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EP2183329A4 - Coating composition and article using the same - Google Patents

Coating composition and article using the same

Info

Publication number
EP2183329A4
EP2183329A4 EP08798178A EP08798178A EP2183329A4 EP 2183329 A4 EP2183329 A4 EP 2183329A4 EP 08798178 A EP08798178 A EP 08798178A EP 08798178 A EP08798178 A EP 08798178A EP 2183329 A4 EP2183329 A4 EP 2183329A4
Authority
EP
European Patent Office
Prior art keywords
article
same
coating composition
coating
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08798178A
Other languages
German (de)
French (fr)
Other versions
EP2183329A2 (en
Inventor
Fumio Karasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of EP2183329A2 publication Critical patent/EP2183329A2/en
Publication of EP2183329A4 publication Critical patent/EP2183329A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
EP08798178A 2007-08-23 2008-08-19 Coating composition and article using the same Withdrawn EP2183329A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007217386A JP2009051876A (en) 2007-08-23 2007-08-23 Coating composition, and article using it
PCT/US2008/073584 WO2009026284A2 (en) 2007-08-23 2008-08-19 Coating composition and article using the same

Publications (2)

Publication Number Publication Date
EP2183329A2 EP2183329A2 (en) 2010-05-12
EP2183329A4 true EP2183329A4 (en) 2011-05-11

Family

ID=40378954

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08798178A Withdrawn EP2183329A4 (en) 2007-08-23 2008-08-19 Coating composition and article using the same

Country Status (6)

Country Link
EP (1) EP2183329A4 (en)
JP (1) JP2009051876A (en)
KR (1) KR20100063083A (en)
CN (1) CN101784622A (en)
TW (1) TW200920799A (en)
WO (1) WO2009026284A2 (en)

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GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
GB2462824A (en) * 2008-08-18 2010-02-24 Crombie 123 Ltd Printed circuit board encapsulation
WO2010020753A2 (en) 2008-08-18 2010-02-25 Semblant Limited Halo-hydrocarbon polymer coating
CN102356267A (en) * 2009-03-17 2012-02-15 皇家飞利浦电子股份有限公司 Led strip for small channel letters
US8697458B2 (en) 2009-04-22 2014-04-15 Shat-R-Shield, Inc. Silicone coated light-emitting diode
DE102009032424A1 (en) * 2009-07-09 2011-01-13 Osram Gesellschaft mit beschränkter Haftung Lighting device with a flexible circuit board
WO2011064861A1 (en) * 2009-11-26 2011-06-03 Cheng Chiang-Ming Multifunction lighting device
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
TWI509838B (en) 2010-04-14 2015-11-21 Pang Ming Huang Led housing with fluoropolymer surface coating layer and led structure having the same
WO2011134941A1 (en) 2010-04-30 2011-11-03 Solvay Solexis S.P.A. Vdf polymer composition
US20120036750A1 (en) * 2010-08-12 2012-02-16 Sun Inno Tech Internally Illuminated Panel and Method of Making the Same
EP2428537A1 (en) * 2010-09-13 2012-03-14 Sika Technology AG Waterproofing membrane
RU2505572C2 (en) * 2012-04-26 2014-01-27 Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" Lacquer composition
CN102977700B (en) * 2012-12-28 2016-05-04 上海电缆研究所 A kind of comprehensive coating that improves aerial condutor performance
ITMI20130350A1 (en) * 2013-03-07 2014-09-08 Davide Zanesi MOLDING PROCESS OF ELECTRONIC CIRCUITS ON TEXTILE SUPPORTS THROUGH SERIGRAPHIC TECHNOLOGY, WITH THE USE OF ELECTRICALLY CONDUCTIVE, THERMO-ELECTRIC OR ELECTRO-LUMINESCENT MATERIAL.
US10103037B2 (en) * 2014-05-09 2018-10-16 Intel Corporation Flexible microelectronic systems and methods of fabricating the same
KR102237112B1 (en) 2014-07-30 2021-04-08 엘지이노텍 주식회사 Light emitting device and light suource module
US9540536B2 (en) 2014-09-02 2017-01-10 E I Du Pont De Nemours And Company Heat-curable polymer paste
EP3196550B1 (en) * 2016-01-20 2018-10-24 OSRAM GmbH A method of producing lighting devices and corresponding lighting device
DE102016105407A1 (en) * 2016-03-23 2017-09-28 Osram Opto Semiconductors Gmbh Method for producing an electronic device and electronic device
CN109314168A (en) * 2016-05-03 2019-02-05 霍尼韦尔国际公司 Optical transmitting set equipment and component and correlation technique with improved chemical-resistant
US10700247B2 (en) 2016-06-29 2020-06-30 Mitsubishi Electric Corporation Display device and method for manufacturing display device
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
EP3625294A4 (en) * 2017-05-20 2021-01-20 Honeywell International Inc. Intellectual Property - Patent Services Milk lumilux dispersion
KR102186090B1 (en) 2017-06-15 2020-12-03 주식회사 엘지화학 Apparatus and method for partially molding of printed circuit board, and printed circuit board produced therefrom
EP3655490A1 (en) * 2017-07-21 2020-05-27 The Chemours Company FC, LLC Photocrosslinkable fluoropolymer coating composition and passivation layer formed therefrom
US11149150B2 (en) * 2017-10-26 2021-10-19 Actnano, Inc. Composition comprising non-newtonian fluids for hydrophobic, oleophobic, and oleophilic coatings, and methods of using the same
JP7301866B2 (en) 2018-03-15 2023-07-03 ソルベイ スペシャルティ ポリマーズ イタリー エス．ピー．エー． Fluoropolymer composition for light emitting device components
JP6899412B2 (en) * 2018-07-27 2021-07-07 住友化学株式会社 LED device manufacturing method
DE102019205064A1 (en) * 2019-04-09 2020-10-15 Conti Temic Microelectronic Gmbh Use of the substance [P (VdF-HFP) HP] as a cooling device for cooling a sensor device of a motor vehicle
CN113853690A (en) 2019-05-16 2021-12-28 住友化学株式会社 Electronic component and method for manufacturing the same
WO2020230716A1 (en) 2019-05-16 2020-11-19 住友化学株式会社 Electronic component production method and electronic component
JP6998362B2 (en) * 2019-05-16 2022-01-18 住友化学株式会社 Electronic components and their manufacturing methods
JP6856787B1 (en) * 2020-01-29 2021-04-14 住友化学株式会社 Manufacturing method of electronic parts
JP6816317B1 (en) * 2020-01-30 2021-01-20 住友化学株式会社 Fluororesin sheet and its manufacturing method
JP6870128B1 (en) * 2020-01-30 2021-05-12 住友化学株式会社 Fluororesin encapsulant and its manufacturing method
JP6830168B1 (en) * 2020-01-30 2021-02-17 住友化学株式会社 Manufacturing method of electronic parts

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5922453A (en) * 1997-02-06 1999-07-13 Rogers Corporation Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates
WO2002003397A2 (en) * 2000-06-30 2002-01-10 3M Innovative Properties Company Insulation material for use in high-frequency electronic parts
US20070053179A1 (en) * 2005-09-08 2007-03-08 Pang Slew I Low profile light source utilizing a flexible circuit carrier

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US5177150A (en) * 1990-05-10 1993-01-05 Elf Atochem North America, Inc. Powder coatings of vinylidene fluoride/hexafluoropylene copolymers
JP2000017197A (en) * 1998-04-30 2000-01-18 Daikin Ind Ltd Thermosetting powder coating composition
WO2002083795A2 (en) * 2001-04-09 2002-10-24 Fuji Photo Film Co., Ltd. Coloring composition for image formation and method for improving ozone resistance of color image
US6878196B2 (en) * 2002-01-15 2005-04-12 Fuji Photo Film Co., Ltd. Ink, ink jet recording method and azo compound
KR100715925B1 (en) * 2003-04-09 2007-05-08 가부시키가이샤 구라레 Methacrylic resin emulsion and process for producing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5922453A (en) * 1997-02-06 1999-07-13 Rogers Corporation Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates
WO2002003397A2 (en) * 2000-06-30 2002-01-10 3M Innovative Properties Company Insulation material for use in high-frequency electronic parts
US20070053179A1 (en) * 2005-09-08 2007-03-08 Pang Slew I Low profile light source utilizing a flexible circuit carrier

Also Published As

Publication number Publication date
CN101784622A (en) 2010-07-21
WO2009026284A2 (en) 2009-02-26
JP2009051876A (en) 2009-03-12
KR20100063083A (en) 2010-06-10
TW200920799A (en) 2009-05-16
EP2183329A2 (en) 2010-05-12
WO2009026284A3 (en) 2009-04-09

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20100309

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A4 Supplementary search report drawn up and despatched

Effective date: 20110413

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