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WO2003059029A3 - Integrated sensor module and method for producing the same - Google Patents

Integrated sensor module and method for producing the same Download PDF

Info

Publication number
WO2003059029A3
WO2003059029A3 PCT/DE2003/000044 DE0300044W WO03059029A3 WO 2003059029 A3 WO2003059029 A3 WO 2003059029A3 DE 0300044 W DE0300044 W DE 0300044W WO 03059029 A3 WO03059029 A3 WO 03059029A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensor module
producing
sensor
same
housing
Prior art date
Application number
PCT/DE2003/000044
Other languages
German (de)
French (fr)
Other versions
WO2003059029A2 (en
Inventor
Bernd Stadler
Original Assignee
Infineon Technologies Ag
Bernd Stadler
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Bernd Stadler filed Critical Infineon Technologies Ag
Publication of WO2003059029A2 publication Critical patent/WO2003059029A2/en
Publication of WO2003059029A3 publication Critical patent/WO2003059029A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The invention relates to an integrated sensor module (2) which comprises an electric sensor component that is enclosed by a sensor housing (4), a plug housing (6), firmly linked with the sensor housing, for receiving active and/or passive electronic components, and contact terminals (8) projecting from the plug housing for connecting the sensor module to a circuit periphery by means of plug contacts. The invention further relates to a method for producing the sensor module (2).
PCT/DE2003/000044 2002-01-11 2003-01-09 Integrated sensor module and method for producing the same WO2003059029A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2002101000 DE10201000A1 (en) 2002-01-11 2002-01-11 Integrated sensor module and method for its manufacture
DE10201000.5 2002-01-11

Publications (2)

Publication Number Publication Date
WO2003059029A2 WO2003059029A2 (en) 2003-07-17
WO2003059029A3 true WO2003059029A3 (en) 2003-11-13

Family

ID=7712009

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/000044 WO2003059029A2 (en) 2002-01-11 2003-01-09 Integrated sensor module and method for producing the same

Country Status (2)

Country Link
DE (1) DE10201000A1 (en)
WO (1) WO2003059029A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005016648A1 (en) * 2005-04-12 2006-10-19 Bayerische Motoren Werke Ag Function e.g. safety function, controlling device for motor vehicle, has sensor component, and electrical control connected to control unit and applied based on output of analysis of electrical current generated in connecting cable
DE102011052809A1 (en) * 2011-08-18 2013-03-14 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Mounting arrangement for parking assistance sensor used in motor vehicle, has housing portions that are provided with electrical connection units and guide surfaces which are connected at junction box portion
DE102016203560A1 (en) 2016-03-04 2017-09-07 Schaeffler Technologies AG & Co. KG Sensor module for an actuator with displaceable armature and actuator arrangement

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05166977A (en) * 1991-12-17 1993-07-02 Witco Of Jupiter Dentsu Kk Molded semiconductor sensor holder
JPH0766356A (en) * 1993-08-30 1995-03-10 Nec Corp Packaging structure of chip component
WO1999025034A1 (en) * 1997-11-06 1999-05-20 Robert Bosch Gmbh Component holder for a hall sensor and process for producing a component holder

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT214347Z2 (en) * 1988-03-31 1990-05-03 Veglia Borletti Srl PERFECTED TYPE TRANSDUCER
DE3812182C2 (en) * 1988-04-13 1997-05-15 Teves Gmbh Alfred Transducers, in particular ultrasound transducers for a distance measuring device installed in a motor vehicle
DE4323084A1 (en) * 1993-07-10 1995-01-12 Vdo Schindling Inductive tachometer generator (tacho-generator, tacho) and method for producing it
DE4327584A1 (en) * 1993-08-17 1995-02-23 Bayerische Motoren Werke Ag Electric drive unit
DE4340177A1 (en) * 1993-11-25 1995-06-01 Mannesmann Kienzle Gmbh Sensor
JPH0821775A (en) * 1994-07-08 1996-01-23 Fuji Koki Seisakusho:Kk Pressure sensor
DE4426812A1 (en) * 1994-07-28 1996-02-08 Siemens Ag Water-tight housing for electronic switching device
DE19504608C2 (en) * 1995-02-11 2002-03-21 Balluff Gebhard Feinmech Position sensor and method for manufacturing the same
DE19544660A1 (en) * 1995-11-30 1997-06-05 Bosch Gmbh Robert Plug fitment for electrical equipment
DE19621000C2 (en) * 1996-05-24 1999-01-28 Heraeus Sensor Nite Gmbh Temperature sensor with a measuring resistor
JPH11153452A (en) * 1997-11-20 1999-06-08 Hitachi Ltd Rotation detector
DE19938868B4 (en) * 1999-08-17 2005-11-24 Siemens Ag Sensor device and method for producing a sensor device
DE29916221U1 (en) * 1999-09-15 1999-12-30 Ab Elektronik Gmbh, 59368 Werne Crankshaft encoder
DE10014992C2 (en) * 2000-03-25 2002-01-31 Bosch Gmbh Robert sensor arrangement

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05166977A (en) * 1991-12-17 1993-07-02 Witco Of Jupiter Dentsu Kk Molded semiconductor sensor holder
JPH0766356A (en) * 1993-08-30 1995-03-10 Nec Corp Packaging structure of chip component
WO1999025034A1 (en) * 1997-11-06 1999-05-20 Robert Bosch Gmbh Component holder for a hall sensor and process for producing a component holder

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 568 (E - 1447) 14 October 1993 (1993-10-14) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 06 31 July 1995 (1995-07-31) *

Also Published As

Publication number Publication date
WO2003059029A2 (en) 2003-07-17
DE10201000A1 (en) 2003-07-31

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