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KR870003197U - 소형 회로기판의 연결편 - Google Patents

소형 회로기판의 연결편

Info

Publication number
KR870003197U
KR870003197U KR2019850009687U KR850009687U KR870003197U KR 870003197 U KR870003197 U KR 870003197U KR 2019850009687 U KR2019850009687 U KR 2019850009687U KR 850009687 U KR850009687 U KR 850009687U KR 870003197 U KR870003197 U KR 870003197U
Authority
KR
South Korea
Prior art keywords
circuit board
board connection
small circuit
small
connection
Prior art date
Application number
KR2019850009687U
Other languages
English (en)
Other versions
KR870003396Y1 (ko
Inventor
장광현
Original Assignee
한국쌍신전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국쌍신전기주식회사 filed Critical 한국쌍신전기주식회사
Priority to KR2019850009687U priority Critical patent/KR870003396Y1/ko
Publication of KR870003197U publication Critical patent/KR870003197U/ko
Application granted granted Critical
Publication of KR870003396Y1 publication Critical patent/KR870003396Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
KR2019850009687U 1985-07-25 1985-07-25 소형 회로기판의 연결편 KR870003396Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019850009687U KR870003396Y1 (ko) 1985-07-25 1985-07-25 소형 회로기판의 연결편

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019850009687U KR870003396Y1 (ko) 1985-07-25 1985-07-25 소형 회로기판의 연결편

Publications (2)

Publication Number Publication Date
KR870003197U true KR870003197U (ko) 1987-03-27
KR870003396Y1 KR870003396Y1 (ko) 1987-10-15

Family

ID=19244318

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019850009687U KR870003396Y1 (ko) 1985-07-25 1985-07-25 소형 회로기판의 연결편

Country Status (1)

Country Link
KR (1) KR870003396Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180081924A (ko) * 2017-01-09 2018-07-18 김학규 중탕 방식 조리 전용 인덕션 레인지

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180081924A (ko) * 2017-01-09 2018-07-18 김학규 중탕 방식 조리 전용 인덕션 레인지

Also Published As

Publication number Publication date
KR870003396Y1 (ko) 1987-10-15

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
LAPS Lapse due to unpaid annual fee