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KR890015967A - PbTiO_3 충전제에서 Ti를 Fe 및 W로 부분치환한 것을 포함하는 충전제로서의 실링 유리조성물 - Google Patents

PbTiO_3 충전제에서 Ti를 Fe 및 W로 부분치환한 것을 포함하는 충전제로서의 실링 유리조성물 Download PDF

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Publication number
KR890015967A
KR890015967A KR1019890004565A KR890004565A KR890015967A KR 890015967 A KR890015967 A KR 890015967A KR 1019890004565 A KR1019890004565 A KR 1019890004565A KR 890004565 A KR890004565 A KR 890004565A KR 890015967 A KR890015967 A KR 890015967A
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KR
South Korea
Prior art keywords
powder
filler
glass composition
sealing glass
pbtio
Prior art date
Application number
KR1019890004565A
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English (en)
Inventor
토시오 야마나까
Original Assignee
원본미기재
니뽄 덴끼 가라스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 원본미기재, 니뽄 덴끼 가라스 가부시끼가이샤 filed Critical 원본미기재
Publication of KR890015967A publication Critical patent/KR890015967A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/04—Particles; Flakes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Ceramic Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Glass Compositions (AREA)

Abstract

내용 없음

Description

PbTiO3충전제에서 Ti를 Fe 및 W로 부분치환한 것을 포함하는 충전제로서의 실링 유리조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. 낮은 팽창계수의 충진제분말 및 낮은 융점의 솔더 유리분말을 포함하는 혼합물로 이루어지는 전자부품내의 부재를 실링하기 위해 사용되는, 실링유리조성물에 있어서, 상기 충진제 분말이 65-75중량%의 Pbo, 10-25중량%의 TiO2, 1-10중량%의 Fe2O3, 1-12중량%의 WO3및 0-5중량%의 CaO로 구성되는 세라믹분말을 포함함을 특징으로 하는 실링유리조성물.
  2. 제 1 항에 있어서, 상기 충진제 분말이 상기 조성물 전체양의 20-50부피%임을 특징으로 하는 실링유리조성물.
  3. 제 1 항에 있어서, 상기 충진제 분말이 약 5㎛의 평균 입자크기를 갖고 있음을 특징으로 하는 실링유리조성물.
  4. 제 1 항에 있어서, 상기 혼합물이 부가적 충진제 분말로서 지르콘분말, 주석물질분말, β-유크립타이트분말, 코오디어라이트분말, 윌레마이트분말 및 뮬라이트분말의 적어도 하나를 더 포함함을 특징으로 하는 실링유리조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890004565A 1988-04-07 1989-04-07 PbTiO_3 충전제에서 Ti를 Fe 및 W로 부분치환한 것을 포함하는 충전제로서의 실링 유리조성물 KR890015967A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63-86909 1988-04-07
JP8690988 1988-04-07

Publications (1)

Publication Number Publication Date
KR890015967A true KR890015967A (ko) 1989-11-27

Family

ID=13899968

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890004565A KR890015967A (ko) 1988-04-07 1989-04-07 PbTiO_3 충전제에서 Ti를 Fe 및 W로 부분치환한 것을 포함하는 충전제로서의 실링 유리조성물

Country Status (3)

Country Link
US (1) US4883777A (ko)
KR (1) KR890015967A (ko)
DE (1) DE3911176A1 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
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DE3934971C1 (ko) * 1989-10-20 1991-01-24 Schott Glaswerke, 6500 Mainz, De
DE4344174C2 (de) * 1993-12-23 1999-07-22 Temperaturmestechnik Geraberg Temperaturfühler
US5814029A (en) * 1994-11-03 1998-09-29 Daig Corporation Guiding introducer system for use in ablation and mapping procedures in the left ventricle
CN1169235C (zh) 1996-05-24 2004-09-29 埃普科斯股份有限公司 电子部件、尤其是利用声表面波工作的电子部件-ofw部件
CN1205051C (zh) * 1997-07-16 2005-06-08 奥蒂斯电梯公司 用于激光标刻的方法和组合物,以及用此方法和组合物标刻的物件
EP0897897A1 (de) * 1997-08-18 1999-02-24 Siemens Aktiengesellschaft Composit-Glaslot, Verwendung eines Composit-Glaslotes und Hochtemperatur-Brennstoffzelle
DE19833252C2 (de) * 1998-07-23 2002-01-31 Schott Glas Komposit-Lotglas mit niedriger Aufschmelztemperatur, ein Füllstoff hierfür, ein Verfahren zu seiner Herstellung sowie deren Verwendung
US6218005B1 (en) 1999-04-01 2001-04-17 3M Innovative Properties Company Tapes for heat sealing substrates
DE10219951A1 (de) * 2002-05-03 2003-11-13 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Verkapselung eines Bauelements auf Basis organischer Halbleiter
DE102004021729B4 (de) * 2004-04-30 2017-01-19 Mann + Hummel Gmbh Verfahren zur Herstellung eines hochtemperaturbeständigen Hohlfasermembranmoduls
CN102070302A (zh) * 2010-11-22 2011-05-25 珠海彩珠实业有限公司 一种介质浆料用透明低熔点玻璃粉及其制备方法
DE102012206967A1 (de) * 2012-04-26 2013-10-31 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
KR102483950B1 (ko) * 2015-04-28 2023-01-03 삼성디스플레이 주식회사 디스플레이 장치 실링용 조성물, 이를 포함한 유기발광 디스플레이 장치 및 그 제조방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2548736C3 (de) * 1975-10-31 1978-05-18 Jenaer Glaswerk Schott & Gen., 6500 Mainz Composit-Passivierungsglas auf der Basis PbO-B2 Okskö-ab O3) m't einem thermischen Ausdehnungskoeffizienten (200-300 Grad C) zwischen 40 und 60 mal 10"7 / Grad C für Silicium-Halbleiterbauelemente mit Aufschmelztemperaturen von höchstens 600 Grad C
US4405722A (en) * 1979-01-23 1983-09-20 Asahi Glass Company Ltd. Sealing glass compositions
JPS59102874A (ja) * 1982-12-03 1984-06-14 岩城硝子株式会社 封着用組成物
JPS59164649A (ja) * 1983-03-11 1984-09-17 Nippon Electric Glass Co Ltd 封着用ガラス組成物
US4537863A (en) * 1983-08-10 1985-08-27 Nippon Electric Glass Company, Ltd. Low temperature sealing composition
US4522925A (en) * 1983-09-01 1985-06-11 Owens-Illinois, Inc. Sealing glass and method of making a Willemite filler therefor
JPS60204637A (ja) * 1984-03-19 1985-10-16 Nippon Electric Glass Co Ltd 低融点封着用組成物
JPS62191442A (ja) * 1986-02-17 1987-08-21 Nippon Electric Glass Co Ltd 低融点封着用組成物
JPS62256741A (ja) * 1986-04-16 1987-11-09 Nippon Electric Glass Co Ltd 封着材料

Also Published As

Publication number Publication date
US4883777A (en) 1989-11-28
DE3911176C2 (ko) 1992-09-10
DE3911176A1 (de) 1989-10-19

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