KR20130111379A - Scribing wheel, scribe apparatus, scribe method, method of manufacturing display panel and disply panel - Google Patents

Abstract

PURPOSE: A scribing wheel, a scribing apparatus having the same, a scribing method using the same, a method for manufacturing a display panel using the same, and the display panel are provided to apply a load on the same rotating on the surface of a brittle material substrate, thereby forming a scribe line. CONSTITUTION: A scribing wheel includes a disc, a ridge, blades, and multiple grooves. The ridge and the blades are formed along the circumferential part of the disc. The blades are formed with inclined surfaces at both sides of the ridge. The grooves are formed at the ridge. The depth of the groove is above 2 um. In a lateral direction, the width of the groove is below 35 um, and is below 3.2 times the depth of the groove. The width of the groove is above twice the depth of the groove. [Reference numerals] (AA) Cut area (N); (BB) Line width LW (Min+1N) (μm); (CC) Line width LW (10N) (μm); (DD) Line width LW (15N) (μm); (EE) Crack (Min+1N) (μm); (FF) Crack (10N) (μm); (GG) Crack (15N) (μm); (HH) Example 1; (II) Example 2; (JJ) Example 3; (KK) Example 4; (LL) Example 5; (MM) Example 6; (NN) Example 7; (OO) Example 8

Description

Scribing wheel, scribing device, scribing method, manufacturing method of display panel and display panel {SCRIBING WHEEL, SCRIBE APPARATUS, SCRIBE METHOD, METHOD OF MANUFACTURING DISPLAY PANEL AND DISPLY PANEL}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a scribing wheel, a scribing apparatus, a scribing method of a brittle material substrate, a manufacturing method of a display panel, and a display panel when forming a scribing line on the surface of a brittle material substrate. A scribing wheel having a plurality of grooves formed on a ridge of the wheel, a scribing apparatus using the scribing wheel having such grooves, a scribing method, a manufacturing method of a display panel, and a display panel.

When dividing a glass substrate in manufacture of a liquid crystal panel etc., a scribing apparatus is generally used and a crack is formed in the direction orthogonal to a board | substrate plane by the scribing wheel of this scribing apparatus.

As such a scribing wheel, it is generally known that a disk made of cemented carbide or sintered diamond is polished from both sides along the outer circumferential surface to form a blade having an approximately V-shaped cross section on the outer circumference, and a ridgeline forming a blade edge is formed. .

On the other hand, as described in Patent Literature 1, a grooved scribing wheel capable of forming deeper cracks by forming grooves at regular intervals on the ridgeline serving as the blade edge is also known.

In the scribing wheel in which the groove is formed, the blade tip portion intermittently touches the substrate by alternately approaching the protruding blade tip portion and the groove portion on the substrate. As a result, a scribe line is formed on the surface of the substrate while giving a spot impact to the substrate, so that the depth of the vertical crack extending along the scribe line is the depth of the crack formed by the above-described grooved scribing wheel. Much deeper than In addition, the scribe line refers to the mark of the scribe formed on the surface of the brittle material substrate, and includes a plastic deformation portion that the scribing wheel imparts to the brittle material substrate, or minute cracks generated in the horizontal direction on the substrate surface. It is.

In addition, according to the scribing wheel provided with grooves, the pressure contact load is concentrated on the blade tip, and the depth of the vertical crack is further deepened by this, so that the scribing wheel has higher permeability than the scribing wheel without grooves. .

Japanese Patent No. 3074143

The glass substrate was divided using a groove-shaped scribing wheel having a high permeability as described above using a variety of groove depths and groove widths (length in the ridge extension direction). In dividing a brittle material substrate, such as a glass substrate, it turned out that the relationship of the groove depth and the groove width is important.

In other words, if the width of the groove is too large with respect to the depth of the groove, the edge angle of the blade edge portion between the groove and the groove becomes too obtuse, resulting in poor permeability (permeability) to the brittle material substrate. Moreover, when scribing using a scribing wheel with a groove | channel, the glass piece corresponding to the shape of the groove part will peel from a glass substrate with time after scribing, and it will become a comparatively large cullet. Depending on the shape of the groove and the size of the scribing wheel, when the vertical cracks are formed on the brittle material substrate, the glass pieces are likely to peel off and the curls are easily generated. It will have a bad influence in the division process or the process after a division process.

In addition, while the grooved scribing wheel can form deep vertical cracks by the impact of the spot, minute cracks also occur in the horizontal direction. There is a tendency for the line width to widen.

Since the scribe line formed by the scribing wheel usually remains on the end surface of the substrate even after the brittle material substrate is divided, various problems may occur when the line width of the scribe line becomes wider. There is.

For example, narrower frames are desired for display panels, such as liquid crystal panels used in display devices, for the purpose of miniaturization, design improvement, realization of a super large panel connecting a plurality of panels, and the like. Even if the scribe lines remain in the frame area, there is no problem if there is sufficient margin in the width of the frame area. However, if narrow frame formation progresses and the width of the frame area becomes insufficient, the display panel is assembled using the display panel and then displayed. There is a problem that a scribe line becomes visible from an outer frame of the device.

Further, the glass fragments are peeled off from the scribe lines remaining on the surface of the substrate, causing the glass fragments to adhere to the substrate surface or to damage the wiring of the display panel.

Then, the scribing wheel on which the grooves with high permeability were formed was divided into glass substrates by using various ones of the groove depth and the groove width (the length of the groove in the extension direction of the ridge line). As for the line width of the scribe line, it has been found that the relationship between the groove depth and the groove width is important.

In other words, when the width of the groove is too large with respect to the depth of the groove, not only the vertical crack is extended but also the crack is greatly extended in the horizontal direction, and the line width of the scribe line is expanded.

Therefore, the present inventors have made various studies to solve this problem. As a result, in the scribing wheel in which a plurality of grooves are formed in the ridgeline, the width of the grooves is set in a predetermined range with respect to the depth of the grooves. In addition to being able to resolve, the present invention has been completed.

That is, this invention makes it a subject to solve the said problem, and manufactures the grooved scribing wheel, the scribing apparatus, the scribing method, the display panel which have the high permeability which is optimal for dividing a brittle material board | substrate. It is an object to provide a method and a display panel.

In order to achieve the said objective, the scribing wheel which concerns on one form of this invention has the blade which consists of a ridgeline and the inclined surface of both sides of the said ridgeline along the circumference of a disc, and the said ridgeline is provided with some groove | channel. It is a scribing wheel, The groove has a depth of 2㎛ or more, the width of the groove in the side view direction is 35㎛ or less, characterized in that 3.2 times or less of the depth of the groove.

Such a scribing wheel can form a deep crack in a brittle material substrate with a small cutting load, and can suppress generation | occurrence | production of the cullet resulting from the groove | channel of a scribing wheel. Moreover, such a scribing wheel can suppress the expansion of the line width of the scribe line formed in the surface of a brittle material substrate.

The scribing apparatus which concerns on another form of this invention is a scribing wheel which has the blade which consists of a ridgeline and the inclined surface of both sides of the said ridgeline along the circumference of a disc, and the said ridgeline was provided with the some groove | channel, Holder for holding a scribing wheel rotatably holding a scribing wheel having a depth of 2 µm or more and a width of the groove in the side view direction of 35 µm or less and 3.2 times or less of the depth of the groove. And a scribe head mounted with the holder.

Such a scribing device can form a deep crack in a brittle material substrate with a small cutting load, and can suppress generation | occurrence | production of the cullet resulting from the groove | channel of a scribing wheel, and therefore high permeability which is optimal for parting a brittle material board | substrate. It is equipped with. In addition, such a scribe device can suppress the expansion of the line width of the scribe line formed on the surface of the brittle material substrate.

A scribing method according to another aspect of the present invention is a scribing method of a brittle material substrate in which a scribing line is formed on a brittle material substrate by using a scribing wheel, and as a scribing wheel, along the circumference of the disc, And a blade formed of inclined surfaces on both sides of the ridgeline, a plurality of grooves are formed in the ridgeline, the groove has a depth of 2 μm or more, and the width of the groove in the side view direction is 35 μm or less. A scribe line is formed while rotating on the surface of the brittle material substrate by applying a load to the scribing wheel by using a 3.2 times or less of the depth of the groove.

Such a scribing method can form a deep crack in a brittle material substrate with a small cutting load, and can suppress generation | occurrence | production of the cullet resulting from the groove | channel of a scribing wheel. In addition, the scribe method of the brittle material substrate can suppress the expansion of the line width of the scribe line formed on the surface of the brittle material substrate.

The manufacturing method of the display panel which concerns on another form of this invention is a manufacturing method of the display panel using a scribing wheel, Comprising: As a scribing wheel, the ridgeline and the both sides of the said ridgeline are provided along the circumference of a disc. It has a blade made of an inclined surface, a plurality of grooves are formed in the ridge, the groove has a depth of 2㎛ or more, the width of the groove in the direction of the side view is 35㎛ or less 3.2 of the depth of the groove A scribe line is formed while applying a load to the scribing wheel to rotate the surface of the mother substrate using a thing less than twice, and the mother substrate is divided to obtain the display panel.

By the manufacturing method of such a display panel, expansion of the line width of a scribe line can be suppressed and the width | variety of the scribe line which remains in a board | substrate edge part can be made small.

A display panel according to another aspect of the present invention has a display region in which a plurality of pixels are formed, a frame region surrounding the display region, and a scribe mark is formed at an end of the frame region, and the width of the scribe mark is provided. It is characterized by being 15 micrometers or less.

Such a display panel can suppress the influence by the scribe line formed in the edge part of a frame area | region.

1 is a schematic diagram of a scribing apparatus according to an embodiment.
The front view of the holder joint which the scribe apparatus in embodiment has.
3 is a perspective view of a holder in the embodiment;
4 is a partially enlarged view of a holder in the embodiment;
Fig. 5A is a side view of the scribing wheel in the embodiment, Fig. 5B is a front view of the scribing wheel, and Fig. 5C is a partially enlarged view of the scribing wheel.
FIG. 6A is a plan view and an enlarged view of the mother substrate, FIG. 6B is a cross-sectional view of CC in FIG. 6A, and FIG. 6C is FIG. 6B. A cross section of a mother substrate.
7 is a cross-sectional view of a display device.
8 is a table relating to scribing wheels of Experimental Examples 1 to 8. FIG.
9 is a table relating to the scribe results of the scribing wheels of Experimental Examples 1 to 8. FIG.
10 is a graph of the line widths of the scribe lines formed by the scribing wheels of Experimental Examples 1 to 8. FIG.
11 is a photograph of a scribe line formed by using the scribing wheel of Experimental Example 1, Experimental Example 4, Experimental Example 6. FIG.
12 is a graph of crack lengths of scribe lines formed by the scribing wheels of Experimental Examples 1 to 8. FIG.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, embodiment shown below shows an example for actualizing the technical idea of this invention, and it does not intend to specify this invention to this embodiment. This invention is applicable also to the thing of other embodiment contained in a claim.

The schematic diagram of the scribe device 10 which concerns on embodiment is shown in FIG. The scribe device 10 is equipped with the movable base 11. And this movable base 11 is screwed with the ball screw 13, and this ball screw 13 rotates by the drive of the motor 14, and thus the pair of guide rails 12a and 12b are rotated. Along the y-axis.

The motor 15 is provided on the upper surface of the movable table 11. The motor 15 is for rotating the table 16 located on the upper side in the xy plane and positioning the table 16 at a predetermined angle. The brittle material substrate 17 is mounted on this table 16 and is held by vacuum suction means or the like not shown. The brittle material substrate 17 to be scribed is a brittle material substrate such as a glass substrate, a ceramic substrate, a sapphire substrate, or a silicon substrate.

The scribing apparatus 10 is equipped with two CCD cameras 18 which image the alignment mark formed in the surface of the brittle material board | substrate 17 above the brittle material board | substrate 17. As shown in FIG. And in the scribe apparatus 10, the bridge 19 is constructed by the support pillar 20a, 20b along the x-axis direction so that the movable base 11 and the table 16 of the upper part may be exceeded.

A guide 22 is attached to this bridge 19, and a scribe head 21 is provided to be movable along the guide 22 in the x-axis direction. And the holder 30 is attached to the scribe head 21 via the holder joint 23.

2 is a front view of the holder joint 23 to which the holder 30 is mounted. 3 is a perspective view of the holder 30. 4 is an enlarged view of a part of the side surface of the holder 30 observed from the direction A of FIG.

The holder joint 23 has a substantially cylindrical shape and includes a rotary shaft portion 23a and a joint portion 23b. In the state where the holder joint 23 is attached to the scribe head 21, two bearings 24a and 24b for rotatably holding the holder joint 23 are formed in the rotary shaft portion 23a in a cylindrical shape. It is attached via the spacer 24c. 2, the front view of the holder joint 23 is shown, and the cross section of the bearing 24a, 24b and the spacer 24c which were attached to the rotating shaft part 23a is shown together.

In the cylindrical joint part 23b, the internal space 26 provided with the circular opening 25 in the lower end part side is formed. A magnet 27 is embedded in the upper portion of the internal space 26. And the holder 30 detachable by the magnet 27 is inserted in this internal space 26, and is attached.

This holder 30 has a substantially cylindrical shape as shown in FIG. 3, and is formed of a magnetic metal. And the positioning mounting part 31 is provided in the upper part of the holder 30. As shown in FIG. The mounting portion 31 is formed by cutting the upper portion of the holder 30, and includes an inclined portion 31a and a flat portion 31b.

Then, the mounting portion 31 side of the holder 30 is inserted into the internal space 26 through the opening 25. At that time, the upper end side of the holder 30 is attracted by the magnet 27, and the inclined portion 31a of the mounting portion 31 comes into contact with the parallel pin 28 passing through the internal space 26, thereby obtaining the holder joint ( Positioning and fixing of the holder 30 with respect to 23) is performed. In addition, when removing the holder 30 from the holder joint 23, the holder 30 can be easily pulled out by pulling the holder 30 downward.

In the lower part of the holder 30, a holding groove 32 formed by cutting the holder 30 is formed. And the support part 33a, 33b is located in the lower part of the holder 30 cut | disconnected in order to form the holding | maintenance groove 32, with the holding groove 31 interposed. The scribing wheel 40 is rotatably arranged in this holding groove 32. In addition, support holes 33a and 33b are formed with support holes 34a and 34b for supporting pins 50 for freely holding the scribing wheel 40 when rotating.

As shown in FIG. 4, the pin 50 is allowed to pass through the pin hole 45 of the scribing wheel 40 and both ends of the pin 50 are provided in the support holes 34a and 34b. The scribing wheel 40 is rotatably mounted with respect to the holder 30. In addition, the support hole 34a has a stepped portion therein, and the hole diameter of the opening on the holding groove 32 side is larger than the hole diameter of the opening on the other side.

Next, the detail of the scribing wheel 40 is demonstrated. FIG. 5A is a side view of the scribing wheel 40, FIG. 5B is a front view of the scribing wheel 40, and FIG. 5C is a view of FIG. 5A. An enlarged view of the portion indicated by circle B. FIG.

The scribing wheel 40 mainly has a main body 41, a blade 42, a blade tip 43, and a groove 44.

The body portion 41 has a disk shape. In the vicinity of the center of the main body part 41, the through hole 45 which penetrates the main body part 41 along the rotating shaft is formed. The pin 50 is inserted in the through hole 45, and the scribing wheel 40 is rotatably held by the holder 30 via the pin 50. And the annular blade 42 is formed in the outer periphery of this main-body part 41. As shown in FIG.

The blade 42 is a toric member formed by concentric inner and outer peripheries about the rotational axis. In addition, the blade 42 has a substantially V-shape when viewed from the front, and the thickness of the blade 42 along the rotation axis gradually decreases toward the blade tip 43 serving as the ridge. In other words, the blade 42 is composed of inclined surfaces on both sides of the ridge serving as the blade edge 43. [

The blade tip 43 is provided along the outermost periphery of the blade 42. At the outermost peripheral portion of the blade 42, a blade tip 43 and a groove 44 are alternately formed. The groove 44 will be described later in detail.

The scribing wheel 40 is formed of a hard metal or sintered diamond. In addition, the scribing wheel 40 may use what coated the film | membrane of hard materials, such as a diamond, on the base materials, such as a cemented carbide.

For example, this sintered diamond scribing wheel 40 is made of a bonding phase composed mainly of diamond grains, the remainder of the additive and the binder. As for the average particle diameter of this diamond particle, the thing of 1.5 micrometers or less is used. The content of diamond in the sintered diamond is in the range of 75.0 to 90.0 vol%.

As the additive, for example, ultrafine carbides of at least one or more elements selected from tungsten, titanium, niobium and tantalum are suitably used. The content of the ultrafine carbides in the sintered diamond is in the range of 3.0 to 10.0 vol%, and the ultrafine carbides contain 1.0 to 4.0 vol% of titanium carbide and the remainder of tungsten carbide.

As a binder, an iron group element is used suitably normally. As an iron group element, cobalt, nickel, iron, etc. are mentioned, for example, cobalt is suitable among these. The content of the binder in the sintered diamond is preferably the remainder of the diamond and the ultrafine carbide, and more preferably in the range of 3.0 to 20.5 vol%.

Next, the manufacturing method of this scribing wheel 40 is demonstrated. First, the above-described diamond particles, additives, and binders are mixed to sinter these mixtures under high temperature and ultra high pressure at which the diamond is thermodynamically stable. Thereby, a sintered diamond is manufactured. At the time of this sintering, the pressure in the metal mold | die of an ultrahigh pressure generator is 5.0-8.0 kPa, and the temperature in metal mold | die is 1500-1900 degreeC.

Next, a disc having a desired radius is cut out from the manufactured sintered diamond. In the peripheral portion of the disc, an inclined surface is formed by cutting each of both sides, whereby a scribing wheel 40 having a V-shaped blade 42 in cross section is produced.

Then, a disk shaped grindstone is brought into contact with the blade tip 43 serving as the ridgeline of the scribing wheel 40 so as to be orthogonal to the blade tip 43, as shown in FIG. 5C. The groove 44 of the shape is formed. At this time, each time one groove 44 is formed, the grindstone is evacuated. Then, after the scribing wheel 40 is rotated by a rotation angle corresponding to a predetermined pitch, the next groove 44 is formed by further contacting the grindstone. In this manner, the blade tips 43 and the grooves 44 are alternately provided at equal pitches at the tips of the blades 42 of the scribing wheel 40.

Next, the dimension of this scribing wheel 40 is demonstrated. The outer diameter Dm of the scribing wheel 40 is 1.0-10.0 mm, Preferably it is 1.0-7.0 mm, Especially preferably, it is the range of 1.0-5.0 mm. When the outer diameter Dm of the scribing wheel 40 is smaller than 1.0 mm, the handleability of the scribing wheel 40 falls. On the other hand, when the outer diameter Dm of the scribing wheel 40 is larger than 10.0 mm, the vertical crack at the time of scribing may not be formed deep with respect to the brittle material board | substrate 17. FIG.

In addition, the thickness Th of the scribing wheel 40 is 0.4-1.2 mm, Preferably it is the range of 0.4-1.1 mm. When the thickness Th of the scribing wheel 40 is smaller than 0.4 mm, workability and handleability may fall. On the other hand, when the thickness Th of the scribing wheel 40 is larger than 1.2 mm, the cost for material and manufacturing of the scribing wheel 40 becomes high.

The blade tip angle θ1 of the blade 42 is usually an obtuse angle and is in the range of 90 ≦ θ1 ≦ 160 (deg), preferably 90 ≦ θ1 ≦ 140 (deg). In addition, the specific angle of the cutting edge angle θ1 is appropriately set from the material, thickness, and the like of the brittle material substrate 17 to be cut.

In addition, the groove 44 is formed so that the width L of the groove becomes 2.0 to 3.2 times the length with respect to the depth H of the groove. In addition, what is shown with the broken line in FIG.5 (c) is the line which showed the blade edge | tip 43 before forming the groove | channel 44 in the scribing wheel 40. As shown in FIG. The depth H of the groove is the distance deepest from this imaginary line. In addition, the width L of the groove is the length of an imaginary straight line connecting the ends of the groove. The width W of the ridge line is the length of the blade tip 43.

Here, the depth H of the groove is set according to the outer diameter of the scribing wheel 40 and the material, thickness, and the like of the brittle material substrate 17 to be cut. And the depth H of the groove is set in the range of 2.0-14 micrometers, Preferably it is the range of 3.0-11.0 micrometers, More preferably, it is the range of 5.0-11.0 micrometers. When the depth H of the groove is smaller than 2.0 µm, it becomes difficult to form deep vertical cracks in the brittle material substrate. In addition, when the depth H of the groove is larger than 14 µm, the volume of the groove increases, so that not only the crack in the vertical direction but also the crack extends in the horizontal direction, and the line width due to the scribe becomes wider. In addition, the crack in the horizontal direction is further extended with time, and the generation of a relatively large cullet is inevitable due to the joining of a plurality of horizontal cracks. In addition, since the length of the crack in the horizontal direction depends on the volume of the groove, the effect of increasing the width L of the groove to 2.0 to 3.2 times the depth H of the groove is particularly large when the depth H of the groove is 5.0 µm or more.

In addition, the width L of the groove is set in the range of 5.0 to 35 µm, and preferably in the range of 7.0 to 30 µm. When the width of the grooves exceeds 35 µm, the volume of the grooves is similarly increased, so that the width of the scribe line is widened and the occurrence of large cullets cannot be avoided.

Moreover, it is preferable that the width W of a ridgeline is 10-30 micrometers. If the width of the ridge line is smaller than 10 mu m, the load cannot be sufficiently transmitted to the substrate, and the vertical crack does not sufficiently penetrate. On the other hand, when the width of the ridge line is larger than 30 µm, horizontal cracks tend to occur.

In addition, the width L of the groove is preferably 1.0 to 3.2 times the length, and particularly preferably 1.0 to 1.8 times the width W of the ridgeline. If it is smaller than 1.0 times, the vertical crack is not sufficiently extended. On the other hand, if it is larger than 3.2 times, the width of the scribe line is wider and the cullets become larger.

In addition, the shape of the groove can take a variety of shapes such as U-shaped, V-shaped, trapezoidal shape as long as it satisfies the size of the depth of the groove and the width of the groove.

The blade tip 43 represented by the intersection angle of the tangent line from the groove side passing through the intersection x of the groove 44 and the blade tip 43 and the tangent from the blade tip side, indicated by θ2 in FIG. 5C. It is preferable that the edge angle θ2 of is in the range of 115 ≦ θ2 ≦ 135 (deg). This is because when the edge angle becomes too large, the penetration (penetration) to the brittle material substrate worsens. The angle (tangential intersection angle) θ3 at which two tangents passing through the intersection x of the groove 44 and the blade tip 43 in the groove 44 intersect is in the range of 60 ≦ θ3 ≦ 90 (deg). Is preferably.

Here, the effect by the line width LW of the scribe line formed in the surface of a brittle material substrate at the time of dividing a brittle material board | substrate using a scribing wheel is demonstrated using a specific example. FIG. 6A is a plan view and an enlarged view of a mother substrate which is a brittle material substrate, FIG. 6B is a cross-sectional view of CC in FIG. 6A, and FIG. 6C is FIG. 6. It is sectional drawing which divided the mother substrate in (b). 7 is a cross-sectional view of the display device.

A brittle material substrate in which a scribing line is formed on the surface of the substrate by a scribing wheel is a large glass substrate for manufacturing a display panel 60 such as a liquid crystal panel. This glass substrate is also called the mother substrate 70. Usually, using this mother substrate 70, the some display panel 60 is manufactured at once. In addition, the top view of the mother substrate shown to Fig.6 (a) is only a part rather than the whole mother substrate.

First, as shown in FIG. 6A, pixels and the like are formed on the mother substrate 70 for each display panel 60. Specifically, the display panel 60 is composed of a display region 61 and a frame region 62 around the display region 61, and the display region 61 is composed of a switching element, a color filter, or the like. A plurality of pixels to be formed are formed, and wirings, external connection terminals, and the like for transmitting various signals to each pixel of the display area 61 are formed in the frame region 62.

Next, as shown in FIGS. 6A and 6B, in the mother substrate 70 in which pixels and the like are formed for each of the display panels 60, the loads are arranged along the boundary of the display panel 60. Rotate and move the scribing wheel 40 is applied. As a result, a scribe line 71 is formed on the surface of the mother substrate 70. Moreover, this scribe line 71 consists of a plastic deformation area | region by the load of the scribing wheel 40 on the surface of the mother substrate 70, and a crack of a horizontal direction.

As shown in FIG. 6B, by forming the scribe line 71, the scribe line 71 is formed from the substantially center of the scribe line 71 in the vertical direction of the mother substrate 70 along the scribe line 71. Vertical crack 72 extends.

Next, by applying stress to the mother substrate 70 on which the scribe line 71 and the vertical crack 72 are formed, as shown in FIG. 6C, the mother substrate 70 is divided into panels. The display panel 60 is completed.

As shown in FIG. 7, the frame region 62 of the display panel 60 is covered with the frame-shaped outer frame 73, and a control board or the like not shown is connected to the display panel 60. The display device 74 is manufactured.

Here, when the line width LW of the scribe line 71 formed in the mother substrate 70 expands, there exists a possibility that the following problem may arise.

First, as shown in FIG. 6C, the scribe line 71 is divided into the display panel 60, and at about half the line width LW, the substrate of the display panel 60 is divided. It remains as a scribe mark 71a on the end surface. If the frame width a of the frame region 62 is sufficiently wide, there is no problem. However, if the frame width a is narrowed by narrowing the frame, the ratio of the scribe mark 71a to the frame width a increases. For this reason, even if the scribe mark 71a is completely covered by the outer frame 73 from the front direction, when the display device 74 is observed from the inclination direction, the scribe mark 71a is directly seen, or the scribe mark ( A diffuse reflection occurs in 71a), which may cause a problem that the scribe mark 71a becomes conspicuous.

In addition, in order to prevent the scribe mark 71a from being observed, when the frame width a is widened, a problem occurs such that the number of display panels 60 manufactured by the mother substrate 70 decreases. Moreover, when the width | variety of the outer frame 73 is made wide, problems, such as an increase in cost and the outer frame 73 overlapping with the display area 61, arise.

Further, even after the display device 74 is formed, if a large number of scribe marks 71a made up of the scribe lines 71 remain on the substrate end surface of the display panel 60, horizontal cracks are connected by vibration or the like. There is a possibility that a small piece of cullet is generated and the wiring and the like are damaged by the cullet. Therefore, when the scribe mark 71a remaining in the display panel 60 is completely removed, another process such as polishing is required, resulting in an increase in cost.

In addition, when the display panel 60 is manufactured by bonding two mother substrates 70 together like a liquid crystal panel, wiring and the like are rarely formed on the same surface as the surface on which the scribe lines 71 are formed. By the formation of the scribe line 71, there is little possibility that the wiring or the like is cut. However, if the mother substrate 70 to be used is one sheet, and the display panel 60 is configured such that wiring and the like are formed directly on the same surface as the surface of the mother substrate 70 on which the scribe lines 71 are formed. By the formation of the scribe line 71, there is a possibility that the wiring or the like is cut off.

The above problem can be solved by suppressing the enlargement of the line width LW of the scribe line 71 formed on the surface of the mother substrate 70 and making the line width LW as narrow as possible. Therefore, as a scribing method of suppressing the expansion of the line width of the scribe line, in the present embodiment, the depth H of the grooves 44 is 2 µm or more, the width L of the grooves 44 is 35 µm or less, and 3.2 of the depth H is 3.2. Using a scribing wheel 40 that is twice as large, a scribing method was performed in which a load was applied to the scribing wheel 40 to rotate on the surface of the brittle material substrate 17 to form a scribe line. By this scribing method, the expansion of the line width of the scribe line can be suppressed, and a scribe line having a narrow line width can be realized.

The concrete result which divided | segmented the brittle material board | substrate 17 by the scribing method of this embodiment is demonstrated. First, the scribing wheel 40 whose depth H of the groove 44 in the scribing method of this embodiment is 2 micrometers or more, the width L of the groove 44 is 35 micrometers or less, and becomes 3.2 times or less of the depth H. ), Three scribing wheels of Examples 1, 2 and 3 were used.

Specifically, the scribing wheel of Example 1,

Outer diameter Dm 2.0mm

Thickness Th 0.65mm

Edge angle θ1 115 °

Depth of groove H 10.7㎛

Width of groove L 28.0㎛

L / H 2.6

170 protrusions

to be.

In addition, the scribing wheel of Example 2,

Outer diameter Dm 2.0mm

Thickness Th 0.65mm

Edge angle θ1 115 °

Depth of groove H 9.3㎛

Width of groove L 26.0㎛

L / H 2.8

180 number of protrusions

to be.

In addition, the scribing wheel of Example 3,

Outer Diameter Dm 2.0mm

Thickness Th 0.65mm

Edge angle θ1 115 °

Depth of groove H 7.7㎛

Width of groove L 24.0㎛

L / H 3.1

190 bumps

to be.

Moreover, in order to compare with the scribing wheel of Example 1, 2, 3, the brittle material board | substrate 17 was also divided using the two scribing wheels of Comparative Example 1, 2.

The scribing wheel of Comparative Example 1,

Outer Diameter Dm 2.0mm

Thickness Th 0.65mm

Edge angle θ1 115 °

Depth of groove H 10.7㎛

Width of groove L 38.0㎛

L / H 3.6

135 turns

to be.

In addition, the scribing wheel of Comparative Example 2,

Outer diameter Dm 2.0mm

Thickness Th 0.65mm

Edge angle θ1 115 °

Depth of groove H 7.7㎛

Width of groove L 37.0㎛

L / H 4.8

140 number of protrusions

to be.

Thus, using 5 scribing wheels, the 0.7 mm-thick glass substrate was divided | segmented. And when the line width of the formed scribe line was observed, the line width of Example 1, 2, 3 was narrow compared with the comparative example 1, 2 in which the width | variety L of the groove | channel with respect to the depth H of the groove | channel is large. This is, for example, in the case of Example 1 and Comparative Example 1, in which the depth of the same groove is H, Comparative Example 1 having a wide groove has a crack in the horizontal direction (direction parallel to the glass substrate surface) at the time of scribing. This occurred, and it is thought that this crack was extended with time. As a result, the line width of the scribing wheel 1 of the comparative example 1 expanded, and the line width of the scribing wheel of Example 1 was suppressed on the contrary. In addition, with the extension of the crack in the horizontal direction, a glass piece (curlet) having a relatively large volume level of the groove was generated. Moreover, the same result was the case of Example 3 and Comparative Example 2 which are the depth H of the same groove | channel.

In the case of Example 1 and Comparative Example 1 having the same depth H of the grooves, in Comparative Example 1, in which the width L of the grooves is larger, a large amount of glass pieces (curlets) having a shape corresponding to the grooves are generated during scribing. Discarded. That is, with the extension of the crack in the horizontal direction, a cullet having a relatively large volume of the groove was generated. Curlets having a relatively large volume of grooves are difficult to remove when adhered to the glass substrate, and are likely to adversely affect (for example, the formation of scratches on the surface of the glass substrate) during the dividing step and subsequent steps. The occurrence of such cullets is undesirable. On the other hand, in Example 1 where the width | variety L of a groove | channel is small, a glass piece is hard to peel even after scribing. This is because a small width L of the groove is formed on the surface of the glass substrate corresponding to the ridge line corresponding to the projection, the broken line constituting the scribe line becomes long, and the ratio of the broken portion of the broken line corresponding to the groove decreases, thereby reducing the small scribe. It is considered that the formation of the scribe line by the load is possible, and as a result, it is possible to suppress the occurrence of stress such as peeling off the glass piece of the shape corresponding to the groove from the glass surface. In addition, since the width L of the groove is small, the size of the generated cullet is also smaller than that of Comparative Example 1, and the effect of the cullet is very low compared to Comparative Example 1. This result is the same also in Example 3 and Comparative Example 2 in which the groove depths are the same.

In addition, compared with Examples 1, 2, and 3, the comparative example 1, 2 in which the width | variety L of the groove | channel with respect to the depth H of the groove | channel was large tended to increase the load which a vertical crack needs to penetrate. For example, when dividing a 0.7 mm-thick glass substrate, the cutting load when 400 micrometers or more of vertical cracks were formed as the penetration amount which is the depth of a vertical crack was compared. Vertical cracks of 400 µm or more were generated at 7.5 kgf (⇒ 73.5 N), whereas vertical cracks of 400 µm or more were generated at 10 kgf (⇒98.0 N) of cutting load in Comparative Examples 1 and 2.

As a reason for this, when the width L of the groove becomes too large with respect to the depth H of the groove, the edge angle of the blade tip 43 represented by θ2 in FIG. 5C becomes large, and thus the brittleness against the brittle material substrate (permeability). It seems to be because) got bad. As described above, when the groove 44 is formed so that the width L of the groove becomes 3.2 times or less with respect to the depth H of the groove, the same amount of vertical cracks are formed on the brittle material substrate 17. The cutting load can be reduced. Therefore, since vertical cracks can be efficiently generated with a small cutting load, generation of cullets can be further reduced.

Next, the result of having divided the brittle material substrate 17 by the scribing method of this embodiment using the scribing wheel different from Example 1, 2, 3 is demonstrated. The used scribing wheel was that of Experimental Examples 1-8. In the scribing wheels of Experimental Examples 1 to 8, the outer diameter Dm was 2.0 mm, the thickness Th was 0.65 mm, and the blade tip angle θ1 was 100 °. 8 is a table | surface which described the other element of Experimental Examples 1-8. 8 shows the depth H of the grooves, the width L of the grooves, the width W of the ridgeline, the number of protrusions, L / H, and L / W of Experimental Examples 1 to 8.

As shown in FIG. 8, the scribing wheel whose width L of the groove | channel becomes 2.0-3.2 times the length of the groove | channel depth H is the scribing wheel of Experimental example 2-8, and the scribing of Experimental example 1 The wheel has an L / H of 3.8.

Then, using the scribing wheels of Experimental Examples 1 to 8, scribing was performed to apply a load to these scribing wheels to form scribe lines while rotating on the surface of the brittle material substrate. 9 is a table of scribe results using the scribing wheels of Experimental Examples 1 to 8. FIG. In FIG. 9, the cutting | disconnection area | region of the scribing wheel of Experimental example 1-8, the line width LW of the scribe line which produced the brittle material substrate, and the length of a crack are shown.

This cut | disconnected area | region means the load area | region which can form a favorable scribe line in cutting a brittle material board | substrate. This load area measures the minimum load on the basis of the occurrence of the rib-shaped string called a rib mark, and from this minimum load, the maximum load that cannot form a good scribe line due to an increase in horizontal cracks or cracks in the substrate. Measured up to. As shown in FIG. 9, the cutting region differs depending on the scribing wheels of Experimental Examples 1 to 8, and the scribing wheels of Experimental Examples 2 to 8 had lower minimum loads in the cutting region than in Experimental Example 1. FIG. .

In addition, as shown in FIG. 9, the load which formed the scribe line for the measurement of the line width LW is the load which added 1N to the minimum load Min of a cutting | disconnection area | region (thus, load differs for every scribing wheel), 10N It was three patterns of the load of and the load of 15N.

The line width LW is the maximum value of the crack in the horizontal direction formed on the surface of the brittle material substrate. And, at each of the three loads, the line width LW was measured. 10 is a graph of the measured line width LW. 11 is an actual photograph of the scribe line formed using the scribing wheel of Experimental Example 1, Experimental Example 4, and Experimental Example 6. FIG.

The length of the crack is the maximum value of the crack in the vertical direction generated on the brittle material substrate. The length of the crack was also measured at each of three loads. 12 is a graph of the measured crack length.

In addition, the other conditions at the time of scribing using the scribing wheel of Experimental example 1-8 are as follows.

Brittle material substrate: 0.7 mm glass substrate [single plate, blank glass]

Scribe device: scribe device (MS type) made by Mitsubishi Diamond Kogyo Kabu Shiki Kaisha

Scribing Speed: 300㎜ / sec

As shown in FIGS. 8-12, when scribe is performed using the scribing wheel (L / H 3.8) of Experimental example 1 whose L / H is not 3.2 or less, Experimental example 2-whose L / H is 3.2 or less Compared to the scribing wheel of 8, the line width is enlarged.

In particular, when dividing the glass substrate for panels, the line width LW of the scribe line is preferably up to about 30 µm. This means that if the line width LW is 30 µm, the scribe trace 71a by the scribe line 71 shown in Fig. 7 is about 15 µm. If the scribe trace 71a is about this level, the scribe trace is also narrowed. This is because problems such as visual confirmation of 71a are difficult to occur. In the scribing wheels of Experimental Examples 2 to 8, the line width LW is lowered in the lowering load (the load of Min + 1N or the load of 10N in FIG. 9), which is often set as the actual cutting load in the cutting region. It is about 30 micrometers, or it is much narrower than 30 micrometers.

In addition, as shown in FIG. 12, about the scribing wheel of Experimental example 2-8, there exists a penetration amount about 70 to 80% with respect to the thickness of a board | substrate, and especially the crack which is all 600 micrometers or more in the load of 10N. This occurs, and it turns out that it also has high permeability. Moreover, about Experimental example 2, 3, it is equipped with permeability similar to Experimental example 1, suppressing the expansion of a line width.

In addition, as shown in FIG. 8, about the relationship between the width | variety L of a groove | channel, and the width | variety W of a ridgeline, the L / W of the scribing wheel of Experimental example 1 is 3.3, and the scribing of Experimental examples 2-8 is As for the wheel, all L / W is 3.2 or less. As shown in FIG. 8 and FIG. 10, the L / W of the scribing wheel is more preferably 1.8 or less in order to suppress the expansion of the line width.

Thus, using the scribing wheel of Experimental example 2-8 whose groove depth H is 2 micrometers or more, groove width L is 35 micrometers or less, and L / H becomes 3.2 or less, By applying a load to rotate the surface of the brittle material substrate to form a scribe line, as in the scribing wheels of Examples 1, 2, and 3, vertical cracks can be efficiently generated with a small cutting load, thereby generating curls. Can be further reduced. The scribing wheel was loaded using the scribing wheels of Experimental Examples 2 to 8 in which the groove depth H was 2 µm or more, the groove width L was 35 µm or less and L / H became 3.2 or less. Is added to rotate on the surface of the brittle material substrate to form a scribe line, so that the expansion of the line width LW of the scribe line is suppressed with high permeability, similarly to the scribing wheels of Examples 1, 2 and 3. In this way, a scribe line having a narrow line width can be realized.

When the width L of the groove becomes too large with respect to the depth H of the groove, the edge angle of the blade tip 43 represented by θ2 in FIG. 5C becomes large, and thus the breakability (penetrability) of the brittle material substrate is increased. Because it gets worse. Therefore, as described above, by making the width L of the groove to be 3.2 times or less with respect to the depth H of the groove, the permeability to the brittle material substrate is improved, the extension of the crack in the horizontal direction is suppressed, and the vertical direction is efficiently Cracked the temple.

In addition, if the width L of the groove becomes too large, the interval between the blade tip 43 that is dug into the substrate first and the blade tip 43 that is dug into the substrate is widened, and a large cullet is generated at the location of the groove due to the spot impact. . Therefore, the crack in the horizontal direction is greatly extended at this time. On the other hand, as described above, by making the width L of the groove to be 3.2 times or less with respect to the depth H of the groove, the gap between the blade tip 43 and the blade tip 43 is also narrowed, and the cullets generated therein are also reduced, and the horizontal direction The crack in the vertical direction can be extended while the extension of the crack in the crack is suppressed.

On the other hand, when the width L of the groove with respect to the depth H of the groove | channel becomes smaller than Example 1, 2, 3, or Experimental Examples 2-8, a specific comparative example is not specifically described, For example, L / When H becomes 1.9, the cullet made of finer glass particles generated at the time of scribing enters the grooves, and the cullets are stored in the grooves every time the separation is performed, so that the penetration amount gradually decreases, which is not preferable.

Therefore, as in the present embodiment, the groove 44 of the scribing wheel 40 is formed so that the width of the groove 44 is in a range of 2.0 to 3.2 times the depth of the groove 44, thereby forming a brittle material substrate. The scribing wheel 40 which is optimal for dividing 17 and has high permeability and can suppress the expansion of the line width of the scribe line can be realized. Moreover, by using such a scribing wheel 40 for the scribing apparatus 10, it becomes the scribing apparatus 10 which exhibits the above-mentioned effect.

In addition, in this embodiment, although the method by the grinding | polishing using disk-shaped grindstone was demonstrated as a method of forming the groove | channel 44 in the blade 42 of the scribing wheel 40, it is a laser, for example. The scribing wheel in which the groove | channel was formed by other methods, such as a method by a process, may be sufficient.

In the present embodiment, the scribing device 10 is configured to be mounted via the holder joint 23 when the holder 30 holding the scribing wheel 40 is attached to the scribe head 21. It is. However, the scribe device 10 may be a structure in which the holder 30 is directly attached to the scribe head 21.

In addition, in this embodiment, the table 16 in which the guide 22 and the bridge 19 for moving the scribe head 21 are provided, or the brittle material substrate 17 is mounted as the scribe device 10. Although the movable table 11 which rotates) was provided, it is not limited to this scribe apparatus 10. As shown in FIG. For example, in order to allow the user to hold the scribe head 21 on which the holder 30 is mounted, a part of the shape of the scribe head 21 is in the shape of a handle, and the user grasps the handle to move the brittle material. A so-called manual scribe device such as dividing the substrate 17 can be applied.

10: scribe device
11: moving table
12a, 12b: guide rail
13: ball screw
14, 15: motor
16: table
17: brittle material substrate
18: CCD camera
19: bridge
20a, 20b: support column
21: scribe head
22: guide
23: holder joint
23a: rotating shaft part
23b: joint part
24a, 24b: bearing
24c: spacer
25: opening
26: Interior space
27: magnet
28: parallel pin
30: Holder
31: mounting portion
31a: slope
31b: flat part
32: holding groove
33a, 33b:
34a, 34b: support holes
40: scribing wheel
41, 41a: substrate
41: main body
42: day
43: end of blade
44: home
45: through hole
50: pin
60: Display panel
61: display area
62: frame area
70: mother substrate
71: scribe line
71a: scribe marks
72: vertical crack
73: outer frame
74: Display device

Claims (8)

It is a scribing wheel which has the blade which consists of a ridgeline and the inclined surface of the both sides of the said ridgeline along the circumference of a disc, and the said ridgeline was formed with the some groove,
The groove has a depth of 2 µm or more, the width of the groove in the side view direction is 35 µm or less, and 3.2 times or less of the depth of the groove, the scribing wheel. The scribing wheel according to claim 1, wherein the groove has a width of at least 2.0 times the depth of the groove. A holder rotatably holding the scribing wheel according to claim 1 or 2;
And a scribe head mounted with said holder. A scribing method of a brittle material substrate using a scribing wheel to form a scribe line on the brittle material substrate,
As a scribing wheel,
A plurality of grooves are formed in the ridges, each having a blade formed of a ridgeline and inclined surfaces on both sides of the ridgeline along the circumference of the disc.
The groove has a depth of 2 μm or more, the width of the groove in the side view direction is 35 μm or less and is 3.2 times or less of the depth of the groove,
And applying a load to the scribing wheel to form a scribe line while rotating on the surface of the brittle material substrate. The method of scribing a brittle material substrate according to claim 4, wherein the width of the groove is 2.0 times or more of the depth of the groove as the scribing wheel. The method for scribing a brittle material substrate according to claim 4 or 5, which is performed in the manufacture of a display panel using the brittle material substrate. It is a manufacturing method of the display panel using a scribing wheel,
As a scribing wheel,
A plurality of grooves are formed in the ridges, each having a blade formed of a ridgeline and inclined surfaces on both sides of the ridgeline along the circumference of the disc.
The groove has a depth of 2 μm or more, the width of the groove in the side view direction is 35 μm or less and is 3.2 times or less of the depth of the groove,
Applying a load to the scribing wheel to form a scribe line while rotating on the surface of the mother substrate,
The display panel is manufactured by dividing the mother substrate to obtain the display panel. A display area in which a plurality of pixels are formed, and a frame area around the display area,
A scribe mark is formed at an end of the frame region, and the width of the scribe mark is 15 µm or less.

Images