Nothing Special   »   [go: up one dir, main page]

SG11201803057VA - Receiving system for components - Google Patents

Receiving system for components

Info

Publication number
SG11201803057VA
SG11201803057VA SG11201803057VA SG11201803057VA SG11201803057VA SG 11201803057V A SG11201803057V A SG 11201803057VA SG 11201803057V A SG11201803057V A SG 11201803057VA SG 11201803057V A SG11201803057V A SG 11201803057VA SG 11201803057V A SG11201803057V A SG 11201803057VA
Authority
SG
Singapore
Prior art keywords
components
receiving system
receiving
Prior art date
Application number
SG11201803057VA
Inventor
Konstantin Koch
Markus Ferstl
Original Assignee
Muehlbauer Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muehlbauer Gmbh & Co Kg filed Critical Muehlbauer Gmbh & Co Kg
Publication of SG11201803057VA publication Critical patent/SG11201803057VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H01L2224/75823—Pivoting mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75824—Translational mechanism
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Operations Research (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Specific Conveyance Elements (AREA)
  • Preliminary Treatment Of Fibers (AREA)
  • Spray Control Apparatus (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manipulator (AREA)
SG11201803057VA 2015-10-16 2016-09-22 Receiving system for components SG11201803057VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015013495.7A DE102015013495B4 (en) 2015-10-16 2015-10-16 Receiving device for components and methods for removing defective components from this
PCT/EP2016/072479 WO2017063835A1 (en) 2015-10-16 2016-09-22 Receiving system for components

Publications (1)

Publication Number Publication Date
SG11201803057VA true SG11201803057VA (en) 2018-05-30

Family

ID=57047183

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201803057VA SG11201803057VA (en) 2015-10-16 2016-09-22 Receiving system for components
SG11201802020WA SG11201802020WA (en) 2015-10-16 2016-09-22 Device and method for self-adjustment of a component-handling device for electronic components

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201802020WA SG11201802020WA (en) 2015-10-16 2016-09-22 Device and method for self-adjustment of a component-handling device for electronic components

Country Status (11)

Country Link
US (2) US10529601B2 (en)
EP (2) EP3363042B1 (en)
JP (2) JP6626195B2 (en)
KR (2) KR102186429B1 (en)
CN (2) CN108369917B (en)
DE (1) DE102015013495B4 (en)
MY (2) MY196046A (en)
PH (1) PH12018500800A1 (en)
SG (2) SG11201803057VA (en)
TW (2) TWI714634B (en)
WO (2) WO2017063835A1 (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015013494B3 (en) * 2015-10-16 2017-04-06 Mühlbauer Gmbh & Co. Kg Component handling device and method for removing components from a structured component supply and for depositing at a receiving device
JP5975556B1 (en) * 2015-12-11 2016-08-23 上野精機株式会社 Transfer equipment
CN107868976B (en) * 2016-09-23 2020-06-12 株式会社村田制作所 Processing apparatus, component conveying apparatus, and processing method
US10651067B2 (en) * 2017-01-26 2020-05-12 Brooks Automation, Inc. Method and apparatus for substrate transport apparatus position compensation
WO2018188731A1 (en) * 2017-04-11 2018-10-18 Muehlbauer GmbH & Co. KG Component receiving device with optical sensor
DE102017124582A1 (en) * 2017-10-20 2019-04-25 Asm Assembly Systems Gmbh & Co. Kg Complementary tool for chip transfer device with removal tool and turning tool
EP3503172B1 (en) 2017-12-20 2024-04-03 Nexperia B.V. Apparatus and system
US11089292B2 (en) * 2018-01-26 2021-08-10 Optikos Corporation Configurable camera stimulation and metrology apparatus and method therefor
KR101921021B1 (en) * 2018-04-06 2018-11-21 (주)이즈미디어 Rotating inspector for camera module
DE102018006771B4 (en) 2018-08-27 2022-09-08 Mühlbauer Gmbh & Co. Kg Device and method for transferring electronic components from a first to a second carrier
DE102018006760A1 (en) * 2018-08-27 2020-02-27 Mühlbauer Gmbh & Co. Kg Inspection when transferring electronic components from a first to a second carrier
US10741434B2 (en) * 2018-09-24 2020-08-11 Asm Technology Singapore Pte Ltd Apparatus for packing ultra-small electronic devices
CN109650030A (en) * 2018-12-20 2019-04-19 浙江新发现机械制造有限公司 A kind of paper container semi-finished product grass-hopper
JP2020183907A (en) * 2019-05-08 2020-11-12 アスリートＦａ株式会社 Electronic component inspection device
DE102019004470B4 (en) 2019-06-25 2021-12-09 Mühlbauer Gmbh & Co. Kg Component conveying device with a setting unit and method for setting a component conveying device
US10748794B1 (en) * 2019-07-09 2020-08-18 Asm Technology Singapore Pte Ltd Apparatus for transferring electronic devices
JP2023508820A (en) * 2019-11-08 2023-03-06 セミコンダクター テクノロジーズ アンド インストゥルメンツ ピーティーイー リミテッド component handler
EP4084047B1 (en) * 2019-12-26 2024-08-21 Sato Holdings Kabushiki Kaisha Ic chip-mounting device and ic chip-mounting method
DE102020116385B3 (en) * 2020-06-22 2021-09-23 Asm Assembly Systems Gmbh & Co. Kg Placement head with two rotor arrangements with individually actuatable handling devices, placement machine and method for the automatic placement of a component carrier
CN111721781A (en) * 2020-06-30 2020-09-29 深圳中科飞测科技有限公司 Detection equipment and detection method thereof
US20220059406A1 (en) * 2020-08-21 2022-02-24 Advanced Semiconductor Engineering, Inc. Method for manufacturing semiconductor package
KR20220030431A (en) * 2020-08-31 2022-03-11 삼성전자주식회사 Fastening automation apparatus for upper electrode
JP7371654B2 (en) * 2021-03-18 2023-10-31 株式会社村田製作所 Parts storage device
TW202320195A (en) * 2021-07-26 2023-05-16 加拿大商弗瑞爾公司 Microled defect management
JP7117041B1 (en) 2021-09-17 2022-08-12 上野精機株式会社 electronic component processing equipment
JP7126285B1 (en) * 2021-09-17 2022-08-26 上野精機株式会社 electronic component processing equipment
JP7573875B2 (en) 2021-09-29 2024-10-28 株式会社 東京ウエルズ Pick-up device, workpiece transport device, and workpiece pick-up method
CN115036443B (en) * 2022-08-11 2022-10-21 成都思越智能装备股份有限公司 OLED panel laminating equipment
TWI841042B (en) * 2022-11-09 2024-05-01 由田新技股份有限公司 A pressing frame device for automatic optical inspection and an automatic optical inspection system comprising thereof

Family Cites Families (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
DD160089A1 (en) 1981-06-30 1983-04-27 Klaus Osterland METHOD FOR REMOVING INDIVIDUAL SEMICONDUCTOR CHIPS FROM SEMICONDUCTOR DEVICES
CA1217572A (en) 1983-05-02 1987-02-03 Kenichi Saito Mounting apparatus for chip type electronic parts
US4626167A (en) 1984-03-22 1986-12-02 Thomson Components-Mostek Corporation Manipulation and handling of integrated circuit dice
US4819699A (en) * 1987-02-24 1989-04-11 Alliance Automation Systems, Inc. Cartridge feed system for automatic PCB loading machine
JPH01193630A (en) 1988-01-28 1989-08-03 Nikka Densoku Kk Apparatus for conveying and inspecting particulate material
JPH02193813A (en) 1989-01-20 1990-07-31 Murata Mfg Co Ltd Arranging/reversing method for electronic component
JP2773307B2 (en) * 1989-10-17 1998-07-09 松下電器産業株式会社 Electronic component mounting method
US5058263A (en) * 1989-12-21 1991-10-22 U.S. Philips Corporation Manipulation device
DE4002075A1 (en) * 1990-01-25 1991-08-08 Antriebs Steuerungstech Ges HANDLING DEVICE AND METHOD FOR HANDLING WORKPIECES
JPH04291795A (en) 1991-03-20 1992-10-15 Matsushita Electric Ind Co Ltd Electronic part mounting unit
US5259500A (en) * 1991-12-23 1993-11-09 Joseph Alvite Tape packaging system with removeable covers
US5547537A (en) 1992-05-20 1996-08-20 Kulicke & Soffa, Investments, Inc. Ceramic carrier transport for die attach equipment
JP2633147B2 (en) * 1992-07-23 1997-07-23 松下電工株式会社 Component mounting method
US5268059A (en) * 1992-09-02 1993-12-07 Vlsi Technology, Inc. Detaping machine for removal of integrated circuit devices from sealed pocket tape
JP3261770B2 (en) * 1992-11-19 2002-03-04 松下電器産業株式会社 Component mounting device
JP3105752B2 (en) 1994-11-29 2000-11-06 シオノギクオリカプス株式会社 Flat product side inspection device, flat product transfer device, and flat product appearance inspection device using them
JPH08162797A (en) * 1994-12-08 1996-06-21 Matsushita Electric Ind Co Ltd Electronic part mounter
JP3652397B2 (en) * 1995-02-21 2005-05-25 三星テクウィン株式会社 Component mounting method and mounting device
JP3132353B2 (en) * 1995-08-24 2001-02-05 松下電器産業株式会社 Chip mounting device and mounting method
JPH08227904A (en) 1995-10-30 1996-09-03 Rohm Co Ltd Chip bonder
SG52900A1 (en) * 1996-01-08 1998-09-28 Matsushita Electric Ind Co Ltd Mounting apparatus of electronic components and mounting methods of the same
US5704250A (en) * 1996-04-04 1998-01-06 Western Atlas, Inc. Ball screw drive with dynamically adjustable preload
US5941674A (en) * 1996-06-12 1999-08-24 Tempo G Interchangeable electronic carrier tape feeder adaptable to various surface mount assembly machines
JPH1070395A (en) * 1996-08-27 1998-03-10 Matsushita Electric Ind Co Ltd Part mounter
DE69832337T2 (en) * 1997-07-28 2006-08-03 Matsushita Electric Industrial Co., Ltd., Kadoma Component feeder and device for assembly
JP3758004B2 (en) 1997-08-06 2006-03-22 シオノギクオリカプス株式会社 Tablet appearance inspection device
EP0906011A3 (en) 1997-09-24 2000-05-24 Siemens Aktiengesellschaft Apparatus for mounting of electrical components on flat component carriers
JP4303345B2 (en) * 1998-03-12 2009-07-29 Ｊｕｋｉ株式会社 Surface mount component mounting machine
JP3446598B2 (en) 1998-03-23 2003-09-16 株式会社村田製作所 Chip part transfer equipment
JP4007526B2 (en) * 1998-04-06 2007-11-14 日東工業株式会社 6-side inspection system for chips
JP3504166B2 (en) 1998-11-25 2004-03-08 株式会社新川 Flip chip bonding equipment
KR100311747B1 (en) * 1999-08-20 2001-10-18 정문술 PCB Transfering System of Surface Mounting Device
JP3846532B2 (en) 1999-09-01 2006-11-15 クオリカプス株式会社 Tablet side surface inspection device and tablet appearance inspection device using the side surface inspection device
US6364089B1 (en) 1999-12-10 2002-04-02 National Semiconductor Corporation Multi-station rotary die handling device
JP2001338935A (en) * 2000-05-26 2001-12-07 Nidec Copal Corp Die bonding apparatus
US7017261B2 (en) * 2000-09-19 2006-03-28 Matsushita Electric Industrial Co., Ltd. Component suction device, component mounting apparatus and component mounting method
KR100353905B1 (en) 2000-12-29 2002-09-28 주식회사옌트 Lighting system used in apparatus for inspecting surface mounted chip
JP2002276254A (en) 2001-03-15 2002-09-25 Ykk Architectural Products Inc Folding door and reverse folding prevention mechanism therefor
DE10128111A1 (en) 2001-06-11 2003-02-20 Bosch Gmbh Robert Device for mounting components on a substrate
KR100414518B1 (en) 2001-12-28 2004-01-07 (주) 인텍플러스 The mounting method and apparatus for chip
SG104292A1 (en) 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor
DE10203601A1 (en) 2002-01-30 2003-08-14 Siemens Ag Chip removal device, chip removal system, placement system and method for removing chips from a wafer
TW200419640A (en) 2003-02-25 2004-10-01 Matsushita Electric Ind Co Ltd Electronic component placement machine and electronic component placement method
JP3879680B2 (en) * 2003-02-25 2007-02-14 松下電器産業株式会社 Electronic component mounting apparatus and electronic component mounting method
JP3879679B2 (en) * 2003-02-25 2007-02-14 松下電器産業株式会社 Electronic component mounting apparatus and electronic component mounting method
JP2005079256A (en) * 2003-08-29 2005-03-24 Hitachi High-Tech Instruments Co Ltd Die and method for picking up die
JP3832460B2 (en) * 2003-09-17 2006-10-11 松下電器産業株式会社 Electronic component mounting apparatus and electronic component mounting method
JP4503969B2 (en) * 2003-09-30 2010-07-14 株式会社日立ハイテクインスツルメンツ Transfer equipment
DE102004007703B3 (en) * 2004-02-16 2005-06-23 Mühlbauer Ag Electronic component testing and rotating device, e.g. for flip-chip testing, with reception elements for electronic components on opposite sides of rotatable component rotated through 180 degrees
JP2005251978A (en) * 2004-03-04 2005-09-15 Matsushita Electric Ind Co Ltd Electronic component mounting apparatus and method therefor
JP4571460B2 (en) * 2004-08-31 2010-10-27 芝浦メカトロニクス株式会社 Electronic component mounting method and mounting apparatus
DE102004051301A1 (en) * 2004-10-20 2006-06-01 Ief Werner Gmbh Device for optical testing of components
US7569932B2 (en) * 2005-11-18 2009-08-04 Checkpoint Systems, Inc. Rotary chip attach
EP1802192A1 (en) * 2005-12-22 2007-06-27 Unaxis International Trading Ltd Method for mounting a flip chip on a substrate
JP2009154889A (en) * 2007-12-25 2009-07-16 Canon Machinery Inc Part feeding device and taping apparatus
JP2009252890A (en) * 2008-04-03 2009-10-29 Murata Mfg Co Ltd Component supply device
DE102008018586A1 (en) 2008-04-12 2009-11-05 Mühlbauer Ag Optical detection device and method for detecting surfaces of components
SG156544A1 (en) * 2008-04-17 2009-11-26 Semiconductor Technologies Component handler
KR101519602B1 (en) * 2010-03-03 2015-05-14 삼성테크윈 주식회사 head nozzle unit and apparatus for mounting electronic parts and method for mounting electronic parts
JP2012116528A (en) * 2010-11-30 2012-06-21 Ueno Seiki Kk Taping unit and electronic component inspection device
DE102010053912B4 (en) * 2010-12-09 2013-01-31 Mühlbauer Ag Optical examination device and optical examination method
JP2012171628A (en) * 2011-02-17 2012-09-10 Hitachi High-Tech Instruments Co Ltd Taping device and taping method
JP5777161B2 (en) * 2011-11-10 2015-09-09 富士機械製造株式会社 Die push-up operation management system
JP5633950B2 (en) * 2011-12-06 2014-12-03 上野精機株式会社 Taping unit, electronic component accommodation method, and electronic component inspection apparatus
JP5893455B2 (en) * 2012-03-19 2016-03-23 日清紡ホールディングス株式会社 Manufacturing method of electronic parts
JP6040490B2 (en) * 2012-03-27 2016-12-07 ハンファテクウィン株式会社Ｈａｎｗｈａ Ｔｅｃｈｗｉｎ Ｃｏ．，Ｌｔｄ． Electronic parts take-out and transfer device
CN103489811A (en) 2012-06-11 2014-01-01 北京中电科电子装备有限公司 Dual-path chip-pickup turning mechanism on bonding equipment
JP2012186505A (en) * 2012-06-18 2012-09-27 Murata Mfg Co Ltd Component supply device
WO2014087491A1 (en) * 2012-12-04 2014-06-12 上野精機株式会社 Transfer device
DE102013102046A1 (en) * 2013-03-01 2014-09-04 Asm Assembly Systems Gmbh & Co. Kg Device for supplying electronic components to surface mounted device machine for mounting printed circuit boards with components, has interface for transferring position and orientation of retained component detected by sensor unit to head
JP2014216621A (en) * 2013-04-30 2014-11-17 株式会社日立製作所 Substrate processing apparatus and substrate processing method
MY156689A (en) 2013-05-28 2016-03-15 Oh Kuang Eng Method and apparatus for electronic components inspection and replacement in carrier tape
JP5995784B2 (en) * 2013-05-31 2016-09-21 ヤマハ発動機株式会社 Component supply device and component mounting device
CN103338627B (en) * 2013-07-18 2015-09-30 苏州盟川自动化科技有限公司 A kind of automatism card machine produced for electronic product abnormity electronic component plug-in mounting
DE102014101901B4 (en) * 2014-02-14 2015-10-15 Asm Assembly Systems Gmbh & Co. Kg Optical measurement of a component with structural features present on opposite sides
WO2015151276A1 (en) * 2014-04-04 2015-10-08 上野精機株式会社 Housing unit and electronic component conveyance device

Also Published As

Publication number Publication date
DE102015013495A1 (en) 2017-04-20
EP3363042A1 (en) 2018-08-22
PH12018500800A1 (en) 2018-10-29
US10347514B2 (en) 2019-07-09
US10529601B2 (en) 2020-01-07
KR20180071264A (en) 2018-06-27
WO2017063838A1 (en) 2017-04-20
EP3363045A1 (en) 2018-08-22
DE102015013495B4 (en) 2018-04-26
KR102186429B1 (en) 2020-12-03
EP3363042B1 (en) 2019-11-27
CN108352346A (en) 2018-07-31
MY196046A (en) 2023-03-09
JP2018533843A (en) 2018-11-15
CN108369917B (en) 2022-05-10
US20180303015A1 (en) 2018-10-18
JP2018533842A (en) 2018-11-15
TW201715946A (en) 2017-05-01
JP6626195B2 (en) 2019-12-25
WO2017063835A1 (en) 2017-04-20
CN108369917A (en) 2018-08-03
TWI704851B (en) 2020-09-11
KR102067203B1 (en) 2020-01-17
CN108352346B (en) 2022-09-30
SG11201802020WA (en) 2018-05-30
TWI714634B (en) 2021-01-01
TW201715948A (en) 2017-05-01
EP3363045B1 (en) 2020-01-08
MY194246A (en) 2022-11-24
KR20180071317A (en) 2018-06-27
US20180315628A1 (en) 2018-11-01

Similar Documents

Publication Publication Date Title
SG11201803057VA (en) Receiving system for components
IL261001B (en) Cybersecurity system
HK1247012A1 (en) Projection system
GB201501510D0 (en) System
IL257409B (en) Conveyance system
GB201517101D0 (en) Mixed-reality system
GB201523166D0 (en) Direct integration system
GB201507208D0 (en) Location system
GB2530303B (en) Fixing system
PT3073021T (en) Connection system
PL4235628T3 (en) System for creating an environment
ZA201705600B (en) Track-module bogie-suspension system
HK1250571B (en) Slide entry system
HK1208776A1 (en) An aquaponic system
GB201517276D0 (en) System
IL259859B (en) Conveyance system
HK1211785A2 (en) Engagement system
GB201713486D0 (en) Collision-warning system
PT3379987T (en) Container-attaching system
GB201514541D0 (en) System
GB201511274D0 (en) Indication system
PL3464736T3 (en) Wearing-part system
GB201617213D0 (en) Telescopic-lateral system
TWM533404U (en) Aquaponics system
GB201612966D0 (en) System