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PL354095A1 - Silicon-based sensor system - Google Patents

Silicon-based sensor system

Info

Publication number
PL354095A1
PL354095A1 PL00354095A PL35409500A PL354095A1 PL 354095 A1 PL354095 A1 PL 354095A1 PL 00354095 A PL00354095 A PL 00354095A PL 35409500 A PL35409500 A PL 35409500A PL 354095 A1 PL354095 A1 PL 354095A1
Authority
PL
Poland
Prior art keywords
microphone
silicon
surface mount
different elements
sensor system
Prior art date
Application number
PL00354095A
Other languages
Polish (pl)
Other versions
PL209935B1 (en
Inventor
MatthiasMullenborn Matthias Mullenborn
Peter U.Scheel Peter U. Scheel
Jochen F.Kuhmann Jochen F. Kuhmann
Original Assignee
Sonionmems A/Ssonionmems A/S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/570,434 external-priority patent/US6522762B1/en
Application filed by Sonionmems A/Ssonionmems A/S filed Critical Sonionmems A/Ssonionmems A/S
Publication of PL354095A1 publication Critical patent/PL354095A1/en
Publication of PL209935B1 publication Critical patent/PL209935B1/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Air Bags (AREA)
  • Silicon Polymers (AREA)

Abstract

The present invention relates to solid state silicon-based condenser microphone systems suitable for batch production. The combination of the different elements forming the microphone system is more flexible compared to any other system disclosed in the prior art. Electrical connections between the different elements of the microphone system are established economically and reliably via a silicon carrier using flip-chip technology. The invention uses an integrated electronic circuit chip, preferably an application specific integrated circuit (ASIC) which may be designed and manufactured separately and independent of the design and manufacture of the transducer element of the microphone. The complete sensor system can be electrically connected to an external substrate by surface mount technology with the contacts facing one side of the system that is not in conflict with the above-mentioned interface to the environment. This allows the user to apply simple and efficient surface mount techniques for the assembly of the overall system.
PL354095A 1999-09-06 2000-09-06 Silicon−based sensor system PL209935B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DKPA199901254 1999-09-06
US39162899A 1999-09-07 1999-09-07
US09/570,434 US6522762B1 (en) 1999-09-07 2000-05-12 Silicon-based sensor system

Publications (2)

Publication Number Publication Date
PL354095A1 true PL354095A1 (en) 2003-12-29
PL209935B1 PL209935B1 (en) 2011-11-30

Family

ID=27221189

Family Applications (1)

Application Number Title Priority Date Filing Date
PL354095A PL209935B1 (en) 1999-09-06 2000-09-06 Silicon−based sensor system

Country Status (10)

Country Link
EP (1) EP1214864B1 (en)
JP (2) JP4459498B2 (en)
CN (1) CN1203726C (en)
AT (1) ATE242587T1 (en)
AU (1) AU6984100A (en)
CA (1) CA2383740C (en)
DE (1) DE60003199T2 (en)
DK (1) DK1214864T3 (en)
PL (1) PL209935B1 (en)
WO (1) WO2001019134A2 (en)

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US7466835B2 (en) 2003-03-18 2008-12-16 Sonion A/S Miniature microphone with balanced termination
JP2004356708A (en) * 2003-05-27 2004-12-16 Hosiden Corp Sound detection mechanism and manufacturing method thereof
CN100515119C (en) * 2003-08-12 2009-07-15 中国科学院声学研究所 Chip for silicon micro capacitor microphone and its preparation method
CN100499877C (en) * 2003-12-17 2009-06-10 中国科学院声学研究所 Chip having high sensitivity for silicon micro-capacitor microphone and preparation method thereof
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DE102005008512B4 (en) 2005-02-24 2016-06-23 Epcos Ag Electrical module with a MEMS microphone
DE102005053765B4 (en) 2005-11-10 2016-04-14 Epcos Ag MEMS package and method of manufacture
DE102005053767B4 (en) 2005-11-10 2014-10-30 Epcos Ag MEMS microphone, method of manufacture and method of installation
DE102005056759A1 (en) * 2005-11-29 2007-05-31 Robert Bosch Gmbh Micromechanical structure for use as e.g. microphone, has counter units forming respective sides of structure, where counter units have respective electrodes, and closed diaphragm is arranged between counter units
CN101005718B (en) * 2006-01-16 2011-04-20 财团法人工业技术研究院 Micro acoustic sensor and its producing method
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DE112007003083B4 (en) * 2006-12-22 2019-05-09 Tdk Corp. Microphone assembly with underfill with low coefficient of thermal expansion
JP4893380B2 (en) * 2007-03-09 2012-03-07 ヤマハ株式会社 Condenser microphone device
US7557417B2 (en) 2007-02-21 2009-07-07 Infineon Technologies Ag Module comprising a semiconductor chip comprising a movable element
DE102007008518A1 (en) * 2007-02-21 2008-08-28 Infineon Technologies Ag Semiconductor module for micro-electro-mechanical system, has semiconductor chip having movable unit and active main surface that is turned towards carrier, where another chip is attached at former chip, and cavity is formed between chips
US8767983B2 (en) 2007-06-01 2014-07-01 Infineon Technologies Ag Module including a micro-electro-mechanical microphone
JP2009081624A (en) * 2007-09-26 2009-04-16 Rohm Co Ltd Semiconductor sensor device
TWI336770B (en) * 2007-11-05 2011-02-01 Ind Tech Res Inst Sensor
TWI365525B (en) * 2007-12-24 2012-06-01 Ind Tech Res Inst An ultra thin package for a sensor chip of a micro electro mechanical system
EP2094028B8 (en) * 2008-02-22 2017-03-29 TDK Corporation Miniature microphone assembly with solder sealing ring
CN102187685B (en) * 2008-10-14 2015-03-11 美商楼氏电子有限公司 Microphone having multiple transducer elements
WO2010135280A2 (en) * 2009-05-18 2010-11-25 Knowles Electronics, Llc Microphone having reduced vibration sensitivity
KR101609270B1 (en) 2009-08-12 2016-04-06 삼성전자주식회사 Piezoelectric micro speaker and method of manufacturing the same
DE102009047592B4 (en) * 2009-12-07 2019-06-19 Robert Bosch Gmbh Process for producing a silicon intermediate carrier
IT1397976B1 (en) * 2009-12-23 2013-02-04 St Microelectronics Rousset MICROELETTROMECHANICAL TRANSDUCER AND RELATIVE ASSEMBLY PROCEDURE.
JP2013093637A (en) * 2010-02-24 2013-05-16 Panasonic Corp Semiconductor device and manufacturing method of the same
TWI491009B (en) 2010-10-08 2015-07-01 Chip level emi shielding structure and manufacture method thereof
CN102456669B (en) * 2010-10-25 2015-07-22 环旭电子股份有限公司 Chip-grade electromagnetic interference shielding structure and manufacturing method thereof
US9108840B2 (en) * 2010-12-30 2015-08-18 Goertek Inc. MEMS microphone and method for packaging the same
JP5721452B2 (en) * 2011-01-27 2015-05-20 ローム株式会社 Capacitive MEMS sensor
JP5799619B2 (en) 2011-06-24 2015-10-28 船井電機株式会社 Microphone unit
DE102011086722A1 (en) * 2011-11-21 2013-05-23 Robert Bosch Gmbh Micromechanical functional device, in particular speaker device, and corresponding manufacturing method
US20130147040A1 (en) * 2011-12-09 2013-06-13 Robert Bosch Gmbh Mems chip scale package
DE102012203373A1 (en) * 2012-03-05 2013-09-05 Robert Bosch Gmbh Micromechanical sound transducer arrangement and a corresponding manufacturing method
US20140090485A1 (en) * 2012-10-02 2014-04-03 Robert Bosch Gmbh MEMS Pressure Sensor Assembly
WO2014094831A1 (en) * 2012-12-18 2014-06-26 Epcos Ag Top-port mems microphone and method of manufacturing the same
US20140312439A1 (en) * 2013-04-19 2014-10-23 Infineon Technologies Ag Microphone Module and Method of Manufacturing Thereof
ITTO20130350A1 (en) * 2013-04-30 2014-10-31 St Microelectronics Srl SLICE ASSEMBLY OF A MEMS SENSOR DEVICE AND RELATIVE MEMS SENSOR DEVICE
US9264832B2 (en) * 2013-10-30 2016-02-16 Solid State System Co., Ltd. Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level
GB2543443B (en) * 2014-06-10 2017-09-13 Cirrus Logic Int Semiconductor Ltd Packaging for MEMS transducers
US10455308B2 (en) * 2014-09-17 2019-10-22 Intel Corporation Die with integrated microphone device using through-silicon vias (TSVs)
CN104780490A (en) * 2015-04-20 2015-07-15 歌尔声学股份有限公司 MEMS microphone packaging structure and manufacturing method thereof
TWI660466B (en) * 2017-04-26 2019-05-21 矽品精密工業股份有限公司 Package structure and method of manufacture thereof
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Also Published As

Publication number Publication date
WO2001019134A2 (en) 2001-03-15
DE60003199T2 (en) 2004-07-01
CN1203726C (en) 2005-05-25
JP4303742B2 (en) 2009-07-29
ATE242587T1 (en) 2003-06-15
CN1387741A (en) 2002-12-25
WO2001019134A3 (en) 2001-09-07
EP1214864B1 (en) 2003-06-04
JP2003508998A (en) 2003-03-04
JP4459498B2 (en) 2010-04-28
DE60003199D1 (en) 2003-07-10
CA2383740A1 (en) 2001-03-15
EP1214864A2 (en) 2002-06-19
PL209935B1 (en) 2011-11-30
AU6984100A (en) 2001-04-10
JP2007028671A (en) 2007-02-01
CA2383740C (en) 2005-04-05
DK1214864T3 (en) 2003-08-25

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Legal Events

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RECP Rectifications of patent specification