TW200630483A - Cleaning solvent for semiconductor production apparatus - Google Patents
Cleaning solvent for semiconductor production apparatusInfo
- Publication number
- TW200630483A TW200630483A TW094139921A TW94139921A TW200630483A TW 200630483 A TW200630483 A TW 200630483A TW 094139921 A TW094139921 A TW 094139921A TW 94139921 A TW94139921 A TW 94139921A TW 200630483 A TW200630483 A TW 200630483A
- Authority
- TW
- Taiwan
- Prior art keywords
- solvent
- cleaning solvent
- cleaning
- production apparatus
- semiconductor production
- Prior art date
Links
- 239000002904 solvent Substances 0.000 title abstract 10
- 238000004140 cleaning Methods 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 abstract 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 abstract 3
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 abstract 2
- 230000001476 alcoholic effect Effects 0.000 abstract 2
- 238000009835 boiling Methods 0.000 abstract 2
- 229940035429 isobutyl alcohol Drugs 0.000 abstract 2
- SJWFXCIHNDVPSH-UHFFFAOYSA-N octan-2-ol Chemical compound CCCCCCC(C)O SJWFXCIHNDVPSH-UHFFFAOYSA-N 0.000 abstract 2
- 239000011342 resin composition Substances 0.000 abstract 2
- WVYWICLMDOOCFB-UHFFFAOYSA-N 4-methyl-2-pentanol Chemical compound CC(C)CC(C)O WVYWICLMDOOCFB-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
- C11D7/262—Alcohols; Phenols fatty or with at least 8 carbon atoms in the alkyl or alkenyl chain
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Organic Chemistry (AREA)
- Emergency Medicine (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Detergent Compositions (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004353375A JP2006160859A (ja) | 2004-12-06 | 2004-12-06 | 半導体製造装置の洗浄用溶剤 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200630483A true TW200630483A (en) | 2006-09-01 |
TWI341865B TWI341865B (zh) | 2011-05-11 |
Family
ID=36577798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094139921A TW200630483A (en) | 2004-12-06 | 2005-11-14 | Cleaning solvent for semiconductor production apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US20080132740A1 (zh) |
EP (1) | EP1840199A1 (zh) |
JP (1) | JP2006160859A (zh) |
KR (1) | KR20070084614A (zh) |
TW (1) | TW200630483A (zh) |
WO (1) | WO2006061967A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101367252B1 (ko) * | 2011-11-10 | 2014-02-25 | 제일모직 주식회사 | 수소화폴리실록사잔 박막용 린스액 및 이를 이용한 수소화폴리실록사잔 박막의 패턴 형성 방법 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2076009B (en) * | 1980-04-14 | 1983-10-26 | Daikin Ind Ltd | Azeotropic solvent composition |
JPS59202298A (ja) * | 1983-05-02 | 1984-11-16 | ポリプラスチックス株式会社 | 金型付着物の除去方法 |
JPS61159499A (ja) * | 1985-01-07 | 1986-07-19 | ポリプラスチックス株式会社 | 金型付着物の除去方法 |
JP3169024B2 (ja) * | 1991-07-12 | 2001-05-21 | 三菱瓦斯化学株式会社 | シリコンウエハーおよび半導体素子洗浄液 |
JPH10146844A (ja) * | 1996-09-17 | 1998-06-02 | Asahi Chem Ind Co Ltd | 金型付着物の除去方法 |
JP2001194785A (ja) * | 2000-01-11 | 2001-07-19 | Mitsubishi Electric Corp | レジストパターン微細化材料及びこの材料を用いた半導体装置の製造方法並びにこの製造方法を用いた半導体装置 |
US6663723B1 (en) * | 2000-10-24 | 2003-12-16 | Advanced Micro Devices, Inc. | Vapor drying for cleaning photoresists |
US7179774B2 (en) * | 2002-06-19 | 2007-02-20 | Henkel Kommanditgesellschaft Auf Aktien | Flushing solutions for coatings removal |
JP4265766B2 (ja) * | 2003-08-25 | 2009-05-20 | 東京応化工業株式会社 | 液浸露光プロセス用レジスト保護膜形成用材料、該保護膜形成材料からなるレジスト保護膜、および該レジスト保護膜を用いたレジストパターン形成方法 |
JP4305095B2 (ja) * | 2003-08-29 | 2009-07-29 | 株式会社ニコン | 光学部品の洗浄機構を搭載した液浸投影露光装置及び液浸光学部品洗浄方法 |
US20070122741A1 (en) * | 2005-11-29 | 2007-05-31 | Shin-Etsu Chemical Co., Ltd. | Resist protective coating material and patterning process |
-
2004
- 2004-12-06 JP JP2004353375A patent/JP2006160859A/ja active Pending
-
2005
- 2005-11-08 WO PCT/JP2005/020446 patent/WO2006061967A1/ja active Application Filing
- 2005-11-08 KR KR1020077012291A patent/KR20070084614A/ko not_active Application Discontinuation
- 2005-11-08 EP EP05806250A patent/EP1840199A1/en not_active Withdrawn
- 2005-11-08 US US11/792,467 patent/US20080132740A1/en not_active Abandoned
- 2005-11-14 TW TW094139921A patent/TW200630483A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20080132740A1 (en) | 2008-06-05 |
EP1840199A1 (en) | 2007-10-03 |
JP2006160859A (ja) | 2006-06-22 |
WO2006061967A1 (ja) | 2006-06-15 |
TWI341865B (zh) | 2011-05-11 |
KR20070084614A (ko) | 2007-08-24 |
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