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KR890012381A - 유전성 조성물 - Google Patents

유전성 조성물 Download PDF

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Publication number
KR890012381A
KR890012381A KR1019890000875A KR890000875A KR890012381A KR 890012381 A KR890012381 A KR 890012381A KR 1019890000875 A KR1019890000875 A KR 1019890000875A KR 890000875 A KR890000875 A KR 890000875A KR 890012381 A KR890012381 A KR 890012381A
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KR
South Korea
Prior art keywords
composition
weight
mixture
glass
substrate
Prior art date
Application number
KR1019890000875A
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English (en)
Other versions
KR920004209B1 (ko
Inventor
토마스 사휠 하워드
Original Assignee
제임스 제이.플린
이.아이.듀우판 드 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제임스 제이.플린, 이.아이.듀우판 드 네모아 앤드 캄파니 filed Critical 제임스 제이.플린
Publication of KR890012381A publication Critical patent/KR890012381A/ko
Application granted granted Critical
Publication of KR920004209B1 publication Critical patent/KR920004209B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • H01B3/085—Particles bound with glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/04—Particles; Flakes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Glass Compositions (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

내용 없음.

Description

유전성 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. 본질적으로 (a)B2O3대 SiO2의 중량비가 0.22-0.55이고, Al2O30.5-1.5중량% 및 유리 총량에 기초하여 0.3-1.0중량%의 LiO2를 함유하는 알칼리 금속, 알칼리 토금속 또는 이들의 혼합물의 산화물로된 혼합물 1.5- 4.0중량%를 함유하는 납이 없는 무정형 보로실리케이트 유리 55-75중량%와 (b) 멀라이트, 용융 실리카와 멀라이트의 혼합물 및 석영과 용융 실리카의 혼합물 중에서 선택된 세라믹 충전제45-25중량%로 구성되는 것을 특징으로 하는 미분 고상물들의 혼합물인, 저K 유전층 제조용 조성물.
  2. 제1항에 있어서, 브로실리케이트 유리가 Na2O와 K2O의 혼합물 0.9-3.0중량%의 B2O3로 구성되는 것을 특징으로 하는 조성물.
  3. 제1항에 있어서, 유리의 보로실리케이트 성분이 본질적으로 72중량%의 SiO2와 28중량%의 B2O3로 구성되는 것을 특징으로 하는 조성물.
  4. 휘발성 유기 용제중에 용해된 중합체 결합제 용액중에 분산시킨 제1항의 조성물로 되는 것을 특징으로 하는 테이프 주형용 조성물.
  5. 제4항에 있어서, 결합제 성분이 메틸 메타크릴레이트, 에틸 메타크릴레이트, 메틸 아크릴레이트 및 이들의 혼합물의 중합체 중에서 선택되는 것을 특징으로 하는 테이프 주형용 조성물.
  6. 제4항에 있어서, 추가로 조성물 중에 중합체 결합제용 가소제를 용해시키는 것을 특징으로 하는 테이프 주형용 조성물.
  7. 가요성 기판상에 제4항의 조성물을 박층으로 주형하고, 캐스트 층을 가열하여 기판으로 부터 휘발성 용제를 제거하고, 기판으로부터 용제없는 층을 제거함으로써 제조되는 것을 특징으로 하는 세라믹 그린 테이프.
    ※참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890000875A 1988-01-28 1989-01-27 유전성 조성물 KR920004209B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US149506 1988-01-28
US07/149,506 US4849380A (en) 1988-01-28 1988-01-28 Dielectric composition
US149.506 1988-01-28

Publications (2)

Publication Number Publication Date
KR890012381A true KR890012381A (ko) 1989-08-26
KR920004209B1 KR920004209B1 (ko) 1992-05-30

Family

ID=22530592

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890000875A KR920004209B1 (ko) 1988-01-28 1989-01-27 유전성 조성물

Country Status (6)

Country Link
US (1) US4849380A (ko)
EP (1) EP0326093B1 (ko)
JP (1) JPH01224240A (ko)
KR (1) KR920004209B1 (ko)
DE (1) DE68922000T2 (ko)
MY (1) MY103806A (ko)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5041342A (en) * 1988-07-08 1991-08-20 Ngk Insulators, Ltd. Multilayered ceramic substrate fireable in low temperature
US5079193A (en) * 1988-08-01 1992-01-07 E. I. Du Pont De Nemours And Company Encapsulant composition
US5346751A (en) * 1988-12-19 1994-09-13 W. R. Grace & Co.-Conn. Electronic package using closed pore composites
US5024975A (en) * 1989-10-19 1991-06-18 E. I. Du Pont De Nemours And Co., Inc. Crystallizable, low dielectric constant, low dielectric loss composition
US5070046A (en) * 1989-10-19 1991-12-03 E. I. Du Pont De Nemours And Company Dielectric compositions
DE3935471A1 (de) * 1989-10-25 1991-05-02 Hoechst Ag Keramische stoffzusammensetzung und ihre verwendung
US5196381A (en) * 1990-01-16 1993-03-23 E. I. Du Pont De Nemours And Company Metaphosphate glass composition
JPH03252353A (ja) * 1990-02-28 1991-11-11 Nec Corp 低温焼結性低誘電率無機組成物
US5212121A (en) * 1990-06-13 1993-05-18 Mitsui Mining Company, Limited Raw batches for ceramic substrates, substrates produced from the raw batches, and production process of the substrates
US5071793A (en) * 1990-08-23 1991-12-10 Aluminum Company Of America Low dielectric inorganic composition for multilayer ceramic package
US5206190A (en) * 1990-09-04 1993-04-27 Aluminum Company Of America Dielectric composition containing cordierite and glass
US5079194A (en) * 1990-10-11 1992-01-07 Aluminum Company Of America Crystal growth inhibitor for glassy low dielectric inorganic composition
US5118552A (en) * 1991-03-04 1992-06-02 Corning Incorporated Composite article and method
JPH0723252B2 (ja) * 1991-07-31 1995-03-15 日本電気株式会社 低温焼結性低誘電率無機組成物
EP0605421A1 (en) * 1991-09-26 1994-07-13 International Business Machines Corporation Low dielectric constant substrate and method of making
US5270268A (en) * 1992-09-23 1993-12-14 Aluminum Company Of America Aluminum borate devitrification inhibitor in low dielectric borosilicate glass
GB9222986D0 (en) * 1992-11-03 1992-12-16 Johnson Matthey Plc Dielectric powder composition
US5468694A (en) * 1992-11-21 1995-11-21 Yamamura Glass Co. Ltd. Composition for producing low temperature co-fired substrate
US5488816A (en) * 1994-07-21 1996-02-06 Boehringer Mannheim Corporation Method and apparatus for manufacturing a coagulation assay device in a continuous manner
JP3904102B2 (ja) * 1997-08-06 2007-04-11 日本電気硝子株式会社 プラズマディスプレーパネル用誘電体形成材料
US6228788B1 (en) * 1998-08-21 2001-05-08 Advanced Ceramic X Corporation High-frequency ceramic inductor formulation
KR100540479B1 (ko) * 2000-06-28 2006-01-12 주식회사 하이닉스반도체 저유전율 다공성막의 형성 방법
US7510995B2 (en) * 2003-04-01 2009-03-31 United Technologies Corporation Application of a mixed metal oxide catalyst to a metallic substrate
US7387838B2 (en) * 2004-05-27 2008-06-17 Delaware Capital Formation, Inc. Low loss glass-ceramic materials, method of making same and electronic packages including same
US7186461B2 (en) * 2004-05-27 2007-03-06 Delaware Capital Formation, Inc. Glass-ceramic materials and electronic packages including same
CN112080071A (zh) * 2020-09-07 2020-12-15 湖南捷立康科技有限公司 一种具有低介电性能的聚丙烯透波母料、制备方法及用其制成的聚丙烯制品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4547467A (en) * 1983-06-22 1985-10-15 Burroughs Corporation Dielectric composition and devices using it
US4591758A (en) * 1983-06-22 1986-05-27 Burroughs Corporation Gas plasma display panel containing an improved low-temperature dielectric
JPS60235744A (ja) * 1984-05-04 1985-11-22 Asahi Glass Co Ltd セラミック基板用組成物
JPS62113758A (ja) * 1985-10-25 1987-05-25 株式会社住友金属セラミックス 低温焼成セラミツクス
JPS62209895A (ja) * 1986-03-10 1987-09-16 松下電器産業株式会社 セラミツク多層配線基板用絶縁ペ−スト

Also Published As

Publication number Publication date
US4849380A (en) 1989-07-18
MY103806A (en) 1993-09-30
JPH01224240A (ja) 1989-09-07
EP0326093B1 (en) 1995-04-05
KR920004209B1 (ko) 1992-05-30
DE68922000T2 (de) 1995-09-28
DE68922000D1 (de) 1995-05-11
JPH0518771B2 (ko) 1993-03-12
EP0326093A2 (en) 1989-08-02
EP0326093A3 (en) 1990-03-21

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