KR20170061599A - 가공 장치 - Google Patents
가공 장치 Download PDFInfo
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- KR20170061599A KR20170061599A KR1020160153194A KR20160153194A KR20170061599A KR 20170061599 A KR20170061599 A KR 20170061599A KR 1020160153194 A KR1020160153194 A KR 1020160153194A KR 20160153194 A KR20160153194 A KR 20160153194A KR 20170061599 A KR20170061599 A KR 20170061599A
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- 238000003754 machining Methods 0.000 title claims abstract description 26
- 238000005520 cutting process Methods 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000428 dust Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
(해결 수단) 판상의 제 1 피가공물 (11) 이 재치되는 재치부 (6) 와, 제 1 피가공물을 분할하여 얻어지는 제 2 피가공물 (13) 을 유지면 (14a) 에서 유지하는 척 테이블 (14) 과, 척 테이블에 의해 유지된 제 2 피가공물을 가공하는 가공 수단 (16) 과, 재치부에 재치된 제 1 피가공물을 유지하여 반송하는 반송 수단 (8) 과, 반송 수단에 의해 유지된 제 1 피가공물을 컷하여 유지면에 대응한 크기의 복수의 제 2 피가공물로 분할하는 프리컷 수단 (26) 을 포함하고, 프리컷 수단은, 반송 수단의 이동 경로 내에 설치되어 반송 수단을 이동시키면서, 반송 수단에 의해 유지된 제 1 피가공물에 프리컷 수단을 절입시킴으로써, 제 1 피가공물을 척 테이블에 반송하기 전에 복수의 제 2 피가공물로 분할한다.
Description
도 2 의 (A) 는, 제 1 반송 유닛의 구조 등을 모식적으로 나타내는 도면이고, 도 2 의 (B) 는, 제 1 반송 유닛의 하면측을 모식적으로 나타내는 도면이다.
도 3 의 (A) 는, 피가공물이 반입측 테이블로부터 제 1 반송 유닛에 넘겨지는 모습을 모식적으로 나타내는 도면이고, 도 3 의 (B) 는, 피가공물이 프리컷 유닛에 의해 프리컷되는 모습을 모식적으로 나타내는 도면이고, 도 3 의 (C) 는, 분할 후의 피가공물이 제 1 반송 유닛으로부터 척 테이블에 넘겨지는 모습을 모식적으로 나타내는 도면이다.
도 4 의 (A) 는, 피가공물을 척 테이블에 넘긴 후의 제 1 반송 유닛의 동작을 모식적으로 나타내는 도면이고, 도 4 의 (B) 는, 분할 후의 다른 피가공물이 제 1 반송 유닛으로부터 척 테이블에 넘겨지는 모습을 모식적으로 나타내는 도면이다.
4 : 기대
4a, 4b : 개구
6 : 반입측 테이블 (재치부)
8 : 제 1 반송 유닛 (반송 수단)
10 : X 축 이동 테이블
12 : 방진 방적 커버
14 : 척 테이블
14a : 유지면
16 : 절삭 유닛 (가공 유닛, 가공 수단)
18 : 스핀들 하우징
20 : 절삭 블레이드
22 : 반출측 테이블
24 : 제 2 반송 유닛
26 : 프리컷 유닛 (프리컷 수단)
28 : 절삭 블레이드
30 : 세정 유닛 (노즐)
32 : 유지 핸드
34 : 흡인 패드
36 : 흡인로
38 : 밸브
40 : 흡인원
11 : 피가공물 (제 1 피가공물)
13 : 피가공물 (제 2 피가공물)
Claims (2)
- 판상의 제 1 피가공물이 재치되는 재치부와, 제 1 피가공물을 분할하여 얻어지는 제 2 피가공물을 유지면에서 유지하는 척 테이블과, 그 척 테이블에 의해 유지된 제 2 피가공물을 가공하는 가공 수단과, 그 재치부에 재치된 제 1 피가공물을 유지하여 반송하는 반송 수단과, 그 반송 수단에 의해 유지된 제 1 피가공물을 컷하여 그 유지면에 대응한 크기의 복수의 제 2 피가공물로 분할하는 프리컷 수단을 구비하고,
그 프리컷 수단은, 그 반송 수단의 이동 경로 내에 설치되고,
그 반송 수단을 이동시키면서, 그 반송 수단에 의해 유지된 제 1 피가공물에 그 프리컷 수단을 절입시킴으로써, 제 1 피가공물을 그 척 테이블에 반송하기 전에 복수의 제 2 피가공물로 분할하는 것을 특징으로 하는 가공 장치. - 제 1 항에 있어서,
그 반송 수단은, 제 2 피가공물에 각각 대응하는 제 1 피가공물의 복수의 영역을 유지할 수 있도록 구성되어 있고, 그 프리컷 수단에 의해 제 1 피가공물을 복수의 제 2 피가공물로 분할하고 나서, 복수의 제 2 피가공물을 순서대로 그 척 테이블에 반송하는 것을 특징으로 하는 가공 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2015-230740 | 2015-11-26 | ||
JP2015230740A JP6579929B2 (ja) | 2015-11-26 | 2015-11-26 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170061599A true KR20170061599A (ko) | 2017-06-05 |
KR102463650B1 KR102463650B1 (ko) | 2022-11-03 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020160153194A KR102463650B1 (ko) | 2015-11-26 | 2016-11-17 | 가공 장치 |
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JP (1) | JP6579929B2 (ko) |
KR (1) | KR102463650B1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7614803B2 (ja) | 2020-11-24 | 2025-01-16 | Towa株式会社 | 切断装置及び切断品の製造方法 |
JP7530809B2 (ja) * | 2020-11-24 | 2024-08-08 | Towa株式会社 | 切断装置及び切断品の製造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09148275A (ja) * | 1995-11-17 | 1997-06-06 | Disco Abrasive Syst Ltd | 大口径ウェーハのダイシングシステム |
JP2001024003A (ja) | 1999-07-09 | 2001-01-26 | Disco Abrasive Syst Ltd | Csp基板分割装置 |
JP2005129567A (ja) * | 2003-10-21 | 2005-05-19 | Trecenti Technologies Inc | 半導体装置の製造方法 |
KR20060022964A (ko) * | 2004-09-08 | 2006-03-13 | 삼성전자주식회사 | 소잉/소팅 시스템 |
JP2009302369A (ja) * | 2008-06-16 | 2009-12-24 | Disco Abrasive Syst Ltd | 板状物の加工方法及び加工装置 |
JP2014093444A (ja) * | 2012-11-05 | 2014-05-19 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2015191992A (ja) * | 2014-03-28 | 2015-11-02 | 株式会社東京精密 | 半導体製造装置及び半導体の製造方法 |
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2015
- 2015-11-26 JP JP2015230740A patent/JP6579929B2/ja active Active
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2016
- 2016-11-17 KR KR1020160153194A patent/KR102463650B1/ko active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09148275A (ja) * | 1995-11-17 | 1997-06-06 | Disco Abrasive Syst Ltd | 大口径ウェーハのダイシングシステム |
JP2001024003A (ja) | 1999-07-09 | 2001-01-26 | Disco Abrasive Syst Ltd | Csp基板分割装置 |
JP2005129567A (ja) * | 2003-10-21 | 2005-05-19 | Trecenti Technologies Inc | 半導体装置の製造方法 |
KR20060022964A (ko) * | 2004-09-08 | 2006-03-13 | 삼성전자주식회사 | 소잉/소팅 시스템 |
JP2009302369A (ja) * | 2008-06-16 | 2009-12-24 | Disco Abrasive Syst Ltd | 板状物の加工方法及び加工装置 |
JP2014093444A (ja) * | 2012-11-05 | 2014-05-19 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2015191992A (ja) * | 2014-03-28 | 2015-11-02 | 株式会社東京精密 | 半導体製造装置及び半導体の製造方法 |
Also Published As
Publication number | Publication date |
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KR102463650B1 (ko) | 2022-11-03 |
JP2017098465A (ja) | 2017-06-01 |
JP6579929B2 (ja) | 2019-09-25 |
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