KR20160099380A - System for grinding edge of substrate and method for inspecting grined edge of substrate - Google Patents

Abstract

In the present invention, a chamfered portion is imaged immediately after the chamfering process of single-piece PCBs is performed, and the chamfered portion is inspected through the formed image to inspect the chamfered portion, thereby preventing the occurrence of continuous chamfering defect due to damage of the spindle bit or the like Wherein the edge grinding system comprises a first edge grinding block disposed on a transfer path of the panel to form a first chamfer in a first area of the panel and a second edge grinding block disposed on a second area of the panel, And a second edge grinding block for forming a second chamfered portion on the first edge grinding block, a first elevating and lowering unit for moving up and down the first edge grinding block, and a second elevating and lowering unit for moving up and down the second edge grinding block. An elevating / lowering module including a panel, and moving in a direction crossing the conveying path of the panel It includes a first mounting surface and to determine using the second chamfered portion taken by the image generation module to generate an image and the image to determine the first and second chamfered portions are not defective in the module.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an edge grinding system and a method for inspecting a grinding edge,

The present invention relates to an edge grinding system and a grind edge inspection method.

In general, a memory module including a memory semiconductor chip for storing data and a printed circuit board on which a memory semiconductor chip is mounted is widely applied to computers and the like.

A plurality of terminals electrically connected to the memory semiconductor chip are arranged in a line at one end of the printed circuit board of the memory module.

Terminals formed on a printed circuit board are inserted into a memory mounting slot provided in a main body of a computer or the like to receive power and transmit or receive a data signal.

A terminal is formed on the terminal so that a portion of the printed circuit board included in the memory module is easily and smoothly inserted into the memory mounting slot.

In general, a circuit board on which a memory semiconductor chip is mounted is mounted on one panel 10 as shown in Figs. 1 and 2A of a printed circuit board terminal portion chamfering device (Apr. 15, 2010) (1), and a narrow and long slot (1c) is formed between the individual PCs (1).

A spindle bit is inserted into the slot 1c to cut the terminal portion at an angle to perform chamfering.

In the case of the terminal block of the printed circuit board, the chamfering operation can be performed accurately only when the single component PCBs 1 are arranged on the panel 10 in the same shape and direction.

On the other hand, when the single piece PCBs 1 are arranged in mutually symmetrical shapes on both sides of the panel with respect to the center of one panel, it is difficult to apply the terminal device for chamfering the terminal portion of the printed circuit board.

In order to perform a chamfering operation on a panel in which the single piece PCBs are arranged symmetrically on both sides with the terminal block of the printed circuit board, chamfering process is firstly performed on the single pieces of PCBs disposed on one side of the panel And the chamfering process must be performed on the single pieces of PCBs disposed on the other side of the panel by changing the direction of the panel, so that it takes much time to perform the chamfering process.

Meanwhile, when the spindle bit is damaged in the process of performing the chamfering process on the panel, uneven scratches are generated in the chamfered portion. Conventionally, chamfering is performed and then the chamfered portion is manually inspected Therefore, there is a problem that the total working time for performing the chamfering process is greatly increased and accurate inspection is difficult.

Patent application title: PRESSURE CIRCUIT BOARD TERMINAL CHAMBER APPARATUS (2010.04.15)

In the present invention, a chamfered portion is imaged immediately after the chamfering process of single-piece PCBs is performed, and the chamfered portion is inspected through the formed image to inspect the chamfered portion, thereby preventing the occurrence of continuous chamfering defect due to damage of the spindle bit or the like And a grinding edge inspection method.

The present invention provides an edge grinding system and a grind edge inspection method that can significantly shorten the time required for chamfering even if the single piece PCBs formed in one panel on which chamfering is performed are arranged in a symmetrical shape with respect to the center of the panel .

In addition, the present invention provides an edge grinding system and a grind edge inspection method capable of performing edge grinding at an end portion where terminals of single piece PCBs are formed by an automated process rather than a manual process.

In one embodiment, an edge grinding system includes a first edge grinding block disposed on a conveying path of a panel to form a first chamfer in a first region of the panel, and a second edge grinding block disposed on a second region of the panel, An edge grinding module including a two-edge grinding block; An up-down module including a first up-down unit for moving up and down the first edge grinding block and a second up-down unit for moving up and down the second edge grinding block; An image generation module for capturing an image of the first planar mounting portion and the second planar portion while moving in a direction intersecting the conveying path of the panel to generate an image; And a determination module for determining whether the first and second chamfered portions are defective using the image.

The image generation module of the edge grinding system includes a guide member formed in a direction crossing the conveyance path and spaced from the panel, and a camera module moving along the guide member.

The camera module of the edge grinding system creates the image while reciprocating the panel.

The first chamfered portions formed on the panel by the edge grinding system are formed in parallel to each other in a direction intersecting with the conveyance path, and the second chamfered portions are each formed in parallel in a direction crossing the conveyance path.

The edge grinding system further includes a separate discharge unit for separating and discharging the panel when at least one of the first and second chamfered portions is defective by the discrimination module.

The elevating and lowering module of the edge grinding system includes a shift unit for shifting the first and second edge grinding blocks with respect to the panel.

The first edge grinding block of the edge grinding system is equipped with a first spindle bit for forming the first chamfered portion on the panel, and a second spindle bit for forming the second chamfered portion is formed on the second edge grinding block Respectively.

A loader for providing the panel to the panel transfer unit is disposed on one side of a panel transfer unit for introducing the panel of the edge grinding system into the transfer path, and on the other side opposite to the one side of the panel transfer unit, An unloader is disposed to receive the panel in which the second chamfered portions are formed.

In one embodiment, an edge grinding inspection method includes moving a panel in a first horizontal direction and forming a first chamfered portion in a first region of the panel; Forming a second chamfered portion in a second region of the panel while moving the panel in a second horizontal direction opposite to the first horizontal direction; The first and second chamfered portions are intermittently photographed while the camera is transferred in a direction crossing the first and second horizontal directions to generate first and second images corresponding to the first and second chamfered portions step; And

And determining whether the first and second chamfered portions are defective by analyzing the first and second images.

In another embodiment, an edge grinding inspection method includes moving a panel in a first horizontal direction while forming a first chamfered portion in a first region of the panel; Intermittently photographing the first chamfered part while transferring the camera in a direction crossing the first horizontal direction to generate a first image; Forming a second chamfered portion in a second region of the panel while moving the panel in a second horizontal direction opposite to the first horizontal direction; Intermittently photographing the second chamfered part while transferring the camera in a direction crossing the second horizontal direction to generate a second image; And a determining step of analyzing the first and second images to determine whether the first and second face attaching parts are defective.

The edge grinding module, the image generating module, the discriminating module, and the unloader of the edge grinding system according to the present invention are automated to form chamfer portions on the unit PCBs of the panel, It is possible to shorten the edge grinding process time of the panel and improve the productivity.

Further, the edge grinding system according to the present invention is characterized in that the edge grinding module is divided into first and second edge grinding blocks, first and second edge grinding blocks are provided with first and second rising and descending units, The edge grinding block is selected and the chamfering process is performed so that the time required for the chamfering process can be greatly shortened even if multiple array panels are inserted symmetrically on both sides of the center of the panel.

In addition, the edge grinding system according to the present invention is an edge grinding system according to the present invention, in which the operator checks the state of the chamfered portions formed on the unit PCBs of the panel by taking pictures of chamfered portions formed on the unit PCB of the panel using the camera module, It is possible to easily, quickly, and accurately determine whether or not the panel is defective by determining whether the chamfered portions are defective by analyzing the image.

Also, every time the chamfering process is performed, whether or not the chamfered portions are defective is determined through the camera module and the discrimination module, thereby preventing the occurrence of continuous chamfering defects due to damage of the spindle bit or the like installed in the first and second edge grinding blocks There is an effect.

1 is a side view illustrating an edge grinding system according to an embodiment of the present invention.
2 is a plan view of Fig.
Figure 3 is a front view of the edge grinding module of Figure 1;
4 is a plan view showing a panel in which unit PCBs are arranged in a symmetrical shape.
5 is a flowchart illustrating an edge grinding test method according to an embodiment of the present invention.
6 is a flowchart showing an edge grinding test method according to another embodiment of the present invention.

In the following description, only parts necessary for understanding the embodiments of the present invention will be described, and the description of other parts will be omitted so as not to obscure the gist of the present invention.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings and the inventor is not limited to the meaning of the terms in order to describe his invention in the best way. It should be interpreted as meaning and concept consistent with the technical idea of the present invention. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely preferred embodiments of the present invention, and are not intended to represent all of the technical ideas of the present invention, so that various equivalents And variations are possible.

1 is a side view illustrating an edge grinding system according to an embodiment of the present invention. 2 is a plan view of Fig. Figure 3 is a front view of the edge grinding module of Figure 1;

1 to 3, the edge grinding system 800 includes an edge grinding module 100, an ascending / descending module 200, an image generating module 300, and a discriminating module 400. In addition, the edge grinding system 800 may include a panel transfer unit 500, a loader 600, and an unloader 700.

2, the direction from the loader 600 to the unloader 700 is defined in the X direction for the sake of explanation and the direction perpendicular to the X direction, that is, the direction in which the panel 1 is moved toward the edge grinding module, For convenience, we shall define it in the Y direction. The direction perpendicular to the XY plane formed by the X direction and the Y direction is defined as the Z direction for convenience of explanation.

The loader 600 receives a panel 1 (see FIG. 4) in which unit PCBs on which edge chamfering is to be performed in the edge grinding module 100 are accommodated.

The unloader 700 disposed at a position spaced apart from the loader 600 in the X direction receives the panels 1 on which the unit PCBs on which the chamfering process is performed in the edge grinding module 100 are formed.

In the unloader 700, only the good panels are housed after the chamfering process in the edge grinding module 100, and the defective panels in which the edge grinding module 100 is defective during the chamfering process are not stored in the unloader 700 And is stored separately in the defective article loading box 750 or the like.

In an embodiment of the present invention, the loader 600 and the unloader 700 allow the chamfering process to proceed with an automated process.

Referring to FIGS. 2 and 3, a panel transfer unit 500 is disposed between the loader 600 and the unloader 700.

The panel transfer unit 500 includes a guide rail 510, a support plate 520, and a drive unit 540.

The guide rails 510 are arranged along the Y direction and have a plate shape erected in the Z direction, and the pair of guide rails 510 are disposed on the upper surface of the base member in parallel with each other.

The support plate 520 is slidably engaged with the upper end of the guide rail 510 and the support plate 520 is moved in the Y direction along the guide rail 510.

A panel 1 provided from the loader 600 is placed on the upper surface of the support plate 520 and the panel 1 is fixed to the upper surface of the support plate 520. As the support plate 520 is moved in the Y direction, the panel 1 fixed on the upper surface of the support plate 520 is also moved in the Y direction as shown in FIG.

The driving unit 540 is installed, for example, between a pair of guide rails 510 and fixed to the upper surface of the base member to transfer the supporting plate 520 in the Y direction.

As the driving unit 540, for example, various linear reciprocating devices that linearly reciprocate in the Y direction can be used.

The driving unit 540 in the embodiment of the present invention may include, for example, a first cylinder body 542 fixed to the base member and a second cylinder body 542 fixed to the first cylinder body 542 and linearly reciprocating in the Y direction And may include a first cylinder rod 544.

2 and 3, the edge grinding module 100 is disposed at a position spaced apart from the panel transfer unit 500 in the Y direction.

In addition, the edge grinding module 100 is disposed at a position spaced apart from the panel transfer unit 500 by a predetermined distance in the Z direction.

The edge grinding module 100 includes a first edge grinding block 120 and a second edge grinding block 140.

In one embodiment of the present invention, the edge grinding module 100 is divided into a first edge grinding block 120 and a second edge grinding block 140, 3 and the unit PCBs 7 disposed symmetrically with respect to the unit PCBs 5 on the right side with respect to the center line 3 as shown in FIG. So that it can be formed.

Of course, when the edge grinding module 100 is divided into the first edge grinding block 120 and the second edge grinding block 140, the unit PCB 5 and the unit PCB 7 are arranged symmetrically on the panel 1 The chamfered portion can be formed.

First spindle bits 122 are mounted on the lower end of the first edge grinding block 120 facing the support plate 520. The first spindle bits 122 of the first edge grinding block 120 are mounted in the same number as the number of the unit PCBs 5 of FIG.

The first spindle bits 122 provided at the lower end of the first edge grinding block 120 form a chamfered portion on the unit PCBs 5 of the panel 1 while rotating at a high speed in the first direction, for example.

When the first spindle bit 122 forms the chamfered portion on the unit PCB 5 of the panel 1 at the lower end of the first edge grinding block 120, the upper surface of the panel 1 is pressed to shake the panel 1 (Not shown) can be disposed.

The panel pressure roller is disposed, for example, between the first spindle bits 122.

Second spindle bits 142 are mounted on the lower end of the second edge grinding block 140 facing the support plate 520. The second spindle bits 142 of the second edge grinding blocks 140 are mounted in the same number as the number of unit PCBs 7 formed on the right side of the center line 3 in Fig.

The second spindle bits 142 provided at the lower ends of the second edge grinding blocks 140 are rotated at a high speed in the second direction, for example, the direction opposite to the rotating direction of the first spindle bits 142, Thereby forming chamfered portions on the unit PCBs 7 of the printed circuit board.

When the second spindle bit 142 forms the chamfered portion on the unit PCB 7 of the panel 1 at the lower end of the second edge grinding block 140, the upper surface of the panel 1 is pressed to the shake of the panel 1 (Not shown) can be disposed.

The panel pressure roller is disposed, for example, between the first spindle bits 142.

The interval between the first spindle bits 122 disposed at the lower end of the first edge grinding block 120 is shorter than the interval between the unit PCBs 5 formed at the left side of the panel 1 shown in FIG. A and the interval between the second spindle bits 142 arranged at the lower end of the second edge grinding block 140 is equal to the interval between the unit PCBs 7 formed on the right side of the panel 1 shown in Fig. (B).

In one embodiment of the present invention, when the edge grinding module 100 is divided into the first and second edge grinding blocks 120 and 140, a unit PCB (not shown) disposed on both sides of the center line 3 of the panel 1 The first and second spindle bits 122,142 are used to detect the position of the panel 1 with the first and second spindle bits 122,142 using the first and second edge drawing blocks 120,140, The chamfered portions can be formed on the unit PCBs 5, 7, respectively.

In an embodiment of the present invention, the interval A between the unit PCBs 5 of the panel 1 shown in Fig. 4 and the interval B between the unit PCBs 7 of the panel 1 are the same and the interval C The elevating and lowering module 200 is disposed in the edge grinding module 100 in order to form chamfer portions on the unit PCBs 5 and 7 of the panel 1, respectively.

The ascending / descending module 200 includes a first ascending and descending unit 220 and a second ascending and descending unit 240. In addition, the up / down module 200 includes a shift unit 260 for shifting the first and second edge grinding blocks 120 and 140 relative to the unit PCBs 5 and 7 of the panel 1.

The first up / down unit 220 is installed in the Z direction between the first edge grinding block 120 and the shift unit 260 to connect the upper end of the first edge grinding block 120 and the shift unit 260 .

The first elevating and lowering unit 220 moves the first edge grinding block 120 up and down in the Z direction so that the first spindle bits 122 can form chamfered portions on the unit PCBs 5 of the panel 1 .

The second ascending / descending unit 240 is erected in the Z direction between the second edge grinding block 140 and the shift unit 260 to connect the upper end of the second edge grinding block 140 and the shift unit 260 .

The second ascending / descending unit 240 ascends or descends the second edge grinding block 140 in the Z direction so that the second spindle bits 142 can form chamfered portions on the unit PCBs 7 of the panel 1, Down.

The first and second ascending / descending units 220 and 240 may be, for example, various vertical reciprocating devices that reciprocate vertically in the Z direction.

The first and second ascending / descending units 220 and 240 in the embodiment of the present invention may include, for example, a second cylinder body 222 and a second cylinder body 222 fixed to the shift unit 260, And second cylinder rods 224, 244 coupled to the first and second edge grinding blocks 120, 140 and vertically reciprocating in the Z direction.

The shift unit 260 includes a first guide portion 262 and a first drive portion 264.

The first guide portion 262 is formed to extend in the X direction so as to cross the support plate 520 and the first and second lift units 220 and 240 are fixed to the first guide portion 262.

The first driving unit 264 is coupled to the first guide unit 262 to move the first and second up / down units 220 and 240 in the X direction.

When the first and second lift units 220 and 240 are moved in the X direction by the first drive unit 264, the first and second edge grinding blocks 120 and 140 fixed to the first and second lift units 220 and 240 Are also moved together to align the first spindle bit 122 and the second spindle bit 122 on the panel 1 where the chamfered portion is to be formed.

The shift unit 260 may be, for example, a variety of linear reciprocating devices that reciprocate linearly in the X direction.

2 and 3, the image generation module 300 is disposed at a position spaced apart from the panel transfer unit 500 by a predetermined distance in the Z direction.

2, the image generating module 300 includes a panel transferring unit 500 and an edge grinding unit 500. The panel transferring unit 500 and the edge grinding unit 500 are disposed at a position spaced apart from the panel transferring unit 500 in the Y direction, Module 100. In this embodiment,

The image generation module 300 includes a guide member 320 and a camera module 340.

The guide member 320 serves to move the camera module 340 in the X direction in order to confirm the state of the face mounting portion formed on the unit PCB 5 of the panel 1. [

The guide member 320 includes a second guide portion 322 and a second drive portion 324.

The second guide portion 322 is spaced apart in the Z direction from the panel 1 placed on the panel transfer unit 500 and the second guide portion 322 is formed long in the X direction across the support plate 520 do.

The second driving unit 324 is mounted on the second guide unit 322 and the second driving unit 324 is mounted on the unit PCBs 5 and 7 of the panel 1 so that the camera module 340 is rotated in X Direction.

As the guide member 320, for example, various linear reciprocating devices that linearly reciprocate in the X direction may be used.

The camera module 340 is mounted on the second guide portion 322 and reciprocates in the X direction along the second guide portion 322 by the second driving portion 324 so that the unit PCB 5, 7) to produce an image.

The discrimination module 400 is electrically connected to the camera module 340 to discriminate the image transferred from the camera module 340 to determine the wear state of the first and second spindle bits 122 and 142 and the first and second spindle bits 122 and 142 and the state of the chamfered portions generated on the unit PCBs 5 and 7 of the panel 1 are checked.

The discrimination module 400 is electrically connected to the unloader 700 and the rejection box 750 so that the good panels discriminated by the discrimination module 400 are accommodated in the unloader 700, The rejected panels determined in step S700 are accommodated in the rejected goods box 750. [

5 is a flowchart illustrating an edge grinding test method according to an embodiment of the present invention. Referring to FIG. 5, a method of edge grinding inspection of edge grinding system 800 is described.

The unit PCB 5 is mounted on the left and right portions of the panel 1 based on the center line 3 of the panel 1 shown in Fig. 4, for example, And 7 are symmetrically symmetrical to each other are transferred to the panel transfer unit 500 and placed on the support plate 520. [

The panel 1 to be subjected to the chamfering process due to the automation of the edge grinding system 800 is automatically transferred from the loader 600 to the panel transfer unit 500.

When the panel 1 on which the chamfering process is to be performed is placed on the support plate 520, the drive unit 540 of the panel transfer unit 500 is driven to move the support plate 520 on which the panel 1 is placed in the Y direction, The first grasping module 200 is moved in the direction in which the edge grinding module 200 is disposed and the first grasping unit 220 is lowered to form a first chamfered portion on each of the unit PCBs 5 formed on the left side of the panel 1 (S1010)

The first edge grinding block 120 is then lifted to separate the first spindle pits 122 from the panel and the first drive unit 264 of the shift unit 260 is driven to drive the first and second lift units 220, For example, in the direction in which the loader 600 is disposed.

The first and second edge grinding blocks 120 and 140 fixed to the first and second ascending and descending units 220 and 240 are shifted along the panel 1 to be positioned at the lower end of the second edge grinding block 140 The arranged second spindle bits 142 are aligned with the terminal portions of the unit PCBs 7 of the panel 1. [

Next, the support plate 520 on which the panel 1 with the first chamfered part is placed is moved in the Y direction, for example, in a direction opposite to the direction in which the edge grinding module 200 is disposed, (240) is lowered to form a second chamfered portion on each of the unit PCBs (7) formed on the right side of the panel (1)

When the first and second chamfered portions are formed on the panel 1, the second driving portion 324 of the image generation module 300 is driven. Then, the camera module 340 intermittently photographs the first and second chamfered portions formed on the unit PCBs 5 and 7 of the panel 1 while moving in the X direction along the second guide portion 322, 1 and the second surface mounting portion (S1030).

For example, the first and second images may be obtained by photographing each of the first and second chamfered portions formed on the unit PCBs 5 and 7 of the panel 1, .

The images of the first and second chamfered portions generated by the camera module 340 are transmitted to the determination module 400. The determination module 400 analyzes the images of the input first and second chamfered portions, And whether the second chamfered portions are defective or not (S1040).

The determination module 400 may determine not only the presence or absence of the first and second chamfered portions but also the wear state of the first and second spindle bits 122 and 142 and the replacement of the first and second spindle bits 122 and 142 have.

The panel 1 in which the presence or absence of defects in the first and second chamfered portions is determined is automatically transferred to the unloader 700 or the defective article loading box 750.

6 is a flowchart showing an edge grinding test method according to another embodiment of the present invention. Referring to FIG. 6, a method of edge grinding inspection of edge grinding system 800 will be described.

The unit PCB 5 is mounted on the left and right portions of the panel 1 based on the center line 3 of the panel 1 shown in Fig. 4, for example, And 7 are symmetrically symmetrical to each other are transferred to the panel transfer unit 500 and placed on the support plate 520. [

The panel 1 to be subjected to the chamfering process due to the automation of the edge grinding system 800 is automatically transferred from the loader 600 to the panel transfer unit 500.

When the panel on which the chamfering process is to be performed is placed on the support plate 520, the drive unit 540 of the panel transfer unit 500 is driven to move the support plate 520 on which the panel 1 is placed in the Y direction, The grinding module 200 is moved in the direction in which the grinding module 200 is disposed and the first up / down unit 220 is lowered to form a first chamfered portion on each of the unit PCBs 5 formed on the left side of the panel 1. S1110)

When the first chamfered portions are formed on the left side of the panel 1, the second driving portion 324 of the image generation module 300 is driven. Then, the camera module 340 moves in the X direction along the second guide portion 322 to intermittently photograph the first chamfered portions of the unit PCBs 5 formed on the left side of the panel 1, And generates corresponding first images (S1120)

The first edge grinding block 120 is then lifted to separate the first spindle pits 122 from the panel and the first drive unit 264 of the shift unit 260 is driven to drive the first and second lift units 220, For example, in the direction in which the loader 600 is disposed.

The first and second edge grinding blocks 120 and 140 fixed to the first and second ascending and descending units 220 and 240 are shifted along the panel 1 to be positioned at the lower end of the second edge grinding block 140 The arranged second spindle bits 142 are aligned with the terminals of the unit PCBs 7 of the panel 1

The driving unit 540 of the panel transfer unit 500 is driven again to move the support plate 520 in which the panel 1 with the first chamfered portion is placed in the Y direction, for example, the edge grinding module 200 And the second lift unit 240 is lowered to form a second chamfered portion on each of the unit PCBs 7 formed on the right side of the panel 1. In operation S1130,

When the second chamfered portions are formed on the right side of the panel 1, the second driving portion 324 of the image generating module 300 is driven again. Then, the camera module 340 moves in the X direction along the second guide portion 322, intermittently photographs the second chamfered portions of the unit PCBs 7 formed on the right side of the panel 1, And generates corresponding second images (S1140)

The images of the first and second chamfered portions generated by the camera module 340 are transmitted to the determination module 400. The determination module 400 analyzes the images of the input first and second chamfered portions, And whether the second chamfered portions are defective or not (S1150)

The determination module 400 may determine not only the presence or absence of the first and second chamfered portions but also the wear state of the first and second spindle bits 122 and 142 and the replacement of the first and second spindle bits 122 and 142 have.

The panel 1 in which the presence or absence of defects in the first and second chamfered portions is determined is automatically transferred to the unloader 700 or the defective article loading box 750.

As described in detail above, the chamfered portion is formed on the unit PCBs of the panel by automating the loader, the panel transfer unit, the edge grinding module, the image generating module, the discriminating module and the unloader of the edge grinding system, By automatically determining whether the panel is defective, the edge grinding process time of the panel can be shortened and the productivity can be improved.

In addition, the edge grinding system divides the edge grinding module into first and second edge grinding blocks, and first and second edge grinding blocks are installed in the first and second edge grinding blocks to form first and second edge grinding blocks The chamfering process is performed so that the time required for the chamfering process can be greatly shortened even if multiple array panels are inserted in symmetrical shapes on both sides of the center of the panel.

In addition, the edge grinding system photographs the chamfered portions formed on the unit PCB of the panel using the camera module without analyzing the state of the chamfered portions formed on the unit PCBs of the panel by the operator, and analyzes the photographed image by the discrimination module It is possible to easily, quickly, and accurately determine whether or not the panel is defective by judging whether or not the chamfered portions are defective.

Also, every time the chamfering process is performed, whether or not the chamfered portions are defective is determined through the camera module and the discrimination module, thereby preventing the occurrence of continuous chamfering defects due to damage of the spindle bit or the like installed in the first and second edge grinding blocks have.

It should be noted that the embodiments disclosed in the drawings are merely examples of specific examples for the purpose of understanding, and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

1 .... panel 100 .... edge grinding module
200 .... ascending / descending module 300 .... image generating module
400 .... discrimination module 500 .... panel transfer unit
600 .... Loader 700 .... Unloader
750 .... Defective loader 800 .... Edge grinding system

Claims (10)

An edge grinding machine including a first edge grinding block disposed on a transfer path of the panel to form a first chamfered portion in a first region of the panel and a second edge grinding block forming a second chamfered portion in a second region of the panel, module;
An up-down module including a first up-down unit for moving up and down the first edge grinding block and a second up-down unit for moving up and down the second edge grinding block;
An image generation module for capturing an image of the first planar mounting portion and the second planar portion while moving in a direction intersecting the conveying path of the panel to generate an image; And
And a determination module for determining whether the first and second chamfered portions are defective using the image. The method according to claim 1,
Wherein the image generation module includes a guide member spaced from the panel and formed in a direction crossing the transport path, and a camera module moving along the guide member. 3. The method of claim 2,
Wherein the camera module of the image generation module generates the image while reciprocating the panel. The method according to claim 1,
Wherein the first chamfered portions are formed in parallel to each other in a direction intersecting with the conveyance path, and the second chamfered portions are each provided in parallel in a direction crossing the conveyance path. The method according to claim 1,
Further comprising a separation and discharge unit for separating and discharging the panel when at least one of the first and second chamfered portions is defective by the determination module. The method according to claim 1,
Wherein the elevating and lowering module includes a shift unit for shifting the first and second edge grinding blocks with respect to the panel. The method according to claim 1,
Wherein the first edge grinding block is provided with a first spindle bit for forming the first chamfered portion on the panel, and the second edge grinding block is provided with an edge grinding having a second spindle bit for forming the second chamfered portion, system. The method according to claim 1,
A panel transfer unit for introducing the panel into the conveyance path is provided with a loader for providing the panel to the panel transfer unit, and on the other side opposite to the one side of the panel transfer unit, the first and second chamfers And an unloader for receiving the panel formed with the unloader. Forming a first chamfered portion in a first region of the panel while moving the panel in a first horizontal direction;
Forming a second chamfered portion in a second region of the panel while moving the panel in a second horizontal direction opposite to the first horizontal direction;
The first and second chamfered portions are intermittently photographed while the camera is transferred in a direction crossing the first and second horizontal directions to generate first and second images corresponding to the first and second chamfered portions step; And
And determining whether the first and second chamfered portions are defective by analyzing the first and second images. Forming a first chamfered portion in a first region of the panel while moving the panel in a first horizontal direction;
Intermittently photographing the first chamfered part while transferring the camera in a direction crossing the first horizontal direction to generate a first image;
Forming a second chamfered portion in a second region of the panel while moving the panel in a second horizontal direction opposite to the first horizontal direction;
Intermittently photographing the second chamfered part while transferring the camera in a direction crossing the second horizontal direction to generate a second image; And
And judging whether or not the first and second surface mounting portions are defective by analyzing the first and second images.

Images