TW200509280A - Method and apparatus for performing metrology dispatching based upon fault detection - Google Patents
Method and apparatus for performing metrology dispatching based upon fault detectionInfo
- Publication number
- TW200509280A TW200509280A TW093119368A TW93119368A TW200509280A TW 200509280 A TW200509280 A TW 200509280A TW 093119368 A TW093119368 A TW 093119368A TW 93119368 A TW93119368 A TW 93119368A TW 200509280 A TW200509280 A TW 200509280A
- Authority
- TW
- Taiwan
- Prior art keywords
- fault detection
- metrology
- routing
- workpieces
- batch
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 6
- 238000001514 detection method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Quality & Reliability (AREA)
- Automation & Control Theory (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- General Factory Administration (AREA)
- Automatic Analysis And Handling Materials Therefor (AREA)
- Multi-Process Working Machines And Systems (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/614,604 US20050021272A1 (en) | 2003-07-07 | 2003-07-07 | Method and apparatus for performing metrology dispatching based upon fault detection |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200509280A true TW200509280A (en) | 2005-03-01 |
Family
ID=34079635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093119368A TW200509280A (en) | 2003-07-07 | 2004-06-30 | Method and apparatus for performing metrology dispatching based upon fault detection |
Country Status (8)
Country | Link |
---|---|
US (1) | US20050021272A1 (zh) |
JP (1) | JP2007527612A (zh) |
KR (1) | KR20060034690A (zh) |
CN (1) | CN1816906A (zh) |
DE (1) | DE112004001259B4 (zh) |
GB (1) | GB2419688B (zh) |
TW (1) | TW200509280A (zh) |
WO (1) | WO2005010978A1 (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7296103B1 (en) * | 2004-10-05 | 2007-11-13 | Advanced Micro Devices, Inc. | Method and system for dynamically selecting wafer lots for metrology processing |
US7277824B1 (en) * | 2005-07-13 | 2007-10-02 | Advanced Micro Devices, Inc. | Method and apparatus for classifying faults based on wafer state data and sensor tool trace data |
US7502702B1 (en) * | 2005-09-07 | 2009-03-10 | Advanced Micro Devices, Inc. | Method and apparatus for dynamic adjustment of sensor and/or metrology sensitivities |
US7257502B1 (en) * | 2006-02-28 | 2007-08-14 | Advanced Micro Devices, Inc. | Determining metrology sampling decisions based on fabrication simulation |
US7954072B2 (en) * | 2006-05-15 | 2011-05-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Model import for electronic design automation |
US7560007B2 (en) * | 2006-09-11 | 2009-07-14 | Lam Research Corporation | In-situ wafer temperature measurement and control |
US8145337B2 (en) * | 2007-05-04 | 2012-03-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methodology to enable wafer result prediction of semiconductor wafer batch processing equipment |
US7974728B2 (en) * | 2007-05-04 | 2011-07-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | System for extraction of key process parameters from fault detection classification to enable wafer prediction |
US7783999B2 (en) * | 2008-01-18 | 2010-08-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electrical parameter extraction for integrated circuit design |
US8037575B2 (en) * | 2008-02-28 | 2011-10-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for shape and timing equivalent dimension extraction |
US8001494B2 (en) | 2008-10-13 | 2011-08-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Table-based DFM for accurate post-layout analysis |
US8806386B2 (en) * | 2009-11-25 | 2014-08-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Customized patterning modulation and optimization |
US8745554B2 (en) * | 2009-12-28 | 2014-06-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Practical approach to layout migration |
US8559001B2 (en) * | 2010-01-11 | 2013-10-15 | Kla-Tencor Corporation | Inspection guided overlay metrology |
US20130297061A1 (en) * | 2012-05-03 | 2013-11-07 | National Taiwan University | Method and computer-aided design system of manufacturing an optical system |
CN104103544B (zh) * | 2014-08-01 | 2020-03-31 | 上海华力微电子有限公司 | 晶圆缺陷监控方法 |
CN105742144A (zh) * | 2016-02-26 | 2016-07-06 | 镇江乐华电子科技有限公司 | 一种监控透射电子显微镜的预警系统 |
WO2018187308A1 (en) * | 2017-04-03 | 2018-10-11 | Swisslog Logistics, Inc. | Automated manufacturing facility and methods |
CN109003919B (zh) * | 2018-07-11 | 2020-11-03 | 上海华力微电子有限公司 | 一种晶圆制程工艺参数的反馈方法 |
CN110831029B (zh) * | 2018-08-13 | 2021-06-22 | 华为技术有限公司 | 一种模型的优化方法和分析网元 |
EP4043976B1 (de) * | 2021-02-16 | 2023-06-14 | Carl Zeiss Industrielle Messtechnik GmbH | Verfahren und system zur vermessung von bauteilen sowie programm |
JP2023083865A (ja) * | 2021-12-06 | 2023-06-16 | 富士通株式会社 | 情報処理プログラム、情報処理方法、および情報処理装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996026539A1 (fr) * | 1995-02-24 | 1996-08-29 | Hitachi, Ltd. | Procede et dispositif destine a l'analyse d'anomalies et la verification de chaines de production |
JP3926478B2 (ja) * | 1998-06-01 | 2007-06-06 | 株式会社ルネサステクノロジ | 半導体製造方法 |
JP2003502771A (ja) * | 1999-06-22 | 2003-01-21 | ブルックス オートメーション インコーポレイテッド | マイクロエレクトロニクス製作に使用するラントゥーラン制御器 |
US6407396B1 (en) * | 1999-06-24 | 2002-06-18 | International Business Machines Corporation | Wafer metrology structure |
US20020147960A1 (en) * | 2001-01-26 | 2002-10-10 | Applied Materials, Inc. | Method and apparatus for determining scheduling for wafer processing in cluster tools with integrated metrology and defect control |
US7698012B2 (en) * | 2001-06-19 | 2010-04-13 | Applied Materials, Inc. | Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
US6444481B1 (en) * | 2001-07-02 | 2002-09-03 | Advanced Micro Devices, Inc. | Method and apparatus for controlling a plating process |
US6708075B2 (en) * | 2001-11-16 | 2004-03-16 | Advanced Micro Devices | Method and apparatus for utilizing integrated metrology data as feed-forward data |
US7051250B1 (en) * | 2002-06-06 | 2006-05-23 | Advanced Micro Devices, Inc. | Routing workpieces based upon detecting a fault |
US6773931B2 (en) * | 2002-07-29 | 2004-08-10 | Advanced Micro Devices, Inc. | Dynamic targeting for a process control system |
US6740534B1 (en) * | 2002-09-18 | 2004-05-25 | Advanced Micro Devices, Inc. | Determination of a process flow based upon fault detection analysis |
US6810296B2 (en) * | 2002-09-25 | 2004-10-26 | Advanced Micro Devices, Inc. | Correlating an inline parameter to a device operation parameter |
US6957120B1 (en) * | 2003-01-06 | 2005-10-18 | Advanced Micro Devices, Inc. | Multi-level process data representation |
-
2003
- 2003-07-07 US US10/614,604 patent/US20050021272A1/en not_active Abandoned
-
2004
- 2004-06-02 KR KR1020067000427A patent/KR20060034690A/ko not_active Application Discontinuation
- 2004-06-02 DE DE112004001259T patent/DE112004001259B4/de not_active Expired - Fee Related
- 2004-06-02 CN CNA2004800192307A patent/CN1816906A/zh active Pending
- 2004-06-02 JP JP2006518635A patent/JP2007527612A/ja active Pending
- 2004-06-02 GB GB0601691A patent/GB2419688B/en not_active Expired - Fee Related
- 2004-06-02 WO PCT/US2004/017502 patent/WO2005010978A1/en active Application Filing
- 2004-06-30 TW TW093119368A patent/TW200509280A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20050021272A1 (en) | 2005-01-27 |
GB2419688B (en) | 2006-10-18 |
GB0601691D0 (en) | 2006-03-08 |
KR20060034690A (ko) | 2006-04-24 |
JP2007527612A (ja) | 2007-09-27 |
CN1816906A (zh) | 2006-08-09 |
DE112004001259B4 (de) | 2011-01-13 |
WO2005010978A1 (en) | 2005-02-03 |
DE112004001259T5 (de) | 2006-05-24 |
GB2419688A (en) | 2006-05-03 |
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