KR101331193B1 - Automated defect detection vision system for recycling ic-tray - Google Patents

Abstract

The present invention relates to an automated defect detection vision system for recycling an IC tray. The purpose of the present invention is to provide an automated defect detection vision system for recycling an IC tray detecting the bad product of a recycled IC tray. The automated defect detection vision system for recycling an IC tray comprises a tray carrying part (100), a camera part (400), a defect detection part (500).

Description

Automated defect detection vision system for recycling IC-Tray}

The present invention, the tray carrying unit 100 for loading, supplying and transporting the recycled IC tray 210, the camera unit 400, the camera unit 400 for measuring the upper and lower surfaces, side surfaces of the recycled IC tray 210 Recycling IC tray defect detection automation vision, characterized in that it comprises a defect detection unit 500 for detecting whether the good or bad product of the recycle IC tray 210 by comparing the measurement result transmitted from the measurement result transmitted from the pre-input It is about the system.

An integrated circuit (IC) refers to an integrated circuit or IC chip, which is a combination of an electric circuit and a semiconductor device that performs a specific function.

IC chip is very sensitive to electric shock and physical shock because microcircuits are printed.

Therefore, the IC tray is called an IC tray which is designed and manufactured to block the IC chip from electromagnetic waves or static electricity that can penetrate from the outside and to be protected even from external shock or high temperature.

In order to prevent the IC chip from electric shocks caused by dust and moisture, and to prevent damage of the IC chip due to dust, the IC tray must maintain a constant static dissipation, that is, surface resistance of 104 to 105 amps.

The type of IC tray determines the size and shape of the IC tray.

In addition, because the user uses the IC chip after baking the tray for moisture removal, the material for the semiconductor tray is important for heat resistance, impact resistance, dimensional stability and low distortion before and after baking.

Therefore, it is important to detect defects to reduce the defective rate of IC trays.

As an example of a study on defect detection inspection of a semiconductor device such as a conventional IC chip, an appearance inspection and classification facility for a wafer level semiconductor device is disclosed in Korea Patent Publication No. 10-2005-0073299 as shown in FIG. It is.

In brief, the semiconductor element 21 separated from the wafer 11 supplied from the wafer supply unit 10 is picked up by the element pickup unit 20, and the first vision inspection unit 30 inspects one surface appearance, and then the element The second vision inspection unit 50 inspects the appearance of the other surface by transferring through the transfer unit 40.

This relates to an inspection and sorting facility for wafer level semiconductor devices that can provide finished products by inspecting and classifying the appearance of wafer level semiconductor devices preceded by electrical performance tests.

The IC tray can be reused after removing the IC chip. At this time, check whether the IC tray is contaminated, cracked, burr, cracked, etc., and then remove the defective product.

In order to detect such defects on IC trays and recycled IC trays, a sorting process is performed manually in Korea in order to check products, check dimensions, and visually examine the appearance according to the eligibility determination procedure for each manufacturing process.

Due to the manual process, there are limitations on daily detection yield and defect spot detection, and by detecting whether the defects are visually inspected by hand, the worker's fatigue increases, which leads to mistakes. Occurs.

In addition, there is a limit in recruiting functional personnel who can proceed manually, and there arises a problem that production costs such as labor costs increase.

Therefore, there is a need to develop an automated vision system for detecting defects of recycled IC trays that can increase daily fractionation, reduce defect efficiency, and improve productivity.

An object of the present invention is to provide a recycling IC tray failure detection automation vision system that can increase the daily fractionation amount, reduce the defect efficiency and at the same time improve productivity.

An object of the present invention, the tray carrying unit 100 for loading, supplying and transporting the recycled IC tray 210, the upper and lower surfaces of the recycled IC tray 210, the camera unit 400 for measuring the side surface, the camera unit ( Recycling IC tray failure detection automation vision system including a defect detection unit 500 for detecting whether the good quality of the recycled IC tray 210 and whether or not by comparing the measurement result transmitted from the measurement result transmitted from the 400) To provide.

The present invention, the tray carrying unit 100 for loading, supplying and transporting the recycled IC tray 210, the camera unit 400, the camera unit 400 for measuring the upper and lower surfaces, side surfaces of the recycled IC tray 210 Recycling IC tray defect detection automation vision, characterized in that it comprises a defect detection unit 500 for detecting whether the good or bad product of the recycle IC tray 210 by comparing the measurement result transmitted from the measurement result transmitted from the pre-input By providing a system, it is intended to solve the above technical problem.

According to the present invention, the tray carrying unit 100 includes a tray loading unit 200 and a tray transfer unit 300 for loading and supplying the recycled IC tray 210, and the tray transfer unit 300 includes a recycled IC tray ( A tray transfer module and a tray reversal module 340 for transporting the 210, the tray reversing module 340 is a recycling IC tray failure detection automation vision system, characterized in that to reverse the top and bottom of the recycle IC tray 210 By providing a, to solve the above technical problem.

According to the present invention, the tray reversing module 340 has a fixed blade 343 located at both sides of the tray rotating part 342, and a tray mounting part 341 is positioned at each end of the fixed blade 343. By providing a recycling IC tray failure detection automated vision system, it is intended to solve the above technical problem.

According to the present invention, the defect detection unit 500 uses the measurement result transmitted from the camera unit 400 to recycle the IC, the appearance of the recycling IC tray 210, the shape of the recycling, characterized in that the contamination IC, characterized in that broken or not By providing a tray failure detection automated vision system, it is intended to solve the above technical problem.

According to the present invention, the defective detection unit 500 measures the bottom surface and the side surface of the recycled IC tray 210 which has been determined to be good quality after measuring the top surface of the camera unit 400, and then detecting the recycled IC tray. By providing a defect detection automated vision system, to solve the above technical problem.

The present invention, the tray carrying unit 100 for loading, supplying and transporting the recycled IC tray 210, the camera unit 400, the camera unit 400 for measuring the upper and lower surfaces, side surfaces of the recycled IC tray 210 Recycling IC tray defect detection automation vision, characterized in that it comprises a defect detection unit 500 for detecting whether the good or bad product of the recycle IC tray 210 by comparing the measurement result transmitted from the measurement result transmitted from the pre-input It has a significant effect on providing the system.

1 is a block diagram showing a conventional inspection and sorting facility for a wafer level semiconductor device.
2 is a view schematically showing the main configuration of the recycling IC tray failure detection automated vision system according to an embodiment of the present invention.
3 is a view schematically illustrating a flowchart of a recycling IC tray failure detection automation vision system according to an exemplary embodiment of the present invention.
4 is a diagram schematically illustrating a configuration of a recycling IC tray failure detection automated vision system according to an exemplary embodiment of the present invention.
FIG. 5 is a view schematically illustrating an IC tray used in a recycling IC tray failure detection automated vision system according to an exemplary embodiment of the present invention.
FIG. 6 is a diagram schematically illustrating a loading assembly diagram of an IC tray used in a recycling IC tray failure detection automated vision system according to an exemplary embodiment of the present invention.
7 is a diagram schematically illustrating a tray reversal module of a recycling IC tray failure detection automated vision system according to an exemplary embodiment of the present invention.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms and the inventor may properly define the concept of the term in order to best describe its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention and are not intended to represent all of the technical ideas of the present invention. Therefore, various equivalents It should be understood that water and variations may be present.

Before describing the present invention with reference to the accompanying drawings, it should be noted that the present invention is not described or specifically described with respect to a known configuration that can be easily added by a person skilled in the art, Let the sound be revealed.

2 is a view schematically showing the main configuration of the recycling IC tray failure detection automated vision system according to an embodiment of the present invention.

Recycling IC tray failure detection automation vision system according to an embodiment of the present invention measures the data by using the recycling IC tray 210, the camera unit 400, and transmits the measured data to the failure detection unit 500 failure detection unit Each defect data is analyzed at 500, and a system for detecting and classifying defective IC trays to automatically sort good and defective products.

The camera unit 400 used in the embodiment of the present invention is an AOI (Automatic Optical Inspection) inspector which is one type of vision inspector.

In general, a vision inspector is used to classify objects using image processing, and is widely used in a quality inspection process for checking a soldering state of a printed circuit board, a short state of a lead wire, and whether or not a wire is connected.

The AOI (Automatic Optical Inspection) inspector used in the embodiment of the present invention is a mechanized work of appearance inspection of parts by an image by applying image processing technology. It is used.

3 is a flowchart of a recycling IC tray failure detection automated vision system according to an exemplary embodiment of the present invention, and FIG. 4 is a diagram schematically illustrating a configuration.

The operation sequence of the recycling IC tray failure detection automation vision system according to the embodiment of the present invention will be briefly described as follows.

The IC tray 210 is supplied from the tray supply module 220 to the roller system 1 310a. When the IC tray 210 moves along the roller system 1 310a and the IC tray 210 enters the measurement range of the upper surface measuring module 410, the upper surface measuring module 410 measures the upper surface of the IC tray 210. The measurement result is transmitted to the failure detection unit 500.

The defect detection unit 500 determines the bending shape, the contamination state, and the brokenness of the transmitted upper surface measurement result, and transfers the IC tray, which is determined to be good, along the roller system 1 310a, and the IC tray, which is determined to be defective, to be defective. Transfer to the defective tray stack module 240 through the conveyor (320).

The IC tray whose upper surface is determined to be good is supplied to the roller system 2 310b with the upper and lower surfaces reversed by the tray reversing module 340. The IC tray 210 moves along the roller system 2 310b, and when the IC tray 210 enters the measurement range of the lower surface measurement module 420, the measurement module 420 measures the lower surface of the IC tray 210. The measurement result is transmitted to the failure detection unit 500.

The defect detection unit 500 determines the curved shape, the contamination state, and the brokenness of the transmitted lower surface measurement result, and transfers the tray determined as good quality along the roller system 2 310b, and the IC tray determined to be defective is a bad transport conveyor. Transfer to the defective tray stacking module 240 through the (320).

The upper and lower IC trays determined by the upper and lower measurement modules 410 and lower surface measurement module 420 are moved along the roller system 2 310b as they are, and the IC tray 210 of the side measurement module 430 Once in the measurement range, the side measurement module 430 distinguishes between good and bad products in the same way as the top and bottom measurement modules.

At this time, the failure detection unit 500 determines the contamination state and the broken state of the side to distinguish between good and bad.

Finally, the upper and lower surfaces, the IC tray side is determined to be good moves to the good tray stacking module 230 along the roller system 2 (310b).

Recycling IC tray defect detection automation vision system can be arranged in a line according to the work space or in parallel in a U-shape.

The recycling IC tray failure detection automation vision system according to an embodiment of the present invention will be described below on the assumption that they are arranged in parallel in a U-shape.

In addition, hereinafter, the recycling IC tray will be referred to as a tray.

Recycling IC tray failure detection automated vision system according to an embodiment of the present invention includes a tray carrying unit 100, the camera unit 400, the failure detection unit 500.

The tray carrying unit 100 performs a function of stacking and transporting a tray, and includes a tray stacking unit 200 and a tray transferring unit 300.

FIG. 5 is a schematic view showing a stacking assembly of the tray 210 used in the embodiment of the present invention, and FIG. 6 is a tray 210 used in the embodiment of the present invention.

The tray stacking unit 200 performs a function of stacking and supplying a tray and includes a tray 210, a tray supply module 220, a good tray stacking module 230, and a defective tray stacking module 240.

The tray 210 is a raw material for semiconductor packing designed and manufactured to protect the IC chip from external impact or high temperature.

The tray 210 used in the embodiment of the present invention is used for recycling and has a size of 318 x 135 x 7mm (width x height x height) and consists of 12 rows and 25 columns, so that a total of 300 IC chips can be stored. .

Preferably, the loading connection jaw 211 is located on the upper surface of the tray 210, the loading connection groove 212 is located on the lower surface.

Trays can be stacked and stacked on top of each other by using the loading connection jaw 211 and the loading connection groove 212. The loading connection jaw 211 of the upper tray located at the bottom of the stacked trays and the lower surface of the tray The stack connection grooves 112 are fitted to each other and stacked.

The tray supply module 220 supplies the rollers 210 loaded to the roller system 1 310a one by one to receive the defect detection.

Preferably, the picker is located on the upper part of the tray supply module 220, and the tray 210 loaded with the picker is sequentially picked up from above and supplied to the roller system 1 310a.

Depending on the design conditions, one picker of the tray supply module 220 may be used, and in some cases, one or more pickers may be used to reduce the overall process time by narrowing the gap for supplying the tray. .

In addition, the tray supply module 220 may exclude the tray supply module 220 from the automated process by directly supplying the tray 210 to the roller system 1 310a without using a picker.

The non-defective tray stacking module 230 performs a function of stacking a tray determined to be good for all defective detection results.

Preferably, the tray determined to be good as a result of all defect detection is moved to the good tray stacking module 230 through the roller system 2 310b.

Pickers are placed on the upper side of the non-defective tray stacking module 230 to pick up the trays 210 which are moved to the non-defective tray stacking module 230 in order, and stack them up.

When a certain quantity of good quality trays are stacked, the worker puts them in a packing box.

According to the design conditions, the non-defective tray stacking module 230 may exclude the non-defective tray stacking module 230 from the automated process by directly loading the non-defective tray into the packaging box without using a picker.

In addition, depending on the design conditions, by applying an automatic packaging system instead of the good quality tray loading module 230, can be applied to pack the good quality trays separately one by one or put in a predetermined quantity in a box.

The defective product tray loading module 240 performs a function of loading a tray determined as a defective product as a result of the defective detection.

Preferably, the tray determined to be a defective product as a result of the defective detection is moved to the defective tray stack module 240 through the defective conveying conveyor (320).

Pickers are placed on the top of the defective tray stacking module 240 to pick up the trays 210 which are moved to the defective tray stacking module 240, and stack them up.

When a certain quantity of defective trays accumulate, the operator puts them in a box.

According to design conditions, the defective tray stacking module 240 may exclude the defective tray stacking module 240 from the automated process by directly stacking the defective trays in a box without using a picker.

The tray transfer unit 300 includes a tray transfer module and a tray reversal module 340 as a means for transferring the tray 210.

The tray transport module includes a roller system 310, a poor transport conveyor 320, and a transport cylinder 330.

The roller system 310 performs a function of transporting a tray for receiving a defect detection by mounting a belt between the roller and the roller, and includes roller systems 1 and 2 310a and 310b.

The roller system 1 310a measures the tray and the upper surface supplied to receive the defect detection, and then transfers the tray which has been judged good quality, and the roller system 2 310b measures the upper surface and then the tray and the lower surface which have been judged good quality. After measuring the sides, transfer the tray that has been judged good.

Depending on the design conditions, the roller system 310 may be installed separately into a number of parts to operate all the parts at once, but to be able to stop and transport, respectively, in case of a sudden situation.

In addition, it is a matter of course that a plurality of rollers can be arranged in a narrow gap without installing a belt between the rollers and the rollers.

Preferably, guides 311 are positioned on both sides of roller systems 1 and 2 310a and 310b to prevent tray 210 from escaping from roller system 310.

The guide 311 is manufactured in consideration of the size of the tray 210, and the tray 210 of the tray mounting portion 341 is formed by equalizing the dimensions of the guide 311 and the tray loading portion of the tray mounting portion 341. To be introduced without difficulty.

Depending on the design conditions, the guide 311 may be fixed and can be adjusted to fit the tray 210 size.

The defective conveying conveyor 320 performs a function of transferring the tray, which has been determined as defective in the defective detection, to the defective tray loading module 240.

Preferably, the defective conveying conveyor 320 is located side by side with the roller systems 1 and 2 310a and 310b and located outside the roller systems 1 and 2 310a and 310b, respectively.

The defective conveying conveyor 320 widens the width so that the tray can be conveyed to the defective tray loading module 240 without being separated.

The conveying cylinder 330 performs a function of transferring the tray, which has been determined as defective in the defect detection, from the roller system 310 to the defective conveying conveyor 320.

Preferably, the transfer cylinder 330 is located between roller systems 1 and 2 310a and 310b so that the piston inside the cylinder allows the piston to move to both sides of the cylinder, respectively.

When it is determined that the tray measured by the camera unit 400 is a defective product by the defect detecting unit 500, the defect detecting unit 500 operates the transfer cylinder 330.

When the conveying cylinder 330 is operated, a piston inside the conveying cylinder pops out and pushes the tray 210 to transfer the tray 310 from the roller system 310 to the defective conveying conveyor 320.

7 is a view schematically showing a tray inversion module 340 according to an embodiment of the present invention.

The tray inversion module 340 inverts the top and bottom of the tray 210 and includes a picker, a tray mounting part 341, a tray rotating part 342, and a fixed blade 343.

Recycling IC tray failure detection automated vision system according to an embodiment of the present invention to measure the upper surface of the tray 210, and then to measure the bottom and side only for the tray that was determined to be good.

Accordingly, the tray 210 having the upper surface determined to be good is to be inverted in order to measure the lower surface, and the tray inverting module 340 performs the function.

The tray reversing module 340 has fixed blades 343 positioned on both sides of the tray rotating unit 342, and tray mounting portions 341 are positioned at each end of the fixed blades 343. The picker is positioned on the tray reversing module 340.

The picker is positioned above the tray inversion module 340 to perform the function of coupling and detaching the tray mounting unit 341.

Preferably, the picker is positioned on top of the tray mounts 1, 2 (341a, 341b) and 3, 4 (341c, 341d), respectively, and moves up and down.

The tray mounting part 341 is composed of tray mounting parts 1 and 2 (341a and 341b) and tray mounting parts 3 and 4 (341c and 341d). Four (341d) and up and down respectively combine to form a mounting portion to secure the tray.

Tray mounts 1 and 2 341a and 341b are colinear with roller system 1 310a and tray mounts 3 and 4 341c and 341d are colinear with roller system 2 310b.

Preferably, the fixing blade assembly groove 344 is located in the middle of the surface of the tray mounting portion 1 (341a) and 2 (341b) is coupled to the fixing blade 343 to be assembled.

The fixed blade 343 is assembled into the fixed blade assembly groove 344, and the tray mounting portion 1 341a and the tray mounting portion 2 341b are assembled to the bottom of the fixed blade 343.

That is, the tray mounting parts 1 341a and 2 341b may be separated from each other or may be combined with respect to the stator blade 343.

The picker groove 345 is located at the opposite side of the fixed wing assembly groove 344. The picker located at the top of the tray reversing module 340 using the picker groove 345 has tray mounting portions 1, 2 (341a, 341b). To move up and down.

In addition, one surface of the tray mounting portion 341 is blocked and the other surface is open to allow the tray 210 to enter the tray mounting portion 341 from the roller system 310. The cylinder groove 346 is located at the center of the blocked surface.

The tray mounting parts 3 and 4 341c and 341d have the same structure as the tray mounting parts 1 and 2 341a and 341b.

The tray rotating unit 342 rotates the tray mounting units 1 and 2 341a and 341b connected to the rotary blades 360 degrees at 180 degree intervals.

Preferably, the tray rotating part 342 is located in the middle of the tray reversing module 340 and the rotary blade and the tray mounting part having the same dimensions and structure on both sides from the tray rotating part 342.

In this case, the distance from the center of the tray rotating part 342 to the tray mounting part 341 is equal to 1/2 of the distance from the roller system 1 310a to the roller system 2 310b.

That is, the distance between the tray mounts 1 and 2 (341a and 341b) and the tray mounts 3 and 4 (341c and 341d) should match the distance from the roller system 1 (310a) to the roller system 2 (310b) in the middle of the distance. The tray rotating part 342 is located.

The order in which the tray is inverted by the tray inversion module 340 is as follows.

The pickers located on the upper sides of the tray mounts 1 and 2 341a and 341b descend to raise the tray mount 2341b.

After measuring the upper surface, the tray having been judged good quality is transferred by the roller system 1 310a and flows into the tray mounting part 341a.

When the tray 210 stops due to the blocked surface of the tray mounting part 1 341a, the picker descends to engage the tray mounting part 341b with the tray mounting part 341a to fix the tray 210, and then move up again.

The tray mounting unit 341 together with the fixed tray is rotated 180 degrees by the tray rotating unit 342 to reverse the positions of the upper and lower surfaces of the tray 210.

At this time, the positions of the tray mounting parts 1 and 2 341a and 341b and the tray mounting parts 3 and 4 341c and 341d are changed.

The tray mounting portions 3, 4 341c and 341d that have been changed positions secure the trays in the same order as the tray mounting portions 1 and 2 341a and 341b.

On the other hand, the tray mounts 1 and 2 341a and 341b lower the pickers located above the original tray mounts 3 and 4 341c and 341d, and lift the tray mounts 134a up.

The tray 210 is then transferred to roller system 2 310b by pushing the tray with the cylinder reversed through the cylinder groove 346 located on the blocked surface of tray mount 2 341b.

When the tray 210 is separated from the tray mount 2 341b and transferred to the roller system 2 310b, the tray mount 1 341a is lowered and fixed with the tray mount 2 341b.

The fixed tray mounting part 341 is rotated 180 degrees by the tray rotating part 342 to return to its original position while the inside is empty.

Tray mounts 3 and 4 341c and 341d transfer tray 210 to roller system 2 310b in the same order as tray mounts 1 and 2 341a and 341b.

As described above, the tray 210 is continuously inverted by using the tray mounting parts 1 and 2 341a and 341b and the tray mounting parts 3 and 4 341c and 341d.

The camera unit 400 performs a function of measuring the appearance of the tray 210 and includes a top measurement module 410, a bottom measurement module 420, and a side measurement module 430.

The upper surface measurement module 410 measures the upper surface of the tray 210 and is located above the roller system 1 310a.

Preferably, when the tray 210 is transported by the roller system 1 310a to enter the measurement area of the upper surface measuring module 410, the upper surface measuring module 410 starts measuring.

The measurement is performed for each row of the tray 210 in the order of entry, and when the measurement is completed, the measurement result is automatically transmitted to the failure detection unit 500.

The lower surface measurement module 420 measures a lower surface of the tray 210 and is located above the roller system 2 310b.

Preferably, when the tray, which has been judged good by the upper surface measuring module 410, is transferred by the roller system 2 310b after the upper and lower sides are inverted, and enters the measuring area of the lower surface measuring module 420, the lower surface measuring module 420 ) Starts the measurement.

The measurement is performed for each row of the tray 210 in the order of entry, and when the measurement is completed, the measurement result is automatically transmitted to the failure detection unit 500.

The side measurement module 430 measures the both sides of the tray and is located on both sides of the roller system 2, respectively.

Preferably, when the tray having received the good product determination by the measuring module 420 is transferred to enter the measuring area of the side measuring module 430, the side measuring module 430 starts measuring the side of the tray 210 and the measurement is performed. When finished, the measurement result is automatically transmitted to the defect detection unit 500.

According to the design conditions, the side measurement module 430 may use a different type of tester than the tester used in the upper surface measurement module 410 and the lower surface measurement module 420.

The defect detection unit 500 compares the measurement result transmitted from the camera unit 400 with a measurement result of a previously inputted good product, and analyzes whether the good or defective product is in the tray 210 and determines whether the tray 210 is good or poor according to the result. It performs the function of classifying defective products and includes a bend shape determination module, a contamination determination module, a fracture determination module, and a transfer control unit.

The bending form determination module performs a function of determining an appearance bending form of the tray 210.

The tray 210 is composed of various types of patterns and materials according to the purpose of use, and has a complex pattern structure composed of several rows and columns to store semiconductor devices for each tray. It is not easy to visually determine whether such a complicated pattern of structure is defective.

Preferably, the bending form determination module determines whether the tray 210 has a complicated pattern by determining whether the tray 210 is curved.

According to the design conditions, the bending form determination module includes a DB in which the result of measuring the bending form of the good-quality tray according to the type of the tray 210 is stored.

The bend shape determination module detects whether the bend shape of the tray 210 is inferior by comparing the result of measuring the good quality tray stored in the DB with the result measured by the camera unit 400.

The contamination determination module performs a function of determining whether there is a contaminant such as ink on the exterior of the tray 210.

Preferably, the contamination determination module determines whether the pollutant on the appearance of the tray 210 by distinguishing the contrast of the tray 210.

According to the design condition, the contamination determination module includes a DB storing the result of measuring the clean appearance without contaminants in the good tray.

The contamination determination module detects the contamination of the tray 210 by comparing the result of measuring the appearance of the clean state stored in the DB with the result measured by the camera unit 400.

The crack determination module performs a function of determining whether a crack such as a crack of the tray 210.

Preferably, the broken determination module includes a DB storing the result of measuring the appearance of the good quality tray and the broken determination module is a result of measuring the appearance of the good quality tray stored in the DB and the result measured by the camera unit 400 Compared to detect whether the tray 210 is broken.

Depending on the design conditions, whether the contamination determination module and whether or not broken determination module may use a single DB or include each DB.

The transfer control unit performs a function of dividing the tray into good and bad according to the result determined by the bending type determination module, the contamination determination module and the fracture determination module.

Preferably, the tray determined to be good in the bending shape determination module, the contamination determination module and the fracture determination module continues to move along the roller system 310.

The tray determined to be defective is operated by the transfer cylinder 330 to be transferred from the roller system 310 to the defective conveying conveyor 320 so as to be loaded on the defective tray loading module 240.

In addition, what was described using FIG. 2 thru | or FIG. 7 above only described the main matter of this invention, and as long as various designs are possible within the technical scope, this invention is not limited to the structure and function of FIG. It is obvious that it is not limited.

100: tray carrying section
200: tray loading section
210: recycled IC tray
211: loading joint
212: loading connection groove
220: tray feed module
230: good quality tray loading module
240: defective tray loading module
300: tray transfer unit
310: roller system
310a: roller system 1
310b: roller system 2
311: Guide
320: defective conveying conveyor
330: return cylinder
340: tray inversion module
341: tray mount
341a: Tray Mount 1
341b: Tray Mount 2
341c: Tray Mount 3
341d: Tray Mount 4
342: tray rotation part
343: fixed wing
344: fixed wing assembly groove
345: Picker Home
346: cylinder groove
400:
410: upper surface measuring module
420: lower surface measurement module
430: side measuring module
500: failure detection unit

Claims (5)

A tray carrying unit 100 for loading, supplying and transporting the recycled IC tray 210;
A camera unit 400 measuring upper and lower surfaces and side surfaces of the recycle IC tray 210;
It includes; a defect detection unit 500 for detecting whether the good quality of the recycling IC tray 210 and whether the defective by comparing the measurement result transmitted from the camera unit 400 and the measurement result of the input good in advance;
The tray carrying unit 100 includes a tray loading unit 200 and a tray transfer unit 300 for loading and supplying the recycled IC tray 210,
The tray transfer unit 300 includes a tray transfer module and a tray reversal module 340 for transferring the recycle IC tray 210,
The tray reversing module 340 is a recycling IC tray defect detection automation vision system characterized in that the up and down of the recycle IC tray 210
delete The method of claim 1,
The tray reversing module 340 is a defective recycling IC tray, characterized in that the fixed blades 343 are located on both sides of the tray rotating part 342 and the tray mounting portion 341 is located at each end of the fixed blades 343. Detection Automation Vision System
The method of claim 1,
The defect detection unit 500 detects the bent shape, contamination, and cracks of the exterior of the recycled IC tray 210 by using the measurement result transmitted from the camera unit 400. Vision system
The method of claim 1,
The defect detection unit 500 measures the upper surface and the lower surface and the side of the recycled IC tray 210 that has been determined to be good quality after measuring the upper surface of the camera unit 400. system

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