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TW200920799A - Coating composition and article using the same - Google Patents

Coating composition and article using the same Download PDF

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Publication number
TW200920799A
TW200920799A TW097132252A TW97132252A TW200920799A TW 200920799 A TW200920799 A TW 200920799A TW 097132252 A TW097132252 A TW 097132252A TW 97132252 A TW97132252 A TW 97132252A TW 200920799 A TW200920799 A TW 200920799A
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TW
Taiwan
Prior art keywords
fluoropolymer
coating
coating composition
solvent
article
Prior art date
Application number
TW097132252A
Other languages
Chinese (zh)
Inventor
Fumio Karasawa
Original Assignee
3M Innovative Properties Co
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Publication date
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Publication of TW200920799A publication Critical patent/TW200920799A/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • F21V31/04Provision of filling media
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/015Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0212Resin particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

To provide a coating composition which is excellent in water resistance, insulating properties and ultraviolet degradation resistance, and is also excellent in transparency of a coating film formed after coating.

Description

200920799 九、發明說明: 【發明所屬之技術領域】 本揭不案係關於一種塗覆組合物及一種使用該組合物之 物件。 【先前技術】 使用氟聚合物之塗覆組合物通常為已知的且由於諸如防 • 水性之性能而被廣泛使用。 日本公開案第6-1 1 653 1號描述一種用於水性塗覆薄臈之 含有基於氟之聚合物之外塗材料,其用以向諸如屋頂、陽 台及浴室之建築結構賦予防水性。此水性外塗材料為複合 防水層,其包含包括基於乙酸乙烯酯之共聚物之水性分散 溶液(組分A)及水泥黏合劑的防水塗覆薄膜層及包含組份 A、氟聚合物分散溶液及顏料之塗覆薄膜層。 日本公開案第57-34107號及第57-34108號描述一種能夠 溶於有機溶劑中用以在烘烤塗覆材料及其他塗覆材料中展 示防水性之含氟共聚物。 f \ ^ 此外,日本公開案第8-2 17993號描述一種防流體塗覆材 料’其包含低分子量四氟乙烯樹脂及黏合劑樹脂之顆粒, 其適用於塗覆在汽車車身及餐具上。 此外,曰本公開案第5-1 52067號描述一種EL(電致發光) 發光元件’其中發光部分經保護層密封,該保護層包含塗 覆在發光部分之整個周邊的由基於氣之單體形成之防水塗 層及由以商品名"TEFLON"出售之材料或聚矽氧管形成之 防水層。 134045.doc 200920799 另一方面,日本公開案第20034 143〇4號揭示一種包含 透明基板及至少一在該透明基板上形成之單一光散射層的 抗反射薄膜,其未直接涉及賦予防水性之塗覆組合物。曰 本公開案第2003-1 14304號描述一種光散射層,其含有半 透明精細顆粒及半透明樹脂且該等半透明精細顆粒與該半 透明樹脂之間折射率之差異為〇 〇2或更大及〇.丨5或更小。 亦包括聚本乙稀珠粒作為半透明精細顆粒且包括雙(心甲基 丙烯醯基噻吩基)硫化物作為半透明樹脂。據描述可調節 折射率之差異以便獲得較佳光散射角。200920799 IX. Description of the invention: [Technical field to which the invention pertains] This disclosure relates to a coating composition and an article using the same. [Prior Art] A coating composition using a fluoropolymer is generally known and widely used due to properties such as water repellency. Japanese Laid-Open Publication No. 6-1 1 653 No. 1 describes a fluorine-containing polymer overcoat material for aqueous coating of a thin crucible for imparting water repellency to a building structure such as a roof, a balcony and a bathroom. The aqueous overcoat material is a composite waterproof layer comprising a water-repellent coating film layer comprising an aqueous dispersion solution (component A) based on a copolymer of vinyl acetate and a cement binder, and a component A, a fluoropolymer dispersion solution And a coating film layer of the pigment. Japanese Laid-Open Publication No. 57-34107 and No. 57-34108 describe a fluorine-containing copolymer which is soluble in an organic solvent for exhibiting water repellency in baking coating materials and other coating materials. f \ ^ In addition, Japanese Patent Publication No. 8-2 17993 describes a fluid-repellent coating material which contains particles of a low molecular weight tetrafluoroethylene resin and a binder resin, which are suitable for coating on automobile bodies and tableware. In addition, the present invention discloses an EL (electroluminescence) light-emitting element in which the light-emitting portion is sealed by a protective layer containing a gas-based monomer coated on the entire periphery of the light-emitting portion. A waterproof coating formed and a waterproof layer formed from a material sold under the trade name "TEFLON" or a polyfluorene tube. 134045.doc 200920799 On the other hand, Japanese Patent Publication No. 20034143-4 discloses an antireflection film comprising a transparent substrate and at least one single light scattering layer formed on the transparent substrate, which is not directly related to imparting water repellency Covering the composition. The present disclosure describes a light-scattering layer containing translucent fine particles and a translucent resin and having a difference in refractive index between the translucent fine particles and the translucent resin of 〇〇 2 or more. Big and 〇. 丨 5 or less. Polyethylene beads are also included as translucent fine particles and include bis(cardomethyl propylene sulfhydryl) sulfide as a translucent resin. The difference in refractive index can be adjusted to achieve a better light scattering angle.

LED(發光一極體)之使用已曰漸增加。舉例而言,[ED 已愈來愈多地用於發光交通信號裝置。因為該等交通信號 裝置已使用寬大且堅固之外殼來維持高防水性,所以用 LED替換此等裝置中所用之電燈泡及螢光燈以實現節能且 減少維護成本。LED在汽車紅色尾燈中之使用亦已日漸增 加。 雖然LED自身在發光裝置(諸如,交通信號裝置)中呈攜 帶型晶片形式,但需要大尺寸基座來安裝LED晶片,且需 要大尺寸透明外殼或覆蓋層來提供防水能力。此外,預期 在將來,在例如高速公路照明及外部照明中之照明裝置中 所用的LED可在夜間開啟以實現進一步節能。考慮到以上 交通信號裝置之此等方面及問題,較佳提供耐用、體積不 大且具防水性之發光裝置,諸如交通信號裝置或外部照明 系統。另外’需要在用防水塗覆組合物塗覆設備之後,該 設備之内部透明以便於後續修理。 134045.doc 200920799 為解決此等問題,考慮用防水塗覆材料密封用作發光裝 置之LED以賦予LED防水功能。然而,習知防水塗覆材料 之絕緣性不足且其抗紫外線降解性較差,此限制其在戶外 之使用。 【發明内容】 因此,希望提供一種具有極佳防水性、絕緣性及抗紫外 線降解性之塗覆組合物,其密封配線、電接觸及電線之導 電部分以提供耐用、體積不大且防水之裝置,諸如發光裝 〇 置。 本揭示案包括以下態樣。 在一實施例中’提供一種包含氟聚合物A、氟聚合物B 及溶劑之塗覆組合物,其中氟聚合物A可溶於溶劑中,且 氟聚合物B呈顆粒狀且不溶於溶劑中。 在另一實施例中’提供一種包含物件及由塗覆組合物形 成之塗層的物件,其中該塗覆組合物用於密封該物件之至 少一導電部分。 〇 如易於由以下描述瞭解,如本文所用之"導電部分"包括 用於構成本揭示案之物件之任何電連接構件。合適之電連 . 接構件之實例包括(但不限於)電接觸,諸如電/電子電路、 導線、倒裝晶片及凸塊。在本揭示案中,天線亦 稱為”導電部分 另外,如本文所用之”功能元件”包括可在電子裝置及其 他設備中主動或被動作用之可選部件。功能裝置之典型實 例包括(但不限於)發光裝置(諸如,LED晶片)、半導體元 134045.doc 200920799 件(諸如’ ic(積體電路)晶片或LSI(閃電成像感應器 (lightening imaging Sensor))晶片)、電容器(capacit〇r/ condenser)、反應器、電感器及電阻器。 【實施方式】The use of LEDs (light-emitting diodes) has gradually increased. For example, [ED has been increasingly used for illuminated traffic signal devices. Because these traffic signal devices have used a large and sturdy casing to maintain high water resistance, replacing the light bulbs and fluorescent lamps used in such devices with LEDs saves energy and reduces maintenance costs. The use of LEDs in automotive red taillights has also increased. While the LED itself is in the form of a carrier-type wafer in a light-emitting device, such as a traffic signal device, a large-sized pedestal is required to mount the LED wafer, and a large-sized transparent casing or cover layer is required to provide water repellency. Furthermore, it is expected that in the future, LEDs used in lighting devices such as highway lighting and exterior lighting can be turned on at night to achieve further energy savings. In view of such aspects and problems of the traffic signal device above, it is preferred to provide a durable, bulky, and waterproof light-emitting device such as a traffic signal device or an external lighting system. In addition, it is desirable to have the interior of the device transparent for subsequent repair after the device has been coated with the water-repellent coating composition. 134045.doc 200920799 To solve these problems, it is considered to seal the LED used as a light-emitting device with a waterproof coating material to impart waterproof function to the LED. However, conventional waterproof coating materials are insufficient in insulation and are resistant to ultraviolet degradation, which limits their use outdoors. SUMMARY OF THE INVENTION Accordingly, it is desirable to provide a coating composition having excellent water repellency, insulation, and resistance to ultraviolet degradation, which seals wiring, electrical contacts, and conductive portions of wires to provide a durable, bulky, and waterproof device. , such as a lighting device. The present disclosure includes the following aspects. In one embodiment, 'providing a coating composition comprising fluoropolymer A, fluoropolymer B and a solvent, wherein fluoropolymer A is soluble in a solvent, and fluoropolymer B is in the form of particles and is insoluble in a solvent. . In another embodiment, an article comprising an article and a coating formed from the coating composition is provided, wherein the coating composition is used to seal at least one electrically conductive portion of the article. As will be readily appreciated by the following description, "conductive portion" as used herein includes any electrical connection member used to construct the articles of the present disclosure. Examples of suitable electrical connections include, but are not limited to, electrical contacts such as electrical/electronic circuits, wires, flip chips, and bumps. In the present disclosure, an antenna is also referred to as a "conducting portion. In addition, a functional element as used herein includes optional components that can be actively or passively acted upon in electronic devices and other devices. Typical examples of functional devices include (but not Limited to light-emitting devices (such as LED chips), semiconductor elements 134045.doc 200920799 (such as 'ic (integrated circuit) wafers or LSI (lightening imaging sensors) wafers), capacitors (capacit〇r/ Condenser), reactor, inductor, and resistor.

在密封導電部分(諸如,電/電子電路、電配線、電接觸 或電線)之狀況下,提供一種可易於形成密封層(在本揭示 案下文中稱為"塗層")之塗覆組合物。塗覆組合物亦可賦予 所得密封物件極佳防水性、絕緣性及耐久性,尤其抗紫外 線降解性,β亥專性質來源於塗層之物理性質。 ’' 另外,本揭示案含有不溶於溶劑之乳聚合物顆粒且因此 可在不縮短工作壽命乃至乾缝覆組合物之情況下適當改 良度。因此,進行塗覆組合物之厚塗覆變得容易且可藉 由單次塗覆操作形成厚的透明塗覆薄膜。 此外,此塗覆組合物易於(例如)藉由將氟聚合物溶於溶 财且分散氟聚合物㈣製備得到,2因此可藉由簡單塗 =式(諸如,刷塗或浸塗)來塗覆。因此,此塗覆組合物 ^覆於甚至具有不規則表面之介體(例如,包含安 ;面上之LED晶片的電路板或包 晶片的半導體基板)上。 四馮所得塗層具有極佳防水性 性,尤豆P|工丨土⑺不性、絕緣性及耐久 牯榭夕々a W 4『月匕&供利用此等極佳 特伐之各種物件,例如戶外廣告 練•驻垩 Λ 直之led裝置、交通作In the case of sealing a conductive portion such as an electric/electronic circuit, an electric wiring, an electrical contact or a wire, a coating which can be easily formed into a sealing layer (hereinafter referred to as "coating" in the present disclosure) is provided. combination. The coating composition also imparts excellent water repellency, insulation and durability to the resulting sealed article, particularly against UV degradation, which is derived from the physical properties of the coating. In addition, the present disclosure contains emulsion polymer particles which are insoluble in the solvent and thus can be suitably modified without shortening the working life or even the dry seam coating composition. Therefore, it is easy to carry out the thick coating of the coating composition and a thick transparent coating film can be formed by a single coating operation. Further, the coating composition is easily prepared, for example, by dissolving a fluoropolymer in a solvent and dispersing the fluoropolymer (IV), and thus can be applied by a simple coating method such as brushing or dip coating. cover. Therefore, the coating composition is coated on a dielectric body having an irregular surface (for example, a circuit board including an LED chip on the surface or a semiconductor substrate including a wafer). The coating obtained by Sifeng has excellent water repellency, and the Bean P|Working Soil (7) is inferior, insulating and durable. A W 4 "Moon 匕 & , for example, outdoor advertising training, stationed in the straight led device, traffic

號裝置、電致發光裝置、其他電裝置、 乂通L 雷始 ,,^ '、、、明系統及經爹霜 電線。此等物件即使在曝露 及丄定覆 ” 光或風雨時,亦可長時 134045.doc 200920799 間穩定保持極佳特徵。舉例而言,認為本揭示案之物件可 連續使用約1 〇年而不會引起特徵退化及損壞。當然,因為 本揭示案之塗覆組合物含有氟聚合物作為基底,所以有可 能賦予所得物件其他良好特徵:諸如極佳防水性、絕緣性 及财久性(尤其抗紫外、線降解性以及耐熱性及抗油性或抗 污染性)。 此外,即使不在水中使用物件,本揭示案之物件亦具有 極佳防水性(日本工業標準C0920(對應於IEC6〇529)防護級 7或更咼級(防水浸型):浸入足以造成不利影響之量之水 中,甚至浸於15 (:„1至1 m深之水中達3〇分鐘亦無影響之程 度)且因此可能在較為接近在水中使用之條件下使用。舉 例而言,在需要直流(Dc)電源之發光裝置(諸如,使用 LED之裝置)之狀況下,與使用(例如)電燈泡或螢光燈之需 要交流(AC)電源之習知發光裝置相比,耐水性(亦即,防 水性)極為重要。在使用交流電源之裝置之狀況下,即使 部分絕緣材料略微被水損壞,亦不會由於水電解而產生大 量氧及氫。相反,在使用直流電源之裝置之狀況下,若絕 緣材料受損’則擔心可能因水電解而產生氧及氫。此外, 由銅、鉛或銀製成之用於連接之配線傾向於電離且溶解於 水中。然而’因為本揭示案之塗覆組合物之防水性極佳, 所以當將塗覆組合物塗佈於LED上且將所得led置放於戶 外或置放於LED可能受潮之場所(濕度高之場所或可能出現 露水凝結之位置)時,LED並未損壞且其不會變得不可使 用。因為將耐久性、尤其抗紫外線降解性添加至此等特徵 134045.doc 200920799 之其他物件及其部分(例 布材料表面、地板材料表 中’所以未來可期望本揭示案 如’木材表面、紙材料表面、 面)之市場擴張。 =揭示案提供-種塗覆組合物及—種物件(例如,咖 裝置、各種電裝置及天線),其中導電部分(諸如,配線、 電接觸或電線)係藉由用該塗覆組合物塗覆來密封。No. device, electroluminescent device, other electric device, 乂通L 雷, , ^ ', ,, Ming system and 爹 frost wire. These objects can maintain excellent characteristics for a long period of time between 134045.doc and 200920799 even when exposed and smeared with light or wind and rain. For example, it is considered that the items in this disclosure can be used continuously for about 1 year without Deterioration and damage of the features may occur. Of course, since the coating composition of the present disclosure contains a fluoropolymer as a substrate, it is possible to impart other good characteristics to the resulting article: such as excellent water repellency, insulation, and longevity (especially resistance) UV, line degradability and heat resistance and oil resistance or stain resistance. In addition, even if the object is not used in water, the object of this disclosure has excellent water resistance (Japanese Industrial Standard C0920 (corresponding to IEC6〇529) protection level 7 or higher grade (waterproof dip type): immersed in water in an amount sufficient to cause adverse effects, even immersed in 15 (: „1 to 1 m deep water for 3 〇 minutes has no effect) and therefore may be Used close to the conditions of use in water. For example, in the case of a light-emitting device requiring a direct current (Dc) power source (such as a device using an LED), and using (for example) Water resistance (ie, water resistance) is extremely important in light bulbs or fluorescent lamps that require an alternating current (AC) power source. Even in the case of an AC power source, even some of the insulating material is slightly damaged by water. In addition, in the case of a device using a DC power source, if the insulating material is damaged, it is feared that oxygen and hydrogen may be generated by water electrolysis. In addition, copper and lead may be generated. The wiring made of silver or silver for connection tends to be ionized and dissolved in water. However, since the coating composition of the present disclosure is excellent in water repellency, when the coating composition is coated on the LED and the resulting led When placed outdoors or placed in a place where the LED may be exposed to moisture (high humidity or where dew condensation may occur), the LED is not damaged and it will not become unusable because of durability, especially UV degradation. Sexually added to other objects of this feature 134045.doc 200920799 and parts thereof (in the case of cloth material surface, floor material table), so the future can be expected as a wood table Market expansion of paper surface, surface). Revealing provides a coating composition and an article (eg, coffee maker, various electrical devices and antennas) in which conductive parts (such as wiring, electrical contacts or wires) ) is sealed by coating with the coating composition.

在一實施例中,藉由將不溶於溶劑之I聚合物(氣聚人 物顆粒分散於實質上包含可溶於溶劑之^合物(椒 3有办於其中之氟聚合物之溶劑的塗覆組合物中來製備塗 覆組合^術語"可溶於溶劑之氟聚合物"意謂溶劑血由氟 聚合物製成之溶質的混合物在宏觀狀態上展示穩定、單一 且均勻之液體狀態的氟聚合物。同樣,術語”不溶於溶劑 之氟聚合物•’意謂分散於溶劑中之氟聚合物。氟聚合物八之 折射率與氟聚合物R折射率之間的差異較佳小於0.15, 此係因為其可提供透明塗層。 本揭示案中所用之氟聚合物A可展示各種特徵,諸如分 子結構及分子中所含之有用氟原子。舉例而言,氟聚合物 A實質上為透明的且並不會對光透射造成不利影響。氣聚 合物A亦具有防水性、絕緣性、耐久性(包括抗紫外線降解 性、耐熱性及抗油性(抗污染性))之特定特徵。此外,本揭 示案之氟聚合物A可易於溶於溶劑中且因此可易於藉由塗 覆來施加。詳吕之’因為本揭示案中所用之氟聚合物A及 溶劑不一定需要加熱來使氟聚合物溶解,所以不僅顯著改 良處理性質,且亦增加氟聚合物A之使用範圍。在先前技 134045.doc •10- 200920799 術中,需要藉由在塗覆組合物中使用添加劑(諸如,反應 催化劑或交聯㈣丨人交聯結構以形成氟樹脂塗層來增加 薄膜強度。然』’在本揭示案中,無需使用可反應以交聯 氣聚合物之§玄等添加劑。 在本揭示案之一實施例中,未特別限制氟聚合物A,只 要其具有上述極佳特徵且亦在所得塗覆組合物及物件中充 分展示^等特徵即可,且其包括各種基於氟之樹脂及基於 氟之橡膝另外,氟聚合物A之分子量可在寬範圍内變 化,但通常為約10,000或更多。當分子量小於1〇,〇〇〇時, 其不可能在’塗覆組合物乾燥後形成樹脂薄膜。a聚合物A 之分子量較佳在約50,000至200,〇〇〇之範圍内,且更佳為約 50,000至150,000。當氟聚合物a具有高分子量時較令人 滿意地展示上述特徵。氟聚合物A之分子量意謂藉由 ASTM D4001-93 (2006): Standard Test Method forIn one embodiment, by dissolving a solvent-insoluble I polymer (gas-polymerized human particles in a coating substantially comprising a solvent-soluble compound (a solvent of a fluoropolymer in which pepper 3 is present) The composition is prepared in a composition. The term "solvent-soluble fluoropolymer" means that a mixture of solvates of solvent blood made of a fluoropolymer exhibits a stable, single and uniform liquid state in a macroscopic state. Fluoropolymer. Similarly, the term "solvent-insoluble fluoropolymer" means a fluoropolymer dispersed in a solvent. The difference between the refractive index of fluoropolymer VIII and the refractive index of fluoropolymer R is preferably less than 0.15. This is because it provides a clear coating. The fluoropolymer A used in the present disclosure can exhibit various features such as molecular structure and useful fluorine atoms contained in the molecule. For example, fluoropolymer A is essentially It is transparent and does not adversely affect light transmission. Gas polymer A also has specific characteristics of water repellency, insulation, durability (including UV degradation resistance, heat resistance and oil resistance (anti-pollution)). The fluoropolymer A of the present disclosure can be easily dissolved in a solvent and thus can be easily applied by coating. The fluoropolymer A and the solvent used in the present disclosure do not necessarily require heating to polymerize fluorine. The dissolution of the material not only significantly improves the handling properties, but also increases the range of use of the fluoropolymer A. In the prior art, 134,045.doc •10-200920799, it is necessary to use an additive (such as a reaction catalyst or Crosslinking (4) cross-linking structure to form a fluororesin coating to increase the film strength. However, in the present disclosure, it is not necessary to use an additive such as § Xuan, which can react to cross-link the gas polymer. In the embodiment, the fluoropolymer A is not particularly limited as long as it has the above-mentioned excellent characteristics and is also sufficiently exhibited in the obtained coating composition and article, and includes various fluorine-based resins and fluorine-based resins. In addition, the molecular weight of the fluoropolymer A can vary over a wide range, but is usually about 10,000 or more. When the molecular weight is less than 1 Torr, it is impossible to dry the coating composition. The resin film is then formed. The molecular weight of the a polymer A is preferably in the range of about 50,000 to 200, Å, and more preferably about 50,000 to 150,000. When the fluoropolymer a has a high molecular weight, it is more satisfactorily exhibited. The above characteristics. The molecular weight of fluoropolymer A means by ASTM D4001-93 (2006): Standard Test Method for

Determination of Weight-Average Molecular Weight of Polymers by Light Scattering獲得之分子量。 氟聚合物A包括部分氟化及全氟化聚合物,包括氟塑膠 及氟彈性體。本揭示案之氟聚合物A之實例包括(但不限 於)基於FEVE(氟乙烯-烷基乙烯醚交替共聚物)之氟聚合 物、基於PVDF(聚偏二氟乙烯)之氟聚合物及基於THV之氟 聚合物。此等氟聚合物可單獨使用或組合使用。 基於FEVE之氟聚合物為(例如)含有稀烴、環己基乙稀 醚、烷基乙烯醚及羥基烷基乙烯醚作為主要組成組份之含 氟共聚物,其中該共聚物可經部分氟化或全氟化。在此類 134045.doc 200920799 共聚物中,烯烴、環己基乙烯醚、烷基乙烯醚及羥基烷基 乙烯醚之含量分別為40至60 mol%(莫耳%)、5至45 mol%、 3至1 5 mol%及0至3 0 mol%。全鹵烯烴、三氟氣乙稀或四氟 乙烯可用作烯烴。基於FEVE之氟聚合物之實例為含有氟 烯烴、環己基乙烯醚及縮水甘油基乙烯醚作為主要組成組 份之含氟共聚物。 基於VDF之氟聚合物可為基於橡膠(彈性體)之氟聚合物 或塑膠。當基於VDF之氟聚合物為基於橡膠之氟聚合物 時,其包括(例如):偏二氟乙烯(VDF)、四氟乙烯(TFE)與 丙烯之共聚物;包含VDF與六氟丙烯(HFP)之共聚物之氟 橡膠;及包含VDF、HFP與TFE之共聚物之氟橡膠。當基 於VDF之氟聚合物為基於塑膠之氟聚合物時,其包括(例 如)VDF聚合物及VDF-TFE共聚物。 氟聚合物A可為含有至少HFP及VDF之氟聚合物。此類 氟聚合物通常為包含HFP及VDF之二元氟聚合物,或包含至 少TFE、HFP及VDF之氟聚合物,例如包含以上單體(例如, THV)之三元氟聚合物。在此等基於THV之氟聚合物中,一 些基於THV之氟聚合物易於溶於溶劑中且具有極佳特徵, 諸如防水性、絕緣性及抗紫外線降解性。此外,可藉由簡 單方法(諸如,刷塗或浸塗)將氟聚合物塗覆在電路板之不 平坦表面上且可易於藉由多次塗覆形成較厚塗覆薄膜。 在以上二元或三元氟聚合物中,氟聚合物中TFE、HFP 與VDF之組成比率可在寬範圍内變化。然而,當將氟聚合 物用於達成密封物件之目的時,需要具有極佳流動性、極 134045.doc -12- 200920799 佳可加工性及低透水性之氟聚合物。具有適當結晶度及適 當熔點之氟聚合物對於密封物件亦為較佳的。當將氟聚合 物用於LED時,透光性對於保持自LED發出之光的強度亦 極為重要。在一實施例中,氟聚合物A含有約36至72 wt°/〇 之TFE、約0至56 wt%之HFP及約30至65 wt%之VDF為較佳 的。當TFE含量增加而偏離此組成比率時,所得氟聚合物 變得不透明且透明度降低。具有如上文所揭示之較佳組成 比率之氟聚合物A亦具有以下優點,亦即,其維持類似於 PTFE(聚四氣乙:#)之耐化學性之而才化學性,具有低物質渗 透性、約30%之結晶度(其不可由習知氟橡膠獲得)及可撓 性。當塗佈於可撓性電路板時,由於具有可撓性,所以諸 如氟聚合物A之氟聚合物可易於隨之變形,且亦不會出現 諸如裂縫之缺陷。因此,其可有利地用於製造具有複雜組 成組件配置之小型電子裝置。 僅供參考,將含有約36至72 wt%之TFE、約0至56 wt°/〇 之HFP及約8至45 wt%之VDF的基於THV之氟聚合物與習知 氟樹脂相比較,且獲得以下結果。 表1 特徵 THV PTFE PFA FEP PVDF ETFE 防水性 極佳 極佳 極佳 極佳 極佳 極佳 耐氣候性 極佳 極佳 極佳 極佳 極佳 極佳 透光性 極佳 不合格 良好 良好 極佳 極佳 可加工性(熔點) 極佳 不合格 合格 合格 良好 良好 (120-180°〇 (327°〇 (290- 310°〇 (255- 260°〇 (160- 175°〇 (260- 270°〇 黏著性 極佳 合格 合格 合格 良好 良好 134045.doc -13· 200920799 注意)評價標準:極佳 > 良好 > 合格 > 不合格 PFA :全氟烷氧基乙烯 FEP :全氟乙烯-丙烯共聚物 PVDF :聚偏二氟乙烯 ETFE :乙稀-四氟1乙浠共聚物 基於THV之氣聚合物可自(例如)Dyneon Co·, Oakdale, MN以商品名”DYNEON"THV 220、”DYNEONnTHV 415、 ”DYNEON”THV 500講得。在本揭示案中,THV220尤其有 C 用且具有以下特徵:120°c之熔點、5°c之玻璃轉移溫度、 阻燃性V-0(根據UL-94)、低濕氣穿透及1.3 6之折射率。 塗覆組合物包含溶劑及適量之溶於溶劑中之氟聚合物 A。未特別限制溶劑,只要該溶劑可易於溶解氟聚合物A 且不會對所得塗覆組合物及物件之特徵造成不利影響即 可。溶劑較佳為基於酮之溶劑、基於酯之溶劑、基於呋喃 之溶劑或極性溶劑。此等溶劑可單獨使用或組合使用。 合適溶劑(諸如,溶解基於THV之氟聚合物之彼等溶劑) ί : 之實例包括基於酮之溶劑、基於S旨之溶劑及極性溶劑。基 於酮之溶劑之實例包括:丙酮(二曱基酮)、ΜΕΚ(甲基乙基 . 酮)、二乙基酮及ΜΙΒΚ(甲基異丁基酮)。基於酯之溶劑之 實例包括乙酸曱酯、乙酸乙酯及乙酸丁酯。基於呋喃之溶 劑之實例包括THF(四氫呋喃)。極性溶劑之實例包括ΝΜΡ (Ν-曱基-2-吡咯啶酮)。 適於溶解基於PVDF之氟聚合物之溶劑的實例包括:極 性溶劑,諸如ΝΜΡ(Ν-甲基-2-吡咯啶酮)、DMAC(二曱基乙 134045.doc -14- 200920799 醯胺)、dmso(二曱亞砜)及DMF(N,N_二甲基甲醯胺);及 乙酸丁酯、MIBK(甲基異丁基及甲苯之混合溶劑。 在將氟聚合物A溶於上述溶劑之過程中,氟聚合物a之 量可根據氟聚合物A、溶劑及塗覆組合物之詳情而在寬範 圍内變化。氟聚合物A以除去不溶於溶劑之氟聚合物(氟聚 合物B)之塗覆組合物的重量計可以約25 或更少且較佳 約5至20 wt /。之量使用。氟聚合物a更佳以約1 〇至15 之量使用。當氣聚合物A之量小於! wt%時,不能獲得具有 適於塗覆之黏度的組合物且塗覆薄膜不能展示來源於該氟 聚合物之各種特徵。相反,當氟聚合物A之量大於20 wt% 時’不能獲得具有適於塗覆之黏度的組合物且僅獲得具有 低強度及較差特徵之組合物。 在本揭示案之塗覆組合物中,將呈顆粒狀且不溶於溶劑 之氟聚合物(氟聚合物⑴添加且分散於氟聚合物A與溶劑之 =二:氣聚合物B使得可能調節黏度,而黏度之調 :,夠經由單次塗覆操作塗佈較厚塗層。此外,塗 設計以實現最佳塗層厚度及合適乾燥時間。 右在不添加氟聚合物8之情況下增加說聚人物 度以實現較厚塗層,則所得 1 加,但所得組合物不物之黏度將迅連增 而更難以處理。 、且會由於乾燥時間過短 按氟聚合物B顆粒乾重比氣人 合物B顆粒之量較佳Α Λ 。 Α顆粒乾重計’氟聚 分比過小時,;==15〇%。當载聚合物一 添加Μ合物B之作用未發揮。另-方面, 134045.doc 200920799 當氟聚合物B之百分比過大時,會由於在塗覆組合物乾燥 後用作連續基質之氣聚合物A之量不足而形成空隙。 氟聚合物B之實例包括:基於PTFE之顆粒、基於thv之 顆粒、基於PFA之顆粒、基於FEP之顆粒、基於etfe之顆 粒、基於VDF之顆粒、基於PCTFE(聚三氟氣乙烯)之顆粒 及基於ECTFE(乙烯-三氟氯乙烯共聚物)之顆粒及其組合。 此外,氟聚合物A之折射率與氟聚合物B之折射率之間的 差異小於0.15。氟聚合物A與B之間的折射率相似性可允許 塗覆組合物乾燥後之塗覆薄臈具有透明性。雖然未特別限 制氟聚合物A之折射率及氟聚合物8之折射率,但其間之Determination of Weight-Average Molecular Weight of Polymers by Light Scattering. Fluoropolymer A includes partially fluorinated and perfluorinated polymers, including fluoroplastics and fluoroelastomers. Examples of fluoropolymer A of the present disclosure include, but are not limited to, FEVE (fluoroethylene-alkyl vinyl ether alternating copolymer) based fluoropolymer, PVDF (polyvinylidene fluoride) based fluoropolymer and based on Fluoropolymer of THV. These fluoropolymers may be used singly or in combination. The fluoropolymer based on FEVE is, for example, a fluorinated copolymer containing a dilute hydrocarbon, a cyclohexyl ether ether, an alkyl vinyl ether, and a hydroxyalkyl vinyl ether as a main component, wherein the copolymer can be partially fluorinated. Or perfluorinated. In such a 134,045.doc 200920799 copolymer, the content of olefin, cyclohexyl vinyl ether, alkyl vinyl ether and hydroxyalkyl vinyl ether is 40 to 60 mol% (mole%), 5 to 45 mol%, 3, respectively. To 15 mol% and 0 to 30 mol%. Perhalogenated olefins, trifluoroethylene or tetrafluoroethylene can be used as the olefin. An example of a fluoropolymer based on FEVE is a fluorine-containing copolymer containing a fluoroolefin, a cyclohexyl vinyl ether, and a glycidyl vinyl ether as a main component. The VDF-based fluoropolymer may be a rubber (elastomer) based fluoropolymer or plastic. When the VDF-based fluoropolymer is a rubber-based fluoropolymer, it includes, for example, vinylidene fluoride (VDF), a copolymer of tetrafluoroethylene (TFE) and propylene; and contains VDF and hexafluoropropylene (HFP). a fluororubber of a copolymer; and a fluororubber comprising a copolymer of VDF, HFP and TFE. When the VDF-based fluoropolymer is a plastic-based fluoropolymer, it includes, for example, a VDF polymer and a VDF-TFE copolymer. The fluoropolymer A may be a fluoropolymer containing at least HFP and VDF. Such fluoropolymers are typically binary fluoropolymers comprising HFP and VDF, or fluoropolymers comprising at least TFE, HFP and VDF, such as ternary fluoropolymers comprising the above monomers (e.g., THV). Among these THV-based fluoropolymers, some THV-based fluoropolymers are readily soluble in solvents and have excellent characteristics such as water repellency, insulation, and resistance to ultraviolet degradation. Further, the fluoropolymer can be coated on the uneven surface of the board by a simple method such as brushing or dip coating and the thicker coated film can be easily formed by multiple coatings. In the above binary or ternary fluoropolymer, the composition ratio of TFE, HFP and VDF in the fluoropolymer can be varied within a wide range. However, when a fluoropolymer is used for the purpose of sealing a article, a fluoropolymer having excellent fluidity, excellent 134045.doc -12-200920799, and low water permeability is required. Fluoropolymers having suitable crystallinity and a suitable melting point are also preferred for sealing articles. When a fluoropolymer is used for an LED, light transmission is also extremely important for maintaining the intensity of light emitted from the LED. In one embodiment, fluoropolymer A contains from about 36 to 72 wt/tw of TFE, from about 0 to 56 wt% of HFP, and from about 30 to 65 wt% of VDF. When the TFE content increases and deviates from this composition ratio, the resulting fluoropolymer becomes opaque and the transparency is lowered. The fluoropolymer A having a preferred composition ratio as disclosed above also has the advantage that it maintains chemical resistance similar to the chemical resistance of PTFE (polytetraethylene B: #), and has low substance penetration. Properties, about 30% crystallinity (which cannot be obtained from conventional fluororubber) and flexibility. When coated on a flexible circuit board, the fluoropolymer such as fluoropolymer A can be easily deformed with flexibility due to flexibility, and defects such as cracks do not occur. Therefore, it can be advantageously used to manufacture small electronic devices having complex component configurations. For reference only, a THV-based fluoropolymer containing about 36 to 72 wt% of TFE, about 0 to 56 wt/h of HFP, and about 8 to 45 wt% of VDF is compared with a conventional fluororesin, and Obtain the following results. Table 1 Features THV PTFE PFA FEP PVDF ETFE Excellent water resistance Excellent Excellent Excellent Excellent Excellent weatherability Excellent Excellent Excellent Excellent Excellent Excellent Transmittance Excellent Unqualified Good Excellent Excellent Excellent processability (melting point) Excellent unqualified pass qualified good (120-180°〇 (327°〇(290-310°〇(255-260°〇(160- 175°〇(260- 270°〇 adhesive) Excellent Qualified Qualified Good Good 134045.doc -13· 200920799 Note) Evaluation Criteria: Excellent> Good &Qualified> Unqualified PFA: Perfluoroalkoxy Ethylene FEP: Perfluoroethylene-propylene Copolymer PVDF : Polyvinylidene fluoride ETFE: Ethylene-tetrafluoroethylene ethene copolymer based on THV gas polymer can be obtained, for example, from Dyneon Co., Oakdale, MN under the trade name "DYNEON" THV 220, "DYNEONnTHV 415," DYNEON" THV 500 speaks. In the present disclosure, THV220 is especially useful for C and has the following characteristics: a melting point of 120 ° C, a glass transition temperature of 5 ° C, a flame retardancy V-0 (according to UL-94), Low moisture penetration and refractive index of 1.36. Coating composition contains solvent and appropriate amount The fluoropolymer A is dissolved in a solvent. The solvent is not particularly limited as long as the solvent can easily dissolve the fluoropolymer A without adversely affecting the characteristics of the resulting coating composition and article. The solvent is preferably based on a ketone. a solvent, an ester-based solvent, a furan-based solvent or a polar solvent. These solvents may be used singly or in combination. Suitable solvents (such as those in which a THV-based fluoropolymer is dissolved) ί : Examples include ketone-based Solvents, solvents based on S and polar solvents. Examples of ketone-based solvents include: acetone (dinonyl ketone), hydrazine (methyl ethyl ketone), diethyl ketone and hydrazine (methyl isobutyl) Examples of the ester-based solvent include decyl acetate, ethyl acetate, and butyl acetate. Examples of the furan-based solvent include THF (tetrahydrofuran). Examples of the polar solvent include hydrazine (fluorenyl-fluorenyl-2-pyrrolidine) Ketones. Examples of solvents suitable for dissolving PVDF-based fluoropolymers include: polar solvents such as hydrazine (hydrazine-methyl-2-pyrrolidone), DMAC (dimercaptopropyl 134045.doc -14-200920799 醯amine ), dmso (disulfoxide) and DMF (N,N-dimethylformamide); and butyl acetate, MIBK (mixture of methyl isobutyl and toluene. Dissolve fluoropolymer A) The amount of the fluoropolymer a in the above solvent may vary widely depending on the details of the fluoropolymer A, the solvent and the coating composition. The fluoropolymer A may be about 25 or less and preferably about 5 to 20 wt / by weight of the coating composition for removing the solvent-insoluble fluoropolymer (fluoropolymer B). The amount used. The fluoropolymer a is more preferably used in an amount of from about 1 Torr to about 15. When the amount of gas polymer A is less than! At wt%, a composition having a viscosity suitable for coating cannot be obtained and the coated film cannot exhibit various characteristics derived from the fluoropolymer. On the contrary, when the amount of the fluoropolymer A is more than 20% by weight, a composition having a viscosity suitable for coating cannot be obtained and only a composition having low strength and poor characteristics is obtained. In the coating composition of the present disclosure, a fluoropolymer which is granulated and insoluble in a solvent (fluoropolymer (1) is added and dispersed in fluoropolymer A and solvent = two: gas polymer B makes it possible to adjust the viscosity And the viscosity of the viscosity: enough to apply a thicker coating through a single coating operation. In addition, the coating is designed to achieve the optimum coating thickness and suitable drying time. Right increase without adding fluoropolymer 8 When the character is concentrated to achieve a thicker coating, the resulting one is added, but the viscosity of the resulting composition will increase rapidly and become more difficult to handle. Moreover, the dry weight of the fluoropolymer B particles will be too short. The amount of the human B particles is preferably Α 。 Α granule dry weight meter 'fluorine concentration ratio is too small,; == 15 〇 %. When the role of the carrier-added conjugate B is not exerted. , 134045.doc 200920799 When the percentage of fluoropolymer B is too large, voids may be formed due to insufficient amount of gas polymer A used as a continuous matrix after the coating composition is dried. Examples of fluoropolymer B include: PTFE-based Particles, thv-based particles, PFA-based particles, FEP-based particles, etfe-based particles, VDF-based particles, PCTFE (polytrifluoroethylene) based particles, and ECTFE (ethylene-chlorotrifluoroethylene copolymer) based particles and combinations thereof. The difference between the refractive index of A and the refractive index of fluoropolymer B is less than 0.15. The refractive index similarity between fluoropolymers A and B allows the coated enamel after drying of the coating composition to be transparent. The refractive index of the fluoropolymer A and the refractive index of the fluoropolymer 8 are not particularly limited, but in between

差異小於〇,15。舉例而言’當氟聚合物A為基於THV之聚 合物(折射率為約丨.36)且將大量PTFE顆粒(折射率:135) 及TFE顆粒添加至氟聚合物A與溶劑之溶液中時,可實現 具有良好透明性之乾塗覆組合物。藉由is〇 ⑽外 PlaStiCS-Determinati〇n 〇f灿扣如來量測折射率。 雖然未特別限制氟聚合物B之粒徑,但其通常為U 譯㈣。當粒徑過小時,難以容易地得到厚塗層。另一 方面,當粒徑過大時,可能難以實現薄膜塗層之透明性及 平滑度。氟聚合物B顆粒較佳具有高透明性以使由塗覆組 。物獲仔之塗覆薄膜具有透明性。在基於卩刑之顆粒之 狀兄下可藉由減小粒徑獲得透明性。可 —_1U999七·G1)之雷射散射方法量測粒徑。 劑雖=示案之塗覆組合物包含至少三種組份,例如溶 於溶劑之I聚合物(氟聚合物A)及不溶於溶劑之 134045.doc 200920799 2合物(氟聚合物B) ’但視情況可含有 通常用於塗霜细入从士 添加劑 纟覆組合物中以幫助製備或賦 =較佳添力,包括(例如)界面活性劑、具有透:;二 考=、㈣染料、增白劑、抗氧化劑及紫外線= 及可選添加劑溶於溶劑中且將說聚 〇物B添加至溶液中來製 τ水表備本揭不案之塗覆組合 塗覆溶液具有所欲黏庚BL 所仔 又且因此可使用習知技術(諸如,The difference is less than 〇, 15. For example, when fluoropolymer A is a THV-based polymer (refractive index is about 丨.36) and a large amount of PTFE particles (refractive index: 135) and TFE particles are added to a solution of fluoropolymer A and a solvent. A dry coating composition having good transparency can be achieved. The refractive index is measured by the IsS (10) PlaStiCS-Determinati〇n 〇f. Although the particle diameter of the fluoropolymer B is not particularly limited, it is usually U (translation). When the particle size is too small, it is difficult to easily obtain a thick coating. On the other hand, when the particle size is too large, it may be difficult to achieve transparency and smoothness of the film coating. The fluoropolymer B particles preferably have high transparency to be coated by the group. The coated film of the obtained material has transparency. Transparency can be obtained by reducing the particle size under the granules based on gauntlet. The laser particle size can be measured by the laser scattering method of -_1U999 VII G1. The coating composition of the invention includes at least three components, such as an I polymer (fluoropolymer A) dissolved in a solvent and a 134045.doc 200920799 2 compound (fluoropolymer B) insoluble in a solvent. Depending on the case, it may be used to generally apply frosting to the composition of the coating to help prepare or impart a preferred additive, including, for example, a surfactant, having a permeation: two test =, (four) dye, increase White agent, antioxidant and ultraviolet light = and optional additives are dissolved in the solvent and the polybatch B is added to the solution to prepare the water meter. The coating combination coating solution of the present invention has the desired viscosity. Abut, and thus can use conventional techniques (such as,

塗、浸塗或噴塗)塗覆在物件表面上。在一些狀況下,可 藉由使用諸如灌注之技術將塗覆溶液滴在預定部分中來形 成密封部分。視組合物黏度而定,可藉由單次或複數次塗 覆操作將塗覆溶液塗覆。然而,因為黏度可藉由添加氟聚 。物B來調即,所以可以單次塗覆操作實現厚塗層。單次 塗覆操作亦可降低由在多次塗覆操作之狀況下層間界面處 包涵空氣而引起的不透明性。 在塗覆完成後,藉由乾燥來使所得塗覆薄膜固化。乾燥 操作可在周圍溫度下進行,且必要時,可使用加熱器或烘 箱加速乾燥。 乾燥後塗覆薄膜(亦即,塗層(或密封層),用於塗覆物件 表面)之厚度視塗覆溶液之量及塗覆次數而變。塗層厚度 通常為至少約10 μπι(微米)且例如為約i〇〇 pm或更多。因 為將氟聚合物顆粒(氟聚合物B)添加至本揭示案之塗覆組 口物中,所以可藉由單次塗覆操作將塗層厚度控制在〇. $ mm(毫米)或更多且尤其1 更多。 本揭示案之塗覆組合物具有顯著特徵,諸如透光性及/ 134045.doc -17- 200920799 或擴散性、防水性、紫外绐禮~ „ 糸卜線穩疋性及塗覆能力。因此,本Coating, dip coating or spraying) is applied to the surface of the article. In some cases, the sealing portion may be formed by dropping a coating solution into a predetermined portion using a technique such as perfusion. Depending on the viscosity of the composition, the coating solution can be applied by a single or multiple coating operations. However, because the viscosity can be increased by adding fluorine. Material B is adjusted so that a thick coating can be achieved in a single coating operation. The single coating operation also reduces the opacity caused by the inclusion of air at the interface between the layers in the case of multiple coating operations. After the coating is completed, the resulting coated film is cured by drying. Drying can be carried out at ambient temperature and, if necessary, accelerated drying using a heater or oven. The thickness of the coated film after drying (i.e., the coating (or sealing layer) for coating the surface of the article) varies depending on the amount of the coating solution and the number of coatings. The coating thickness is typically at least about 10 μm (micrometers) and is, for example, about i pm or more. Since fluoropolymer particles (fluoropolymer B) are added to the coating set of the present disclosure, the thickness of the coating can be controlled to 〇. $ mm (mm) or more by a single coating operation. And especially 1 more. The coating composition of the present disclosure has remarkable characteristics such as light transmittance and /134045.doc -17-200920799 or diffusibility, water repellency, ultraviolet ~ 糸 疋 疋 及 及 及 及 及 及 及 及 。 。 。 。 。 。 。 。 。 。 。 。 。 。 this

揭示案之塗覆組合物可用於塗覆各種物件(例如)以形成塗 :或密封層。詳言之,可在物件之導電部分上形成塗層或 在封層。本揭不案之塗覆組合物可用於塗覆物件,藉此密 封物件中所包括之導電部分。因為可保護曝露部分(電 路配線、天線等)免受潮氣、紫外光或其他周圍不利影 響’所以可將包括經本揭示案之塗覆組合物塗覆之導電部 分的物件穩定保持-段長時間。此外,使用本揭示案之塗 覆組合物亦能夠縮小物件(諸如,交通信號裝置),此係因 為可經由塗覆組合物實現足夠防水性,消除大體積外殼、 防護罩或其類似物之使用。 本揭不案亦提供一種物件,其包含具有導電部分之物品 及由本揭示案之塗覆組合物形成之塗層其中至少該導電 部分經密封。本揭示案之物件可包括各種具有導電部分之 物品。其典型實例其包括(但不限於): LED裝置’其中該LED裝置之LED元件及與LED元件連 接之導電部分至少經本揭示案之塗層密封, 可撓性電路板(亦稱為印刷電路板),其包含安裝於表面 上之功能元件’其中該電路板之功能元件及與該功能元件 連接之導電部分至少經本揭示案之塗層密封, 電子袭置’其包含安裝於其中之功能元件,其中該裝置 之功能元件及與該功能元件連接之導電部分至少經本揭示 案之塗層密封, 經塗覆之電線’其中該電線之曝露電線至少經本揭示案 134045.doc -18- 200920799 之塗層密封,及 天線,其經本揭示案之塗層塗覆。 使用之特定實例包括(但不限於)以下物品。咖裝置包 括(例如)交通k號裝置(例如,道路信號裝置、鐵路信號裝 置、具有信㈣之施工標牌等)、EL面板(例如,升降型^ 型队面板、資訊牌、車上交通信號裝置、環型燈等)、道 路交通標ti(例如’方向牌、交通阻塞顯示板、随道掘進 引導燈等)、廣告媒體(例如,大型LED電視、廣告燈、桿 軚、内部照明EL標牌、槽型字、邊緣燈等)及車上燈。 -電路板包括:由包括纖維素之紛樹脂、包括玻璃且纖維之 環氧樹脂或氟樹脂”打^等)製成之剛性印刷電路板;及由 聚醯亞胺樹脂或基於烴之樹脂(PE、pp等)製成之可挽性印 刷電路板,LED晶片或半導體晶片係安裝在表面上。更詳 細地描述,在可撓性印刷電路板中,基底材料通常係由可 撓性薄膜形成,且除聚醯亞胺樹脂以外’亦可由丙烯酸系 樹脂、聚酯樹脂、聚胺基曱酸酯樹脂、聚氣乙烯樹脂或基 於烴之樹脂形成。此外,可使用與通常用以製造印刷電路 板相同之技術在基底材料上形成具有可選圖案之諸如配 線、電路及接觸之導電部分。舉例而言,可使用諸如真空 沈積或喷墨印刷之技術’由導電金屬(諸如,銅、錄、 金、銀或銘或其合金)形成諸如配線之配線圖案。同樣, 可藉由將導體薄膜施用在薄膜基底材料之整個表面上且選 擇性地蝕刻導體薄膜來形成配線圖案層。必要時,配線圖 案層可使用諸如焊接之技術形成。 134045.doc -19- 200920799 圖1至3各自展示包含内部安裝LED晶片之電路板之線性 燈的實例。在各別圖式之平面圖中,塗層5係以陰影線顯 示以幫助理解排列狀態。 圖1展示LED晶片3安裝在由包括玻璃纖維之環氧樹脂製 成的電路板1之表面上的線性燈^ LED晶片3可發射白光。 在電路板1之表面上,銅配線2曝露且經覆蓋導線6連接至 銅配線且使用焊劑4固定。銅配線2及銅配線2與導線6之間 的連接部分及LED晶片3經塗層5密封以將其塗覆。可藉由 使用滴注方法以斑點樣方式滴入本揭示案之塗覆組合物且 固化該塗覆組合物’容易地形成塗層5。在該圖所示之實 例中’僅將本揭示案之塗覆組合物塗佈至電路板1表面必 須塗覆之一部分上。塗覆組合物與電路板1之黏著力極強 且使用期間塗層5不會剝落。 可藉由將塗覆組合物塗覆於電路板1之一個表面之整個 表面上來進一步改良電路板之防水性、絕緣性及耐久性。 圖2展示圖1中所示之電路板之一種改進。在圖2中,將本 揭不案之塗覆組合物塗佈於包括LED晶片3之電路板1之整 個表面上。在此實例中,塗覆組合物可藉由喷塗法來塗 佈。塗覆組合物與電路板丨之黏著力極強且使用期間塗層5 不會剝落。 可藉由將塗覆組合物塗覆於電路板之整個表面上來進一 步改良電路板之防水性、絕緣性及耐久性,且因此電路板 1之使用範圍可進一步增加。圖3展示圖1中所示之電路板1 之另—改進。在圖3中,將本揭示案之塗覆組合物均勻塗 134045.doc • 20- 200920799 覆在電路板1之整個表面( 5。在此實例中,塗覆組!物可2及側面)上以形成塗層 組合物與電路板丨之黏著 《塗法來塗佈。塗覆 落。 極強且使用期間塗層5不會剝 此外’本揭示案之塗霜έ 覆S物可用於保護或密封電線之 曝路部分(未圖示)。舉例而一 ' 羋例而s,通常用氣乙烯樹脂覆 線。為便於使用,將氣乙嫌掛nt 〃 盖電 行乳乙烯樹脂剝離所欲位置以曝 線。本揭示案之塗覆組合物The coating compositions of the disclosure can be used to coat various articles, for example, to form a coating: or a sealing layer. In particular, a coating or a seal can be formed on the conductive portion of the article. The coating composition of the present invention can be used to coat articles whereby the conductive portions included in the article are sealed. Since the exposed portion (circuit wiring, antenna, etc.) can be protected from moisture, ultraviolet light, or other surrounding adverse effects, the article including the conductive portion coated with the coating composition of the present disclosure can be stably maintained for a long period of time. Furthermore, the use of the coating compositions of the present disclosure also enables the reduction of articles, such as traffic signal devices, since sufficient water repellency can be achieved via the coating composition, eliminating the use of bulky casings, shields or the like. . The present invention also provides an article comprising an article having a conductive portion and a coating formed from the coating composition of the present disclosure wherein at least the conductive portion is sealed. The articles of the present disclosure may include various articles having conductive portions. Typical examples thereof include, but are not limited to: LED device 'where the LED component of the LED device and the conductive portion connected to the LED component are sealed by at least the coating of the present disclosure, the flexible circuit board (also referred to as a printed circuit board) a functional component mounted on a surface, wherein the functional component of the circuit board and the conductive portion connected to the functional component are at least sealed by the coating of the present disclosure, and the electronic component includes a functional component mounted therein. Wherein the functional component of the device and the electrically conductive portion coupled to the functional component are at least sealed by the coating of the present disclosure, the coated electrical wire wherein the exposed wire of the electrical wire is at least coated by the disclosure of 134045.doc -18-200920799 A seal, and an antenna, coated with a coating of the present disclosure. Specific examples of use include, but are not limited to, the following items. The coffee device includes, for example, a traffic k device (for example, a road signal device, a railway signal device, a construction sign with a letter (4), and an EL panel (for example, a lift type panel, an information card, an on-board traffic signal device). , ring lights, etc.), road traffic signs ti (such as 'direction cards, traffic jam display boards, accompanying road guide lights, etc.), advertising media (for example, large LED TVs, advertising lights, poles, interior lighting EL signs, Slotted characters, edge lights, etc.) and on-board lights. - the circuit board comprises: a rigid printed circuit board made of a resin comprising cellulose, an epoxy resin comprising a glass and a fiber, or a fluororesin; and a polyimide resin or a hydrocarbon-based resin ( A flexible printed circuit board made of PE, pp, etc., an LED chip or a semiconductor wafer mounted on a surface. In more detail, in a flexible printed circuit board, the base material is usually formed of a flexible film. And may be formed of an acrylic resin, a polyester resin, a polyamino phthalate resin, a polystyrene resin or a hydrocarbon-based resin in addition to the polyimine resin. Further, it can be used and used to manufacture printed circuits. The same technique of the board forms a conductive portion such as a wiring, a circuit, and a contact having an optional pattern on the base material. For example, a technique such as vacuum deposition or inkjet printing can be used 'from a conductive metal (such as copper, recorded, Gold, silver or Ming or its alloy) forms a wiring pattern such as wiring. Also, the conductor film can be applied to the entire surface of the film substrate material and selectively etched. A thin film is formed to form a wiring pattern layer. If necessary, the wiring pattern layer can be formed using a technique such as soldering. 134045.doc -19- 200920799 Each of FIGS. 1 to 3 shows an example of a linear lamp including a circuit board on which an LED chip is mounted. In the plan view of the respective drawings, the coating 5 is shown hatched to help understand the alignment. Fig. 1 shows a linear lamp in which the LED chip 3 is mounted on the surface of a circuit board 1 made of epoxy resin including glass fibers. ^ The LED chip 3 can emit white light. On the surface of the circuit board 1, the copper wiring 2 is exposed and connected to the copper wiring via the covered wire 6 and fixed using the flux 4. The copper wiring 2 and the connection portion between the copper wiring 2 and the wire 6 And the LED wafer 3 is sealed by coating 5 to coat it. The coating composition of the present disclosure can be dropped in a spot-like manner by using a drip method and the coating composition is cured to form a coating 5 easily. In the example shown in the figure, 'only the coating composition of the present disclosure is applied to one part of the surface of the circuit board 1 to be coated. The adhesion of the coating composition to the circuit board 1 is extremely strong and during use. Coating 5 will not peel off The water repellency, insulation and durability of the circuit board can be further improved by applying the coating composition to the entire surface of one surface of the circuit board 1. Fig. 2 shows an improvement of the circuit board shown in Fig. 1. In Fig. 2, the coating composition of the present invention is applied to the entire surface of a circuit board 1 including an LED wafer 3. In this example, the coating composition can be applied by a spray coating method. The coating composition has strong adhesion to the circuit board and does not peel off during use. The water repellency and insulation of the circuit board can be further improved by applying the coating composition to the entire surface of the circuit board. And durability, and thus the range of use of the circuit board 1 can be further increased. Figure 3 shows another modification of the circuit board 1 shown in Figure 1. In Figure 3, the coating composition of the present disclosure is evenly coated 134045 .doc • 20- 200920799 Overlay the entire surface of board 1 (5. In this example, the coating can be applied to the coating and the coating of the board. Coating. Extremely strong and the coating 5 does not peel during use. The smear of the present disclosure can be used to protect or seal the exposed portion of the wire (not shown). For example, 'an example, s, usually covered with gas vinyl. For ease of use, the battery should be detached from the nt 〃 cover. Coating composition of the present disclosure

f用於塗覆現曝露之電線以保 護曝露電線免受外界影響(例 曰UN如,濕氣)。類似地,各種天 線之表面可經本揭示案之塗覆組合物塗覆以保護天線。天 線可連續長時間使用,同時仍租垃$治> ^ ^ 1J吁仍保持天線之極佳特徵而不出 現缺陷。 實例 現將藉由實例來描述本揭示案。本揭示案不受此等實例 限制。 實例1 在此實例中,基於添加(或不添加)氟聚合物B,檢查塗 覆組合物之黏度與乾燥時間之間的關係。 氟聚合物A為TFE、HFP及VDF之共聚物,其係由Dyne〇nf is used to coat exposed wires to protect exposed wires from external influences (eg UN, moisture). Similarly, the surface of the various antennas can be coated with the coating composition of the present disclosure to protect the antenna. The antenna can be used continuously for a long time, while still renting $治> ^ ^ 1J appeals to maintain the excellent characteristics of the antenna without defects. EXAMPLES The present disclosure will now be described by way of examples. This disclosure is not limited by these examples. Example 1 In this example, the relationship between the viscosity of the coating composition and the drying time was examined based on the addition (or no addition) of the fluoropolymer B. Fluoropolymer A is a copolymer of TFE, HFP and VDF, which is composed of Dyne〇n

LLC,Oakdale, MN以商品名”DYNEON"THV 220A 出售,且 MEK用作溶劑。氣聚合物B為由Dyneon LLC·,Oakdale MN以商品名"DYNEON"Microp〇wder TF 9205 出售之 PTFE 粉末。DYNE ON THV 220A為具有超過i〇, 〇〇〇之分子量之 氟聚合物。DYNEON Micropowder TF 9205具有藉由雷射 134045.doc •21 · 200920799 散射法量測之平均粒徑,為8 覆組合物的乾燥時間及黏度。 μιη。量測具有各種濃度之塗 用於量測乾燥時間之方法 首先,在室溫(25。〇下將氟聚合物Α添加至溶劑中且藉 由混合來溶解以獲得不含款聚合物B之塗覆組合物。在本 揭示案之塗覆組合物中,進—步添加氟聚合物B,接著授 拌’以獲得均勾分散溶液。 在實驗中將0.5 塗覆組合物展布於直徑為約3〇 匪(25至30 mm)之圓形水平玻璃板上。將自塗覆在該板表 面上之塗覆組合物凝固開始至輕觸時液體不黏附手指所需 之時間視為表面乾燥時間。雖然觸摸時感到塗層乾燥,但 在表面下可能仍存在流體且可感到塗層具有彈性。將不再 感到塗層具有彈性之時間記錄為總乾燥時間。 黏度量測 根據 JISK6833(財政年 1994)使用由 Tokyo Keiki c〇 Ud 製造之黏度計來量測塗覆組合物之黏度。 各組伤之組成、乾炼時間及黏度概述於下表2中。 134045.doc -22- 200920799 表2 以氟聚合物A及MEK 之總重量計,氟聚合 物A之重量 以氟聚合物A之重 量計,氟聚合物B 之重量(%) 表面乾燥 時間(min) 總乾燥時 間(min) 塗覆組合物之 黏度(mPa.s) 10 0 6.5 7.5 41 15 0 6.5 8.5 220 20 0 5.5 8.5 750 25 0 5.5 10.5 4 500 30 0 2.5 11.0 8 400 35 0 2.0 14.5 26 000 __40 -------— 1 —-0 0.5 16.5 43,000 20 5 7.5 9.0 780 20 25 6.0 9.0 820 20 50 5.5 100 〇rt〇 _ 20 100 3.5 20.0 1 mo 20 ----- --_ 3.5 20.5 1,600 20 200 2.0 24.5 2,000 如表2中所示,當塗覆組合物之黏度為4,000 mpa.s或更 大時’表面乾燥時間小於55 mine當表面乾燥時間為3分 鐘或更少時,幾乎不可能經由刷塗來塗覆。LLC, Oakdale, MN is sold under the trade name "DYNEON" THV 220A, and MEK is used as a solvent. Gas polymer B is a PTFE powder sold by Dyneon LLC, Oakdale MN under the trade name "DYNEON" Microp〇wder TF 9205. DYNE ON THV 220A is a fluoropolymer having a molecular weight exceeding i〇, 〇〇〇. DYNEON Micropowder TF 9205 has an average particle size measured by a laser 134045.doc •21 · 200920799 scattering method, and is an 8-coated composition. Drying time and viscosity. μιη. Measuring the coating with various concentrations for measuring the drying time First, the fluoropolymer hydrazine is added to the solvent at room temperature (25 〇 under the mash and dissolved by mixing to obtain The coating composition of the polymer B is not included. In the coating composition of the present disclosure, the fluoropolymer B is further added, followed by the mixing to obtain a homogenous dispersion solution. 0.5 coating is applied in the experiment. The composition is spread over a circular horizontal glass plate having a diameter of about 3 〇匪 (25 to 30 mm). The coating composition applied from the surface of the plate is solidified until the liquid does not adhere to the finger at the time of light touch. The time required is considered to be dry Time. Although the coating is dry when touched, fluid may still be present under the surface and the coating may be rendered elastic. The time when the coating is no longer felt to be elastic is recorded as the total drying time. Viscosity measurement according to JIS K6833 (Fiscal Year 1994) The viscosity of the coating composition was measured using a viscometer manufactured by Tokyo Keiki c〇Ud. The composition, drying time and viscosity of each group of injuries are summarized in Table 2 below. 134045.doc -22- 200920799 Table 2 Based on the total weight of fluoropolymer A and MEK, the weight of fluoropolymer A is based on the weight of fluoropolymer A, the weight of fluoropolymer B (%), surface drying time (min), total drying time (min) Viscosity of the composition (mPa.s) 10 0 6.5 7.5 41 15 0 6.5 8.5 220 20 0 5.5 8.5 750 25 0 5.5 10.5 4 500 30 0 2.5 11.0 8 400 35 0 2.0 14.5 26 000 __40 ------- — 1 —-0 0.5 16.5 43,000 20 5 7.5 9.0 780 20 25 6.0 9.0 820 20 50 5.5 100 〇rt〇_ 20 100 3.5 20.0 1 mo 20 ----- --_ 3.5 20.5 1,600 20 200 2.0 24.5 2,000 As shown in Table 2, when the viscosity of the coating composition is 4,000 mPa.s or more, the surface is dry. When the time is less than 55 min, when the surface drying time is 3 minutes or less, it is almost impossible to apply by brushing.

如自表2令所示結果顯而易見,在不含敗聚合物B之塗覆 、,且口物中,#使氟聚合物A之濃度增加以形成厚塗層,乃 —或更大之濃度亦過度增加黏度且過度_ 間,且因此不能進行刷塗操作。另一方面,在本揭= 塗覆組合物中,可保持合適黏度及合適表面乾燥時間且因 =藉由單次塗覆操作來進行厚塗覆。料,藉由最優化 厚;覆薄:加塗覆薄膜之厚度以藉由單次塗覆操作來獲得 134045.doc -23、 200920799 實例2 將5 g DYNEON THV 220A(氟聚合物A)添加至20 g MEK 中且藉由混合來溶解以獲得20%氟聚合物A溶液。將5 g不 同THV共聚物(由Dyneon Co.,Oakdale, MN製造,以商品名 ”DYNEON"THV 610出售)(氟聚合物3)之經研磨產物(歸類 為粒徑在4 5至12 5 μηι之間的粉末)添加至所得溶液中,接 著攪拌,以獲得塗覆組合物。將此塗覆組合物浸塗於綠色 銅基板上,並乾燥3次。與DYNEON THV 220Α相比, DYNEON THV 610具有更高四氟乙烯含量且不溶於MEK。 實例3 除DYNEON THV610之粒徑歸類於125至250 μηι之間 外,以與實例2相同之方式進行實例3。 實例4 除DYNEON THV610之粒徑歸類於125至250 μηι之間且 使用乙酸丁酯代替ΜΕΚ作為溶劑外,以與實例2相同之方 式進行實例4。 實例5 除氟聚合物Β為以商品名”DYNEON"TF9207 Micropowder 出售之PTFE氟樹脂顆粒(由3M Co·,St. Paul,MN製造)且使 用乙酸丁酯代替MEK作為溶劑外,以與實例2相同之方式 進行實例5。 比較實例1 除添加0.5 g(與5 g DYNEON THV 610之體積相同)以商 品名"3M Glass Bubbles K20"(由 3M Co.,St. Paul,MN製造) 134045.doc -24- 200920799 出售之玻璃泡且製備塗覆組合物外,以與實例2相同之方 式製備比較實例1。玻璃泡為鈉鈣硼矽酸鹽玻璃,具有 〇.2〇〇士〇.〇2之真比重及3〇至11〇01!1之粒徑分布(8〇%或更多)。 比較實例2 除使用乙酸丁酯代替MEK作為溶劑外,以與比較實例1 相同之方式製備比較實例2。 比較實例3 除未添加氟聚合物B外,以與實例丨相同之方式製備比較 實例3。 比較實例4 除未添加氟聚合物B且使用乙酸丁酯代替MEK作為溶劑 外,以與實例1相同之方式製備比較實例4。 使以上實例及比較實例之樣品經受透光測試及防水性測 試。 透射率之量測:自酚醛紙銅基板剝去薄膜且使用由 Hitachi,Ltd.製造之U-4 100型分光光度計在整個可見範圍 中量測光譜透射率。接著藉由校正可見度及光源來測定可 見光透射率。 防水性測試:用於塗覆之酚醛紙銅基板具有丨6 mm之寬 度、1.5 mm之厚度及75 mm之長度,且在中心具有寬〇2 mm之狹縫(參見圖4)。因此,基板丨上右側及左側之銅配線 2電獨立。將線c_c以下之整個部分用由浸塗形成之塗層$ 塗覆。此外,藉由浸於水中達至線c_c以下之線w_w來進 行防水性測試。將上部銅配線曝露之右側及左側部分各自 I34045.doc -25- 200920799 用與數位式萬用表(P-ίο,由METEX Co.製造)連接之彈簧 夾夾住,且接著量測電阻值。如表3中所示,無塗層之對 照樣品顯示數百kQ(千歐姆)之電阻值。 在防水性測試中,將具有在水中30分鐘後量測時顯示40 ΜΩ或更高電阻值(顯示足夠絕緣性及防水性)之塗層之樣品 評定為”合格"。測試結果顯示於下表3中。 表3 實例2 實例3 實例4 實例5 比較實例1 比較實例2 比較實例3 比較實例4 氟聚合物 THV220A THV220A THV220A THV220A THV220A THV220A THV220A THV220A A(g) 5 g 5 g 5g 5 g 5g 5g 5 g 5g 氟聚合物 THV 610 THV 610 THV 610 TF9207 K20 K20 無 無 B(g) 5g 5 g 0.5 g 0.5 g 氟聚合物B 粒徑(μηι) 45-125 125-250 125-250 約4 30-110 30-110 未添加 未添加 溶劑(g) MEK MEK 乙酸丁酯 乙酸丁酯 MEK 乙酸丁酯 MEK 乙酸丁酯 20 g 20 g 20 g 20 g 20 g 20 g 20 g 20 g 乾燥薄膜 厚度(mm) 0.58 0.77 0.73 0.65 0.60 0.75 0.23 0.23 透光率(%) 76 64 65 76 20 18 79 88 防水性 合格 合格 合格 合格 合格 合格 合格 合格 如自表3中所示結果顯而易見,當添加氟聚合物顆粒B且 添加玻璃泡時可進行厚塗覆。甚至在添加氟聚合物顆粒B 時,亦實現與未添加氟聚合物B時幾乎相同之透光率。另 一方面,當添加玻璃泡時,透光率低且塗覆薄膜變白。 認為透明性係由折射率之相似性獲得,此係因為 DYNEON THV 220A之折射率為約1.36,而經研磨DYNEON THV610及未經研磨DYNEON THV 610之折射率為約 1.36,且 DYNEON TF9207 Micropowder之折射率為 1.35。 -26- 134045.doc 200920799 另一方面,因為玻璃泡含有鈉鈣硼矽酸鹽玻璃(折射率: 1.53至1.57)作為主要組份,所以DYNEON TF9207 Micropowder與DYNEON THV 220A之間折射率的差異大於 0.15(例如,0.17至0.21)。因此,不能獲得乾燥塗覆組合物 之透明性。 實例6As is apparent from the results shown in Table 2, in the coating without the defeat of the polymer B, and in the mouth, # increase the concentration of the fluoropolymer A to form a thick coating, or - or a greater concentration Excessively increase the viscosity and excessive _ between, and therefore can not be brushed. On the other hand, in the present coating composition, a suitable viscosity and a suitable surface drying time can be maintained and a thick coating is carried out by a single coating operation. By optimizing the thickness; coating: adding the thickness of the coated film to obtain by a single coating operation 134045.doc -23, 200920799 Example 2 Adding 5 g DYNEON THV 220A (fluoropolymer A) to 20 g MEK and dissolved by mixing to obtain a 20% fluoropolymer A solution. 5 g of different THV copolymer (manufactured by Dyneon Co., Oakdale, MN, sold under the trade name DYNEON "THV 610) (fluoropolymer 3) ground product (classified as particle size 4 5 to 12 5 The powder between μηι) was added to the resulting solution, followed by stirring to obtain a coating composition. This coating composition was dip-coated on a green copper substrate and dried 3 times. Compared with DYNEON THV 220, DYNEON THV 610 had a higher tetrafluoroethylene content and was insoluble in MEK. Example 3 Example 3 was carried out in the same manner as in Example 2 except that the particle size of DYNEON THV610 was classified between 125 and 250 μm. Example 4 Except for DYNEON THV610 Example 4 was carried out in the same manner as in Example 2 except that the diameter was between 125 and 250 μηι and butyl acetate was used instead of hydrazine as a solvent. Example 5 The fluoropolymer oxime was sold under the trade name "DYNEON" TF9207 Micropowder. Example 5 was carried out in the same manner as in Example 2 except that PTFE fluororesin particles (manufactured by 3M Co., St. Paul, MN) and butyl acetate were used instead of MEK as a solvent. Comparative Example 1 except for the addition of 0.5 g (same volume as 5 g DYNEON THV 610) sold under the trade name "3M Glass Bubbles K20" (manufactured by 3M Co., St. Paul, MN) 134045.doc -24- 200920799 Comparative Example 1 was prepared in the same manner as in Example 2 except that the glass was bubbled and a coating composition was prepared. The glass bubble is a soda-calcium borosilicate glass having a true specific gravity of 〇〇.2〇〇士〇.〇2 and a particle size distribution of 3〇 to 11〇01!1 (8〇% or more). Comparative Example 2 Comparative Example 2 was prepared in the same manner as in Comparative Example 1, except that butyl acetate was used instead of MEK as a solvent. Comparative Example 3 Comparative Example 3 was prepared in the same manner as in Example 除 except that fluoropolymer B was not added. Comparative Example 4 Comparative Example 4 was prepared in the same manner as in Example 1 except that fluoropolymer B was not added and butyl acetate was used instead of MEK as a solvent. The samples of the above examples and comparative examples were subjected to a light transmission test and a water repellency test. Measurement of Transmittance: The film was peeled off from the phenolic paper copper substrate and the spectral transmittance was measured over the entire visible range using a U-4 100 spectrophotometer manufactured by Hitachi, Ltd. The visible light transmittance is then determined by correcting the visibility and the light source. Water resistance test: The phenolic paper copper substrate used for coating has a width of 丨6 mm, a thickness of 1.5 mm and a length of 75 mm, and a slit having a width of mm2 mm at the center (see Fig. 4). Therefore, the copper wirings 2 on the right and left sides of the substrate are electrically independent. The entire portion below the line c_c is coated with a coating $ formed by dip coating. Further, the water repellency test was carried out by immersing the water in a line w_w below the line c_c. The right side and the left side of the upper copper wiring are exposed. I34045.doc -25- 200920799 is clamped with a spring clip connected to a digital multimeter (P-ίο, manufactured by METEX Co.), and then the resistance value is measured. As shown in Table 3, the uncoated test sample showed resistance values of several hundred kQ (kilo ohms). In the water resistance test, a sample having a coating exhibiting a resistance value of 40 Μ Ω or higher (showing sufficient insulation and water repellency) measured after 30 minutes in water was rated as "qualified". The test results are shown below. Table 3 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Fluoropolymer THV220A THV220A THV220A THV220A THV220A THV220A THV220A THV220A A(g) 5 g 5 g 5g 5 g 5g 5g 5 g 5g fluoropolymer THV 610 THV 610 THV 610 TF9207 K20 K20 without B (g) 5g 5 g 0.5 g 0.5 g fluoropolymer B particle size (μηι) 45-125 125-250 125-250 about 4 30- 110 30-110 No added solvent (g) MEK MEK Butyl acetate butyl acetate MEK Butyl acetate MEK Butyl acetate 20 g 20 g 20 g 20 g 20 g 20 g 20 g 20 g Dry film thickness (mm) 0.58 0.77 0.73 0.65 0.60 0.75 0.23 0.23 Transmittance (%) 76 64 65 76 20 18 79 88 Waterproof qualified pass qualified pass qualified pass qualified As shown in Table 3, it is obvious when adding fluoropolymer particles B and Thick coating when adding glass bubbles Even when the fluoropolymer particles B are added, the light transmittance is almost the same as when the fluoropolymer B is not added. On the other hand, when the glass bubbles are added, the light transmittance is low and the coating film becomes white. The system is obtained by the similarity of the refractive index, because the refractive index of DYNEON THV 220A is about 1.36, and the refractive index of the ground DYNEON THV610 and the unground DYNEON THV 610 is about 1.36, and the refractive index of DYNEON TF9207 Micropowder is 1.35. -26- 134045.doc 200920799 On the other hand, since the glass bubble contains sodium calcium borosilicate glass (refractive index: 1.53 to 1.57) as the main component, the refractive index between DYNEON TF9207 Micropowder and DYNEON THV 220A The difference is more than 0.15 (for example, 0.17 to 0.21). Therefore, the transparency of the dry coating composition cannot be obtained.

如實例1中所述’藉由將以重量計相同量之DYNEON TF9205 Micropowder添加至 DYNEON THV220A中以產生 以氟聚合物A及溶劑之總重量計氟聚合物a之重量為2〇%且 以氟聚合物A之重量計氟聚合物b之重量為1 〇〇%的塗覆組 合物,來製備本揭示案之塗覆組合物。將此塗覆組合物塗 覆於電路板1上以形成圖5中所示之物件。如圖5中所示’ LED係經由電線連接於電路板丨上。導線6連接於電路板】 以連接電源且將塗覆組合物塗佈於電路板丨上以用塗層5包 住。將圖5中所示物件之子彈形LED焊接於電路板丨上。由 於形狀複雜,故將浸塗法、刷塗法及灌注法組合使用以將 塗覆組合物塗佈至包含LED之電路板丨上。穿透電路板丨且 自電路板1突出之LED插腳的長度在丨至5 mm之間變化。甚 至當伸出插腳之長度為5 mm時,亦可用本揭示案之塗覆组 合物進行厚塗覆。將所得物件(圖5)連接至電源且浸於水 中。LED連續發光3G分鐘或更長時間。在浸人水中期間既 未觀測到氧氣及氫氣之產生(電解),亦未觀_金屬離子 之溶解。 實例7 134045.doc •27· 200920799 如實例6中所揭示來製備塗覆組合物,且經由浸塗法將 其塗覆在LED線性燈(以商品名"white LED Substrate Unit NP-00014 獲仔’由 shibazaki Seisakusho Ltd·製造)上,且 接著藉由在將平均厚度為〗,〇〇〇 電路板浸於水中距離 水面1 m之深度的狀態下載運電流2小時或更長時間來將 LED連續開啟。因此,已發現此實例之安裝lEd之電路板 具有對應於(日本工業標準c〇92〇)防護級7或更高級(防水浸 型)之防水性。 在不偏離本發明之精神及範疇的情況下,可預見之本發 明之修改及變更將為熟習此項技術者顯而易見。本發明不 應限於本申請案中出於說明之目的所闡述之實施例。 【圖式簡單說明】 圖1為展示根據本揭示案之包含安裝在内部之LED晶片 的電路板之一實例的平面圖(A)及剖視圖(B); 圖2為展示根據本揭示案之包含安裝在内部之LED晶片 的電路板之另一實例的平面圖(A)及剖視圖(B); 圖3為展示根據本揭示案之包含安裝在内部之[ED晶片 的電路板之另一實例的平面圖(A)及剖視圖(B); 圖4為用於防水性測試中之基板之透視圖;且 圖5為使用包括長插腳之子彈狀LED之基板的俯視圖 及側視圖(B)。 【主要元件符號說明】 圖1-3 電路板/基板 134045.doc -28· 200920799 2 銅配線 3 LED晶片 4 焊劑 5 塗層 6 經覆蓋導線 圖4 1 酚醛紙銅基板 2 銅配線 5 塗層 圖5 1 電路板 5 塗層 6 導線By adding the same amount of DYNEON TF9205 Micropowder to DYNEON THV220A by weight, as described in Example 1, to produce a weight of fluoropolymer a of 2% by weight and fluorine based on the total weight of fluoropolymer A and solvent. A coating composition of the present disclosure was prepared by coating a coating composition having a weight of the fluoropolymer b of 1% by weight of the polymer A. This coating composition was coated on the circuit board 1 to form the article shown in Fig. 5. The 'LEDs' are connected to the board 经由 via wires as shown in FIG. The wire 6 is attached to the circuit board to connect the power source and the coating composition is applied to the circuit board to be wrapped with the coating 5. The bullet-shaped LED of the object shown in Fig. 5 is soldered to the board. Since the shape is complicated, a dip coating method, a brush coating method, and a potting method are used in combination to apply the coating composition onto a circuit board containing an LED. The length of the LED pins that penetrate the board and protrude from the board 1 varies from 丨 to 5 mm. Even when the length of the protruding pins is 5 mm, the coating composition of the present disclosure can also be used for thick coating. Connect the resulting object (Figure 5) to a power source and immerse in water. The LED continuously emits 3G minutes or more. Neither oxygen nor hydrogen (electrolysis) was observed during the immersion in the water, nor was the dissolution of the metal ions observed. Example 7 134045.doc • 27· 200920799 A coating composition was prepared as disclosed in Example 6, and coated by a dip coating method on an LED linear lamp (according to the trade name "white LED Substrate Unit NP-00014 'on the basis of 'shibazaki Seisakusho Ltd.'), and then by continuously storing the current for 2 hours or more in a state where the average thickness is 〇〇〇, the 〇〇〇 board is immersed in water at a depth of 1 m from the water surface Open. Therefore, it has been found that the circuit board on which the lEd of this example is mounted has water resistance corresponding to (Japanese Industrial Standard c〇92〇) protection grade 7 or higher (waterproof dip type). Modifications and variations of the present invention are obvious to those skilled in the art without departing from the scope of the invention. The present invention should not be limited to the embodiments set forth herein for the purpose of illustration. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view (A) and a cross-sectional view (B) showing an example of a circuit board including an LED chip mounted therein according to the present disclosure; FIG. 2 is a view showing installation according to the present disclosure. A plan view (A) and a cross-sectional view (B) of another example of a circuit board of an internal LED chip; FIG. 3 is a plan view showing another example of a circuit board including an [ED wafer] mounted inside according to the present disclosure ( A) and cross-sectional view (B); FIG. 4 is a perspective view of the substrate used in the waterproof test; and FIG. 5 is a plan view and a side view (B) of the substrate using the bullet-shaped LED including the long pins. [Main component symbol description] Figure 1-3 Circuit board/substrate 134045.doc -28· 200920799 2 Copper wiring 3 LED wafer 4 Flux 5 Coating 6 Covered wire Figure 4 1 Phenolic paper copper substrate 2 Copper wiring 5 Coating pattern 5 1 circuit board 5 coated 6 wire

L 134045.doc -29L 134045.doc -29

Claims (1)

200920799 十、申請專利範圍:200920799 X. Patent application scope: -種塗覆組合物’其包含氟聚合物A、敦聚合物B及溶 劑,其中該氟聚合物柯溶於該溶劑中,且其中該Μ 合物Β呈顆粒狀且不溶於該溶劑中。 2. 如請求項1之塗覆組合物’纟中該氟聚合物Α之折射率與 該氣聚合物B之折射率之間的差異小於〇15。 3.A coating composition comprising fluoropolymer A, a polymer B, and a solvent, wherein the fluoropolymer is dissolved in the solvent, and wherein the oxime is in the form of particles and is insoluble in the solvent. 2. The difference between the refractive index of the fluoropolymer oxime and the refractive index of the gas polymer B in the coating composition of claim 1 is less than 〇15. 3. 4. 5.4. 5. 6. 如請求項1或2之塗覆組合物,其中該氟聚合物A為包含 至少六氟丙烯及偏二氟乙烯之氟聚合物。 如請求項1或2之塗覆組合物,其中該氟聚合物A為包含 四乱乙烯、六氟丙稀及偏二氧乙稀之氟聚合物。 如凊求項1之塗覆組合物,《中該氟聚合物B為選自以下 ,,少:者之氣聚合物:包含四氟乙烯、六氟丙烯及偏 、氟乙歸之4聚合物;基於聚四氣乙稀之說聚合物;基 於全敦烷氧基乙烯之氟聚合物;基於全氟乙稀_丙烯共聚 物之氟聚合物;基於乙烯-四氟乙烯共聚物之氟聚合物; 基:聚偏二氟乙烯之氟聚合物;基於聚三氟氯乙烯之氟 聚合物;或基於乙烯-三氟氣乙烯共聚物之氟聚合物。 2 π求項1之塗覆組合物,按該氟聚合物6乾重比該氟聚 物Α乾重計,其包含50至15〇Q/°之量之該氟聚合物Β。 叫求項1之塗覆組合物,其用於密封至少物件中所包 括之導電部分。 種物件,其包含導電部分及由如請求項1至7中任一項 塗覆組合物形成之塗層,其中至少該導電部分經該塗 覆組合物密封。 134045.doc 200920799 9. 如請求項8之物件,直 部分。 〃 Τ该導電#刀為自該物件曝露之 10. 如請求項8或9之物件,其為咖裝置,且至少—該㈣ 裝置之LED元件及與該LED元件連接之導電部分經該塗 層密封。 11. 如請求項8或9之物件,其為包含安裝於表面上之功能元 件之可撓性電路板,且至少該可撓性電路板之該功能元 件及與該功能元件連接之導電部分經該塗層密封。 12. 如請求項8或9之物件,其為電子裝置,其包含安裝於其 中之功能70件,且至少該裝置之該功能元件及與該功能 元件連接之導電部分經該塗層密封。 13. 如請求項8或9之物件,其為經塗覆之電線或天線,且至 少該電線或該天線之曝露部分經該塗層密封。 134045.doc6. The coating composition of claim 1 or 2, wherein the fluoropolymer A is a fluoropolymer comprising at least hexafluoropropylene and vinylidene fluoride. The coating composition of claim 1 or 2, wherein the fluoropolymer A is a fluoropolymer comprising tetrahydroethylene, hexafluoropropylene and ethylene dioxyethylene. The coating composition of claim 1, wherein the fluoropolymer B is selected from the group consisting of: a gas polymer comprising: tetrafluoroethylene, hexafluoropropylene, and a polymer of partial or fluoroethylene Polytetraethylene-based fluoropolymer; fluoropolymer based on perfluoroethylene-propylene copolymer; fluoropolymer based on ethylene-tetrafluoroethylene copolymer Base: a fluoropolymer of polyvinylidene fluoride; a fluoropolymer based on polychlorotrifluoroethylene; or a fluoropolymer based on an ethylene-trifluoroethylene copolymer. The coating composition of 2 π, wherein the fluoropolymer 6 has a dry weight of the fluoropolymer, and the fluoropolymer enthalpy is contained in an amount of from 50 to 15 Å Q/°. The coating composition of claim 1 for sealing at least the electrically conductive portion included in the article. An article comprising a conductive portion and a coating formed from the coating composition of any one of claims 1 to 7, wherein at least the conductive portion is sealed by the coating composition. 134045.doc 200920799 9. The object of claim 8, straight.导电 Τ the conductive #刀 is exposed from the object 10. The object of claim 8 or 9, which is a coffee device, and at least - the LED component of the device is connected to the conductive component of the LED component seal. 11. The object of claim 8 or 9, which is a flexible circuit board comprising a functional component mounted on a surface, and at least the functional component of the flexible circuit board and the conductive portion connected to the functional component are The coating is sealed. 12. The article of claim 8 or 9, which is an electronic device comprising a function 70 mounted therein, and at least the functional component of the device and the electrically conductive portion coupled to the functional component are sealed by the coating. 13. The article of claim 8 or 9, which is a coated wire or antenna, and at least the wire or exposed portion of the antenna is sealed by the coating. 134045.doc
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Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
GB2462824A (en) * 2008-08-18 2010-02-24 Crombie 123 Ltd Printed circuit board encapsulation
WO2010020753A2 (en) 2008-08-18 2010-02-25 Semblant Limited Halo-hydrocarbon polymer coating
CN102356267A (en) * 2009-03-17 2012-02-15 皇家飞利浦电子股份有限公司 Led strip for small channel letters
US8697458B2 (en) 2009-04-22 2014-04-15 Shat-R-Shield, Inc. Silicone coated light-emitting diode
DE102009032424A1 (en) * 2009-07-09 2011-01-13 Osram Gesellschaft mit beschränkter Haftung Lighting device with a flexible circuit board
WO2011064861A1 (en) * 2009-11-26 2011-06-03 Cheng Chiang-Ming Multifunction lighting device
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
TWI509838B (en) 2010-04-14 2015-11-21 Pang Ming Huang Led housing with fluoropolymer surface coating layer and led structure having the same
WO2011134941A1 (en) 2010-04-30 2011-11-03 Solvay Solexis S.P.A. Vdf polymer composition
US20120036750A1 (en) * 2010-08-12 2012-02-16 Sun Inno Tech Internally Illuminated Panel and Method of Making the Same
EP2428537A1 (en) * 2010-09-13 2012-03-14 Sika Technology AG Waterproofing membrane
RU2505572C2 (en) * 2012-04-26 2014-01-27 Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" Lacquer composition
CN102977700B (en) * 2012-12-28 2016-05-04 上海电缆研究所 A kind of comprehensive coating that improves aerial condutor performance
ITMI20130350A1 (en) * 2013-03-07 2014-09-08 Davide Zanesi MOLDING PROCESS OF ELECTRONIC CIRCUITS ON TEXTILE SUPPORTS THROUGH SERIGRAPHIC TECHNOLOGY, WITH THE USE OF ELECTRICALLY CONDUCTIVE, THERMO-ELECTRIC OR ELECTRO-LUMINESCENT MATERIAL.
US10103037B2 (en) * 2014-05-09 2018-10-16 Intel Corporation Flexible microelectronic systems and methods of fabricating the same
KR102237112B1 (en) 2014-07-30 2021-04-08 엘지이노텍 주식회사 Light emitting device and light suource module
US9540536B2 (en) 2014-09-02 2017-01-10 E I Du Pont De Nemours And Company Heat-curable polymer paste
EP3196550B1 (en) * 2016-01-20 2018-10-24 OSRAM GmbH A method of producing lighting devices and corresponding lighting device
DE102016105407A1 (en) * 2016-03-23 2017-09-28 Osram Opto Semiconductors Gmbh Method for producing an electronic device and electronic device
CN109314168A (en) * 2016-05-03 2019-02-05 霍尼韦尔国际公司 Optical transmitting set equipment and component and correlation technique with improved chemical-resistant
US10700247B2 (en) 2016-06-29 2020-06-30 Mitsubishi Electric Corporation Display device and method for manufacturing display device
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
EP3625294A4 (en) * 2017-05-20 2021-01-20 Honeywell International Inc. Intellectual Property - Patent Services Milk lumilux dispersion
KR102186090B1 (en) 2017-06-15 2020-12-03 주식회사 엘지화학 Apparatus and method for partially molding of printed circuit board, and printed circuit board produced therefrom
EP3655490A1 (en) * 2017-07-21 2020-05-27 The Chemours Company FC, LLC Photocrosslinkable fluoropolymer coating composition and passivation layer formed therefrom
US11149150B2 (en) * 2017-10-26 2021-10-19 Actnano, Inc. Composition comprising non-newtonian fluids for hydrophobic, oleophobic, and oleophilic coatings, and methods of using the same
JP7301866B2 (en) 2018-03-15 2023-07-03 ソルベイ スペシャルティ ポリマーズ イタリー エス.ピー.エー. Fluoropolymer composition for light emitting device components
JP6899412B2 (en) * 2018-07-27 2021-07-07 住友化学株式会社 LED device manufacturing method
DE102019205064A1 (en) * 2019-04-09 2020-10-15 Conti Temic Microelectronic Gmbh Use of the substance [P (VdF-HFP) HP] as a cooling device for cooling a sensor device of a motor vehicle
CN113853690A (en) 2019-05-16 2021-12-28 住友化学株式会社 Electronic component and method for manufacturing the same
WO2020230716A1 (en) 2019-05-16 2020-11-19 住友化学株式会社 Electronic component production method and electronic component
JP6998362B2 (en) * 2019-05-16 2022-01-18 住友化学株式会社 Electronic components and their manufacturing methods
JP6856787B1 (en) * 2020-01-29 2021-04-14 住友化学株式会社 Manufacturing method of electronic parts
JP6816317B1 (en) * 2020-01-30 2021-01-20 住友化学株式会社 Fluororesin sheet and its manufacturing method
JP6870128B1 (en) * 2020-01-30 2021-05-12 住友化学株式会社 Fluororesin encapsulant and its manufacturing method
JP6830168B1 (en) * 2020-01-30 2021-02-17 住友化学株式会社 Manufacturing method of electronic parts

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177150A (en) * 1990-05-10 1993-01-05 Elf Atochem North America, Inc. Powder coatings of vinylidene fluoride/hexafluoropylene copolymers
US5922453A (en) * 1997-02-06 1999-07-13 Rogers Corporation Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates
JP2000017197A (en) * 1998-04-30 2000-01-18 Daikin Ind Ltd Thermosetting powder coating composition
ATE320656T1 (en) * 2000-06-30 2006-04-15 3M Innovative Properties Co HIGH FREQUENCY ELECTRONIC PART COMPRISING AN INSULATING MATERIAL AND METHOD FOR PRODUCING THE SAME
WO2002083795A2 (en) * 2001-04-09 2002-10-24 Fuji Photo Film Co., Ltd. Coloring composition for image formation and method for improving ozone resistance of color image
US6878196B2 (en) * 2002-01-15 2005-04-12 Fuji Photo Film Co., Ltd. Ink, ink jet recording method and azo compound
KR100715925B1 (en) * 2003-04-09 2007-05-08 가부시키가이샤 구라레 Methacrylic resin emulsion and process for producing the same
US20070053179A1 (en) * 2005-09-08 2007-03-08 Pang Slew I Low profile light source utilizing a flexible circuit carrier

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