~150°C ’該橡膠輥子 120a、120b的硬度爲40度~90度，該橡膠輥子120a、120b 的加壓壓力（線壓）爲50N/ cm〜400N/ cm。 透過橡膠輥子120a、120b而結束將感光性薄片22之 一片分積層於玻璃基板24時，該橡膠輥子120a的旋轉即 被停止，另一方面被積層該感光性薄片22之該玻璃基板24 -18 - 200922788 ，即，貼附基板24a係藉由基板運送輥子128b而予以夾住 〇 而且，橡膠輥子120b從離開橡膠輥子120a的方向縮 回而解除夾住，同時開始旋轉基板運送輥子128b，貼附基 板24a朝箭頭C方向被定量運送，感光性薄片22之基板間 位置移動到橡膠輥子120a之下方附近的既定位置。另一方 面，透過加熱裝置45使其次的玻璃基板24朝向貼附位置 運送。 其次的玻璃基板2 4的前端被配置在橡膠輥子1 2 0 a、 12 0b間時，該橡膠輥子1 20b上升，藉由該橡膠輥子120a 、120b該其次的玻璃基板24與感光性薄片22被夾住。而 且，在橡膠輥子120a、120b及基板運送輥子128b的旋轉 作用下開始積層，同時貼附基板24a朝箭頭C方向運送。 貼附基板24a朝箭頭C方向定量地被運送，藉由基板 間薄片切斷機構4 8玻璃基板2 4間的感光性薄片2 2被切斷 之後，通過冷卻機構1 3 0予以冷卻’再被移送到基底剝離 機構1 3 2。在此基底剝離機構1 3 2，貼附基板2 4 a在被吸附 保持於吸附墊1 34的狀態下’基底薄膜26及殘留部分3Ob 藉由機器人手柄1 36剝離，而獲得感光性積層體1 40。 其時，在吸附墊13 4之上游、下游及兩側方，從4方 向的側面對貼附基板24a的積層部分整體噴射去除靜電空 氣。此外，感光性積層體140，係被機器人142的手部142a 所保持而僅收容既定之數於感光性積層體儲存器146。 此種情況，在第1的實施形態，如第4圖所示，在加 -19- 200922788 熱裝置45與積層裝置46之間’玻璃基板24係藉由建構成 進給機構92之運送輥子80a被運送到該積層裝置46的貝占 附處理位置’同時透過第3紅外線加熱器9 0 c保溫於既定 的加熱溫度到該貼附處理位置的附近。 因此，玻璃基板24能有效地阻止加熱裝置45與積層 裝置46之橋跨部分的溫度降低，同時可提高該玻璃基板24 之面內溫度的均勻性。藉此，可及時的阻止氣泡被捲入感 光性薄片22與玻璃基板24之間或該感光性薄片22發生皺 紋等，可良好且確實地維持貼附基板24a的積層品質。 又，在建構成第2加熱機構78之本體部78a之箭頭C 方向的前端面，設置有進給機構9 2，該進給機構9 2 /係被 配置在積層裝置46的附近。 因此，尤其使用厚度薄且大型的玻璃基板24時，可確 實地保持此玻璃基板24之運送方向前端側，可圓滑、且確實 地將該玻璃基板24運送到建構成積層裝置46之橡膠輥子 120a 、 120b 間。 再者’又執行積層裝置46之維修作業等時，如以下， 後退第1加熱機構7 6及第2加熱機構7 8。即，在第1加熱 機構76 ’本體部76a沿著第1導軌86朝箭頭C1方向僅移 動既定的距離L1’同時建構成第2加熱機構78之本體部 7 8 a ’同樣地沿著第3導軌1 04朝箭頭c 1方向僅移動既定 的距離L1。在此’第1加熱機構76及第2加熱機構78掛 上有聯鎖以阻止朝箭頭C方向移動。 接著，在第2加熱機構78，本體部78a與可動台102 -20- 200922788 移 業 之 歇 基 體 相 而 樣 46 向 成 • ， 於 裝 上 體 1*52- 一體沿著第2導軌loo朝箭頭d方向（參照第5圖）僅 動既定的距離L2而被掛上聯鎖。 因此’在積層裝置46，於加熱裝置45側形成維修作 用的空間’作業者使用此空間可進行建構成積層裝置46 橡膠輥子120a、12〇b的清掃或更換等維修作業。 此外’在第1實施形態，玻璃基板24雖進行基於間 輸送之所謂批量輸送，但並不限定於此，亦可將該玻璃 板24適用建構成連續輸送。 第6圖係有關本發明之第2實施形態的感光性積層 之製造系統1 7 0的要部說明圖。此外，與第1實施形態 關之製造系統20同樣的構成元件賦予相同的參考符號， 省略其詳細說明。又，在以下說明之第3實施形態也同 ’將其詳細說明省略。 製造系統170，係具備有加熱裝置172及積層裝置 。加熱裝置172，係具備沿著基於輸送機構74而運送方 配裝，至少第1加熱機構174及第2加熱機構176。建構 第1加熱機構174之本體部174a，係被固定在基台821 同時建構成第2加熱機構丨7 6之本體部1 7 6 a，係被固定 該基台8 2上。 在此第2實施形態，尤其從加熱裝置1 7 2側到積層 置46之維修作業不要之際，可良好適用之外’可獲得與 述第1實施形態同樣的效果。 第7圖係有關本發明之第3實施形態的感光性積層 之製造系統190的要部說明圖。 -21 - 200922788 製造系統190，係具備有加熱裝置45及 。積層裝置192，係設置有基部構件194，在此 上，配置有支撐台196。框體198被支撐在ifc| 同時在該框體198內，被設置有複數個運送朝 紅外線加熱器90c。 在如此建構成的第3實施形態，收容運 第3紅外線加熱器9〇c之框體198，係透過支 設在積層裝置1 9 2側。因此，加熱裝置4 5側 簡化之外，可獲得與上述第1實施形態同樣 此外’在第3實施形態，雖使用加熱裝 此’亦可採用加熱裝i 172。又，使用第2力 外’另一方面替代第1加熱機構7 6，亦可採 構 174。 【圖式簡單説明】 第1圖係有關本發明之第1實施形態的 槪略構成圖。 第2圖係被使用於該製造系統之長狀感 面圖。 第3圖係將黏著標籤黏著於該長狀感光 的說明圖。 第4圖係該製造系統的要部說明圖d 第5圖係該製造系統的要部俯視說明圖 第6圖係有關本發明之第2實施形態的 槪略構成圖。 積層裝置192 :基部構件1 9 4 :支撐台1 9 6， $子80a及第3 送輥子80a及 撐台196而裝 的構成有效地 的效果。 置45，但替代 ]熱機構7 8之 用第1加熱機 製造系統之 光性薄片的剖 性薄片之狀態 製造系統之 -22- 200922788 第7圖係有關本發明之第3實施形態的製造系統之 槪略構成圖。 第8圖係日本專利特開平8 - 1 8 3 1 4 6號公報所揭示 之乾保護膜（dry resist film)之積層方法的說明圖。 【主要元件符號說明】 20、 170 ' 190 製 造 系 統 22 咸 光 性 薄 片 24 玻 璃 基 板 26 基 底 薄 膜 28 感 光 性 樹 脂 層 30 保 護 薄 膜 45、 172 加 熱 裝 置 4 6、 192 積 層 裝 置 74 運 送 機 構 76、 78 、 174 、 176 加 熱 機 構 76a、 78a 、 174a 、 176a 本 體 部 80、 80a 運 送 輥 子 84 固 定 台 9 0 & ~ 90c 紅 外 線 加 熱 器 92 進 給 機 構 94 退 避 機 構 96、 198 框 體 102 可 動 台 120a 、120b 橡 膠 輥 子 -23-[Technical Field] The present invention relates to a manufacturing system for a photosensitive laminate, comprising a heating device that preheats a substrate to a predetermined temperature, and attaches the photosensitive sheet to the heated A laminate device for the substrate at a predetermined temperature. [Prior Art] For example, a substrate for a liquid crystal panel, a substrate for a printed wiring, and a substrate for a PDP panel are attached to a surface of a substrate by a photosensitive sheet (photosensitive sheet) having a photosensitive material (photosensitive resin) layer. It is composed of a photosensitive laminate. In the photosensitive sheet, the photosensitive material layer and the protective film are sequentially laminated on the flexible plastic support. When the photosensitive sheet is produced, a substrate such as a glass substrate or a resin substrate is usually heated to a predetermined temperature in advance. Further, the photosensitive film which is partially or entirely peeled off of the protective film and the heated substrate are heated by pressure between the laminated rolls constituting one of the laminating devices, and the photosensitive material layer is thermocompression bonded on the substrate. Next, the photosensitive plastic support is peeled off from the substrate to produce a photosensitive laminate. For example, a method of laminating a dry resist film disclosed in Japanese Laid-Open Patent Publication No. Hei No. Hei. The cooling unit 3, the substrate upper film cutting unit 4, and the film removing unit 5 are attached based on the transport direction of the transport unit 6 along the substrate 7. In the substrate preheating section 1, the substrate 7 is sent to the laminate portion 2 after the substrate 7 has been heated to a predetermined temperature by the preheating heater 1a. In the laminated portion 2 200922788, a pair of laminated rolls 2a, 2b' are disposed, and the substrate 7 and the dry protective film 8 are transported between the laminated rolls 2a, 2b. Therefore, the dry protective film 8 is thermocompression bonded to the substrate. However, in the above-described conventional technique, between the substrate preheating portion 1 and the substrate insertion side of the buildup rolls 2a, 2b constituting the laminated portion 2 (hereinafter, also referred to as a bridge portion), since the substrate 7 is exposed indoors In the air, the temperature of the substrate 7 is easily lowered. However, the in-plane temperature distribution of the substrate 7 affects the build-up quality at the time of lamination, so that the in-plane temperature uniformity of the substrate 7 is an important factor for maintaining the build-up quality. Therefore, it is necessary to ensure the desired temperature of the substrate 7 at the time of lamination. For example, it is estimated that the temperature of the indoor air is lowered, and it is conceivable to set the set temperature of the substrate 7 higher than the target temperature. However, as the transport speed of the substrate 7 in the bridge portion is changed, and since the temperature of the peripheral portion of the substrate 7 is lowered more than the central portion, the in-plane temperature of the substrate 7 in the bridge portion is uniform. Sex will decrease. SUMMARY OF THE INVENTION The present invention has been made in an effort to solve the above problems, and an object thereof is to provide a manufacturing system of a photosensitive laminate which can effectively prevent a temperature decrease of a substrate of a bridge portion between a heating device and a laminate device. At the same time, the uniformity of the in-plane temperature of the s plate can be improved. The present invention relates to a manufacturing system for a photosensitive laminate comprising: a heating device for preheating a substrate to a predetermined temperature; and a layering device for attaching the photosensitive sheet to a predetermined temperature The substrate. 200922788 Moreover, between the heating device and the laminating device, a feeding mechanism for transporting the substrate to the attaching processing position of the laminating device is provided; and a heat insulating mechanism for heating the substrate to a predetermined temperature Keep warm to the vicinity of the attached processing location. In the present invention, between the heating device and the laminating device, the substrate is transported to the attaching processing position of the laminating device by the feeding mechanism, and is maintained at a predetermined temperature by the temperature keeping mechanism until the vicinity of the attaching processing position. Therefore, the substrate can effectively prevent the temperature of the bridge portion of the heating device and the laminating device from being lowered, and at the same time, the uniformity of the in-plane temperature of the substrate can be improved. Thereby, the build-up quality can be maintained well and surely. The above and other objects, features and advantages will be apparent from the description of the accompanying drawings. [Embodiment] The description of a preferred embodiment is shown in Fig. 1. The manufacturing system 20 for a photosensitive laminate according to the first embodiment of the present invention is used for the production of a color filter for liquid crystal or organic EL. In the process, a thermal transfer operation of the photosensitive resin layer 28 (described later) of the long photosensitive sheet 2 to the glass substrate 24 is performed. As shown in Fig. 2, the photosensitive sheet 22 used in the manufacturing system 20 is formed by laminating a flexible base film (support) 26, a photosensitive resin layer (photosensitive material layer) 28, and a protective film 30. Composition. As shown in Fig. 1, the manufacturing system 20 includes a photosensitive sheet roll 22a that winds the photosensitive sheet 22 in a cylindrical shape, and a sheet that feeds the photosensitive sheet 22 from the photosensitive sheet roll 22a. The delivery mechanism 32 200922788 • The protective film 30 of the photosensitive sheet 22 to be fed is formed into a processing mechanism 36 that is a half-cut portion 3 4 (see FIG. 2) that can be cut in the width direction; The adhesive label 38 of the non-adhesive portion 38a (refer to Fig. 3) is adhered to the label adhesive mechanism 40 of the protective film 30. Downstream of the label attachment mechanism 40, a reservoir mechanism 42 for changing the photosensitive sheet 22 from intermittent conveyance to continuous conveyance is disposed; and the protective film 30 is peeled off from the photosensitive sheet 22 at a predetermined length interval. The mechanism 44; the heating device 45 that transports the glass substrate 24 to the attached position while being heated to a predetermined temperature; and the photosensitive resin layer 28 exposed by peeling off the protective film 30 is attached to the glass substrate 24 The layering device 46. Further, in the following, the photosensitive sheet 22 is attached to the object to be processed of the glass substrate 24 by the layering device 46, and is referred to as a patch substrate 24a. In the vicinity of the upstream of the attaching position of the laminating device 46, a detecting mechanism 47 for directly detecting the half-cut portion 34 as the boundary position of the photosensitive sheet 22 is disposed, and at the same time, the respective glass substrates are disposed downstream of the stacking device 46. The inter-substrate sheet cutting mechanism 48 in which the photosensitive sheet 22 of the 24 sheets is cut. A sheet cutting mechanism 48a used at the start of the operation and at the end of the operation is provided upstream of the inter-substrate sheet cutting mechanism 48. In the vicinity of the downstream of the sheet feeding mechanism 3 2, an adhesive stage 49 for adhering the rear end of the photosensitive sheet 22 which has been substantially used to the tip end of the newly used photosensitive sheet 22 is disposed. A film end position detector 51 is disposed downstream of the adhesive stage 49 in order to control the deviation in the width direction due to the winding deviation of the photosensitive web roll 22a. The processing mechanism 36 is disposed downstream of the roller pair 50. The roller pair 50 200922788 is for calculating the winding diameter of the photosensitive web roll 22a accommodated in the sheet feeding mechanism 32. The processing mechanism 36 is provided with a single circular blade 52 that travels in the width direction of the photosensitive sheet 2 2 to form a half-cut portion 3 4 ° at a predetermined position of the photosensitive sheet 2 2 As shown in Fig. 2, it is necessary to cut at least the protective film 30 at the half-cut portion 34. Actually, in order to surely cut the protective film 30, the cutting depth of the circular blade 5 2 is set so as to be cut into the photosensitive resin layer 2 8 even to the base film 26. The half-cut portion 34 is set such that the spacers of the glass substrate 24 are set to enter a position of 10 mm from the both end portions of the glass substrate 24, respectively. The portion which is sandwiched between the glass substrate 24 and the half-cut portion 34 has a function as a mask when the photosensitive resin layer 28 is attached to the glass substrate 24 in a frame-like manner in the laminating device 46 to be described later. The label attaching mechanism 40 is provided with a residual portion 30b for protecting the film 30 in correspondence with the glass substrate 24, and an adhesive label 38 for connecting the peeling portion 30aa on the front side of the peeling side and the peeling portion 30ab on the rear side of the peeling side. As shown in Fig. 2, the protective film 30 is sandwiched by the residual portion 3 Ob, and the portion which is first peeled off serves as the front peeling portion 30aa, and the portion which is peeled off later serves as the rear peeling portion 30 ab. As shown in Fig. 3, the adhesive label 38 is formed in a book shape, for example, formed of the same resin material as the protective film 30. The adhesive label 38 is attached to the central portion with a non-adhesive portion (including micro-adhesive portion) 38 8a which is not coated with an adhesive, and is provided on both sides of the non-adhesive portion 38a, that is, at both ends of the adhesive label 38. The portion has a first adhesive portion 38b 200922788 adhered to the front peeling portion 30aa, and a second adhesive portion 38c adhered to the rear peeling portion 3Oab. As shown in Fig. 1, the label attaching mechanism 40 is provided with a plurality of adhesive labels 38 each having a plurality of adhesive labels 38 spaced apart at predetermined intervals, and the adhesive pads 54a to 54g are attached thereto, and the adhesive is adhered according to the adsorption pads 54a to 54g. The attaching position of the label 38 is disposed so as to be capable of accommodating the intermittent conveyance of the photosensitive sheet 22 on the upstream side, and the downstream side of the photosensitive sheet 22 for holding the photosensitive sheet 22 from below. In addition to the speed difference of the continuous conveyance of the photosensitive sheet 22, in order to prevent the fluctuation of the tension, the adjustment roller 61 which consists of the roller 60 which can swing in two rows is provided. Further, the rollers 60 may be one or three or more columns depending on the amount of storage. The peeling mechanism 44 disposed downstream of the storage unit mechanism 42 is provided with a tension suction drum 62 for reducing the tension fluctuation on the delivery side of the photosensitive sheet 22 and stabilizing the lamination. In the vicinity of the suction drum 62, the peeling roller 63 is disposed, and the protective film 30 peeled off from the photosensitive sheet 22 at an acute peeling angle by the peeling roller 63 is removed by the protective film take-up portion 64 except for the remaining portion 30b. Taken. A tension control mechanism 66 that can apply tension to the photosensitive sheet 22 is attached to the downstream of the peeling mechanism 44. The tension control mechanism 66 is provided with a cylinder block 68. Under the driving action of the cylinder block 68, the photosensitive sheet 2 2 in which the tension adjusting roller 70 is in sliding contact can be adjusted by the swinging displacement of the tension adjusting roller 70. tension. Further, the tension control mechanism 66 may be used as needed or may be omitted. The detecting mechanism 47 is provided with a photo-sensing device 72 such as a laser sensor and a photo sensor (Ph〇to_ -10 - 200922788 sensor), which directly detects the wedge of the half-cut portion 34 The groove shape portion and the step difference ' according to the thickness of the protective film 30' or the change in the combination are used as the boundary position signal. The photoinductor 7 2 is disposed opposite the support roller 73. Further, instead of the photodetector 72, an image inspection means such as a non-contact displacement gauge or a C C D camera can be used. As shown in Fig. 4, the heating device 45 includes a transport mechanism 74 for transporting the glass substrate 24 in the direction of the arrow C, and a plurality of at least a plurality of the transport units 74 depending on the transport direction of the transport mechanism 74. 1 heating mechanism 76 and second heating mechanism 7 8. The transport mechanism 74 is provided with a plurality of resin-shaped disk-shaped transport rollers 80' that are fitted in the direction of the arrow C. The transport roller 80 is attached to the main body portion 76a constituting the first heating mechanism 76 and constitutes the second The body portion 7 8 a of the heating mechanism 78. The first heating mechanism 76 is disposed on the upstream side of the second heating mechanism 78 in the direction of the arrow c, and the fixed table 84 is mounted on the base 82. On the fixing table 84, as shown in Figs. 4 and 5, a pair of guide rails 86 extending in parallel with each other in the direction of the arrow C are provided, on which the fitting body portion 76a can only advance and retreat in the direction of the arrow C. The established distance L1. The main body portion 7.6a is provided with an interlock (i n t e r 1 〇 c k) (not shown) at the front end portion in the arrow C direction and the rear end portion in the arrow C direction, and the main body portion 76a can be held at the advanced position. The retracted position of the main body portion 76a, that is, the entrance side of the glass substrate 24, is provided with a robot fence 88. In the main body portion 76a, above the transport lepton 80, for example, a plate type first infrared ray -11 - 200922788 heater 90a is provided. The second heating mechanism 78 includes a main body portion 78a, and the main body portion 78a is provided with a feeding mechanism 92 that extends to the vicinity of the laminating device 46 for transporting the glass substrate 24 to the attaching processing position of the laminating device 46. a third infrared heater (heat retention mechanism) 90c for holding the glass substrate 24 heated to a predetermined temperature in the vicinity of the attachment processing position, and a retracting mechanism 94 for the laminate portion 78a to be laminated Device 46 moves. The main body portion 718a is formed to communicate with the opening 98 in the frame body 96 to be described later, and in the main body portion 78a, the second infrared heater 90b which is located above the plurality of transport rollers 80, for example, is plated. The setting extends to the direction of arrow C. Further, a hot air heater can be used for the first and second infrared heaters 90a and 90b. The frame 96 extends to the side surface of the main body portion 78a on the distal end side in the direction of the arrow C, and is fixed to the width direction of the glass substrate 24 (in the direction of the arrow D in Fig. 5). A plurality of resin-shaped disk-shaped transport rollers 80 are disposed in the frame 96 in the direction of the arrow C to form a feed mechanism 9 2, and a plate-type third infrared heater 90c is provided above the transport roller 80 ( Or hot air heater). An opening 916a is formed in the frame body 96 to feed the glass substrate 24 to the layering device 46. The retracting mechanism 94 is provided with a pair of second guide rails 1 that extend parallel to each other on the base 82 in the direction of the arrow D. On the second guide rail 100, the rail platform 102 can be moved forward and backward in the direction of the arrow D. An interlock (not shown) is provided at the advancing and retracting position ' of the movable table i 〇 2 in the direction of the arrow D, and the movable table 102 can be held at two positions. -12- 200922788 On the movable table 102, a pair of guide rails 104 are arranged in the direction of the arrow C, and the main body C is placed on the guide rail 1〇4 to advance and retreat. The body portion 78a is fixed to the arrow adjacent to the laminating device 46. On the other hand, it can also be fixed at the position. The main body portion 78a is moved only in the direction of the arrow C1, and is movable in the direction of the arrow D along the guide rail 1〇〇. The moving distance L1 is set such that when the feeding mechanism 92 faces, the size of the laminating device 46 is not interfered, and the moving distance L2 is set to be the operator's maintenance work for the laminated type. In addition, the transporting mechanism 74 may be equipped with a lifting plate, and the glass substrate 24 may be floated to the side of the heating device 45 as shown in FIG. The unit 1 10 is for accommodating a plurality of glass substrates 24. 5 A unit (or air duct unit) 112 is attached to the side surfaces of the three sides except for the input and the outlet. The fan units 112, 110 are ejected to remove static clean air. Each of the glass substrates 24 that have been received by the 110 is sucked and taken out by the suction pad 1 16 of the robot, and is carried into the heating device laminating device 46, and is provided with rubber rollers 120a and 120b for laminating the temperature. . In the rubber, the support rollers 122a, 122b are in sliding contact therewith, while the roller holding portion 124 is pressed against the rubber roller 120b, and the portion 7 8a is provided in parallel with the distance L1 of the rear end position of the arrow C direction toward the rear end position of the arrow C direction. The direction of the arrow C1 in the direction of the dry head C1 moves to the direction of the arrow D. Air (not shown) is transported in the i c direction. The substrate storage substrate storage unit 11 is provided with a fan for removing the substrate, and the hand storage portion of the substrate storage portion 1 1 4 is 1 1 4 a 45. At the same time, it is heated to the predetermined; the rollers 1 20a, 1 20b are on the side of the support roller 122b. -13- 200922788 In the vicinity of the rubber roller 1 20a, a movable contact preventing roller 126 is provided to prevent the photosensitive sheet 22 from coming into contact with the rubber roller 120a. A preliminary heating portion 127 is provided in the vicinity of the upstream of the layering device 46 to prepare to heat the photosensitive sheet 22 to a predetermined temperature. The preliminary heating unit 1 27 is provided with, for example, a heating means such as an infrared rod heater. A film transport roller 128a and a substrate transport roller 128b are disposed between the laminating device 46 and the inter-substrate sheet cutting mechanism 48. On the downstream side of the inter-substrate sheet cutting mechanism 48, a cooling mechanism 130 is disposed, and on the downstream side of the cooling mechanism 130, a substrate peeling mechanism 133 is disposed. The cooling mechanism 130 cuts off the photosensitive sheet 22 between the attached substrates 24a by the inter-substrate sheet cutting mechanism 48, and then supplies cold air to the attached substrate 24a for cooling treatment. Specifically, the cold air temperature is 10 ° C, and the air volume is set to 1.0 to 2.0 m 3 /mln. Further, the cooling mechanism 130 may not be used, and the photosensitive laminate storage unit 146 described later is naturally cooled. In addition, air can be supplied based on the indoor air instead of the cold air. The substrate peeling mechanism 132 disposed downstream of the cooling mechanism 130 is provided with a plurality of adsorption pads 134 that are adsorbed from the lower side of the attached substrate 24a, and the attached substrate 24a is adsorbed and held by the adsorption pad 134 by the robot. The handle 136 peels off the base film 26 and the residual portion 30b. A blower for removing static electricity (not shown) is disposed upstream, downstream, and both sides of the adsorption pad 134, and the entire laminated portion of the attached substrate 24a is ejected from the four side faces to remove static electricity. In addition, in order to remove dust, the machine can be made vertical, or tilted, or turned over for peeling. Downstream of the substrate peeling mechanism 1 32, a photosensitive laminated body is provided for accommodating a plurality of photosensitive laminated bodies + 丨 4 〇. The photosensitive laminate 140' from which the base film 26 and the residual portion 30b are peeled off from the substrate peeling mechanism 132 from the attached substrate 24a is sucked by the adsorption pad 14 4 provided in the hand 142a of the robot 142, and is taken out and stored in Photosensitive laminate storage unit 14 6 . Further, the handle portion 14 2 a may be independent of adsorption, for example, using a friction-based retention method. In the photosensitive laminate storage unit 146, a dust removing fan unit (or duct unit) 112 is attached to the side surfaces of the three sides other than the input and the outlet. The fan unit 112' blows clean air from the inside of the photosensitive laminate storage unit 146 to remove static electricity. In the manufacturing system 20, the sheet feeding mechanism 32, the processing mechanism 36, the label attaching mechanism 40, the reservoir mechanism 4, the peeling mechanism 44, the tension control mechanism 66', and the detecting mechanism 47 are disposed above the stacking device 46. In contrast, the sheet feeding mechanism 3 2 to the detecting unit 47 may be disposed below the layering device 46 to make the photosensitive sheet 22 upside down and the photosensitive resin layer 28 It is attached to the lower side of the glass substrate 24, and the manufacturing system 20 may be integrally formed on a straight line. The manufacturing system 20 is controlled by the build-up process control unit 150. Each of the functional parts of the manufacturing system 20 is provided with, for example, a build-up control unit 15 2, a substrate heating control unit 154, and a base peeling control unit. 1 5 6 etc. These are connected to each other by the in-process network. The build-up process control unit 150 is connected to the factory network, and performs production management and operation management of instruction information (condition setting and production information) from a factory CPU (not shown) for production. -15- 200922788 The stacking control unit 152 controls the respective units as the main unit of the entire process, and based on the position information of the half-cut portion 34 of the photosensitive thinness detected by the detecting unit 47, for example, The control mechanism that controls the heating 45. The base peeling control unit 156 separates the base film 26 from the bonding plate 24a supplied from the laminating device 46, and further performs the discharging operation of the light-controlling laminated body 140 in the downstream process, and simultaneously controls the attaching of the attached substrate. And information of the photosensitive laminate 110. In the manufacturing system 20, the first chamber 162a and the second clean room 162b are partitioned by the partition wall 160. In the first clean room 162a, the sheet feeding mechanism 32 is accommodated to the sheet-force control unit 66, and the second clean room □ is accommodated from the detecting unit 47. The first clean room 162a and the second chamber 162b communicate with each other through the penetration portion 164. The operation of the manufacturing system 20 will be described below. First, as shown in Fig. 1, 'the processing mechanism 36 moves the circular blade 52 in the width direction of the optical sheet 22, and the photosensitive sheet 22 is cut into half from the film 30 to the photosensitive material layer 28 or even to the base film 26. Part 3 4 (refer to Figure 2). As a result, as shown in Fig. 1, the photosensitive sheet is stopped in the direction of the arrow A corresponding to the remaining portion 3b of the protective film 30, and the half-cut portion 34 is formed under the travel of the circular blade 52. Thus, in the photosensitive sheet 22., the front peeling portion 30 aa and the rear peeling 30ab (see Fig. 2) are provided with the portion 30b interposed therebetween. Next, the photosensitive sheet 22' is transported to the labeling machine. Function t 22 Device attachment sense: 24a Dust free from thin 162b Dust-free protection and shape 22 > Size effect residual part 1 40 -16 - 200922788 The predetermined attachment portion of the protective film 30 is disposed on the cap 56. The label adhesive mechanism 40' has a predetermined number of adhesive labels 38 that are adsorbed and held by the adsorption of 5 4a to 5 4g, and the adhesive labels 38 are adhered across the protective film 30 residual portion 30b' to adhere the front peeling portion 30aa to the rear peeling portion 30ab. Integral (see Figure 3). For example, the photosensitive sheet 2 2 of the adhesive label 38 adhered to the seven sheets is not transported by the reservoir unit 42 to prevent the tension fluctuation of the feed and is continuously conveyed to the peeling mechanism 44 as shown in Fig. 1 . In the peeling mechanism 44, the base film 26 of the photosensitive thin film 22 is suction-held by the suction drum 62, while the protective film leaves the residual portion 30b and is peeled off from the photosensitive sheet 22. This protective film is taken up by the film take-up portion 64 by being peeled off at an acute angle of peeling by the peeling roller 63. Under the action of the peeling mechanism 44, after the protective film 30 leaves the residual portion 3〇b and is peeled off from the base film 26, the photosensitive sheet 22' is subjected to tension adjustment by the transmission force control mechanism 66, and further, the detecting mechanism 47 is used for photoelectric The sensor 72 performs the detection of the half-cut portion 34. The photosensitive sheet 2 2 is quantitatively transported to the laminate 46 by the rotation of the film transport roller 1 28 a in accordance with the detection information of the half-cut portion 34. At this time, the contact preventing roller 126 stands by while the rubber roller 120b is disposed below. On the other hand, in the heating device 45, the heating temperature in the first and second heating mechanisms 76 and 78 is set in accordance with the layer temperature in the layering device 46, for example, when the layering temperature is 1 1 〇 ° C, 1 and the second infrared heating 9 〇a, 90b, and the heating temperature in the first and second heating mechanisms 76, 78 is set in the back of the pad, such as the back piece 30, and the thickness of the pad is set to be -17- 200922788 is around 1 20 °C. Therefore, the robot 114 grips the glass substrate 24 accommodated in the substrate stocker 110, and carries the glass substrate 24 into the first heating mechanism 76. In the first heating mechanism 76, as shown in Fig. 4, after the glass substrate 24 is heated by the heating of the first infrared heater 90a, the glass substrate 24 is sent to the second heating mechanism by the transport mechanism 74. 7 8. In the second heating mechanism 78, the glass substrate 24 is heated by the second infrared heater 90b, and the glass substrate 24 is maintained at a predetermined temperature state by the third infrared heater 90c. The layering device 46. In the laminating device 46, the attachment portion of the glass substrate 24 corresponding to the photosensitive resin layer 28 of the photosensitive sheet 22 is temporarily disposed between the rubber rolls 1 2 0 a and 1 2 0 b. In this state, the support roller 1 22 and the rubber roller 120b are raised by the roller holding portion 146, and the glass substrate 24 is sandwiched between the rubber rollers 120a and 120b with a predetermined pressing pressure. Further, under the action of the rotation of the rubber roller 120a, the photosensitive resin layer 28 is transferred (laminated) to the glass substrate 24 by heat fusion. Here, as the lamination condition 'speed is / min~10.0 m/_.min, the temperature of the rubber rollers 120a and 120b is 80 ° C to 150 ° C. The hardness of the rubber rollers 120 a and 120 b is 40 to 90 degrees. The pressing pressure (linear pressure) of the rubber rollers 120a and 120b is 50 N/cm to 400 N/cm. When one of the photosensitive sheets 22 is layered on the glass substrate 24 by the rubber rollers 120a and 120b, the rotation of the rubber roller 120a is stopped, and the glass substrate 24-18 of the photosensitive sheet 22 is laminated. - 200922788, that is, the attached substrate 24a is sandwiched by the substrate transporting roller 128b, and the rubber roller 120b is retracted from the direction away from the rubber roller 120a to be detached, and the substrate transport roller 128b is started to be rotated and attached. The substrate 24a is quantitatively conveyed in the direction of the arrow C, and the position between the substrates of the photosensitive sheet 22 is moved to a predetermined position near the lower side of the rubber roller 120a. On the other hand, the secondary glass substrate 24 is transported toward the attaching position by the heating device 45. When the front end of the second glass substrate 24 is disposed between the rubber rolls 1 2 0 a and 12 0b, the rubber roll 1 20b is raised, and the second glass substrate 24 and the photosensitive sheet 22 are replaced by the rubber rolls 120a and 120b. Clamped. Further, lamination is started by the rotation of the rubber rollers 120a and 120b and the substrate conveyance roller 128b, and the attached substrate 24a is conveyed in the direction of the arrow C. The attached substrate 24a is quantitatively conveyed in the direction of the arrow C, and the photosensitive sheet 2 2 between the glass substrate 24 is cut by the inter-substrate sheet cutting mechanism 48, and then cooled by the cooling mechanism 130. Transfer to the substrate peeling mechanism 1 3 2 . In the substrate peeling mechanism 1 32, the attached substrate 24a is peeled off by the robot handle 136 in a state where the substrate 2 4a is adsorbed and held by the adsorption pad 134, thereby obtaining the photosensitive laminate 1 40. At this time, on the upstream side, the downstream side, and the both sides of the adsorption pad 13 4, the laminated portion of the attached substrate 24a is sprayed and removed from the entire surface in the four directions. Further, the photosensitive laminated body 140 is held by the hand 142a of the robot 142 and accommodates only a predetermined number of the photosensitive laminated body reservoir 146. In this case, in the first embodiment, as shown in Fig. 4, between the heating device -19-200922788 and the laminating device 46, the glass substrate 24 is formed by the conveying roller 80a which constitutes the feeding mechanism 92. The shelling processing position 'conveyed to the layering device 46 is simultaneously insulated by the third infrared heater 90c to a predetermined heating temperature to the vicinity of the attaching processing position. Therefore, the glass substrate 24 can effectively prevent the temperature of the bridge portion of the heating device 45 and the stacking device 46 from being lowered, and at the same time, the uniformity of the in-plane temperature of the glass substrate 24 can be improved. Thereby, it is possible to prevent the bubbles from being caught between the photosensitive sheet 22 and the glass substrate 24 or wrinkles of the photosensitive sheet 22, and the laminated quality of the attached substrate 24a can be favorably maintained. Further, a feed mechanism 9 2 is provided on the front end surface of the main body portion 78a constituting the second heating mechanism 78 in the direction of the arrow C, and the feed mechanism 9 2 / is disposed in the vicinity of the stacking device 46. Therefore, in particular, when the glass substrate 24 having a small thickness and a large size is used, the front end side of the glass substrate 24 in the conveyance direction can be surely held, and the glass substrate 24 can be smoothly and reliably conveyed to the rubber roller 120a constituting the lamination device 46. , 120b. Further, when the maintenance work of the build-up device 46 is performed, the first heating mechanism 7 6 and the second heating mechanism 7 are retracted as follows. In other words, the first heating unit 76' body portion 76a moves along the first rail 86 in the direction of the arrow C1 by only a predetermined distance L1' while constructing the main body portion 7 8 a' of the second heating mechanism 78. The guide rail 104 moves only a predetermined distance L1 in the direction of the arrow c1. Here, the first heating mechanism 76 and the second heating mechanism 78 are interlocked to prevent movement in the direction of the arrow C. Next, in the second heating mechanism 78, the main body portion 78a and the movable table 102 -20- 200922788 are moved to the base of the body, and the upper body is 1*52-integrated along the second guide rail. The d direction (refer to Fig. 5) is interlocked only by moving the predetermined distance L2. Therefore, the space in which the maintenance device is formed on the side of the heating device 45 is formed by the operator. The operator can use this space to perform maintenance work such as cleaning or replacement of the rubber rollers 120a and 12b of the laminating device 46. Further, in the first embodiment, the glass substrate 24 is transported by so-called mass transfer based on the intermediate transport. However, the present invention is not limited thereto, and the glass plate 24 may be applied to form a continuous transport. Fig. 6 is an explanatory view of a principal part of a manufacturing system 170 of the photosensitive laminate according to the second embodiment of the present invention. The same components as those of the manufacturing system 20 of the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. In the third embodiment described below, the detailed description thereof will be omitted. The manufacturing system 170 is provided with a heating device 172 and a laminating device. The heating device 172 is provided to be transported along the transport mechanism 74, and at least the first heating mechanism 174 and the second heating mechanism 176. The main body portion 174a of the first heating mechanism 174 is fixed to the base 821 and the main body portion 177a of the second heating mechanism 丨7 6 is simultaneously fixed to the base 8 2 . In the second embodiment, in particular, when the maintenance work of the heating device 177 side to the stacking unit 46 is not required, the same effects as those of the first embodiment can be obtained. Fig. 7 is an explanatory view of a principal part of a manufacturing system 190 for a photosensitive laminate according to a third embodiment of the present invention. -21 - 200922788 The manufacturing system 190 is provided with heating means 45 and . The layering device 192 is provided with a base member 194, on which a support table 196 is disposed. The frame 198 is supported at ifc| while in the frame 198, a plurality of transports are provided toward the infrared heater 90c. In the third embodiment constructed as described above, the casing 198 for accommodating the third infrared heater 9A is perforated and supported on the side of the laminating device 192. Therefore, the heating device 45 can be simplified in the same manner as in the above-described first embodiment. In the third embodiment, the heating device i 172 can be used. Further, instead of the first heating means 7 6 on the other hand, the second heating means 7 may be employed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic block diagram showing a first embodiment of the present invention. Figure 2 is a long view of the manufacturing system used. Figure 3 is an explanatory view showing the adhesion of the adhesive label to the long photosensitive light. Fig. 4 is a schematic plan view of a main part of the manufacturing system. Fig. 6 is a schematic block diagram showing a second embodiment of the present invention. The laminating device 192: the base member 1 94: the support table 196, the sub-80a, the third feed roller 80a, and the support 196 are provided to have an effective effect. 45. However, instead of the thermal mechanism, the state of the cross-sectional sheet of the optical sheet of the first heater manufacturing system is -22-200922788. FIG. 7 is a manufacturing system according to the third embodiment of the present invention. The outline of the composition. Fig. 8 is an explanatory view showing a lamination method of a dry resist film disclosed in Japanese Laid-Open Patent Publication No. Hei 08-128. [Description of main component symbols] 20, 170 ' 190 Manufacturing system 22 Light-sensitive sheet 24 Glass substrate 26 Base film 28 Photosensitive resin layer 30 Protective film 45, 172 Heating device 4 6, 192 Laminating device 74 Transport mechanism 76, 78 174, 176 heating mechanism 76a, 78a, 174a, 176a body portion 80, 80a transport roller 84 fixed table 90 and 90C infrared heater 92 feed mechanism 94 retraction mechanism 96, 198 frame 102 movable table 120a, 120b rubber Roller-23-