TW200815939A - Exposure equipment - Google Patents

Abstract

The invention is to provide an exposure device that can reliably prevent fracture of a mask due to interference with a substrate. A division sequential proximity exposure device PE is equipped with: a laser monitoring device 70 having a light emitting unit 71, 72 emitting a laser beam LB that passes in an almost horizontal direction through a predetermined position between a mask M held by a mask stage 1 and a substrate W held by a work stage 2, and a light receiving unit 73, 74 receiving the laser beam LB; and a controller 80 that stops elevation of the work stage when the receiving quantity of the laser beam LB at the light receiving unit 73, 74 decreases to a predetermined value or lower.

Description

200815939 IX. Description of the Invention: [Technical Field] The present invention relates to an exposure apparatus which is mounted on a substrate of a large flat panel display such as a liquid crystal display or a plasma display, and is highly suitable for dividing a mask by successive successive exposure methods. The mask pattern is used to approximate (adjacent) the exposure transfer. [Prior Art] A plurality of exposure apparatuses for manufacturing color filters of a flat panel display device such as a liquid crystal display device or a plasma display device have been developed (for example, refer to Patent Documents 1 and 2). In the exposure apparatus described in Patent Document 1, a mask smaller than a substrate as an exposure material is used, and the mask is held by the mask stage while the substrate is held by the work object carrier. The two are close and in the opposite direction. Then, in this state, the working object carrier is stepped and moved to the mask, and each step of the person is irradiated with light for pattern exposure from the mask side, thereby drawing the mask on the mask. The plurality of mask patterns are exposed and transferred onto the substrate, and a plurality of displays or the like are formed on one substrate. Further, when the substrate and the mask are arranged to face each other, after the positioning operation of the substrate is completed, the gap sensor is used to perform the adjustment operation of the target gap while detecting the gap between the substrate and the mask. The exposure apparatus described in Patent Document 2 is a moving path of the substrate, and is provided with a non-contact type measuring device and a shutter, and when the substrate is in contact with the mask at a position where the measuring device cannot detect the position, The substrate is then in contact with a gate made by Monica to protect the mask. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2000-35676 [Patent Document 2] JP-A-2002-272139 SUMMARY OF THE INVENTION Problems to be Solved by the Invention • However, with the flat panel in recent years The enlargement of the display device has made the mask for manufacturing the color filter larger (for example, 1400 mmxl2()() ugly), and the unit price of the mask is also high. Therefore, how to prevent the substrate from being in contact with the mask without damaging the mask is a problem to be solved. In the exposure apparatus described in Patent Document 1, the gap between the substrate and the mask is detected as a gap, and the gap is adjusted. Since the gap sensor is a non-contact type, a large-scale error occurs, and the substrate is defective due to an operation error or the like. The possibility of contact with the mask. Further, in the exposure apparatus described in Patent Document 2, since the non-contact type gap sensor is used, the work object is carried when the substrate is in contact with the gate while the above-mentioned problem is to be solved. The movement of the platform must be confirmed and controlled by the operator. The present invention has been made in view of the above-mentioned problems to be solved, and an object thereof is to provide an exposure apparatus capable of surely preventing breakage of a mask. Means for Solving the Problems The above object of the present invention is achieved by the following structure. (1) An exposure apparatus comprising: a vegetative member carrier that holds a substrate as a substrate to be exposed; a mask carrier that is disposed opposite to the substrate to hold the hood; and an illuminating member; Aligning the substrate, illuminating the pattern with the light to cover the mask; and transmitting the mechanism, the system 121476.doc 200815939 makes the working object carrier and the mask carrier move stepwise relative to the mask The mask pattern is opposite to a plurality of specific positions on the substrate; and includes: a laser monitoring device having: a light emitting portion that causes the laser beam to emit light, the laser beam being held in a horizontal direction Between the mask of the mask carrier and the substrate held on the substrate of the crop material (4), the position and the light receiving portion, which are received by the laser beam;

When the amount of light received by the laser beam in the light receiving unit is equal to or less than the value, the movement of at least one of the mask stage and the workpiece carrier is stopped. (7) An exposure apparatus comprising: a vegetative member carrier that holds a substrate as a substrate to be exposed; a mask carrier that is configured to align with each other to hold a mask; and an illuminating member Pairing the substrate two: the case: the light used to illuminate the mask with the mask; and the transport mechanism, directly transmitting the work object carrier and the mask carrier for the mask pattern of the mask and the plurality of substrates The specific position is:::: The mask on the TM is equipped in the vicinity of the edge of the cover station < t the edge of the light to make the laser beam reduce the light; and is held in the mask bearing HU Hunting monitors the gap by the gap between the measurements; and the substrate control device of the carrier port, which is to suspend the movement of the cover and the workpiece in the upper and lower directions of the workpiece. 121476.doc 200815939 Stop By. Advantageous Effects of Invention According to the present invention, when the laser monitoring device detects that the gap between the mask and the substrate is equal to or less than a specific value, the control device sets at least the upper and lower directions of the mask carrier and the work object carrier. The movement is stopped: therefore, the contact of the mask close to the substrate during exposure can be avoided, and the damage of the mask is surely prevented. [Embodiment] Hereinafter, each embodiment of the exposure apparatus of the present invention will be described in detail with reference to the accompanying drawings. (First Embodiment) A first embodiment of the present invention will be described with respect to the divided successive proximity exposure apparatus of the present invention. As shown in FIG. 1, the split sequential proximity exposure apparatus of the present embodiment includes: a mask carrying platform that holds the mask M, and a workpiece that holds the glass substrate (exposed material) W, the stage 2, _ The illumination optical system 3 for exposure of the illumination member for pattern exposure, and the device base 4 for supporting the mask carrier 1 and the workpiece carrier 2 are provided. Further, the glass substrate W (hereinafter referred to as "substrate w") and the mask are disposed to face each other on the surface (mask facing surface) to apply light absorbing agent to exhibit light transmission, and the surface system is The mask pattern p drawn on the mask M should be used as an exposure transferer. For convenience of explanation, the following description begins with the illumination optical system 3, and the optical system 3 includes, for example, a high-pressure mercury lamp 3, which is a light source for ultraviolet irradiation, and a concave mirror 32 which is irradiated with the high-pressure mercury lamp 31. 121476.doc 200815939 light concentrator; two optical integrators 33, which are arranged near the focus of the concave mirror 32, are free to switch; plane mirrors 35, 36 and spherical mirror 37, and exposure control The shutter 34 is disposed between the plane mirror 36 and the optical integrator 33, and the illumination path is opened and closed. At the time of exposure, when the exposure control shutter 34 is controlled to be opened, the light irradiated from the high pressure mercury lamp 31 is held by the light path B shown in FIG. The mask M and the surface of the substrate w held on the work object carrier 2 are vertically irradiated. In this way, the mask pattern p of the mask is exposed and transferred onto the substrate w. Next, according to the order of the mask carrying platform and the work object carrying platform 2, the H mask carrying platform includes a mask carrying base ig, and the mask carrying base 10 is protruded from the mounting base. The cover of the cover 4 is supported by the cover, and is disposed above the work object carrier 2. As shown in FIG. 2, the mask base is made of an approximately rectangular shape, and has an opening 10a at the central portion, and the opening l〇a is provided with a mask that can move in the X and Y directions. Hold box 12. As shown in Fig. 3 (4), in the case of the mask holding frame 12, the flange 12a provided at the outer peripheral portion of the upper end is placed on the upper side of the opening center of the base of the mask carrier base 1 and is carried by the mask. The inner circumference of the opening 10a of the stage base 10 is inserted between the inner circumferences with a certain gap therebetween. In this way, the mask holding frame 12 can be moved in the X and γ directions corresponding to this gap. Below the mask holding frame 12, the suction cup portion "121476.doc -12-200815939 is used to hold the spacer 20 and is held by the holding tray a I △ , and the mask holding frame 12 can be held together. For the mask K. The abutment 10 is moved to the Χ, γ direction, and the 芎荽 field is from t | Α υ 卜 卜 , 系 系 系 系 系 系 Α Α Α Α Α Α Α Α Α Α Α Α Α Α Α Α Α Α Α = = = = = = = = The cover _ depicts the mask pattern ρ. In this way, = = suction spray (four), which is held by a vacuum suction device (not shown) in a freely detachable manner. The upper surface of 10 is provided with a mask position adjustment, and in the ®2, it is based on the alignment camera 15 described later, the result of the joy, or the measurement result by the laser length measuring device 6 () which will be described later. The mask holding frame 12 is moved in the plane of the lamp, and the position and posture of the mask 保持 held by the mask holding frame 12 are adjusted. The mask position adjusting member 13 includes: the X-axis direction driving device i &, which is mounted on one side of the mask holding frame 12 along the γ-axis direction; and two y-axis direction driving means 13y, which are mounted on the mask One side of the frame 12 in the X-axis direction. As shown in FIGS. 3(a) and 3(b), the X-axis direction driving device 13A includes: a drive actuator (for example, an electric actuator) 131, The linear guide bearing port 33 is attached to the edge of the mask holding frame 12 along the γ-axis direction. The linear guide 133 The guide rail 1331 is extended in the γ-axis direction and fixed to the mask holding frame 12. Further, the slider i33s movably attached to the guide 13 is attached to the latch support mechanism 132 at the tip end of the rod 131r. And the rod 13] is fixed to the base of the mask carrier. On the other hand, the Y-axis direction driving device 13y also has the same structure as the axial direction driving 121476.doc -13-200815939 device 13A. Actuator (for example, electric actuator) 13 1 ' includes a rod 伸缩3丨r that expands and contracts in the γ-axis direction; and a linear guide (linear motion bearing guide) 133 'Installs The edge of the mask holding frame 12 along the X-axis direction. The guiding of the linear guide 133 is 13 The direction is extended and fixed to the mask holding frame 12. Further, the slider 133s movably attached to the guide holder 133r is connected to the front end of the rod 13 lr via the latch supporting mechanism 132. The driving device 13 performs the adjustment of the mask holding frame 12 in the X-axis direction, and the two-axis direction driving device 13y performs the ¥axis direction and the zero-axis direction of the mask holding frame 12 (shaking around the Z-axis). Further, as shown in FIG. 2, in the inner side of the two sides of the mask holding frame 12 in the direction of the x-axis, a gap sensor 丨4 is provided as the measurement cover. The member that covers the gap between the cover and the opposing surface of the substrate W; and the alignment camera 15 detects the member of the mask "the amount of deviation from the plane between the alignment standards." The gap sensor 14 and the alignment camera 15 are arranged to move in the X-axis direction with the movement mechanism 19 interposed therebetween. In the moving mechanism 19, on the upper side of the two sides of the mask holding frame 12 in the direction of the x-axis, the gap sensor 14 and the holding frame 191 of the aligning machine 15 are respectively held to γ. The shaft direction extends and is disposed; the end of the holder stage 91 away from the side of the γ-axis direction driving device 丨3y is supported by the linear guide 192. The linear guide 192 includes a guide 192r that is disposed on the mask stage base 10 and extends along the axis direction, and a slider (not shown) that moves on the guide rail 1921>. The aforementioned end of the holder 191 is fixed to the slider. 121476.doc -14 - 200815939 In addition, the slider is driven by actuation 193 using a drive including a motor and a knurled screw, and the dual dynamic 叩" spacer 191 is interposed and aligned with the camera 15 Move in the direction of the X axis. E, i Yi 14 As shown in Fig. 4, the camera is aligned with the mask side calibration mark 101 of the surface of the mask (mask pattern surface), and optically detected from the back side of the mask. The cover is held below the mask support < The focus adjustment mechanism 151 makes a focus adjustment for the masking of the cover, and the self-adjustment of the land.

The guide 1 52, the ball screw 1 μ and the horse 152r and the slider 152s; wherein the movement of the visor camera 15 mounted on the mask carrier 1 is separated from the working focus adjustment mechanism 153 includes a linearity 154. The linear guide 152 includes a holder stage 91 that guides the guide holder 1 52r to the up-and-down direction extending mechanism 19, and the stage 152t is fixed to the slider i52s of the linear guide 152. Further, when the screw is turned on, the screw shaft is rotationally driven by the motor 154. The nut of the screw shaft of the ball screw 153 is coupled to the same table of the table i52t, as shown in FIG. 5. In this embodiment, below the workpiece suction cup 8 provided on the work object carrier 2, The projection optical system is aligned with the Z-axis micro-motion stage 24 in alignment with the optical axis of the alignment camera 15, and the projection optical system 78 has a light source 781 and a condensing mirror 782 and the working object side calibration mark 1 〇〇 Projector from below. Further, the work object carrier 2 and the γ-axis transfer table 52 form through holes corresponding to the optical paths of the projection optical system 78. Further, as shown in Fig. 6, in this embodiment, a preferred focus adjustment mechanism 510 for calibrating the image is provided, which has a mask side of the mask μ. 121476.doc -15· 200815939

The position of the surface of the mark 101 (mask pattern surface Mm) is detected to prevent the focus of the camera 15 from being out of focus. This optimum focus adjustment mechanism 15 uses a gap sensor 14 as an out-of-focus detection mechanism in addition to the alignment camera 15 and the focus adjustment mechanism 151. That is, the measured value of the position under the mask measured by the gap sensor 14 is compared with the preset focus position by the control device 8A, and the difference is obtained, and the relative difference from the set focus position is calculated from the difference. The focus position change amount is controlled, and the motor 1 54 of the focus grading mechanism 15 1 is controlled to move the aligning camera 丨 5 according to the calculated change amount, thereby adjusting the focus of the aligning camera 丨5. By using the optimum focus adjustment mechanism 15A, it is possible to perform high-precision focus adjustment of the calibration image without being affected by the variation in the thickness of the mask m or the unevenness of the thickness of the mask. That is, when a plurality of types of masks M are used interchangeably, even if the thickness of each mask is different, a suitable focal point can always be obtained. Further, the focus adjustment mechanism 151, the projection optical system 78, the optimum focus adjustment mechanism 150, and the like not only correspond to the high precision of the calibration of the second layer division pattern, but also contribute to the high precision of the second layer and later calibration. Further, if the thickness of the mask 为 is known, the optimum focus adjustment mechanism (10) is omitted and the focus adjustment mechanism 丨5 1 may be driven depending on the thickness. Further, the shielding apertures (shielding plates) 17 for shielding the both ends of the mask batch are disposed at the opposite ends of the opening 1〇a of the mask base 1〇 in the axial direction as needed. a position above the cover; the shielding hole (4) is movable in the Y-axis direction by the shielding aperture driving device 18 including the motor, the ball screw and the linear guide, and the shielding area of the both ends of the mask can be Make adjustments. 121476.doc -16- 200815939 ¥ : #object carrier 2 contains: Guard crop sucker 8 ' 1 嗖 placed on the base of the device a 4 μ & - 〇 系 · from the straight two on the top with a suction cup surface 8 & The suction cup surface h:: the base mask transfer table (gap adjustment member) 2A is adjusted by a vacuum suction device (not shown) or the like, and the gap between the opposite surfaces of the soil and the opposite surface is adjusted to a specific amount. The work 4 transport platform 2B is disposed in the z-axis transfer table 仏 'moving the work object carrier 2 in the XY-axis direction. Main: The Z-axis transfer table 2 shown in Fig. 7 includes: a z-axis coarse movement stage 22, and the A-series is erected on the lower base unit 4 of the apparatus base 4, so as to be thicker than the Z-axis 2 The mode is supported by the supporter; and the Z-axis micro-motion stage 24, which is supported by the upper and lower micro-motion devices 23, is supported by the z-axis coarse motion stage 22 in the upper and lower coarse motion devices 21, such as By using an electric actuator including a motor or a ball screw or an air compressor cylinder, the Z-axis coarse movement stage 22 is lifted and lowered without simply applying a gap between the cover (4) and the substrate w by simply performing the vertical movement. To the preset position. On the other hand, the upper and lower micro-motion device 23 shown in Fig. i includes a movable wedge mechanism which is a combination of a motor, a ball screw and a wedge; in this embodiment, the cymbal is arranged, for example, on the z-axis coarse movement stage. The upper motor 22 of the 22 is rotated by the screw shaft 232 of the ball screw, and the ball screw nut 233 is formed into a wedge shape, and the inclined surface of the wedge nut 233 is protruded from the Z-axis micro-motion bearing table 24 The inclined surface of the lower wedge 241 is engaged to form a movable wedge mechanism in this manner. Then, when the screw shaft 232 of the ball screw is rotationally driven, the wedge nut 233 is horizontally moved in the Y-axis direction, and the horizontal micro-motion movement is inclined by the two wedges 233 and 241 by 121476.doc -17-200815939. Role, while fretting movement. The upper and lower micro-motion devices 23 including the movable wedge mechanism are provided on one end side (the front side of the eye in FIG. 1) of the Z-axis micro-motion stage 24 in the Y-axis direction, and one on the other end side (not shown). A total of 3 units are set up and controlled separately. In this way, the upper and lower micro-motion devices 23 also have a tilting function, and the result is determined by the measurement of the gap between the three gap sensors 14 and the substrate 1 to a higher precision. The height of the Z-axis micro-motion stage 24 is finely adjusted so that the mask Μ is aligned with the substrate W in parallel and with a certain gap therebetween. Further, the upper and lower coarse motion devices 21 and the upper and lower fine motion devices 23 may be provided in the γ-axis transfer table 52. As shown in Fig. 7, the working object carrier transport mechanism 2B includes a linear V-track 41 which is disposed above the paraxial micro-motion stage 24, and is disposed away from the γ-axis direction, and is respectively extended in the direction. There are two sets of rolling guides, the X-axis transfer table 42, and the slider of the linear guide 41, and the X-axis transfer drive 43, i

The 4-axis transfer table 42 in the axial direction moves the X-axis transfer table 42 to the X 432^, and the ball screw 433 screwed to the ball screw shaft 32, and the ball drive device 43 The garment-shaped screw shaft is rotated by the motor 431 of the mine 43 by the X-axis. Further, the upper surface of the X-axis transfer table 42 is disposed away from each other in the X-axis direction, and is respectively disposed along the 乂 axis 5丄: the group of the group rolling guide; the γ-axis transfer table 52 / σ, sigh The 导 乂 / /, 系 Y 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装 安装The shaft nr 52 is coupled to a ball screw nut (not shown) for screwing the screw shaft 532, and the ball 5 is rotated by the motor 531 of the Y-axis transmission drive unit 53. On the top of the (four) transfer table 52, the work object is attached: In addition, the laser length measuring device 6〇 of the y-axis position moving distance measuring unit for detecting the work object carrier 2 is attached to In the case of the work object carrier 2 constructed as described above, the error is caused by (4) = f or the shape of the linear guide itself, or the installation error, etc., when the workpiece carrier 2 is moved, the difference is (4) It is inevitable that yaw, error, etc. are generated. Therefore, to measure the error of ^, the laser is Long device 6〇.... As shown in Fig.!, this laser length measuring device 6〇 contains a bamboo shaft trunk 62, 63 ' which is attached to the axis of the cultivar bearing table ^ and (4) is a stern axis The interferometer 64 is disposed at the end of the work =: the X-axis direction of the carrier 2 and has a laser, and the γ-axis mirror is disposed on the γ-axis interferometer with the work object carrier 2 The position of 62, 63; and the X-axis mirror 68 are disposed in the opposite direction to the working object; the X-axis interferometer 64 of the stage 2 is opposite. In this manner, by providing two x-axis interferometers 62 for the γ-axis direction, it is possible to know not only the position of the axis of the work object carrier 2 in the direction of the ¥ axis but also the interference of the x-axis. The yaw error is known from the difference in the position data of the juices 62 and 63. The position in the Y-axis direction can be calculated by appropriately applying the correction by averaging the yaw error in the y-axis direction of the crop material carrier 2 in the average of the two. 121476.doc 19 200815939 Next, the work object carrier & χ γ direction position χ, γ axis transmission ^ position ' or even after the previous division pattern is followed by the next division diagram (4) exposure exposure 'transfer the substrate w to the next In the stage of the area, as shown in FIG. 8, the detection signals output from the interferometers 62 to 64 are input to the control device 80. In this control device, the X-axis transfer drive unit 43 and the γ-axis transfer drive unit 53 are controlled based on the detected number to adjust the amount of movement in the χ γ direction for splitting the exposure, and at the same time, according to The detection correction amount for the connection exposure is calculated by the detection result of the x-axis interferometer 64 and the result of the output of the x-axis interferometers 62 and 63, and the calculation result is output to the mask position adjusting member 13 (and output to the upper and lower micro-motion devices 23 as needed). In this way, the positional adjustment error, the yaw, etc The impact is excluded. As shown in FIG. 1 and FIG. 7, a laser monitoring device 70 is provided on the apparatus base 4, which monitors the mask μ held by the mask carrier and the substrate W held by the workpiece carrier 2 The gap between the people. The laser monitoring device 7 has a light-emitting portion 71, 72 that causes the laser beam LB to emit light, and the laser beam LB passes through a specific position between the mask M and the substrate in a slightly horizontal direction, and The light receiving units 73 and 74 receive the laser beam LB. The illuminating lamps 71 and 72 and the illuminating portions 73 and 74 are disposed on the outer side of the primary element region in which the workpiece carrier 2 is step-moved, and are disposed to face the opposite sides of the mask Μ (refer to FIG. 9). ). Furthermore, 'for example, 'the gap g between the mask Μ and the substrate w is set to 150 μm and is applied. 121476.doc -20- 200815939

In the case of the exposure, the light-emitting portion η"" of the present embodiment is arranged such that the laser beam LB passes through the position 8Q_ from the lower surface of the mask M. For this reason, for example, the gap between the mask Μ and the substrate W When the angle is 8 〇 or less, the laser beam LB from the bamboo-light-emitting units 71 and 72 is cut, and the amount of light received by the light-receiving unit 73 is changed by t: the control device 8 is input to the light-receiving unit 73. If the amount of received light is less than or equal to a specific value, it is determined that the substrate 1 and the mask collide with each other, and the motor of the Z-axis transmission (upper and lower coarse movement (4) or the upper and lower micro-motion devices 23) is driven to stop control. The control device 8 of the present embodiment is basically implemented by using a series of controls such as a microcomputer, a series of people, etc., except for the opening control system for the exposure control shutter, the transmission control of the Ji crop material carrier 2, and the laser according to the laser. The correction amount calculation of the inspection values of the interferometers 62 to 64 and the drive control of the mask position adjustment member 13 include the correction amount calculation at the time of calibration adjustment, the drive control of the workpiece automatic supply device (not shown), and the like. And grouping into the segmentation successive exposure The driving of the actuator of the majority of the PE and the specific arithmetic processing. Next, with reference to FIG. 3(a), the avoidance of the collision between the substrate W and the mask M in the split sequential proximity exposure apparatus PE of this embodiment is avoided. The processing is described in the following. The mask is held on the mask carrier, and the substrate w is placed on the work object carrier 2 by the transport mechanism after the calibration adjustment I has been performed, and the substrate W is operated. The object suction cup is vacuum-adsorbed. Then, the Z-axis transfer table 2A for driving the gap adjustment means is adjusted while the gap sensor 14 is being monitored, so that the gap between the underside of the mask M and the substrate is exposed. It becomes a necessary specific value (for example, 15 pm). Same as 121476.doc -21 - 200815939

At this time, the laser beam irradiated by the light-emitting portions 71 and 72 passes through the lower surface of the vicinity of the two sides of the mask M, and the light-receiving amount is detected by the light-receiving portions 74 and 74. As shown by a dashed line in the figure, the Z-axis transfer table 2A rises, and when the substrate w cuts the laser beam lb from the light-emitting portions 71, 72, the amount of light received by the light-receiving portions 73, 74 is generated. Variety. For example, if the control device 8 detects that the aperture is below a certain value, it determines that the substrate w and the mask are in a conflicting state of danger, and the crucible transfer table 2 (the upper and lower coarse motion device 21 or the upper and lower micro motion devices 23) The motor drive is stopped. In this way, the contact of the substrate w with the mask 得 is avoided. Furthermore, since the laser beam LB passes through the lower surface of the vicinity of the two sides of the mask, even if the substrate W approaches the mask 倾斜 in an inclined state, the gap between the substrate W and the mask μ can be detected to be the narrowest. In this way, any contact of the substrate W with the mask μ can be surely avoided. Further, in the above description, the laser monitoring device is composed of two sets of light-emitting portions 71 and 72 and light-receiving portions 73 and 74. However, if more light-emitting portions and light-receiving portions are used, In the region, the protruding portion of the substrate w and the foreign matter on the US plate W can be detected, and the damage of the mask flaw due to the protruding portion or the foreign matter can be reliably prevented. Therefore, the "sequential proximity exposure device" according to the present embodiment includes: a laser monitoring device 70 having: light-emitting portions 71, 72 for causing the laser beam LB to emit light, and the laser beam lb to be slightly horizontal The direction passes through a specific position between the mask 保持 held by the mask carrier 1 and the substrate W held by the work object carrier 2; and the light receiving portions 73, 74 receive the laser light 121476.doc • 22- 200815939 In the case of the beam LB, and the control device 8A, when the amount of light received by the laser beam LB in the light receiving portion 74 is equal to or less than a specific value, the workpiece is loaded and stopped. Therefore, it is possible to avoid the contact between the substrate (W) and the substrate W at the time of exposure, and it is possible to prevent the damage of the mask M from being surely prevented. (Second embodiment)

Next, the division-by-step proximity exposure apparatus relating to the second embodiment of the present invention will be described with reference to Fig. 11; In addition, the exposure apparatus of this embodiment differs from the first embodiment only in the configuration of the laser monitoring apparatus. Therefore, the same reference numerals are given to the same configurations as those of the first embodiment, but the description will be omitted. Or simplified. The exposure apparatus of the present embodiment is in the vicinity of the four vertices of the mask on the mask carrier 1, and is provided with a laser monitoring device 9' The gap between the mask m of the stage i and the substrate w held by the workpiece σ 2 is monitored and monitored. The laser monitoring device 90 includes a light-emitting portion 91 for causing the laser beam lb to illuminate obliquely downward toward the substrate w, and a light-receiving portion 92 for receiving the laser beam LB reflected by the upper surface of the substrate w. The light receiving unit 92 monitors the gap by measuring the gap between the mask μ held by the mask stage 1 and the substrate w held by the workpiece carrier 2 in accordance with the position of the received laser beam LB. Furthermore, the position below the mask M that is sucked and held is pre-mastered, and the gap between the mask and the substrate is given by considering the following two positions. The light-receiving portion 92 is used for inspection. The position of the laser beam and the position below the mask. The disturbance table 80 is measured by the light receiving position of the light receiving portion 92. The gap between the mask Μ and the substrate W is measured. If the gap is less than or equal to a specific value, the substrate W and the mask are determined. The collision state of M is dangerous, and the motor of the z-axis transfer table 2 (upper and lower coarse motion device 21 or the upper and lower micro-motion device 23) is driven to stop control. In this way, the contact of the mask Μ with the substrate w can be avoided, and the damage of the mask] VI can be surely prevented.

In other structures and functions, it is the same as the i-th embodiment. Further, the laser monitoring device 9 of the present embodiment is provided near the four vertices of the mask ,, but the present invention is not limited thereto, and may be disposed at any position near the edge portion of the mask ,. According to the outer contour shape of the mask, it can be configured as appropriate. (Third embodiment) Next, a divided sequential proximity exposure apparatus according to a third embodiment of the present invention will be described. It is to be noted that the same reference numerals are given to the same structures as in the first embodiment, and the description will be omitted or simplified. As shown in FIG. 12, the singular yoke-type segmentation successive proximity exposure device ρΕ includes: a mask carrier 1 which holds the mask; and a work object carrier 2 which holds the glass substrate (exposed material) The illumination optical system 3 is used as an illumination member for pattern exposure; and the device base 4 supports the mask bearing port 1 and the work object carrier 2 . As shown in FIG. 13 and FIG. 3, the suction cup portion 16 in the vicinity of the apex of the four portions of the mask is formed with a contact sensing solid portion 16b, and the window portion 16b is provided with the addition and sensing. The sensor 30 is in contact with the sensor. The contact sensor 30 has a reaction portion 3〇a at a position lower than the lower surface of the mask ,, and is held in the substrate W of the work object carrier 2 by the 佶+-卞^g? & Cover Engagement a 〗 5 Before touching the mask Μ, touch the substrate w. 121476.doc •24- 200815939, for example, when the gap g between the mask Μ and the substrate w is set to 15 () μηη for exposure, the contact sensor 30 is mounted so as to be under the mask The distance 至 to the reaction 邛 30a is 8〇. In this way, when the gap g between the mask μ and the substrate W becomes 8 〇 _ or less, the contact sensor shoulder causes the reaction and the P 3 Ga contact base to be detected as a collision state between the mask μ and the substrate w, and This danger signal is transmitted to the control device 80.

Further, at both ends of the opening 1〇& of the opening of the mask base 1', the shielding apertures (shielding plates) 17 for shielding the both ends of the mask are disposed at the position The position of the shielding hole (4) is set to be movable in the Y-axis direction by the shielding aperture driving device 18 including the motor, the ball screw and the linear guide, and the two ends of the mask can be The shaded area is adjusted. Next, as shown in FIG. 15, the work object carrying platform 2 includes a work object suction cup 8 which is disposed on the apparatus base 4 and has a suction cup _ on the upper side, and the suction cup surface 8a is provided by the straight 彳 彳 β The Z-Jun is equipped with a two-type suction device (not shown) to hold the substrate W in a detachable manner; a 2-axis transfer table (gap adjustment structure:): Α 'The system will cover the Μ and the substrate The gap between the opposing faces is adjusted to a specific amount; and the work object carrier transfer mechanism 2β is disposed on the y-axis transfer table 2 , to move the work object carrier 2 in the z-axis direction. The cymbal transmission WA includes: a cymbal coarse motion bearing stage 22, which is supported by the lower coarse motion device 21 on the apparatus base 4, and is supported by the yaw axis direction in a coarsely movable manner, and the cymbal shaft The fine movement stage 24 is supported by the upper and lower micro-motion devices 23 on the boring coarse movement stage 22. In the upper and lower coarse motion device 21, for example, an electric actuator 121476.doc -25 - 200815939 or a pneumatic cylinder including a motor or an octagonal screw is used, and by simply performing the up and down motion, it is not necessary to perform the cymbal and the substrate W. The gap is measured, and the z-axis coarse movement stage is lifted to a predetermined position. On the other hand, the upper and lower micro-motion device 23 shown in FIG. 12 includes a movable wedge mechanism which combines a motor, a ball screw and a transverse arm; in this embodiment, the sorrow is set in the z-axis coarse movement platform. The motor 23 on the upper side of the 22 drives the screw shaft 232 of the ball screw to rotate, and the ball screw 螺母-nut 233 is formed into a wedge shape, and the inclined surface of the wedge nut 233 is protruded from the 2-axis micro-motion bearing. The inclined surface of the wedge 24 below the table 24 is engaged, thereby forming a movable wedge mechanism. Then, when the screw shaft 232 of the ball screw is rotationally driven, the floor nut 233 is horizontally moved in the γ-axis direction, and the horizontal fretting motion is changed to be more by the slope of the two wedges 233 and 241. High precision micro motion. The upper and lower micro-motion devices 23 including the movable wedge mechanism are provided on the one end side of the J-port 24 in the direction of the ¥ axis (the front side of the head of FIG. 12), and one on the other end side (not shown). Shown, a total of three sets, respectively, are driven independently (four) J. In this way, the upper and lower micro-motion devices 23 also have a tilt function, 1 according to the gap between the mask Μ and the substrate W of the three gap sensors 14 The measurement result 'the height of the crucible micro-motion stage 24 is finely adjusted so that the mask Μ and the substrate| are aligned in parallel and with a certain gap therebetween. Further, as above, the coarse motion device 21 and the upper and lower micro-motion The device 23 is also disposed on the part of the boring axis transfer table. The flow device of the work piece carrier includes: linear 121476.doc -26. 200815939 guide rail 41, which is attached to the 微 shaft micro-motion bearing _______ ^ The bauxite Y f is one of two sets of rolling guides that are oriented away from each other and are respectively extended along the X-axis direction; the X-axis transfer table 42 is attached to the slider 41a of the linear guide; X-axis transfer drive unit 43, which is configured to rotate the spindle transfer table 42 To the mover, the X-axis transfer table 42 is coupled to a ball screw nut 433 screwed to the ball screw _432, and the ball screw shaft 432 is rotated by the motor 431 of the X-axis transfer drive unit 43. The driver 。 / 、, the upper surface of the X-axis transfer table 42 includes: a linear guide 51 which is disposed away from each other in the X-axis direction, and is arranged in the direction of the ¥ axis, respectively The γ-axis transfer table 52' is attached to the slider 51a of the linear guide 51; and the γ-axis transfer drive device is for moving the γ-axis transfer table 52 in the Y-axis direction. The γ-axis transfer (four) is connected The ball screw (not shown) is screwed to the ball screw shaft 532, and the ball screw: 532 is driven by the motor 53 of the Y-axis transmission drive unit 53 and is rotated. Further, the upper surface of the transport table 52 is attached to the work object carrier. Further, the laser length measuring device 60' for detecting the work object carrier axis and the γ-axis position distance measuring unit is provided on the device base 4. Work object carrier 2 aspect 'caused by ball screw or linear guide itself> strong The error of the special 1 or the installation error, etc., in the movement of the carrier 2, the positioning error, yaw, flatness, g 1 generation is inevitable. Therefore, to carry the error For the purpose of this, that is, for the laser, the county dream and wave are set to 60. As shown in Fig. 12, the laser length measuring device 60 includes a pair of γ ^ dry gauges 62 and 63, which are attached to the work object. 121476.doc -27- 200815939 The end of the stage 2 in the x-axis direction is oppositely disposed and includes the laser; an X-axis:: meter 64 is disposed at the axial end of the work object carrier 2 And the two laser Υ 用 axis mirrors, which are arranged at positions opposite to the working object bearing ^62, 63; and X (four) reflection 2 '/, #, and the working object carrier The position of the axial direction. Lie can be used as the axis in the γ-axis direction, and only the position of the Y-axis direction of the workpiece carrier 2 can be obtained by the γ-axis interferometers 62 and 63. Beco's difference is known as a yaw. For the γ-axis direction, the hunting is based on the average of the two,

4 X of the processing crop piece carrier 2 plus correction is calculated. Set, yaw error, moderately applied, 'the work object carrying station is only the position of the battle port 2, the position of the 传送 axis transfer station 52, and even after the previous ^^^^ 4 〇® case will be followed by When the pattern is divided, the stage of the substrate Ο 16 传达 传达 传达 传达 传达 传达 , , , , , 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 传达 检signal input,. In the aspect of the control device 80, the X-axis transmission drive 4 is set to 43 and the x-axis transmission drive device is operated by the X-axis transmission φ; The detection result of the interference interferometer 64 and the second time, according to the results of the detection of the surviving surname # 冲果 and hunting by the ¥ axis interferometers 62, 63, and calculated for the 牡 暖 々 々 々 Μ Ρ ° Correction amount 'and the calculation is called the dry main 遮 main mask position replacement 锩 微 微 微 驻 “ 及 及 及 及 及 及 及 及 及 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 输出 遮 遮Etc., and the 'strong mask error' is excluded by the X-axis transmission drive 43 or the Y-axis 121476.doc -28· 200815939. The positioning error of the transmission drive μ is excluded. Straightness error, yaw, etc. On the reverse side, the position of the offset side calibration mark 101 and the work object side alignment mark (10) are detected according to the alignment camera 15: the position adjustment member 13 is driven and controlled, and the sense of the gap is sensed. The detector 14 detects the gap between the mask M and the substrate W, and the side will be up and down The driving device 23 performs driving control. Further, when the control device 8G detects the dangerous state of collision between the substrate w and the mask river by sensing the thief 30, the upper and lower coarse motion devices 21 or the upper and lower micro-motion devices are driven by a motor. The control device 8 () of the present embodiment is basically implemented by using a series of controls such as a microcomputer, a series of people, etc., except for the opening control of the shutter for exposure control, and the control unit 2 The transmission control, the correction amount calculation of the inspection value of the laser interferometer 62 64, and the drive control of the mask position adjustment member η, and the calculation of the correction amount at the time of calibration adjustment, and the automatic supply of the workpiece (not shown) Drive control, etc., and driving of a plurality of actuators divided into successive proximity exposure devices, and specific arithmetic processing. Next, referring to FIG. 13, the substrate in the split sequential proximity exposure device PE of the present embodiment is used. The avoidance process of the collision of W with the mask μ is explained. The mask is held on the mask stage 1 and the substrate W is placed by the transport mechanism in a state where calibration adjustment has been performed. On the work object carrier 2, the 'substrate W is vacuum-adsorbed by the workpiece suction cup. Then, the y-axis transfer table 2 驱动 which drives the gap adjustment means is adjusted while the gap sensor 14 is performing 121476.doc -29-200815939 In order to make the gap between the lower surface of the mask M and the upper surface of the substrate to be a specific value (for example, 15 〇 _) at the time of exposure. In the z-axis transmission, the contact sensing is performed. When the device 3 is in contact with the substrate w, the contact sensing (4) detects the rushing and dangerous heart and transmits the danger signal to the control device 8 藉. In this way, the control device 8 The 〇 system drives the motor of the (10) transfer table 2A to stop control so that the substrate W and the mask are in contact with each other. Further, the reaction portion is applied from the bottom of the mask to a specific distance! However, it is positioned so that when the contact sensor 30 has detected a conflicting dangerous state, the substrate W is also separated from the mask Μ by a specific distance, so that the contact between the substrate w and the mask 确实 can be surely avoided. Furthermore, the contact sensor 30 is attached to the vicinity of the apex of the 4 portion of the mask, because any of the contact sensors 30 can be used even if the substrate W approaches the mask in an inclined state. Contacting the highest part of the substrate W to detect the conflicting dangerous state, it is possible to surely avoid the contact between the substrate W and the mask 0 0. Therefore, according to the division of the present embodiment, the exposure device is successively connected, and is placed at the portion of the mask Μ A contact sensor 3 is disposed near the apex, and is provided with the reaction portion 30a below the mask % held by the mask carrier; therefore, it can be controlled from the contact sensor 3 The dangerous signal is generated to control the driving of the Z-axis transfer table 2A, so that the contact between the mask M and the substrate W can be avoided, and the damage of the mask μ can be surely prevented. (Fourth Embodiment) Next, a divided sequential proximity exposure apparatus according to a fourth embodiment of the present invention will be described with reference to Fig. 17 . Furthermore, the exposure apparatus 121476.doc -30-200815939 of the present embodiment differs from the third embodiment only in the structure of the contact sensor, and therefore 'in terms of the same structure as the third embodiment, The same symbol but the description will be omitted or simplified. As shown in Fig. 17, the contact sensor 5 of the present embodiment is directly placed near the apex of the four portions below the k-cover. Further, the contact sensor 5 is the same as the third embodiment, and has a reaction portion 5A at a position lower than the lower surface of the mask so that the substrate on the work object carrier 2 is held and held. Before the mask M of the mask carrier 1 is brought into contact, it is first brought into contact with the substrate|. When the reaction portion 50a comes into contact with the substrate w, it is detected that the mask % and the substrate w are in a dangerous state, and this signal is transmitted to the control device 8A. In this way, the driving of the Z-axis transfer table 2A can be controlled by controlling the dangerous signal detected from the contact sensor 5, so that the contact between the mask M and the substrate can be prevented, and the damage of the mask can be prevented. Further, since the contact sensor 50 is directly attached to the mask Μ, even if the mask % has a plate thickness unevenness, the contact between the mask Μ and the substrate W can be surely avoided. The other structures and functions are the same as those of the third embodiment. Further, the present invention is not limited to the above-described embodiments, and can be implemented in various forms without departing from the gist of the invention. The contact sensor 3 of the present embodiment is provided on the chuck portion 1 6 near the apex of the 4 portions of the mask 但, but is not limited thereto, and is installed in the mask according to the mask carrier Any member of the cover deck side (for example, the mask holding frame 12, etc.) may also be used. Further, the contact sensors 30 and 50 of the present embodiment are disposed near the apex of the four portions of the mask ,, but are not limited thereto, and at least four portions are disposed at any position near the edge portion of the mask M. The above can be used, such as according to 121476.doc -31 - 200815939 according to the outer contour shape of the mask is suitable for configuration. Further, in the case of the reaction portion disposed below the mask % which is held by the mask carrier, for example, when the mask is in a state where the central portion is in a curved state, the mask is used. _ The bottom position of the central part ^ below, consider the bottom position, the size of the mask μ and the base gap, etc., as appropriate. As can be seen from the above, the third embodiment and the fourth embodiment are not limited to the structure of an exposure apparatus, and are characterized in that the package S crop member carrier is held as a substrate of the exposed material. a mask bearing D disposed opposite to the substrate to hold the mask; an illuminating member aligning the substrate with light for pattern exposure, the illuminator for the mask; and a transport mechanism ' </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; At least four points in the vicinity of the edge portion of the cover are provided with contact sensors that are held below the lower surface of the mask of the mask carrier to have a reaction portion. According to the present structure, ώ % + ; at least 4 points in the vicinity of the edge portion of the mask are provided with a 'measurement portion' than the bottom portion of the mask held by the mask carrier; therefore' The driving of the transmission mechanism can be controlled from the contact sensor: the dangerous signal', so that the contact of the soil plate can be prevented from actually preventing the damage of the mask. The present invention is not limited to the above embodiment, but can be It is implemented in various types within the range of not exceeding /, and is required. 121476.doc •32- 200815939 [Simplified description of the drawings] Fig. 1 is a schematic diagram of the sequential proximity exposure apparatus of the i-th embodiment of the present invention. Fig. 2 is an enlarged perspective view of the portion of the mask carrier. (a) is a sectional view of the ΙΠβΙΠ line of Fig. 2, and (b) is a top view of the mask position adjusting member of the system (4). FIG. 5 is a structural view showing a focus adjustment mechanism for calibrating an image. FIG. 6 is a view showing a focus adjustment mechanism of the alignment camera and the alignment camera. Basic structure Figure 7 is a front view of the split sequential proximity exposure apparatus shown in Figure 1. Figure 8 is a block diagram showing the electrical structure of the divided successive proximity exposure apparatus shown in Figure 1. Figure 9 is a block diagram showing the structure shown in Figure 1. Fig. 1 is an explanatory view showing the detection state of the mask and the substrate S gap of the exposure apparatus of the second embodiment. Fig. 11 is a mask carrier of Fig. 10. Fig. 12 is a perspective view showing a partially exploded proximity exposure device according to a third embodiment of the present invention. Fig. n(a) will be cut along line III-III of Fig. 2. A cross-sectional view of the mask carrier along with the substrate; (b) a top view of the mask position adjustment member of the (a). Figure 14 is a bottom view of the suction cup portion of the mask carrier. 121476.doc •33· 200815939 Figure 15 is a front view showing the divided successive proximity exposure apparatus shown in Figure 12. Figure 16 is a block diagram showing the electrical structure of the divided successive proximity exposure apparatus shown in Figure 12. Figure 17 is a fourth embodiment of the present invention. Type-dependent segmentation of the masking stage of the successive proximity exposure device together with the substrate Sectional diagram of the main components. [Main component symbol description] 1 Mask carrier 2 Working object carrier 2 Λ Z-axis transfer table 2B 3 4 Working object carrier transfer mechanism Exposure illumination optical system device Abutment 8 Working object suction cup 8a Suction cup Face 10 Mask carrier base 10a Opening U 11 12 Mask carrier post cover retaining frame * 12a Flange. 13 13x 13y 14 15 Mask position adjustment member X-axis direction drive γ-axis direction drive gap sensing Alignment camera 121476.doc -34- 200815939

16 suction cup 16a suction nozzle 16b window 17 shielding aperture (shield) 18 shielding aperture drive 19 moving mechanism 21 upper and lower coarse motion device 22 z-axis coarse movement platform 23 upper and lower micro-motion device 24 Z-axis micro-motion bearing platform 30 &gt; 50 Contact sensor 30a ^ 50a Reaction portion 31 High pressure mercury lamp 32 Concave mirror 33 Optical integrator 34 Exposure control shutter 35 &gt; 36 Planar mirror 37 Spherical mirror 41, 51, 152, 192 Linear guide 41 a, 5 1 a, 133s &gt; 152s slider 42 X-axis transfer table 43 X-axis transfer drive 121476.doc -35- 200815939

ϋ 52 Y-axis transfer table 53 Y-axis transfer drive unit 60 Laser length measuring device 62, 63 X-axis interferometer 64 X-axis interferometer 66 X-axis mirror 68 X-axis mirror 70 &gt; 90 Laser monitoring device 71, 72, 91 Light-emitting unit 73, 74, 92 Light-receiving unit 78 Projection optical system 80 Control device 100 Workpiece-side calibration mark 101 Mask-side calibration mark 131 Drive actuator 131r Rod 132 Pin support mechanism 133r, 152r, guidance Rail 192r 152t Table 153 Spherical screw 150 Best focus adjustment mechanism for calibration image 151 Focus adjustment mechanism 154, 231, motor 121476.doc -36- 200815939 431, 531 191 Cage 232 Ball screw screw shaft 233 Wedge Nut 241 wedge 432, 532 spherical screw shaft 781 light source 782 concentrating mirror g gap 1 distance L optical path LB laser beam M mask Mm mask pattern surface P mask pattern PE division successive proximity exposure device W substrate 121476.doc -37 -

Claims (1)

200815939 X. Patent application scope: 1. An exposure apparatus, comprising: a working object bearing W, which is (4) a substrate for riding and storing; a mask carrying platform, which is arranged opposite to the substrate to maintain a masking device; the illuminating member's pair of the substrate for illuminating the pattern for illuminating the mask; and the transporting mechanism for arranging the working object carrier and the mask The stepwise movement is such that the mask pattern of the mask is opposite to a plurality of specific positions on the substrate; and includes: a laser monitoring device, and the dead m # 3 〃 has a hair front portion The laser beam is emitted 2. The laser beam is slightly horizontally passed through the cover and the light receiving portion of the mask and the substrate held by the workpiece carrier, a laser beam; and the amount of light received by the laser beam in the light receiving portion: when the specific value is less than or equal to a specific value, the occlusion bearing station and the foregoing operation: movement in at least the upper and lower directions of the carrier Stop it. An exposure apparatus comprising: 2 a crop member carrier that holds a substrate as a substrate to be exposed; a carrier platform that is disposed opposite to the substrate to maintain a mask: a pair of members The substrate is irradiated with a mask; and a nine-a transport mechanism that moves the workpiece carrier and the mask substrate in a relative stepwise manner, the substrate JL β H , the mask pattern of the mask and the plurality of specific-position laser monitoring devices on the substrate, both of which are included; and the cover unit # ^ , &amp; light portion, the system configuration In the vicinity of the edge portion of the occlusion cover, the laser beam is directed forward; Γ first:: and: the light portion ′ receives the mask reflected by the substrate and is held by the mask carrier "Review the gap between the substrates of the crop material carrier: see the gap; and the equipment, the pot in the a needle, +, #, when the gap is below a certain value, then the single bearing Station and the aforementioned work object carrier to the middle D to move the party over who is to be stopped. U 121476.doc