KR20120066924A - 오르토-니트로벤질 에스테르 화합물 및 이를 포함하는 포지티브형 감광성 수지 조성물 - Google Patents
오르토-니트로벤질 에스테르 화합물 및 이를 포함하는 포지티브형 감광성 수지 조성물 Download PDFInfo
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- KR20120066924A KR20120066924A KR1020100128278A KR20100128278A KR20120066924A KR 20120066924 A KR20120066924 A KR 20120066924A KR 1020100128278 A KR1020100128278 A KR 1020100128278A KR 20100128278 A KR20100128278 A KR 20100128278A KR 20120066924 A KR20120066924 A KR 20120066924A
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- 238000012661 block copolymerization Methods 0.000 description 1
- QDHFHIQKOVNCNC-UHFFFAOYSA-N butane-1-sulfonic acid Chemical compound CCCCS(O)(=O)=O QDHFHIQKOVNCNC-UHFFFAOYSA-N 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- 125000003739 carbamimidoyl group Chemical group C(N)(=N)* 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 229940117360 ethyl pyruvate Drugs 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 125000001188 haloalkyl group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine group Chemical group NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- 125000005597 hydrazone group Chemical group 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- CWKLZLBVOJRSOM-UHFFFAOYSA-N methyl pyruvate Chemical compound COC(=O)C(C)=O CWKLZLBVOJRSOM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- GNWCSWUWMHQEMD-UHFFFAOYSA-N naphthalene-1,2-dione diazide Chemical group [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C(=O)C=CC2=C1 GNWCSWUWMHQEMD-UHFFFAOYSA-N 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- LCUPNHOUKMJAQN-UHFFFAOYSA-N phenoxycarbonyl phenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC(=O)OC1=CC=CC=C1 LCUPNHOUKMJAQN-UHFFFAOYSA-N 0.000 description 1
- 238000001782 photodegradation Methods 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C205/00—Compounds containing nitro groups bound to a carbon skeleton
- C07C205/27—Compounds containing nitro groups bound to a carbon skeleton the carbon skeleton being further substituted by etherified hydroxy groups
- C07C205/35—Compounds containing nitro groups bound to a carbon skeleton the carbon skeleton being further substituted by etherified hydroxy groups having nitro groups and etherified hydroxy groups bound to carbon atoms of six-membered aromatic rings of the carbon skeleton
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C205/00—Compounds containing nitro groups bound to a carbon skeleton
- C07C205/39—Compounds containing nitro groups bound to a carbon skeleton the carbon skeleton being further substituted by esterified hydroxy groups
- C07C205/42—Compounds containing nitro groups bound to a carbon skeleton the carbon skeleton being further substituted by esterified hydroxy groups having nitro groups or esterified hydroxy groups bound to carbon atoms of six-membered aromatic rings of the carbon skeleton
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
- G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials For Photolithography (AREA)
Abstract
Description
오르토-니트로벤질 에스테르 화합물 | 오르토-니트로벤질 에스테르 화합물 함량 (알칼리 가용성 수지 100 중량부에 대한 중량부) |
막두께 (㎛) | 감도 (mJ/cm2) |
잔막률 (%) |
||
예비소성 | 현상후 | |||||
실시예 1 | 화학식 2 | 1 | 10.01 | 9.20 | 300 | 91.90 |
실시예 2 | 화학식 4 | 1 | 10.22 | 9.31 | 350 | 91.10 |
실시예 3 | 화학식 2 | 2 | 10.04 | 9.19 | 350 | 91.53 |
실시예 4 | 화학식 4 | 2 | 10.24 | 9.35 | 400 | 91.31 |
실시예 5 | 화학식 2 | 10 | 10.01 | 9.33 | 450 | 93.20 |
실시예 6 | 화학식 4 | 10 | 10.02 | 9.30 | 500 | 92.81 |
비교예 1 | - | - | 9.984 | 8.861 | 500 | 88.75 |
Claims (10)
- 하기 화학식 1로 표시되는 화합물을 포함하는 오르토-니트로벤질 에스테르 화합물:
[화학식 1]
상기 화학식 1에서,
R1 및 R2는 동일하거나 서로 상이하며, 각각 독립적으로 치환 또는 비치환된 C1 내지 C20 지방족 유기기, 또는 치환 또는 비치환된 C3 내지 C20 지환족 유기기이고,
R3 및 R4는 동일하거나 서로 상이하며, 각각 독립적으로 단일결합, 또는 치환 또는 비치환된 2가의 C1 내지 C20 지방족 유기기이고,
Z1 및 Z2는 동일하거나 서로 상이하며, 각각 독립적으로 하이드록시기(OH), 아민기(N(R103)(R104), 여기서, R103 및 R104는 동일하거나 서로 상이하며, 각각 독립적으로 수소, 치환 또는 비치환된 지방족 유기기임), 카르복실기(COOH) 또는 알데히드기(CHO)이고,
n1 및 n2는 동일하거나 서로 상이하며, 각각 독립적으로 0 내지 5의 정수이고,
n1+n2는 1 내지 5의 정수이다.
- 제1항에 있어서,
상기 Z1 및 Z2는 동일하거나 서로 상이하며, 각각 독립적으로 하이드록시기(OH), 또는 카르복실기(COOH)인 것인 오르토-니트로벤질 에스테르 화합물.
- 제1항에 있어서,
상기 Z1 및 Z2는 하이드록시기(OH)인 것인 오르토-니트로벤질 에스테르 화합물.
- (A) 하이드록시기 함유 알칼리 가용성 수지;
(B) 제1항 내지 제4항 중 어느 한 항에 따른 오르토-니트로벤질 에스테르 화합물;
(C) 감광성 디아조퀴논 화합물;
(D) 실란 화합물;
(E) 페놀 화합물; 및
(F) 용매
를 포함하는 포지티브형 감광성 수지 조성물.
- 제5항에 있어서,
상기 하이드록시기 함유 알칼리 가용성 수지는 하기 화학식 5로 표시되는 반복단위를 포함하는 폴리벤조옥사졸 전구체, 하기 화학식 6으로 표시되는 반복단위를 포함하는 노볼락 수지, 하기 화학식 7로 표시되는 반복단위를 포함하는 폴리-4-히드록시 스티렌 수지 또는 이들의 조합을 포함하는 것인 포지티브형 감광성 수지 조성물:
[화학식 5]
상기 화학식 5에서,
X1은 각각의 반복단위에서 동일하거나 서로 상이하며, 각각 독립적으로 방향족 유기기이고,
Y1은 각각의 반복단위에서 동일하거나 서로 상이하며, 각각 독립적으로 방향족 유기기, 또는 2가 내지 6가의 지환족 유기기이고,
[화학식 6]
상기 화학식 6에서,
R5는 동일하거나 서로 상이하며, 각각 독립적으로 수소 또는 C1 내지 C10 알킬기이고,
n3은 0 내지 3의 정수이고,
[화학식 7]
상기 화학식 7에서,
R6은 동일하거나 서로 상이하며, 각각 독립적으로 수소 또는 C1 내지 C10 알킬기이고,
n4는 0 내지 4의 정수이다.
- 제5항에 있어서,
상기 하이드록시기 함유 알칼리 가용성 수지는 3,000 내지 300,000의 중량평균 분자량(Mw)을 갖는 것인 포지티브형 감광성 수지 조성물.
- 제5항에 있어서,
상기 수지 조성물은
(A) 하이드록시기 함유 알칼리 가용성 수지 100 중량부에 대하여,
(B) 제1항 내지 제3항 중 어느 한 항에 따른 오르토-니트로벤질 에스테르 화합물 0.1 내지 20 중량부;
(C) 감광성 디아조퀴논 화합물 5 내지 100 중량부;
(D) 실란 화합물 0.1 내지 30 중량부;
(E) 페놀 화합물 1 내지 30 중량부; 및
(F) 용매 200 내지 900 중량부
를 포함하는 것인 포지티브형 감광성 수지 조성물.
- 제5항 내지 제8항 중 어느 한 항에 따른 포지티브형 감광성 수지 조성물을 사용하여 제조된 감광성 수지막.
- 제9항의 감광성 수지막을 포함하는 반도체 소자.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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KR1020100128278A KR20120066924A (ko) | 2010-12-15 | 2010-12-15 | 오르토-니트로벤질 에스테르 화합물 및 이를 포함하는 포지티브형 감광성 수지 조성물 |
US13/239,441 US8592131B2 (en) | 2010-12-15 | 2011-09-22 | Ortho-nitrobenzyl ester compound and positive type photosensitive resin composition including the same |
CN2011103012007A CN102531910A (zh) | 2010-12-15 | 2011-09-28 | 邻硝基苄酯化合物及包含它的正型光敏树脂组合物 |
TW100135518A TWI439440B (zh) | 2010-12-15 | 2011-09-30 | 鄰硝基苄酯化合物及包括該化合物之正型光敏性樹脂組成物 |
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KR1020100128278A KR20120066924A (ko) | 2010-12-15 | 2010-12-15 | 오르토-니트로벤질 에스테르 화합물 및 이를 포함하는 포지티브형 감광성 수지 조성물 |
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US (1) | US8592131B2 (ko) |
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Cited By (2)
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US9329475B2 (en) | 2013-10-23 | 2016-05-03 | Cheil Industries Inc. | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device |
KR20230161108A (ko) * | 2022-05-18 | 2023-11-27 | 인하대학교 산학협력단 | 주쇄 절단형 고불소화 고분자 포토레지스트 및 그 제조방법 |
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KR101432605B1 (ko) * | 2010-12-16 | 2014-08-21 | 제일모직주식회사 | 하드마스크 조성물, 이를 사용한 패턴 형성 방법 및 상기 패턴을 포함하는 반도체 집적회로 디바이스 |
KR101400186B1 (ko) * | 2010-12-31 | 2014-05-27 | 제일모직 주식회사 | 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자 |
WO2019003918A1 (ja) * | 2017-06-30 | 2019-01-03 | 住友ベークライト株式会社 | 感光性樹脂組成物、樹脂膜及び電子装置 |
CN112266368B (zh) * | 2017-11-15 | 2024-03-19 | 中山光禾医疗科技有限公司 | 光交联水凝胶材料的制备、原料、产品及应用 |
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-
2010
- 2010-12-15 KR KR1020100128278A patent/KR20120066924A/ko not_active Application Discontinuation
-
2011
- 2011-09-22 US US13/239,441 patent/US8592131B2/en active Active
- 2011-09-28 CN CN2011103012007A patent/CN102531910A/zh active Pending
- 2011-09-30 TW TW100135518A patent/TWI439440B/zh active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9329475B2 (en) | 2013-10-23 | 2016-05-03 | Cheil Industries Inc. | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device |
KR20230161108A (ko) * | 2022-05-18 | 2023-11-27 | 인하대학교 산학협력단 | 주쇄 절단형 고불소화 고분자 포토레지스트 및 그 제조방법 |
Also Published As
Publication number | Publication date |
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US8592131B2 (en) | 2013-11-26 |
TWI439440B (zh) | 2014-06-01 |
US20120156622A1 (en) | 2012-06-21 |
CN102531910A (zh) | 2012-07-04 |
TW201231438A (en) | 2012-08-01 |
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