KR20190138705A - 인쇄 잉크 액적 측정 및 정밀 공차 내로 유체를 증착하기 위한 제어 기법 - Google Patents
인쇄 잉크 액적 측정 및 정밀 공차 내로 유체를 증착하기 위한 제어 기법 Download PDFInfo
- Publication number
- KR20190138705A KR20190138705A KR1020197036003A KR20197036003A KR20190138705A KR 20190138705 A KR20190138705 A KR 20190138705A KR 1020197036003 A KR1020197036003 A KR 1020197036003A KR 20197036003 A KR20197036003 A KR 20197036003A KR 20190138705 A KR20190138705 A KR 20190138705A
- Authority
- KR
- South Korea
- Prior art keywords
- nozzle
- droplet
- printhead
- nozzles
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/205—Ink jet for printing a discrete number of tones
- B41J2/2054—Ink jet for printing a discrete number of tones by the variation of dot disposition or characteristics, e.g. dot number density, dot shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/12—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0291—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work the material being discharged on the work through discrete orifices as discrete droplets, beads or strips that coalesce on the work or are spread on the work so as to form a continuous coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/0456—Control methods or devices therefor, e.g. driver circuits, control circuits detecting drop size, volume or weight
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04581—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on piezoelectric elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04588—Control methods or devices therefor, e.g. driver circuits, control circuits using a specific waveform
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04593—Dot-size modulation by changing the size of the drop
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/07—Ink jet characterised by jet control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/21—Ink jet for multi-colour printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/21—Ink jet for multi-colour printing
- B41J2/2132—Print quality control characterised by dot disposition, e.g. for reducing white stripes or banding
- B41J2/2135—Alignment of dots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/21—Ink jet for multi-colour printing
- B41J2/2132—Print quality control characterised by dot disposition, e.g. for reducing white stripes or banding
- B41J2/2142—Detection of malfunctioning nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
- B41J29/38—Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F22/00—Methods or apparatus for measuring volume of fluids or fluent solid material, not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/811—Controlling the atmosphere during processing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Quality & Reliability (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Coating Apparatus (AREA)
- Fluid Mechanics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Ink Jet (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020217040761A KR102617723B1 (ko) | 2013-04-26 | 2014-04-23 | 인쇄 잉크 액적 측정 및 정밀 공차 내로 유체를 증착하기 위한 제어 기법 |
Applications Claiming Priority (23)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361816696P | 2013-04-26 | 2013-04-26 | |
US61/816,696 | 2013-04-26 | ||
US201361822855P | 2013-05-13 | 2013-05-13 | |
US61/822,855 | 2013-05-13 | ||
US201361842351P | 2013-07-02 | 2013-07-02 | |
US61/842,351 | 2013-07-02 | ||
US201361857298P | 2013-07-23 | 2013-07-23 | |
US61/857,298 | 2013-07-23 | ||
US201361866031P | 2013-08-14 | 2013-08-14 | |
US61/866,031 | 2013-08-14 | ||
US201361898769P | 2013-11-01 | 2013-11-01 | |
US61/898,769 | 2013-11-01 | ||
US201361920715P | 2013-12-24 | 2013-12-24 | |
USPCT/US2013/077720 | 2013-12-24 | ||
US61/920,715 | 2013-12-24 | ||
PCT/US2013/077720 WO2014105915A1 (en) | 2012-12-27 | 2013-12-24 | Techniques for print ink volume control to deposit fluids within precise tolerances |
TW102148330 | 2013-12-26 | ||
TW102148330A TWI548530B (zh) | 2012-12-27 | 2013-12-26 | 噴墨印刷的方法以及印刷機 |
US14/162,525 US9010899B2 (en) | 2012-12-27 | 2014-01-23 | Techniques for print ink volume control to deposit fluids within precise tolerances |
US14/162,525 | 2014-01-23 | ||
US201461950820P | 2014-03-10 | 2014-03-10 | |
US61/950,820 | 2014-03-10 | ||
PCT/US2014/035193 WO2014176365A2 (en) | 2013-04-26 | 2014-04-23 | Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020187034202A Division KR20180128524A (ko) | 2013-04-26 | 2014-04-23 | 인쇄 잉크 액적 측정 및 정밀 공차 내로 유체를 증착하기 위한 제어 기법 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020217040761A Division KR102617723B1 (ko) | 2013-04-26 | 2014-04-23 | 인쇄 잉크 액적 측정 및 정밀 공차 내로 유체를 증착하기 위한 제어 기법 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20190138705A true KR20190138705A (ko) | 2019-12-13 |
Family
ID=53186549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020197036003A Ceased KR20190138705A (ko) | 2013-04-26 | 2014-04-23 | 인쇄 잉크 액적 측정 및 정밀 공차 내로 유체를 증착하기 위한 제어 기법 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP6781733B2 (zh) |
KR (1) | KR20190138705A (zh) |
CN (2) | CN105142913B (zh) |
TW (2) | TWI645984B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12011934B2 (en) | 2021-08-24 | 2024-06-18 | Semes Co., Ltd. | Substrate processing apparatus and the method thereof |
US12036790B2 (en) | 2020-11-26 | 2024-07-16 | Samsung Display Co., Ltd. | Inspection apparatus |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4011633A1 (en) * | 2013-04-26 | 2022-06-15 | Kateeva, Inc. | Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances |
US9961783B2 (en) * | 2016-07-08 | 2018-05-01 | Kateeva, Inc. | Guided transport path correction |
CN109476158B (zh) * | 2016-10-25 | 2020-12-01 | 惠普发展公司,有限责任合伙企业 | 用于维持打印质量参数的打印机和方法 |
CN106555186A (zh) * | 2016-11-28 | 2017-04-05 | 惠州市宏赫精密模具有限公司 | 一种蚀刻刀模画线加工方法 |
CN108340679B (zh) * | 2017-01-24 | 2019-08-27 | 京东方科技集团股份有限公司 | 液滴体积的调节装置和调节方法 |
US20180229497A1 (en) * | 2017-02-15 | 2018-08-16 | Kateeva, Inc. | Precision position alignment, calibration and measurement in printing and manufacturing systems |
JP2019051498A (ja) * | 2017-09-19 | 2019-04-04 | アイシン精機株式会社 | 検査装置 |
CN108944045B (zh) * | 2017-12-25 | 2019-12-10 | 广东聚华印刷显示技术有限公司 | 喷墨打印方法、装置、存储介质和计算机设备 |
CN108287899B (zh) * | 2018-01-23 | 2022-07-01 | 巫协森 | 双色配线标示用料制作系统与方法 |
UA126824C2 (uk) * | 2018-01-26 | 2023-02-08 | Пресіжн Плантінг Ллк | Спосіб картування розміру крапель сільськогосподарського обприскувача |
CN108031573A (zh) * | 2018-01-28 | 2018-05-15 | 北京工业大学 | 单液滴静电喷射系统稳定工作的调控方法 |
US10321002B1 (en) * | 2018-02-14 | 2019-06-11 | Xerox Corporation | Variable data vector graphic pattern ink pantograph |
CN110091604B (zh) * | 2018-04-13 | 2020-07-10 | 广东聚华印刷显示技术有限公司 | 喷墨打印控制方法、喷墨打印控制装置及喷墨打印系统 |
CN108646470A (zh) * | 2018-05-04 | 2018-10-12 | 京东方科技集团股份有限公司 | 隔垫物制作方法及系统、显示面板和显示装置 |
US11305284B2 (en) * | 2018-11-26 | 2022-04-19 | Tokitae, LLC | Determining a bulk concentration of a target in a sample using a digital assay with compartments having nonuniform volumes |
US11135854B2 (en) | 2018-12-06 | 2021-10-05 | Kateeva, Inc. | Ejection control using imager |
CN109823051B (zh) * | 2018-12-29 | 2019-12-24 | 华中科技大学 | 一种液滴喷射融合全过程体积控制方法、系统及打印机 |
CN112517928B (zh) * | 2019-08-28 | 2022-11-04 | 北京梦之墨科技有限公司 | 一种打印路径规划方法及打印装置 |
CN110455204B (zh) * | 2019-09-18 | 2020-11-20 | 中北大学 | 一种固体火箭发动机封头段涂层厚度自动检测校正方法 |
CN110455203B (zh) * | 2019-09-18 | 2020-12-15 | 中北大学 | 一种固体火箭发动机直筒段涂层厚度自动检测校正方法 |
KR102725592B1 (ko) * | 2019-11-22 | 2024-11-06 | 삼성디스플레이 주식회사 | 표시 장치 제조 방법 |
CN115135505B (zh) * | 2020-01-08 | 2023-10-31 | Lg电子株式会社 | 显示器的薄膜图案制造方法 |
JP7446854B2 (ja) * | 2020-03-02 | 2024-03-11 | 住友重機械工業株式会社 | インク塗布装置、インク塗布装置の制御装置、及びインク塗布方法 |
CN111746123B (zh) * | 2020-06-08 | 2024-03-26 | 深圳圣德京粤科技有限公司 | 一种多喷头打印装置及其打印方法 |
CN111905982A (zh) * | 2020-07-16 | 2020-11-10 | 苏州小蜂视觉科技有限公司 | 一种基于光纤传感器的喷射点胶胶量的实时测量设备 |
TWI785844B (zh) * | 2020-10-28 | 2022-12-01 | 德商博斯特比勒費爾德有限公司 | 印刷系統 |
CN112387552B (zh) * | 2020-11-05 | 2022-05-17 | 大连交通大学 | 一种腻子涂装机器人喷涂参数自整定的方法 |
CN114074478A (zh) * | 2020-12-28 | 2022-02-22 | 广东聚华印刷显示技术有限公司 | 喷墨打印控制方法、控制装置以及喷墨打印系统 |
JP7044932B1 (ja) * | 2021-07-08 | 2022-03-30 | アーベーベー・シュバイツ・アーゲー | 塗装ヘッドの塗装判定装置及び塗装システム |
JP7122451B1 (ja) | 2021-07-08 | 2022-08-19 | アーベーベー・シュバイツ・アーゲー | 塗装ヘッドの塗装判定装置及び塗装システム |
CN113771493A (zh) * | 2021-09-10 | 2021-12-10 | Tcl华星光电技术有限公司 | 喷墨打印头、喷墨打印设备、方法以及装置 |
CN114670547B (zh) * | 2022-03-04 | 2023-02-10 | 华中科技大学 | 一种喷墨打印tfe图案化膜厚控制方法 |
CN114801477B (zh) * | 2022-03-11 | 2023-01-06 | 华中科技大学 | 一种用于印刷显示的图案化规划方法、打印方法及系统 |
US11820140B2 (en) * | 2022-03-21 | 2023-11-21 | Funai Electric Co., Ltd | Dispense modes for multi-mode capable device |
CN115107370B (zh) * | 2022-05-25 | 2024-04-26 | 复旦大学 | 一种高效oled像素层打印方法、装置及存储介质 |
CN116899820B (zh) * | 2023-09-14 | 2024-01-02 | 常州银河世纪微电子股份有限公司 | 一种用于芯片双孔点胶头及其点胶方法 |
CN119056678B (zh) * | 2024-11-06 | 2025-02-11 | 常州铭赛机器人科技股份有限公司 | 胶量分配补偿方法及其补偿系统 |
Family Cites Families (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0427552A (ja) * | 1990-05-22 | 1992-01-30 | Canon Inc | 液体噴射記録装置 |
US6513906B1 (en) * | 1991-06-06 | 2003-02-04 | Canon Kabushiki Kaisha | Recording apparatus and recording method |
JP2963072B2 (ja) * | 1996-09-30 | 1999-10-12 | キヤノン株式会社 | インクジェット記録方法及び装置及びカラーフィルタ及び表示装置及びこの表示装置を備えた装置 |
US5867194A (en) * | 1995-05-16 | 1999-02-02 | Videojet Systems International, Inc. | Method and apparatus for automatic setting of nozzle drive voltage in an ink jet printer |
JP3346454B2 (ja) * | 1997-01-08 | 2002-11-18 | セイコーエプソン株式会社 | インクジェット式印刷装置及び印刷方法 |
JP2001071476A (ja) * | 1999-09-03 | 2001-03-21 | Canon Inc | 吐出液滴評価装置および吐出液滴評価方法 |
US6495917B1 (en) * | 2000-03-17 | 2002-12-17 | International Business Machines Corporation | Method and structure of column interconnect |
JP2003014442A (ja) * | 2001-07-03 | 2003-01-15 | Canon Inc | 液滴体積測定装置 |
JP3838964B2 (ja) * | 2002-03-13 | 2006-10-25 | 株式会社リコー | 機能性素子基板の製造装置 |
JP3951765B2 (ja) * | 2002-03-20 | 2007-08-01 | セイコーエプソン株式会社 | チャンバ装置の運転方法、チャンバ装置、これを備えた電気光学装置および有機el装置 |
US7188919B2 (en) * | 2002-07-08 | 2007-03-13 | Canon Kabushiki Kaisha | Liquid discharge method and apparatus using individually controllable nozzles |
JP4323879B2 (ja) * | 2002-07-08 | 2009-09-02 | キヤノン株式会社 | 液体吐出装置及び液体吐出方法 |
JP4040543B2 (ja) * | 2002-07-08 | 2008-01-30 | キヤノン株式会社 | 液体吐出装置及び方法、パネル製造装置及び製造方法、カラーフィルタ製造方法、液晶表示パネルの製造方法、液晶表示パネルを備えた装置の製造方法 |
US7111755B2 (en) * | 2002-07-08 | 2006-09-26 | Canon Kabushiki Kaisha | Liquid discharge method and apparatus and display device panel manufacturing method and apparatus |
JP2004058627A (ja) * | 2002-07-31 | 2004-02-26 | Canon Inc | 液滴計測方法およびその装置 |
JP4168788B2 (ja) * | 2003-03-06 | 2008-10-22 | セイコーエプソン株式会社 | 成膜方法、カラーフィルタ基板の製造方法、エレクトロルミネッセンス装置用基板の製造方法、表示装置の製造方法 |
ATE419121T1 (de) * | 2003-05-02 | 2009-01-15 | Tpo Displays Corp | Verfahren zum präzisen regeln des volumens von aus einem druckkopf ausgestossenen tintentröpfchen |
US7578951B2 (en) * | 2004-01-27 | 2009-08-25 | Hewlett-Packard Development Company, L.P. | Method of making microcapsules utilizing a fluid ejector |
JP4580706B2 (ja) * | 2004-07-08 | 2010-11-17 | 株式会社東芝 | インク塗布装置及び表示装置製造方法 |
US8152262B2 (en) * | 2004-08-06 | 2012-04-10 | Seccombe S Dana | Means for higher speed inkjet printing |
US8342636B2 (en) * | 2004-08-23 | 2013-01-01 | Kabushiki Kaisha Ishiihyoki | Discharge rate control method for ink-jet printer, ink spread inspecting method, and oriented film forming method |
JP4568800B2 (ja) * | 2004-12-17 | 2010-10-27 | 国立大学法人埼玉大学 | 小滴の状態計測装置及び該装置におけるカメラの校正方法 |
JP2007117833A (ja) * | 2005-10-26 | 2007-05-17 | Seiko Epson Corp | 薄膜形成方法及び薄膜形成装置 |
JP2007315976A (ja) * | 2006-05-26 | 2007-12-06 | Japan Aerospace Exploration Agency | 微小液滴・気泡・粒子の位置・粒径・速度測定の方法と装置 |
US20080024532A1 (en) * | 2006-07-26 | 2008-01-31 | Si-Kyoung Kim | Methods and apparatus for inkjet printing system maintenance |
GB0622784D0 (en) * | 2006-11-15 | 2006-12-27 | Cambridge Display Technology O | Droplet volume control |
JP2008183529A (ja) * | 2007-01-31 | 2008-08-14 | Seiko Epson Corp | 液滴吐出装置 |
JP4840186B2 (ja) * | 2007-02-19 | 2011-12-21 | セイコーエプソン株式会社 | チャンバ装置 |
US7648220B2 (en) * | 2007-04-23 | 2010-01-19 | Hewlett-Packard Development Company, L.P. | Sensing of fluid ejected by drop-on-demand nozzles |
JP4888346B2 (ja) * | 2007-11-06 | 2012-02-29 | セイコーエプソン株式会社 | 液状体の塗布方法、有機el素子の製造方法 |
WO2009076249A2 (en) * | 2007-12-06 | 2009-06-18 | Applied Materials, Inc. | Methods and apparatus for measuring deposited ink in pixel wells on a substrate using a line scan camera |
JP2009189954A (ja) * | 2008-02-14 | 2009-08-27 | Seiko Epson Corp | 駆動信号設定方法 |
CN102112317B (zh) * | 2008-06-06 | 2013-03-20 | 富士胶卷迪马蒂克斯股份有限公司 | 检测用于打印的目标 |
US8333453B2 (en) * | 2008-07-30 | 2012-12-18 | Hewlett-Packard Development Company, L.P. | Method of dispensing liquid |
JP2009093189A (ja) * | 2008-11-17 | 2009-04-30 | Seiko Epson Corp | 表示装置の製造方法 |
JP5287165B2 (ja) * | 2008-11-19 | 2013-09-11 | 富士ゼロックス株式会社 | 液滴吐出装置、及びメンテナンスプログラム |
JP2010227762A (ja) * | 2009-03-26 | 2010-10-14 | Seiko Epson Corp | 液滴吐出装置、薄膜形成方法 |
JP2012139655A (ja) * | 2011-01-05 | 2012-07-26 | Seiko Epson Corp | 印刷装置 |
JP5754225B2 (ja) * | 2011-04-19 | 2015-07-29 | 株式会社リコー | トナーの製造方法及びトナーの製造装置 |
WO2012164628A1 (ja) * | 2011-06-03 | 2012-12-06 | パナソニック株式会社 | 有機el表示パネルの製造方法、および有機el表示パネルの製造装置 |
KR102777021B1 (ko) * | 2012-12-27 | 2025-03-05 | 카티바, 인크. | 정밀 공차 내로 유체를 증착하기 위한 인쇄 잉크 부피 제어를 위한 기법 |
EP4011633A1 (en) * | 2013-04-26 | 2022-06-15 | Kateeva, Inc. | Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances |
-
2014
- 2014-04-23 KR KR1020197036003A patent/KR20190138705A/ko not_active Ceased
- 2014-04-23 CN CN201480023530.6A patent/CN105142913B/zh active Active
- 2014-04-23 CN CN201710770926.2A patent/CN107364237B/zh active Active
- 2014-04-25 TW TW103114950A patent/TWI645984B/zh active
- 2014-04-25 TW TW107141748A patent/TWI670184B/zh active
-
2018
- 2018-05-07 JP JP2018089271A patent/JP6781733B2/ja active Active
-
2019
- 2019-11-01 JP JP2019199806A patent/JP6905761B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12036790B2 (en) | 2020-11-26 | 2024-07-16 | Samsung Display Co., Ltd. | Inspection apparatus |
US12011934B2 (en) | 2021-08-24 | 2024-06-18 | Semes Co., Ltd. | Substrate processing apparatus and the method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI645984B (zh) | 2019-01-01 |
JP6781733B2 (ja) | 2020-11-04 |
CN105142913A (zh) | 2015-12-09 |
CN107364237A (zh) | 2017-11-21 |
JP6905761B2 (ja) | 2021-07-21 |
TW201906741A (zh) | 2019-02-16 |
JP2020024943A (ja) | 2020-02-13 |
JP2018120874A (ja) | 2018-08-02 |
TWI670184B (zh) | 2019-09-01 |
CN105142913B (zh) | 2017-10-27 |
CN107364237B (zh) | 2019-09-10 |
TW201509691A (zh) | 2015-03-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11489146B2 (en) | Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances | |
JP7587861B2 (ja) | 印刷インク液滴測定および精密な公差内で流体を堆積する制御のための技法 | |
US9802403B2 (en) | Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances | |
KR20190138705A (ko) | 인쇄 잉크 액적 측정 및 정밀 공차 내로 유체를 증착하기 위한 제어 기법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A107 | Divisional application of patent | ||
A201 | Request for examination | ||
PA0104 | Divisional application for international application |
Comment text: Divisional Application for International Patent Patent event code: PA01041R01D Patent event date: 20191205 Application number text: 1020187034202 Filing date: 20181126 |
|
PA0201 | Request for examination | ||
PG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20210104 Patent event code: PE09021S01D |
|
AMND | Amendment | ||
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
Patent event date: 20210721 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20210104 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
X091 | Application refused [patent] | ||
PX0901 | Re-examination |
Patent event code: PX09011S01I Patent event date: 20210721 Comment text: Decision to Refuse Application Patent event code: PX09012R01I Patent event date: 20210324 Comment text: Amendment to Specification, etc. |
|
E601 | Decision to refuse application | ||
E801 | Decision on dismissal of amendment | ||
PE0601 | Decision on rejection of patent |
Patent event date: 20211022 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20210104 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
PE0801 | Dismissal of amendment |
Patent event code: PE08012E01D Comment text: Decision on Dismissal of Amendment Patent event date: 20211022 Patent event code: PE08011R01I Comment text: Amendment to Specification, etc. Patent event date: 20210917 Patent event code: PE08011R01I Comment text: Amendment to Specification, etc. Patent event date: 20210324 |
|
A107 | Divisional application of patent | ||
PA0104 | Divisional application for international application |
Comment text: Divisional Application for International Patent Patent event code: PA01041R01D Patent event date: 20211213 Application number text: 1020187034202 Filing date: 20181126 |