TW200421513A - IC tester system for eliminating electrostatic discharge damage - Google Patents

Abstract

An IC tester system for eliminating electrostatic discharge damage is provided. The IC tester system includes a temperature control oven and an IC test board. The IC test board contains a dummy conducting wire and a grounding interface for grounding out the electrostatic discharge (ESD) generated during the loading and unloading of the test board through a thermal-insulated rubber installed in the door of the oven.

Description

200421513 V. Description of the invention (1) The technical field to which the invention belongs ^ The present invention provides an IC component test system, especially an electrical capacity test system for IC components that can prevent electrostatic damage. Prior art

In the IC chip manufacturing process, the "reliability" of a product is one of the very important factors to consider. Reliability can be simply described as the service life of the product under normal use conditions. In order for IC manufacturers to know the service life of products in a short period of time, they usually use the "Accelerated lifetime test" to predict the average service life of their products by using stricter working conditions than Working environment, such as product life test under high ambient temperature, voltage, current or pressure, to determine the life of the product under deteriorating conditions, and then use the life cycle model (Li feti me Model) to calculate the product under normal use conditions Life. The reliability test of general IC factories can be divided into "Wafer-Level Reliability (WLR)" and "Package-Level Reliability (PLR)" according to their test methods. The former is to directly place the wafer Tests are carried out in a test machine on a general production line, while the latter first cuts and packages the wafer into test samples, then inserts these samples into a test board, and then places them in a special high-temperature furnace for testing. Among them, the life test test strip of the "package level" reliability test

200421513 V. Description of the invention (2) The stress conditon is closer to the normal working conditions of the product, and the result is more acceptable to the industry. At present, the most commonly used packaging level of IC wafer fabs. C-chip electrical test equipment is shown in Figure 1. Figure 1 shows the appearance of the conventional c-test equipment. 丨 IC chip test equipment i 〇 contains a temperature control. The furnace body 12 and a temperature-resistant and temperature-resistant material 16 such as rubber are fixedly arranged on the inner and outer sides of the furnace door 丨 4. The high temperature resistant material 16 is used to isolate the temperature inside and outside the temperature control furnace, and there are several slits that are cut open for the test board b〇ard) 30 to pass through and insert into the furnace door 14. Test board 30 contains a slot for the device under test

(socket) 34 'is used to place a device under test 32, such as a test IC, a test lead 36, and a test interface (or golden finger) 3 8 for connecting a port of a test unit ( Not shown). During the test, a device under test (DUT) 32 packaged as a test sample is installed on the test element slot 34, and the test board 30 is manually inserted into the high temperature resistant material on the furnace door 14 The elongated opening 18, then the furnace 2, and then the temperature control furnace is used to provide the required μ loops for the reliability test. The test circuit provides current and voltage for the test.

$ ， '1 knows that the IC chip electrical test equipment i 〇 can not be designed = only statically destroys the absence of the component to be tested: when the operator inserts the test board 30 k of the slender opening of the south resistant material 18 into the furnace When the door 14 is loading (loading boards), the test interface 38 on the test board 30 and the conductive surface of the board-the South-temperature-resistant material 丨 6 will rub against each other to generate static electricity, which will destroy the test.

Page 6 200421513 V. Description of the invention (3) The component has caused the component to be damaged by static electricity and lose its normal function before the electrical test has been formally tested. Similarly, when the test panel 30 is unloaded from the furnace door 14 by the operator after the test is completed, the components may be destroyed by static electricity due to friction, which may cause great losses. The current remedy for the lack of conventional IC chip electrical test equipment is generally to use a special fixture provided by the original test equipment factory. When placing the test sample in the test component slot, each special fixture is first used to close each IC test components, so that the operator will not generate static electricity when the test board is inserted in the furnace door, and then before each electrical test,

Remove the fixture on the component to be tested before testing; after the test is completed, the operator must also install the anti-static fixture attached to the factory before removing the test board. Although this method using a fixture can prevent the generation of static electricity, it must take a lot of time to set up and remove the fixture when performing electrical tests, and the steps are very cumbersome. Even when the operator sets up the fixture, the steps may be complicated. As a result of human error, the device under test is destroyed, and the cost and effect of the electrical test cannot be effectively improved. Therefore, an IC chip electrical test equipment with simple anti-static damage operation steps is really urgently needed by current manufacturers.

Summary of the Invention

The main object of the present invention is to provide a 1C which can prevent electrostatic damage.

Page 7 200421513

V. Description of the invention

In the scope of the patent application of the present invention, an IC test system for anti-static damage is disclosed. The IC test system includes a temperature control furnace and at least one IC component test board. The temperature test furnace includes a temperature-controlled furnace body, a furnace door, and a high-temperature resistant material disposed on the furnace door. The IC component test board includes a circuit board body, at least one slot for a component under test, a test interface, a ground interface, a test lead, and a dummy lead. During the loading / unloading process of the IC component test board, the static electricity generated by the test lead and the high temperature resistant material due to friction can be connected to the ground interface and grounded by using a Qinhu 罟 wire. H The anti-static destruction IC test system of the present invention is provided with a dummy wire and a ground interface, which can lead the static electricity generated by the friction between the test wire and the high-temperature resistant material to ground before testing to avoid electrostatic damage. 1 (: to be tested Components, effectively improve the defects of the conventional equipment, and thus improve the accuracy of the electrical power test. In order to allow your reviewers to better understand the features and technical content of the present invention, 'please refer to the following detailed description and appendix of the present invention However, the drawings are for reference and explanation only, and are not intended to limit the present invention.

200421513

Refer to FIG. 2 for reference. FIG. 2 is a schematic view of the j C element of the present invention. As shown in the figure-say -r ☆ 1 Ding㊇ or system 50 0 = as shown in Figure 1, the IC component test system of the present invention > dish control furnace 60 and a, first 50 daggers, a 60 including a, Heart-piece test plate portion. The temperature control furnace also has a temperature control furnace body 62 for providing the test temperature of the temperature, as soon as you # 迪 座 丨, ChengWu LW measuring element is appropriate, the mouth is connected to the dish control furnace The furnace door 64 on the body and the same material 66, such as rubber, are fixed on the furnace door 64 to isolate and control the inside and outside of the furnace, and the sound of the sound. The ICto component test board 70 having a plurality of cut-out elongated openings on it includes a circuit board body 71, an element to be tested, and a slot 72 is provided on the circuit board body 71 for installing a temple measurement component M and a test interface. 73, used to connect a test unit's connection port (unplugged), a ground interface 74, used to connect a grounded connection port 80, a test lead 75, used to connect the component under test 72 and the test The interface 73 is connected with a dummy lead 76 for connecting the test lead 75 and the ground interface 74. In this embodiment, in order to simplify the description, the c-component test system 5 〇 only contains an I Ctg test board 7 〇, and the I c-component test board 70 also includes only one IC test component slot 7 2 . However, the present invention is needed according to the actual situation.

The remaining test system 50 may include a plurality of IC component test boards 70, and each IC component test board 70 may include a plurality of test component slots 72, which may accommodate a plurality of IC test components 78 for testing.

--- When performing the test, first insert the pins of the I Of temple component 7 8 into the corresponding holes in the component socket 72 of the component under test, so that! cThe component under test is fixed on the component slot 7 2 to be tested, and then the ground interface 7 4 and a grounded port

Page 9 200421513 V. Description of the invention (6) ί ί 2 ”The test board 70 for the component to be tested is manually fixed by the inside 70 of the furnace door 64 to: 3 the elongated opening 68 of the material 66, so that the test board for the component to be tested Ancient, ^ from the pole, at this time, the static electricity generated by the test lead 7 5 ^ ϊ t on the circuit board body 透 will pass through the dummy lead 76: two ^: surface 74 connection 槔 8〇 ground, Then unplug the connection port 80 and close the furnace door 64, and then electrically connect the test interface 73 to a test port (not shown), and perform an electrical power test under predetermined test conditions.

When the test is completed, first remove the port (not shown) of the test unit from the test interface 73, then open the furnace door 64 and connect the ground interface 74 to a ground, port 80, and then manually connect ( : The component test board 70 is carried by the high temperature resistant material 66. At this time, the static electricity generated by friction will pass through the dummy wire 7 6 through the grounded connection port 2 connected to the ground interface 74. Connect the 崞 8 to unplug and remove the I c test component 7 8 from the test component slot 7 2 to complete the test of the I c component. 0

Compared with the conventional IC component test equipment, the c component test system of the present invention is designed with a dummy wire and a ground interface on the IC component test board, which can connect the test lead of the IC component test board and the temperature control furnace door. The static electricity generated by the friction of the high heat-resistant material is directly grounded to prevent static electricity from damaging IC test components, so it can effectively improve the shortcomings of conventional equipment and improve the accuracy of IC electrical testing.

Page 10 200421513 V. Description of the invention (7) The above description is only a preferred embodiment of the present invention. Any equal changes and modifications made in accordance with the scope of the patent application of the present invention shall fall within the scope of the invention patent.

Page 11 200421513 Simple illustration of the diagram Simple illustration of the diagram Figure 1 is the intention of the conventional IC component test equipment. FIG. 2 is a schematic diagram of the IC component testing system of the present invention. Schematic symbol description

Page 12 10 1C component testing equipment 12 Temperature control furnace body 14 Furnace door 16 High temperature resistant material 18 Slim opening on south temperature resistant material 30 IC test board 32 1C component to be tested 34 1C component to be tested slot 36 Test lead 38 Test interface 50 1C component test system 60 Temperature control furnace 62 Temperature control furnace body 64 Furnace door 66 and South temperature material 68 Slim opening on South temperature resistant material 70 IC test board 71 Circuit board body 72 1C component under test Slot 73 Test interface 74 Ground interface 75 Test lead 76 Dummy lead 78 1C DUT 80 Ground connection port

Claims (1)

200421513 6. Scope of patent application 1. An anti-static destruction 1C component test board (DUT Board) is used to test the electrical capacity of an IC under test (DUT). The IC component test board includes: A circuit board body; an IC component to be tested slot disposed on the circuit board body for mounting the IC component to be tested; a test interface located at a protruding position of an edge of the circuit board body; a ground interface located at A protruding position of the other edge of the circuit board body; A test lead is disposed on the circuit board body, one end of which is electrically connected to the slot of the component under test, and the other end is connected to the test interface; and a dummy wire is disposed on the circuit board body, the The dummy lead is electrically connected to the test lead, and one end is connected to the ground interface; wherein the dummy lead is used to pre-charge static electricity generated during the loading / unloading of the IC component test board into a temperature-controlled furnace door. It is led out through the ground interface to prevent the static electricity from damaging the IC device under test installed in the slot of the device under test. 2 · The IC component test board as described in item 1 of the scope of patent application, wherein the temperature-controlled furnace door is rotatably connected to a temperature-controlled furnace body, and the temperature-controlled furnace door is provided with a high-temperature resistant material, The high temperature resistant material has at least one elongated opening through the temperature control furnace door. The opening is just large enough to allow the IC component test board to pass. Page 13 200421513 VI. Patent application scope 3 · The IC component test board described in item 1 of the patent application scope, wherein a plurality of holes are provided in the IC test component socket to provide corresponding access to the test component Pin (pin) is inserted. 4 · The IC component test board described in item 1 of the scope of patent application, wherein the test interface is electrically connected to a port on a test unit. 5 · The IC component test board as described in item 1 of the scope of patent application, wherein the ground interface is electrically connected to a grounded port before testing, and then the IC component test board is loaded into the temperature-controlled furnace door, The dummy wire is used to advance the static electricity generated when the 1C component test board is loaded into the temperature-controlled furnace door through the ground interface, and then the ground connection is disconnected. 'Close the furnace door and connect the test interface to the A port on a test unit. 6 · The IC component test board as described in item 1 of the scope of patent application, wherein after the test is completed, the test unit's port is first unplugged, then the furnace door is opened to electrically connect the ground interface to a grounded port, and then The Ic component test board carries the temperature control furnace door ', so that the dummy wire leads the static electricity generated when the Ic component test board is carried out of the temperature control furnace door to the ground through the ground interface, and finally unplug the ground connection water pulley. 7. An IC component test system including: A temperature controlled furnace including: 200421513 6. Scope of patent application 1. Temperature control furnace body for accommodating an IC component test board and providing the appropriate test temperature of the IC component test board; a switchable furnace door connected to the temperature control furnace body and provided thereon There is a local temperature-resistant material, the Cainan temperature material has at least slender openings; an IC component test board capable of preventing static electricity damage, including: a circuit board body; an IC test component slot, which is arranged in the The circuit board body is used to install an IC component to be tested; a test interface is located at a protruding position of one edge of the circuit board body; a ground interface is located at a protruding position of the other edge of the circuit board body; a test lead is arranged One end of the circuit board body is electrically connected to the slot of the device under test, and the other end is connected to the test interface; a dummy wire is arranged on the circuit board body, and is electrically connected to the test wire, and one end is Connected to the ground interface; and a test unit connected to the test interface on the circuit board for testing a device under test on the circuit board; When a row I C element electrically charge test, the test of the I C-based interface of the device test board refractory material through the elongated opening of the door. 8. The IC device test system as described in item 7 of the scope of the patent application, wherein the south temperature resistant material is a rubber. Page 15 200421513 6. Scope of patent application 9: The IC component test system described in item 7 of the scope of patent application, wherein a plurality of holes are provided in the socket of the I0ί test component to provide corresponding pins on the Ic tested component (Pin) insert. 1 0. The 1C component test system as described in item 7 of the scope of patent application, wherein the test interface is connected to a port on the test unit. ^ 1 1 · The IC component test system as described in item 7 of the scope of patent application, wherein the ground interface is electrically connected to a grounded port before testing, and then the IC component test board is loaded into the temperature control Furnace door, the static electricity generated when the dummy wire is loaded into the temperature control furnace door of the IC component test board is led out through the ground interface, and then the grounded port is unplugged, the furnace door is closed, and the test interface is A connection bee that is electrically connected to a test unit. . 1 2 · The IC component test system described in item 7 of the scope of patent application, wherein after the test is completed, the test unit's port is first unplugged, and then the furnace door is opened to electrically connect the ground interface to a grounded port, and then The temperature control furnace door is carried out by the IC component test board, so that the dummy wire leads the static electricity generated when the IC component test board is carried out by the temperature control oven door to ground through the ground interface, and finally unplug the ground connection. . 1 3 · —Ic component testing equipment for antistatic destruction, used to test Ic Page 16 200421513 VI. Patent application scope testing components, the IC component testing equipment includes: a temperature control furnace, including: a temperature control furnace body, which provides the appropriate test temperature of the IC test components; a switchable furnace door Is connected to the temperature control furnace body, and a high temperature resistant material is arranged on the high temperature resistant material, the high temperature resistant material has at least all elongated openings; an IC test component test board is inserted through the elongated openings of the high temperature resistant material. The furnace door includes: a circuit board body, which can be divided into a first part and a second part, wherein the first part is located in the temperature control furnace and the second part is located at the temperature when the test is performed Control the furnace body; an IC test component slot is arranged on the first part of the circuit board body to install an IC test component; a test interface is located at an edge protruding position of the second part of the circuit board body; The ground interface is located at a protruding position of an edge of the first part of the circuit board body; a test lead is arranged on the circuit board body, and one end thereof is electrically connected To the IC test component slot, the other end is connected to the test interface; a dummy wire is 'disposed on the circuit board body' which is electrically connected to the test lead, and one end is connected to the ground interface; and a test unit And is connected to the test interface on the IC test board to test the IC device under test. 200421513 VI. Scope of patent application 1 4 · The IC device testing equipment described in item 丨 3 of the scope of patent application, wherein the high temperature resistant material is a rubber. 1 5 · The IC component testing equipment as described in item No. 丨 3 of the patent application scope, wherein a plurality of holes are provided in the IC test component slot to provide corresponding pins (pi η) on the IC test component. . 16 · The IC device testing device as described in item 3 of the patent application scope, wherein the test interface is connected to a port on the test unit. 1 7 · The I c component test equipment as described in item 3 of the patent application scope, wherein the ground interface is electrically connected to a grounded port before testing, and then the IC component test board is loaded into the temperature control Furnace door, the static electricity generated when the dummy wire is loaded into the temperature control furnace door of the IC component test board is led out through the ground interface, and then the grounded port is unplugged, the furnace door is closed, and the test interface is Electrically connected to a port on a test unit. 1 8 · The IC component test equipment as described in item 13 of the scope of patent application, wherein after the test is completed, the test unit's port is first unplugged, and then the furnace door is opened to electrically connect the ground interface to a grounded port, and then Carry the 1C component test board out of the temperature control furnace door, and allow the dummy wire to pass the static electricity generated when the IC component test board is carried out of the temperature control furnace door through the connection. Page 18 200421513 6. Scope of patent application The ground interface is grounded, and finally the grounded port is unplugged. IHII Page 19