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SG113541A1 - Release process film - Google Patents

Release process film

Info

Publication number
SG113541A1
SG113541A1 SG200407901A SG200407901A SG113541A1 SG 113541 A1 SG113541 A1 SG 113541A1 SG 200407901 A SG200407901 A SG 200407901A SG 200407901 A SG200407901 A SG 200407901A SG 113541 A1 SG113541 A1 SG 113541A1
Authority
SG
Singapore
Prior art keywords
release process
process film
film
release
Prior art date
Application number
SG200407901A
Other languages
English (en)
Inventor
Otsuka Junichi
Inoue Makoto
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG113541A1 publication Critical patent/SG113541A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1462—Polymer derived from material having at least one acrylic or alkacrylic group or the nitrile or amide derivative thereof [e.g., acrylamide, acrylate ester, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
SG200407901A 2004-01-16 2004-12-31 Release process film SG113541A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004009097A JP4880877B2 (ja) 2004-01-16 2004-01-16 フレキシブルプリント配線基板の製造方法及び該製造方法に用いる再剥離性剥離材付き工程フィルム

Publications (1)

Publication Number Publication Date
SG113541A1 true SG113541A1 (en) 2005-08-29

Family

ID=34747201

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200407901A SG113541A1 (en) 2004-01-16 2004-12-31 Release process film

Country Status (6)

Country Link
US (1) US7291372B2 (ko)
JP (1) JP4880877B2 (ko)
KR (1) KR101110450B1 (ko)
CN (1) CN100506009C (ko)
SG (1) SG113541A1 (ko)
TW (1) TWI363082B (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006022313A (ja) * 2004-06-11 2006-01-26 Toyo Ink Mfg Co Ltd 粘着剤組成物及びこれを用いた粘着シート
JP5001530B2 (ja) * 2005-06-15 2012-08-15 ソマール株式会社 再剥離性粘着剤、再剥離性粘着シート及びこれを用いた回路基板の製造方法
JP4676398B2 (ja) * 2006-07-26 2011-04-27 古河電気工業株式会社 ダイシング用粘着テープ
JP4913555B2 (ja) * 2006-11-09 2012-04-11 リンテック株式会社 再剥離性粘着型光学フィルム及びこの光学フィルムを貼付してなるプラズマディスプレイパネル表示装置
KR100838461B1 (ko) * 2007-01-24 2008-06-16 율촌화학 주식회사 표면 보호 필름
JP4982251B2 (ja) * 2007-05-29 2012-07-25 日本メクトロン株式会社 配線基板のめっき方法及び配線基板
TWI426118B (zh) * 2007-10-11 2014-02-11 Lintec Corp 電子零件用兩面黏著片及其製造方法
JP5554503B2 (ja) * 2008-03-18 2014-07-23 リンテック株式会社 再剥離性工程フィルム
US8278142B2 (en) * 2008-05-22 2012-10-02 Texas Instruments Incorporated Combined metallic bonding and molding for electronic assemblies including void-reduced underfill
US9752022B2 (en) 2008-07-10 2017-09-05 Avery Dennison Corporation Composition, film and related methods
CN102023403A (zh) * 2009-09-17 2011-04-20 群康科技(深圳)有限公司 光学膜
PL2542409T3 (pl) 2010-03-04 2019-05-31 Avery Dennison Corp Folie i laminaty foliowe nie zawierające PCW
JP6001255B2 (ja) * 2011-11-15 2016-10-05 日東電工株式会社 粘着シート
CA2935150A1 (en) 2013-12-30 2015-07-09 Avery Dennison Corporation Polyurethane protective film
JP6418872B2 (ja) * 2014-09-26 2018-11-07 ソマール株式会社 配線基板製造工程用バックアップフィルム
JP2017002190A (ja) * 2015-06-10 2017-01-05 リンテック株式会社 加熱剥離性粘着シート
JP6926089B2 (ja) 2016-08-19 2021-08-25 ライオン・スペシャリティ・ケミカルズ株式会社 粘着剤組成物および粘着シート
TWI645005B (zh) * 2017-03-03 2018-12-21 得萬利科技股份有限公司 熱壓用保護離型膠及其應用
JP7275462B2 (ja) * 2019-03-27 2023-05-18 日本カーバイド工業株式会社 粘着剤組成物及び粘着シート
JP7275463B2 (ja) * 2019-03-27 2023-05-18 日本カーバイド工業株式会社 粘着剤組成物及び粘着シート

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1296833C (en) * 1988-04-05 1992-03-03 Erica Marie-Jose Besso Polymethylpentene release sheet
JP3398262B2 (ja) * 1995-07-14 2003-04-21 リンテック株式会社 粘着シート
JPH0940927A (ja) * 1995-07-25 1997-02-10 Nippon Carbide Ind Co Inc アクリル系感圧性接着剤組成物
JP4416850B2 (ja) 1998-07-27 2010-02-17 リンテック株式会社 耐熱再剥離性粘着フィルム
KR100385720B1 (ko) * 1999-04-30 2003-05-27 주식회사 엘지화학 재박리성이 우수한 광학용 아크릴계 감압 점착제 조성물 및 그를이용한 라미네이트
EP1061108B1 (en) * 1999-06-10 2003-10-22 Nitto Denko Corporation Low-staining adhesive sheets and method for removing resist material
KR100313188B1 (ko) * 1999-12-15 2001-11-07 백윤현 용제형 아크릴계 점착제의 제조방법
DE10109066A1 (de) * 2001-02-24 2002-09-12 Tesa Ag Ausgasungsarme Acrylathaftklebemassen
JP2002309201A (ja) * 2001-04-18 2002-10-23 Nitto Denko Corp フレキシブルプリント配線板固定用接着シート及びフレキシブルプリント配線板への電子部品の実装方法
JP3908929B2 (ja) * 2001-06-25 2007-04-25 日東電工株式会社 半導体ウエハ加工用粘着シート及びそれに用いる粘着剤組成物

Also Published As

Publication number Publication date
JP4880877B2 (ja) 2012-02-22
CN1642407A (zh) 2005-07-20
KR20050075693A (ko) 2005-07-21
US20050158502A1 (en) 2005-07-21
TWI363082B (en) 2012-05-01
KR101110450B1 (ko) 2012-02-15
US7291372B2 (en) 2007-11-06
JP2005200567A (ja) 2005-07-28
CN100506009C (zh) 2009-06-24
TW200535210A (en) 2005-11-01

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