KR20200048804A - Vapor chamber - Google Patents

Abstract

Disclosed is a vapor chamber that is excellent in heat transfer and easy to manufacture. The vapor chamber includes: upper and lower metal plates facing each other; An elastic adhesive layer formed on a rib formed along an edge of at least one of the opposite surfaces of the upper plate and the lower plate, and sealing the upper plate and the lower plate by sealing each other; Projections for a plurality of flow paths formed inside the sealing portion on the opposite surface; A fluid flow path formed by a gap between the projections for the flow path; A working fluid filled in the fluid passage; And it is at least one of the projections for the flow path, and includes a support projection formed on the upper surface of the elastic adhesive layer.

Description

Vapor chamber

The present invention relates to a vapor chamber made of a metal plate, and more particularly, to a vapor chamber that is excellent in heat transfer by vacuum and working fluid and is easy to manufacture.

The vapor chamber made of a metal plate is a device of a substantially rectangular flat plate with at least one site, and is a form of a heat pipe with good heat transfer capable of efficiently transporting heat in a plane or vertical direction by vacuum and a working fluid.

Conventional vapor chambers are provided with a hollow container whose edges are sealed by brazing by a filler material, and the upper member and the lower member, which are usually made of metal plates, contain a working fluid in the container, and a wick installed inside the container. The flow path by is formed, and the vacuum is maintained by the filler material.

The structure and manufacturing method of the conventional vapor chamber is a well-known technique, and a brazing material containing a large amount of metal components melted at high temperature is applied to the edge of a metal plate made of copper or aluminum with good thermal conductivity and brazed at high temperature. It is manufactured by sealing the edges of the metal plate to keep the inside in a vacuum.

In the vapor chamber, there is a portion that functions as an evaporation portion and a portion that functions as a condensation portion. When the evaporation portion is heated by a heat source, evaporation of the working fluid in the container occurs, and the working fluid in the gas phase condenses in the container ( Cold zone). In the low temperature region, the working fluid in the gas phase is cooled and condensed, and as a result, heat received by the working fluid in the evaporation part is discharged to the outside of the vapor chamber.

The condensed working fluid returns to the evaporator by a capillary phenomenon along a wick installed inside the container, and the working fluid returned to the evaporator evaporates again and moves to a low temperature region.

In this way, the vapor chamber transports heat using latent heat by repeating evaporation and condensation of the working fluid.

Existing vapor chambers are used, for example, for cooling of electronic devices, and the electronic devices undergoing thinning are limited in quickly cooling heat of various structures or high temperatures. For example, in a portable electronic device represented by a smart phone, a large number of electronic components are accommodated in a limited space, and the vapor chamber applied thereto needs to maintain a thin thickness while having various shapes, and is easy to mass-produce economically. Vapor chambers are limited in accommodating them all.

For example, since the molten metal containing a lot of metal components is melted in a vacuum furnace or a gas atmosphere furnace requiring a high temperature of about 700 ° C to 900 ° C to join the metal plates, manufacturing cost and investment cost are high, and the filler material is flexible. When there is little bending and bending of the vapor chamber, cracks may occur in the filler material. In this case, the vacuum may be released or the working fluid may leak, and if the filler material is not elastic, the vapor chamber is interposed between the object and the object. There is a disadvantage that it is difficult to contact and it is difficult to efficiently transfer heat to the object.

In addition, the vapor chamber is usually disadvantageously disadvantageous in that productivity is low.

Accordingly, it is an object of the present invention to provide a reliable vapor chamber that can be usefully applied to electronic devices that are thinner and thinner while having various shapes.

Another object of the present invention is to provide a vapor chamber with low material cost and easy sealing for an economical vacuum.

Another object of the present invention is to provide a vapor chamber capable of providing reliable heat transfer due to good mechanical strength without opening the middle portion of the vapor chamber.

Another object of the present invention is to provide a vapor chamber in which cracks of the adhesive layer are less generated even when bending or folding.

Another object of the present invention is to provide a vapor chamber that has good elasticity when it is interposed between opposing objects, and thus has good heat transfer due to elasticity.

Another object of the present invention is to provide an economical vapor chamber that is easy to mass-produce.

According to an aspect of the present invention, a vapor chamber used to transfer and cool heat of a heat generating source, comprising: upper and lower metal materials facing each other; An elastic adhesive layer interposed between the upper plate and the sealing portion formed along the edge of the opposite surface of the lower plate, and sealing the upper plate and the lower plate to each other by sealing the sealing portion; A fluid flow path having a predetermined pattern formed inside the sealing portion at any one of the opposite surfaces of the upper plate and the lower plate; Projections for a plurality of flow paths spaced apart by the fluid flow paths; And a working fluid filled in the fluid passage, wherein at least one of the protrusions constitutes a support protrusion, and an upper surface of the support protrusion is attached to an upper or lower plate facing the corresponding part through an elastic adhesive. A vapor chamber characterized by the above is provided.

According to another aspect of the present invention, a vapor chamber used to transfer and cool heat of a heat generating source, comprising: upper and lower metal materials facing each other; An elastic adhesive layer interposed between the upper plate and the sealing portion formed along the edge of the opposite surface of the lower plate, and sealing the upper plate and the lower plate to each other by sealing the sealing portion; A fluid flow path having a predetermined pattern formed inside the sealing portion on each of the opposing surfaces of the upper plate and the lower plate; Projections for a plurality of flow paths spaced apart by the fluid flow paths; And a working fluid filled in the fluid flow path, wherein at least one of the protrusions forms a support protrusion, and the upper surface of each support protrusion is provided with an elastic adhesive to provide adhesion to the vapor chamber. do.

According to another aspect of the present invention, a vapor chamber used to transfer and cool heat of a heat generating source, comprising: upper and lower metal materials facing each other; An elastic adhesive layer interposed between the upper plate and the sealing portion formed along the edge of the opposite surface of the lower plate, and sealing the upper plate and the lower plate to each other by sealing the sealing portion; A fluid flow path having a predetermined pattern formed inside the sealing portion at any one of the opposite surfaces of the upper plate and the lower plate; Projections for a plurality of flow paths spaced apart by the fluid flow paths; And a working fluid filled in the fluid flow path, wherein at least one of the protrusions constitutes a support protrusion, and an upper surface of the support protrusion is bonded to an upper or lower plate facing the corresponding portion through an elastic adhesive, Steps are respectively formed on at least one of the sealing portions of the upper plate and the lower plate and the corresponding portion of the upper plate or the lower plate opposite to the upper surface of the supporting projection, so that the projections for the flow path are opposite by receiving the adhesive layer and the adhesive. A vapor chamber is provided, which is characterized in that it directly contacts the upper or lower plate.

According to another aspect of the present invention, a vapor chamber used to transfer and cool heat of a heat generating source, comprising: upper and lower metal materials facing each other; An elastic adhesive layer interposed between the upper plate and the sealing portion formed along the edge of the opposite surface of the lower plate, and sealing the upper plate and the lower plate to each other by sealing the sealing portion; A fluid flow path having a predetermined pattern formed inside the sealing portion on opposite surfaces of the upper plate and the lower plate; Projections for a plurality of flow paths spaced apart by the fluid flow paths; And a working fluid filled in the fluid passage, wherein at least one of the protrusions constitutes a support protrusion, and the upper surfaces of the support protrusions are bonded to each other via an elastic adhesive, and sealing the upper and lower plates. A vapor chamber is provided, wherein at least one of the parts and at least one of the support protrusions are each formed at a low height to receive the adhesive layer and the adhesive and the projections for the flow paths are in direct contact with each other. .

Preferably, a tip forming an injection hole for injecting the working fluid is protruded on one side of the upper plate and the lower plate facing each other.

Preferably, the adhesive layer may be a curable rubber adhesive layer.

Preferably, the size of the projection for the flow path may be set differently from the evaporation part to the cooling part of the portion where the heating element contacts.

Preferably, at least one of a copper wire mesh, a copper braided wire or a copper knit wire is interposed between the upper plate and the opposite surfaces of the lower plate, or a graphite sheet is interposed to be in contact with the upper plate and the lower plate.

Preferably, the area of the upper surface of the protrusion for support may be larger than the area of the upper surface of the protrusion for the flow path.

Preferably, the upper surface of the projection for the flow path may directly contact the opposite upper or lower plate.

Preferably, a graphite layer may be formed on at least one externally exposed surface of the upper plate and the lower plate.

Preferably, at least one portion of the vapor chamber can be bent by bending.

According to the present invention, the phase transition between the liquid phase and the gas phase of the working fluid is repeated, and heat recovered from the evaporation unit using latent heat is easily transported repeatedly to the cooling region (condensation unit).

In addition, the adhesive layer formed by curing after printing or dispensing the liquid silicone rubber adhesive on the sealing portion formed along the edges of the metal upper plate and the lower plate having good heat transfer has elasticity and flexibility and seals and bonds the upper and lower plates. Even when the vapor chamber is bent or folded, cracks are less likely to occur and a seal for vacuum can be maintained.

In addition, when the adhesive layer is elastic and interposed between opposing objects, heat transfer is good due to good adhesion with opposing objects.

In addition, since the low cost silicone rubber is used, the material cost is low and the sealing part and the protrusion are formed by etching, so that the dimensions are precise and the mass production is easy.

In addition, the silicone rubber constituting the adhesive layer can be cured in an oxidizing atmosphere at a low temperature, so manufacturing costs are low and equipment investment costs are low.

In addition, since the adhesive layer is formed on the facing metal plate after the adhesive layer is formed on the supporting projection having a larger size than the projection for the flow path, the intermediate portion of the vapor chamber does not open and the mechanical strength is good, so that reliable heat transfer can be achieved.

In addition, since a plurality of projections for the flow path contact the opposing metal plate, reliable and effective heat transfer can be achieved.

In addition, by applying a graphite sheet having good heat conduction in the width direction therein, heat transferred from the heating element can be quickly transferred to another position on the horizontal surface of the upper plate or the lower plate.

1 is an exploded perspective view showing a vapor chamber according to an embodiment of the present invention.
2 is a partial cross-sectional view cut in the width direction.
3 is a cross-sectional view showing a vapor chamber according to another embodiment of the present invention.
4 is a cross-sectional view showing a vapor chamber according to another embodiment of the present invention.

It should be noted that the technical terms used in the present invention are only used to describe specific embodiments, and are not intended to limit the present invention. In addition, technical terms used in the present invention should be interpreted as meanings generally understood by a person having ordinary knowledge in the technical field to which the present invention belongs, unless otherwise defined in the present invention. It should not be interpreted as a meaning or an excessively reduced meaning. In addition, when the technical term used in the present invention is a wrong technical term that does not accurately represent the spirit of the present invention, it should be understood as being replaced by a technical term that can be correctly understood by those skilled in the art. In addition, the general terms used in the present invention should be interpreted as defined in the dictionary or in context before and after, and should not be interpreted as an excessively reduced meaning.

1 is an exploded perspective view showing a vapor chamber according to an embodiment of the present invention, and FIG. 2 is a partial cross-sectional view cut in the width direction.

The vapor chamber 100 is interposed between the upper plate 110 and the lower plate 120 made of metals facing each other, and the sealing portions 124 formed along the edges of the opposite surfaces of the upper plate 110 and the lower plate 120, thereby interposing the upper plate. (110) and the lower plate 120 are adhered to each other to seal and seal the elastic adhesive layer 130, the lower surface 120 of the fluid flow path 121 formed on the opposite surface, the fluid flow path 121 for a plurality of flow paths It consists of a projection 122, and a projection 123 for support.

The thickness of the vapor chamber 100 may be 0.20 mm to 0.7 mm, and the width and length are very large compared to the thickness, and many parts form a plane as a whole.

The upper plate 110 and the lower plate 120 are made of, for example, copper, copper alloy, aluminum or aluminum alloy, and in this embodiment, the upper plate 110 is a flat plate shape that is not processed on both the upper and lower surfaces, and the lower plate 120 is It has a fluid flow path 121 formed inside the sealing portion 124.

By making the material and thickness of the upper plate 110 and the lower plate 120 the same, the vertical direction is small, so that the thermal difference due to the direction can be reduced.

At least the sealing portion 114 of the top plate 110 is finely etched to have a constant surface roughness so that the adhesive layer 130 can be reliably adhered.

Here, the distinction between the upper plate 110 and the lower plate 120 is defined based on the city on the drawing, and is not particularly limited to the term in terms of location or connection.

As will be described later, the fluid flow path 121 means a passage through which the working fluid flows, and the fluid flow path 121 is formed by etching the lower plate 120 in a predetermined pattern, and as the fluid flow path 121 is formed, As a result, a sealing portion 124, a projection 122 for the flow path, and a projection 123 for support are formed.

Accordingly, the present invention essentially includes a structure in which a fluid flow path is formed by etching on at least one of the opposing surfaces of the opposing upper and lower plates.

Optionally, a graphite layer may be formed on one surface exposed to the outside of the upper plate 110 and the lower plate 120. In this case, the vapor chamber 100 has an advantage that heat transfer is better in the horizontal direction by the graphite layer.

In the present invention, the sealing portion 124 is made of a constant width along the edges of the upper plate 110 and the lower plate 120 for forming the adhesive layer 130 for sealing adhesion of the upper plate 110 and the lower plate 120 As a part, it is distinguished from the part where the fluid flow path 121 is formed, and in this embodiment, it maintains the same horizontal level as the top surface of the projection 122 for the flow path.

The thickness of the upper plate 110 and the lower plate 120 may be appropriately selected depending on whether the fluid flow path 121 is formed in a range of 0.1 mm to 0.4 mm, and the width and height of the sealing portion 124 are 1 mm, respectively. It may be 0.05 mm.

On the opposite sides of the upper plate 110 and the lower plate 120, tips 115 and 125 for forming an injection hole 126 for injecting a working fluid are protruded.

In this embodiment, the tip 115 of the upper plate 110 and the tip 125 of the lower plate 120 are adhered to both sides by the adhesive layer 130 so that the injection hole 126 is formed at the end.

To inject the working fluid through the injection hole 126, the inside of the injection hole 126 is evacuated by injecting the working fluid into the chamber by vacuum suction force, and then the inside of the chamber is operated as one well-known technique. After leaving only a certain amount of fluid, the remaining working fluid is frozen using liquid nitrogen.

Thereafter, a vacuum is formed on a part of the inside of the pipe by a vacuum operation.

Thereafter, the tips 115 and 125 of the upper plate 110 and the lower plate 120 are melted by heat welding by spot welding, ultrasonic waves, or lasers to be adhered to each other and sealed, and the chamber is filled with a predetermined amount of working fluid. It becomes a vacuum.

As shown in the circle enlarged in FIG. 1, a portion other than the fluid flow path 121 is formed by etching the inside of the sealing portion 124 in a predetermined pattern on the opposite surface of the lower plate 120 to form the fluid flow path 121. It becomes the dragon protrusion 122. Or, on the contrary, by forming the projections 122 for the flow path in a predetermined pattern, the fluid flow path 121 may be formed by the gap between the projections 122 for the flow path.

In this embodiment, the fluid flow path 121 is formed on the lower plate 120, but may be formed on the upper plate 110, on the contrary, as described later, the same or different patterns of fluid on both the upper plate 110 and the lower plate 120 A flow path can be formed.

The protrusions 122 for the flow path need not be formed with the same density and pattern in the entire lower plate 120, and may be formed with an irregular density and pattern if only the fluid flow path 121 having a predetermined width can be formed.

The width of the fluid passage 121 may be set differently from the evaporation part to the cooling part, which is assumed to be a part where the heating element is in contact, to improve the heat transfer effect. Accordingly, the diameter or density of the protrusion 122 for the flow passage may be changed. .

In addition, referring to the enlarged circle of FIG. 1, a support protrusion 123 having a size different from the protrusion 122 for the flow passage formed in the lower plate 120 may be formed.

As described above, the projection 122 for the flow path is formed for the purpose of forming the fluid flow path 121, but the support projection 123 is formed with an adhesive layer 132 thereon to support the projection 123 at the corresponding portion. The upper surface of the top plate 110 is bonded to prevent the top plate 110 and the bottom plate 120 from being lifted or opened in the middle of the vapor chamber 100.

Therefore, the support protrusion 123 is formed to a size sufficient to sufficiently form the adhesive layer 132, and the area of the top surface of the support protrusion 123 is usually less than the area of the top surface of the flow path protrusion 122. Big.

In this embodiment, the protrusion 122 for the flow path and the protrusion 123 for support form a circle, but are not limited to this, and may have a rounded corner.

In addition, the adhesive layer 132 may be applied with an adhesive such as the adhesive layer 130, the adhesive layer 132 may be formed in the process of forming the adhesive layer 130 for this purpose.

The fluid flow path 121 has good mass-producibility and can be formed precisely by one etching. As will be described later, the top surface of the sealing portion 124 and the top surface of the protrusion 122 form the same horizontal level for the flow path. In order to prevent the protrusion 122 from contacting the top plate 110, a step of about the thickness of the adhesive layer 130 may be formed on the sealing portion 124 or formed as low as possible, and at this time, the fluid flow path 121 may be formed. A separate etching process from the forming etching process can be applied.

The adhesive layers 130 and 132 have elasticity and flexibility, and may be formed by curing after printing or dispensing a liquid silicone rubber adhesive.

That is, the liquid silicone rubber is a curable material having an adhesive force with an object to be opposed after curing. After curing, the sealing portions 114 and 124 of the upper plate 110 and the lower plate 120 are reliably adhered to the vapor chamber 100. The inside of the container is reliably sealed.

In addition, since the adhesive layers 130 and 132 are heat-curable materials made of an elastic rubber adhesive, they are not melted again by heat after curing once, so that even if heat is applied to the vapor chamber 100, the internal vacuum is reliably maintained and operated. Avoid leaking fluids.

Preferably, curing of the adhesive layers 130 and 132 is performed by heat in consideration of workability.

The thickness of the adhesive layers 130 and 132 is not limited, but may be preferably 0.02 mm to 0.2 mm in consideration of curing speed, heat transfer effect, and degree of sealing.

The adhesive layers 130 and 132 are reliably adhered to the sealing portions 114 and 124 by surface treatment of the sealing portions 114 and 124 of the upper plate 110 or the lower plate 120 by etching, and have good adhesion.

The adhesive layers 130 and 132 of the present invention are not limited to silicone rubber, and may be a curable polymer material having elasticity and adhesion after curing.

The adhesive layer 130 is interposed between the sealing portions 114 and 124 formed on the edges of the upper plate 110 and the lower plate 120, and in this embodiment, is formed and interposed on the sealing portion 124 of the lower plate 120. .

The upper plate 110 and the lower plate 120 are adhered to each other by the adhesive layer 130 so that the inside of the vapor chamber 100 is sealed to maintain a vacuum. The silicone rubber constituting the adhesive layer 130 has elasticity and flexibility. Due to the elasticity and flexibility of the adhesive layer 130 when bending or folding the manufactured vapor chamber 100, cracks are not formed and sealing can be maintained.

Accordingly, the manufactured vapor chamber 100 may have a shape in which at least one portion is bent by bending.

In addition, when the vapor chamber 100 is interposed between opposing objects, the upper plate 110 and the lower plate 120 are elastically coupled by the elastic adhesive layer 130, so that the pressing property is good and opposes. It is in good contact with the object and has good heat transfer.

Although the elasticity may be small in proportion to the thickness when the adhesive layer 130 is thin, this degree of elasticity may also be effective in a thin product such as a mobile phone, and such elasticity absorbs vibration in vibration tests of mobile phones and the like. It can also play a role.

In addition, compared to the brazing adhesion for a conventional filler material performed in a vacuum furnace or a gas furnace of approximately 700 ° C to 900 ° C, the silicone rubber can be cured in an oxidizing atmosphere of 100 ° C to 200 ° C, which is a very low temperature, so that the vapor chamber 100 ) Is easy to manufacture and economical.

In addition, the price of the silicone rubber is cheaper than the expensive filler material of Ag / Cu, so that the vapor chamber 100 can be economically manufactured, and the weight of the silicone rubber is also light, so that the weight of the finished product can be reduced.

In order to increase the heat transfer effect of the vapor chamber 100, the thermally conductive powder may be mixed with the liquid silicone rubber to make the adhesive layer 130 thermally conductive. However, in this case, when a large amount of thermally conductive powder is mixed, there is a disadvantage that the sealing property for vacuum is poor. The heat transfer rate of the thermally conductive adhesive layer 130 may be about 1.5 W / mK.

As described above, the sealing portions 114 and 124 of the upper plate 110 and the lower plate 120 are sealed by the adhesive layer 130 to form a hollow flat plate type vapor chamber 100, and the vapor chamber ( The working fluid may be sealed in a state in which non-condensing gas such as air is degassed in the interior of 100).

According to the vapor chamber having the above-described structure, a heating element such as an electronic component is disposed on a certain portion of the outer surface of the upper plate 110 or the lower plate 120. The heating element is in direct contact or is interposed with a thermally conductive adhesive or a thermally conductive adhesive tape. Can be glued / adhered or placed in close proximity.

An evaporation portion is formed in a corresponding portion of the upper plate 110 or the lower plate 120 corresponding to the heating element, and when the working fluid is evaporated in this portion, the gaseous working fluid is diffused along the fluid flow path 121.

As the working fluid in the gas phase moves away from the evaporator, heat is taken away and condensed. This condensation occurs particularly remarkably at the end far from the evaporator.

When the working fluid is condensed, the liquid working fluid returns to the vicinity of the evaporator along the fluid flow path 121, and absorbs heat from the heating element again.

As described above, the vapor chamber 100 of the present invention repeats the phase transition between the liquid phase and the gas phase of the working fluid, and repeatedly transports heat recovered from the evaporation unit to the cooling region (condensation unit) using latent heat. have.

3 (a) and 3 (b) are cross-sectional views showing a vapor chamber according to another embodiment of the present invention.

In this embodiment, the sealing portion 114 is formed along the edge on the opposite surface of the upper plate 110, and the protrusion 112 for the flow path of the same shape as the lower plate 120 is formed inside the sealing portion 114. The fluid flow path 111 is formed, and the supporting projection 113 is formed corresponding to the supporting projection 123 of the lower plate 120.

In this embodiment, as shown in Figure 3 (a), the sealing portion 114, 124 formed on the upper plate 110 and the lower plate 120, the projections 112, 122 for the flow path and the projections 113, 123 for the support The mechanical strength is good by contacting them to face each other in a symmetrical manner, but is not limited thereto. In this case, the sealing portions 114 and 124 formed on the upper plate 110 and the lower plate 120 have different widths, different widths of the fluid flow paths 111 and 121, or protrusions 112 and 122 for the flow paths. ) And the supporting projections 113 and 123 may have different sizes.

4 (a) and 4 (b) are cross-sectional views showing a vapor chamber according to another embodiment of the present invention.

According to one embodiment of the above, the adhesive layer (130, 132) is formed on the sealing portion 124 and the projection 123 of the lower plate 120, respectively, the adhesive layer (130, 132) has a constant thickness Therefore, the upper surface of the protrusion 122 for the flow path may not directly contact the opposite surface of the top plate 110, and thus a gap may be formed.

As a result, the size of the fluid flow path 121 may be larger than a predetermined size by a gap formed between the upper surface of the protrusion 122 for the flow path and the opposite surface of the top plate 110, and thus heat transfer efficiency may be deteriorated.

Referring to Figure 4 (a), the support projections 123 and the lower plate 120, the sealing portion 124, respectively formed on the adhesive layer (130, 132) corresponding to the upper plate 110 portion of the step (114a, 114b) ) Is formed.

The depths of the steps 114a and 114b may be equal to the thickness of the adhesive layers 130 and 132, or may be formed somewhat smaller because the adhesive layers 130 and 132 have elasticity.

According to this structure, the step 114a, 114b accommodates the adhesive layers 130, 132, so that the level of the upper surface of the adhesive layers 130, 132 is the same as the level of the upper surface of the projections 122 for the flow path, and still for the flow path. The protrusion 122 may directly contact the opposite surface of the top plate 110 to prevent the formation of a gap.

Referring to Figure 4 (b), by forming a step (124a, 123a) on the projection 123 and the sealing portion 124 of the lower plate 120, respectively, by forming a lower height than the projection 122 for the flow path, Steps (124a, 123a) is to accommodate the adhesive layer (130, 132).

The adhesive layers 130 and 132 may be reliably adhered to by having a predetermined surface roughness in the step portion for forming the step.

In the above embodiment, a vapor chamber constituting a hollow flat container is exemplified, but the present invention is equally applied to a heat pipe.

Specifically, a fluid flow path is formed on the inner surface of the sealing body made of copper or copper alloy and the working fluid is filled.

The heat pipe may be formed in a circular cross section or pressed flat so that a corresponding portion of the sealing body contacting the heating element maintains a flat surface.

Meanwhile, a graphite sheet may be selectively disposed between the upper plate 110 and the lower plate 120.

As is well known, the graphite sheet has a very good thermal conductivity in the horizontal direction, and thus, the heat absorbed from the evaporation part can be quickly conducted to other locations on the horizontal surface. In particular, the graphite sheet is interposed in a state in contact with the top plate 110 or the bottom plate 120, so that heat generated from the heating element contacting the top plate 110 or the bottom plate 120, for example, an electronic component, can be quickly moved to another location on a horizontal surface. Can deliver.

Further, despite the fluid flow paths 111 and 112, a wick made of a copper wire mesh, a copper braided wire or a copper knit wire may be interposed between the upper plate 110 and the lower plate 120.

In the above, although the description has been mainly focused on the embodiment of the present invention, it is needless to say that various changes can be made at the level of those skilled in the art. Therefore, the scope of the present invention can not be interpreted limited to the above-described embodiment, it should be interpreted by the claims described below.

100: Vapor chamber
110: top
112, 122: fluid flow path
120: bottom
130, 132: adhesive layer

Claims (17)

A vapor chamber used to transfer and cool heat from a heat source,
Metal upper and lower plates facing each other;
An elastic adhesive layer interposed between the upper plate and the sealing portion formed along the edge of the opposite surface of the lower plate, and sealing the upper plate and the lower plate to each other by sealing the sealing portion;
A fluid flow path having a predetermined pattern formed inside the sealing portion at any one of the opposite surfaces of the upper plate and the lower plate;
Projections for a plurality of flow paths spaced apart by the fluid flow paths; And
And a working fluid filled in the fluid passage,
At least one of the protrusions constitutes a support protrusion, and an upper surface of the support protrusion is bonded to an upper or lower plate facing the corresponding portion through an elastic adhesive. In claim 1,
A tip of the upper plate and the lower plate facing each other, the tip (tip) forming an injection hole for injecting the working fluid is characterized in that the vapor chamber is formed. In claim 1,
The adhesive layer is a vapor chamber, characterized in that the curable rubber adhesive layer. In claim 1,
The size of the projection for the flow path is characterized in that the vapor chamber is set differently from the evaporation portion to the cooling portion of the portion in contact with the heating element. In claim 1,
A vapor chamber, characterized in that at least one of a copper wire mesh, a copper braided wire or a copper knit wire is further interposed between the upper plate and the opposite surfaces of the lower plate. In claim 1,
A vapor chamber further comprising a graphite sheet interposed between opposite surfaces of the upper plate and the lower plate to contact the upper plate and the lower plate. In claim 1,
The area of the upper surface of the projection for support is larger than the area of the upper surface of the projection for the flow path. In claim 1,
The support chamber and the projection for the flow path is a vapor chamber, characterized in that the round or rounded corners. In claim 1,
Vapor chamber, characterized in that the material and thickness of the upper plate and the lower plate are the same. In claim 1,
The upper surface of the projection for the flow path is a vapor chamber, characterized in that in direct contact with the opposite upper or lower plate. A vapor chamber used to transfer and cool heat from a heat source,
Metal upper and lower plates facing each other;
An elastic adhesive layer interposed between the upper plate and the sealing portion formed along the edge of the opposite surface of the lower plate, and sealing the upper plate and the lower plate to each other by sealing the sealing portion;
A fluid flow path having a predetermined pattern formed inside the sealing portion on each of the opposing surfaces of the upper plate and the lower plate;
Projections for a plurality of flow paths spaced apart by the fluid flow paths; And
And a working fluid filled in the fluid passage,
At least one of the protrusions forms a support protrusion, and the upper surface of each support protrusion is bonded to each other via an elastic adhesive. In claim 11,
The vapor chamber, characterized in that the seal formed on the upper plate and the lower plate, the projection for the flow path and the projection for support are symmetrical to each other. A vapor chamber used to transfer and cool heat from a heat source,
Metal upper and lower plates facing each other;
An elastic adhesive layer interposed between the upper plate and the sealing portion formed along the edge of the opposite surface of the lower plate, and sealing the upper plate and the lower plate to each other by sealing the sealing portion;
A fluid flow path having a predetermined pattern formed inside the sealing portion at any one of the opposite surfaces of the upper plate and the lower plate;
Projections for a plurality of flow paths spaced apart by the fluid flow paths; And
And a working fluid filled in the fluid passage,
At least one of the projections constitutes a supporting projection, and the upper surface of the supporting projection is bonded to an upper or lower plate opposite to the corresponding portion through an elastic adhesive,
Steps are respectively formed on at least one of the sealing portions of the upper plate and the lower plate and a corresponding portion of the upper plate or the lower plate opposite to the upper surface of the supporting projection to accommodate the adhesive layer and the adhesive so that the projections for the flow path are opposed. Vapor chamber, characterized in that in direct contact with the upper or lower plate. A vapor chamber used to transfer and cool heat from a heat source,
Metal upper and lower plates facing each other;
An elastic adhesive layer interposed between the upper plate and the sealing portion formed along the edge of the opposite surface of the lower plate, and sealing the upper plate and the lower plate to each other by sealing the sealing portion;
A fluid flow path having a predetermined pattern formed inside the sealing portion on opposite surfaces of the upper plate and the lower plate;
Projections for a plurality of flow paths spaced apart by the fluid flow paths; And
And a working fluid filled in the fluid passage,
At least one of the protrusions constitutes a support protrusion, and the upper surface of each support protrusion is bonded to each other through an elastic adhesive,
At least one of the sealing portion of the upper plate and the lower plate, and at least one of each of the support protrusions are respectively formed at a low height to receive the adhesive layer and the adhesive, so that the projections for the flow path directly contact each other. Vapor chamber. In any one of claims 1, 11, 13 and 14,
A vapor chamber, characterized in that a graphite layer is formed on at least one surface exposed to the outside of the upper plate and the lower plate. In any one of claims 1, 11, 13 and 14,
The adhesive layer is a vapor chamber, characterized in that the thermal conductivity. In any one of claims 1, 11, 13 and 14,
The vapor chamber is characterized in that at least one portion of the vapor chamber is bent by bending.

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